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ZA202106094B - Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipation - Google Patents

Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipation

Info

Publication number
ZA202106094B
ZA202106094B ZA2021/06094A ZA202106094A ZA202106094B ZA 202106094 B ZA202106094 B ZA 202106094B ZA 2021/06094 A ZA2021/06094 A ZA 2021/06094A ZA 202106094 A ZA202106094 A ZA 202106094A ZA 202106094 B ZA202106094 B ZA 202106094B
Authority
ZA
South Africa
Prior art keywords
heat dissipation
copper
manufacturing
tourmaline composite
cpu
Prior art date
Application number
ZA2021/06094A
Other languages
English (en)
Inventor
jing min Zhang
Original Assignee
Chuxin Digital Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuxin Digital Tech Co Ltd filed Critical Chuxin Digital Tech Co Ltd
Publication of ZA202106094B publication Critical patent/ZA202106094B/en

Links

ZA2021/06094A 2019-10-29 2021-08-24 Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipation ZA202106094B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911040560.9A CN110684142A (zh) 2019-10-29 2019-10-29 一种用于cpu散热的蜂窝状固液复合散热材料的制造方法
PCT/CN2019/114312 WO2021081799A1 (zh) 2019-10-29 2019-10-30 一种用于cpu散热的蜂窝状固液复合散热材料的制造方法

Publications (1)

Publication Number Publication Date
ZA202106094B true ZA202106094B (en) 2021-10-27

Family

ID=69114696

Family Applications (2)

Application Number Title Priority Date Filing Date
ZA2021/06094A ZA202106094B (en) 2019-10-29 2021-08-24 Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipation
ZA2021/06093A ZA202106093B (en) 2019-10-29 2021-08-24 Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation

Family Applications After (1)

Application Number Title Priority Date Filing Date
ZA2021/06093A ZA202106093B (en) 2019-10-29 2021-08-24 Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation

Country Status (3)

Country Link
CN (1) CN110684142A (zh)
WO (1) WO2021081799A1 (zh)
ZA (2) ZA202106094B (zh)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2624123B1 (fr) * 1987-12-08 1990-04-06 Atochem Copolymeres piezoelectriques de fluorure de vinylidene et de trifluoroethylene
DE102004026608A1 (de) * 2004-06-01 2005-12-22 Wacker Polymer Systems Gmbh & Co. Kg Nichtblockende Festharze von Vinylester-Mischpolymerisaten
US20100316821A1 (en) * 2009-06-12 2010-12-16 Sunny General International Co., Ltd. Multi-layer films, sheets, and hollow articles with thermal management function for uses as casings of secondary batteries and supercapacitors, and sleeves of secondary battery and supercapacitor packs
CN101735374B (zh) * 2009-12-15 2011-11-09 上海三爱富新材料股份有限公司 一种偏氟乙烯基共聚树脂的制备方法
CN102181168B (zh) * 2011-03-08 2014-01-22 东莞华科电子有限公司 聚合物基复合材料及其制造方法
CN103113668A (zh) * 2013-01-07 2013-05-22 安邦电气集团有限公司 一种高分子基导电复合材料及釆用该复合材料制备自限温伴热电缆的方法
EP2874479B1 (en) * 2013-06-19 2018-08-08 Amogreentech Co., Ltd. Hybrid insulation sheet and electronic equipment comprising same
CN104789194B (zh) * 2014-01-20 2018-11-13 广州贝特缪斯能源科技有限公司 一种储能复合材料及其制造方法
CN105367961A (zh) * 2015-12-04 2016-03-02 太仓苏晟电气技术科技有限公司 一种剥皮机底座
CN105755307B (zh) * 2016-03-21 2017-12-26 中南大学 一种蜂窝状结构增强复合材料及制备方法
CN107760278A (zh) * 2016-08-22 2018-03-06 杜邦公司 用作热界面材料的组合物
CN107585321B (zh) * 2017-08-02 2020-06-30 东南大学 一种偏流板
CN108251072B (zh) * 2018-03-05 2020-08-25 北京科技大学 一种液态金属复合相变材料的制备方法
CN108461463A (zh) * 2018-04-02 2018-08-28 丹阳中谷新材料技术有限公司 一种应用于cpu芯片的石墨烯复合膜

Also Published As

Publication number Publication date
CN110684142A (zh) 2020-01-14
WO2021081799A1 (zh) 2021-05-06
ZA202106093B (en) 2021-10-27

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