Cmos Schmitt Trigger With Current-Controlled Hysteresis: Damian Imbrea
Cmos Schmitt Trigger With Current-Controlled Hysteresis: Damian Imbrea
Publicat de
Universitatea Tehnică „Gheorghe Asachi” din Iaşi
Tomul LXI (LXV), Fasc. 2, 2015
Secţia
ELECTROTEHNICĂ. ENERGETICĂ. ELECTRONICĂ
DAMIAN IMBREA*
1. Introduction
Several configurations of Schmitt trigger circuits have been proposed.
Some of them are shown in Fig. 1; all these schematics include enhancement-
mode transistors only. The threshold voltages VtL and VtH specific to a Schmitt
trigger, also called Low and High switching thresholds, are dependent on the
process variations, supply voltage and temperature. The frequency of the input
signal Vin also affects VtL and VtH due to the intrinsic parasitic capacitors (not
represented in Fig. 1).
Explanations and switching threshold calculations relating to the
circuits in Fig. 1 a, b, c can be found in (Dokic, 2012). It can be seen that the
*
Corresponding author: e-mail: dimbrea@etti.tuiasi.ro
62 Damian Imbrea
2. Circuit Description
The schematic of the proposed Schmitt trigger, shown in Fig. 2, contains
the inverters N1–P1, N2–P2 and the current sources P5 and P3. The second
inverter N2–P2 is supplied directly from VDD while the first inverter N1–P1 is
supplied from the current sources P5 and P3. Except for P4 and P5 which have
long channels, all other transistors have short channels (i.e., minimum or close
to the minimum length, specific to core devices), in order to achieve an
operating speed as high as possible. The intrinsic capacitors C1, C2 do influence
the switching thresholds at high frequencies; C1 and C2 are mainly gate
capacitors and can be approximated by the relations
C1 C gN2 C gP2 ,C2 C gP3 C Inv (1)
At low values (close to VSS) of the input voltage Vin the transistor N1 is
off (I1 = 0); all this time the transistors P1, P3, P5 are working in the triode region
at zero drain current and the voltages V1, V3 are close to VDD. Increasing Vin will
determine N1 to enter the active (or saturation) region, while P1, P3 and P5
Bul. Inst. Polit. Iaşi, t. LXI (LXV), f. 2, 2015 65
remain in the triode region. When Vin reaches the high threshold VtH, the
transistors P1, P3 and P5 enter the active region. At this moment the current
through P5 is equal to Ib, V1 falls approximately to 0.5 V and N1 is still active;
also, V2 reaches about 0.15 V and V3 drops to about 0.8 V.
From Fig. 2 (at low frequencies) it follows that
I1 I b I 3 . (2)
For both transistors N1 and P3, working in strong inversion, we can
evaluate the drain currents by using the square law
1 W
I D Cox (| VGS | | Vth 0 |) 2 (1 | VDS |) , (3)
2 L
where µ, Cox, W/L, Vth0 and λ are, respectively, the mobility of charge carriers,
the gate-oxide capacitor per unit area, the channel width/length ratio, the
threshold voltage with VBS = 0 V (body-source voltage) and the channel-length
modulation coefficient.
By combining (2) and (3) we get successively
1 W
n Coxn 1 (VtH Vthn0 ) 2 (1 1 0.5VDD )
2 L1
, (4)
1 W
I b p Coxp 3 (0.85VDD Vthp0 ) 2 (1 3 0.2VDD ),
2 L3
1 W
I b p Coxp 3 (0.85VDD Vthp0 ) 2 (1 3 0.2VDD )
2 L3
VtH Vthn0 . (5)
1 W
n Coxn 1 (1 1 0.5VDD )
2 L1
After Vin exceeds the threshold VtH, the following will happen: P 3 turns
off, N1 enters the triode region and P 5 remains active (I1 = Ib). Further, while Vin
increases to VDD, P5 enters the triode region and then it turns off.
Decreasing Vin from VDD to VSS will determine V3 to decrease almost
linearly, P5 to go successively in the triode and then in the active regions, and
N1 to enter the triode region; until Vin reaches the low threshold VtL, P3 remains
off. When Vin equals VtL, the transistor N1 becomes active (V1 ≈ 0.4 V) and the
voltage V2 falls down to VSS; this would result in a large current through P3 and
therefore, N1 is forced to return quickly back to the triode region. After Vin falls
below the threshold VtL, P3 enters the triode region.
The relation I1 = Ib underlies the low threshold calculation. This time N 1
may operate in the moderate inversion or subthreshold region, depending on the
value of Ib, so the EKV model (Enz et al., 1995) should be used instead of (3).
For NMOS transistors with VBS = 0 V and VDS > 4VT, the model takes the form
66 Damian Imbrea
W 2 2 V Vthn0 Cdep
I D 2n n Coxn VT ln (1 exp GS ),n 1 , (6)
L 2nVT Coxn
where n, Cdep and VT are, respectively, the slope factor, the surface depletion
capacitance and the thermal voltage. The slope factor n is technology-
dependent, taking values in the range [1.1, 1.8], and it decreases slightly with
increasing the difference VGS – Vthn0 (also called pinch-off voltage).
The low threshold is given by
I b L1
VtL Vthn0 2nVT ln exp 1 . (7)
VT 2n n CoxnW1
By taking the difference between (5) and (7) we obtain the hysteresis
value:
W3
2 I b p Coxp (0.85VDD Vthp0 )2 (1 3 0.2VDD )
L3
VtH VtL
W
n Coxn 1 (1 1 0.5VDD ) (8)
L1
I b L1
2nVT ln exp 1 .
VT 2n n CoxnW1
The bias current Ib has a greater influence on the low threshold; the high
threshold changes very little. Both switching thresholds and the hysteresis
depend on the process variations, supply voltage and temperature.
At high frequencies the following equation should be used instead of (2)
I1 I b I 3 I C1 , (9)
where IC1 is the discharge current of capacitor C1; the high threshold VtH will
increase. The low threshold VtL should be calculated by using the relation
I1 I b I C1 . (10)
This time the capacitor C1 has to be charged by a current derived from
the bias current Ib and thus, VtL will decrease.
The capacitor C2 determines a slight increase of VtH through the current
I3.
3. Simulation Results
threshold is almost insensitive to the bias current and increases with frequency.
The low threshold is sensitive to both bias current and frequency; in accordance
with (7), its dependence on current is not linear. The range of the bias current Ib
must be chosen depending on the input frequency.
The low threshold VtL is more sensitive to the process variations than
the high threshold VtH. From ff corner to sf corner, VtL varies (approximately)
between 150 mV and 400 mV; VtH varies between 700 mV and 600 mV.
The changes in supply voltage (±100 mV) have a slightly higher
influence on the high threshold (about ±50 mV).
Both switching thresholds are weakly dependent on temperature; VtL is
slightly more sensitive and it decreases by less than 50 mV with increasing
temperature from –40 ºC to 125 ºC.
Fig. 9 shows the rise and fall times of the voltage V2, at 1 GHz input
frequency.
The silicon area of the Schmitt trigger in Fig. 2, which includes the load
inverter Inv, is less than 21 µm2; the layout is illustrated in Fig. 11. The mirror
P4-P5 (situated in the upper part) occupies about half of the total area.
Table 1
Comparisons
This work Yuan 2010
Process 65 nm CMOS std. 0.18 µm CMOS std.
Supply voltage [0.9, 1.1] V
1.8 V nominal
1 V nominal
Supply current 50 µA (rms)@1GHz
2.61 mA
consumption 200 µA (peak)@1GHz
PVT simulations shown not shown
Temperature range [-40, +125] ºC not shown
Max. input frequency 5 GHz not shown
Controlled thresholds low threshold both thresholds
(at low frequency) 0 < VtL < 0.54 V 0.95 V < VtL, VtH < 1.35 V
Max. hysteresis
0.54 V 0.23 V
(at low frequency)
Rise time 35 ps@1GHz
not shown
Fall time 61 ps@1GHz
Silicon area < 21 µm2 not shown
5. Conclusions
The new Schmitt trigger described in this work contains only 7 MOS
transistors of type 1.0V standard-Vt. The circuit is designed in 65 nm CMOS
standard process but can be implemented in any other technology. The silicon
area is about 21 µm2; also, the power consumption is quite small.
The circuit schematic consists of two inverters and two current sources;
one of the current sources is controlled by an external bias current that serves to
adjust the low switching threshold and also the hysteresis.
Simulations show that both switching thresholds are weakly dependent
on temperature. The process variations and supply voltage have greater
influences; their compensation up to a certain degree can be made through the
external bias current.
The circuit can be used in digital and analog applications up to 5 GHz
frequency.
72 Damian Imbrea
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