Liu et al., 2016 - Google Patents
Improved joint strength with sintering bonding using microscale Cu particles by an oxidation-reduction processLiu et al., 2016
- Document ID
- 3225624785889642855
- Author
- Liu X
- Nishikawa H
- Publication year
- Publication venue
- 2016 IEEE 66th electronic components and technology conference (ECTC)
External Links
Snippet
An improved Cu-Cu joint strength was achieved by a pressureless sintering bonding using microscale Cu particles with an oxidation-reduction process for power device packaging. After the bonding at 300° C in air, Cu2O nanoparticles uniformly formed on the surface of …
- 239000002245 particle 0 title abstract description 90
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