[go: up one dir, main page]

Manaila et al., 1995 - Google Patents

Ti nitride phases in thin films deposited by DC magnetron sputtering

Manaila et al., 1995

Document ID
18291338265280619861
Author
Manaila R
Biro D
Barna P
Adamik M
Zavaliche F
Craciun S
Devenyi A
Publication year
Publication venue
Applied surface science

External Links

Snippet

Ti nitride films were deposited by DC magnetron sputtering on HSS and Si substrates. X-ray diffraction showed the formation of single-phase δ-TiN.(111) texture was found in most films, as well as stacking disorder on (111) planes, both correlated with deposition parameters …
Continue reading at www.sciencedirect.com (other versions)

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021Reactive sputtering or evaporation
    • C23C14/0036Reactive sputtering

Similar Documents

Publication Publication Date Title
Flink et al. Influence of Si on the microstructure of arc evaporated (Ti, Si) N thin films; evidence for cubic solid solutions and their thermal stability
Cemin et al. Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films
US11965234B2 (en) Al-rich AlTin-based films
Greczynski et al. Metal-ion subplantation: A game changer for controlling nanostructure and phase formation during film growth by physical vapor deposition
Zhao et al. Overall energy model for preferred growth of TiN films during filtered arc deposition
Sundgren et al. Mechanisms of reactive sputtering of titanium nitride and titanium carbide III: Influence of substrate bias on composition and structure
Puchert et al. Postdeposition annealing of radio frequency magnetron sputtered ZnO films
Sundgren et al. Mechanisms of reactive sputtering of titanium nitride and titanium carbide II: Morphology and structure
US5472795A (en) Multilayer nanolaminates containing polycrystalline zirconia
US5310607A (en) Hard coating; a workpiece coated by such hard coating and a method of coating such workpiece by such hard coating
Alhafian et al. Comparison on the structural, mechanical and tribological properties of TiAlN coatings deposited by HiPIMS and Cathodic Arc Evaporation
Wong et al. Preparation and characterization of AlN/ZrN and AlN/TiN nanolaminate coatings
Molleja et al. AlN thin films deposited by DC reactive magnetron sputtering: effect of oxygen on film growth
Berger et al. Microstructure of dc magnetron sputtered TiB2 coatings
Ensinger Ion bombardment effects during deposition of nitride and metal films
Sue Development of arc evaporation of non-stoichiometric titanium nitride coatings
Greczynski et al. Extended metastable Al solubility in cubic VAlN by metal-ion bombardment during pulsed magnetron sputtering: film stress vs subplantation
Lee et al. Characteristics of TiN film deposited on stellite using reactive magnetron sputter ion plating
Friesen et al. Ultrahard coatings from Ti-BN multilayers and by co-sputtering
Wu et al. Optimization of deposition processing of VN thin films using design of experiment and single-variable (nitrogen flow rate) methods
Manaila et al. Ti nitride phases in thin films deposited by DC magnetron sputtering
Valvoda Structure of thin films of titanium nitride
Panjan et al. Structural analysis of Zr N and Ti N films prepared by reactive plasma beam deposition
Niu et al. Influence of substrate bias on the structure and properties of ZrN films deposited by cathodic vacuum arc
Oh et al. Two critical thicknesses in the preferred orientation of TiN thin film