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Chip Industry Week In Review
By The SE Staff - 11 Oct, 2024 - Comments: 0

Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

Chip Industry Technical Paper Roundup: Oct. 8
By Linda Christensen - 08 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=365 /] More ReadingTechnical Paper Library home » read more

Government Chip Funding Spreads Globally
By Liz Allan - 07 Oct, 2024 - Comments: 0

This is the first in a series of articles tracking government chip investments. Countries around the world are ramping up investments into their semiconductor industries as part of new or existing approaches. The increased government activity stems from growing awareness of the strategic importance of the chip sector, a desire to avoid a repeat of pandemic-era supply chain issues, and height... » read more

Review Paper: Challenges Required To Bring the Energy Consumption Down in Microelectronics (Rice, UC Berkeley, Georgia Tech, Et al.)
By Technical Paper Link - 06 Oct, 2024 - Comments: 0

A new review article titled "Roadmap on low-power electronics" by researchers at Rice University, UC Berkeley, Georgia Tech, TSMC, Intel, Harvard, et al. This roadmap to energy efficient electronics written by numerous collaborators covers materials, modeling, architectures, manufacturing, metrology and more. Find the technical paper here. September 2024. Ramamoorthy Ramesh, Sayeef Sal... » read more

Research Bits: Oct. 1
By Liz Allan - 01 Oct, 2024 - Comments: 0

Rust-resistant coating for 2D semiconductors Researchers from Pennsylvania State University, National Yang Ming Chiao Tung University in Taiwan, Purdue University, Intel, and the Kurt J. Lesker Company developed a synthesis process to produce a rust-resistant coating with properties ideal for creating faster, more durable electronics. "One of the biggest issues that we see in 2D semiconduct... » read more

Barriers To Chiplet Sockets
By Brian Bailey - 30 Sep, 2024 - Comments: 0

Experts At The Table: Demand for chiplets is growing, but debate continues about whether standards and general-purpose chiplets will kick-start the commercialization boom, or whether success will come through customization of those chiplets. Semiconductor Engineeering sat down to discuss these and other related issues with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technol... » read more

Chip Industry Week In Review
By The SE Staff - 27 Sep, 2024 - Comments: 0

Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027, according to SEMI. Key drivers are the regionalization of semiconductor fabs and the increasing demand for AI chips in data centers and edge devices, with China, South Korea, and Taiwan leading the way. The Biden-Harris Administration launched the National Semiconductor Technology Center’... » read more

Chip Industry Week In Review
By The SE Staff - 20 Sep, 2024 - Comments: 0

Synopsys agreed to sell its Optical Solutions Group to Keysight for an undisclosed amount, in a deal deemed necessary for Synopsys to win regulatory approval for its planned acquisition of Ansys. The sale to Keysight is contingent on the Synopsys-Ansys deal going through. Meanwhile, Ansys has its own optical business. The U.S. Department of Defense (DoD) made the first awards for Microelectr... » read more

How Die Dimensions Challenge Assembly Processes
By Anne Meixner - 19 Sep, 2024 - Comments: 1

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To fully enable a multi-chiplet ecosystem, standardized component handling and interfaces are needed. The underlying concept is similar to LEGO blocks that simply snap together, yet it's nowhere near t... » read more

What Comes After HBM For Chiplets
By Brian Bailey - 18 Sep, 2024 - Comments: 0

Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja... » read more

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