[go: up one dir, main page]

Ballandras et al., 2012 - Google Patents

High overtone Bulk Acoustic Resonators: application to resonators, filters and sensors

Ballandras et al., 2012

View PDF
Document ID
4970035969956563253
Author
Ballandras S
Baron T
Lebrasseur E
Martin G
Gachon D
Reinhardt A
Lassagne P
Friedt J
Chommeloux L
Rabus D
Publication year
Publication venue
Acoustics 2012

External Links

Snippet

Acoustelectric devices have been used now for several decade to stabilize oscillators, to filter radio-frequency signals or to allow for physical and even chemical detection and measures. Among all the structures that have been developed in that purpose, one has …
Continue reading at hal.science (PDF) (other versions)

Classifications

    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezo-electric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezo-electric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezo-electric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/174Membranes
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezo-electric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezo-electric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezo-electric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/175Acoustic mirrors
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02086Means for compensation or elimination of undesirable effects
    • H03H9/02102Means for compensation or elimination of undesirable effects of temperature influence
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/105Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the BAW device
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02062Details relating to the vibration mode
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/54Filters comprising resonators of piezo-electric or electrostrictive material
    • H03H9/56Monolithic crystal filters
    • H03H9/562Monolithic crystal filters comprising a ceramic piezoelectric layer
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezo-electric or electrostrictive resonators or networks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02Analysing fluids
    • G01N29/022Fluid sensors based on micro-sensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices

Similar Documents

Publication Publication Date Title
US11309861B2 (en) Guided surface acoustic wave device providing spurious mode rejection
US10270420B2 (en) Surface elastic wave device comprising a single-crystal piezoelectric film and a crystalline substrate with low visoelastic coefficients
Kadota et al. High-frequency lamb wave device composed of MEMS structure using LiNbO 3 thin film and air gap
Benetti et al. Growth of AlN piezoelectric film on diamond for high-frequency surface acoustic wave devices
US7609132B2 (en) Hybrid resonant structure
US20150303895A1 (en) Transducer with bulk waves surface-guided by synchronous excitation structures
Ballandras et al. High overtone Bulk Acoustic Resonators: application to resonators, filters and sensors
Di Pietrantonio et al. Guided lamb wave electroacoustic devices on micromachined AlN/Al plates
Kadota et al. 4 and 7 GHz solidly mounted thickness extension mode bulk acoustic wave resonators using 36 Y LiNbO3
CN102084590B (en) HBAR resonator with a high level of integration
Pijolat et al. Large Qxf product for HBAR using Smart Cut™ transfer of LiNbO 3 thin layers onto LiNbO 3 substrate
Kadota et al. 9.5 GHz Solidly Mounted Bulk Acoustic Wave Resonator using Third Overtone of Thickness Extension Mode in LiNbO 3
US20120062068A1 (en) Multi-mode bulk-acoustic-wave resonators
Baron et al. High-overtone bulk acoustic resonator
Strijbos et al. Design and characterisation of high-Q solidly-mounted bulk acoustic wave filters
Lu et al. ZnO piezoelectric devices
Yang et al. Impact of device parameters on performance of one-port type SAW resonators on AlN/sapphire
Ballandras et al. High overtone bulk acoustic resonators built on single crystal stacks for sensors applications
Nakamura Shear-horizontal piezoelectric surface acoustic waves
Kadota et al. Acoustic devices (PAW, SAW, and BAW) using wafer bonding technology
Yantchev et al. Design of high frequency piezoelectric resonators utilizing laterally propagating fast modes in thin aluminum nitride (AlN) films
Gonzalez Impact of Li non-stoichiometry on the performance of acoustic devices on LiTaO3 and LiNbO3 single crystals
Gachon et al. Fabrication of high frequency bulk acoustic wave resonator using thinned single-crystal lithium niobate layers
Thomas et al. High-Q and low TCF HBAR based on LiTaO 3 substrate
Mirea FBAR Devices: Fundamentals, fabrication and applications