DRV 8308

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DRV8308
SLVSCF7B – FEBRUARY 2014 – REVISED NOVEMBER 2017
DRV8308 Brushless DC Motor Controller

1 Features 3 Description
1• Three-Phase Brushless DC Motor Controller The DRV8308 controls sensored brushless DC
motors with advanced features and a simple input
– Digital Closed-Loop Speed Control with interface. As a predriver, it drives the gates of 6
Programmable Gain and Filters external N-Channel MOSFETs with a configurable
• Drives 6 N-Channel MOSFETs With Configurable current of 10mA to 130mA for optimal switching
10- to 130-mA Gate Drive characteristics.
• Integrated Commutation from Hall Sensors The 3 motor phases are commutated according to the
– Timing Can Be Advanced/Delayed Hall sensor inputs. Once the motor reaches a
– 120° or 180°-Sinusoidal Current Control consistent speed, the DRV8308 uses just 1 Hall
sensor to minimize jitter caused by sensor mismatch.
– Single Input Controls Motor Speed The Hall signal-to-drive timing can be advanced or
• Operating Supply Voltage 8.5 to 32 V delayed in 0.1% increments to optimize power
• Flexible Configuration Methods efficiency. An optional 180° commutation mode drives
sinusoidal current through the motor and minimizes
– Read Internal Non-Volatile Memory audible noise and torque ripple. Peak motor current
– Read External EEPROM can be controlled by sizing a sense resistor.
– Write SPI The DRV8308 achieves closed-loop speed control to
• Configurable Motor Current Limiter spin motors to a precise RPM across a wide range of
• 5-V Regulator for Hall Sensors load torques. The system matches motor
speed—generated from an FG trace or the Hall
• Low-power Standby Mode sensors—to the reference frequency on pin CLKIN.
• Integrated Overcurrent, Overvoltage, and The DRV8308 can also drive motors open-loop using
Overtemperature Protection a duty cycle command, from either a clock or register
setting.
2 Applications An assortment of protection features bolster system
• Industrial Pumps, Fans, and Valves robustness, as the DRV8308 handles and reports
• White Goods overcurrent, overvoltage, undervoltage, and
overtemperature.
• Power Tools and Lawn Equipment
• Printers Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
DRV8308 VQFN (40) 6.00 mm × 6.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
8.5V to 32 V
DRV8308
CLKIN
DIR BLDC Predrive
FETs M
Controller SPI Controller
(optional)
FGOUT ISEN
Speed Control
FAULTn
Protection Hall sensors
EPROM FG trace
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV8308
SLVSCF7B – FEBRUARY 2014 – REVISED NOVEMBER 2017 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.5 Programming .......................................................... 35
2 Applications ........................................................... 1 7.6 Register Map........................................................... 36
3 Description ............................................................. 1 8 Application and Implementation ........................ 41
4 Revision History..................................................... 2 8.1 Application Information............................................ 41
8.2 Typical Application .................................................. 44
5 Pin Configurations and Functions ....................... 3
8.3 Do's and Don'ts ...................................................... 49
6 Specifications......................................................... 6
6.1 Absolute Maximum Ratings ...................................... 6 9 Power Supply Recommendations...................... 50
6.2 Handling Ratings....................................................... 6 10 Layout................................................................... 50
6.3 Recommended Operating Conditions....................... 6 10.1 Layout Guidelines ................................................. 50
6.4 Thermal Information .................................................. 7 10.2 Layout Example .................................................... 50
6.5 Electrical Characteristics........................................... 8 11 Device and Documentation Support ................. 51
6.6 SPI Timing Requirements ....................................... 10 11.1 Documentation Support ....................................... 51
6.7 Typical Characteristics ............................................ 11 11.2 Receiving Notification of Documentation Updates 51
7 Detailed Description ............................................ 12 11.3 Community Resources.......................................... 51
7.1 Overview ................................................................. 12 11.4 Trademarks ........................................................... 51
7.2 Functional Block Diagram ....................................... 13 11.5 Electrostatic Discharge Caution ............................ 51
7.3 Feature Description................................................. 14 11.6 Glossary ................................................................ 51
7.4 Device Functional Modes........................................ 30 12 Mechanical, Packaging, and Orderable
Information ........................................................... 51
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2014) to Revision B Page
• Deleted Locked Rotor Detection and Restart from the Features section............................................................................... 1
• Deleted Locked Rotor Detection from Description ................................................................................................................. 1
• Deleted Rotor Stall Detection from FAULTn description in the Pin Functions ....................................................................... 4
• Deleted extra notes in the Thermal Information table (refer to the Semiconductor and IC Package Thermal Metrics
application report for this information ..................................................................................................................................... 7
• Deleted RLOCK from tRETRY in the Electrical Characteristics ............................................................................................. 9
• Deleted tLOCK from the Electrical Characteristics................................................................................................................. 9
• Deleted Locked Rotor Detection from Overview .................................................................................................................. 12
• Updated direction change behavior in the Commutation section ......................................................................................... 17
• Deleted the Rotor Lockup (RLOCK) section in theProtectton Circuits section..................................................................... 29
• Changed the LRTIME bit to reserved in the Register Description table .............................................................................. 39
• Changed the RLOCK bit to reserved in the Register Description table ............................................................................... 40
• Added the Receiving Notification of Documentation Updates and Community Resources sections................................... 51
Changes from Original (February 2014) to Revision A Page
• Added Handling Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 6
2 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated
Product Folder Links: DRV8308

DRV8308
www.ti.com SLVSCF7B – FEBRUARY 2014 – REVISED NOVEMBER 2017
5 Pin Configurations and Functions
RHA Package
40-Pin VQFN With Exposed Thermal Pad
Top View
WHSG
UHSG
WLSG
VHSG
ULSG
VLSG
ISEN
W
U
V
40
39
38
37
36
35
34
33
32
31
UHP 1 30 CP1
UHN 2 29 CP2
VHP 3 28 VCP
VHN 4 27 VM
WHP 5 26 GND
WHN 6 GND 25 VINT
VSW 7 24 VREG
FGFB 8 23 RESET
FGINN_TACH 9 TBD 22 ENABLE
FGINP 10 21 DIR
11
12
13
14
15
18
19
20
16
17
SCLK
SCS
SMODE
SDATAI
CLKIN
SDATAO
FGOUT
FAULTn
BRAKE
LOCKn
Pin Functions
PIN
I/O (1) DESCRIPTION EXTERNAL COMPONENTS OR CONNECTIONS
NAME NO.
POWER AND GROUND
CP1 30 PWR
Charge pump flying capacitor Connect a 0.1-μF 35-V capacitor between CP1 and CP2
CP2 29 PWR
Ground reference. Pin 26 and the
GND 26, PPAD PWR exposed thermal pad are internally Connect to board GND
connected.
VCP 28 PWR Charge pump storage capacitor Connect a 1-μF 35-V ceramic capacitor to VM
Internal 1.8-V core voltage regulator
VINT 25 PWR Bypass to GND with a 1-μF 6.3-V ceramic capacitor
bypass
Connect to motor supply voltage.
Bypass to GND with a 0.1-μF ceramic capacitor, plus a large
VM 27 PWR Motor supply voltage
electrolytic capacitor (47 μF or larger is recommended), with a
voltage rating of 1.5× to 2.5× VM.
5-V regulator output. Active when Bypass to GND with a 0.1-μF 10-V ceramic capacitor. Can
VREG 24 PWR
ENABLE is active. provide 5-V power to Hall sensors.
Switched VM power output. When
Can be used for powering Hall elements, along with added
VSW 7 PWR ENABLE is active, VM is applied to this
series resistance.
pin.
CONTROL
Causes motor to brake. Polarity is
BRAKE 20 I programmable. Internal pulldown
resistor.
The clock input, used in Clock
CLKIN 19 I Frequency Mode and Clock PWM
Mode. Internal pulldown resistor.
Sets motor rotation direction. Polarity is
DIR 21 I programmable. Internal pulldown
resistor.
(1) I = input, O = output, OD = open-drain output, I/O = input/output

Copyright © 2014–2017, Texas Instruments Incorporated Submit Documentation Feedback 3
DRV8308
Pin Functions (continued)

PIN
NAME NO.
Enables and disables motor. Polarity is
ENABLE 22 I programmable. Internal pulldown
resistor.
Fault indicator – active low when
FAULTn 17 OD overcurrent, or overtemperature. Open-
drain output.
Outputs a TACH signal generated from
FGOUT 16 OD the FG amplifier or Hall sensors.
Open-drain output.
Outputs a signal that indicates the
LOCKn 18 OD speed loop is locked. Open-drain
output.
Active high to reset all internal logic.
RESET 23 I
Internal pulldown resistor.
SERIAL INTERFACE
SPI mode: Serial clock input. Data is clocked on rising edges.
SCLK (2) 11 I/OD Serial clock
EEPROM mode: Connect to EEPROM CLK. Open-drain
output requires external pullup.
SPI mode: Active high enables serial interface operation.
SCS (2) 12 I/OD Serial chip select
EEPROM mode: Connect to EEPROM CS. Open-drain output
requires external pullup.
SPI mode: Serial data input. Internal pulldown resistor.
SDATAI 14 I Serial data input EEPROM mode: Serial data input. Connect to EEPROM DO
terminal.
SPI mode: Serial data output. Open-drain output.
SDATAO 15 OD Serial data output EEPROM mode: Connect to EEPROM DI. Open-drain output
requires external pullup.
SPI mode: leave open or connect to ground for SPI interface
SMODE 13 I Serial mode mode.
EEPROM mode: Connect to logic high to for EEPROM mode.
POWER STAGE INTERFACE
ISEN 31 I Low-side current sense resistor Connect to low-side current sense resistor
U 33 I
Measures motor phase voltages for
V 36 I Connect to motor windings
VFETOCP
W 39 I
UHSG 32 O
VHSG 35 O High-side FET gate outputs Connect to high-side 1/2-H N-channel FET gate
WHSG 38 O
ULSG 34 O
VLSG 37 O Low-side FET gate outputs Connect to low-side 1/2-H N-channel FET gate
WLSG 40 O
HALL AND FG INTERFACE
FGFB 8 O FG amplifier feedback pin Connect feedback network to FGIN–
Connect to FG trace and filter components. When using a
FG amplifier negative input or TACH
FGINN_TACH 9 I (3) TACH with FGSEL= 3, connect a logic-level TACH signal. If
input
unused, connect FGFB to FG–.
Connect to FG trace and filter components on the PCB (if
FGINP 10 I/O FG amplifier positive input
used).
(2) In SPI mode, these pins are inputs; in EEPROM mode, they are open-drain outputs.
(3) When using FG amplifier, this pin is an analog input. If in TACH mode, this is a logic-level input.

DRV8308
Pin Functions (continued)

PIN
NAME NO.
UHP 1 I Hall sensor U positive input
UHN 2 I Hall sensor U negative input
VHP 3 I Hall sensor V positive input Connect to Hall sensors. Noise filter capacitors may be
VHN 4 I Hall sensor V negative input desirable, connected between the + and – Hall inputs.
WHP 5 I Hall sensor W positive input
WHN 6 I Hall sensor W negative input

DRV8308
6 Specifications
6.1 Absolute Maximum Ratings
(1) (2) (3)
over operating free-air temperature (unless otherwise noted)
MIN MAX UNIT
Power supply voltage (VM) –0.3 42 V
Charge pump and high side gate drivers (VCP, UHSG, VHSG, WHSG) –0.3 50 V
Output pin, low side gate drivers, charge pump flying cap and switched VM power
–0.6 40 V
supply voltage (U, V, W, ULSG, VLSG, WLSG, CP1, CP2 VSW)
Internal core voltage regulator (VINT) –0.3 2 V
Linear voltage regulator output (VREG) –0.3 5.5 V
Sense current pin (ISEN) –0.3 2 V
Digital pin voltage range (SCLK, SCS, SMODE, SDATAI, SDATAO, FGOUT, FAULTn,
–0.5 5.75 V
LOCKn, CLKIN, BRAKE, DIR, ENABLE, RESET)
Hall sensor input pin voltage (UHP, UHN, VHP, VHN, WHP, WHN, FGFB,
0 VREG V
FGINN/TACH, FGINP)
Continuous total power dissipation See Thermal Information
Operating junction temperature range, TJ –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.
(3) Power dissipation and thermal limits must be observed
6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –60 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all -4000 4000
pins (1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification -1500 1500
JESD22-C101, all pins (2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VM Motor power supply voltage range, ENABLE = 1, motor operating (1) 8.5 32
V
VMDIS Motor power supply voltage range, ENABLE = 0, motor not operating 4.5 35
IVREG VREG output current (2) 0 30
(2)
mA
IVSW VSW output current 0 30
fHALL Hall sensor input frequency (3) 0 30
SPDMODE = 00 (Clock Frequency Mode) 0 90 kHz
fCLKIN Frequency on CLKIN (4)
SPDMODE = 01 (Clock PWM Mode) 16 50
(1) Note that at VM < 12 V, gate drive output voltage tracks VM voltage
(2) Power dissipation and thermal limits must be observed
(3) fHALL of 50 Hz to 6.7 kHz is best
(4) Operational with frequencies above 50 kHz, but resolution is degraded

DRV8308
6.4 Thermal Information

DRV8308
THERMAL METRIC (1) RHA (VQFN) UNIT
40 PINS
RθJA Junction-to-ambient thermal resistance 33.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 23 °C/W
RθJB Junction-to-board thermal resistance 8.8 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 8.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

DRV8308
6.5 Electrical Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VM SUPPLY
ENABLE = active,
IVM VM active current 12 18 mA
VREG and VSW open
ISTBY VM standby current ENABLE = inactive 120 µA
VM falling 4.6
VRESET VM logic reset voltage V
VM rising 5
VREG SUPPLY
VVREG Output voltage IOUT = 1 to 30 mA 4.75 5 5.25 V
IVREG Output current 30 mA
VSW SUPPLY
RDS(ON) VSW switch on-resistance IOUT = 1 to 30 mA 9 20 Ω
IVSW Output current 30 mA
INTERNAL CLOCK OSCILLATOR
fCLK50 Internal CLK50 clock frequency 50 MHz
LOGIC-LEVEL INPUTS AND OUTPUTS
VIL Low-level input voltage 0.8 V
VIH High-level input voltage 1.5 5.5 V
IIL Low-level input current –50 50 µA
VIN = 3.3 V, RESET,
DIR, BRAKE, CLKIN,
20 100
IIH High-level input current SCS, SCLK, SDATAI, µA
SMODE
VIN = 3.3 V, ENABLE 6 9
VHYS Input hysteresis voltage 0.1 0.3 0.5 V
RESET, DIR, BRAKE,
CLKIN, SCS, SCLK, 50 100 150
RPD Input pulldown resistance SDATAI, SMODE kΩ
ENABLE 350 550
OPEN DRAIN OUTPUTS
VOL Low-level output voltage IOUT = 2.0 mA 0.5 V
IOH Output leakage current VOUT = 3.3 V 1 µA
FG AMPLIFIER AND COMPARATOR
VIO FG amplifier input offset voltage –7 7 mV
IIB FG amplifier input bias current –1 1 μA
VICM FG amplifier input common mode voltage range 1.5 3.5 V
AV FG amplifier open loop voltage gain 45 dB
GBW FG amplifier gain bandwidth product 500 kHz
VREF+ FG comparator positive reference voltage –20% VVREG / 2 20% V
VIT+ FG comparator positive threshold –20% VVREG / 1.8 20% V
VIT- FG comparator negative threshold –20% VVREG / 2 20% V
HALL SENSOR INPUTS
VHYS Hall amplifier hysteresis voltage 15 20 25 mV
∆VHYS Hall amplifier hysteresis difference Between U, V, W –5 5 mV
VID Hall amplifier input differential 50 mV
Hall amplifier input common mode voltage
VCM 1.5 3.5 V
range
IIN Input leakage current H_x+ = H_x- –10 10 μA
tHDEG Hall deglitch time 20 μs

DRV8308
Electrical Characteristics (continued)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MOSFET DRIVERS
VOUTH High-side gate drive output voltage IO = 100 μA, VM ≥ 12V VM + 10 V
VOUTL Low-side gate drive output voltage IO = 100 μA 10 V
IDRIVE = 000 10
IDRIVE = 001 20
IDRIVE = 010 30
IDRIVE = 011 50
IOUT Peak gate drive current mA
IDRIVE = 100 90
IDRIVE = 101 100
IDRIVE = 110 110
IDRIVE = 111 130
CYCLE-BY-CYCLE CURRENT LIMITER
Voltage limit across RISENSE for the current
VLIMITER 0.225 0.25 0.275 V
limiter
OCPDEG = 00 2
Time that VLIMITER is ignored, from the start of OCPDEG = 01 3
tBLANK µs
the PWM cycle OCPDEG = 10 3.75
OCPDEG = 11 6
PROTECTION CIRCUITS
Voltage limit across RISENSE for overcurrent
VSENSEOCP 1.7 1.8 1.9 V
protection
OCPTH = 00 200 250 400
Voltage limit across each external FET’s drain OCPTH = 01 400 500 600
VFETOCP mV
to source for overcurrent protection OCPTH = 10 600 750 850
OCPTH = 11 850 1000 1200
OCPDEG = 00 1.6
Deglitch time for VSENSEOCP or VFETOCP to OCPDEG = 01 2.3
tOCP µs
trigger OCPDEG = 10 3
OCPDEG = 11 5
VM rising 8
VUVLO VM undervoltage lockout V
VM falling 7.8
VM rising, OVTH = 0 32 34.5 36
VOVLO VM overvoltage lockout V
VM rising, OVTH = 1 28 29
tRETRY Fault retry time after OTS RETRY = 1 5 s
TTSD Thermal shutdown die temperature 150 160 °C
VCPFAIL VCP failure threshold (CPFAIL bit) VM + 3 V

DRV8308
6.6 SPI Timing Requirements

(1)
TA = 25°C, over recommended operating conditions unless otherwise noted
(2)
NUMBER MIN MAX UNIT
1 tCYC Clock cycle time 62
2 tCLKH Clock high time 25
3 tCLKL Clock low time 25
4 tSU(SDATI) Setup time, SDATI to SCLK 5
5 tH(SDATI) Hold time, SDATI to SCLK 1 ns
6 tSU(SCS) Setup time, SCS to SCLK 5
7 tH(SCS) Hold time, SCS to SCLK 1
8 tL(SCS) Inactive time, SCS (between writes) 100
9 tD(SDATO) Delay time, SCLK to SDATO (during read) 10
tAWAKE Wake time (ENABLE active to high-side gate drive enabled) 1 ms
tSPI Delay from power-up or RESET low until serial interface functional 10 μs
(1) SMODE = Low

(2) These numbers refer to the corresponding number in Figure 1
6 7 8
SCS
SCLK
2
SDATI X X
4 5
9
SDATO
SDATO
Valid
Figure 1. SPI Timing Requirements

DRV8308
6.7 Typical Characteristics
Figure 2. VSW vs Current with VM = 12V Figure 3. VREG vs Current with VM = 12V

DRV8308
7 Detailed Description
7.1 Overview
The DRV8308 device controls 3-phase brushless DC motors using a speed and direction input interface and Hall
signals from the motor. The device drives N-channel MOSFETs with 10-V VGS, and a configurable gate drive
current of 10 to 130 mA.
There are three modes of speed input: clock frequency, clock duty cycle (pulse-width modulation), and an
internal register that specifies duty cycle. In the Clock Frequency Mode, the device’s digital speed control system
matches motor speed with the input clock’s frequency. Motor speed is either determined from the Halls sensors
or signal on the FG input, which can be generated from a board trace underneath the motor that senses
magnetic reluctance. The speed control system offers digital tuning of pole and zero frequencies and integrator
gain. When properly tuned, the DRV8308 can drive motors with < 0.1% cycle jitter and fast torque compensation
for varying loads. The duty cycle speed modes operate in open-loop without speed control.
When the DRV8308 device powers up, the configuration registers are set from either the one-time programmable
(OTP) non-volatile memory, or from an external EEPROM (depending on the SMODE pin). After power-up,
registers can be set in realtime over SPI, and the OTP memory can be permanently written once.
When the DRV8308 device begins spinning a motor, it initially uses all three Hall sensor phases to commutate.
After a constant speed is reached, the LOCKn pin is pulled low and only one Hall sensor becomes used; this
feature reduces jitter by eliminating the error caused by non-ideal Hall device placement and matching. Also at
this time, commutation transitions to sine wave current drive (if enabled), which minimizes acoustic noise and
torque ripple. Commutation timing can be tuned using the ADVANCE register for optimal performance and power
efficiency.
Numerous protection circuits prevent system components from being damaged during adverse conditions.
Monitored aspects include motor voltage and current, gate drive voltage and current, and device temperature .
When a fault occurs, the DRV8308 device stops driving and pulls FAULTn low, in order to prevent FET damage
and motor overheating.
The DRV8308 device is packaged in a compact 6 × 6-mm, 40-pin QFN with a 0.5-mm pin pitch, and operates
through an industrial ambient temperature range of –40°C to 85°C.

DRV8308
7.2 Functional Block Diagram

VM
0.1 µF
VM VM
bulk VSW or VREG

Power VCP
CP1 UHSG
Charge Phase U
0.1 µF U
Pump pre-driver
CP2 10 V
VM ULSG
VCP
VCP
1 µF VM
VINT 1.8-V Linear VCP

Regulator VHSG
1 µF
Phase V V
VREG 5-V Linear pre-driver
Regulator 10 V
0.1 µF VLSG
VSW
VM Hall
ENABLE Power
GND VCP
WHSG
10 V 10-V Linear
PPAD Phase W Hall Hall Hall
Regulator W
pre-driver U V W
10 V
WLSG
CLKIN
- VLIMITER FG sense
DIR PWM (optional)
Limiter
Control ISEN
BRAKE +
Inputs
RISENSE
- VSENSEOCP
ENABLE Core SENSE
Logic OCP
RESET +
FGINP
Outputs
FGOUT FGINN / TACH
FG Input
LOCKn FGFB
FAULTn
Hall UHP
Voltage Differential Optional

UHN
Monitoring Comparators
SCLK
OTP + VHP
Memory
SDATAI - Optional
VHN
+
SCS SPI Thermal
Sensor -
SDATAO WHP
+
Oscillator - Optional
SMODE WHN

DRV8308
7.3 Feature Description

7.3.1 Hall Comparators
Three comparators are provided to process the raw signals from Hall effect transducers to commutate the motor.
The Hall amplifiers sense zero crossings of the differential inputs and pass the information to digital logic.
The Hall amplifiers have hysteresis, and their detect threshold is centered at 0. Note, hysteresis is defined as
shown in Figure 4:
Hall
Differential
Voltage VHYS
0V
Hall Amplifier
Output
(Internal)
Figure 4. Hall Amplifier Hysteresis
In addition to the hysteresis, the Hall inputs are deglitched with a circuit that ignores any extra Hall transitions for
a period of 20 μs after sensing a valid transition. This prevents PWM noise from being coupled into the Hall
inputs, which can result in erroneous commutation.
If excessive noise is still coupled into the Hall comparator inputs, it may be necessary to add capacitors between
the + and – inputs of the Hall comparators, and (or) between the input or inputs and ground.
The ESD protection circuitry on the Hall inputs implements a diode to VREG. Because of this diode, the voltage
on the Hall inputs should not exceed the VREG voltage.
Since VREG is disabled in standby mode (ENABLE inactive), the Hall inputs should not be driven by external
voltages in standby mode. If the Hall sensors are powered from VREG or from VSW, this is specified by the
DRV8308 device; however, if the Hall sensors are powered externally, they should be disabled if the DRV8308 is
put into standby mode. In addition, they should be powered-up before enabling the motor, or an invalid Hall state
may cause a delay in motor operation.
7.3.2 FG Amplifier, Comparator, and FG Output

An FG amplifier and comparator provide rotational feedback from an external magnetic reluctance sensor. A
diagram of the FG circuit is shown in Figure 5:

DRV8308
Feature Description (continued)
5V
FGSEL (to speed control)

2.75V HALL_U
2
HALL_V FG
HALL_W
2.50V FGOUT
0
1
2 MUX
MR - 3
Pickup
FGIN+
+ S
4.7éF
1nF + Q
FGIN- / TACH
- R
0.1éF 2k
-
Filter components 820k
FGFB
as required ± +
values may differ
in actual
application 100pF
Figure 5. FG Circuit Diagram
The output of the FG amplifier is provided on a pin, so the gain of the FG amplifier can be set by the user. Filter
circuits can also be implemented.
Note that the FG signal is also fed back internally to the speed control circuits.
The FG signal that the DRV8308 device uses can be generated from a PCB trace under a motor, or it can be
input from a logic-level TACH input, or it can be synthesized from the Hall sensor transitions (selectable by
register FGSEL). If generated from Hall transitions, the resulting output can be either an exclusive-or function of
the three Hall sensors, or the same as the HALL_U input, as shown in Figure 6.
Selection of FG operating mode is through the FGSEL register bits.
The FGOUT pin is an open-drain output and requires an external pullup resistor to the logic supply.

DRV8308
HALL_U
HALL_V
HALL_W
FGFB
TACH
FGOUT when FGSEL=0

(HALL_U)
FGOUT when FGSEL=1
(XOR of the Halls)
FGOUT when FGSEL=2
(FG amplifier)
FGOUT when FGSEL=3
(TACH)
Figure 6.
7.3.3 Enable, Reset, and Clock Generation

The ENABLE pin is used to start and stop motor operation. ENABLE can be programmed to be active high or
active low, depending on the state of the ENPOL bit; if ENPOL = 0, ENABLE is active high. If ENPOL = 1, the
ENABLE pin is active low.
The polarity of ENABLE cannot be modified during operation through register writes; it is controlled only by the
contents of the ENPOL bit in OTP memory.
When ENABLE is active, operation of the motor is enabled. When ENABLE is made inactive, the speed control
loop is reset, and the motor either brakes or coasts depending on the state of the BRKMOD bit. After motor
rotation has stopped (when no transitions occur on the FGOUT pin for a period of 1 s), the DRV8308 device
enters a low-power standby state. In the standby state, the motor driver circuitry is disabled (all gate drive
outputs are driven low, so the FET outputs are high-impedance), the gate drive regulator and charge pump are
disabled, the VREG regulator and VSW power switch are disabled, and all analog circuitry is placed into a low
power state. The digital circuitry in the device still operates in standby mode.
All internal logic is reset in three different ways:
1. Upon device power-up.
2. When VM drops below VRESET.
3. When the RESET pin is high while ENABLE is active.
If RESET is high while ENABLE is inactive, then the registers read as 1. If the RESET pin is not needed, it can
be connected to GND. The RESET input is deglitched with a 10-µs timer on assertion and deassertion.
An internal clock generator provides all timing for the DRV8308 device. The master oscillator runs at 100 MHz.
This clock is divided to a nominal 50-MHz frequency that clocks the remainder of the digital logic.

DRV8308

7.3.4 Commutation
For 3-phase brushless DC motors, rotor position feedback is provided from Hall effect transducers mounted on
the motor. These transducers provide three overlapping signals, each 60° apart. The windings are energized in
accordance with the signals from the Hall sensors to cause the motor to move.
In addition to the Hall sensor inputs, commutation is affected by a direction control, which alters the direction of
motion by reversing the commutation sequence. Control of commutation direction is by the DIRPOL register bit
as well as the DIR input pin. The DIRPOL register bit is combined with the pin with an exclusive-OR function as
follows:
Table 1. Direction Behavior

DIR PIN DIRPOL REGISTER BIT RESULTING DIR FOR
COMMUTATION
0 0 0
0 1 1
1 0 1
1 1 0
If the commanded direction is changed while the motor is still spinning, this may cause excessive current flow in
the output stage.
The DRV8308 device supports three commutation modes: standard 120° commutation using three Hall sensors,
120° commutation using a single Hall sensor, and 180° sine-wave-drive commutation.
In standard 120° commutation, mis-positioning of the Hall sensors can cause motor noise, vibration, and torque
ripple. 120° commutation using a single Hall sensor (single-Hall commutation) can improve motor torque ripple
and vibration because it relies on only one Hall edge for timing.
180° sine-wave-drive commutation is even more advanced, and excites the windings with a waveform that
delivers nearly sinusoidal current to each winding.
7.3.4.1 120° 3-Hall Commutation

In standard 120° commutation, the motor phases are energized using simple combination logic based on all
three Hall sensor inputs. Standard 120° commutation is in accordance with Table 2, Figure 7, and Figure 8:
Table 2. Standard 120° Commutation (1)

HALL INPUTS PRE-DRIVE OUTPUTS
STATE DIR = 1 DIR = 0 PHASE U PHASE V PHASE W
U_H V_H W_H U_H V_H W_H U_HSGATE U_LSGATE V_HSGATE V_LSGATE W_HSGATE W_LSGATE
1 L L H H H L L L PWM L / !PWM (2) L H
2 L H H H L L PWM L / !PWM (2) L L L H
3 L H L H L H PWM L / !PWM (2) L H L L
4 H H L L L H L L L H PWM L / !PWM (2)
5 H L L L H H L H L L PWM L / !PWM (2)
6 H L H L H L L H PWM L / !PWM (2) L L
1X H H H L L L L L L L L L
2X L L L H H H L L L L L L
(1) Hall sensor is "H" if the positive input pin voltage is higher than the negative input pin voltage. States 1X and 2X are illegal input
combinations.
(2) During states where the phase is driven with a PWM signal, using asynchronous rectification, the LS gate is held off (L); using
synchronous rectification, the LS gate is driven with the inverse of the HS gate.
DRV8308
Standard 120° Commutation (DIR = 1)
State 1 2 3 4 5 6 1 2 3 4 5 6 1
Hall U
Hall V
Hall W
Phase U HS
Phase U LS (1) (1)
Phase V HS
Phase V LS (1) (1) (1)
Phase W HS
Phase W LS (1) (1)
(1) Low for Asynch Rectification, !PWM for Sync Rectification
Figure 7. Standard 120° Commutation (DIR = 1)

DRV8308
Standard 120° Commutation (DIR = 0)
State 1 2 3 4 5 6 1 2 3 4 5 6 1
Hall U
Hall V
Hall W
Phase U HS
Phase U LS (1) (1)
Phase V HS
Phase V LS (1) (1) (1)
Phase W HS
Phase W LS (1) (1)
(1) Low for Asynch Rectification, !PWM for Sync Rectification
Figure 8. Standard 120° Commutation (DIR = 0)
7.3.4.2 120° Single-Hall Commutation

To generate commutation timing for single-Hall commutation, a digital timer is used to create a clock that runs at
960× the Hall sensor frequency. Only one Hall sensor input, HALL_U, is used for commutation; this eliminates
any torque ripple caused by mechanical or electrical offsets of individual Hall sensors.
Single-Hall commutation is only enabled when the register BASIC = 0 and the motor is operating at a nearly
constant speed or speed-locked condition. To control this function, logic is used to determine when the speed is
constant and the speed control loop is locked. This logic generates the LOCK signal. The LOCK signal is also
output on the LOCKn pin.
Except in PWM input modes, LOCK is also prevented from being signaled if the speed control loop integrator is
saturated (either at 0 or full-scale), which indicates that the speed control loop is not locked.
Until LOCK goes active (for example, at start-up, stop, or application of a sudden load that causes motor speed
to drop very quickly), standard 120° commutation is used. Because of this, three Hall sensors are required
regardless of which commutation method is used.
The commutation timer drives a counter that can be offset with a value programmed in the ADVANCE register.
This value allows the phase of commutation to be shifted relative to the actual Hall sensor transitions. Note that
the phase advance is not functional in standard 120° commutation. The phase advance also has an automatic
mode where the advance value is scaled according to motor speed (see Auto Gain and Advance Compensation).

DRV8308
Timing of 120° single-Hall commutation is essentially the same as standard 120° commutation shown previously.
However, there are small time differences of when the transitions occur.
7.3.4.3 180° Sine-Wave-Drive Commutation

180° sine-wave-drive commutation uses a single Hall sensor to generate commutation timing, as described for
120° single-Hall commutation. In addition, the value of the commutation timer modulates the duty cycle of the
outputs in accordance with a fixed pattern that approximates sinusoidal current through the windings.
The output of the commutation block is a 12-bit modulation value for each motor phase (U, V, and W) that
represents the duty cycle modulation of the PWM for each output. Note that during 120° commutation, these
values are either 0 or set to a constant value derived from the MOD120 register.
When using sine mode, MOD120 should be set to 3970.
Modulation value
Duty Cycle
Figure 9. 180° Sine-Wave-Drive Commutation
During 180° sine-wave-drive commutation, commutation transitions occur midway between Hall transitions. The
PWM duty cycle is modulated to provide sinusoidal current waveforms. Commutation (shown for asynchronous
rectification) is in accordance with the table and diagrams below. Note that the diagrams show a representation
of duty cycle, not level, for the PWM states.
Table 3. Commutation for Asynchronous Rectification (1)

HALL INPUTS PRE-DRIVE OUTPUTS
STATE DIR = 1 DIR = 0 PHASE U PHASE V PHASE W
U_H V_H W_H U_H V_H W_H U_HSGATE U_LSGATE V_HSGATE V_LSGATE W_HSGATE W_LSGATE
1 L L H H H L PWM L / !PWM (2) PWM L / !PWM (2) L H
2 L H H H L L PWM L / !PWM (2) PWM L / !PWM (2) L H
3 L H L H L H PWM L / !PWM (2) L H PWM L / !PWM (2)
4 H H L L L H PWM L / !PWM (2) L H PWM L / !PWM (2)
(2)
5 H L L L H H L H PWM L / !PWM PWM L / !PWM (2)
6 H L H L H L L H PWM L / !PWM (2) L L / !PWM (2)
1X H H H L L L L L L L L L
2X L L L H H H L L L L L L
(1) Hall sensor is "H" if the positive input pin voltage is higher than the negative input pin voltage. States 1X and 2X are illegal input
combinations.
(2) During states where the phase is driven with a PWM signal, using asynchronous rectification, the LS gate is held off (L); using
synchronous rectification, the LS gate is driven with the inverse of the HS gate.

DRV8308
180° Sine Commutation (DIR = 1)
State 1 2 3 4 5 6 1 2 3 4 5 6 1
Hall U
Hall V
Hall W
Phase U HS
Phase U LS (1) (1) (1)
Phase V HS
Phase V LS (1) (1) (1)
Phase W HS
Phase W LS (1) (1)
(1) Low for Asynch Rectification, Inverted HS Signal for Sync Rectification
Figure 10. 180° Sine Commutation (DIR = 1)

DRV8308
180° Sine Commutation (DIR = 0)
State 6 5 4 3 2 1 6 5 4 3 2 1 6
Hall U
Hall V
Hall W
Phase U HS
Phase U LS (1) (1)
Phase V HS
Phase V LS (1) (1) (1)
Phase W HS
Phase W LS (1) (1) (1)
(1) Low for Asynch Rectification, Inverted HS Signal for Sync Rectification
Figure 11. 180° Sine Commutation (DIR = 0)

DRV8308
7.3.5 Commutation Logic Block Diagram

A block diagram of the commutation logic is shown in Figure 12.
DELAY
ADVANCE !
U_MOD
Commutation Timer
HALL_PERIOD V_MOD
Auto COMCNT
Advance D Q W_MOD
0 LD DIR_PWM
D Q D Q /960 D Commutation
Q=0 Cnt = 0 BKRMOD
Tables
LD LD LD 0 - 960 count ENSINE
CLK50 CLK50 CLK50 ENABLE U_LS

25b CNT
Phase V_LS
25b REG 17b DN CNT DIR
Advance / W_LS
HU_SYN
Commutation HV_SYN
Counter HW_SYN
/N
HALLRST (1,2,4,8)
HALL_U Sync HU_SYN
CLK50 Deglitch
D Q
HALL_V Sync HV_SYN CLK50
Deglitch
Speed Change Detect
HALL_W Sync HW_SYN
Deglitch D Q Diff. A
A>B
B
8b DN CNT
/4,/8, .../512
BASIC
LD Q ENL_180
ENABLE = 0 SPDTH D
ENABLE Clears all
Registers and
Counters A SPDREVS
A>B Minimum Revs at
MINSPD B Speed
DIRPWM
Minimum Speed INTSAT
Detect
Lock Detect Logic
Figure 12. Commutation Logic
7.3.6 Commutation Parameters

A number of commutation parameters are programmable through registers accessed through the serial interface,
including:
• ADVANCE — The phase of commutation is advanced (or delayed) relative to the Hall sensor transition by this
8-bit amount. Units are in commutation clocks, which is 1 / 960 of the HALL_U period. Note that phase
advance is only applicable in single-Hall commutation modes. An automatic phase advance compensation
mode can also be enabled by the AUTOADV bit (see Auto Gain and Advance Compensation for details).
• DELAY — if set, commutation is delayed relative to Hall transitions; if cleared, commutation is advanced
relative to Hall transitions.
• BASIC — If set, commutation is a basic 120° 3-Hall mode with no ADVANCE.
• ENSINE — The ENSINE bit, when set, selects 180° sinusoidal commutation. The BASIC bit must also be 0.
• HALLRST — HALLRST sets how many HALL_U cycles pass for each commutation counter reset. In other
words, the commutation counter is reset every N HALL_U edges. Selections available are 1, 2, 4, and 8.
• MINSPD — Sets the minimum Hall_U period that LOCK can be set. The 8-bit field represents 2.56 ms/count,
with a max value of 652.8 ms.
• SPDREVS — After the MINSPD and SPEEDTH criteria are met, SPDREVS adds a minimum number of
Hall_U periods that must occur for LOCK to be set.
• SPEEDTH — Sets how much speed variation is allowed across Hall_U periods while keeping LOCK set. This
3-bit field sets the percentage variation allowed by changing a programmable divider. Divisions of 1/4, 1/8,
1/16, 1/32, 1/64, 1/128, 1/256, and 1/512 are supported. These divisors correspond to 25%, 12.5%, 6.25%,

DRV8308
3.13%, 1.56%, 0.78%, 0.39%, and 0.20% variation per revolution.

• SPEED — In the Internal Register PWM Mode, SPEED divided by 4095 sets the input duty cycle. In Clock
Frequency Mode, SPEED sets the open-loop gain during spin-up before LOCKn goes Low.
The diagram below shows how the lock parameters (MINSPD, SPEEDTH, and SPDREV) affect commutation
mode.
Frequency
HALL_U SPEEDTH
SPDREVS:
MINSPD and SPEEDTH criteria
meet for the number of electrical
revs before 180 commutation
SPDREVS
SPEEDTH: enable
How much speed variation is allowed
while 180 commutation
MINSPD:
Sets the mim speed that 180°
commutation can be enabled
ENL_180 H: 180° commutation

L: 120° commutation
Commutation
120° Commutation 180° Commutation 120 180
Table Output
Figure 13. Commutation Parameters
7.3.7 Braking
Motor braking can be initiated by the BRKPOL register bit as well as the BRAKE pin. The BRKPOL register bit
can also be used to program the polarity of the BRAKE pin, as it is combined with the pin with an exclusive-OR
function as follows:
Table 4. Brake Behavior

BRAKE PIN BRKPOL REGISTER RESULTING
BIT FUNCTION
0 0 Not brake
0 1 Brake
1 0 Brake
1 1 Not brake
When the motor is braking, all low-side drivers are held in an on state, causing all low-side FETs to turn on, and
the integrator is reset to 0.
In addition, braking can be entered when the ENABLE pin is made inactive. BRKMOD controls the behavior of
the outputs when ENABLE is inactive. If BRKMOD= 0, the outputs are 3-stated, resulting in the motor coasting; if
BRKMOD = 1, all low-side FETs are turned on, causing the motor to brake.

DRV8308
Table 5. BRKMOD
BRKMOD = 0 BRKMOD = 1
COAST BRAKE
RESET = 1 Coast Brake
BRAKE = active Brake Brake
ENABLE = inactive Coast Brake
DIR Coast Brake
Clock off Brake Brake
Power down Coast Brake
7.3.8 Output Pre-Drivers

The output drivers for each phase consist of N-channel and P-channel MOSFET devices arranged as a CMOS
buffer. They are designed to directly drive the gate of external N-channel power MOSFETs.
The outputs can provide synchronous or asynchronous rectification. In asynchronous rectification, only the high-
side FET is turned on and off with the PWM signal; current is recirculated using external diodes, or the body
diodes of the external FETs. In synchronous rectification, the low side FET is turned on when the high side is
turned off.
Synchronous rectification is enabled or disabled using the SYNRECT control bit. When set to 1, synchronous
rectification is used. In general, synchronous rectification results in better speed control and higher efficiency.
The high-side gate drive output UHSG is driven to VCP whenever the duty cycle output U_PD from the PWM
generator is high, the enable signal U_HS from the commutation logic is active, and the current limit (VLIMITER) is
not active. If the high-side FET is on and a current limit event occurs, the high-side FET is immediately turned off
until the next PWM cycle.
The low-side gate drive ULSG is driven to VM whenever the internal signal U_LS is high, or whenever
synchronous rectification is active and UHSG is low.
Phases V and W operate in an identical fashion.
VCP
IDRIVE
TDRIVE UHGS
DTIME
Dead
SYNRECT
Time
Generator U
U_PD &
Drive
ILIMIT to other phases Logic VM
U_HS
11V
U_LS ULSG
BRAKE
Figure 14. Predriver Circuit

DRV8308
tDRIVE
High Z High Z High Z

Low Z
HS drive
Low
Z
xHS
tDRIVE
High Z Low Z High Z High Z
LS drive Low
Z
xLS
tDEAD tDEAD
Figure 15. Drive Timing
The peak drive current of the pre-drivers is adjustable by setting the IDRIVE register bits. Peak drive currents
may be set between 10 and 130 mA. Adjusting the peak current changes the output slew rate, which also
depends on the FET input capacitance and gate charge.
When changing the state of the output, the peak current is applied for a short period of time (tDRIVE), to charge
the gate capacitance. This time is selected by setting the TDRIVE register bits. Times of 1, 5, 10, or 15 µs may
be selected. After this time, a weak current source is used to keep the gate at the desired state. When selecting
the gate drive strength for a given external FET, the selected current must be high enough to fully charge and
discharge the gate during the time when driven at full current, or excessive power is dissipated in the FET.
During high-side turn-on, the low-side gate is held low with a low impedance. This prevents the gate-source
capacitance of the low-side FET from inducing turn-on. Similarly, during low-side turn-on, the high-side gate is
held off with a low impedance.
The pre-driver circuits include enforcement of a dead time in analog circuitry, which prevents the high-side and
low-side FETs from conducting at the same time. Additional dead time can be added (in digital logic) by setting
the DTIME register bits.
7.3.9 Current Limit

The current limit circuit activates if the voltage detected across the low-side sense resistor exceeds VLIMITER. This
feature restricts motor current to less than VLIMITER/RISENSE, and it reduces the requirements of the external power
supply. Note that the current limit circuit is ignored immediately after the PWM signal goes active for a short
blanking time, to prevent false trips of the current limit circuit.
If current limit activates, the high-side FET is disabled until the beginning of the next PWM cycle. If synchronous
rectification is enabled when the current limit activates, the low-side FET is activated while the high-side FET is
disabled.

DRV8308
7.3.10 Charge Pump

Since the output stages use N-channel FETs, a gate drive voltage higher than the VM power supply is needed to
fully enhance the high-side FETS. The DRV8308 device integrates a charge pump circuit that generates a
voltage approximately 10 V more than the VM supply for this purpose.
The charge pump requires two external capacitors for operation. For details on these capacitors (value,
connection, and so forth), refer to the Pin Functions table in the Pin Configurations and Functions section.
The charge pump is shutdown when in standby mode (ENABLE inactive).
VM
VM
0.1 µF
35 V
CP1
0.1 µF
35 V
CP2 Charge
Pump
VCP
1 µF
10 V To Pre-Drivers
Figure 16. Charge Pump
7.3.11 5-V Linear Regulator

A 5-V linear regulator (VREG) is provided to power internal logic and external circuitry, such as the Hall effect
sensors.
A capacitor must be connected from the VREG output to ground, even if the output is not used for external
circuitry. The recommended capacitor value is a 0.1-μF, 10-V ceramic capacitor.
The VREG output is designed to provide up to 30-mA output current, but power dissipation and thermal
conditions must be considered. As an example, with 24 V in and 20 mA out, power dissipated in the linear
regulator is 19 V × 20 mA = 380 mW.
The VREG regulator is shutdown in standby mode (when ENABLE is inactive).
7.3.12 Power Switch

A low-current switch is provided in the DRV8308 device that can be used to power the Hall sensors or other
external circuitry through the VSW pin. When ENABLE is active the switch is turned on, connecting the VSW pin
to VM. When ENABLE is inactive the switch is turned off (standby mode).
7.3.13 Protection Circuits

A number of protection circuits are included in the DRV8308 device. Faults are reported by asserting the
FAULTn pin (an active-low, open-drain output signal), as well as setting the appropriate bit or bits in the FAULT
register. Note that bits in the FAULT register remain set until either a 0 is written to them, RESET is asserted, or
the device power is cycled.
7.3.13.1 VM Undervoltage Lockout (UVLO)

If the VM power supply drops, there may not be enough voltage to fully turn on the output FETs. Operation in this
condition causes excessive heating in the output FETs. To protect against this, the DRV8308 device contains an
undervoltage lockout circuit.

DRV8308
In the event that the VM supply voltage drops below the undervoltage lockout threshold (VUVLO), the FAULTn pin
is driven active and the motor driver is disabled. After VM returns to a voltage above the undervoltage lockout
threshold, the FAULTn pin is high impedance and operation of the motor driver automatically resumes.
The UVLO bit in the FAULT register is set. This bit remains set until a 0 is written to the UVLO bit.
At power-up, the UVLO bit is set.
Note that register reads and writes are still possible during the UVLO condition, as long as VM stays above the
VM reset threshold. If VM drops below the VM reset threshold, all registers are reset and register read or write is
not functional.
7.3.13.2 VM Overvoltage (VMOV)

In some cases, if synchronous rectification is used, energy from the mechanical system can be forced back into
the VM power supply. This can result in the VM power supply being boosted by the energy in the mechanical
system, causing breakdown of the output FETs, or damaging the DRV8308 device. To protect against this, the
DRV8308 device has overvoltage protection.
There are two overvoltage thresholds, selectable by the OVTH bit. An overvoltage event is recognized if the VM
voltage exceeds the selected overvoltage threshold (VMOVLO). Note that for the output FETs to be protected, they
must be rated for a voltage greater than the selected overvoltage threshold.
In the event of an overvoltage, the FAULTn pin is pulled low. If synchronous rectification is enabled, the output
stage is forced into asynchronous rectification. After VM returns to a voltage below the overvoltage threshold, the
FAULTn pin is high impedance. If synchronous rectification was enabled prior to the overvoltage event, after a
fixed 60-µs delay, synchronous rectification is re-enabled.
The VMOV bit in the FAULT register is set. This bit remains set until a 0 is written to the VMOV bit.
7.3.13.3 Motor Overcurrent (OCP)

Overcurrent protection (OCP) is provided on each FET in addition to the current limit circuit. The OCP circuit is
designed to protect the output FETs from atypical conditions such as a short circuit between the motor outputs
and each other, power, or ground.
The OCP circuit is independent from the current limit circuitry. OCP works by monitoring the voltage drop across
the external FETs when they are enabled. If the voltage across a driven FET exceeds VFETOCP for more than tOCP
an OCP event is recognized. VFETOCP is configurable by register OCPTH and tOCP is configurable by register
OCPDEG.
In addition to monitoring the voltage across the FETs, an OCP event is triggered if the voltage applied to the
ISEN pin exceeds the VSENSEOCP threshold voltage.
In the event of an OCP event, FAULTn is pulled low, and the motor driver is disabled.
After a fixed delay of 5 ms, the FAULTn pin is driven inactive and the motor driver is re-enabled.
The OCP bit in the FAULT register is set when an OCP event is recognized. This bit remains set until a 0 is
written to the OCP bit.
7.3.13.4 Charge Pump Failure (CPFAIL)

If the voltage generated by the high-side charge pump is too low, the high-side output FETs are not fully turned
on, and excessive heating results. To protect against this, the DRV8308 device has a circuit that monitors the
charge pump voltage.
If the charge pump voltage drops below VCPFAIL, the FAULTn pin is pulled low and the motor driver is disabled.
After the charge pump voltage returns to a voltage above the VCPFAIL threshold, the FAULTn pin is high
impedance and operation of the motor driver automatically resumes.
The CPFAIL bit in the FAULT register is set when the charge pump voltage drops below VCPFAIL. This bit
remains set until a 0 is written to the CPFAIL bit.
At power-up, the CPFAIL bit is set.

DRV8308
7.3.13.5 Charge Pump Short (CPSC)

To protect against excessive power dissipation inside the DRV8308 device, a circuit monitors the charge pump
and disables it in the event of a short circuit on the PCB.
If a short circuit is detected on the charge pump, the FAULTn pin is pulled low and the motor driver is disabled.
After a fixed period of 5 s, the FAULTn pin is high impedance and operation of the motor driver automatically
resumes. If the short circuit condition is still present, the cycle repeats.
The CPSC bit in the FAULT register is set when a short circuit is detected on the charge pump. This bit remains
set until a 0 is written to the CPSC bit.
7.3.13.6 Overtemperature (OTS)

To protect against any number of faults that could result in excessive power dissipation inside the device, the
DRV8308 device includes overtemperature protection.
Overtemperature protection activates if the temperature of the die exceeds the OTS threshold temperature
(TTSD). If this occurs, the FAULTn pin is pulled low, the device is disabled and the OTS bit in the FAULT register
is set. This OTS bit remains set until a 0 is written to the OTS bit.
If the RETRY bit is set after the temperature has fallen below the OTS threshold, the part re-enables itself after a
fixed delay of 5 s.
If the RETRY bit is not set, the part disables the pre-drivers until RESET is asserted, or until power has been
removed and re-applied to the device.

DRV8308
7.4 Device Functional Modes

7.4.1 Modes of Speed Input
The DRV8308 device is designed to support a wide range of motor speeds and constructions. Speeds of up to
approximately 50000 RPM are supported with motor constructions of up to 16 poles, or corresponding lower
speeds with more poles. This translates into a Hall sensor speed of up to 6.7 kHz. (The frequency of one Hall
sensor can be calculated by RPM × (motor poles) / 120.)
Speed control of the motor is accomplished by varying the duty cycle applied to the external FETs. Three
methods of speed control input are possible with the DRV8308 device:
• Clock Frequency Mode: This is closed-loop speed control that locks the FGOUT frequency with the CLKIN
frequency.
• Clock PWM Mode: This is open-loop, where the duty cycle of the clock on CLKIN scales the speed of the
motor.
• Internal Register PWM Mode: This is open-loop, where register SPEED divided by 4095 commands the
input duty cycle.
The mode used is set by the SPDMODE register.
7.4.1.1 Clock Frequency Mode

For a practical guide on tuning closed-loop speed control, refer to Section 3 of theDRV8308EVM User's Guide.
In Clock Frequency Mode, the clock signal is deglitched by the 51.2-MHz clock. The deglitched input, along with
the FG signal (derived from the FG amplifier, TACH input, or the Hall sensors), are input to a speed differentiator,
where the CLKIN signal is compared to the actual speed of the motor (determined by the FG frequency). The
speed differentiator outputs are UP and DOWN pulses.
The deglitcher and speed differentiator are shown in Figure 17:
Sync and Deglitch Speed Compare
CLK50
CLKIN/PWMIN CLK_DEG REF UP

Deglitch
Speed
Diff.
IN DOWN
FG
Signal must be high or low
for two consecutive CLK50
edges for the deglitched
output to change
PWM_DEG
Figure 17. Deglitcher and Speed Differentiator
The UP and DOWN outputs of the speed differentiator are integrated by accumulating the value set by the
SPDGAIN register for each cycle of the integrator clock (CLK50 divided by the value of the INTCLK register) that
an UP or DOWN signal is active. If UP is active, the amount is added to the current integrator output; if the
DOWN input is active, the value is subtracted. If neither signal is active, the integrator output remains the same.
Note that the integrator output is reset to 0 at any time the motor is disabled or in brake, and at reset. The
integrator output does not roll over at maximum or minimum count.
At the moment that ENABLE is made active, the integrator and filters are reset to 0. If there are no transitions on
the CLKIN pin, no UP pulses are generated, so the integrator remains at 0, and the motor is not driven.
Once the motor is running, if the signal on CLKIN stops, DOWN pulses are generated until the integrator reaches
0. This actively decelerates the motor (brake) until the motor stops.

DRV8308
Device Functional Modes (continued)

The output of the integrator is applied to a programmable digital filter. The filter has one pole and one zero. The
pole location is programmable from approximately 100 to 1600 Hz, and is set via the FILK1 register; the zero
location is programmable from 2 to 100 Hz and is set via the FILK2 register. The filter may be bypassed by
setting the BYPFILT bit.
For a given pole and zero frequency, FILK1 and FILK2 are calculated as follows:
f fp
2S z 2S
fs fs
FILK2 219 , FILK1 216
fz fp
1 S 1 S
fs fs
where
• fz is the desired zero frequency
• fp is the desired pole frequency
• fs is the filter sample rate (195000 Hz)
• The result is rounded to the nearest integer (1)
Following the filter is a programmable lead compensator, which also contains one pole and one zero. The
compensator characteristics are programmable by the COMPK1 and COMPK2 registers. Center frequency is
programmable between 20 and 100 Hz, with a phase lead between 0° and 80°. The compensator may be
bypassed by setting the BYPCOMP bit.
For a given pole and zero frequency, COMPK1 and COMPK2 are calculated as follows:
f fp
2S z 2S
fs fs
COMPK2 219 , COMPK1 216
fz fp
1 S 1 S
fs fs
where
• fz is the desired zero frequency
• fp is the desired pole frequency
• fs is the filter sample rate (195000 Hz)
• The result is rounded to the nearest integer (2)
The filter and compensator ratios also scale DC gain in the same way as LOOPGAIN. DC gain is scaled by
2×(FILK2/FILK1) and 0.5×(COMPK2/COMPK1).
The digital filter and compensator are reset to 0 whenever the motor is disabled.
The integrator, filter, and lead compensator result in a typical open-loop response as shown in Figure 18. Note
that the locations of the poles and zeros are not restricted to what is shown.

DRV8308
Int
Re egrat
sp
on o r
se Section 1 Section 1
Zero Pole
Section 2
Pole / Zero
LOOPGN
Gain
FILK2 FILK1 COMPK1,2

0 Hz
Frequency
Figure 18. Open-Loop Response
The integrator operates on the periods of CLKIN and the Feedback as shown in Figure 19:
SPDGAIN
TCLKIN TCLKIN
³
1 1 . 6 ˜ SPDGAIN
TFB TFB 2 INTCLK
INTCLK
Figure 19. Integrator and Filters
7.4.1.2 Clock PWM and Internal Register PWM Modes

In PWM input modes, the PWM input signal is timed using a 50 MHz clock to generate a 12-bit number that
corresponds to the duty cycle of the incoming PWM signal. The input PWM frequency should be between 16 and
50 kHz, higher PWM frequencies work, but resolution is degraded. Note that the gate driver’s output PWM
frequency is independent of the speed control PWM input frequency; the output PWM frequency is selected by
the PWMF register bits.
The measured input duty cycle is scaled by the contents of the MOD120 register. With a full-scale MOD120
register (4095 decimal), the output duty cycle is 2× the input duty cycle. To make the output duty cycle equal to
the input, a value of 2048 decimal should be written to MOD120.
An additional multiplication factor of 2 is introduced when the BYPCOMP bit is set; if BYPCOMP is set, the
output duty cycle is 4× the input duty cycle (when MOD120 is 4095).

DRV8308

In register speed control mode, a 12-bit register SPEED is used to directly provide the speed command.
During sine commutation, the input duty cycle is multiplied by the modulation values for each phase (MOD_U,
MOD_V, and MOD_W) to generate a 12-bit value that determines the output PWM duty cycle of each phase.
Note that in 120° commutation, the MOD values are fixed at a duty cycle that is set by the MOD120 register.
The PWM frequency can be set to either 25, 50, 100, or 200 kHz, with register PWMF. Lower PWM frequencies
are desirable to minimize switching losses; higher PWM frequencies provide better control resolution, especially
at very high motor speeds.
The outputs of the PWM generators are the signals U_PD, V_PD, and W_PD. These contain the duty cycle
information for each phase.
Modulation and PWM generation is shown in Figure 20:
Sine Modulation PWM generators
MOD120
100 MHz
12-bit U_PD
MOD_U 1 PWM
0
X
12-bit V_PD
MOD_V 1 PWM
0
X
SPD_CMD
12-bit W_PD
PWM 1 PWM
MOD_W X
PWM_DEG Input
0
Timer
0 MUX ENL_180
1
2
SPEED
MOD_U, MOD_V, and MOD_W values generated

SPDMODE from lookup tables and logic based on the
commutation counter. In 120° commutation mode,
CLKIN mode = 0, PWM mode = 1, full-scale duty cycle is set by MOD120 register.
Speed Reg mode = 2
Figure 20. Modulation and PWM Generation
7.4.2 Auto Gain and Advance Compensation

The DRV8308 device provides modes to automatically scale the loop gain and the phase advance settings
based on motor speed. This helps improve loop stability and motor performance in cases where the motor must
operate over a wide speed range with a single set of parameters. For applications that run at only one speed,
these functions should be left disabled.
Auto gain compensation is enabled by setting the AUTOGAIN bit. Auto gain will scale the LOOPGAIN of the
system using the following equation:
Computed Gain = (LOOPGAIN / AG_SETPT) × fCLKIN (3)
Automatic advance is enabled by setting the AUTOADV bit. The advance setting is scaled such that at zero
speed, there is no phase advance. As speed increases, the phase advance is increased using the equation
below:
Computed Advance = (ADVANCE / AA_SETPT) × fHall_U (4)
Both the gain and advance values are latched when LOCK goes active (when the motor is at constant speed).
The auto gain and advance functions are shown in Figure 21:

DRV8308
AA_SETPT
B
A
fHALL_U A/B
AUTOADV
ADVANCE X 1
To Commutation
0 Latch Counter
AG_SETPT
B
LOCK
A
fCLKIN A/B AUTOGAIN
LOOPGAIN X 1
To Loop Gain
0 Latch Multiplier
Figure 21. Auto Gain and Advance Functions
7.4.3 External EEPROM Mode

A serial EEPROM can be connected to the serial port to load the register contents. To activate external
EEPROM mode, connect the SMODE pin to logic high. This causes the SPI interface to act as a master, and
load data from an external EEPROM. The DRV8308 device latches data on the falling edge of SCLK.
The serial EEPROM should be a microwire-compatible, 16-bit-word device, such as the 93C46B. The VREG
power supply can be used to power the EEPROM. Connections are as shown in Figure 22:
VREG
10 k
Microwire Serial EEPROM
93C46B or Equivalent
SDATAO
VCC
SCS
CS
DO
SDATAI SPI
DI
SCLK
CLK
VSS SMODE
Figure 22. EEPROM Mode Connections
Data in the EEPROM should be arranged starting at address 0 exactly as shown in Table 6. EEPROM data bits
12 to 15 are unused.

DRV8308

To program the EEPROM device in-circuit while connected to the DRV8308 device, place the DRV8308 device
into the reset state by driving RESET high. This 3-states the serial interface pins and allows them to be
overdriven by external programming logic. Alternatively, the EEPROM may be programmed off-board before
assembly. The DRV8308 device cannot program an EEPROM.
7.5 Programming
7.5.1 Serial Interface

A simple SPI serial interface is used to write to the control registers in the DRV8308 device. Optionally, the
interface can be configured to automatically load the registers from an external EEPROM device.
Data is shifted into a holding register when SCS is active high. When SCS is returned to inactive (low), the data
received is latched into the addressed register.
7.5.2 Serial Data Format

The serial data consists of a 24-bit serial write, with a read or write bit, 7 address bits, and 16 data bits. The
address bits identify one of the registers defined in Table 8.
To write to a register, data is shifted in after the address as shown in Figure 23:
SCS
SCLK 1 2 3 4 5 6 7 8 Note 1 9 10 11 12 13 14 15 16 Note 1 17 18 19 20 21 22 23 24
Note 2
SDATI WRT A6 A5 A4 A3 A2 A1 A0 X D15 D14 D13 D12 D11 D10 D9 D8 X D7 D6 D5 D4 D3 D2 D1 D0
A. Any amount of time may pass between bits, as long as SCS stays active high. This allows 8-bit writes to be used.
B. Any additional clock edges encountered after the 24th edge are ignored.
Figure 23. SDF Timing Diagram 1
Data may be read from the registers through the SDATO pin. During a read operation, only the address is used
from the SDATI pin; the data bits following are ignored. Reading is enabled by setting the READ bit at the
beginning of the access:
SCS
SCLK 1 2 3 4 5 6 7 8 Note 1 9 10 11 12 13 14 15 16 Note 1 17 18 19 20 21 22 23 24
Note 2
SDATI READ A6 A5 A4 A3 A2 A1 A0
SDATO D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
A. Any amount of time may pass between bits, as long as SCS stays active high. This allows 8-bit writes to be used.
B. Any additional clock edges encountered after the 24th edge are ignored.
Figure 24. SDF Timing Diagram 2

DRV8308
Programming (continued)
7.5.3 Programming the OTP Configuration Memory
To permanently program the non-volatile OTP memory, first write all the data into the registers as described
previously, and then follow this sequence:
Table 6. Programming the OTP Configuration Memory

ADDRESS DATA ACTION
-- -- device ENABLE must be
active
0x2D 0x1213 write
0x2D 0x1415 write
0x2D 0x1617 write
0x2D 0x1819 write
0x39 0x0002 write
-- -- wait 10 ms minimum
0x2D 0EDD write
The internal OTP memory can only be programmed once. After programming, the registers can still be
overwritten by accesses through the SPI port, or by using an external EEPROM.
7.6 Register Map

7.6.1 Control Registers
The DRV8308 device uses internal registers to set operation parameters, including the characteristics of the
speed control loop, commutation settings, gate drive current, and so forth. The registers are programmed
through a serial SPI communications interface. In addition, the registers can be permanently programmed into
non-volatile OTP memory, or loaded from an external serial EEPROM device.
Table 7 is the register map for the device.

DRV8308
Table 7. Control Register Map

Address Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0x00 AG_SETPT ENPOL DIRPOL BRKPOL SYNRECT PWMF SPDMODE FGSEL BRKMOD RETRY
0x01 RSVD ADVANCE
0x02 SPDREVS MINSPD
0x03 BASIC SPEEDTH MOD120
0x04 RSVD HALLRST DELAY AUTOADV AUTOGAIN ENSINE TDRIVE DTIME IDRIVE
0x05 RSVD INTCLK SPDGAIN
0x06 HALLPOL RSVD BYPFILT FILK1
0x07 RSVD FILK2
0x08 RSVD BYPCOMP COMK1
0x09 AA_SETPT COMK2
0x0A OCPDEG OCPTH OVTH VREG_EN LOOPGAIN
0x0B RSVD SPEED
0x2A RSVD VMOV CPFAIL UVLO OTS CPOC OCP

DRV8308
At power-up, when VM rises above the VM reset threshold, or whenever RESET is toggled, the register contents
are loaded from the OTP memory or EEPROM (depending on SMODE). For details on external EEPROM
connections, see External EEPROM Mode. If the OTP has not been programmed and the DRV8308 device is
powered-up with SMODE low, the default register values are all 0, except for the FAULT register, which defaults
to 0x18. FAULT bits can be cleared by writing 0.
At any time, the register contents may be written or overwritten through the SPI interface.
For detailed descriptions for each register, refer to the prior sections.
Table 8. Register Descriptions

ADDRESS BIT NAME DESCRIPTION TYPE (1)
Autogain Setpoint
0000 = 3 Hz 0100 = 48 Hz 1000 = 763 Hz 1100 = 12 kHz
15:12 AG_SETPT 0001 = 6 Hz 0101 = 95 Hz 1001 = 1.5 kHz 1101 = 24 kHz RW
0010 = 12 Hz 0110 = 191 Hz 1010 = 3 kHz 1110 = 49 kHz
0011 = 24 Hz 0111 = 382 Hz 1011 = 6 kHz 1111 = 98 kHz
ENABLE pin polarity
11 ENPOL 0 = Device is active when ENABLE is high RW
1 = Device is active when ENABLE is low
DIR pin polarity
10 DIRPOL 0 = Normal DIR pin behavior RW
1 = Inversed DIR pin behavior
BRAKE pin polarity
9 BRKPOL 0 = Brake when BRAKE is high RW
1 = Brake when BRAKE is low
Synchronous rectification
8 SYNRECT 0 = Disabled RW
1 = Enabled
The PWM frequency used on the external FETs
0x00 00 = 25 kHz
7:6 PWMF 01 = 50 kHz RW
10 = 100 kHz
11 = 200 kHz
Speed control mode
00 = Clock Frequency Mode
5:4 SPDMODE 01 = Clock PWM Mode RW
10 = Internal Register PWM Mode
11 = Reserved
FG select
00 = Use HALL_U to generate FG
3:2 FGSEL 01 = Use XOR of all three Hall sensors RW
10 = Use FG amplifier input
11 = Use TACH input signal
Motor brake mode
1 BRKMOD 0 = Coast when ENABLE is inactive (outputs 3-state) RW
1 = Brake when ENABLE is inactive (all low-side FETs on)
Retry mode
0 RETRY 0 = Latch off in case of fault RW
1 = Automatic retry in case of fault
15:8 RSVD Reserved –
0x01
7:0 ADVANCE Commutation timing advance versus Hall signals; each count is 1 / 960 the Hall_U period RW
After the MINSPD and SPEEDTH criteria are met, SPDREVS adds a minimum number of
15:8 SPDREVS RW
0x02 Hall_U periods that must occur for LOCK to be set
7:0 MINSPD Sets the minimum Hall_U period that LOCK can be set; each count is 2.56 ms RW
(1) R = Read Only; RW = Read or Write. Fault registers can only be written 0.

DRV8308
Table 8. Register Descriptions (continued)

Basic operation
15 BASIC 0 = Normal device operation RW
1 = Disables ADVANCE functionality and forces 3-Hall 120° commutation
Speed change tolerance for LOCK
0x03
14:12 SPEEDTH 000 = 1/512 rev (0.20%) 011 = 1/64 rev (1.56%) 110 = 1/8 rev (12.5%) RW
001 = 1/256 rev (0.39%) 100 = 1/32 rev (3.13%) 111 = 1/4 rev (25%)
010 = 1/128 rev (0.78%) 101 = 1/16 rev (6.25%)
11:0 MOD120 Scales the input duty cycle in PWM modes RW
15:14 RSVD Reserved RW
Sets the frequency to reset the Hall commutation counter
00 = Every Hall_U cycle
13:12 HALLRST 01 = Every 2nd Hall_U cycle RW
10 = Every 4th Hall_U cycle
11 = Every 8th Hall_U cycle
Controls whether ADVANCE leads or lags Hall signals
11 DELAY 0 = Commutate before Hall signals arrive RW
1 = Commutate after Hall signals arrive
Enables automatic advance compensation
10 AUTOADV 0 = Disabled RW
1 = Enabled
Enables automatic gain compensation
9 AUTOGAIN 0 = Disabled RW
1 = Enabled
0x04
Enables 180° sine wave current drive
8 ENSINE 0 = Disabled RW
1 = Enabled
Predriver high-current drive time
00 = 1 µs
7:6 TDRIVE 01 = 5 µs RW
10 = 10 µs
11 = 15 µs
Additional dead time added between high-side and low-side driving (typical)
5:3 DTIME 000 = 60 ns 011 = 500 ns 110 = 1.24 µs RW
001 = 120 ns 100 = 740 ns 111 = 1.5 µs
010 = 240 ns 101 = 1.0 µs
Predriver output peak current
2:0 IDRIVE 000 = 10 mA 011 = 50 mA 110 = 110 mA RW
001 = 20 mA 100 = 90 mA 111 = 130 mA
010 = 30 mA 101 = 100 mA
15 RSVD Reserved –
Integrator clock frequency
0x05 14:12 INTCLK 000 = 50 MHz 011 = 6.3 MHz 110 = 0.8 MHz RW
001 = 25 MHz 100 = 3.1 MHz 111 = 0.4 MHz
010 = 12.5 MHz 101 = 1.6 MHz
11:0 SPDGAIN Speed compensator gain RW
Hall polarity
15 HALLPOL 0 = Hall signal logic levels are directly used RW
1 = Hall signal logic levels are inverted
0x06
Bypass the filter that FILK1 and FILK2 configure
12 BYPFILT 0 = Filter is enabled RW
1 = Filter is disabled (FILK1 and FILK2 are ignored)
11:0 FILK1 Filter coefficient that sets the pole frequency RW

DRV8308
Table 8. Register Descriptions (continued)

0x07
11:0 FILK2 Filter coefficient that sets the zero frequency RW
Bypass the compensator (COMPK1 and COMPK2 are ignored)
0x08 12 BYPCOMP 0 = Filter is enabled RW
1 = Filter is disabled (FILK1 and FILK2 are ignored)
11:0 COMPK1 Compensator coefficient that sets the pole frequency RW
Autoadvance setpoint
0000 = 3 Hz 0100 = 48 Hz 1000 = 763 Hz 1100 = 12 kHz
15:12 AA_SETPT 0001 = 6 Hz 0101 = 95 Hz 1001 = 1.5 kHz 1101 = 24 kHz RW
0x09
0010 = 12 Hz 0110 = 191 Hz 1010 = 3 kHz 1110 = 49 kHz
0011 = 24 Hz 0111 = 382 Hz 1011 = 6 kHz 1111 = 98 kHz
11:0 COMPK2 Compensator coefficient that sets the zero frequency RW
Overcurrent protection deglitch time to ignore voltage spikes. Controls tOCP and tBLANK.
00: tocp = 1.6µs, tBLANK = 2µs
15:14 OCPDEG 01: tocp = 2.3µs, tBLANK = 3µs RW
10: tocp = 3µs, tBLANK = 3.75µs
11: tocp = 5µs, tBLANK = 6µs
Protection threshold for VFETOCP
00 = 250 mV
13:12 OCPTH 01 = 500 mV RW
10 = 750 mV
0x0A
11 = 1000 mV
Protection threshold for VOVLO
11 OVTH 0 = 34.5 V RW
1 = 28 V
Writing this bit over SPI requires ENABLE to be active.
10 VREG_EN 0 = VREG is enabled only when ENABLE is active RW
1 = VREG is always enabled
9:0 LOOPGAIN Sets the overall gain for the speed control loop RW
0x0B In the Internal Register PWM Mode, SPEED divided by 4095 sets the input duty cycle. In
11:0 SPEED Clock Frequency Mode, SPEED sets the open-loop gain during spin-up before LOCKn goes RW
Low.
6 RSVD Reserved RW
Fault: VM overvoltage
5 VMOV 0 = Normal RW
1 = Fault detected
Fault: charge pump undervoltage
4 CPFAIL 0 = Normal RW
1 = Fault detected (default on power up)
Fault: VM undervoltage
3 UVLO 0 = Normal RW
0x2A
1 = Fault detected (default on power up)
Fault: overtemperature shutdown
2 OTS 0 = Normal RW
1 = Fault detected
Fault: charge pump overcurrent
1 CPOC 0 = Normal RW
1 = Fault detected
Fault: motor OCP
0 OCP 0 = Normal RW
1 = Fault detected

DRV8308
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information

8.1.1 Internal Speed Control Loop Constraints
The DRV8308 device is a versatile speed controller and driver for small, 3-phase brushless motors. However,
there are some limitations to its application.
The built-in speed control loop is designed to work optimally with motor electrical speeds from about 50 Hz up to
6.7 kHz. For an 8-pole motor, this translates into about 500 RPM up to more than 100000 RPM. For motors with
higher pole counts, these speeds scale down; for lower pole counts, they scale up.
Operation is possible at slower or faster speeds, but speed control becomes less effective, especially if using the
Hall sensors for speed feedback (as opposed to the FG input).
Typically, the speed loop is optimized (by setting the filter coefficients and gains) at one desired motor speed.
Operation is possible with one set of parameters over a limited speed range (for example, 1000 RPM to 2000
RPM), However, operation over a very wide speed range requires different parameters. The use of the auto gain
and auto advance features can extend the dynamic range up to 4×.
When using the SPI interface to program the registers, the parameters can be updated at any time, even while
the motor is running. In this manner, a wider range of speeds can be accommodated by the speed loop.
When not using the internal speed loop (when controlling the motor using PWM input or register speed control),
the limits imposed by the speed loop do not apply. An external speed control implementation (using a
microcontroller, FPGA, or other logic) can essentially control the motor current directly.
However, if using sine commutation, there are limits to the minimum and maximum speed, which are dictated by
the timers that are used to generate the commutation sequence. The commutation timer is a 25-bit timer clocked
at 50 MHz; therefore, the longest time it can capture is 655 ms. This limits the slowest speed to about 1.5 Hz (or
23 RPM for an 8-pole motor). At the other extreme, there are 960 steps in each sine commutation cycle. To
ensure that there is enough time for the steps, the maximum speed is that which generates 960 counts at 50
MHz, or 52 kHz. This corresponds to a maximum speed of 800000 RPM for an 8-pole motor.
When not using the internal speed loop and using 120° commutation (using all three Hall sensors), there are no
speed limitations. Commutation is performed with combinational logic.
8.1.2 Hall Sensor Configurations and Connections

The Hall sensor inputs on the DRV8308 device are capable of interfacing with a variety of Hall sensors.
Typically, a Hall element is used, which outputs a differential signal on the order of 100 mV. To use this type of
sensor, the VREG5 regulator can be used to power the Hall sensor. Connections are as shown in Figure 25:

DRV8308
Application Information (continued)
VREG
INP
OUTN Hall OUTP xHP

Sensor +
Optional Hall
INN xHN Amp
-
Figure 25. Hall Sensor Connections
Since the amplitude of the Hall sensor output signal is very low, often capacitors are placed across the Hall
inputs to help reject noise coupled from the motor PWM. Typically capacitors from 1 to 100 nF are used.
Some motors use digital Hall sensors with open-drain outputs. These sensors can also be used with the
DRV8308 device, with the addition of a few resistors:
All Resistors 1 to 4.7 k

VREG
VCC
Hall OUT xHP

Sensor +
Hall
GND xHN Amp
-
To Other
xHN Inputs
Figure 26. Hall Resistors
The negative (xHN) inputs are biased to 2.5 V by a pair of resistors between VREG and ground. For open-
collector Hall sensors, an additional pullup resistor to VREG is needed on the positive (xHP) input. Again, the
VREG output can usually be used to supply power to the Hall sensors.
8.1.3 FG Amplifier Configurations and Connections

To improve speed control by providing a higher bandwidth speed feedback, often a magnetic pickup coil,
commonly referred to as an FG generator, is used. This is typically implemented as a serpentine PCB trace on
the motor PCB. This generates a low-level sine wave signal whose amplitude and frequency is proportional to
the speed of the motor.

DRV8308
Application Information (continued)

Since the FG trace is in close proximity to the motor coils, it is very susceptible to noise coupling from the PWM
of the motor. Noise coupling into the FG circuit causes poor speed regulation, especially at low motor speeds.
Startup is a particularly difficult situation, as the motor current is at a maximum, and the FG signal amplitude is
low (in fact, 0 at the moment of startup). If noise couples into FG during startup, the speed loop interprets the
noise as fast motor rotation, and lowers the PWM duty cycle. The result is slow startup of the motor. If this
problem is suspected, looking at the FGOUT signal with an oscilloscope during startup should reveal it.
To address this, in addition to the resistors that set the gain of the FG amplifier (R1 and R2 in Figure 27), usually
passive filter components are needed on the FG amplifier circuit.
MR
Pickup FGIN+
C2 C4
FGIN±/ TACH
C1 R1
R2
FGFB
C3
Figure 27. FG Amplifier Circuit
Ideally, the user desires a large amount of rejection of the PWM frequency. However, the user needs to pass the
frequency that corresponds to their fastest motor speed. As an example, a motor may put out 36 FG pulses per
revolution. At 5000 RPM, this is a 3-kHz signal. If you operate the PWM at 25 kHz, you can set a single pole at 3
kHz and have significant rejection of the PWM frequency, and the higher harmonics of the PWM (which are
typically more easily coupled) are rejected even more.
Because the amplitude of the FG signal also increases with higher motor speed, it is possible to set this pole at a
much lower frequency than the maximum speed dictates. The optimal values need to be determined by testing
on the actual motor.
This pole is set by C3 in Figure 27.
In addition to rejection of high frequency, the FG winding should be AC-coupled to the amplifier to prevent any
issues with DC offsets. This capacitor (C1) must be large enough to allow the motor to start-up reliably, since the
FG frequency and amplitude are very low at startup. Typically capacitors on the order of 100 nF to 1 µF are used
here. The voltage is low, so a 6.3-V ceramic capacitor can be used.
Occasionally an additional small capacitor is used across the FG trace. This capacitor (C2 above) may not be
needed, but it can help reject very high-frequency harmonics of the PWM (glitches). Capacitors between 330 and
2200 pF are typically used.

DRV8308
8.2 Typical Application
VM
VM
BLDC
VM
0.03Ÿ
WLSG
WHSG
VLSG
VHSG
ULSG
UHSG
ISEN
180Ÿ
H1 UHP CP1
0.1µF 0.1µF
UHN CP2
H2 VHP VCP VM
0.1µF 1µF
VHN VM + + 24V
0.1µF 470µF ±
H3 WHP GND
0.1µF DRV8308 1µF
WHN VINT 0.1µF
1.3NŸ
820NŸ
VSW VREG
FGFB RESET
100pF
0.1µF 2NŸ
FGINN_TACH ENABLE
1nF
FGINP DIR
SDATAO
FAULTn
SMODE
SDATAI
4.7µF
FGOUT
BRAKE
LOCKn
CLKIN
SCLK
PPAD
SCS
FG Controller
trace
PU
PU
PU
PU
Figure 28. Typical Application

DRV8308
Typical Application (continued)

8.2.1 Design Requirements
This section describes design considerations.
DESIGN PARAMETER REFERENCE EXAMPLE VALUE

Motor voltage VM 24V
Motor current (peak and RMS) IM 10A peak, 3A RMS
Speed command method speed Closed-loop at 3000 RPM
Required flutter (speed jitter) flutter < 0.2%
Configuration method config Use OTP
Hall element current IHALL 7mA
Power FET switching time tFET 500ns
8.2.2 Detailed Design Procedure
8.2.2.1 Motor voltage

BLDC motors are typically rated for a certain voltage. Higher voltages generally have the advantage of causing
current to change faster through the inductive windings, which allows for higher RPMs. And for a given required
power delivery (torque * speed), higher voltage allows for lower current.
8.2.2.2 Motor Current (Peak and RMS)

It is important to understand and control motor current. This affects power FET device selection, the amount of
required bulk capacitance, and the sizing of the sense resistor for the DRV8308 current-limiter feature.
With BLDC motors, increasing the load torque increases current. For a fixed load, the current during motor spin-
up is the highest. It is generally a good idea to limit spin-up current by sizing sense resistors appropriately,
because if it’s not limited, a motor can consume many amperes during startup and cause VM to droop unless a
large amount of bulk capacitance is used. Limiting current reduces the bulk capacitance required.
The DRV8308 VLIMITER trips at 0.25V. If the sense resistance is 0.025Ω for example, 10A will be required to raise
the ISEN voltage above 0.25V. When this happens, the DRV8308 drives the external FETs with a shorter duty
cycle to limit current below 10A.
When selecting the power FET device, key parameters to consider are:
• It must be N-channel type, and 6 are needed.
• The max drain current (ID); pulsed and continuous.
• Max VDS must be greater than VM.
• Max VGS must be at least 12V (the DRV8308 drives approximately 10V).
• RDS(ON) – lower values decrease device temperature.
8.2.2.3 Speed Command Method

The DRV8308 can drive BLDCs using an open-loop 0% to 100% command, or using closed-loop speed control.
When using closed-loop, the correct reference clock frequency (on CLKIN) must be calculated.
If DRV8308 register FGSEL is set to 00b to use Hall U to sense motor speed,
fCLKIN = RPM / 60 * (NPOLES / 2) (5)
NPOLES is the number of permanent magnet poles.
If DRV8308 register FGSEL is set to 10b to use FG to sense motor speed,
fCLKIN = RPM / 60 * NFG (6)
NFG is the number of FG cycles per motor revolution.

DRV8308
8.2.2.4 Required Flutter (Speed Jitter)

Flutter is a measure of motor speed consistency. The best possible flutter largely depends on motor
characteristics, loading, and tuning of the DRV8308 registers. BLDC motors with high detent torque and discrete
positions will have higher flutter. The DRV8308EVM User's Guide SLVUA41 describes the important registers
and a tuning process.
8.2.2.5 Configuration Method

The DRV8308 must have its registers set in order to function. There are 3 methods:
1. Pre-program an external EEPROM, and set pin SMODE High.
2. Set pin SMODE Low, and write register data over SPI while the DRV8308 is powered.
3. Set pin SMODE Low, write register data over SPI while the DRV8308 is powered, and burn it to the internal
EPROM (OTP). Then on future power ups, the DRV8308 will load the custom configuration data.
If the DRV8308 will be used in an open-loop PWM mode, the following register settings provide good baseline
settings:
ADDRESS VALUE
0x00 0x0911
0x01 0x0000
0x02 0x04FF
0x03 0x6800
0x04 0x40D2
0x05 0x0000
0x06 0x0000
0x07 0x0000
0x08 0x0000
0x09 0x0000
0x0A 0xF000
0x0B 0x0000
8.2.2.6 Hall Element Current

Hall elements output a differential voltage that is proportional to the amount of bias current. An absolute max
current is specified, as well as the element resistance over temperature.
The DRV8308 regulated outputs VREG or VSW can be used to supply Hall element current, along with a series
resistor to limit element current. Its sizing depends on the element equivalent resistance (they can be arranged in
parallel or serial), and the VM voltage if VSW is used.
8.2.2.7 Power FET Switching Time

The switching time on the external FETs is the VGS rise time, and it can be easily controlled with DRV8308
register IDRIVE. The 10mA setting causes a switching time that is 5 times the 50mA setting. Larger FETs that
have higher current capabilities have a larger gate charge (Qg), and require higher IDRIVE settings for
reasonable switching times.
However, fast switching times can cause extra voltage noise on VM and GND. This can be especially due to a
relatively slow reverse-recovery time of the low-side body diode, where it conducts reverse-bias momentarily,
being similar to shoot-through. To minimize noise, lower IDRIVE settings are often beneficial, and the 10mA
setting has worked well with many types of FETs operating below 5A.

DRV8308
8.2.3 Application Curves
Figure 29. Closed-loop Efficiency vs Torque Figure 30. Closed-loop RPM and Current vs Torque
Figure 31. Open-loop Efficiency vs Torque Figure 32. Open-loop RPM and Current vs Torque
Figure 33. Open-loop RPM vs Voltage Figure 34. Phase Current with 120 Degrees Mode

DRV8308
Figure 35. Phase Current with Sine Mode Figure 36. Startup
Figure 37. Vgs with IDRIVE = 10mA Figure 38. Vgs with IDRIVE = 20mA

DRV8308
8.3 Do's and Don'ts

8.3.1 RESET and ENABLE Considerations
Since the ENABLE function doubles as a sleep (low-power shutdown) function, there are some important
considerations when asserting and deasserting ENABLE and RESET.
While the motor driver is enabled, the deassertion of ENABLE initiates a stop-and-power-down sequence. This
sequence starts by disabling the motor (either braking or coasting depending on the BRKMOD bit), and waiting
for rotation to stop. After rotation is stopped for 1 s (as determined by the absence of transitions on FGOUT), the
internal circuitry is powered-down, the V5 regulator and power switch are disabled, and internal clocks are
stopped.
In this low-power sleep state, the serial interface may still be used to read or write registers. All other logic is
disabled.
After this stop-and-power-down sequence has been initiated (by deasserting the ENABLE pin for at least 1.2 µs,
or by changing the state of the ENPOL bit), the sequence continues to completion, regardless of the state of
ENABLE. If ENABLE is immediately returned to the active state, the motor slows and stops for 1 s, at which point
it starts again.
If RESET is asserted during power-down (at any time after the deassertion of ENABLE is recognized), it is acted
upon when ENABLE is again asserted, and the part powers-up.
If RESET is asserted when ENABLE is active, the motor is stopped similar to the sequence when ENABLE is
deasserted. After it is stopped for 1 s, all internal registers are reloaded with the value contained in OTP memory,
faults are cleared, and internal states (that is, the speed loop datapath) are initialized. The motor remains
disabled until RESET is deasserted.
RESET and ENABLE may be connected together (if the ENPOL bit in OTP memory is programmed so that
ENABLE is active low). When both signals are low, the motor is enabled; when both signals are high, the motor
is disabled. As soon as the signals are returned to high, all registers are reloaded from OTP memory, faults are
cleared, and the motor starts.

DRV8308
9 Power Supply Recommendations

The DRV8308 device is designed to operate from an input voltage supply range between 8.5 and 32 V. This
supply should be well regulated. A minimum bulk capacitance of 47-µF should be used to stabilize the motor
voltage.
10 Layout
10.1 Layout Guidelines

For VM, place a 0.1-µF bypass capacitor close to the device. Take care to minimize the loop formed by the
bypass capacitor connection from VM to GND. Refer to the DRV8308EVM evaluation board for good layout
practices.
10.2 Layout Example
+
WHSG
Power FETs
WLSG
UHSG
VHSG
ULSG
VLSG
ISEN
W
U
V
UHP CP1
UHN CP2
VHP VCP
VHN VM
WHP GND
WHN VINT
VSW VREG
FGFB RESET
FGINN ENABLE
FGINP DIR
SDATAO
FAULTn
SDATAI
SMODE
BRAKE
FGOUT
LOCKn
CLKIN
SCLK
SCS
Figure 39. Layout Example

DRV8308
11 Device and Documentation Support
11.1 Documentation Support

11.1.1 Related Documentation
For related documentation see the following:
• Texas Instruments, DRV8308 User’s Guide
• Texas Instruments, Hardware Design Considerations for an Efficient Vacuum Cleaner Using a BLDC Motor
application report
• Texas Instruments, Understanding IDRIVE and TDRIVE in TI Motor Gate Drivers application report
11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
DRV8308RHAR ACTIVE VQFN RHA 40 2500 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 DRV8308
DRV8308RHAT ACTIVE VQFN RHA 40 250 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 DRV8308
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DRV8308RHAR VQFN RHA 40 2500 330.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2
DRV8308RHAT VQFN RHA 40 250 180.0 16.4 6.3 6.3 1.1 12.0 16.0 Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Aug-2017
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DRV8308RHAR VQFN RHA 40 2500 367.0 367.0 38.0
DRV8308RHAT VQFN RHA 40 250 210.0 185.0 35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RHA 40 VQFN - 1 mm max height
6 x 6, 0.5 mm pitch PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4225870/A
www.ti.com
PACKAGE OUTLINE
RHA0040E SCALE 2.000
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
6.15
B A
5.85
PIN 1 INDEX AREA
6.15
5.85
1.0
0.8
SEATING PLANE
0.05 2X 4.5 0.08 C
0.00
3.52 0.1
SYMM
EXPOSED (0.1) TYP
THERMAL PAD 11 20
10
21
SYMM 41
2X 4.5 2.62 0.1
36X 0.5 30
1
0.30
40X
0.18
PIN 1 ID 40 31
0.1 C A B
0.5 0.05
40X
0.3
4219054/A 04/2020
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RHA0040E VQFN - 1 mm max height
(3.52)
SYMM
SEE SOLDER MASK
40 31 DETAIL
40X (0.6)
40X (0.24) 1
30
36X (0.5)
(2.62)
SYMM 41
(5.8)
(1.06)
( 0.2) TYP
VIA
(R0.05) TYP
10 21
11 20
(0.6) (0.91)
TYP
(5.8)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 15X
0.07 MIN
0.07 MAX ALL AROUND
ALL AROUND
METAL UNDER
METAL EDGE SOLDER MASK
EXPOSED METAL
SOLDER MASK EXPOSED SOLDER MASK
OPENING METAL OPENING
NON SOLDER MASK

DEFINED SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS

4219054/A 04/2020
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RHA0040E VQFN - 1 mm max height
(1.2)
40 31
40X (0.6)
40X (0.24) 1 30
36X (0.5)
41 (0.675)
SYMM
(5.8)
6X (1.15)
(R0.05) TYP
10 21
11 SYMM 20
6X (1)
(5.8)
SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL
SCALE: 15X
EXPOSED PAD 41
75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4219054/A 04/2020
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
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applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
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Copyright © 2021, Texas Instruments Incorporated

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DRV8308 Brushless DC Motor Controller

Changes from Revision A (October 2014) to Revision B Page

Changes from Original (February 2014) to Revision A Page

2 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated

Product Folder Links: DRV8308

5 Pin Configurations and Functions

(1) I = input, O = output, OD = open-drain output, I/O = input/output

Pin Functions (continued)

Product Folder Links: DRV8308

Pin Functions (continued)

Copyright © 2014–2017, Texas Instruments Incorporated Submit Documentation Feedback 5

6.2 Handling Ratings

6.3 Recommended Operating Conditions

6 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated

Product Folder Links: DRV8308

6.4 Thermal Information

Copyright © 2014–2017, Texas Instruments Incorporated Submit Documentation Feedback 7

6.5 Electrical Characteristics

8 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated

Product Folder Links: DRV8308

Electrical Characteristics (continued)

Copyright © 2014–2017, Texas Instruments Incorporated Submit Documentation Feedback 9

6.6 SPI Timing Requirements

(1) SMODE = Low

Figure 1. SPI Timing Requirements

10 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated

Product Folder Links: DRV8308

6.7 Typical Characteristics

Copyright © 2014–2017, Texas Instruments Incorporated Submit Documentation Feedback 11

12 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated

Product Folder Links: DRV8308

7.2 Functional Block Diagram

bulk VSW or VREG

VINT 1.8-V Linear VCP

Voltage Differential Optional

Copyright © 2014–2017, Texas Instruments Incorporated Submit Documentation Feedback 13

7.3 Feature Description

Figure 4. Hall Amplifier Hysteresis

7.3.2 FG Amplifier, Comparator, and FG Output

14 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated

Product Folder Links: DRV8308

Feature Description (continued)

FGSEL (to speed control)

Figure 5. FG Circuit Diagram

Copyright © 2014–2017, Texas Instruments Incorporated Submit Documentation Feedback 15

Feature Description (continued)

FGOUT when FGSEL=0

7.3.3 Enable, Reset, and Clock Generation

16 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated

Product Folder Links: DRV8308

Feature Description (continued)

Table 1. Direction Behavior

7.3.4.1 120° 3-Hall Commutation

Table 2. Standard 120° Commutation (1)

Standard 120° Commutation (DIR = 1)

Phase U LS (1) (1)