Kryliouk et al., 1999 - Google Patents
GaN Substrates: Growth and CharacterizationKryliouk et al., 1999
View PDF- Document ID
- 14923699599490999460
- Author
- Kryliouk O
- Reek M
- Mastro M
- Anderson T
- Chai B
- Publication year
- Publication venue
- physica status solidi (a)
External Links
Snippet
Single crystal GaN substrates were grown by Hydride‐Metal Organic Vapor Phase Epitaxy (H‐MOVPE) on nearly lattice matched LiGaO2 substrates. The key to obtain high quality GaN films on LiGaO2 was the initial surface nitridation step. A self‐separating technique was …
- 229910002601 GaN 0 title abstract description 54
Classifications
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL-GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL-GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- H—ELECTRICITY
- H01—BASIC ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Liu et al. | Substrates for gallium nitride epitaxy | |
Lahreche et al. | Buffer free direct growth of GaN on 6H–SiC by metalorganic vapor phase epitaxy | |
US7435608B2 (en) | III-V group nitride system semiconductor self-standing substrate, method of making the same and III-V group nitride system semiconductor wafer | |
US6440823B1 (en) | Low defect density (Ga, Al, In)N and HVPE process for making same | |
Jang et al. | High-quality GaN/Si (1 1 1) epitaxial layers grown with various Al0. 3Ga0. 7N/GaN superlattices as intermediate layer by MOCVD | |
EP1298709B1 (en) | Method for producing a iii nitride element comprising a iii nitride epitaxial substrate | |
Weeks Jr et al. | Undoped and doped GaN thin films deposited on high-temperature monocrystalline AlN buffer layers on vicinal and on-axis α (6H)–SiC (0001) substrates via organometallic vapor phase epitaxy | |
Ghosh et al. | Reduced-stress GaN epitaxial layers grown on Si (1 1 1) by using a porous GaN interlayer converted from GaAs | |
Parillaud et al. | Localized Epitaxy of GaN by HVPE on patterned Substrates | |
Kryliouk et al. | Large area GaN substrates | |
Kryliouk et al. | Growth of GaN single crystal substrates | |
US6339014B1 (en) | Method for growing nitride compound semiconductor | |
Yamamoto et al. | A comparative study of OMVPE-grown InN heteroepitaxial layers on GaAs (1 1 1) B and α-Al2O3 (0 0 0 1) substrates | |
Wen et al. | Influence of barrier growth temperature on the properties of InGaN/GaN quantum well | |
Kumagai et al. | Growth of thick hexagonal GaN layer on GaAs (111) A surfaces for freestanding GaN by metalorganic hydrogen chloride vapor phase epitaxy | |
Twigg et al. | Nucleation layer microstructure, grain size, and electrical properties in GaN grown on a-plane sapphire | |
Kryliouk et al. | GaN Substrates: Growth and Characterization | |
Koljonen et al. | Growth of high-quality GaSb by metalorganic vapor phase epitaxy | |
Horikawa et al. | Hetero-epitaxial growth of InP on Si substrates by LP-MOVPE | |
Wong et al. | Growth of GaN by gas-source molecular beam epitaxy by ammonia and by plasma generated nitrogen radicals | |
Li et al. | A new buffer layer for MOCVD growth of GaN on sapphire | |
Wu et al. | Investigation of GaN crystal quality on silicon substrates using GaN/AlN superlattice structures | |
Lee et al. | Properties of freestanding GaN substrates grown by hydride vapor phase epitaxy | |
Jang et al. | The influence of AlxGa1− xN intermediate buffer layer on the characteristics of GaN/Si (1 1 1) epitaxy | |
Hemmingsson et al. | Growth of III-nitrides with halide vapor phase epitaxy (HVPE) |