Chiang et al., 2004 - Google Patents
Reflow and burn-in of a Sn-20In-0.8 Cu ball grid array package with a Au/Ni/Cu padChiang et al., 2004
View PDF- Document ID
- 6162100751932248472
- Author
- Chiang M
- Chang S
- Chuang T
- Publication year
- Publication venue
- Journal of electronic materials
External Links
Snippet
The intermetallic compounds formed after reflow and burn-in testing of a Sn-20In-0.8 Cu solder ball grid array (BGA) package are investigated. Along with the formation of the Cu 6 (Sn 0.78 In 0.22) 5 precipitates (IM1) in the solder matrix, scallop-shaped intermetallic …
- 229910000679 solder 0 abstract description 70
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