IPC-T-51

Terms and Definitions

for the Design and
Manufacture of
Printed Electronics

Developed by D-64a Printed Electronics Terms and Definitions

Task Group

Supersedes: Users of this publication are encouraged to participate in the

IPC-6903A - January 2018 development of future revisions.
IPC-6903 - October 2015
Contact:

IPC

Tel 847 615.7100

Fax 847 615.7105
April 2022 IPC-T-51

Table of Contents
1 SCOPE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 APPLICABLE DOCUMENTS . . . . . . . . . . . . . . . . . . . 1
1.1 Purpose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.1 IPC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 3D Printed Electronics Types . . . . . . . . . . . . . . . . . 1 3 TERMS AND DEFINITIONS FOR
PRINTED ELECTRONICS . . . . . . . . . . . . . . . . . . . . . . 2

v
April 2022 IPC-T-51

Terms and Definitions for the Design and

Manufacture of Printed Electronics

1 SCOPE
This standard provides terms and definitions for the design and manufacture of printed electronics.

1.1 Purpose The purpose of this standard is to provide common terminology regarding printed electronics.
The reader is encouraged to also reference IPC-2291, IPC-2292, IPC-4591, IPC-4592, IPC-6901, IPC-6902, IPC-9204 and
IPC-9257, which have additional industry-approved terms and definitions.

1.2 3D Printed Electronics Types It is the understanding of the IPC Printed Electronics Committee that electronics manufacturers
have several definitions for 3D Printed Electronics. Because these descriptions are the result of years of time and investment by
various market segments, the IPC Printed Electronics Committee will not define one term for 3D printed electronics.
To better help industry identify and describe the various processes for producing 3D printed electronics, the IPC Printed Electronics
Committee has established three initial types for 3D printed electronics.
Type 1 – Using printed electronics processes on a planar substrate
Type 2 – Using printed electronics processes on a nonplanar substrate
Type 3 – Using printed electronics processes to fully build and functionalize a device in a 3D space
As additional 3D printed electronics types are described by industry, they will be added to the 3D Printed Electronics Types.
2 APPLICABLE DOCUMENTS

2.1 IPC1
IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronics Circuits
IPC-2291 Design Guideline for Printed Electronics
IPC-2292 Design Standard for Printed Electronics on Flexible Substrates
IPC-4591 Requirements for Printed Electronics Functional Materials
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-6901 Application Categories for Printed Electronics
IPC-6902 Qualification and Performance Specification for Printed Electronics on Flexible Substrates
IPC-9204 Guideline on Flexibility and Stretchability Testing for Printed Electronics
IPC-9257 Requirements for Electrical Testing of Flexible Printed Electronics

1 www.ipc.org

1
IPC-T-51 April 2022

3 TERMS AND DEFINITIONS FOR PRINTED ELECTRONICS

C F
Coating Flexibility
The process of uniformly depositing (blade, slot die, spray, The degree to which printed electronics can be bent and retain
etc.) a fluid functional material over a substrate or device, functionality. Also sometimes referred to as bendability.
generally with limited patternability compared to printing. Functional Material
Conductive Ink A compound which serves an electrical, electronic,
A fluid composition of organic compounds and conductive electromechanical, chemical or other nongraphic functionality
particles that forms a solid, electrically conductive substance in printed electronics.
after undergoing a postprocess such as drying, curing or
sintering. H
Heat Transfer Process
Conductive Paste
The use of heat and pressure to transfer printed electronics
A high-viscosity, shear thinning conductive ink.
from a carrier to a substrate.
Conformability
Hysteresis
The degree to which printed electronics can be shaped to
The permanent deformation of a material after strain is
match the physical form of the object on, or in, which it is
removed.
included and retain functionality.
I
Contamination
Ink
Foreign materials which may disrupt the performance of
A material containing a functional material and a vehicle that
printed electronics.
can be deposited via a printing process.
Creaseability
The degree to which printed electronics can be pressed across L
a fold and retain functionality. Liquid Metal
A conductive alloy that is permanently in a liquid or gel state
Crossover
across its operating temperature.
An electrically insulated material printed on top of one or
more circuit traces for the purpose of electrically isolating M
the underlying circuit traces from the circuit traces passing Machine Direction (Web Direction)
over it. The direction in which the substrate flows during processing,
Curing or the circumferential direction of a roll of substrate.
A chemical reaction causing the polymerization (cross- Margin Area
linking) of lower molecular weight organic compounds into The border surrounding the printed area on a substrate.
higher molecular weight polymers.
Modulus (Elastic Modulus or Young’s Modulus)
Curing, Light A mechanical property that measures the stiffness of a solid
The use of light to drive polymerization reactions. material. It defines the relationship between stress (force per
Curing, Moisture unit area) and strain (proportional deformation) in a material
The use of humidity and temperature to drive polymerization in the linear elasticity regime of a uniaxial deformation.
reactions. Moisture Vapor Transmission Rate (MVTR)
Curing, Thermal The amount of water vapor which passes through a unit area
The use of heat energy to drive polymerization reactions. of a material (typically a film) during a period of time under
specified temperature and humidity conditions. Also known
D as Water Vapor Transmission Rate (WVTR).
Diluent
A liquid which is added to a material to assist in the deposition N
of materials by diluting or reducing the viscosity. Nonvolatile Content
Components of a compound that do not evaporate during
Drying
processing (see volatile organic compounds (VOCs).
A thermal process during which volatiles are evaporated.

E P
Pliability
Elasticity
The degree to which printed electronics are soft and easily
The ability of a printed electronic device or material to resume
deformed and retain functionality.
its normal shape after being stretched or compressed.
Print Registration
Encapsulation
The degree of alignment of a printed pattern relative to its
The process of protecting printed electronic constructions via
intended position with regard to other features.
polymeric compounds (e.g., encapsulants).