EEPaper I

UNIT 1
Resistors
Learning Objectives
After completing this unit, the student will be able to understand
• The meaning of resistance, its units and their types.
• The constructional details of various types of resistors.
• Colour coding of the resistors.
• Total resistance of two or more resistors connected in
a) series and b) parallel.
• Difference between fixed resistors and variable resistors.
• Specifications of resistors.
• Specific resistance and temperature coefficient of resistance.
• Common troubles in resistors.
1.1 Introduction
It is one of the most important component used in electronic circuits.
Resistance has been defined as the opposition to the flow of current. This
opposition comes from the electrons present in the atom of a material. In materials
like copper, the electrons are more free to move about than the electrons in a
material like rubber. In other words, copper has less resistance than rubber.
2 Electronic Engineering Technician
1.2 The Unit of Resistance

The practical unit of resistance is ohm. A conductor is said to have a resistance
of one ohm if it permits one ampere current to flow through it when one volt is
impressed across its terminals. The symbol for ohm is  and resistance is denoted
by the symbol R.
For insulators whose resistances are very high, a much bigger unit is used
i.e., Megaohm = 1u6 ohm or Kilo-ohm = 103 ohm. In the cases of very small
resistances, smaller, units like milli-ohm = 10-3 ohm or micro-ohm = 10-6 ohm
are used.
Fig. 1.1 Circuit Symbol of Resistance
Table 1.1 Multiples and submultiples of ohm

Prefix Its meaning Abbreviation Equal to
Mega One million M 106 
Kilo One thousand K 103 
Milli One thousand M 10-3 
Micro One Millianth M 10-6 
1.3 Types of Resistors

Basically there are two types of resistors. 1. Fixed resistors and 2. Variable
resistors. Resistors whose value can not be changed are called fixed resistors.
Resistors whose value can be changed or varied are known as variable resistors.
1.4 Types of Resistors
They are of two types carbon resistors and wire-wound resistors.
Carbon resistors: These can be either carbon composition resistors or
carbon film resistors.
Paper - I Circuit Theory and Electronic Components 3
(a) Carbon Composition resistors are made by mixing granules of carbon

with a binding material and moulded in the form of rods as shown in fig 1.2. wire
leads are inserted at the two ends and the package is sealed with a non-conducting
coating.
Fig. 1.2 Carbon Resistors
(b) Carbon Film Resistors are types of carbon resistors made by depositing
a carbon film on a ceramic rod. The value of the resistance is set by cutting a
spiral groove through the film. The groove adjusts the length and the width of the
ribbon so that the desired value of the resistor is reached.
Carbon resistors are available in value varying from 1  to 20 M . These
are made by wrapping a known length of wire of a nickel – chrome always
called nichome over a from made of ceramic Advance and manganin wires are
also used for the construction of wire wound resistors. All these materials have
a much higher resistivity than copper. After taking out leads the entire winding is
coated with a protective coating.
(c) Wirewound Resistors
Since the length of the wire required increases with the ohmic value of the
resistance, the range of these resistors is from less than 1  to several thousand
ohms.
Fig. 1.3 Wirewound Resisors

These resistors are used in circuits carrying high current when relatively
high amounts of power are dissipated. Wire wound resistors are used in precision
instruments where stable and accurate resistance values are required. Wire wound
resistor in shown in fig 1.3.
1.5 Variable Resistors
The most common type of variable resistor is known as the potentiometer
or simply POT as shown in the fig 1.4. This is used as volume control in radio
and TV sets. The resistance value can be varied by the rotation of a shaft fixed
at the end. A volume control is generally combined with an On/Off switch for
power supply which can be operated from the common shaft.
The construction of a potentiometer is shown in fig 1.4. In this
potentiometer, a movable contract slides over a strip of carbon. The resistance
between terminals 1 and 3 is fixed and is the maximum value marked on the
body of the potentiometer.
When the movable arm slides from left to right or a clockwise the
resistance between points 1 and 2 increases and that between points 2 and 3
decreases. The variation of resistance is not uniform in the case of carbon
potentiometers.
Fig. 1.4 Potentiometer
For uniform variation of resistance and for precision work, wire wound
potentiometers are used. These have wire wound elements in place of carbon
strips are available in 1,2,3 and 4 volts wire-wound potentiometer is shown in
When continuous variation of the resistance is not required, a tapped
resistance is used. Fixed taps are provided at a number of points an a wire-
would resistance. A sliding contact on a bare wire resistance will vary the
resistance in any of the convenient steps. Table 1.6 shows comparison of wire-
wound and metal film carbon resistors.
Fixed Variable Variable Tapped
Fig. 1.5
The differences between the above three types of Resistors are shown in
the table 1.2
Carbon Resistors Metal Film Resistors Wire wound Resistors
1. These are manufactured 1. These are manufac- 1. These are
using the carbon granuals tured by depositing a manufactured using
mixed with resin, binder film of metal alloys us a Nichrome wires.
and flux. ceramic or glass body.
2. These are available in 2. These are available in 2. These are available
high resistance values low resistance values. in the resistance values
ranging from 1 Ω to 10 from 0.1 to Ω150K.
MΩ.
3. These are available in 3. These are available in 3. These are available
the low power ratings the low power ratings at high power ratings in
ranging from 1/8 watt to 2 ranging from 1/8 to 2 w. the order of kilowatts.
watt.
4. Carbon resisto rs 4. These are also 4. Wire wound resistors
occupy less space in occupy less space in occupy more space in
circuits due to their small circuits due to their small circuits due to their
in size. in size. large size.
5. The value of the resistor 5. The value of the 5. The value of the
is coded using colour code. resistor is coded using resistor is printed on it.
colour code.
6. These are used at high 6. These are also used 6. These are not used
and low frequencies for for noise less operation at high frequencies due
their noise less operation. at high frequency. to noisy operation.
7. These have low current 7. These have low and 7. These have high
carrying ability. medium current carrying current carrying ability.
ability.
1.7 Preset
These Presets are just smaller versions of a variable resistor. They can be
easily placed on a PCB and can be adjustable when needed. The value of
resistance is commonly adjusted with the help of a screw-driver. They are mostly
used in applications like adjusting the frequency of and alarm tone or to adjust
sensitivity of circuits. These are also highly precise presets which have multi-turn
± the resistance will increase/decrease only slowly and hence
options. In this type,
the screw has to be rotated many times. Here also the basic slider and track
mechanism is used. The track mechanism is always linear.
Fig. 1.7
Most of the variable resistors are placed directly on the PCB some are
mounted by drilling hole in the case containing the circuit and is connected to the
terminals with the help of a wire.
In recent years, the size as well as the weight of such devices have been
greatly reduced which makes it more suitable for any field of electronics.
1.8 Color Code for Carbon Resistors
The ohmic value and the tolerance of a carbon resistor is indicated by a
color code. Ten colors are used to represent each of the digits from zero to nine
as indicated below in table 1.4.
Colour Digit Colour Digit

Black 0 Green 5
Brown 1 Blue 6
Red 2 Voilet 7
Orange 4 Grey 8
Yellow $ White 9
In the case of carbon resistors having arial leads, the colour bands are
printed near one edge of the resistor as shown in fig 1.2. Reading from left the
first significant figure the second and the third band indicates the multiplier (X10)
or the number of zeroes to be added after the two significant figures. The tolerance
is indicated by the fourth band or by its absence. A gold band indicates 5%
tolerance, silver band 10% tolerance and no band 20% tolerance.
Examples: What is the value and tolerance of a carbon resistor which has
the following bands starting from the left: Brown, Black, Red, Gold.
Brown, Blank, Red, Gold
1 0 00 ‘“ 5%
Fig. 1.8 Colour code chart for Carbon Resistor
Example : What is the value and tolerance of a carbon resistor which has
the following bands starting from the left : Brown, Black, Red, Gold.
Brown Black Red Gold
1 0 00 ± 5%
Therefore, the resistor value is 1000 ± 5%
1.9 Resistors Under 1 
In their case, the third band is either gold or silver which serves as fractional
multiplier. If the third band is gold, multiply the first two digits by 0.1. If it is
silver, then multiply by 0.01. However, fourth band, as before, gives tolerance.
Example 2: Find the value of the

Carbon resistor with the following colour bands
Red, Black, Gold, Gold
2 0 x 0.1 5% = 2 ± 5%.
1.10 Specifications of a Resistor
The three important specifications of a resistor are i) Resistance value ii)
Tolerance and iii) The power rating or wattage.
(i) Resistance value: This is the value of the resistance expressed in ohms
e.g. 10, 47 or 1M. This resistance value is either written or stamped on
the body of the resistor as in the case of wire wound resistors. In the case of
carbon resistors (film), the value of the resistance is indicated by a colour code.
(ii) Tolerance: This is the variation on the value of the resistance that is
expected from the exact value indicated. 5% tolerance in the case of 100
resistor will mean that its value can vary brain 95 to 105. Wire wound
resistors as they are more exact in value and their tolerances are low.
(iii) Wattage: This is the maximum amount of heat in watts that can be
dissipated by a resistor without damage to it. The physical size of a resistor
gives an idea of its waltage. The larger the size of a resistor, the higher will be its
wattage rating.
Carbon resistors generally have an low wattage of value 1/8, ¼, ½ 1 or
2w. Wire-round resistors are available in higher wattage ratings from 5 w to
several hundred watts.
1.11 Standard Value of Resistors
In practical electronic circuits, the values of the resistors required may lie
within a very wide range. In most of the circuits, it is not necessary to use resistors
of exact values. Even if a resistor in a circuit has a value which differs from the
desired value by as much as 20% the circuit still works quiet satisfactorily.
Therefore, it is not necessary to manufacture resistors of all the possible values.
A list of readily available standard values of resistors appears in table 1.5.
Table 1.5 standard values of commercially available resistors.
Ohm (  ) kilo ohms (k  ) Megohms (M )
1.0 10 100 1.0 10 100 1.0 10

1.2 12 120 1.2 12 120 1.2 12
1.5 15 150 1.5 15 150 1.5 15
1.8 18 180 1.8 18 180 1.8 18
2.2 22 220 2.2 22 220 2.2 22
2.7 27 270 2.7 27 270 2.7
3.3 33 330 3.3 33 330 3.3
3.9 39 390 3.9 39 390 3.9
4.7 47 470 4.7 47 470 4.7
5.6 56 560 5.6 56 560 5.6
6.8 68 680 6.8 68 680 6.8
8.2 82 820 8.2 82 820 8.2
1.12 Uses of Resistors

(a) To establish proper values of circuit voltages due to IR drops
(b) To limit current and
(c) To provide load.
1.13 Resistor Troubles
The most common trouble with resistor is ‘Open’ which happens due to
excessive current and heat. A colour or discoloured resistor should be discarded
straight away though it will usually check good with a Multimeter.
1.14 Measurement of Resistance
Usually an ohmmeter or a multimeter is used to measure the resistance
value of a resistor.
A popular type of resistance measurement involves the voltmeter ammeter
method. Since the instruments required are usually available in most laboratories.
If the voltage V across the resistor and the current I through the resistor are
measured. The unknown resistance R, can be calculated by ohm’s law.
R = V ohms
I
1.15 Resistors in Series
R1 R2 R3
I V1 V2 V3
V
Fig. 1.9 Resistors in series
When some conductors having resistances R1, R2 and R3 etc are joined
end-on-end, they are said to be connected in series.
Being a series circuit, it should be remembered that
(i) Current is the same through all the three conductors.
(ii) But voltage drop across each is different due to its resistance and is
given by ohm’s Law and
(iii) Sum of the three voltage drops is equal to the voltage applied across
the three conductors
V = V1 + V2 + V3
= IR1 + IR2 + IR3
But V = IR
Where R is the equivalent resistance of the combination.
Therefore IR = = IR1 + IR2 + IR3
or R = = R1 + R2 + R3
The main characteristics of a series circuit are
1. Same current passes through all parts of the circuit.
2. Different resistors have their individual voltage drops.
3. Voltage drops are additive.
4. Applied voltage equals the sum of different voltage drops.
5. Resistances are additive.
6. Powers are additive.
1.16 Resistors in Parallel
Fig. 1.10 Resistors in Parallel
Three resistors, as joined in fig. 1.10 are said to be connected in parallel.

In a parallel circuit
(i) P.D. across all resistances will remain same.
(ii) Current in each resistor is different and is given by ohm’s law and
(iii)The total current is the sum of the three separate currents.
I = I1 + I2 +I3
= ___
V + ___ V + ____
V
R1 R2 R3
Now, I = current
V is the applied voltage and
R is the equivalent resistance of the combination.
Since V = ___
V + ___ ___
V +V
R R1 R2 R3
or 1 = ___
1 + ___
1 + ___
1
R R1 R2 R3
The main characteristics of a parallel circuit are
1. Same voltage acts across all parts of the circuit.
2. Different resistors have their individual current.
3. Branch currents are additive.
4. Conductance are additive.
5. Powers are additive.

Example 3: Find the total resistance of the circuit given below.
2.5  3 1.5 
Fig. 1.11
It is clear that the three resistors are connected in series.

R = R1 + R2 + R3 = 2.5 + 3 + 1.5
=7
Example 4: Find the total resistance of the circuit given below
The three resistors are connected in parallel.
2.5 
1 1 1 1 1
___ 1
___ 1
___
= ___ + ___ + ___ = + +
6 R R1 R2 R3 3 6 2
2+1+3 6
2 = = = 1
6 6
1.17 Factors Affecting the resistance of a material

The resistance R offered by a conductor depends on the following factors.
(i) It varies directly as its length L
(ii) It varies inversely as the cross section A of the conductor.
(iii) It depends on the nature of the material.
(iv) It also depends on the temperature of the conductor.
Neglecting the last factor for time being we can say that
R L / A or R = pL/A
Where p is a constant depending on the nature of the material of the
conductor and is known as its specific resistance or resistivity.
In other words, specific resistance of a material may be defined as the
resistance between the opposite faces of a meter cube of the material.
Units = ohm-metre or
ohm-centimetre
1.18 Conductance
Conductance (G) is a reciprocal of resistance.
Units : The unit of conductance is Siemens (S) earlier, this unit was called
mho (  ).
1.19 Effect of Temperature on Resistance
The effect of rise in temperature of metals is large and fairly regular for
normal range of temperature. The temperature or resistance graph is straight
line. Therefore metals have positive temperature co-efficient of resistance.
The increase of resistance of alloys, though in their case, the increase is
relatively small and irregular. For some high resistance alloys like Eureka and
Manganin, the increase in resistance is negligible over a considerable range of
temperature.
The resistance of electrolytes, insulators and semi conductors is practically
negligible hence they are said to posses zero temperature co-efficient of resistance.
Rheostat is a variable resistor with one terminal fixed and the other terminal
connected. Always it is connected to the circuit in the series. It is available in the
form of wire-wound.
Potentioneter is a variable resistor and is used to taps off of voltage in the
circuit. Always it is connected in parallel to the circuit. It has three terminals.
Summary
1. Resistance is defined as the property of opposition to the blow of electric
current.
2. The practical unit of resistance is ohms.
3. Resistors are of two types a) fixed resistors b) variable resistors
4 . Resistors whose value can’t be charged are called fixed resistors. Ex:
carbon resistor and wire wound resistors.
5. Resistors whose value can be charged or varied are called variable
resistors. Ex: potentiometer.
6. Presets are the smaller versions of the variable resistor used for finer
adjustments of a circuit sensitivity, frequency etc.
7. The resistance values are directly printed on their body in the case of
wire resistors whose values are stable and accurate and can carry high
currents with high power dissipation capabilities.
8. In the case of carbon resistors their values indicated by means of colour
code. They are available in the wattage ratings of 1/8,1/4,1/2,1 2 W.
9. The important specifications of a resistors are a) Resistance value b)
Tolerance and c) Wattage.
10. The main use of resistor are a) to provide required voltage drop in a
circuit b) To limit current and c) to provide load in a circuit.
11. The most common trouble with resistor is open due to excess current
or heat.
12. When two or more resistors are connected in series the total resistance
R = R1 + R2 + R3
13. When 2 or more resistors are connected in parallel, the total resistance
is 1 1 1
= +
R R1 R2
14. The resistance of a material depends on a) length b) area of cross
connection c) nature of material d) temperature.
15. Specific resistance of a material may be defined as the resistance between
the opposite faces of a meter cube of the material.
Units=ohm meter of ohm-centimeter.
16. Conductance is the reciprocal of resistance.
17. Metals have PTC, insulators, eletrolytes have NTC and for certain
alloys like eureka, Marganis etc have negligible resistance charge over
a wide range of temperature.
Short Answer Type Questions
1. Define resistance and mention its units.
2. Classify different types of resistors.
3. What are the applications of resistors?
4. What are the specifications of resistors?
5. Define wattage rating of resistors.
6. Define specific resistance and write its unit.

7. Define tolerance of a resistor.
8. 3 and 6 are connected in a) series b) parallel. Calculate total
resistance in both the cases?
9. What factors effects the resistance value of a material?
10. Define conductance and mention its units?
11. What is the difference between rheostat and potentiometer?
12. Find the value of resistor
With the following colours are imprinted on their body
(a) Brown, Black, Brown, Gold
(b) Yellow, Violet, Black, Silver.
(c) Brown, Red ,Red
(d) Grey, White, Brown, Gold
13. Write the colour code for the resistors given below
a) 1  5% c) 270  20 %
b) 8.2 k 10% d) 10  10%
Long Answer Type Questions
1. Derive an expression for the total resistance of three resistors R1,R2,R3
connected in series?
2. Derive the formula for calculations the equivalent resistors of three resistors
R1, R2, R3 are connected in parallel.
3. Explain the constructural details of wire wound resistors.
4. Write short note on colour code of resistors.
5. What is the effect of temperature on resistance.
6. Distinguish between carbon resistors and wire wound resistors?
UNIT 2
Inductors and Transformers
Learning Objectives
1. Faraday’s laws of electromagnetic induction.
2. Lenz’s law
3. Self inductance and mutual inductance.
4. Factors affecting the value of inductance.
5. Constructional details of transformers.
6. Different types of transformer
7. The applications of transformer
8. The specifications of transformer.
2.1 Introduction
In many electronic circuits like frequency tunning circuits,oscillators etc
inductors and transformer forms the basic part of the circuit. In generation and
inducement of AC voltage and current inductors play a vital role. Similarly in
power circuits transformers play a vital role. In this chapteryou will learn about
the basic laws that are used to induce voltages, using electromagnetic induction.
Further regarding self inductance,mutual inductance and contruction of

transformers are given in the subsequent topics.
2.2.1 Electro Magnetic Induction
It is well known that whenever an electric current flows through a conductor
a magnetic field is immediately bought into existence in the space surrounding
the conductor or the converse of this is also the true i.e. when a magnetic field
embracing a conductor moves relative to the conductor it produces a flow of
electrons.This phenomenon where by an emf and current is induced in any
conductor that is cut by a magnetic flux is known as electromagnetic induction..
These are the basic principles which are used in the inducement of voltages
in generators and force in the magnetic circuit. For example in generators if we
can rotate a coil in the magnetic field then voltages or emf will be induced in it.
Thus using electromagnetic induction we can generate voltages in generators.
Similarly whenever an electric current flows through a conductor magnetic
field is immediately brought into existence in the space surrounding the conductor
if such a conductor is placed in a magnetic field then due to interaction of these
two magnetic fields some force or torque will be produced in the coil. Using this
principle devices or gadgets like loudspeakers, fans, motors etc..are working.
Thus using electromagnetic induction principle in two ways. We can
generateAC voltage or force or torque in electric circuits. These are illustrated
in the following fig 2.1
Figure 2.1 Principle of Inducing Voltage and Force

2.2.2 Faraday’s Laws of Electro Magnetic Induction

Faraday summed up the above facts in to the laws known as faradaya law
of electromagnetic induction.
First Law: It states that Whenever a conductor cuts magnetic flux an emf
is induced in thatconductor,(or) whenever the magnetic flux linked with a circuit
changes in emf is always induced in it.
Second Law: It states The magnitude of the induced emf is equal to the
rate of change in the flux linkages.
Explanation: Let a coil has N turns and flux through it changes from an
initial value of p1 wb, to. The final value of p2 wb in time ‘t’ seconds. Then we
know that by flux linkages is meant the product of number of turns by the flux
linked with the coil, we have
Initial flux linkages =NΦ1
Final flux linkages =NΦ2
According to second law induced emf ‘e’ is equal to rate of change of flux
linkages.
NΦ2 - N1
e=
t
Putting the above expression in differential form we get e =d(NΦ)/dt

or e = N dΦ/dt.Volt.
Usually a minus sign is given to the right hand side expression to signify the
fact that the induced emf sets up current in such a direction that magnetic effect
produced by it opposes the very cause producing it.
e =d(NΦ)/dt or e = N dΦ/dt.Volt.
Applications Domestic apparatus like motor, generators, transformers, IK-
s galvanometers, loud speakers, micro phones etc… are operated on the basic
principles of electromagnetic induction.
2.2.3 Lenz’s Law
The direction of induced emf or current may be found by Lenz’s Law. Lenz
law state that the electromagnetically induced current always flow in such a
direction that the action of the magnetic field set up by it tends to oppose the
very cause which produces it.
2.3 Inductance
Inductance is the ability of the conductor to produce induced voltage when
the varying current flows through it or it is the property of the coil by which there
produces a opposite polarity’ voltage is called inductance of the coli. This is
measured using the unit ‘HENRY’. Inductance is represented symbolically as
shown in fig.2.2
Fig. 2.2 Symbol of Inductance
2.3.1 Inductance
The component which gives a definite value of inductance by wounding a
insulated conductor or a coil on a core is known as an inductor.
2.3.2 Classification of Inductance
Inductance can be classified in to two types.
1. Self inductance
2.3.3 Self Inductance
The ability of a conductor to induce voltage in itself when the current or flux
changes in it is called inductance (or) the property of the coil due to which it
opposes any increases or decreases of current or flux through it is known as self
inductance.
Imagine a coil of wire to one shown in below fig 2.3 connected to battery
through Rheostat. It is found that when ever an effort is made to increase current
through it. It is always opposed by the instantaneous production of counter emf
of self induction. Energy required to overcome this opposition is supplied by the
battery. Similarly if now an effort is made to decrease the current then again it is
delayed due to production of self induced emf this time in the opposite direction.
This property of coil due to which it opposes any increase or decrease of current
or flux through it is known as self inductance. It is measured in terms of co-
efficient self induction L. We know by experience that initially it is difficult to set
a heavy body on to motion, but once in motion it is actually difficult to stop it.
Similarly a coil having large induction it is initially difficult to established a current
through it, but once established, it is equally difficult to withdraw it. The co-
efficient of self inductance of a coil is defined as the weber-turns per ampere in

the coil……By definition L=NΦ/1 henry.
Fig. 2.3 Self Inductance
2.4 Factors Affecting the Value of Indutance

The following factors affect the inductance of coil. These are
(1) Number of turns
(2) Area of the coil or thickness of the wire.
(3) Length of the coil
(4) Permeability of the core or quality of the core.
(5) Distance of the turns
1. Number of Turns : The inductance of a coil is directly proportional to
the square of the turns. Thus greater the number of turns of the coil, more the
inductance because more voltage can be induced. Thus in the same area and
length if the number of turns are doubled then the inductance increases four
times.
2. Area of the Coil : If the area of each turn or thickness of the wire is
increased then its inductance increases. This is because the resistance of the thin
wire is large when compared to the thick wire. If the resistance is less then it’s
inductance is more. Thus the inductance of the coil is directly proportional to its
area or thickness.
3. Length of the Coil : Inductance of the coil L increases with more length
for the same number of turns.
4. Permiability of the core inductance of the coil also increases with the
permeability of the core..
5. Distance Between the Turns: Inductance of the coil is inversely

proportional to the distance between the turns. It means that if we increase the
distance between no of turns then the inductance will increases and vice versa.
Thus inductance L = µ0 µrN2 A/L.
2.5 Inductive Reactance
The opposition offered due to AC supply in a conductor is known as it’s
inductive reactance. This is denoted by the letter XL. It depends on the following
factors.
(1) It is directly proportional to the inductance of the coil.
(2) It is directly proportional to the frequency
Mathematically XL = 2 fL. This is measured in ohms.
2.6 Mutual Inductance
The ability of one coil to produce voltage in the near by coil due to flow of
variable current in the first coil is known as mutual inductance. This is represented
by the letter M and is measured in henrys.
Explanation : Let two coils L1 and L2 are placed side by side as shown in
fig 2.4 let some variable current will be allowed to flow through the coil L due to
this variable current magnetic field will be produced around the coil.
N
Secon dary
Primary Current
Current
AC Voltage Load Resis-

Source tance
Primary S Secondary
Fig. 2.4 Mutual Inductance
This magnetic field will be variable and also fraction of this field will flows
through the coil L2 which will be placed beside it. According to faradays law of
electromagnetic induction this variable magnetic field cuts the turns of the coil L2
and hence produces some voltage in the coil L2 . This magnitude of the induced
emf in turns equals to the rate of change of flux linkages. Thus the ability of one
coil to produce voltage in the near by coil is known as mutual inductance. This
principle is used in transformers.
2.7 Coefficient of Coupling
The fraction of the magnetic flux from one coil linking another coil is the co-
efficient of coupling K between the coils.
It can be expressed as
Flux linkage between L1 and L2
K=
Flux produced by L1
Thus if all the flux of L1 links with L2 then the co-efficient of the coupling
K=1. The co-efficient of coupling increases if the coils are closely placed.
Mathematically co-efficient of coupling K is expressed as
M
K=
L1 - L2
2.8.1 Inductance in Series
Series connections are of two types
1. Series aiding
2. Series opposing
2.8.2 Series - Aiding
When two coils be so joined in series that their fluxes (mmf) are additive
i.e. in the same direction then such type of connection is known as ‘inductance
series aiding’. This is shown in the below figure 2.5. Let A and B are two coils
connected in series Aiding (i.e. their fluxes be additive).
Let M = Co=efficient of mutual inductance
L1 =Co-efficient of self inductance of coil A
L2 =Co-efficient of self inductance of coil B
Then self induced emf in A is =e1 -L1 di / dt.
Mutually induced emf in A due to change of current in
B is e2 = -M (di / dt)
Then self induced emf in B is e2 = L2 (di / dt)
Mutually induced emf in b due to change of current in

A is e2 = -M (di / dt).
Total induced emf in the combination= -di / dt -(L) = L2=2M)……..1
If ‘L’ is the equivalent inductance then total induced emf in that single coil
would be -L (di / dt) ............. ( 2 )
Equating 1 and 2 we have L=L1+L2+2M
Thus equation for total inductance in series aiding is L=L1+L2+2.M
e2 B
e2 e2
e1 A
T1 T2 T3
T4
Fig. 2.5 Inductance Connected in Series Aiding
2.8.3 Series Opposing

When two coils so joined that their fluxes are in opposite direction as shown
in low fig 2.6. Then such type of connection is known as ‘series opposing’. Let
A and B are two coils in series opposing (i.e. their fluxes are subtractive).
Let M=co-efficient of mutual inductance
L1=co-efficient of self inductance of coil A.
L2=co-efficient of self inductance of coil b.
Then self induced emf in A is – e1=-L1 I (di/dt)
Mutually induced emf in A due to change of current in B is =e1=+M (di/dt)
Self induced emf in B is = e2=L2 (di/di).
Mutually induced emf in B due to change of current =e2-+M (di/dt)
Total induced emf in the combination=di/dt (L1+L2-2M)…..1
If ‘L’ is the equivalent induced emf in the single coil = -di / dt…….4
Equating 3 and 4 we have L=L1+L2-2M
Thus equation for total inductance in series opposing is L=L1+L2-2M

A e2 B
e1
e1 e2
T1 T2 T3 T4
Fig. 2.6 Inductance connected in Series Opposing
2.9 Inductance in Parallel

As shown in figure 2.7 two inductances of values L1 and L2 are connected
in parallel. Let I be the main supply in current and i1 and i2 be branch currents.
In parallel we know that the total current i = i1 + i2
Since the coils are in parallel their emf’s are equal. Therefore as in parallel
resistance here also total inductance in parallel
I / L = (I / L1 ) + (1 / L2)…..
L1
i1
i1 B
i2 L1
Fig 2.7 Inductances Connected in parallel
2.10 Solved Problems

1. Two choke coils of 20H and 40H and inductances are joined a) in
series b) in parallel. What is the effective inductance in both conditions
(neglect mutual inductance).
Ans. In series connection we know that total inducrance:
L = L 1 + L2……..
Let L1-20 H and L2-40H
Substituting these values in the above equation L = 20 + 40 = 60
H in parallel connection we know that
Total inductance L= I / L 1 + I / L 2
= I/20 + I/40 = 2 + I/40
= I/L = 3/40
L = 40/3 = 13.3 H
2. The inductance of two coils are 10mh, 20mh respectively and its
co-efficient of coupling is 0.75. calculate mutual inductance
Ans: Inductance of first coil L1=10 mil
Inductance of second coil L2=20 mil
Co-efficient of coupling K = 0.75
Mutual inductance M = K L 1- L 2
2. The inductance of two coils are 10mh, 20mh respectively and its
co-efficient of coupling is 0.75. Calculate mutual inductance.
Ans: Inductance of first coil L1 = 10mh
Inductance of second coil L2 = 20mh
Co=efficient of coupling K = 0.75
Mutual inductance M=K L 1- L 2
= 0.75 10 x 10-3 x 20 x 10-3
= 0.0106 OR 10.6 mH
3. The combined inductance of the coils connected in series aiding
is 0.6 H their self inductance are 0.2H and 0.15H respectively. Calculate
mutual inductance and co-efficient of coupling.
Ans: Total inductance in series aiding L = 0.6H
L1= 0.2
L2 = 0.15
We know that in series Aiding L=L1+L2+2M

Substituting the values: 0.6 = 0.2 + 0.15 + 2M
0.6 = 0.35 + 2M
2M = 0.6-0.35
= 0.25
M=0.25 / 2 = 0.125 H
We know that K=M / L1 L2
= 0.125 / 0.2 x 0.15
= 0.72
4. Find the resultant inductance in series aiding and opposing when
0.9 H and 0.4 H are connected and mutual inductance between them is
0.3 H?
Ans: From the problem L1=0.9 H
L2=0.4 H
M=0.3 H
In series aiding L=L1+L2+2M
= 0.9 + 0.4 + 2 x 0.3
=0.9 + 0.4 + 0.6-1.9 H
In series opposing = L1+L2-2M
= 0.9+0.4-0.6+0.7 H
5. Find the total inductance in series and parallel when 4H and 6H
are connected. Neglect mutual inductance between them.
Ans : Let L1 = 4H
L2 = 6H
Total inductance in series L = L1 + L2
= 4 + 6 = 10 H
Total inductance in parallal I / L = 1 / 4 + 1 / 6
= 3 + 2 / 12
= 5 / 12
L=12/5=2.4 H
2.11 Applications of Inductors
1. Inductors are used in chokes
2. These are used in receivers as oscillator coils and as antenna coils.
3. These are used in filter circuits.
2.12 Construction and Working of Transformer
The transformer is constructed by wounding a coil on a core. In power
transformer the core is constructed with sheets of soft magnetic material in different
shapes. These are known as laminations. Two types of core shape are in use.
One is “core type” and other is the “shell type”. In power transformers shel type
core is used. These are shown in the below fig 2.8. two copper coils are wounded
on this core. One coil is known as primary winding and another coil is known as
secondary coil. The assembly is placed in a metal case and the ends of the
winding are soldered on a strip for external connection.
Luminator
Primary Winding
Secondary Winding
Shell type Core type Symbol
Fig. 2.8 Transformer
Working
Whenever we apply A.C. power to the primary winding according to the
principle of mutual inductance it can induce voltage in the secondary winding.
Here the magnitude of the voltage depends on the no. of turns of the secondary
windings. Thus transformer Induces voltage in the secondary.
Applications
1. These are used in power supplies.
2. These are used in stabilizers.

3. These are used in Radio’s, TV’s and other electronic circuits.
2.13 Audio Frequency Transformers
Construction and Working
If the AF transformer is of the same construction as the power transformer
with two windings wounds on a core of laminated silicon steel. The laminated
type of construction is preferred to the wound cut because the former introduces
an air gap in the core. The gap helps to stabilize the core flux in the event of DC
magnetization by any quiescent direct current flowing into the winding. The use
of light permeability and radio metals reduce the size or to increase the frequency
range of the transformer.
Power transformers are used to transmit energy at single frequency, but
communication transformers are used to transmit intelligence of information, which
are usually in the form of continious waves within a specified frequency range.
The A.F transformers gives the good performance over a band of frequencies in
the audio range which may be from 30HZ to 30KHZ.
Specifications: Impedance matching 200/250Q to 2/5Q frequency range 30HZ
TO 3030KHZ.
Applications
1. These are used at high frequencies in radio T.V. and satellite receiver
circuits.
2. These are used in AF amplifiers for impedance matching.
2.14 R.F Transformers
The radio frequency transformers are used for providing amplification at
high frequencies and acts as the load impedance in Amplifiers. These are used in
tuning circuits and can be tuned over a wide band of frequencies.
These transformers use air core powdered iron core or ferrite cores. The
air core coils are wound with wire over a wax paper or fibre bobbins. It has a
multilayer wounding in which the conductor spirals back and forth across the
width of the winding as the winding is built up. These type of winding decreases
the capacitance and large inductance can be obtained from small size coils.
Specified frequency range: 50KHZ-20MHZ
Inductance: 10mH-100Mh
Applications: These are used at high frequencies in radio TV and satellite

receiver circuits.
2.15 Specifications of a Transformer
Specifications are the input and output ratings of a transformer. These are
different for different transformers. The following factors are known as
specifications of transformer..
1. Rating in KVA OR VA.
2. Rated voltage
3. Voltage ratio primary to secondary
4. Rated frequency (50HZ).
5. Tappings Ex: center tapping or multi winding
6. Turns ratio 300/100
7. Type of transformer EX: power supply
8. Inductance Ex: 2/5 H
2.16 Applications of Transformers
The various transformers are used for different applications in electronic
circuits. These are given below
1. Power transformers are used in power supply circuits
2. IFT’S are used in radio’s and TV receivers.
3. EHT’S are used in TV receivers.
4. Pulse transformers are used in digital and telephone circuits.
5. Baiun transformers are used for impedence matching in TV receivers.
6. Auto transformers are used in stabilizers.
7. A.F transformers are used in AF amplifiers for impedance matching and
amplification.
Summary
1. The phenomenon where by an e.m.f will be induced in a conductor that
is cut across by a magnetic flux is known as electromagnetic flux.
2. According to Faraday’s first law an e.m.f will be induced in a conductor,
when it cuts the magnetic flux.
3. According to Faraday’s second law, the magnitude of the induced e.m.f

is directly proportional to the rate of change of flux linkages.
4. Lenz’s law states that an induced current always flows in such a direction
so as to oppose the cause that produces it.
5. Inductance is the ability of a conductor to produce induced voltage when
the varying current flows through it.
6. The inductance of an inductor depends on a) Number of turns b) area of
coil or thickness of wire c) length of coil d) permeability of the core e) distance
between the two turns.
7. The opposition offered by an inductor to A.C is konwn as inductive
reactance.
8. The ability of one coil to provide voltage in a nearby coil due to changing
current in the first coil is known as mutual inductance.
9. The transformer works on the principle of mutual induction.
10. Transformers are classified as a) power transformer b) RF transformer
c) IF transformer d) AF transformer.
1. Define self inductance and mention its unit.
2. Define mutual inductance and mention its unit.
3. What is meant by electromagnetic induction.
4. Define Lenz law.
5. Why Lenz law is used.
6. Write the principle on which generators, motors, transformers are
working.
7. What is meant by inductor ?
8. What is meant by inductive reactance ?
9. Define co-efficient of coupling?
10. Write the specifications of transformers?
11. Write the applications of transformer.
12. Draw the symbols of inductor and transformer.
13. Write the principle on which transformer works?

1. State and explain faradays laws of electromagnetic induction.
2. Explain the construction, working and applications of power transformers.
3. Explain the construction working of AF and RF transformers.
4. Derive the equation for series aiding and series opposing connection in
case of inductance connected in series.
5. Explain how the factors effecting the value of inductance.
6. Explain about self inductance and mutual inductance.
32 Circuit Theory and Electronic Components
UNIT 3
Capacitors
Learning Objectives
After completing this unit, the student shall be able to understand
• The meaning of capacitor and types.
• Factors affecting the capacitance of a capacitor.
• Dielectric strength and dielectric constant.
• Colour coding of capacitors.
• Losses in a capacitor.
3.1 Introduction
Capacitor is an electronic component which is made by two metallic plates
separated by an insulating material. The device which can store electric charge
in the form of static electricity is called capacitor. Some times these are also
called as condensors. The basic function of the capacitor is as follows
1. In a circuit it may bypass certain frequencies.
2. It can store electrical energy.
3. It can couple signal from one circuit to another circuit.
Hence the study of capacitors, types, dielectrics and characteristics are as
important and is explained as follows.
Paper - I Electronic Engineering Technician 33
3.2 Capacitance
The capacitance of a capacitor may be defined as an amount of charge
required to create unit potential difference between it’s plates. Or capacitance is
the ability of a capacitor to store charge on it’s dielectric. By definition
C=Q/V
Where C is the capacitance in Farad’s
Q is the charge in coulombs
V is the voltage in volts.
3.2.1 U.I Units
The unit of the capacitance is Farads and it is very big unit for practical
purposes. Hence sub multiple units micro farad (10’6F) and micro farads or
pico farads (10’12F) are generally used.
3.2.2 Symbol
The capacitor is represented by the following symbol as shown in below fig
3.1.
Fig. 3.1 Symbol of Capacitor
3.2.3 Dielectric Material

The insulating material which is placed in between two metallic plates of a
capacitor is known as “Dielectric Material”.
Ex: Air, Ceramic, Glass, Mica etc.
3.3 Factors Effecting the Capacitance of a Capacitor
The capacitance of a capacitor depends on so many no. of factors. These
are as follows.
1. Area of the plates.
2. No. of plates.
3. Distance between the plates.

4. Permeability.
1. The capacitance of a capacitor is directly proportional to it’s area of
plates i.e. as the area of plates increases then it’s capacitance also increases or
vice-versa.
2. As the no. of plates in a capacitor increases, its capacitance also increases.
3. Capacitance also depends inversely on the distance between the plates
i.e as the distance between the plates increases its capacitance decreases or
vice versa.
4. Capacitance also depends on the permeability i.e. the medium which is
used between the plates. Writing all these factors as an expression we can get.
C=A ε0εr (N-1)/d
If the no. of plates are only two then C=A ε0 εr/d
Where C is capacitance in farads
εo is space permittivity 8.854 x 10-12 F/mt
εr is relative permittivity
A is area of plates in square meters.
N is the no. of plates.
d is the distance between the plates in meters or thickness of dielectric in
meters.
3.4 Dielectric Constant
The insulating material which is used between the plates of a capacitor is
known as dielectric. The dielectric constant is the ability of an insulator to
concentrate electric flux. It’s value is specified as the ratio of flux in the insulator
is air or vacuum.
For example mica has an average dielectric constant of 6, It means it
can provide density of electric flux 6 times as great as that of air or vacuum for
the same applied voltage and size.
3.4.1 Dielectric Strength
Dielectric strength is the ability of dielectric material to withstand a potential
difference without break down. It may be expressed in volts/mil.
This voltage ratio is very important because breakdown of the insulator

provides a conducting path to the dielectric. Since the breakdown voltage
increases with greater thickness. Capacitors of high voltage rating have more
distance between the plates. This increased distance between the plates reduces
the capacitance.
3.4.2 Breakdown Voltage
Breakdown voltage is defined as the maximum voltage that can be applied
across a dielectric material for it’s safe operation. Hence the capacitors are
fated much below the breakdown voltage of capacitors. If the capacitors are
operated with more than this rated voltage it may be destroyed.
The Dielectric properties of different dielectric materials along with their
electric strength are important in manufacturing the capacitors. These are given
below in the tables 3.1 and 3.1
Table 3
S.no Material Dielectric Material Dielectric strength
voltage
1 Air or vaccum 1 20
2 Ceramic 80-1200 600-1200
3 Glass 8 35-2000
4 Mica 3-8 600-1500
5 Oil 2-5 375
6 Paper 2-6 1250
Frequency response of dielectrics is also shown in the table. 3.2
Table 3.2
S.no Dieletric Frequency range
1. Mica 5KHZ-100MHX
2. Paper 100KHZ-1MHZ
3. Glass 5KHZ-1000KHZ
4. Ceramic 1KHZ-500MHZ
5. Polyster 100HZ-1MHZ
6. Polystyrene 10HZ-100KHZ
7. Electrolyte 1HZ-100KHZ
3.5 Classication of Capacitors

Capacitors are basically classified into two types.
1. Fixed capacitors.
2. Variable capacitors.
3.5.1 Fixed Capacitors
Fixed capacitors are further classified according to the dielectric material
used in it as follows
1. Paper capacitor
2. Ceramic capacitor.
3. Polystyrene capacitor.
4. Mica capacitor
5. Tantalum capacitor
6. Electrolyte capacitor.
1. Paper Capacitors: Paper capacitors are manufactured by keeping paper
as dielectric between two metal foils like tin or aluminium. These are further
divided in to two types
1. Impregnated separated capacitors.
2. Metallised paper capacitors.
2. Ceramic Capacitors: In this capacitors ceramic is used as dielectric
between two metallic plates. These are available in two shapes
1. Disc type
2. Tabular type.
3. Polystyrene capacitors: In these capacitors polystyrene is used as
dielectric between two metal foils.
4. Mica capacitors: In these capacitors mica plates are placed between

the metal foils. These are also two types according to their construction.
(a) Stacked mica capacitors
(b) Silvered mica capacitors.
5. Tantalum capacitors: In these capacitors tantalum is used as dielectric
between two metallic foils.
6. Electrolytic capacitors : The name electrolytic capacitors has come
out only based on electrolyte, this in turn creates a medium to produce high
dielectric constant. Thus in electrolytic capacitors using electrolytic process borox
phosphate or carbonate electrolyte provides a thin layer of dielectric between
two metal foils like aluminium. These are of two types 1. Polarised electrolytic
capacitors 2. Non polarized electrolytic capacitors.
Different types of electric capacitors are shown in the figure 3.2
Lead Straight
Lead Performed
Axial Type
Tape and Reel Bulk Package
Lug Type
Non Polarized
Fig. 3.2 Different Types of Electrolytic Capacitor

3.5.2 Variable Capacitors

As the name itself implies a variable capacitor is one whose value canbe
varied continuosly. These are classified as follows.
1. Gangs 2. Trimmers or padders. Ex: Air type, button type. Ganges are
further classified into the following types.
(a) Metal gangs b) PVCGangs, Ex:2X,2J PVC Gangs. Different ganges
are shown in the below fig 3.3.
Application: These are used in tunning circuits.
Symbol of Gang
Fixed vanes
Plastic gang
Film dielectric variable

Construction of differ- capacitors
ential capacitor
Gang Capacitor
Metal gang PVC 2K
Fig. 3.3 Different gang capacitors
3.6 Colour Code of a Capacitor

Mica and tabular ceramic capacitors are colour coded to indicate the
capacitance value. As the coding is necessary only for very small sizes. The
colour code of capacitance value is always in PF. The colour used is same as
the resistors coding from black and from 0-9. Mica capacitors use a six system
as shown in the fig 3.4.
Fig. 3.4
Fig. 3.5
The top row is read from left to right and the bottom from right to left. The
dots indicates the following 1. White 2. Digit 3. Digit 4. Multiplier 5. Tolerance
6. Class white for the first dot indicates the coding.
The capacitance value is read from the first three dots. For example if the
colour are red, green and brown for dots 2,3,4 the capacitance is 250pF. If the
first dot is silver, it indicates paper capacitor. For tabular ceramic capacitors,
the colour code is as shown in the fig3.5. The wide colour band indicates the left
end and specifies % the temperature co-efficient. The next three colours indicates
the value of the capacitance. For example brown, black, brown indicates 100pF.
For very small values grey and white are used as for 0.01 and white for 0.10.
For example green, white and black means 50*0.1 or 5pF.
Table 3.3 colour code for ceramic capacitors

Colour Decimal Multiplier Tolerance % Temperature Co-efficient
Black 1 20 0
Brown 10 1 -30
Red 100 2 -80
Orange 1000 -150 -
Yellow - - -220
Green - 5 -330
Blue - - -470
Violet - - -750
Gray - - 30
White - - 500
3.7 Losses in A Capacitors

The following losses generally occurs in capacitors
1. Resistance loss
2. Leakage loss
3. Dielectric loss
4. Absorption loss
1. Resistance loss: This is due to resistance of plates and leads of
capacitors
2. Leakage loss: This is caused by the electrons leaking through the
dielectric. This increase with frequency, applied voltage and temperature.
3. Dielectric loss: This loss is caused due to energy absorbed by dielectric.
4. Absorption loss: When an ac voltage is applied to a capacitor their in
continues charging and discharging of the capacitor. The reverse charging cannot
take place instantaneously with high frequency charging of a capacitor. There
may be difference between the amount of ac voltage applied and the ac. Voltage
stored in the dielectric. This difference can be treated as absorption loss in the
dielectric.
3.8 Capacitance in Series
Let C1, C2, C3 be the three capacitors connected in parallel as shown in the
below fig3.7. This combination is applied to the supply of ‘V’ volts. In parallel
combination p,d across each is same but charge on each is different. Let it be
Q1, Q2, Q3 on C1, C2, C3 respectively.
Fig. 3.6
Now total charge Q=Q1+Q 2+Q 3

CV=C1V+C2V+C3V
Thus in parallel total capacitance C=C1+C2+C3.
3.9 Solved Problems
1. Find the total capacitance of two capacitors 10 and 20 are
Ans: Let C1=10F, C2=20F
In series total capacitance I/C = I/C1+I/C2
= 1/10+1/20= (2+1)/20=3/20
Therefore I/C=3/20 , C=20/3.F.

2. Find the total capacitance between the points a and b?
100F
200F
A B
300F
Ans: Total capacitance in parallel

C = C1+C2+C3
= 100 µ F + 200 µ F + 300 µ F
= 600 µF
3. Two capacitors having ‘a’ capacity of 5µF when connected in
parallel and 1.2 µF when connected in series. Calculate their capacities?
Ans: In Series I/C = 1/C1+I/C2
C = C1C2/C1+C2 = 1.2µF
In parallel C = C1 + C2 = 5µF………….1
Substituting C1 + C2 = 5µF IN C1C2 / C1+C2
We have C1C2 = 6µF
(C1-C2)2 = (C1+C2)2 – 4C1C2
(5)2 – 4 X 6 = 1
C1 – C2 =2 …………………………………2
Solving equations 1 and 2
C1 = 3µF, C2 = 2µF
4. Find the total capacitance of the following combination?
Ans: Capacitance between BC is 500 + 500 = 1000µF
Capacitance between AD I/CAD = 1/100 + 1/1000 + 1/100
= 10+1+10/1000
= 21/1000
CAD = 1000/21µF
500F
100F 100F
A C D
B
500F
3.12 Applications
Capacitors are used in various places in electronic circuits. These are as
follows
1. Capacitors are used as ‘filters’ in power supply circuits.
2. Capacitors are used as ‘signal bypass’ elements.
3. Capacitors are used as coupling devices in electronic circuits.
4. Variable capacitors are used in tuning circuits in receiver circuits.
Summary
1. The capacitance of a capacitor may be defined as the amount of charge
required to create unit potential difference or it is the ability to store charge.
2. The unit of capacitance is farads (F).
3. The capacitance of a capacitor depends on
(a) Area of plates (b) No. of plates (c) Distance
4. Various losses in a capacitor are
(a) Resistance loss (b) Leakage loss (c) Dielectric loss (d) Absorption
loss.
5. When C1, C2 and C3 are the three capacitors connected in series, then
1/CT = 1/C1 + 1/C2 + 1/C3
6. When C1, C2 and C3 are connected in parallel, CT = C1+ C2+ C3

7. Capacitors are classified as a) Fixed and b) Variable capacitor.
8. Fixed capacitor are further classified as paper capacitors, ceramic
capacitors, polystyrene capacitors, mica capacitors, tantalum capacitors,
electronic capacitors etc..
9. Capacitors are widely used as filters in power supply circuits, to bypass
signals, as coupling devices and as a component in tuning circuits.
1. Define capacitance and mention it’s unit?
2. Classify different types of capacitors?
3. What is meant by dielectric material. Give examples?
4. Define Dielectric constant and Dielectric strength of a capacitor?
5. What are the applications of capacitors?
6. What are the losses of capacitors?
1. Explain the colour code of capacitors?
2. Derive the equation for total capacitance when three capacitance are
3. Derive the equation for total capacitance when three capacitors are
connected in parallel?
UNIT 4
Fundamentals of DC and AC
Circuit
Learning Objectives
• The meaning of different terms like current, voltage, resistance,
conductance, power, admittance.
• Ohm’s law and Kirchhoff’s law
• Find the total resistance, current and voltage across each branch in a
DC circuit.
• The concept of alternating current and its principle of generation.
• Familiar with the terminology like cycle, frequency, time period,
instantaneous value, average value, RMS value etc..
• The behavior of AC through series and parallel circuits containing
elements like resistance, capacitance and inductance.
• Idea of resonance in A.C. circuit.
• Deriving an expression of resonance in RLC series circuit.
• Compare series and parallel resonant circuit performance features like

current, impedance, power factor etc.
4.1 Introduction
4.1.1 Current
The flow of the free electrons is called electric current. It is defined as the
rate of change of charge at any cross section of the conductor, I= d/dt
It is measured in Amperes (A).One Ampere of current is said to flow through
a wire if one coloumb of charge flows in one second.
4.1.2 Voltage
The work done to carry an electron or unit charge from one point to another
point in a conductor is known as voltage. This is also called as potential difference
or electromagnetic force. It is denoted by the letter V and is measured in volts.
4.1.3 Resistance
The opposition offered by a substance to the flow of electric current is
called resistance. It is denoted by the letter R and is measured in ohms ().
4.1.4 Conductance
Conductance is the reciprocal of resistance. The unit of the conductance is

mho ( ) .
4.1.5 Power
The rate of doing work is called power . In other words, power is the
work done per unit time. The unit of power is watt. Bigger units applied are KW
and MW.
1KW=1000 watts
1MW=1000KW= (10 6) watts.
Sometimes power is measured in horse power (HP).
1 HP = 746 watts.
4.1.6 Admittance
Admittance is defined as the reciprocal of impedence, i.e. admittance,
Y=1/z.
The unit if admittance is Siemens (S).
4.2 Ohm’s Law

The ratio of potential difference (v) between ant two points on a conductor
to the current (I) flowing between them, is constant, provided the temperature
of the conductor does not change.
In other words, V/I = constant or V/I = R.
Where R, is the resistance of the conductor between the two points
considered.
4.3 Kirchhoff’s Law
Kirchhoff’s laws are quiet useful for solving electrical networks which may
not be readily solved by ohm’s law. The two laws are
1. Kirchhoff’s current law or point law: In any electrical network, an
algebraic sum of the currents meetings at a point (or junction) is zero.
In other words the total current leaving a junction is equal to the total current
entering that junction.
Consider the case of a few conductors meeting at a point A in fig 4.1
I1 I2
I5 I3
I4
Fig. 4.1
Some conductors have currents leading to a point A, where as some have

currents leading away from point A. Assuming incoming currents with positive
sign and outgoing currents negative, we have
I1+(-I2)+(-I3)+(+I4)+(-I5)=0
or I1-I2-I3-I4-I5=0
or I1+I4 = I2+I3+I5
Or sum of incoming currents=sum of outgoing currents
Or I=0
2. Kirchhoff’s mesh law or voltage law(KVL): The algebraic sum of the
products of currents and resistance in each of the conductors in any closed path
(or mesh) in a network plus the algebraic sum of the emf’s in that path is zero..
In other words, IR +  e.m.f=0.
4.4 Series and Parallel Circuit
It was already explained in chapter 1, that in a series circuit containing
resistors R1,R2,R3. The total resistance
R=R1+R2+R3
In a parallel circuit containing resistors R1, R2, R3 the total resistance
1 1 1 1
= + +
R R1 R2 R3
4.4.1 Solved Problems
1. Find the total resistance of the following circuits.
12 8 6
It is clear that the above circuit, the three resistors are connected in series.
R = R1+R2+R3 = 12 + 8 + 6 = 26
2. Calculate the equivalent resistance of the circuit given below
V
The above three resistors are connected in parallel

1 1 1 1 1 1 1 2+1+3 6
 = + + = + + = = = 1
R R1 R2 R3 3 6 2 6 6
 R=1 
3. Determine the total resistance and the circuit current in the figure shown
below.
20V
Resistance between points B and C
1 1 1 1 1 4+1 6
= + = + + =
R R1 R2 5 20 20 20
Therefore RBC = 20/5 = 4 

Total resistance R1 = R1 + R2 + R3 = 2 + 4 + 4 = 10 
 Circuit current, I = V/R = 30 = 3 A.
10
4. Find the current and voltage in each branch in the circuit shown below
24V
Resistance between points B and C
1 1 1 1 1 2+1 3
= + = + + =
RBC R1 R2 6 12 12 12
 RBC = 12 = 4
3
RAC = R1+R2 = 4 + 4 = 8 
Total Resistance=8 
Total current I = V = 24 = 3A
R 8
 Current through 4 =3A
 Voltage drops across 4  = IR = 3 x 4 = 12V
Therefore Voltage drop between the points B and C = 24 – 12 = 12V
Since 6 and 12 are in parallel, same 12 V of voltage will be developed
across each resistor.
Current through 6  = V/R = 12/6 = 2A
Current through 12  = V/R = 12/12 = 1A
Current through 6  =I, R2 12
=3 = 2A
R1+R2 6+12=2A
Current through 12  =3x 6 =1A
6 +12
4.5 Introduction to AC Circuits

Alternatively voltage may be generated by rotating a coil in a magnetic field
or by rotating a magnetic field within a stationery coil. These are the fundamental
principles which are used in AC voltage generation. This is also known as
electromagnetic induction. According to Michale Faraday First aw of
electromagnetic induction explains how AC voltage is generated and the second
law gives how much voltage is generated and on what factors the magnitude of
the generated emf depends. These two laws are the basic principles forAC
voltage generation and the basic circuit for generation of AC voltage is given in
the below fig 4.2
Fig. 4.2 Basic Circuit for A.C. Voltage Generation
4.6 Generation of Sinusoidal AC Voltage

As already explained in the previous topic that the sinusoidal AC voltage is
generated using electromagnetic induction. The magnitude of the voltage
generated depends in each case upon the no. of turns in the coil, strength of the
field and the speed at which the coil or magnetic field rotates.
For instance consider a rectangular coil having N turns and rotating in a

uniform magnetic field with an angular velocity of ‘ω’ radians/seconds. As shown
in the fig 4.6. Let it be measured by X axis maximum flux Φm is linked with the
coil with its plane outside with the X axis. In time ‘t’ seconds coil rotates through
an angle θ = Φm cos ωt. Hence flux linkages of the coil at any time in the deflected
position are N θ = N Φm cos ωt
y
x x
y
Fig. 4.3
According to faradays law of electromagnetic induction the emf induced in

the coil is given by the rate of change of flux linkages of the coil. Hence the value
of induced emf at this instant or the instantaneous value of the induced emf is
e = - d (NΦ).
dt
= -d (NΦm). cos ωt
dt
= - NωΦm (-sin ωt)

= ω NΦm sin ωt
= ωN Φm sinθ ...................................... (1)
When the coil has turned through 900 i.e., when θ = 900 then sinθ = 1.
Hence ‘e’ has maximum value say Em. From eq.(1) we get
Em = ω NΦm = 2f NBm A volt
Where Bm = maximum flux density in wb/mt2.
A = Area of the coil in mt2.
F – frequency of rotation of the coil in rev/sec.
Substituting this value of Em in equation we get
e = Em sinθ
= Em sin ωt………………………….. (2)
This equation (2) represents the sinusoidally generated voltage. Similarly
the equation of the induced current is I = Im sinθ
The equation of the induced emf or current reveals that the e m f or
current varies as sine fuction of the time angle ωt. This is shown is graphically in
the below fig 4.3.
Fig. 4.3
4.7 Cycle Frequency Time Period
One complete set of positive and negative values of alternating quantity
is known as a cycle. A cycle may also be defined in terms of angular measure as
“if a coil is rotated for 360o in a magnetic field then it is said to be one cycle”.
This is graphically represented as shown in the below fig 4.4. The number
of cycles/sec is called the frequency of alternating quantity. It is measured in
Hertz. It is also defined as the reciprocal of the time period of the alternating
quantity.
Fig. 4.4
Therefore f = I / T.
Hence the time taken by an alternating quantity to complete one cycle is
called time period T.It is measured in m sec. This is also graphically represented
in the below fig 4.5
Current
 3/2 2
/2
I=0

I=T
4.8 Instateneous Maximum, Average, RMS values and

Factors
A quantity which varies in each and every instant of its time then it is called
instantaneous quantity. For example you consider instantaneous voltage which
varies at each and every instant of its time sinusoidally that’s why it is called
instantaneous or sinusoidal AC voltage or quantity.
In alternating quantities the voltage or current starts from zero, reaches
peak value and then falls to zero in 180o of rotation. Here the maximum value is
defined as the peak value or the highest amplitude of the alternating quantity
irrespective of its direction or sign and is known as maximum value.
The average value of an alternating current is expressed by that steady
current which transfers across any circuit the same charge as is transferred by
that alternating current. In case of symmetrical alternating current the average
value over a complete cycle is zero. Hence in this case the average value is
obtained by adding or integrating the instantaneous values of current over half
cycle only. But in case of unsymmetrical alternating current the average value
must be taken over by the whole cycle. This is given by two methods
1. Mid ordinate method
2. Analytical method.
Fig. 4.7
In mid ordinate method the time base of the positive half cycle as shown in
fig 4.7 divides into an equal intervals of time each of duration t/n seconds. The
average value of the current is
i1 + i2 + ..... in
Iavg =
n
According Analytical method Iavg is given by
I avg = 2 I /  or 0.637 x max
The Rms value of alternating current is given by that steady(dc) current
which when flowing through a given circuit for given time produces the same
heat as produced by the alternating current flowing through the same circuit for
the same time. This is also given by two methods.
1. Mid ordinate method
2. Analytical method
It is also known as effective value of AC. For finding Rms value of a
symmetrical sinusoidal alternating current either mid ordinate method or analytical
method may be used. For symmetrical non sinusoidal waves the mid ordinate
method would be found more convenient.
According to this mid ordinate method any positive half cycle as shown in
fig 4.7 is divided into n equal intervals of time each of the duration t/n seconds.
Let the mean instantaneous values of currents during these intervals be respective
i1,i2…..in in fig 4.6. Suppose this alternating current is passed through a circuit
of resistance R ohm.
Then
Heat produced in 1st interval = 0.24i12Rt / n cal.
Heat produced in 2nd interval = 0.24i22Rt / n cal
Heat produced in nth interval = 0.24in2Rt / n cal
Heat produced in ‘t’ second is
0.24 Rt (i 12 + i 2 + i 2 )
2 n
Total heat produced in ‘t’ second is =
n
According to definition 0.24 I2 Rt = 0.24 Rt (i 21 + i 2 + i 2 )

2 n
(i 21 + i 2 + i2n ) n
2 2
I =
n
I = (i 21 + i 2 + i2n )
2
n
Square root of the mean squares of the instantaneous currents.

According to Analytical method Irms = 0.707 x Imax
Vrms = 0.707 x Vmax
The Rms value of an alternating current is of considerable importance in
practice, because the ammeters and volt meters record the rms value of alternating
the current and voltage respectively.
Form Factor
Form factor is defined as the ratio between rms value of an alternating
quantity to the average value of alternating quantity.
Rms Value
Form Factor kf =
Average value
0.707 Imax
= = 1.11
0.637 Imax
Crest or Peak or Amplitude factor

It is defined as the ratio between maximum value of an alternating quantity
to the rms value of the alternating quantity.
Maximul value
Peak Factor = = Im / Im /2 =2 = 1.414
Rms value
4.9 A.C Through Pure Resistance

When only a resistor is used in an ac circuit as shown in this 4.8 the voltage
and current rises and fall simultaneously and it is said that the current and current
are in the same phase.
VR V= Vm Sin wt
I I= Im Sin wt
IR
v=Vm Sin wt
Fig. 4.8
Circuit Diagram Voltage and Current Wave form Vector Diagram
Mathematically applied voltage V = Vm sin ωt

VR = Vm sin ωt
IR = Im sin ωt
4.10 A.C Through Pure Inductance
When AC is applied to pure inductor the current lags the voltage by 90o as
shown in fig 4.9 when AC voltage is increased the inductor gives the opposition
hence the back emf is produced which decreases the flow of current at this time.
Increase of forward voltage increases the back emf at the instant of maximum
peak voltage there is maximum back emf, hence no current will flow at this time.
When the voltage decreases the conductor gives back energy and rises to
keep the status thus the current increases and reaches the maximum when the
22
voltage is zero. Thus the current is lagging the voltage at the time by 90o or the
voltage is leading the current by 90o.
In pure Inductance applied voltage V = Vm sin t
IL = Vm / XL Sin (t - Π/2)
IL = Im Sin (t - Π/2) ( Since Im = Vm / Xl)
V V=Vm Sin wt
V

IL
Circuit Diagram Wave forms of Current and Voltage Vector Diagram
Fig. 4.9
Here Π/2 appears because of lagging characteristics. XL denotes the

inductive reactance. The vector diagram also shown in fig 4.9.
4.11 A.C Through Pure Capacitance
When an AC flows through the capacitor as shown in the fig 4.10 the
current leads the voltage by 90o. Initially when an emf starts from zero and rises
in positive direction a flow of electrons takes place between the plates as there
is no initial charge on the capacitor plates to oppose this flow of electron.
Ic = Im sin (wt +

C Ic
V = Vm sin wt
V=Vm Sin wt Ic
  V
Circuit Diagram Wave forms of Current and Voltage Vector Diagram
Fig. 4.10
Thus when the voltage is at zero position the current is at it’s maximum
position as the capacitor gets charged or the capacitor is fully charged the current
is zero. This shows that the current leads the voltage by 900. From the fig 4.10
it can be seen that in one half cycle energy is absorbed and in the next half cycle
it is returned back resulting in no loss of energy. The voltage and current
relationship can be expressed as
Applied voltage V = Vm sin t
ic = Vm / Xc Sin (t + Π/2)
ic = Im Sin (t + Π/2) (Since Im = Vm/Xc)
4.12 AC Through Resistance in Series with an Inductor
When an alternating voltage is applied to an RL series circuit as shown in
fig 4.11. The current ‘I’ flows through the circuit which produces voltage drop
across each element. The voltage drop across resistance VR is in phase with the
current. This drop is equal to the IR. The voltage drop VL across the inductor is
equal to IXL, which is leading current by 90o. These voltage drops are shown in
the vector diagram, where OA represents VR and OB represents VL.
The applied voltage is given by the vector sum of the voltage drops
2
V = VR + V 2
L
= (IR)2 + (IXL)2
= I2 (R2 + X 2 )
L
2
= I (R2 + X L)
2
= V / (R2 + X L )
2
The quantity R2 + X L is known as the impedance of the circuit it has
the same property as that of the resistance. In fig. 4.11. CDE triangle shows that
impedance triangle. Here CD represents the resistance reactance and CE
represents the impedance. This satisfies the relation as represented by the
impedance equation. Z = (R2 + X2 )
c
The power in AC circuit is given by the product of the voltage and that part
of the current which is in phase with voltage P=VIcostΦ.
PF: The power factor of RL series circuit is defined as the ratio between
resistance and impedence of that circuit.
PF = R/Z = R / (R2 + X 2 )
L
VL
VR 90o
B
VR VL XL=wl
V VL Z
I
I
VR A C D
Circuit Diagram Voltage Triangle Impedance Triangle
Fig. 4.11
4.13 AC Through Resistance in Series with the Capacitance

When a resistance is connected in series with a capacitor then alternating current
produces voltage drop across it. The voltage drop across resistance VR is in
phase with current I where as the voltage drop across capacitance VC is lagging
I by 900 as indicated in the vector diagram shown in the below figure 4.12
The applied voltage is given by the vector sum of the voltage drops.
V = V 2 + V2
L C
= (IR)2 + (IXC)2
2
= I2 (R2 + X C )
2
= I (R2 + X C )
2
I = V / (R2 + XC )
= V/Z
VR
Vc
VR I 0 R a
VR Vc
V Vc Xc
z
Circuit Diagram Voltage Triangle Impedance Triangle
Fig. 4.12
Here again Z = R2 + X is the impedence of the RC series cicrcuit this

is shown in the above impedance triangle.
4.14 Resistance, Inductance And Capacitance in Series
When alternating voltage is applied across the series combination of
resistance, capacitance and inductance as shown in the below fig 4.13. The
current I flowing through the circuit develops a voltage drop across each element.
Let the voltage across R is VR=IR (which is in phase with I).
The voltage drop across L is VL=IXL ( which is lagging behind I by Π/2)
The voltage drop across C is VC = IXC (which is lagging behind I by Π/2)
These voltages are shown in the voltages triangle. From the voltage
triangle OA represents voltage across R and which is in the phase with the
current I. AB and AC represents voltage drops across inductor and capacitor
respectively both are 180oout of phase with each other. The applied voltage V
is represented by OD.
Fig. 4.13 R.L.C Series Connection Circuit Diagram

From the Triangle AC = BD

AD = AB - CD
= AB - AC
Applied voltage is the vector sum of voltage drops
2
V= V + (VL - Vc)2
L
= (IR)2 + (IXL - IXC)2
= I2 (R2 + (XL - XC)2)
= I (R2 + (XL-XC)2)
I= V/ (R2 + (XL - XC)2)

= V /Z
Z = (R2 + (XL - XC)2)

Power factor is defined as the ratio between resistance and impedance of
the RLC series circuit. Pf = R (R2 + (XL - XC)2)
4.15 RL Parallel Circuit

When an inductor L and resistor R are connected in parallel to an source
then it is known as RL parallel circuit. Parallel RL circuit is shown in the below
fig 4.14. In which voltage remains same but the currents will be different. The
importance between a purely resistive parallel circuit and an RL parallel circuit is
in finding out the total currents . In purely resistive parallel circuits simply the
total of all the circuits the currents in the inductive branch currents wick be the
total current. But in parallel RL circuit current in the inductive branches are 900
out of phase with the currents of resistive branches. Thus vector addition approach
wil be utilized. First of all the inductive currents must be added up and they now
added vertically to the resistive currents.
Thus total currents It I2 + I2
RT LT
Where I LT = Total current of resistive branches
Vs 2 V
=Vs ( ) + ( s )2
RT XLT
ILT = ( 1 )2 + ( 1 )2
RT XLT
It
Vs =
1 1
( )2 + ( )2
RT XLT
It
=
(G)2 + (BL)2
lt
=
Y
Where G = 1 / Rt is known as conductance

BL = 1/ XLT which is inverse of inductive reactance and is known as
suseptance.
Y= (G)2 + (BL)2 ; Y is called as admittance and is measured in Mho’s.
Circuit Diagram Vector Diagram
Fig. 4.14
4.16 R.C. Parallel Circuit

When capacitor C and resistor are connected in parallel across an ac source
then it is known as RC parallel circuit. The voltage is same everywhere, however
the current through the capacitor leads to the voltage by 90o and the current
through the resistor is in phase with the applied voltage as shown in the below fig
4.15. Thus the capacitive current leads the resistive current by 90o and the
resultant current or total line current is the vector sum of these currents.
ICt
Ct
Vs IRt
Fig. 4.15
In making the vectors of this situation the current through the resistor is laid
off no horizontal axis and current through the capacitor on the vertical axis
because the capacitive current leads the resistive current by 900 which is shown
in below fig. Here the resistive current is in the phase with the applied voltage.
The resultant vector represents the total current in the circuit and the angle
which makes the vector IR is the phase angle.
It = I2 + Ic2
R
Tangent of the angle is equal to IRT / ICT = V/R / V/ Xc = Xc / R
This it can be seen that total current in a parallel RC circuit is always greater
than current in either branch.
It = Vs (1/RT)2 + (1/XCT)2
It
= (G)2 + (Bc)2
= It / Y
4.17 RLC Parallel Circuit
When all the three elements i.e. resistance, inductance and capacitance are
connected in parallel then the circuit is said to be RLC parallel circuit. These are
shown in fig 4.16 the circuit can be solved by converting the resistance into the
corresponding reciprocals inductive, capacitive reactance into corresponding
susptances by applying the following equations.
Y = G2 + B2
VS = It / Y = It / G2 + B2
IC C
IL R L
V
Circuit Diagram
IL cosB V XC
 
0
z
IL sin 
IL
 XL
Vector Diagram Impedance Triangle

Fig. 4.16 Parallel Resonance
Solved Problems
1. Find the amplitude of the following quantity e = 100 sin 200t
Ans : We know that e = Em = sin t
Compairing the abvoe with the given equation e = 100 sin 200 t
Amplitude Em = 100 V
2. Find the frequency of the following AC voltage e = 50 sin 200 t
Ans. We know that e = 50 sin 200 t
Compairing the above with the standard equation
E = Em = sin 2ft we can get
Em = 50 V 200 t = 200 t
f = 200 t / 200 t = 100 HZ
3. Write the equation of an alternating current its amplitude is 5 Amps and

frequency is 60 Hz.
Ans : From the above problem we know that
Em = 5A, f = 60 Hz
Substituting these values in the standard equation
I = Im sin 2ft we can get
I = 5 sin 2 t 60 t = 5 sin 120 t
4. The maximum or peak value of a AC quantity is 220 V find out its
average value.
Ans : We know that average value = 0.637 x max Value
Substituting the above in the equation we can get
V avg = 0.637 x 220 V
= 139.42 V
5. If a meter indicates 220 V rms value find out its peak value
Ans : We know that Vrms = 0.707 x V max
Vmax = Vrms / 0.707
= 311.08 V
6. If the peak value of an AC quantity is 240 V. Find out its effective value
or RMS value.
Ans : We know that Vrms = 0.707 x Vmax
= 0.707 x 240
= 169.98 V
7. Find the time period of 50 Hz frequency
Ans : We know that Time period T = 1 / f = 1 / 50 = 0.02 sec
8. Find the frequency Time period and Amplitude of the AC quantity e =
200 sin 100 t .
Ans : Compairing the equation e = 200 sin 100 t with the standard equation
We have amplitude Em = 200 V
Frequency f = 50 Hz
Time period T = 1/f = 1/50 = 0.02 sec
9. In a RL series circuit 3 resistance is connected in a series with an
inductive reactance of 4 find its impedance.
2
Ans : In a RL series circuit impedence Z = (R2 + XL )
= 32 + 42
= 25 = 5
10. Find out the impedance of RC series circuits having the resistance of
1000 with 1F capacitance connected a cross supply frequency of 60 Hz.
Ans : Given Data R = 1000 C= 1F, f=60 HZ
1 1
We know that the capacitive reactance XC = =
2fc 260 x 1 x 10-6
= 2651.5 
2
In RC series circuit Z = (R2 + X L )
= (1000)2 + (2651.5)2
= 2833.8
11. In a RL series circuit 300 resistance is connected in series with an
inductance of 80 mH across 25 V, 800 Hz, AC Supply find its impedance and
power factor.
Ans : Given data R = 300 L = 80 mH f = 800 Hz
Inductive reactance XC = 2 fc = 2 x 2.14 x 800 x 80 x 10-3
XL = 402
Impedance of RL series circuit Z = (R2 + X 2 )
C
= (300)2 + (402)2
= 501.6
Power factor R / Z = 300 / 501.6 = 0.598
12. A coil having a resistance of 6 and an inductance of 0.03 H is

connected across a 50 V, 60 Hz, supply. Calculate its inductance, impedance
and power factor.
Ans : We know that XL = 2fL
= 2 x 60 x 0.03 = 11.3
Impedance of RL series circuit Z = (R2 + X2 )
L
= (6)2 + (11.3)2
= 12.8 
13. A capacitor having a capacitance of 10 F is connected in series with
a non inductive resistance of 120across a 100V, 50 Hz supply. Calculate its
capacitance reactance, impedance and power factor.
Ans : Given data C = 10F R = 120 F = 50 Hz
1 1
Capacitive reactance XC = = = 318.47
2fc 2 x 3.14 x 50 x 10 x 10-6
2
Impedance of RL series circuit Z = (R2 + XL)
= (120)2 + (318.47)2
= 340
Power factor R/Z = 120 / 340 = 0.3529
14. A coil resistance 10 ohms and inductance 0.1 H is connected in series
with a capacitance of 150 f across a 200V, 50 Hz supply. Determine impedance
and power factor.
Ans : Given data R = 10 L = 0.1 H C= 150f f = 50 Hz
From the data XL = 2 fL
= 2 x 3.14 x 50 x 0.1 = 31.4
Capacitive reactance XC = 1 1
= = 21.2
2fc 2 x 3.14 x 50 x 150 x 10-6
Impedance of RL Series circuit Z = R2 + (XL-XC)2)
= (10)2 + (31.4 - 21.2)2

= 14.26
Power factor R/Z = 10/14.26 = 0.7
15. A resistance of 1 , an impedance of 1 Hz and a capacitance of 1 F
are in series across a voltage of 100V, 50 Hz supply. Find its impedance, current
through the circuit and voltage across each element.
Ans : Given data P = 1 L = 1H C= F f= 50 Hz V=100
From the data XL = 2  fL
= 2 x 3.14 x 50 x 1 = 314
1 1
Capacitive reactance XC = = = 3185
2fc 2 x 3.14 x 50 x 1 x 10-6
Impedance of RL series circuit Z = R2 + (XL-XC)2)
= (1)2 + (314 - 3185)2

= 2871
I = V / Z = 100 / 2871 = 0.0348 or 34.8 mA
Voltage across resistor VR = IR = 0.0348 x 1 = 0.0348 V
Voltage across inductor Vt= I x XL = 0.0348 x 314 - 10.9
Voltage across capacitor VC = I x XC = 0.0348 x 3185 = 110.8
Power factor R/Z = 10 / 14.26 = 0.7
4.18 Concept of resonance in AC circuits
In many of the electronic circuits resonance is very important
phenomenon. The study of resonance is very useful particularly in the area of
communications. For example the ability of a radio receiver to select the desired
frequency transmitted by a transmitter and to reject the frequencies from other

stations or unwanted frequencies is based on the principle of resonance. A two
terminal network in general offers a complex impedence consisting of resistive
and reactive components. If a sinusoidal voltage is applied to such network then
the current is then out of phase with the applied voltage. Under special
circumstances however the impedence offered by network is purely resistive or
if we can align the circuit in such a way that the current in circuit is in the phase.
The applied voltage then the phenomenon is called frequency of resonance. The
nature of resonance depends upon whether the inductance and the capacitance
are in series or in parallel. Accordingly we classify the resonance circuits into the
following two types.
1. Series resonance circuit
2. Parallel resonant circuit.
4.19 Resonance
A circuit is said to be under resonance when its net reactance is zero or the
impedance offered by the circuit is purely resistive or the current in the circuit is
in phase with the applied voltage. The frequency at which resonance occurs is
known as resonant frequency.
4.20 Expression for resonant frequency in RLC series circuit
A series circuit is said to be in resonance when its net reactance is zero.
The frequency fo at which this happens is known as resonant frequency. Consider
series RLC circuit shown in below fig 4.17
VL 90O I
90O
VC
VR
1 C
R L
VR VL VC
I
V
Fig. 4.17. R.L.C Series Resonance Circuit

According to the definition of resonance a series circuit is said to be in

resonance if the current is in phase with the applied voltage.
This occurs when it’s net reactance equals to capacitive reactance. The
frequency at which this occurs is known as resonant frequency. Since XL = XC
the impedance in a series RLC circuit is purely resistive.
At the resonant frequency fo the voltage across the capacitance and
inductance are equal in magnitude. Since they are 180o out of phase with each
other. They cancel each other and hence zero voltage appears across the LC
combination.
At resonance net reactance is zero
X = 0 or XL - XC = 0
XL = XC
L = 1 / C
2 = 1 / LC (Since  = 2f)
(2fo)2 = 1/ LC
fo = 1 / 2 LC
4.21 Current and impedance at Resonance
The under resonance conditions X=0 hence (formula). This is the
minimum possible value of impedance. The current is maximum and is given by
Imax = V/Z = V/R. In this condition power factor is also equals to unity.
4.22 Frequency Vs Current and impedance curves of a
series RLC circuit
The variation of impedance reactance with frequency is shown in the below
fig. 4.18. Suppose an alternating voltage of constant magnitude but of varying
frequency is applied to an RLC circuit.
If resistance R is independent of frequency hence it is represented by a
straight horizontal line. Inductive reactance XL is directly proportional to frequency
hence its graph is a straight line through the origin f0, XL increases linearly with
frequency. Capacitive reactance XC, is inversely proportional to its frequency.
Hence its graph is a rectangular hyperbola which is drawn in fourth quadrant
because XC is regarded negative.
I
XL
Im
Z
R
o
f
- Xc
Fig. 4.18 Frequency in Impedance Current
Net reactance X = XL - XC . Its graph is hyperbola and crosses the X axis

at point A. The value of frequency at A is called resonant frequency f0. Thus at
resonant frequency reactance X is zero. Impedance Z = R2 + (XL-XC)2. At low
frequencies impedance is large. AT (capacitive) high frequencies Z is again large
(Inductive). At resonance impedance Z is equal to R and net reactance X = 0.
Current has low value on both sides of resonant frequency this is due to
large impedance. But current has maximum value at resonance.
4.23 Resonance Curve
The curve drawn between current and frequency is known as resonance
curve. This is shown in fig 4.19 for various values of R. For smaller values of R
current frequency curve is sharply peaked, but for larger values for R the curve
is flat.
R Very Small
R Very Large
fo
Fig. 4.19
4.24 Band Width, Q factor and Selectivity

The band width of any system is the range of frequencies for which the
current or output voltage is equal to 70.7% of its value at the resonant frequency
and it is denoted by B.W. Below fig 4.20 shows the response of a series RLC
circuit.
Here in the below fig 4.20 frequency f1 is the frequency at which the current
is 0.707 times the current at resonance value and it is called the lower cutoff
frequency. The frequency f2 is the frequency at which the current is 0.707 times
the current at resonant value and is called upper cut off frequency. The Bandwidth
or B.W. is defined s the frequency differences of f2 and f1.
Max Value
0.707 max
I
or
v
f1 fo f2 f
Fig. 4.20
4.25 Q Factor
The quality factor Q is the ratio of the reactive power in the inductor or
capacitor to the true power in the resistance in series with the coil or capacitor.
Maximum energy stored
The quality factor Q = 2 Energy dissipated / cycle
Q factor of a coil = ωL/R

Q factor of a capacitor = 1/ωCR
Thus Q factor = ω L/R or 1/ω CR
4.26 Selectivity
A series RLC circuit gives unequal responses to voltages of different
frequencies. At the frequency of resonance the impedance is minimum and the
current is maximum. As the frequency of the applied voltage is either reduced or

increased from this resonance frequency the impedance increases and the current
fall. The below fig 4.21 shows the variation of current I with frequency. Thus
series RLC circuits posses frequency selectivity.
Selectivity of a resonant circuit is defined as the ratio of resonant frequency
f0 to the 3dB bandwidth.
Thus selectivity = Resonance frequency/3dB Bandwidth
= f0/3dB Bandwidth
Max Value
0.707 max
I
or
v
f1 fo f2 f
Fig. 4.21 Current Vz Freqency curve of a series of RLC Circuit
4.27 Comparison between series and parallel resonance.

Sl. No Impedance Series circuit Parallel Circuit
1. Impedance at Resonance Minimum Maximum
2. Current at Resonance Maximum(V/R) Minimum
[V/(L/CR) ]
3. Impedance at Resonance R L/CR
4. Power factor at resonance Unity (1) Unity (1)
5. Resonant frequency 1/2 LC 1/2 1 R2
LC L2
6. It magnifies Voltage Current

Solved Problems on Resonance

1. Calculate the resonance freqeuency when 2 mH inductor and 80 pf
capacitor is connected in a series circuit.
Ans : = L = 2 mH
C = 80 x 10-12 F
Resonant frequency fo = 1 / 2 LC
1
=
2 2 x 10-3 x 80 x 10-12
= 389 KHz
2. Determine the resonant frequency for the circuit shown in fig 4.22
10 0.5 mH 10 f
Vs
Fig. 4.22
Ans : Resonant frequency f0 = 1 / 2 LC

1
=
2 10x 10-6 x 0.5 x 10-3
= 2.25 KHz
3. For the circuit shown in Fig. determine the impedance and resonant
frequency as resonance.
10 0.1 H 10 f
Vs
Fig. 4.23
Ans : Resonant frequency f0 = 1 / 2 LC
1
= = 159.2 KHz
2 0.1 x 10 x 10-6
Impedance at resonance is equal to R i.e. Z = 10

Applications of Resonant Circuits
Resonant circuits are nothing but tuned circuits
1. These are used as tank circuits in oscillators.
2. These are used in Receivers for frequency selection
3. These are used for flat frequency response in IF amplifiers
4. These are also used as load impedance.
5. Thus resonant circuits are very useful in all communications circuits like
Radio receivers, TV receivers, Satellite receivers, Transmitters etc.
Summary
1. Current is the flow of electrons and its unit is ampere (A)
2. Voltage is the wor k done to carry an electron or unit charge from one
point to another point in a conductor and its unit is volt.
3. Resistance may be define as the opposition to the flow of current and its
unit is ohms ()
4. The rate of doing work is called power and its unit is Walt (w)
5. Admittance is the reciprocal of impedance which is measured in Seimens
(s)
6. Conductance is the reciprocal of of resistance measured in mhos.
7. Ohm’s law states that the ratio of potential difference and the current
flowing through a conductor between any two points is always constant
provided that the temperature do not change.
8. Kirchhoff’s current law states that the algebraic sum of current meeting
at a point or a junction in an electrical network of conductors is zero.
9. According to Kirchhoff’s second law, the algebric sum of e.m.fs and IR
drops in a closed loop or mesh is zero.
10. One complete set of positive and negative half cycles is known as a
cycle.
11. The total number of cycles completed in one second is known as
frequency and it is measured in Hertz (Hz) or cycles / sec.
12. The average value of an alternating current is expressed by that
steady current which transfers across any circuit the same chrges as
is transferred by that steady current.
13. The RMS value of an A.C is given by that steady or d.c. current which
when flowing through a given circuit for given time produces the same
heat as produced by that alternating current when flowing through the
same circuit for thesame time.
14. Any series RLC circuit is said to be in electrical resonance when its net
reactance is zero.
15. In a series RLC circuit the current is maximum, and the impednace is
minimum in series RLC circuit.
16. In a parallel resonant circuit, current is minimum and impedance is
maximum at resonant frequency.
17. Resonant circuits are used in oscillators radio and Television receivers
for frequency selection.
1. Define electric current and mention its units.
2. Define the term resistance and state its units.
3. Define (a) Conductance and (b) Admittance. Write its units.
4. Define power and state its units.
5. State and explain ohms law.
6. State and explain Kirchhoff’s laws
7. Write the principle used in AC voltage generation.
8. Write the equation for AC voltage and write the meaning of each term in
it.
9. What is meant by cycle and time period of a cycle.
10. What is meant by frequency and write its unit.
11. What is meant by average value of an AC quantity.

12. What is meant by Rms value of an AC quantity.
13. What is meant by peak or creast factor.
14. Draw the vector diagram of RL series circuit.
15. Draw the vector diagram of RC series circuit.
16. Write the equations for impedance of RL, RC series circuits
17. Define Resonance? And write the equation for resonant frequency in
RLC series circuit.
18. What is resonance curve and draw the diagram.
19. Define Quality factor
20. Define Bandwidth
21. Define selectivity.
22. Write the applications of Resonant circuits.
23. Write the equations for inductive, capacitive reactance and impedance
in RLC series circuit.
24. Draw the vector diagram for RLC series circuit.
25. Write the relation between Q resonant frequency and bandwidth.
1. Derive the equation for sinusoidal or instantaneous voltage?
2. Derive the equation for impedance in RL series circuit?
3. Derive the equation for impedance in RC series circuit?
4. Derive the equation for impedance in RLC series circuit?
5. Derive the equation for resonant frequency in RLC series resonance.
6. Write the comparison between series and parallel resonance.
7. Explain about selectivity and Bandwidth of resonant circuit
8. Explain variations of current and impedance at resonance with neat graph.
9. A series RLC circuit consists a resistance of 10&! and inductance of
0.1H and capacitance in Hz and in radians/second (A: 15920 Hz, 105
rad/sec)
UNIT 5
Miscellaneous Components
Learning Objectives
• The different types of wires.
• Different gauges of wire and their current capacity.
• Familiar with different wire joints.
• Various connectors used in electronic circuits.
• Get an idea of terminators used in Electronic circuits.
• The need of contactor and their types
• Get an idea about a switch and their types and applications
• The concept of relay, types and their applications.
5.1 Wires
Single strand wire, consists of one piece of metal wire. Stranded wire is
composed of a bundle of wires to make a larger conductor.
Stranded wire is more flexible than single strand wire of the same total
cross-sectional area, is used where there is little need for flexibility in the wire.
single strand wire also provides mechanical ruggedness.

Stranded wire is used when higher resistance to metal fatigue is required.
Such situations include connections between circuit boards in multi-printed circuits
board devices. Where the rigidity of solid wire would produce too much stress
as a result of movement during assembly or servicing. AC line cords for
appliances, musical instrument cables; computer mouse cables; welding electrode
cables; control cables connecting moving machine parts; mining machine cables,
trailing machine cables, and numerous other applications.
5.2 Standard Wire Gauge
5.1 Standard Wire Guage
The thickness of a wire is often gives as a Standard Wire Guage, or SWG.

This is number from 0000000 or 7/0 (thickest) to 50 (thicknest). The guage of
most wires used in electronics between 20 and 30. Often a wire guage will be
stated followed by “swg”, like 26 swg, etc.
5.2.1 Wire Joints
When working with the electronic equipments or with electrical wiring it
becomes necessary to splice or join wires together. Splices and joints are
essentially the same thing. Several different methods of doing this exist. The
fundamental necessities of an effective splice includes each other even without
solder and that they are well soldered to avoid corrosion. All wire joints must be
taped with electrical tape after soldering.
5.2.2 Western Union Splice
The western union splice works best to splice together small, solid
conductors. It is the most common type of wire splice. To make the western
union splice, first remove about five inches of insulation from both wires and
cross the exposed wires. Cut off the excess wires and pinch the ends down
with pliers, solder the joint together and wrap tape around it.
5.2.3 Tap splice
A tap splice also called a tap joint and is used to connect a conductor to a
running wire. To make a tap splice strip about 11/2 inches off running the wire.
Taking the running wire and wrap it once round the running wire. Now wrap the
end of the wire through the loop you just made. Then wrap the connecting wire
around the running wire about six times. Make sure the wire points away from
the original turn, solder the joint wrap around it.
5.2.4 Fixture splice
Fixture splices or fixture joints are used to connect wires of different sizes.
This joint requires five inches of insulation stripped off the wire. Hold the wires
together and then twist them few times with a pliers. Both wires must twist for
the joint to be tightened cut both ends of the wire so that they are same length
and then take the twisted joint and bend it, so that it lines up with wires. Take the
cut ends, and extend them perpendicular to the wire, and twisted portion. Wrap
these two ends in the same direction as the twist solder the joints together and
wrap around it.
5.3 Connectors
Connectors are used in electronic circuits for various purposes and are of
several types. When complex electronic circuits are assembled, it will not be
possible to have all of the circuit functions in one circuit board or block and
interconnecting one part with the others requires suitable connectors. Connectors
are of several types, one has a particular area for its use.
1. Coaxial connectors, normal, BNC etc.
2. Instrumental connectors.
3. D series connection
4. Edge connectors of PCB
5. Euro card connectors
6. Jack and plug type connectors
7. Din series audio conncetors
8. Modulator connectors for PCBs.
5.3.1 Coaxial connectors

Coaxial connectors are used to connect coaxial cable. The male type is
always connected to the cable and the female type is fixed to the instrument.
The connectors are housed in a outer metallic cylinder which is always connected
to the earth. Coaxial connectors are manufactured as type BNC, type,TVC
type, N type, Ctype ,HN and UHF cables.
Each of these cables have different frequency response and impedence.
Most of the cables have 50 ohms.
5.3.2 BNC Series
The BNC series are also called Bayonet Coupled is very popular because
they are weather proof, light weight, small in size and a have a constant impedence
of 50 ohms. The bayonet locking provides quick locking arrangement. Coaxial
cables are used to achieve maximum signal isolation.
BNC series has wide band width and can work satisfactorily upto 2GHZ.
They have a insertion loss of 0.1 Db.
Fig. 5.2 BNC Connector
5.3.3 TNC Connector

Threaded coupled or TNC connectors are similar to the BNC connectors
in construction. These connectors are available with constant impedence of 50
ohms. TNC series can be used upto 5ghz. SMA or subminiature type conncctors
are available and can be used upto 18 ghz.
Fig 5.3 TNC Connector

5.3.4 N Connectors
These connectors have a threaded coupling. N connectors have a
impedence of 50ohms and has a rated voltage of 1000v. The frequency range
over which these can respond connector is 10 GHz.
The ultra high frequency connectors can respond upto 200 MHZ. Theses
connectors have a impedance of 50 ohms and rated voltage of 500v. UHF
connectors have threaded coupling and are widely used in video applications.
The manufacturing costs is comparatively lower than the other type of connectors.
5.3.5 PCB Connectors
PCB connectors are available as edge connectors and euro card connectors.
Edge connectors are multi way single or double row connectors. The standard
spacing for the connecting fingers is 4 mm. The spacing will be small for specific
applications. Edge connectors are available with different pin configurations.
The standard spacing for the connecting fingers is 4 mm. The spacing will be
small for specific applications. The standard edge connectors have 10,12,16,18
and 22 pins. The edge connectors are used to interconnect the circuit boards.
Fig 5.4 Edge Connector
Euro card connectors

Euro card connectors differ from edge connectors in construction. The
edge connectors have fingers where euro card connectors have holes and pins
mating together. Two or more row of pins are used for larger no. of contacts.
Bent pin euro card connectors are used for mounting on the PCB. The contacts
are made of phosphor bronze and are gold plated. These cards can withstand
currents upto few amperes.
Fig 5.5 Euro Card Connector
5.3.6 Instrument connectors

The instrument connectors are used in the measuring instruments. Some of
the instrument connectors are Jones plug, modular plug and X-plug socket.
Fig 5.6 Jones plug and Socket
5.3.7 Modular Connectors

Modular connectors are of small size they are made of brass plug silver
plated contacts for panel mounting. Modular plugs may be directly mounted on
the chasis. Modular plugs are available with 4,8,12,24 ways. Pins protrude
from PCB. These are used to interconnect several modules. They are mostly
used for low power applications.
Fig 5.7 Modular Connectors
5.3.8 Din connectors

Din connectors are multi pole connector’s plugs. These are circular in shape
3 and 5 pin plugs are available.
Fig 5.8 DIN Connectors
5.4 Terminators
When constructing and using coaxial cable, it is important to close off any
exposed coaxial cable ends. This is known as terminating the cable. Coaxial
cable terminators also known as “F” terminators are screw in metal connectors
that seal the exposed end of a coaxial cable. The terminators emulate a connection
to a video measurement or computer accessory and formed a closed loop in the
cabling system instead of an open one which can result in signal loss.
The terminator is a round non electrical component that allows the single
wire exiting out of the coaxial cable to fit inside of it. These components keep
extraneous signals from equipment or unwanted radio signals from entering into
the signals being carried by the coaxial cable. A terminator also keeps the moisture
from entering through the exposed end of the cable.
5.5 Contactors
A contactor is an electrically controlled switch used for switching a power
circuit, similar to a relay except with higher current ratings. A contactor is a
controlled by a circuit which has much lower power level than the switched
circuit.
Contactors come in many forms with varying capacities and features. Unlike
a circuit breaker a contactor is not intended to interrupt a short circuit current.
Contactors range from those having a breaking current of several amperes and
24 VDC to thousands of amperes and many kilo volts. The physical size of the
contactors ranges from a device small enough to pick up with one hand to large
devices approximately a metre yard on a side.
Contactors are used to control electric motors, lighting, heating, capacitor
banks and other electrical loads. Various types of contactors are
1. Power contactors
2. Capacitors switching contactors
3. DC contactors
4. MCH contactors
5. Definite purpose contactor etc.
5.6 Terminals
Terminals are connecting points on instruments or connecting boards. These
are used to connect signal sources with the circuit or measuring instruments with
the circuits one end of the terminal is rigidly fixed to the panel board and the
other end has a threaded turntable knob. Terminals of various ratings are available
250v ,5A to 250V, 30A are available in the market.
Fig 5.9 Terminal
If no. of points are to be connected a terminal block is used. These are

available with blocks,sizes and ratings.
5.7 Introduction to Switches
A switch is a device which can connects two points in a circuit or disconnect
two circuits, If a switch is acting so as to connect two points it is said to be in
“ON” position. Such a switch is sometimes called as tap key or key it’s symbol
is shown in the figure
switch in Off position switch in On position

Fig 5.10 Terminal
In this switch it can be seen that there is only one throw and one pole to be
connected. Hence it is also called as single pole throw switch. In short SPST
according to no. of poles and throws used in a switch these are classified as
follows.
1. Single pole sing throw (SPST) switch
Fig 5.11
2. Single pole double throw (SPDT) switch.
3. Double pole single throw(SPST) switch
4.Double pole double throw (DPDT) switch.
Fig 5.12
Single pole single throw switch is one in which there is one pole and one
throw to be connected as shown in the figure.
Single pole double switch throw is one in which independent circuits are to
be connected using two throws but still connecting one pole as shown in the fig.
It is also called as SPDT.
Double pole single throw switch is one in which two poles are be connected
in a single throw. In short it is called as DPST.
Fig 5.13 Double pole single throw
These types of switches are used in connecting an antenna to a receiver. Its

symbol is shown in fig 5.13
A double pole double throw switch is one in which two poles are to be
connected to two different circuits. In short it is called DPDL. Its symbol is
shown in the fig 5.14. This type of switch is capable of connecting receiver to
antenna or antenna to receiver.
Fig 5.14 Double pole double throw switch
5.7.1 Types of Switches

In electronic equipment different types of switches are used for the required
application. They are as follows
1. Toggle switches
2. Push button switches
3. Knife switches
4. Key or lever switches
5. Slide switches
6. Rotatory wafer switches
7. Micro switches
8. Key board switches
9. Piano switches
10. Mercury switches.
5.7.2 Specification of switches
The different electrical characteristics of switches are known as ratings or
specification of switches. They are as follows
1. Max operating voltage
2. Operating current
3. Type of load
4. Capacitance
5. Insulation resistance
6. Change over time and bound effects.
Some of the switches ranging are given below
1. Toggle switch ratings
Max operating voltage 250/440V AC
Operating current 5-10Amps
Life (electrical) 5000 Amperes
Mechanical 100000 operations
Contact resistance 100 milli ohms
Insulation resistance 100 M ohms
2. Rotatory switch ratings
Contact resistance 10 milli ohms
Insulation resistance 100 M ohms
Life 7500 operations at full load
5.7.3 Applications of switches
Switches are needed i) to switch power supplies to circuits ii) to pass
electrical signals to selective parts of composite circuit iii) to switch one among
several components parts in to a common circuit.
However specific applications of different switches are given below:
1. Toggle switches are used in electric and electronic instruments.
2. Rotatory switches are used in band switches in receivers.
3. Piano switches are used in tape recorders, radios, instruments where
wide range of function is to be selected.
4. Key board switches are used in computers.
5. Key or level switches are used for motor vehicles for ignition.
6. Push button switches are used in power supplies.
7. DPDT switches are used as band switches in radios.
5.8 Relay
Relay is an electromechanical device employed to control large power to
perform switching operation. Thus relays are actually switches. They can have
several poles and several contacts. The type of contacts could be normally
open and normally closed.
5.8.1 Classification of Relays
These can be broadly classified as
1. Eletromagnetic relays
2. Thermal relays
3. Electronic relays and
4. Miscellaneous relays
According to their operating characteristics these are classified as follows
1. Solenoid type
2. Moving coil type
3. Armature type
4. Electro dynamic type
Depending on their applications they are classified as
1. General purpose relays
2. Telephone relays
3. Latch in relays
4. Time delay relays
5. Reed relays
6. Polarized relays
7. Inter locking relays
8. High temperature relays
9. Frequency relays
5.8.2 Electromagnetic relays
Electro magnetic relay is the first man made electrical device. It was invented
in the year 1836 by the great scientist “Morse”. It was first used in telegraphy in
1850. Relay has got important place in the automatic and semi automatic
equipments. Relay is such a electronic device which can turn ON/OFF any
external circuit in special circumstances.
The principle of relay is mainly based on electromagnetism. A simple relay
can be compared with 1 pole relay switch. The difference is only that simple
switch is a normal switch where as relay is automatic switch to some extent. It
has a coil in it when this coil gets supply, then it becomes electromagnet and
attracts the strip pole towards itself and changes the position of the switch.
When supply is cut off the coil demagnetizes and thus switch comes to normal
position. In a simple single pole relay there are totally five ends. Out of these
two ends p1 and p2 are one ends of the coil. End A is known as pole end C is
known is known as normal connection and c is orderly connection. When coil
of relay does not gets the supply then pole A remains touched with the end n/c
and this state of relay is called normal state or off state. As it is shown in the fig
7.6 when the coil of relay gets the supply the core of the coil becomes
electromagnet and the pole A which is connected with long strips gets attracted
towards the electromagnet. As a result of which a pole A make contact with end
o/c end c. In this way the contacts of relay switches only changes when it gets
the supply. As soon as the supply to the coil cuts off the relay comes backs to its
normal position
B B
P1 P1
N/C N/C
A A
PO L PO L
P2 C C
O/C O/C
Off position On position

Fig 5.15 Sinle Pole Electro Magnetic Relay
5.8.3 Specification and applications of relay

Different electrical characteristics of relay are known as specifications.
They are as follows
1. Operating voltage-6V/9V/12V/24V
2. Current-150mA and less
3. Coil resistance-order of 1 kilo ohm and low

4. Contact resistance-low
5.8.4 Applications of relays
Relays are used in different fields in electronics. They are as follows
1. Relays are used in stabilizers
2. They are used in emergency lights
3. They are used in telephone circuits
4. They are used in telegraphy circuits.
Summary
1. Single strand wire consists of one piece of metal wire. Stranded wire
composed of a bundle of wires to make a large conductor.
2. The thickness of a wire is often given as a standard wire guage or SWG.
Greater the SWG of a wire, smaller is its current carrying capacity.
3. Various types of wire joints are western union, splice, tap splice, fixture
splice etc.
4. Connectors are used to inter connect one part of the circuit to the other.
5. Coaxial connectors, instrumental connectors, D-series connectors, PCB
connectors etc., are widely used in electronic circuits.
6. A switch is a device which can connect two points in circuit or disconnect
two points.
7. Relay is an electro mechanical device employed to control large power
to perform switching operation.
8. Relays are extensively used in stablizers, emergency lights, telephone
and telegraph circuits.
1. Write the difference between single stand and multi stand wire?
2. Name the different types of wire joints?
3. What is the need of connector in electric circuits and mention some
connectors?
4. What is the use of terminator in electronic circuits?
5. State the need of contactors and write their different types?

6. What is meant by switch and write the symbols of different switches?
7. Write different types of switches?
8. Write the specifications of switches?
9. What is meant by relay and classify different types of relays?
10. What are the applications of relays?
11. Write the specifications of relays?
Long Answer Type Qusestions
1. Explain in detail about PCB connectors?
2. Explain the constructural details and working of electromagnetic relay?
UNIT 6
Soldering and PCB’s
Learning Objectives
• The concept of soldering
• The different types of soldering
• The need of soldering flux
• The importance of temperature controlled soldering and de soldering
station.
• The need of PCB’s in electronic equipment and their types.
• The steps involved in PCB preparation
• The steps involved in screen printing.
6.1 Introduction
Soldering is the process of joining two metallic conductors together at a
relatively low temperature of 500 and 600o Fahrenheit. The joint where the two
metal conductors are to be joined or fused is heated, with a device called soldering
Iron and then an alloy of tin and lead called solder is applied which melts and
covers the joint. The solder cools and solidifies quickly to ensure good and
durable connection between the joined metals. Covering the joints with solder
also prevents oxidation. Faulty solder joints remain one of the major causes of
equipment failure.
6.2 Soldering Lead Types
Fig 6.1
Solder used for electronics is a metal alloy, made by combining tin and lead
in different proportions. We can usually find this proportions marked on the
various types of solder available.
The grades of solder available contain the percentage of tin to lead
respectively as 40-60, 50-50 and 60-40, The 60-40 (60 tin 40 lead) solder
melts easily and makes soldering easy and safe without damage to the surface
or components being soldered. This type of solder is most suitable for electronic
work. Solder is usually available in the form of wires of different sizes.
We need to be careful not to move any elements of the joint during the cool
down period. Movements may cause what is known as disturbed joint. A
disturbed joint has a rough, irregular appearance and looks dull instead of bright
and shiny. A disturbed solder joint may be unreliable and may require rework.
6.3 Soldering Iron
He a t i n g Handle
Element
Copper Tip
Supply Cord and Plug

Fig 6.2
A soldering iron is most commonly used hand tool in soldering. It supplies

heat to melt the solder so that it can flow into the joint between two work
pieces. Soldering irons are most often used for radio, television and other
electronic equipment servicing. It consist of
1. Supply cord and plug
2. A wooden or plastic handle
3. Metallic shank containing the heating element and
4. Copper tip
All these parts are replaceable. Soldering irons are rated in watts. For
electrical and electronic work the rating of a soldering iron varies from 10 W to
100 W. A 10 W to 35 W soldering is commonly used for radios and TV network.
To avoid damage to work table and other surfaces, a heated soldering iron
should be placed on it’s holder or stand.
6.4 Soldering flux
A rosin solder flux or paste is generally used for soldering. The flux easily
melts and cleans the surface of any oxide films to ensure a smooth and cleaned
soldered joint. However solder wires with flux filled in the hollow core of the
wire also available. Use of flux core solder wire makes the external application
of flux unnecessary. Acid flux should not be used particularly when soldering
copper wires.
6.5 Tips for good soldering
Good soldering practice is very important for assembling any electronic
circuit. The following points should be kept in mind during the time of soldering.
1. Use the correct type of soldering iron and solder.
2. The tip of the soldering iron should be cleaned with a file and tinned
before use.
3. Avoid overheating of components and PCBs.
4. Do not use too much solder.
6.6 Temperature controlled soldering and de soldering
stations
One of the major elements that is always required in electronics production
or PCB assembly area is the ability of rework. There will always be board
failures and as a result, components need to be removed and replaced. This

needs to be done using skills, and the right equipment so that no damage is
caused.
Fig 6.3
While de-soldering tools are helpful A full holder station is an essential item.
The solder station comprises equipments for solder and de-soldering. The de-
soldering elements of the solder station normally comprises a heated element,
with a central hole that is connected to a vaccum pump. In this way the solder
station can be used, to effectively apply heat and remove the solder from the
joint. This means that a solder station will be the most effective tool rework is
undertaken, with minimum of risk to the board.
6.7 Need of PCB in electronic equipments
The printed circuit boards are usually termed as PCB. These are used to
avoid most or all the disadvantages of conventional electronic boards. Due to
the following advantages PCBs are needed in the electronic equipments.
These advantages are as follows
1. These are small in size and gives clear conception.
2. These are efficient in performance and gives all the information on the
board.
3. Connections of the circuits on the PCB is solved and there is no chance
for loose connections.
4. Servicing or fault tracing in PCBs is easy.
5. They are accurate. The only disadvantage is that once the board is
prepared no more changes are possible.
6.8 Classification of printed circuit boards

PCBs are broadly classified into two types.
1. General purpose PCB’s.
2. Special purpose PCB’s.
Special purpose PCB’s are again classified in to the following types, These
are single aided boards
1. Single sides boards.
2. Double sided boards.
3. Multi layer PCB’s.
6.9 Types of laminates used in PCB
A laminate is a tin sheet obtained by pressing layers of a filler impregnated
with resin under heat and pressure. The widely used fillers are paper (craft
paper, alpha cellulose or rags) glass. The resins used are epoxy, polyster, polytra.
Thus laminates are two types
1. Phonetic paper based laminates.
2. Glass epoxy material laminates.
Further glass epoxy laminates are of two types
1. Woven type
2. Non woven type.
Phonetic paper laminates PCBs are used where either high voltage or high
frequencies are not required and when tracks are also not too close. Glass
epoxy laminate PCBs are used where loose tracks layouts or high frequencies
are involved.
The standard glass epoxy laminate is looking green but even white coloured
boards are also available. In the woven type glass, fibre is spun woven in to a
cloth and impregnated with epoxy resin. Non woven laminate boards have their
a glass mat impregnated with epoxy resin. The non woven type is economical,
but is not resistance to crack propagation. The holes are clean in the non woven
type. Woven type boards are very hard to grill also.
Copper Clad Laminate
By the process of electro deposition, if a thin film of copper is deposited on
a laminate then it is known as copper clad laminate.
The basic materials required for the manufacture of copper clad laminates
are 1.Filler 2. Resin 3.Copper coil.
6.10 Preparation of PCB layout
Layout means components positions on a copper lay out. The circuit diagram
with components that is the diagram, which shows the spacing for their
components, and their inter connection tracks on a copper clad is known as
layout of PCB. This layout allocates spacing for different components, supply
tracks, inter components connection track, as per the circuit diagram.
The various steps involved in the preparation of PCB layout are as follows:
1. Drawing or art work is the first step in the preparation of PCB layout.
2. While drawing a PCB layout we have to kept in mind about the sizes of
components of the circuit.
3.The art work is usually carried out on a transparent base foil or on trace
paper or drawing sheet according to the printing method used for PCB.
4. For small board ink drawing and strip art work is used where as for
large boards black taping is widely used.
5. For simple efficient design of art work, self adhesive tapes, and pads are
used.
6. While drawing layout draw lines and small circles across each component
draw two parallel lines for supply, earth and circles associated with
base collector and emitter of the transistor.
7. Draw the connections without over lapping and out line of the layout is
prepared.
8. After completion of art work the lines and circles are fixed using self
adhesive tapes and pads respectively.
9. The design of art work becomes simple and more efficient.
10. After fixing the boundaries of the PCB, pads exactly and properly
wherever desired and taping of conductors is completed giving the actual
circuit layout.
11. The below fig 6.4 shows the simple PCB layout for a power supply
circuit.
12. While preparing a PCB layout some other considerations must kept in
mind. They are
(i) The diameter of the solder pad should be selected such that any
component lead should fit in appropriately.
(ii) Sufficient solder pad size must be provided to avoid damage due to
drilling of holes.
(iii) The conductor width should always be less than the solder pad diameter
preferably about one third.
(iv)The pattern around the holes should be maintained uniformly as small as
possible.
(v) When the components like transistors or diodes are to be mounted in a
fixed direction then it is required to index the orientation, on the art
work. This helps not onlyl in PCB assembling but also in trouble shooting.
Fig 6.4 P.C.B. of a regulated power supply unit
6.11 Methods of Transferring layout on to the copper clad

sheet
Using the following methods we can transfer layout on to the copper clad
sheet. These are 1. Screen printing. 2. Photo proven printing.
6.12 Steps involved in Screen printing
The following steps are used in screen printing of PCB.
1. A screen fabric with uniform mashes and opening is stretched and fixed,
on a solid frame of wood or metal. This is known as screen.
2. This screen is washed, using soap and after that it is dried for a few
minutes in the light.
3. The circuit pattern or circuit layout is then transferred on to the screen

leaving the meshes in the pattern are open while meshes in the rest of the
area are closed.
4. Then printing ink is forced by moving squeezer, through the open meshes,
on to the surface of the material to be printed.
5. Thus the circuit to be printed is covered with the ink surface while the
rest is left free.
6. The fixation of the screen printing is shown in the fig 7.8.
7. The primary selection of the fabric depends on the thickness of the ink to
be deposited, durability of the screen, resistivity to chemical agents in
the inks and mechanical sensibility.
8. The fabrics used for the PCBs are made of monofile polyster or stainless
steel fabric. Mono file polyster fabrics are widely used in the PCBs.
The stainless steel fabrics are used wherever accuracy is needed.
9. The frames for fixing the screen are made of seasoned wood or aluminium.
10. The screen is fixed to the frame and a drying operation is carried out.
Caustic soda solution is splashed in the screen and evenly distributed by
a brush. Thereafter the solution is thoroughly removed with water rinse
and the screen is dried by blowing hot air. The screen is now ready for
pattern transfer.
11. Cleaned up screen is coated with a photographic emulsion. This is then
exposed in direct contact with the film master on which the circuit is
prepared. On developing mesh opens in the pattern required and the
rest is closed.
12. The ink for the screen printing must be capable of rapidly drying on the
PCB but slowly on the screen. It should be easily visible and should not
contaminate the cleaning liquids.
13. The prepared screen is put in a frame holder which is rigidly held. A
squeezer of width 2 or 4 cm. More than the pattern width is selected.
The squeezer is pulled and firmly pressed across the pattern on the
screen. In this fashion the first few prints are made on white papers until
the perfect patterns appear. The actual screen printing is now done on
the copper clad sheets.
Ink Screen
Fixing Frame
|PCB Table
Fig 6.5 Set up for Screen printing
Materials used in screen printing of PCB.

The materials required for screen printing is as follows.
1. Copper clad laminate
2. Screen (mono file polyester fabric or stainless steel).
3. Frame wood or aluminiun
4. Ink
5. Cleaning solution
6. Squeezer
7. Photographic emulsion.
6.13 Photo processing Technique for PCB preparation
In the photo processing method of preparing PCBs copper clad laminate
itself is sensitized by applying a light sensitive emulsion. On exposure and
development a fine acid resistance film of circuit pattern is obtained after stretching
such a developed pattern. The light sensitive emulsion used for the above purpose
is known as “Photo resist”. The laminate is heated with pumice powder in a dust
free environment. After the cleaning process, the laminate is degreased with
trichloro-ethylene. A fine layer of photo resist is applied by one of the following
methods. These are
1. Brush coating
2. Flow coating
3. Dip coating
4. Roller coating
5. Whirler coating.
The photo resist coating dries up very fast and thus formed on the laminate
is very sensitive to light. The entire preparation of the board is done in dark
room under a safe red or orange light the dried on photo sensitive.
Laminate is then exposed to ultra violet light in contact with the circuit
master negative. After exposure the laminate is developed with a suitable solvent
developer. In this process of developing the unwanted photo resist layer is
removed and the laminate is now ready for etching and finishing. Once the circuit
pattern is obtained the board is drilled and the protective coating is applied as in
the screen printing method. Holes are drilled using high speed micro drills.
Sometimes the printed circuit boards are punched to make holes. Thus PCBs
are prepared using photo processing method. This method is very useful for
accurate printing. But is some costlier than screen printing. Due to accurate
printing this method is used in professional applications.
6.14 Etching drilling and cleaning of PCB
The process of removing the unwanted copper and forming copper pattern
on the laminate or PCB is known as etching. In the preparation of PCB sometimes
we may obtain different copper patterns. Some of them are enlarged copper
conductor size, track shorting, over hangings etc from actual copper pattern. In
this case we have to remove their extra or unwanted copper patterns using this
etching process. In this process using enchants like ferric chloride, cupric chloride
chromic acid or alkaline ammonia. We can remove the unwanted copper. Spray
etching and bubble etching methods are used for etching process. Among these
spray etching offers high etching uniformity and a fast etching rate.
The printed circuits boards are to be cleaned and prepared for the layout
of the circuit. Insufficient cleaning of the PCBs may leads to difficulties in final
preparation. The organic elements like oil and greases are present variably. This
may be due to the equipment used for shearing, drilling or punching. These are
to be removed with a suitable solvent. The finger prints formed while handling
PCBs may be removed by rinsing in water and blowing with compressed air or
by scrubbing with abrasives.
6.15 Steps used in PCB printing
In the previous topics we have learned the different processes come across
in PCB printing. These different steps are given here in the sequential order.
1. Preparation of copper clad laminate
2. Preparation of circuit layout using drawing or an art work on a transparent

base foil using high quality water proof ink or using self adhesive tapes
or pads.
3. Cleaning the board layout of the circuit.
4. Preparation of master copy of layout.
5. Checking the layout of the copper clad laminate using screen printing or
photo process printing techniques.
6. Transferring the layout on to the copper clad laminate using screen printing
or photo process techniques.
7. Etching the printed PCBs required.
8. Drilling the holes wherever required.
9. Scrubbing or clearing the PCBs for removing the loosely attached particles
of the PCBs which are existing in drilling.
10. Finally drilling the PCBs are ready for external use. Thus using the
above steps we can prepare PCB’s.
6.16 Soldering methods of PCBs
Soldering is process used for joining two metal parts or two conductors.
The following soldering methods are used in PCB’s.
1. Manual soldering
2. Mass soldering
Manual Soldering
In manual soldering the surface to be soldered must be cleaned and fluxed.
The soldering iron is switched and allowed to attain the soldering temperature.
Let the form of wire is applied near the component to be soldered and heated
with iron. The surfaces to be soldered are filled and iron is removed and the
joint is cooled without disturbing. This is known as manual soldering process.
Mass Soldering
Mass soldering is used where a large no. of joints are to be soldered
simultaneously. These are two types
1. Dip soldering
2. Wave soldering
1. Dip Soldering : A refluxed PCB with assembled component dipped

vertically in to a clean solder bath to a depth. The board is kept in bath for 2-3
seconds. While taking out the board an angled path should be allowed.
2. Wave Soldering : In wave soldering the assembly is applied flux. It is
pre-heated while passing through conveyor or belt to 110o and then to 140o it
passes over a wave of folder. The advance of lambda wave is that, while the
board enters the components touch the flat top of the wave while, the board
leaves the solder is drained away because of angle of wave with horizontal.
Thus the various steps in mass soldering are as follows.
1. Assembling the board.
2. Flux application.
3. Flux drying a Precheting.
4. Soldering.
5. Cooling
6. Flux removal.
6.17 Use of edge Connectors and Plating
The modular nature of construction of electronic equipment led to the wide
usage of edge board connectors. Edge connectors are mostly used in
interconnecting add on circuits or circuit boards, to basic mother board. In all
personal computers, and in some tv sets, these are strongly used. They are two
basic types of printed circuit board, edge connection.
1. Plug and receptacle (indirect entry)
2. Care edge (direct entry).
Indirect entry type is used when the board is on non standard thickness. A
plug type of connector and a separate receptacle connector is connected by dip
soldering. This type is more expensive and non repairable.
Electroplating is the process at which the ions are deposited by the passage
of current. In PCBs the base copper coating forming the conductor track is
liable to damage when exposed to atmosphere over a long period of time. Thus
the copper tracks has to be protected. This led to use of plating as a protection
to the copper coating. This plating is used for protecting the copper coating or
copper tracks in PCBs for long period of time.
6.18 Specification of PCB

The following characteristics are the specifications of PCBs. They are:
1. Current carrying capacities of PCB.
2. Contact resistance.
3. Insulation resistance.
Summary
1. Soldering is the process of jointing together two metallic conductors at
relatively lwo temperature.
2. Solder used in electronics is a metal alloy made by combining tin and
lead in different proportions. Common graded available are 40-60, 50-
50 and 60-40.
3. A soldering iron is a hand tool used for soldering. 10 w to 35 w soldering
irons are commonly used for servicing work.
4. Soldering flux cleans the surface so as to ensure for smooth and clean
solder joint.
5. PCB’s are classified as (a) general purpose PCBs and (b) special purpose
PCBs.
6. PCB preparation involves in (a) layout preparation (b) Etching
(c) Cleaning and (d) drilling wise sequential steps.
7. Manual solderig and mass soldering methods are used for PCB soldering.
8. The main specifications of PCB’s are (a) current carrying capacity (b)
contact resistance and (c) insulation resistance.
1. What is soldering?
2. Name the different types of soldering leads used?
3. Write the different parts of soldering iron?
4. What is the use of soldering flux?
5. Give some tips for good soldering?
6. What is the need of PCB?
7. Write the classifications of PCBs?
8. Write the soldering methods used in PCBs?

9. What is meant by a laminate? Name the materials used for laminate?
10. What materials are used for screen printing of PCBs?
11. What are the specifications of PCBs?
12. What is meant by etching? Write the different types of etchants used in
etching process?
13. What are the used of edge connectors and plating in PCBS?
1. What are the steps used in screen printing of PCBs?
2. Explain the preparation of layout of PCB?
3. Explain in detail about photo printing process of PCB?
4. What are the sequential steps used in manufacturing of PCB?
5. Write the importance of temperature controlled soldering and desoldering
station?
UNIT 7
SMD Components
Learning Objectives
• The concept of Surface Mount Technology (SMT)
• The advantages and disadvantages of SMT over the pin through hole
method of mounting components.
• Become familiar with various SMD components
• Become familiar with various SMD packages
• Explain the SMT soldering methods
• Become familiar with SMT soldering stations
7.1 Introduction
Surface mount technology(SMT): It is a method of constructing
electronic circuits in which the components are mounted directly on to the surface
of printed circuit boards (PCBs). In the industry it is largely replaced through
hole technology construction method of fitting components with wire leads in to
holes in to the circuit board.
An SMT component is usually smaller than its through-hole counterpart

because it has either smaller leads or no leads at all. It may have short pins or
leads of various styles, flat contacts, a matrix of solder balls (BGAs), or
terminations on the body of the component.
7.2 Advantages
The main advantages of SMT over the older through-hole technique are:
1. Smaller components.
2. Much higher number of components and many more connections per
component.
3. Fewer holes need to be drilled through abrasive boards.
4. Simpler automated assembly.
5. Small errors in component placement are corrected automatically.
6. Components can be placed on both sides of the circuit board.
7. Lower resistance and inductance at the connection (leading to better
performance for high frequency parts).
8. Better mechanical performance under shake and vibration conditions.
9. SMT parts generally cost less than through-hole parts.
10. Fewer unwanted RF signal effects in SMT parts when compared to
leaded parts, yielding better predictability of component characteristics.
11. Faster assembly.
7.3 Disadvantages
1. The manufacturing processes for SMT are much more sophisticated
than through-hole boards, raising the initial cost and time of setting up
for production.
2. Manual prototype assembly or component-level repair is more difficult
(more so without a steady hand and the right tools) due to very small
sizes and lead spacing of many SMDs.
3. SMDs can’t be used directly with breadboards.
4. SMDs solder connections may be damaged by potting compounds going
through thermal cycling.
Fig 7.1
Fig 7.2 SMT board with typical IC Packages
7.4 SMD Components

Surface mount devices, SMDs by their nature are very different to the
traditional leaded components. They can be split into a number of categories:
Passive SMDs: There is quite a variety of different packages used for
passive SMDs. However the majority of passive SMDs are either resistors or
capacitors for which the packages sizes are reasonably well standardized. Other
components including coils, crystals and others tend to have more individual
requirements and hence their own packages.
Resistors and capacitors have a variety of package sizes. These have
designations that include: 1812, 1206, 0805, 0603, 0402 and 0201. The figures
refer to the dimensions in hundreds of an inch. In other words the 1206 measures
12 hundreds by 6 hundreds of an inch. The larger sizes such as 1812 and 1206
were some of the first that were used. They are not in widespread use now as
much smaller components are generally required. However they may find use in
applications where larger power levels are needed or where other considerations
require the larger size.
The connections to the printed circuit board are made through metallised
areas at either end of the packages.
Transistors and Diodes: These components are often contained in a small
plastic package. The connections are made via leads which emanate from the
package and are bend so that they touch the board. The leads are always used
for these packages. In this way it is easy to identify which way round the device
must go.
Integrated circuits: There is a variety of packages which are used for
integrated circuits.
The package used depends upon the level of interconnectivity required.
Many chips like the sample logic chips may only require 14 or 16 pins, whereas
other likes the VLSI processors and associated chips can require up to 200 or
more. In view of the wide variation of requirements there is a number of different
packages available.
For the smaller chips, packages such as the SOIC (Small Outline Integrated
Circuit) may be used. These are effectively the SMT version of the familiar DIL
(Dual In Line) packages used for the familiar 74 series logic chips. Additionally
there are smaller versions including TSOP (Thin Small Outline Package) and
SSOP (Shrink Small Outline Package).
The VLSI chips require a different approach. Typically a package known
as a quad flat pack is used. This has a square or rectangular footprint and has
pins emanating on all four sides, Pins again are bent out of the package in what
is termed a gull-wing formation so that they meet the board. The spacing of the
pins is dependent upon the number of pins required. For some chips it may be
as close as 20 thousandths of an inch. Great care is required when packaging
these chips and handling them as the pins are very easily bent.
Other packages are also available. One known as a BGA (Ball Grid Array)
is used in many applications. Instead of having the connections on the side of the
package, they are underneath. The connection pads have balls of solder that
melt during the soldering process, thereby making a good connection with the
board and mechanically attaching it. As the whole of the underside of the package
can be used, the pitch of the connections is wider and it is found to be much
more reliable.
A smaller version of the BGA, known as the micro BGA is also being used
for some ICs. As the name suggests it is a smaller version of the BGA.
7.5 SMT in Use
SMT is used almost exclusively for the manufacture of electronic circuit
boards these days. Now it is found that SMDs are far more widely used than
traditional leaded components, and as a result, traditional leaded components
are considerably less common. Some components, particularly high density ICs
may only be available in SMT packages. While there is still a need for many
traditional components, SMDs now form the main line stream for components.
7.6 SMT/SMD Component Packages
Surface Mount Technology (SMT) components come in a variety of
packages. The different SMT packages can be categorized by the type of
component, and there are standard packages for each.
7.7 Passive Rectangular Components
These SMT components are mainly resistors and capacitors which form
the bulk of the number of components used. There are several different sizes
which have been reduced as technology has enabled smaller components to be
manufactured and used.
1812 4.6 x 3.0 0.18 x 0.12

1206 3.0 x 1.5 0.12 x 0.06
0805 2.0 x 1.3 0.08 x 0.05
1603 1.5 x 0.8 0.06 x 0.03
0402 1.0 x 0.5 0.04 x 0.02
0201 0.6 x 0.3 0.02 x 0.01
Of these sizes, the 1812 , and 1206 sizes are now only used for specialized
components or ones requiring larger levels of power to be dissipated. The 1603
and 0402 SMT sizes are the most widely used.
7.8 Tantalum Capacitors SMD Packages

As a result of the different construction and requirements for tantalum SMT
capacitors, there are some different packages that are used for them. These
conform to EIA specifications.
Size A 3.2 x 1.6 x 1.6 EIA 3216-18
Size B 3.2 x 2.8 x 1.9 EIA 3528-21
Size C 6.0 x 3.2 x 2.2 EIA 6032-28
Size D 7.3 x 4.3 x 2.4 EIA 7343-31
Size E 7.3 x 4.3 x 4.1 EIA 7343-43
7.9 Semiconductor SMC Packages

There is a wide variety of SMT packages used for semiconductors including
diodes, transistors and integrated circuits. The reason for the wide variety of
SMT packages for integrated circuits results from the large variation in the level
of interconnectivity required. Some of the main packages are given below.
7.10 Transistor Packages
SOT-23 – Small Outline Transistor. This is SMT package has three terminals
for a diode of transistor, bit it can have more pins when it may be used for small
integrated circuits such as an operational amplifier, etc. It measures 3 mm x 1.75
mm x 1.3 mm.
SOT-223 – Small Outline Transistor. This package is used for higher power
devices. It measures 6.7 mm x 3.7 mm x 1.8 mm. There are generally four
terminals, one of which is large heat-transfer pad.
7.11 Integrated Circuit SMD Packages
SOIC – Small Outline Integrated Circuit. This is a dual in the configuration
and gull wing leads with a pin spacing of 1.27 mm.
TSOP – Thin Small Outline Package. This package is thinner than the SOIC
and has a smaller pin spacing of 0.5 mm.
SSOP – Shrink Small Outline Package. This has a pin spacing of 0.635
mm.
TSSOP – Thin Shrink Small Outline Package.
PLCC – Plastic Leaded Chip Carrier. This type of package is square and
uses 3-lead pins with a spacing of 1.27 mm
 QSOP – Quarter Size Small Outline Package. It has a pin spacing of
0.635 mm.
 VSOP – Very Small Outline Package. This is smaller than the QSOP
and has pin spacing of 0.4, 0.5 or 0.65mm.
 LQFP – Low Profile Quad Flat Pack. This package has pins on all four
sides. Pin spacing varies according to the IC, but the height is 1.4mm.
 PQFP – Plastic Quad Flat Pack. A square plastic package with equal
number of gull wing style pins on each side. Typically narrow spacing
and often 44 or more pins. Normally used for VLSI circuits.
 CQFP – Ceramic Quad Flat Pack. A ceramic version of the PQFP.
 TQFP – Thin Quad Flat Pack. A thin version of the PQFP.
 BGA – Ball Grid Array. A package that uses pads underneath the
package to make contact with the printed circuit board.
Before soldering the pads appear as solder balls, giving rise to the name.
By placing the pads underneath the package there is more room for them, thereby
overcoming some of the problems of the very thin leads required for the quad
flat packs. The ball spacing on BGA is typically 1.27 mm.
7.12 SMD Package Applications
SMT surface mount technology packages are used for most printed circuit
designs that are going to be manufactured in any quantity. Although it may appear
there is a relatively wide number of different packages, the level of standardization
is still sufficiently good. In any case it arises mainly out of the enormous variety
in the function of the components.
7.13 SMD Resistor and its Construction
Surface Mount Device, SMD, resistors are the most widely used electronic
component. Everyday millions are used to produce the electronic equipment
from cell phones to televisions and MP3 players and commercial communications
equipment to high technology research equipment.
SMD resistors are rectangular in shape. They have metallised areas at either
end of the body of the SMD resistor and this enables them to make contact with
the printed circuit board through the solder. The resistor itself consists of a ceramic
substrate and onto this is deposited a metal oxide film. The thickness, and the
length of the actual film determines the resistance. In view of the fact that the
SMD resistors are manufactured using metal oxide, means that they are quite
stable and usually have a good tolerance.
7.14 SMD Resistor Packages
SMD resistors come in a variety of packages. As the technology has moved
forward so the size of the resistor packages has fallen. The main packages with
their sizes are summarized below:
2512 6.3 x 3.1 0.25 x 0.12
2010 5.00 x 2.60 0.20 x 0.10
Fig 7.5
1812 4.6 x 3.0 0.18 x 0.12
1210 3.20 x 2.60 0.12 x 0.10
1206 3.0 x 1.5 0.12 x 0.06
0805 2.0 x 1.3 0.08 x 0.05
0603 1.5 x 0.08 0.06 x 0.03
0402 1.0 x 0.5 0.04 x 0.02
0201 0.6 x 0.3 0.02 x 0.0
Fig 7.3
MLP package 28-pin chip, upside down to show the size
0 1 2 3 4
Various SMD chips, desoldered
0 1 2 3 4
SMD capacitors (on the left) with two through
Fig 7.5
7.15 SMT Soldering Process

There are several stages required to solder SMDs to boards. However
there are two basic methods of soldering that are used. These two processes
require the board to be laid out with slightly different PCB design rules, and they
also require the SMT soldering process to be different. The two main methods
for SMT soldering are:
 Wave Soldering
 Reflow Soldering
Reflow Soldering is the most widely used method of soldering used with
PCB assembly whether it is used for mass production or for prototype PCB
assembly with surface mount components. The technology uses two main stages.
First a solder paste is applied to the board, and then secondly the board is
heated to enable the solder to melt. This stage in itself has several steps that are
needed to ensure that the board is heated and cooled correctly.
Using Reflow Soldering technology it is possible to reliably solder surface
mount components, and particularly those with very fine pitch leads. This makes
it ideal for use with components used in mass produced electronics products.
7.16 Soldering Stations

One of the major elements that is always required in any electronics
production or PCB assembly area is the ability for rework. There will always be
board failures and as a result, components need to be removed and replaced.
This needs to be done using skill and the right equipment so that no damage is
caused. While de-soldering tools are helpful a full solder station is an essential
item. The solder station comprises equipment for solder and de-soldering. The
de-soldering elements of the solder station normally comprise a heated element
with a central hole that is connected to a vacuum pump. In this way the solder
station can be used to effectively apply heat and remove the solder from the
joint. This means that a solder station will be the most effective way of ensuring
that any network is undertaken with the minimum of risk to the board.
Summary
1. Surface-Mount Technology (SMT) is a method for constructing
electronic circuits in which the components are mounted directly onto
the surface of printed circuit boards (PCBs).
2. SMT Offers many advantages such as low cost, better performance,
greater component density, faster assembly etc.
3. The main disadvantage of SMT is its initial cost and the time of setting
up for production.
4. The various SMT components include passive components like resistors,
capacitors, coils and active component like transistors and ICs.
5. SMT is used almost exclusively for the manufacture of electronic circuit
boards these days.
6. The two main methods for SMT soldering are: 1. Wave soldering and
2. Reflow Soldering.
7. The solder station can be used to effectively apply heat and remove the
solder from the joint. This means that a solder station will be the most
effective way of ensuring that any network is undertaken with the minimum
of risk to the board.
1. What is surface mount technology?
2. What are the advantages of SMT?
3. Write the disadvantages of SMT?

4. Give some examples of semiconductor SMD Packages?
5. Mention the methods of SMD Soldering?
6. What is the use of Soldering station?
1. Give an idea of Surface Mount Technology?
2. Write the advantages and Disadvantages of Surface Mount Technology?
UNIT 8
Batteries and Cells
Learning Objectives
• The difference between primary and secondary cells.
• Applications of batteries
• The resultant voltage and current in series and parallel grouping of cells.
• The constructional details and working of lead acid cell, nicket iron cell
and nickel cadmium cells.
• The indications of a fully charged cell and their maintenance
• Maintenance free batteries and button cells.
8.1 Introduction
Batteries are extensively used as a power source in all portable electronic
equipment. They can produce electrical (D.C) power at the expense of chemical
energy.
Cell and Battery
A cell is a single unit whereas a battery is a group of cells.
8.2 Primary Cells

A cell is which chemical action is not reversible is called a primary cell. E.g.
voltaic cell, Daniel Cell, Lechlanche Cell, dry cell etc. In other words, we can’t
recharge them when completely discharged.
8.3 Secondary Cells
A cell in which chemical action is reversible is called secondary Eg. Nickel
Iron Cell, Nickel Cadmium Cell, Lead Acid Cell etc. In other words, we can
recharge them when completely discharged.
8.4 Types of Storage Cells
1. Lead Acid Cells.
2. Nickel Iron Cells.
3. Nickel Cadmium Cells.
4. Mercury Cadmium Cells.
5. Lithium-ion Cells.
6. Sodium/Sulphur Cells.
7. Nickel Zinc Cells.
8. Iron Silver Cells
9. Manganese – Titanium (Lithium) Cells.
10. Redore (Liquid Electrode) Cells.
8.5 Applications of Batteries
a. They are used is private generating plants both for industrial and domestic
use.
b. They are used for Petrol Motor Car starting and ignition etc.
c. They are used in U.P.S and Inverters.
d. They are used in telephone exchanges, Radio broadcasting stations
to energize the electronic systems during power interruption.
e. Batteries are extensively used as an emergency power supply in Banks,
Theatres and Hospitals where continuous supply is absolutely essential.
f. They are used in remote rural areas where there exists no power lines.
8.6 Cells In Series

In the series combination of cells, the positive terminal of one cell is connected
to the negative terminal of the other cell, and so on. In this case, the voltages add
up. Thus if we connect four 1.5v cell in series, the total voltage of the series
combination would be bv.
+. . . .
1.5V
+
1.5V
+
1.5V
+
1.5V
+
6V
- - - - -
Fig 8.1
8.7 Cells in Parallel

In a parallel combination of cells all the positive terminals are connected to
each other and all the negative terminals are connected to each other. In this
case, the total voltage of the parallel combination would be equal to single cell
voltage.
Fig 8.2
It should be remembered that in a series combination, the current rating of

the combination does not increase. The current rating of the combination is
equal to the current rating of the weakest cell. But in parallel combination, current
rating increases but the voltage rating remains the same as for one cell. In order
to increase the current and voltage ratings, the cells may be connected in series-
parallel combination.
8.8 Lead Acid Cell

The active materials are
a. Lead-Peroxide (Pbo2) is used as positive plate or anode which has
chocolate brown colour.
b. Lead (pb) is used as negative plate which has grey colour
c. Dilute Sulphuric Acid (H2SO4) with a specific gravity of 1.28 is used as
an electrolyte.
8.9 Chemical Changes, During Discharging
When the cell discharges, it sends current through the external load.
Then H2SO4 is dissociated into positive H2 and negative SD4 ions. As the
current within the cell is flowing from cathode to anode, H2 ions move to the
cathode.
Pbo4 + H2 + H2SO4 à PbSO4 + 2H2O
At the cathode, (Pb) SO4 combines with it to form Ph SO4.
Pb + SO4 à Pb SO4
It will be noted that during discharging.
1 Both the plates are converted into lead sulphate (PbSO4) which is whitish
in colour.
2 With the bornation of water, the specific gravity of the acid falls to about
1.18.
3 Cell voltage decreases to about 1.8V.
4 The cell gives out energy.
8.10 Chemical Changes during Charging
When the cell is recharged, the H2 ions move to cathode and SO4 ions to
anode and the following changes take place.
At Cathode: Pbo4 + H2 à Pb + H2SO4
At Anode: Pbo4 + 2H2O à PbO2 + 2H2O4
Hence, the anode and cathode again become PbO2 and pb respectively.
It will be noted that during charging.
1 The anode becomes dark chocolate brown in colour (PbO2) and cathode
becomes grey metallic lead (Pb).
2 Due to consumption of water, the specific gravity of H2SO4 is increased
to about 1.28.
3 There is a rise in voltage to about 2V.
4 Energy is absorbed by the Cell.
8.11 Specifications of Storage Batteries
The following specifications are to be considered while selecting a storage
battery.
1 Cell voltage in volts and Amp-hour capacity.
2 Power/weight in wats/kg.
3 Energy/weight in wh/kg.
4 Charge/discharge efficiency in percentage.
5 Self discharge rate in % per month.
6 Life period in years.
7 Conversion efficiency.
8 Storage capacity in Ampere-hour.
8.12 Indications of a Fully Charged Cell
Voltage: During charging, the terminal potential of a cell increases and
provides an indication to its state of charge. A fully charged lead acid cell has a
terminal voltage of about 2 volts.
(i) Specific Gravity: The specific gravity of the electrolyte of a fully charged
lead acid cell is about 1.28. This can be measured by means of hydrometer.
(ii) Gassing : When the cell is fully charged, the charging current result is
that hydrogen is given off at the cathode and oxygen at the anode. The process
is being known as gassing and it will give another indication of a fully charged
cell.
(iii) Colour of Plates: When the cell is fully charged, the positive plate
gets converted into Pbo2 (chocolate brown) and the negative plate to spongy
lead (grey).
8.13 Maintenance of Lead Acid Cells

1. It should not be left in discharged condition for long.
2. Keep the top of the batteries clean and dry.
3. The level of the electrolyte should always be 10 to 15 mm above the
top of the plates.
4. Discharging should not be prolonged after the minimum value of the
voltage for the particular rate of discharge is reached.
5. Do not charge the battery at a high rate.
6. Do not short circuit the battery.
8.14 Nickel Iron Cell or Edison Cell
The active materials of a Nickel Iron Cell are
1. Nickel Oxide (Ni2 O3) is used as the positive plate.
2. Iron (Fe) is used as the negative plate and
3. 21% solution of potassium hydroxide (KoH) with a small amount of
lithium added is used as an electrostate.
4. When the cell is discharged the positive plate is reduced to lower oxide
of nickel (i.e. nio) and the negative plate is reduced to iron oxide (FEO).
When the cell is recharged, the chemical process is reversed that ispositive
plate is converted into Ni2 o3 and the negative plate to Fe.
The equation of the chemical action is under
Ni2O3+2KOH+Fe Discharge 2Nio+2KOH+Feo
The emf of a nickel cell is about 1.2v when the cell is about 1.2v when
charge falls to 0.9v when discharged. Since there is no change is the specific
gravity of the electrolyte during charging and discharging a voltemeter may be
employed to check whether the cell is charged upto its rated voltage.
8.15 Nickel cadmium cell
The active materials of the nickel cadmium cell are
1. Ni(OH) is used as positive plate.
2. Cadmium (cd) is used as negative plate.
3. 21% solution of potassium hydrochloride (KOH) with a small amount of

lithium added is used as an electrolyte.
Chemical Changes
The electrolyte is split into K ions and negative OH ions. The chemical
reactions at the two plates are as under.
During discharge
At anode Ni(OH)c
At cathode Cd+(2H)2+2k=CD+2KOH
The above reaction can be expressed by following reversible equation
NI(oh)4+koh+cd Ni(OH)2+KOH+CD(OH)2
The emf of nickel cadmium cell is about 1.2v when charged and falls to
1.1v when discharged. A vott meter may be employed to as certain whether the
cell is charged upto its rated voltager or not.
8.16 Comparison of nickel iron nickel cadmium and lead
acid cells.
S.No. Paraneter Lead Acid Nickel Iron Nickel Cadmium

1. Anode Pbo2, lead Nickel hydrox- Nickel hydrox-
peroxide ide Ni(OH)4 ide Ni(OH)4
or Nio2
2. Cathode sponge lead pb Iron (Fe) Cadmium(cd)
3. Electrolytic Diluted KOH KDH
4. Internal Comparatively High Higher
resistance Low
5. Cost Low High Higher
6. Life Cives nearly Five years Life upto 20
1250 charges years canbe
and discharges expected
7. Average 2 v/cell 12 V/cell 12 V/Cell
e.m.f.
8. Efficiency 90-95% 80% 90%
8.17 Maintenance free batteries

Maintenance free batteries come from factory under sealed condition
however initial charges can be done by the supplier before marketing. These
batteries do not require pouring of distilled water by opening the top knobs.
The maintenance free batteries also called “sealed maintenance free
batteries” which are primarily designed and used for slow charges and discharges.
They need not higher charging currents have than the conventional type batteries.
The main disadvantage of maintenance of free batteries is its higher initial
costs. They are extensively used in systems, inverters, emergency lights, railway
signaling systems, telecommunications.
8.18 Miniature button cells
A miniature battery defined as a small round battery whose diameter is
greater than its height. Miniature batteries can either be button shaped or coin
shaped. These cells generally have diameters ranging from less than millimeters
to about 25 millimeters and heights ranging from less than 1 mm to 15mm.
These button cells are used in toys, hearing aids, buttons, mobiles etc. The
alkaline type silver oxide, zinc and lithium type button cells are commonly used
type of buttons cells.
Summary
1. A cell is a source of emf in which chemical energy is converted into
electrical energy.
2. A cell is a single unit where a battery is a group of cells.
3. A cell is which chemical action is not reversible is called primary cell. Eg:
Dry and voltaic cell.
4. A cell in which chemical action is reversible is called a secondary cell.
Eg: Dry and voltaic cell etc.
5. In series grouping of cells the voltages added up by current rating
is equal to the rating of single cell.
6. In parallel grouping of cells the total voltage is equal to the voltage of
the single cell and current ratings increases.
7. The active materials of the lead acid are pbo2 for anode. Pb for cathode
and dilute H2So4 for electrolyte.
8. The indications of a fully charged lead cell are traced by means of it’s a)
voltage b) specific gravity c)colour of plates d) gassing
9. In alkaline cells the specific gravity of the electrolyte does not change
during charging and discharging.
10. Button cells are miniature type cells used in toys hearing aids etc.
1.What is the difference between a cell and a battery?
2. Distinguish between primary and secondary cells?
3. Write the applications of batteries?
4. What are the active materials contained in the lead acid cell?
5. Write the different types of batteries used in daily life?
6. Write some important specifications of storage batteries?
7. Give the indications of fully charged cell?
8. What precautions should be taken to enhance the life of lead acid battery?
9. Determine the total voltage in the given grouping of cells?
1.5V 1.5V 1.5V 1.5V
a) b)
1.5V
1.5V 1.5V
1.5V
1.5V 1.5V
c)
1.5V 1.5V
10. What are maintenance free batteries?

1. Explain in detail about the constructural details and working of lead acid
cell with necessary sketches?
2. Give the constructural details and working of nickel iron cell?
3. Describe the constructural details and working of nickel cadmium cell?
4. Compare lead acid cell, nickel iron cell and nickel cadmium cell?
UNIT 9
Microphones and
Loud Speakers
Learning Objectives
• Microphones and their specifications
• Classification of microphones
• Constructional details and working of carbon, moving coil, condender,
crystal and ribbon microphones
• Constructional details and working of PMMC loud speaker
• The need for baffle and their types.
9.1 Introduction
Microphones and Loud Speakers are used as input and output devices
in electronic units like Amplifiers, Receivers and Transmitters. These are also
known as Transducers. Transducers are the devices which converts one type of
energy in to another form. For example microphone converts sound signal into
corresponding electrical signal. Similarly loudspeaker converts electrical signal
into corresponding sound waves. This chapter deals with the principles involved
in various microphones and loudspeakers their construction working and
applications.
9.2 Microphones
Microphones is acoustic transducer which converts sound pressure
variations into electrical signals of the same proportions as in pressure variations.
Its circuit symbol is represented as shown in fig 9.1
Fig 9.1
9.3 Specifications
Microphones can be specified using the following characteristics. They are
1. Sensitivity
2. Signal to noise ratio
3. Frequency response
4. Output Impedance
5. Non-linear distortion
6. Directivity.
9.4 Familiarization of Different Microphones
Microphones are familiar according to their manufacturing. These are
1. Moving Coil Microphone (or) Dynamic Microphone.
2. Ribbon Microphone
3. Carbon Microphone
4. Condenser Microphone
5. Crystal Microphone.
9.5 Different Types of Microphones based on Impedance
Based on impedance among these conductor and crystal microphones are
high impedance microphones, carbon has medium impedance, Ribbon and
moving coil has lowest impedance. The impedance values of different
microphones are shown in below table.
Name of the Microphone Moving Ribbon Carbon Crystal Condenser

Impedance 25 0.25 100 1M 100M
9.6 Different Type of Microphones based on Polar

Characteristics
Polar characteristics are also known as directivity. Generally there are three
types of directivities are existing. These are
1. Omini Directivity.
2. Figure of eight or Bidirectional Directivity.
3. Cardiod or Heart Shaped Directivity.
1. Omini Directivity
If a microphone receives signals from all directions then it is known omini
directivity. Graphically this is represented as a circle as shown in below fig 9.2.
Ex. Moving Coil, Crystal, Condenser and Carbon Microphone are omini
directional microphones.
Fig 9.2
2. Bidirectional Directivity
If a microphone pick ups or receives signals only in opposite directions
then such type of microphone is known as bidirectional microphone. Ex. Ribbon
microphone has Bidirectional Directivity. Polar diagram of Bidirectional directivity
in shown in fig 9.3.
Fig 9.3
3. Cardial or Hearted shaped directivity

In order to get the best frequency and noiseless output sometimes omini
directional microphone is connected in series with a bidirectional microphone.
This type of connection gives a heart shaped polar characteristics. This is shown
in the below fig 9.4
Fig 9.4
9.7 Microphones and their working principles

Each microphone works with a different principle. These are as follows:
1. Moving call microphone: Moving coil microphones works on
electromagnetic induction.
2. Ribbon microphone: It works on the same principal as in above i.e. on
electromagnetic induction.
3. Carbon Microphone: Carbon Microphone works on the principle of
Resistance.
4. Condenser Microphone: Condenser Microphone works on the
principle of Capacitance.
5. Crystal Microphone: Crystal Microphone works on the principle of
“Piezeo Electric Effect”.
9.8 Moving Coil Microphone (or) Dynamic Microphone
Principle
Moving coil microphone uses the principle of electro magnetic induction.
When sound pressure variations moves a coil placed in magnetic field there is a
change of magnetic flux passing through the coil an emf is therefore induced in
the coil and thus emf forms output of the microphone.
Construction
The construction detail of the microphone is shown in fig 9.5. The main
components of a moving coil microphone are magnet, diaphragm and coil. The
magnet is a permanent magnet with a south pole as central pole piece and North
Pole as peripheral pole piece. This type of magnet gives uniform magnetic field
in the gap between the pole pieces. Diaphragm is of non-magnetic material and
is light weight. It is fixed to the body of the magnet with the help of springs coil
is wound on card board cylinder which is attached to the diaphragm. The coil is
single layered enameled wire. A protective cover is used to save the delicate
diaphragm and coil assembly from being mishandled. A silk cloth partition is
used to separate the upper chamber from the lower chamber. A small tube is
used in the lower chamber to give access to the free atmosphere.
Protective
Coil
Spring
Pole piece
Fig 9.5
Working
When sound waves strike the diaphragm it moves and hence coil moves in
and out in the magnetic field. This motion changes the flux through the coil which
results in emf being produced in the coil due to electromagnetic induction. The
value of emf depends on the rate of change of flux and hence on the motion of
the coil. The displacement of the coil depends on the pressure of sound waves
on the diaphragm. Thus this microphone induces more voltage. The induced
voltage is the faithful replica of the sound pressure variation.
Specifications
1. Sensitivity: 30 Micro Volts
2. S/N Ratio: 30 db
3. Frequency Response: 60Hz – 8KHz.
4. Distortion less than 5%
5. Output Impedance = 25 ohms.
Applications
These are widely used in PA System and in broad cast studios.
9.9 Ribbon Microphone

Principle
Ribbon Microphone also works on the Principle of electromagnetic
induction. In this microphone we can increase the high frequency response by
using light aluminium ribbon instead of using diaphragm and coil assembly. Here
ribbon acts as a conductor as well as a diaphragm.
Output Terminals
Ribbon Foil
Built-in matching
transformer
Permanent magnet with pole
pieces extended
Fig 9.6 Ribbon Microphone
Construction
The main parts of ribbon microphone are permanent magnet and ribbon
conductor. The permanent magnet is a specially designed horse shoe magnet
with extended pole pieces. It provides strong magnetic field. These are shown
in the fig 9.6.
The ribbon is a light aluminium foil. It is corrugated at right angles to its
length to provide greater surface area. It is suspended in the magnetic field of
the permanent and the stiffness of suspension is small. The whole unit is enclosed
in a circular or rectangular baffle. The shape of the baffle is not purely circular or
rectangular, but is rather irregular and depends on the structure of the magnet.
Working
When the ribbon placed in a magnetic field is made to move at right angles
to the magnetic field by the force of sound pressure there is a change of magnetic
flux through the ribbon conductor. Due to this change of magnetic flux an emf is
induced across the ribbon. This emf is proportional to the rate of change of flux
which is proportional to the force of sound waves striking the ribbon. It is also
called pressure gradient microphone or Velocity Microphone.
Applications
It is very suitable for dramas due to its figure of eight polar diagram.
9.10 Carbon Microphone

Principle
When the fine carbon granules enclosed in a case are subjected to variation
of pressure the resistance of granules changes. When such device of carbon
granules is connected in series with a load through a d.c. supply the current
through the load will vary in accordance with pressure variations on the carbon
granules.
Construction
The construction of a carbon microphone is shown in below figure 9.7.
Fine carbon granules are enclosed between two metal plates. The upper plate is
attached to a movable metal diaphragm through a metal piston or plunger. The
lower metal plate is fixed and is insulated from the diaphragm. A protective
cover with holes is used to protect the unit.
Protective Cover
Metal Diaphragm
Metal Piston
Metal valve
Metal plate Fine Carbon granules
Metal case
Output
Insulator
Carbon Microphone
Battery Tra nsformer
Fig 9.7 Carbon Microphone
A battery is connected between two metal plates. When load is connected

current flow through the carbon granules and the load. The path of current is
shown by arrows. The output is obtained through a transformer to eliminate d.c.
content of the microphone output.
Working
When sound waves strike the diaphragm it moves to and fro. During
compression condition it presses the carbon granules and during rarefaction it
loosens them. When carbon granules are passed the resistance decreases and
hence the current though the circuit increases. When carbon granules loosen,
the resistance increases decreasing the current through circuit. In the absence of
sound a steady current flow through the circuit. Thus sound waves superimposes
a varying current or audio current on the steady d.c. current.
The net resistance of the carbon granules is given by

Rt = Ro + är where Rt = net resistance in ohms.
Ro = Steady resistance in ohms for no sound.
δr = Variation of resistance due to sound pressure.
The development of Voltage V across a load resistance RL is given below.
If E is battery voltage and RL is the load resistance the current I in RL will be
given by
E
I=
RO +r + RL
Thus the voltage of the load is the faithful replica of the sound pressure
variations.
Characteristics or Specifications
Sensitivity = 20 dB(100mV)
S/N Ratio = Poor
Frequency Response = 200 to 5 KHz.
Distortion = 10%.
Directivity = Omini
Output impedance = 100 ohms.
Applications
Due to limited frequency range it is useful only in Telephones. It is also
sometimes useful in radio communications sets.
9.11 Condenser Microphone
Principle
When capacitance of a capacitor changes the charge on the capacitor tends
to remain the same and hence voltage changes in accordance with equation V =
q/C. The above equation shows that if C increases V will decrease and if C
decreases V will increase.
Diaphragm of the microphone acts as one plate of the condenser. The
other plate called back plate is fixed. When sound pressure moves the diaphragm
in the capacitance increases and when it moves out the capacitance decreases.
The change in capacitance results in change in voltage.
Metal Diaphragm Spring
Metal back
plate
Supporting
fixtures
Insulator Voltage input
Fig 9.8 Condensor Microphone
Condenser microphone is shown in the above fig 9.8. It consists of a light

weight metal diaphragm, which is suspended above a fixed metal back plate.
The two metals form the two plates of a capacitor. The diaphragm is the movable
plate and the back plate is a fixed plate. A fixed dc voltage of about 200V is
applied between the back plate and the movable plate. The diaphragm is in
stretched condition as it remains attached to the supporting fixtures with the help
of spider springs. The two plates are insulated from each other.
Working
When sound waves strike the diaphragm it moves. During compression
waves it moves towards the fixed back plate and increases capacitance. During
rarefaction it moves away from the back plate and decreases capacitance. The
change in capacitance changes the d.c voltage across the capacitor plates. The
net voltage Vt at any instant is given by Vt = Vdc + Vac
Where Vt = Instantaneous voltage
Vdc = d.c. bias applied to the condenser plates.
Vac = Audio signal corresponding to the sound pressure variation.
The output of a condenser microphone is quite low and hence high gain
amplifier is built inside the microphone.
Characteristics (Specifications)
Sensitivity = 3mV
S/N Ratio = 40dB
Frequency response = 40 Hz to 15 KHz excellent.
Distortion = 1%
Directivity = Omini
Output Impedance = High 100 M ohms
Applications
1. It is used as standard microphone for calibrating other microphones.
2. It is used in sound level meters.
3. It is used in professional high fidelity recording
9.12 Crystal Microphone
Principle
A crystal microphone is based on the principle of “Piezo electric effect”
which is defined as “Difference of potential between the opposite faces of some
crystals is produced when these are subjected to mechanical pressure”. The
crystals which shows this effect are Quartz, Tourmaline, Rochelsalt and Ceramic.
Spring Spring
Diaphragm
Output termi-
nals
Insulating terminals
Fig 9.9 Crystal Microphone
Construction
The constructional details of Crystal Microphone are shown in the above
fig 9.9. The crystal is cut along certain planes to form a slice. Metallic foil
electrodes are attached to the two surfaces to carry the potential differences to
the output terminals. Two thin crystal slices suitably cut are placed in an insulating
holder with an air space between them. A large number of such elements are
combined and increase an emf. A diaphragm made of aluminium is attached to
the crystal surface through a push rod. The whole unit is encases in a protective
case. There is a protective cover over the diaphragm.
Working
When there is a sound waves of compression it compresses the crystal. In
case of rare fraction converse takes place and the crystal is extended and is
under tension. Due to this compression and extension a varying potential
difference is generated which is proportional to the mechanical pressure applied
to the crystal by the sound waves.
Specifications
S/N Ratio: 40dB
Frequency Response: 100 – 8KHz.
Distortion = < 1%
Directivity = omini directional
Output Impedance = 1M ohm.
Applications
These are used for the following purposes
1. Home recording system
2. Amateur communications
3. Mobile Communications.
9. 13 Loud Speaker
Loudspeaker is a Transducer which converts electrical signals of Audio
frequency to sound waves of the same frequency. Loudspeakers are used as
output devices in Radio Receivers, T.V. Receivers and P.A. systems. According
to construction these are as follows:
1. PMMC Local speakers
2. EMMC Loudspeakers
3. Horn Loud Speakers
4. Head Phones
Further according to frequency reproduced these are classified as follows:
1. Woofer 2. Squeaker 3. Tweeter
The speakers which reproduce low frequencies from 16Hz to 1000 Hz are
called Woofers. The speakers which reproduce high frequencies from 1000Hz
to 20000 Hz are called tweeters. Squeaker is used to reproduce frequencies
from 500 to 5000 Hz. The symbol of Loudspeaker is as shown in fig 9.10.
Fig 9.10
Sl.No Parameter Moving Coil Ribbon Carbon Condenser Crystal
1 Sensitivity 90dB 110dB 20dB 50dB 26dB
2 S/N ratio 30dB 50dB Poor 40dB 40dB
3 FrequencyResponse 60 to8KHz 20 to 12KHz 250 to 5KHz 40 toKHz 100 toKHz
4 Impedance 2.5 0.25 100 100M 1M
5 Distortion 5% 1% 10% 1% 1%
6 Directivity Omini Bidirectional Omini Omini Omin
9.14 Comparison of Microphones
7 Size Big Big Small Big Small

8 Cost Medium High Lowest High
Paper - I Circuit Theory and Electronic Components
Low
139
9.15 PMMC Loudspeaker

Principle
The moving coil loudspeaker works on the principle of interaction between
magnetic field and current in the same way as an a.c. motor works.
A coil called voice coil is placed in a uniform magnetic field when audio
current passes through the voice coil there is an interaction between the magnetic
field and the coil, resulting in the force working on the movable coil. This force
is proportional to the Audio current and hence cases vibratory motion in the
coil, which makes a conical paper diaphragm to vibrate and produce pressure
vibration in air resulting in sound waves.
Shell
Permanent magnet
Po
lepie
Diaphargm
Voice
ces
Ppaer Coone
Term inals
voice coil
Spring
coil
of
Fig 9.11 P.M.M.C Loud Speaker
Construction & Working

The moving coil Loudspeaker consists of a voice coil wound on a card
board or fibre cylinder as shown in fig 9.11. Audio current is fed to it through
two terminals. The coil is placed in a magnetic field. The magnet is a pot type
permanent Magnet which has a central pole and peripheral pole. The magnet is
so shaped as to give strong radial magnetic field in the annular space between
the central and peripheral poles. The voice coil is free to move in the annular
space having strong and uniform magnetic field. Because of the use of permanent
magnet it is also called permanent magnet type speaker. The coil is attached to
a conical diaphragm made of paper. It is called paper cone. The cone is
corrugated having circular corrugation. A flexible strip of rubber around its
periphery is used to support it. The spider springs are used to support the
complete diaphragm and also provide the required stiffness to restrain the motion.
The spiders also keep the coil centered so that the motion is vertical and linear.
Leads from the voice coil are centered to the cone surface. From there these
are brought to the terminals mounted on the metal frame.
When audio current flow through the voice coil placed in a magnetic field a
force equal to BIL newtons act on the coil and moves it to and fro. The paper
cone attached to the coil also moves and causes compression and rarefaction
cycles in the air. Thus audio current is finally converted into sound waves.
Ratings
Different characteristics like power handling impedance frequency response
and directivity etc. are known as rating of loud speakers. These are as follows:
Power Handling : Few mill watts to hundreds of watts.
Impedance : 2 to 32 ohms
Frequency response: 200 Hz – 5000 Hz
Directivity : Omin directional
9.16 Baffles
Rigid flat material used to extend the edges of a loudspeaker cone is called
Baffles. The term Baffle is commonly used for a place surface. A baffle increases
the effective length of the acoustical transmission path between the front and the
back of the radiator.
Necessity of a Baffle
There is air on both sides of the cone, the front as well as the back. Hence
the cone radiates sound from both sides. However when the cone moves forward
there is compression of the air in the front but rarefaction at the back. When the
cone moves backwards compression in the back and rarefaction in the front
occurs. Thus the sound waves produced in the rear air are of opposite phase.
The sound waves from the rear leak round the sides and meet the sound waves
in the front. If the path difference is small as compared to ë/2 the two waves will
almost cancel each other causing response of the speaker to drop off sharply.
When the frequency of radiated waves is low the wavelength is large and hence
the path difference between rear and front sides is quite small. This will allow
low frequency waves to arrive from rear to the front almost 1800 out of phase,
reducing the radiated energy substantially. To save the low frequencies from
attenuation it is necessary to increase the path difference by using a physical
barrier the baffle. This is explained with the fig 9.12 shown in below.
Cone Front Waves

Unit
Waves coming from the back
Fig 9.12
9.17 Types of Baffles

There are four types of Baffles. They are
1. Finite baffle
2. Infinite baffle
3. Enclosure
4. Bass reflex Baffle.
Finite Baffle
The wooden cabinets as in radio receivers or T.V. receivers acts as finite
baffle such baffles being of finite size are not very effective and do cause some
loss of low frequency signals.
Infinite Baffle
An ideal infinite baffle is the one which has infinite lateral dimensions. Such
a baffle will not be feasible. However if battle dimensions are so large that the
frequency at which the path length is ë/2 is far below the lowest frequency to be
used such as baffle can be called infinite baffle. For example let a speaker be
fixed in a hole in the wall or a house.
Encloures
When a loud speaker is mounted in a closed box with an opening in the
front that serves the purpose of infinite baffle because the waves from the back
of the cone will not be able to come to the front side. Such a closed box is called
an enclosure and is shown in below figure 9.13.
Bass Reflex Enclosures
In this system radiation from the back of the cone is used to strengthen the
front radiation rather than weaken it. This design is shown in fig 9.13. Here the
port or cut is so designed that it permits flow of air from the rear to the front with
additional path difference of ë/s. Thus the phase difference between the back
wave coming out from the port and the front wave caused directly by the cone
is 180 + 180 = 3600 and therefore the two waves reinforce each other.
Fig 9.13
9.18 Comparison of Loud Speakers and Headphones

Sl.
No Parameter Loudspeaker Headphone
1. Power They can produce large They can produce small
power. powers
These are small in size
2. Size These are larger in size
compared to headphones. co mpared to less
loudspeaker
3. Cost Costlier Lost Costlier
These are used in Type
4. Applications These are used for Radio
Receivers, TV Receivers, PA Recorders, Walkmans for
systems & in Audio Ckts. The Lower power consumers.
sound produced by loud The sound produced by
speakers are heared by large Headphones are heard by
number of persons at a time. only one or two persons at
a time.
Summary
1. Microphone is an acoustic transducer which converts sound waves into
corresponding electical signals.
2. The important specifications of microphones are (a) sensitivity (b) S/N
ratio (c) frequency response and (d) output impedance.
3. Moving coil microphone works on Faradays laws of electromagnetic
induction. It has better frequency response of 60 Hz to 8 kHz.
4. Ribbon microphone also works on electromagnetic induction. It has an
excellent audio frequency response and its is particularly used for studio
work.
5. Crystal microphone works on the principal of Piezo electrical effect.
6. Loud crystal is a transducer which converts electrical signals into sound
waves.
7. A single loud speaker cannot cover on entire audio frequency range.
Therefore Woofer, Driver and Tweeter speakers are used to cover low,
mid and high frequency ranges.
8. A baffle increases the effective length of the acoustical transmission path
between the front and the back of the radiation path.
1. Define Microphone and Loudspeaker?
2. What is meant by Transducer?
3. What is meant by Piezo electric effect?
4. What are the applications of Microphones and Loudspeaker?
5. Write the ratings of a Loudspeakers?
6. What is meant by Baffle and what are the 3 types?
7. Write the differences between the Loudspeaker and headphone?
8. Classify different types of Microphones?
1. Write the principles construction and working of moving coil microphones.
2. Explain the principles construction and working of Ribbon microphones.
3. Explain the principles construction and working of Carbon microphones.

4. Explain the principles construction and working of Condenser
microphones.
5. Explain the principles construction and working of Crystal microphones.
6. Explain the principles construction and working of PMMC microphones.

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UNIT 1

1.2 The Unit of Resistance

Fig. 1.1 Circuit Symbol of Resistance

Table 1.1 Multiples and submultiples of ohm

1.3 Types of Resistors

(a) Carbon Composition resistors are made by mixing granules of carbon

Fig. 1.2 Carbon Resistors

Fig. 1.3 Wirewound Resisors

Fig. 1.4 Potentiometer

Fixed Variable Variable Tapped

Colour Digit Colour Digit

Fig. 1.8 Colour code chart for Carbon Resistor

Example 2: Find the value of the

Table 1.5 standard values of commercially available resistors.

Ohm (  ) kilo ohms (k  ) Megohms (M )

1.0 10 100 1.0 10 100 1.0 10

1.12 Uses of Resistors

1.15 Resistors in Series

1.16 Resistors in Parallel

Fig. 1.10 Resistors in Parallel

Three resistors, as joined in fig. 1.10 are said to be connected in parallel.

5. Powers are additive.

It is clear that the three resistors are connected in series.

1.17 Factors Affecting the resistance of a material

6. Define specific resistance and write its unit.

Further regarding self inductance,mutual inductance and contruction of

Figure 2.1 Principle of Inducing Voltage and Force

2.2.2 Faraday’s Laws of Electro Magnetic Induction

Putting the above expression in differential form we get e =d(NΦ)/dt

Fig. 2.2 Symbol of Inductance

efficient of self inductance of a coil is defined as the weber-turns per ampere in

Fig. 2.3 Self Inductance

2.4 Factors Affecting the Value of Indutance

5. Distance Between the Turns: Inductance of the coil is inversely

AC Voltage Load Resis-

Fig. 2.4 Mutual Inductance

Mutually induced emf in b due to change of current in

Fig. 2.5 Inductance Connected in Series Aiding

2.8.3 Series Opposing

Thus equation for total inductance in series opposing is L=L1+L2-2M

Fig. 2.6 Inductance connected in Series Opposing

2.9 Inductance in Parallel

Fig 2.7 Inductances Connected in parallel

2.10 Solved Problems

We know that in series Aiding L=L1+L2+2M

Shell type Core type Symbol

Fig. 2.8 Transformer

2. These are used in stabilizers.

Applications: These are used at high frequencies in radio TV and satellite

3. According to Faraday’s second law, the magnitude of the induced e.m.f

13. Write the principle on which transformer works?

Fig. 3.1 Symbol of Capacitor

3.2.3 Dielectric Material

3. Distance between the plates.

This voltage ratio is very important because breakdown of the insulator

3.5 Classication of Capacitors

4. Mica capacitors: In these capacitors mica plates are placed between