IPC-J-STD-005B

Requirements for
Solder Pastes
If a conflict occurs
between the English
language and translated
versions of this
document, the English
version will take
precedence.
Developed by the 5-24B Task Group of the Assembly and
Joining General Committee 5-20 of IPC

Users of this publication are encouraged to participate in the

development of future revisions.
Supersedes: Contact:
IPC-J-STD-005A
February 2012 IPC
March 2024 IPC-J-STD-005B

Table of Contents
1 GENERAL....................................................................... 1 3.4.3.1 Powder Shape................................................. 4
1.1 Scope ............................................................. 1 3.5 Metal Percent.................................................. 4
1.2 Purpose........................................................... 1 3.6 Viscosity......................................................... 4
1.3 Quality/Performance Classification............... 1 3.6.1 Methods of Determining Viscosity................ 4
1.4 Measurement Units ....................................... 1 3.7 Slump Test...................................................... 5
1.5 Definition of Requirements............................ 1 3.7.1 Test with 0.1 mm and 0.2 mm
1.6 Process Control Requirements....................... 1 Thick Stencils................................................. 5
1.7 Order of Precedence ...................................... 1 3.8 Solder Ball Test.............................................. 6
1.7.1 Conflict........................................................... 2 3.8.1 Type 1-6 Powder............................................ 6
1.7.2 Clause References.......................................... 2 3.8.2 Types 7 and 8 Powder.................................... 6
1.7.3 Appendices..................................................... 2 3.9 Tack Test......................................................... 6
1.8 Use of “Lead” ................................................ 2 3.10 Wetting............................................................ 6
1.9 Abbreviations and Acronyms......................... 2 3.11 Labeling ......................................................... 6
1.10 Terms and Definitions.................................... 2 4 QUALITY ASSURANCE PROVISIONS.......................... 8

2 APPLICABLE DOCUMENTS.......................................... 2 4.1 Responsibility for Inspection ........................ 8

2.1 Joint Standards............................................... 2 4.1.1 Responsibility for Compliance...................... 8
2.2 
International Organization for 4.1.1.1 Quality Assurance Program........................... 8
Standardization............................................... 3 4.1.2 Test Equipment and Inspection Facilities...... 8
2.2.1 ISO 9001......................................................... 3 4.1.3 Inspection Conditions..................................... 8
2.2.2 ISO 10012:2003 Part 1................................... 3 4.2 Classification of Inspections.......................... 8
2.3 IPC ................................................................. 3 4.3 Inspection Report Form.................................. 9
2.3.1 IPC-A-20........................................................ 3 4.4 Qualification Inspection................................. 9
2.3.2 IPC-A-21........................................................ 3 4.4.1 Sample Size.................................................... 9
2.3.3 IPC-T-50 ........................................................ 3 4.4.2 Inspection Routine......................................... 9
2.3.4 IPC-TM-650................................................... 3 4.5 Quality Conformance..................................... 9
2.3.5 IPC-9191........................................................ 3 4.5.1 Sampling Plan................................................ 9
2.4 American Society for Testing Materials ....... 3 4.5.2 Rejected Lots.................................................. 9

3 REQUIREMENTS........................................................... 3
4.6 Statistical Process Control (SPC).................. 9

3.1 Description of Product .................................. 3 5 PREPARATION FOR DELIVERY.................................. 1 0

3.2 Alloy Composition......................................... 4 6 NOTES ........................................................................ 1 0

3.3 Flux Characterization and Inspection............ 4 6.1 Applicability ................................................ 10
3.4 Solder Powder Particle Size........................... 4 6.2 Shelf Life ..................................................... 10
3.4.1 Powder Size Determination........................... 4 6.3 Acquisition Requirements............................ 10
3.4.2 Powder Size.................................................... 4
APPENDIX A Test Report on Solder Paste.......................... 11
3.4.2.1 Maximum Powder Size (Fineness of Grind).4
3.4.2.2 Solder Powder................................................ 4 APPENDIX B Abbreviations and Acronyms........................12

3.4.3 Solder Powder Particle Shape........................ 4

Copyright 2024 by IPC International, Inc. All rights reserved. v

IPC-J-STD-005B March 2024

Figures Tables

Figure 3-1 Slump Test Stencil Thickness – 0.20 mm...... 5 Table 3-1 System to Describe Solder Paste Products
Figure 3-2 Slump Test Stencil Thickness – 0.10 mm...... 6 Description..................................................... 4
Figure 3-3 Level 1 Preferred .......................................... 7 Table 3-2 Solder Powder by Weight Percentage —
Figure 3-4 Level 2 Acceptable......................................... 7 Nominal Size (Microns)................................. 4

Figure 3-5 Level 3 Defect................................................ 7 Table 3-3 Bridging Failure Limits for Cold and
Hot Slump....................................................... 5
Figure 3-6 Level 4 Defect................................................ 7
Table 4-1 Qualification, Quality Conformance and
Figure 3-7 Level 5 Defects............................................... 8
Performance Testing for Solder Paste1........... 9

vi Copyright 2024 by IPC International, Inc. All rights reserved.

March 2024 IPC-J-STD-005B

IPC-J-STD-005B
Requirements for Solder Pastes

1 GENERAL

1.1 Scope This standard prescribes general requirements for the characterization and testing of solder pastes used to make
high quality electronic interconnections. This specification is a material quality control document and is not intended to relate
directly to the material’s performance in the assembly process. Solder paste users are referred to paragraph 6.3 for a listing of
requirements information and options that should be addressed when procuring solder paste.

1.2 Purpose This standard defines the characteristics of solder paste through the definitions of properties and specification of
test methods and inspection criteria. The materials include solder powder and solder paste flux blended to produce solder paste.
Solder powders are classified by the shape of the particles and size distribution of the particles. It is not the intent of this
standard to exclude particle sizes or distributions not specifically listed. The flux properties of the solder paste, including
classification and testing, shall be based on J-STD-004. The solder alloy properties of solder paste, which includes requirements,
shall be based on J-STD-006. The requirements for solder paste are defined in general terms. Users can perform additional tests
(beyond the scope of this specification) to determine the acceptability of the solder paste for specific processes.

1.3 Quality/Performance Classification Three general classes have been established to reflect progressive increases in
inspection and testing frequency. It should also be recognized that there is typically an overlap between classes. In many cases
the difference between classes is one of attribute assurance level not attribute difference. The user has the responsibility to
determine the class into which his product belongs. Testing and inspection requirements in this specification have been separated
so the metallic foils may be tested to any one of the three quality/performance classes.
The three classes are:

Class 1 Material in this class is suitable for applications where mechanical properties and cosmetic defects are not important,
and the only requirement is functionality of the complete circuit. This material has no prescribed inspection and testing
requirements.

Class 2 Material in this class is suitable for use where circuit design, process yield, and specification conformance requirements
allow localized areas of nonconformance. This material has moderate levels of assurance, demonstrated via the use of testing
and/or statistical process control (SPC)/statistical quality control (SQC) techniques.

Class 3 Material in this class is suitable for applications where high levels of assurance are required. These levels of assurance
shall be demonstrated via the use of testing and/or SPC/SQC techniques.

1.4 Measurement Units This Standard uses International System of Units (SI) units per ASTM SI10, IEEE/ASTM SI 10,
Section 3 [Imperial English equivalent units are in brackets for convenience]. The SI units used in this Standard are millimeters
(mm) [in] for dimensions and dimensional tolerances, Celsius (°C) [°F] for temperature and temperature tolerances, grams (g)
[oz] for weight, and lumens (lm) [footcandles] for illuminance.
Note: This Standard uses other SI prefixes (ASTM SI10, Section 3.2) to eliminate leading zeroes (for example, 0.0012 mm
becomes 1.2 μm) or as an alternative to powers-of-ten (3.6 x 103 mm becomes 3.6 m).

1.5 Definition of Requirements The words shall or shall not are used in the text of this document wherever there is a requirement
for materials, preparation, process control or acceptance. The word “should” reflects recommendations and is used to reflect
general industry practices and procedures for guidance only. Line drawings and illustrations are depicted herein to assist in the
interpretation of the written requirements of this Standard. The text takes precedence over the figures.

1.6 Process Control Requirements The use of “statistical process control” (SPC) is optional and should be based on factors
such as design stability, lot size, production quantities, and the needs of the Manufacturer. See paragraph 4.6 for the quality
assurance section regarding SPC.

1.7 Order of Precedence The contract shall take precedence over this Standard, referenced standards and drawings.

Copyright 2024 by IPC International, Inc. All rights reserved. 1