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Han et al., 2021 - Google Patents

AiP Component and Board Level Heat dissipation Analysis for Automotive Radar

Han et al., 2021

View PDF
Document ID
5639979254852634468
Author
Han Y
Chai T
Lim S
Publication year
Publication venue
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

External Links

Snippet

For mm-wave application, the size of package with antenna becomes very small, which poses critical challenge for heat dissipation issue. The function demand for high performance and higher duty-cycled condition makes the thermal issue even more severe …
Continue reading at oar.a-star.edu.sg (PDF) (other versions)

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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices having separate containers
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    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
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