ZA202106094B - Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipation - Google Patents
Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipationInfo
- Publication number
- ZA202106094B ZA202106094B ZA2021/06094A ZA202106094A ZA202106094B ZA 202106094 B ZA202106094 B ZA 202106094B ZA 2021/06094 A ZA2021/06094 A ZA 2021/06094A ZA 202106094 A ZA202106094 A ZA 202106094A ZA 202106094 B ZA202106094 B ZA 202106094B
- Authority
- ZA
- South Africa
- Prior art keywords
- heat dissipation
- copper
- manufacturing
- tourmaline composite
- cpu
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title 2
- 239000002131 composite material Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 229940070527 tourmaline Drugs 0.000 title 1
- 229910052613 tourmaline Inorganic materials 0.000 title 1
- 239000011032 tourmaline Substances 0.000 title 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911040560.9A CN110684142A (zh) | 2019-10-29 | 2019-10-29 | 一种用于cpu散热的蜂窝状固液复合散热材料的制造方法 |
PCT/CN2019/114312 WO2021081799A1 (zh) | 2019-10-29 | 2019-10-30 | 一种用于cpu散热的蜂窝状固液复合散热材料的制造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ZA202106094B true ZA202106094B (en) | 2021-10-27 |
Family
ID=69114696
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA2021/06094A ZA202106094B (en) | 2019-10-29 | 2021-08-24 | Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipation |
ZA2021/06093A ZA202106093B (en) | 2019-10-29 | 2021-08-24 | Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ZA2021/06093A ZA202106093B (en) | 2019-10-29 | 2021-08-24 | Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN110684142A (zh) |
WO (1) | WO2021081799A1 (zh) |
ZA (2) | ZA202106094B (zh) |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2624123B1 (fr) * | 1987-12-08 | 1990-04-06 | Atochem | Copolymeres piezoelectriques de fluorure de vinylidene et de trifluoroethylene |
DE102004026608A1 (de) * | 2004-06-01 | 2005-12-22 | Wacker Polymer Systems Gmbh & Co. Kg | Nichtblockende Festharze von Vinylester-Mischpolymerisaten |
US20100316821A1 (en) * | 2009-06-12 | 2010-12-16 | Sunny General International Co., Ltd. | Multi-layer films, sheets, and hollow articles with thermal management function for uses as casings of secondary batteries and supercapacitors, and sleeves of secondary battery and supercapacitor packs |
CN101735374B (zh) * | 2009-12-15 | 2011-11-09 | 上海三爱富新材料股份有限公司 | 一种偏氟乙烯基共聚树脂的制备方法 |
CN102181168B (zh) * | 2011-03-08 | 2014-01-22 | 东莞华科电子有限公司 | 聚合物基复合材料及其制造方法 |
CN103113668A (zh) * | 2013-01-07 | 2013-05-22 | 安邦电气集团有限公司 | 一种高分子基导电复合材料及釆用该复合材料制备自限温伴热电缆的方法 |
EP2874479B1 (en) * | 2013-06-19 | 2018-08-08 | Amogreentech Co., Ltd. | Hybrid insulation sheet and electronic equipment comprising same |
CN104789194B (zh) * | 2014-01-20 | 2018-11-13 | 广州贝特缪斯能源科技有限公司 | 一种储能复合材料及其制造方法 |
CN105367961A (zh) * | 2015-12-04 | 2016-03-02 | 太仓苏晟电气技术科技有限公司 | 一种剥皮机底座 |
CN105755307B (zh) * | 2016-03-21 | 2017-12-26 | 中南大学 | 一种蜂窝状结构增强复合材料及制备方法 |
CN107760278A (zh) * | 2016-08-22 | 2018-03-06 | 杜邦公司 | 用作热界面材料的组合物 |
CN107585321B (zh) * | 2017-08-02 | 2020-06-30 | 东南大学 | 一种偏流板 |
CN108251072B (zh) * | 2018-03-05 | 2020-08-25 | 北京科技大学 | 一种液态金属复合相变材料的制备方法 |
CN108461463A (zh) * | 2018-04-02 | 2018-08-28 | 丹阳中谷新材料技术有限公司 | 一种应用于cpu芯片的石墨烯复合膜 |
-
2019
- 2019-10-29 CN CN201911040560.9A patent/CN110684142A/zh active Pending
- 2019-10-30 WO PCT/CN2019/114312 patent/WO2021081799A1/zh active Application Filing
-
2021
- 2021-08-24 ZA ZA2021/06094A patent/ZA202106094B/en unknown
- 2021-08-24 ZA ZA2021/06093A patent/ZA202106093B/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN110684142A (zh) | 2020-01-14 |
WO2021081799A1 (zh) | 2021-05-06 |
ZA202106093B (en) | 2021-10-27 |
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