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WO2024198420A1 - 显示面板及显示面板的制作方法 - Google Patents

显示面板及显示面板的制作方法 Download PDF

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Publication number
WO2024198420A1
WO2024198420A1 PCT/CN2023/133924 CN2023133924W WO2024198420A1 WO 2024198420 A1 WO2024198420 A1 WO 2024198420A1 CN 2023133924 W CN2023133924 W CN 2023133924W WO 2024198420 A1 WO2024198420 A1 WO 2024198420A1
Authority
WO
WIPO (PCT)
Prior art keywords
display panel
glass substrate
layer
panel body
organic layer
Prior art date
Application number
PCT/CN2023/133924
Other languages
English (en)
French (fr)
Inventor
王德祺
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Publication of WO2024198420A1 publication Critical patent/WO2024198420A1/zh

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10Substrates, e.g. flexible substrates

Definitions

  • the present application relates to the field of display technology, and in particular to a display panel and a method for manufacturing the display panel.
  • OLED Organic Light-Emitting Diode
  • LCD Liquid Crystal Display
  • OLED light-emitting devices adopt a sandwich structure. When current is passed through both ends, electrons and holes are injected into the organic light-emitting layer. Different organic light-emitting materials emit different colors of light under exciton excitation, and thus are applied to various display products.
  • Hybrid OLED has a glass substrate under the panel, so its screen strength is stronger than flexible OLED.
  • the cost of Hybrid OLED is lower than that of flexible screen, so it has great application potential. All panel manufacturers are researching this technology.
  • the biggest disadvantage of Hybrid OLED compared to flexible OLED is that it cannot be made into fixed curved products. For example, double or quadruple curvature can only be achieved using flexible PI (Polyimide) substrates, which limits the application scenarios of Hybrid OLED.
  • the embodiments of the present application provide a display panel and a method for manufacturing the display panel. After the glass substrate and the display panel body are combined, the surrounding areas are flexible and the middle area is rigid, thereby achieving a fixed-bend product while improving the hardness of the module.
  • an embodiment of the present application provides a display panel, including:
  • a display panel body comprising an organic layer disposed on the glass substrate and a thin film transistor layer disposed on the organic layer, wherein at least a portion of an outer edge of the organic layer exceeds an outer edge of the glass substrate;
  • An optical adhesive layer disposed on the display panel body
  • a curved cover plate disposed on the optical adhesive layer
  • a foaming layer is provided on a side of the glass substrate away from the display panel body;
  • a grid adhesive layer disposed between the foaming layer and the glass substrate;
  • the outer edges of the organic layer on two opposite sides exceed the outer edge of the glass substrate; or, the outer edges of the organic layer on all sides exceed the outer edge of the glass substrate.
  • an embodiment of the present application provides a display panel, including:
  • a display panel body comprising an organic layer disposed on the glass substrate and a thin film transistor layer disposed on the organic layer, wherein at least a portion of an outer edge of the organic layer exceeds an outer edge of the glass substrate;
  • An optical adhesive layer disposed on the display panel body
  • the curved cover plate is arranged on the optical adhesive layer.
  • the present application provides a method for manufacturing a display panel, comprising:
  • the display panel body includes an organic layer disposed on the glass substrate
  • the glass substrate within a preset range of the outer edge is removed and peeled off, and the organic layer is completely retained;
  • An optical adhesive layer and a curved cover plate are sequentially attached to a side of the display panel body away from the glass substrate.
  • the method further includes:
  • the junction between the back plate and the glass substrate is sealed with glue.
  • FIG1 is a schematic diagram of the structure of a display panel in an embodiment of the present application.
  • FIG2 is a schematic diagram of the structure of a display panel in an embodiment of the present application.
  • FIG3 is a schematic diagram of the structure of a display panel in an embodiment of the present application.
  • FIG4 is a schematic flow chart of a method for manufacturing a display panel in an embodiment of the present application.
  • FIG5 is a schematic diagram of the structure of a display panel in an embodiment of the present application.
  • FIG. 6 is a schematic flow chart of a method for manufacturing a display panel in an embodiment of the present application.
  • a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them.
  • a first feature being “above”, “above” and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature.
  • a first feature being “below”, “below” and “below” a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
  • an embodiment of the present application provides a display panel, which includes a glass substrate 1, a display panel body 2, an optically clear adhesive layer 3 (OCA) and a curved cover plate 4 (3D CG, 3D Cover glass) arranged in sequence.
  • the glass substrate 1 is used to carry the display panel body 2 and other components to provide rigid support therefor, and each film layer structure of the display panel body 2 is sequentially prepared with the glass substrate 1 as the base.
  • the display panel body 2 is an OLED display module, including an organic layer 21 disposed on a glass substrate 1, and a thin film transistor layer 22 disposed on the organic layer 21.
  • the organic layer 21 has insulating properties and is flexible, for example, a single layer formed of polyimide or a plurality of layers formed by repeatedly stacking polyimide by coating and curing.
  • the thin film transistor layer 22 includes but is not limited to a buffer layer, a semiconductor, a gate, and a source and drain electrode layer.
  • the display panel body 2 also includes a polarizer, a light-emitting layer, etc.
  • the optical adhesive layer 3 is used to attach the curved cover plate 4 to the display panel body 2.
  • the edge of the curved cover plate 4 since the edge of the curved cover plate 4 has a certain curvature, and the glass substrate 1 is a rigid support, it will affect the bonding of the curved cover plate 4. Therefore, at least part of the outer edge of the organic layer 21 exceeds the outer edge of the glass substrate 1, and the edge of the module after the glass substrate 1 and the display panel body 2 are bonded is the flexible organic layer 21.
  • the curved cover plate 4 is bonded to the display panel body 2, a space is provided for the outer edge of the display panel body 2 to bend toward the side of the glass substrate 1, so that the rigid screen Hybrid OLED can also become a fixed curved product.
  • the display panel can be a hyperbolic or quad-curved product, so based on the type of the curved cover plate 4, if the curved cover plate 4 is hyperbolic, the outer edges of the organic layer 21 on the opposite sides of the display panel body 2 exceed the outer edges of the glass substrate 1, and the opposite sides correspond to the curved edges of the curved cover plate 4.
  • the curved cover plate 4 is four-curved, the outer edges of the organic layer 21 of the display panel body 2 are all beyond the outer edges of the glass substrate 1, that is, after the glass substrate 1 and the display panel body 2 are bonded, the module is surrounded by the flexible organic layer 21, and the middle area is a rigid area.
  • the dimension of the outer edge of the organic layer 21 exceeding the outer edge of the glass substrate 1 is determined according to the parameters of the curved edge of the curved cover plate 4 . Generally, the outer edge of the organic layer 21 exceeds the outer edge of the glass substrate 1 by 1-2 mm.
  • the display panel further includes a foaming layer 6Foam and a mesh adhesive layer 5Embo.
  • the foaming layer 6 is disposed on a side of the glass substrate 1 away from the display panel body 2, that is, the display panel body 2 and the foaming layer 6 are respectively disposed on opposite sides of the glass substrate 1.
  • the mesh adhesive layer 5 is disposed between the foaming layer 6 and the glass substrate 1, and the mesh adhesive layer 5 is used to adhere the foaming layer 6 and the glass substrate 1.
  • the glass substrate 1 is a rigid substrate that provides rigid support, and the display panel body 2 is a flexible structure.
  • the glass substrate 1 and the display panel body 2 are combined to form a Hybrid OLED.
  • at least part of the outer edge of the organic layer 21 of the display panel body 2 exceeds the outer edge of the glass substrate 1, and the curved cover plate 4 is bonded to form a curved edge Hybrid OLED.
  • this embodiment is a fixed curved product bonded to the curved cover plate 4, and the glass substrate 1 is a rigid substrate.
  • the glass substrate 1 is thinned, that is, a glass substrate 1 with a smaller thickness is selected.
  • the display panel body 2 is not a separately packaged integrated module, and each functional film layer in the display panel body 2 is prepared on the glass substrate 1 in sequence.
  • the outer edge of the organic layer 21 of the display panel body 2 exceeds the outer edge of the glass substrate 1, and a bending space is provided for the outer edge of the display panel body 2 when the curved cover plate 4 is bonded.
  • the outer edges of the grid adhesive layer 5 and the foaming layer 6 do not exceed the outer edge of the glass substrate 1, so as to avoid that the outer edge of the grid adhesive layer 5 or the foaming layer 6 interferes with the outer edge of the organic layer 21 of the display panel body 2 when the curved cover plate 4 is bonded, thereby increasing the product defective rate.
  • the outer edge of the organic layer 21 of the display panel main body 2 exceeds the outer edge of the glass substrate 1, but at the same time it also causes the outer edge of the organic layer 21 to be easily damaged without the protection of the glass substrate 1.
  • the display panel also includes a back plate 7 (BP, back plate), and the back plate 7 is arranged in the area where the organic layer 21 of the display panel main body 2 does not cover the glass substrate 1, and the back plate 7 and the glass substrate 1 are arranged on the same side of the display panel main body 2, that is, the back plate 7 is arranged on the outer circle of the glass substrate 1, and the back plate 7 and the glass substrate 1 cooperate to support the display panel main body 2, and the back plate 7 provides protection for the area where the display panel main body 2 does not cover the glass substrate 1 to avoid damage to the various film layers of the display panel main body 2.
  • BP back plate
  • the thickness of the back plate 7 is less than the thickness of the glass substrate 1, so that the back plate 7 provides support for the outer edge of the display panel body 2 while retaining sufficient bending space.
  • a sealing glue connection part 8 is provided at the junction of the back plate 7 and the glass substrate 1 to play a role of adhesion and prevent the intrusion of water vapor.
  • the sealing glue connection part 8 is UV glue (shadowless glue). It should be noted that the sealing glue connection part 8 is only provided at the junction of the back plate 7 and the glass substrate 1 to avoid excessive coating on the back plate 7, which will lead to excessive strength increase in the area where the back plate 7 is provided, affecting the bonding of the curved cover plate 4.
  • the outer edge of the glass substrate 1 is peeled off under the premise of ensuring the integrity of the organic layer 21 of the display panel body 2.
  • the surrounding area is flexible with the organic layer 21, and the middle area is rigid, which can not only realize fixed products, but also reduce material costs, increase module hardness, and enhance the quality of the screen.
  • outer edges of two opposite sides of the organic layer extend beyond the outer edge of the glass substrate; or outer edges of four sides of the organic layer extend beyond the outer edge of the glass substrate.
  • the display panel further comprises:
  • a foaming layer is provided on a side of the glass substrate away from the display panel body;
  • the grid adhesive layer is arranged between the foaming layer and the glass substrate.
  • outer edges of the grid glue layer and the foaming layer do not exceed outer edges of the glass substrate.
  • the display panel further includes a back plate, the back plate is disposed in a region of the display panel body not covering the glass substrate, and the back plate and the glass substrate are disposed on a same side of the display panel body.
  • the thickness of the back plate is less than the thickness of the glass substrate, and the thickness direction is the stacking direction from the glass substrate to the curved cover plate.
  • a sealing glue connection portion is provided at the junction of the back plate and the glass substrate.
  • the sealing glue connection portion is configured as UV glue.
  • the top of the sealing glue connection portion does not exceed the end surface of the glass substrate away from the display panel body.
  • the display panel further includes an ink layer disposed between the optical adhesive layer and the curved cover plate, and the ink layer covers a non-display area of the display panel body.
  • the display panel and the method for manufacturing the display panel provided in the embodiments of the present application have at least part of the outer edge of the display panel body extending beyond the outer edge of the glass substrate, and provide space for bending the outer edge of the display panel body when a curved cover plate is attached to the display panel body, so as to realize a fixed-bend product and improve the hardness of the module.
  • the present invention provides a method for manufacturing a display panel, comprising the following steps:
  • a glass substrate 1 is provided, and various functional film layers of a display panel body 2 are sequentially prepared on the glass substrate 1.
  • the display panel body 2 includes an organic layer 21 disposed on the glass substrate 1, and a thin film transistor layer 22 disposed on the organic layer 21.
  • the organic layer 21 has insulating properties and is flexible, for example, a single layer formed of polyimide or a plurality of layers formed by repeatedly stacking polyimide by coating and curing.
  • the thin film transistor layer 22 includes but is not limited to a buffer layer, a semiconductor, a gate, and a source and drain electrode layer.
  • the display panel body 2 also includes a polarizer 23, a light-emitting layer, and the like.
  • the display panel main body 2 can be that all film layers are prepared in step S20 and then the outer edge of the glass substrate 1 is peeled off, or part of the film layers are prepared in step S20, and after peeling off part of the outer edge of the glass substrate 1, part of the film layers of the display panel main body 2 are prepared.
  • This embodiment is not specifically limited.
  • the bonding of the polarizer 23 is set as a separate process. Therefore, after preparing the glass substrate 1 and other film layers of the display panel main body 2 and peeling off the outer edge of the glass substrate 1, the polarizer 23 is prepared.
  • the laser half-cut process is used to cut off the part within the preset range of the outer edge of the glass substrate 1 without damaging the organic layer 21 of the display panel body 2.
  • the display panel can be a hyperbolic or quadruple-curved product. Therefore, based on the type of the curved cover plate 4, if the curved cover plate 4 is hyperbolic, the outer edges of the organic layer 21 of the display panel body 2 on the opposite sides exceed the outer edge of the glass substrate 1, and the opposite sides correspond to the curved edges of the curved cover plate 4.
  • the outer edges of the organic layer 21 of the display panel body 2 on all sides all exceed the outer edge of the glass substrate 1, that is, the module after the glass substrate 1 and the display panel body 2 are bonded is surrounded by a flexible organic layer 21, and the middle area is a rigid area.
  • the size of the outer edge of the corresponding organic layer 21 exceeding the outer edge of the glass substrate 1 is determined according to the parameters of the curved edge of the curved cover plate 4. Generally, the outer edge of the organic layer 21 exceeds the outer edge of the glass substrate 1 by 1-2 mm.
  • the outer edge area of the cut glass substrate 1 (i.e., the glass substrate 1 with a thickness of 1-2 mm at the edge) is irradiated by using the LLO (laser lift-off) technology, so that the portion of the outer edge of the glass substrate 1 within a preset range is separated from the organic layer 21 of the display panel body 2, and then the glass substrate 1 is peeled off.
  • the module components are bonded according to the normal module process flow, for example, the curved cover plate 4 is bonded to the side of the display panel body 2 away from the glass substrate 1 through the optical adhesive layer 3, and a hyperbolic or quadrilateral CG bonding is performed.
  • a foaming layer 6 is bonded to the side of the glass substrate 1 away from the display panel body 2 through a grid adhesive layer 5.
  • the glass substrate 1 is a rigid substrate that provides rigid support, and the display panel body 2 is a flexible structure.
  • the glass substrate 1 and the display panel body 2 are combined to form a Hybrid OLED.
  • the outer edge of the glass substrate 1 within a certain distance is cut and peeled off to provide bending and avoidance space for the outer edge of the display panel body 2 when the curved cover plate 4 is attached.
  • the method further includes:
  • the outer edge of the cut glass substrate 1 is irradiated by the LLO technology, so that the outer edge of the preset range of the glass substrate 1 is separated from the organic layer 21 of the display panel body 2, and then the glass substrate 1 is peeled off.
  • the area where the glass substrate 1 is peeled off on the display panel body 2 is attached to the back plate 7 for protection, that is, the exposed organic layer 21 of the display panel body 2 is attached to the back plate 7 for protection.
  • the thickness direction is the stacking direction from the glass substrate 1 of the display panel to the curved cover plate 4.
  • the thickness of the back plate 7 is less than the thickness of the glass substrate 1, so that the back plate 7 provided provides support for the outer edge of the display panel body 2 while retaining sufficient bending space.
  • UV glue is applied at the junction of the back plate 7 and the glass substrate 1 to form a glue connection part 8, which plays a role of adhesion and prevents water vapor from invading. Since the side of the glass substrate 1 away from the display panel body 2 also needs to be prepared with a mesh glue layer 5, a foaming layer 6 and other film layers, in order to avoid affecting its production process, the top of the glue connection part 8 does not exceed the end face of the glass substrate 1 away from the display panel body 2, that is, the glue connection part 8 does not contact the mesh glue layer 5. According to the normal module process flow, the module components are bonded, and the curved cover plate 4 is bonded to the side of the display panel body 2 away from the glass substrate 1 through the optical glue layer 3, and the double-curved or quad-curved CG bonding is performed.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

本申请公开一种显示面板及显示面板的制作方法。显示面板包括:玻璃基板;显示面板主体,包括设于玻璃基板上的有机层、以及设于有机层上的薄膜晶体管层,有机层的至少部分外边缘超出玻璃基板的外边缘;光学胶层,设于显示面板主体上;曲面盖板,设于光学胶层上。

Description

显示面板及显示面板的制作方法 技术领域
本申请涉及显示技术领域,具体涉及一种显示面板及显示面板的制作方法。
背景技术
OLED(OrganicLight-Emitting Diode,有机电致发光二极管)显示因其具有柔性可弯曲、自发光、广视角等优点成为目前市场上的主流显示产品,被誉为继LCD(Liquid Crystal Display,液晶显示器)显示后最有发展潜力的显示技术。OLED发光器件采用三明治结构,当两端通入电流后,电子和空穴被注入到有机发光层中,不同的有机发光材料在激子激发下发出不同颜色的光,从而应用于各种显示产品。
Hybrid OLED(混合型OLED)因为面板下方有玻璃基板,其屏幕强度强于柔性OLED,并且Hybrid OLED成本低于柔性屏,应用潜力巨大,各面板厂商都有研究该技术。目前Hybrid OLED相比于柔性OLED最大缺点是不能做固曲产品,如双曲或者四曲只能利用柔性PI(Polyimide,聚酰亚胺)基板来实现,这就限制了Hybrid OLED的应用场景。
发明概述
本申请实施例提供一种显示面板及显示面板的制作方法,玻璃基板和显示面板主体结合之后四周是柔性,中间区域是刚性,实现固曲类产品的同时提高模组硬度。
第一方面,本申请实施例提供一种显示面板,包括:
玻璃基板;
显示面板主体,包括设于所述玻璃基板上的有机层、以及设于所述有机层上的薄膜晶体管层,所述有机层的至少部分外边缘超出所述玻璃基板的外边缘;
光学胶层,设于所述显示面板主体上;
曲面盖板,设于所述光学胶层上;
发泡层,设于所述玻璃基板上远离所述显示面板主体的一侧;
网格胶层,设于所述发泡层与所述玻璃基板之间;
所述有机层相对两侧的外边缘超出所述玻璃基板的外边缘;或,所述有机层四周的外边缘均超出所述玻璃基板的外边缘。
第二方面,本申请实施例提供一种显示面板,包括:
玻璃基板;
显示面板主体,包括设于所述玻璃基板上的有机层、以及设于所述有机层上的薄膜晶体管层,所述有机层的至少部分外边缘超出所述玻璃基板的外边缘;
光学胶层,设于所述显示面板主体上;
曲面盖板,设于所述光学胶层上。
第三方面,本申请提供一种显示面板的制作方法,包括:
提供玻璃基板;
在所述玻璃基板上制备所述显示面板主体,所述显示面板主体包括设于所述玻璃基板上的有机层;
将外边缘预设范围内的所述玻璃基板去除剥离,完整保留所述有机层;
在所述显示面板主体上远离所述玻璃基板的一侧依次贴合光学胶层和曲面盖板。
在一些实施例中,所述将外边缘预设范围内的所述玻璃基板去除剥离,完整保留所述有机层之后,还包括:
在所述显示面板主体上已剥离所述玻璃基板的区域制备背板;
所述背板与所述玻璃基板的交接处进行封胶。
附图说明
下面结合附图,通过对本申请的具体实施方式详细描述,将使本申请的技术方案及其它有益效果显而易见。
图1是本申请一实施例中显示面板的结构示意图;
图2是本申请一实施例中显示面板的结构示意图;
图3是本申请一实施例中显示面板的结构示意图;
图4是本申请一实施例中显示面板的制作方法的流程示意图;
图5是本申请一实施例中显示面板的结构示意图;
图6是本申请一实施例中显示面板的制作方法的流程示意图。
附图标号:
1、玻璃基板;2、显示面板主体;21、有机层;22、薄膜晶体管层;23、偏光片;3、光学胶层;4、曲面盖板;5、网格胶层;6、发泡层;7、背板;8、封胶连接部;9、油墨层。
本发明的实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
在以下详细说明中,仅简单地通过例示示出和描述了本发明的某些实施方式。如本领域技术人员可以理解的,本文中描述的实施方式可以以多种方式进行修改,而不背离本发明的精神或范围。
在附图中,为了清晰起见并且为了更好地理解和便于描述,可能放大了层、膜、板、区域等的厚度。应当理解当元件如层、膜、区域、或衬底被称为“位于另一元件上”时,其可以直接位于另一元件上或者还可以存在插入的元件。
另外,除非相反地明确描述,否则词语“包括”及其像“包含”或“含有”这样的变体将被理解为暗含包括所论述的元件,但不一定排除其它元件。进一步,在说明书中,词语“在……上”指放置在对象部分上方或下方,而不一定指基于重力方向放置在对象部分的上侧。
将理解的是,尽管在本文中可以使用术语“第一”,“第二”等来描述各种组件,但是这些组件不应受到这些术语的限制。这些组件仅用于区分一个组件和另一个组件。
如本文所使用的,单数形式“一”,“一个”和“该”也意图包括复数形式,除非上下文另外明确指出。
还将理解的是,本文中使用的术语“包括”和/或“包含”指定存在所述特征或组件,但是不排除一个或多个其他特征或组件的存在或添加。
将理解的是,当层,区域或部件被称为“形成在”另一层,区域或部件上时,其可以直接或间接地形成在另一层,区域或部件上。例如,可以存在中间层,区域或组件。
在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
请参阅图1,本申请实施例提供一种显示面板,显示面板包括依次设置的玻璃基板1、显示面板主体2、光学胶层3(OCA,Optically Clear Adhesive)以及曲面盖板4(3D CG,3D Cover glass)。玻璃基板1用于承载显示面板主体2等部件,为其提供刚性支撑,显示面板主体2的各个膜层结构以玻璃基板1为基底依次制备。
显示面板主体2为OLED显示模组,包括设于玻璃基板1上的有机层21、以及设于有机层21上的薄膜晶体管层22,有机层21具有绝缘性能并且是柔性的,例如由聚酰亚胺形成的单个层或可形成为通过涂布和固化而重复地堆叠聚酰亚胺形成的多个层。薄膜晶体管层22包括但不限于缓冲层、半导体、栅极、源漏极层若干膜层,此外,显示面板主体2还包括偏光片、发光层等。光学胶层3用于将曲面盖板4贴合在显示面板主体2上。
其中,由于曲面盖板4的边缘具有一定的曲度,而玻璃基板1为刚性支撑,会影响曲面盖板4的贴合。因此,有机层21的至少部分外边缘超出玻璃基板1的外边缘,玻璃基板1与显示面板主体2贴合之后的模组边缘是柔性的有机层21。则当将曲面盖板4贴合在显示面板主体2上时,为显示面板主体2的外边缘提供向玻璃基板1一侧弯折的空间,使得刚性屏幕的Hybrid OLED也能够成为固曲产品。
在一个实施例中,显示面板可以是双曲或四曲产品,因此基于曲面盖板4的类型,如果曲面盖板4为双曲,则显示面板主体2的有机层21相对两侧的外边缘超出玻璃基板1的外边缘,且该相对两侧对应曲面盖板4的曲边。
如果曲面盖板4为四曲,则显示面板主体2的有机层21四周的外边缘均超出玻璃基板1的外边缘,即玻璃基板1与显示面板主体2贴合之后的模组四周都是柔性的有机层21,而中间区域为刚性区域。
此外,根据曲面盖板4曲边的参数确定对应的有机层21的外边缘超出玻璃基板1的外边缘的尺寸,一般有机层21的外边缘超出玻璃基板1的外边缘1-2mm。
在一个实施例中,如图2所示,显示面板还包括发泡层6Foam和网格胶层5Embo。发泡层6设于玻璃基板1上远离显示面板主体2的一侧,即显示面板主体2和发泡层6分别设于玻璃基板1相对的两侧。网格胶层5设于发泡层6与玻璃基板1之间,网格胶层5用于粘贴发泡层6和玻璃基板1。
玻璃基板1为刚性基板,提供刚性支撑,显示面板主体2为柔性结构,将玻璃基板1与显示面板主体2相结合形成Hybrid OLED,同时显示面板主体2的有机层21至少部分外边缘超出玻璃基板1的外边缘,贴合曲面盖板4形成曲边Hybrid OLED。需要说明的是,本实施例为贴合曲面盖板4的固曲产品,玻璃基板1为刚性基板,为了减少玻璃基板1对贴合曲面盖板4的影响,以及降低产品厚度,对玻璃基板1进行薄化,即选择厚度较小的玻璃基板1。
需要说明的是,虽然本实施例中将玻璃基板1与显示面板主体2描述为分割独立的部件,但是在实际制备工艺中,显示面板主体2并不是单独封装集成的模组,显示面板主体2中各个功能膜层依次在玻璃基板1上制备。
在一个实施例中,显示面板主体2的有机层21外边缘超出玻璃基板1的外边缘,在贴合曲面盖板4时为显示面板主体2的外边缘提供弯折避让的空间,为了避免设于玻璃基板1远离显示面板主体2一侧的网格胶层5和发泡层6的体积过大,影响曲面盖板4的贴合,网格胶层5和发泡层6的外边缘不超出玻璃基板1的外边缘,避免网格胶层5或发泡层6的外边缘在贴合曲面盖板4时与显示面板主体2的有机层21外边缘干涉,导致产品不良率提升。
在一个实施例中,为了在贴合曲面盖板4时为显示面板主体2的外边缘提供弯折避让的空间,显示面板主体2的有机层21外边缘超出玻璃基板1的外边缘,但是同时也导致有机层21的外边缘没有玻璃基板1保护而容易受到损伤,因此,如图3所示,显示面板还包括背板7(BP,back plate),背板7设于显示面板主体2的有机层21没有覆盖玻璃基板1的区域,且背板7与玻璃基板1设于显示面板主体2的同一侧,即背板7设置在玻璃基板1的外圈,背板7和玻璃基板1配合支撑显示面板主体2,背板7为显示面板主体2没有覆盖玻璃基板1的区域提供保护,避免损坏显示面板主体2的各个膜层。
此外,光学胶层3与曲面盖板4之间还设有油墨层9,油墨层9用于遮盖显示面板主体2的非显示区域。
在一个实施例中,厚度方向为显示面板的玻璃基板1至曲面盖板4的堆叠方向,由于背板7具有一定的强度,为了避免设置的背板7过厚,导致阻碍贴合曲面盖板4时显示面板主体2外边缘的弯折,因此需要设置合适的背板7厚度。其中,如果背板7的厚度等于或大于玻璃基板1的厚度,则上述实施例中描述的显示面板主体2的有机层21至少部分外边缘超出玻璃基板1的外边缘,在贴合曲面盖板4时为显示面板主体2的外边缘提供的弯折的空间被设置的背板7占据,导致曲面盖板4无法贴合或者贴合效果不佳,因此背板7的厚度小于玻璃基板1的厚度,使得设置的背板7在为显示面板主体2的外边缘提供支撑的同时保留足够的弯折空间。
在一个实施例中,如图3所示,背板7与玻璃基板1的交接处设有封胶连接部8,起到黏连作用和防止水汽入侵的作用。其中,封胶连接部8为UV胶(无影胶)。需要说明的是,封胶连接部8仅设置在背板7与玻璃基板1的交接处即可,避免在背板7上过量涂布,导致设置背板7的区域强度提升过大,影响曲面盖板4的贴合。
在一个实施例中,由于玻璃基板1远离显示面板主体2的一侧还需要制备网格胶层5、发泡层6等膜层,为了避免封胶连接部8对其制作工序的影响,封胶连接部8的顶部不超过玻璃基板1远离显示面板主体2的端面,即封胶连接部8不与网格胶层5接触。
本实施例在保证显示面板主体2的有机层21完整的前提下,将玻璃基板1的外边缘剥离,玻璃基板1和显示面板主体2结合之后四周是柔性的有机层21,中间区域是刚性,既可以实现固曲类产品,又能降低材料成本,提高模组硬度,提升屏体品味。
在一些实施例中,所述有机层设为柔性膜层。
在一些实施例中,所述有机层的外边缘超出所述玻璃基板的外边缘1-2mm。
在一些实施例中,所述有机层相对两侧的外边缘超出所述玻璃基板的外边缘;或,所述有机层四周的外边缘均超出所述玻璃基板的外边缘。
在一些实施例中,所述显示面板还包括:
发泡层,设于所述玻璃基板上远离所述显示面板主体的一侧;
网格胶层,设于所述发泡层与所述玻璃基板之间。
在一些实施例中,所述网格胶层和所述发泡层的外边缘不超出所述玻璃基板的外边缘。
在一些实施例中,所述显示面板还包括背板,所述背板设于所述显示面板主体未覆盖所述玻璃基板的区域,且所述背板与所述玻璃基板设于所述显示面板主体的同一侧。
在一些实施例中,所述背板的厚度小于所述玻璃基板的厚度,所述厚度方向为所述玻璃基板至所述曲面盖板的堆叠方向。
在一些实施例中,所述背板与所述玻璃基板的交接处设有封胶连接部。
在一些实施例中,所述封胶连接部设为UV胶。
在一些实施例中,所述封胶连接部的顶部不超过所述玻璃基板远离所述显示面板主体的端面。
在一些实施例中,所述显示面板还包括设于所述光学胶层与所述曲面盖板之间的油墨层,所述油墨层覆盖所述显示面板主体的非显示区域。
本申请实施例提供的显示面板及显示面板的制作方法,显示面板主体的至少部分外边缘超出玻璃基板的外边缘,在显示面板主体上贴合曲面盖板时为显示面板主体外边缘的弯折提供空间,以实现固曲类产品,同时提高模组硬度。
本申请实施例提供一种显示面板的制作方法,包括以下步骤:
S10、提供玻璃基板1;
S20、在所述玻璃基板1上制备所述显示面板主体2,所述显示面板主体2包括设于所述玻璃基板1上的有机层21;
S30、将外边缘预设范围内的所述玻璃基板1去除剥离,完整保留所述有机层21;
S40、在所述显示面板主体2上远离所述玻璃基板1的一侧依次贴合光学胶层3和曲面盖板4。
具体地,如图4所示,提供玻璃基板1,在玻璃基板1上依次制备显示面板主体2的各个功能膜层,显示面板主体2包括设于玻璃基板1上的有机层21、以及设于有机层21上的薄膜晶体管层22,有机层21具有绝缘性能并且是柔性的,例如由聚酰亚胺形成的单个层或可形成为通过涂布和固化而重复地堆叠聚酰亚胺形成的多个层。薄膜晶体管层22包括但不限于缓冲层、半导体、栅极、源漏极层若干膜层,此外,显示面板主体2还包括偏光片23、发光层等。需要说明的是,基于不同的工序设计,显示面板主体2可以是所有膜层均在步骤S20中制备完成,然后对玻璃基板1的外边缘进行剥离,也可以是部分膜层在步骤S20中进行制备,在剥离部分玻璃基板1的外边缘之后再制备显示面板主体2部分膜层,本实施例不作具体限定,例如,如图5所示,将偏光片23的贴合设为单独的工序,因此在制备玻璃基板1和显示面板主体2的其它膜层、并剥离玻璃基板1的外边缘之后,再制备偏光片23。
显示面板主体2制备完成之后,利用镭射激光半切(Laser cut)工艺,将玻璃基板1的外边缘预设范围内的部分切断而不损坏显示面板主体2的有机层21。显示面板可以是双曲或四曲产品,因此基于曲面盖板4的类型,如果曲面盖板4为双曲,则显示面板主体2的有机层21相对两侧的外边缘超出玻璃基板1的外边缘,且该相对两侧对应曲面盖板4的曲边。如果曲面盖板4为四曲,则显示面板主体2的有机层21四周的外边缘均超出玻璃基板1的外边缘,即玻璃基板1与显示面板主体2贴合之后的模组四周都是柔性的有机层21,而中间区域为刚性区域。此外,根据曲面盖板4曲边的参数确定对应的有机层21的外边缘超出玻璃基板1的外边缘的尺寸,一般有机层21的外边缘超出玻璃基板1的外边缘1-2mm。
利用LLO(laser lift-off,激光剥离)技术,照射切割的玻璃基板1的外边缘区域(即边缘处1-2mm的玻璃基板1),使得玻璃基板1的外边缘预设范围的部分与显示面板主体2的有机层21分离,然后剥离玻璃基板1。之后按照normal模组工艺流程,进行模组部材的贴合,例如,通过光学胶层3将曲面盖板4贴合在显示面板主体2远离玻璃基板1的一侧,进行双曲或者四曲CG的贴合。此外,在玻璃基板1上远离显示面板主体2的一侧通过网格胶层5贴合发泡层6。
玻璃基板1为刚性基板,提供刚性支撑,显示面板主体2为柔性结构,将玻璃基板1与显示面板主体2相结合形成Hybrid OLED,同时切割剥离一定距离范围内的玻璃基板1的外边缘,以便在贴合曲面盖板4时为显示面板主体2的外边缘提供弯折避让的空间。
此外,在贴合曲面盖板4时为显示面板主体2的外边缘提供弯折避让的空间,为了避免设于玻璃基板1远离显示面板主体2一侧的网格胶层5和发泡层6的体积过大,影响曲面盖板4的贴合,网格胶层5和发泡层6的外边缘不超出玻璃基板1的外边缘,避免网格胶层5或发泡层6的外边缘在贴合曲面盖板4时与显示面板主体2的有机层21外边缘干涉,导致产品不良率提升。
在一个实施例中,步骤S30、将外边缘预设范围内的所述玻璃基板1去除剥离,完整保留所述有机层21之后,还包括:
S60、在所述显示面板主体2上已剥离所述玻璃基板1的区域制备背板7;
S70、所述背板7与所述玻璃基板1的交接处进行封胶。
具体地,如图6所示,利用LLO技术,照射切割的玻璃基板1的外边缘,使得玻璃基板1预设范围的外边缘与显示面板主体2的有机层21分离,然后剥离玻璃基板1。为了解决LLO后显示面板主体2的外边缘没有刚性支撑保护而造成的有机层21等面板损伤问题,显示面板主体2上剥离玻璃基板1的区域贴附背板7进行保护,即将裸漏的显示面板主体2的有机层21贴附背板7进行保护。厚度方向为显示面板的玻璃基板1至曲面盖板4的堆叠方向,由于背板7具有一定的强度,为了避免设置的背板7过厚,导致阻碍贴合曲面盖板4时显示面板主体2外边缘的弯折,背板7的厚度小于玻璃基板1的厚度,使得设置的背板7在为显示面板主体2的外边缘提供支撑的同时保留足够的弯折空间。
在背板7与玻璃基板1的交接处进行UV封胶形成封胶连接部8,起到黏连作用和防止水汽入侵,由于玻璃基板1远离显示面板主体2的一侧还需要制备网格胶层5、发泡层6等膜层,为了避免对其制作工序的影响,封胶连接部8的顶部不超过玻璃基板1远离显示面板主体2的端面,即封胶连接部8不与网格胶层5接触。按照normal模组工艺流程,进行模组部材的贴合,通过光学胶层3将曲面盖板4贴合在显示面板主体2远离玻璃基板1的一侧,进行双曲或者四曲CG的贴合。
在上述实施例中,对各个实施例的描述都各有侧重,某个实施例中没有详述的部分,可以参见其他实施例的相关描述。
以上实施例的各技术特征可以进行任意的组合,为使描述简洁,未对上述实施例中的各个技术特征所有可能的组合都进行描述,然而,只要这些技术特征的组合不存在矛盾,都应当认为是本说明书记载的范围。
以上对本申请实施例所提供的一种显示面板及显示面板的制作方法进行了详细介绍,本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想;同时,对于本领域的技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,综上,本说明书内容不应理解为对本发明的限制。

Claims (20)

  1. 一种显示面板,其中,包括:
    玻璃基板;
    显示面板主体,包括设于所述玻璃基板上的有机层、以及设于所述有机层上的薄膜晶体管层,所述有机层的至少部分外边缘超出所述玻璃基板的外边缘;
    光学胶层,设于所述显示面板主体上;
    曲面盖板,设于所述光学胶层上;
    发泡层,设于所述玻璃基板上远离所述显示面板主体的一侧;
    网格胶层,设于所述发泡层与所述玻璃基板之间;
    所述有机层相对两侧的外边缘超出所述玻璃基板的外边缘;或,所述有机层四周的外边缘均超出所述玻璃基板的外边缘。
  2. 如权利要求1所述的显示面板,其中,所述网格胶层和所述发泡层的外边缘不超出所述玻璃基板的外边缘。
  3. 如权利要求1所述的显示面板,其中,所述显示面板还包括背板,所述背板设于所述显示面板主体未覆盖所述玻璃基板的区域,且所述背板与所述玻璃基板设于所述显示面板主体的同一侧。
  4. 如权利要求3所述的显示面板,其中,所述背板的厚度小于所述玻璃基板的厚度,所述厚度方向为所述玻璃基板至所述曲面盖板的堆叠方向。
  5. 如权利要求4所述的显示面板,其中,所述背板与所述玻璃基板的交接处设有封胶连接部。
  6. 一种显示面板,其中,包括:
    玻璃基板;
    显示面板主体,包括设于所述玻璃基板上的有机层、以及设于所述有机层上的薄膜晶体管层,所述有机层的至少部分外边缘超出所述玻璃基板的外边缘;
    光学胶层,设于所述显示面板主体上;
    曲面盖板,设于所述光学胶层上。
  7. 如权利要求6所述的显示面板,其中,所述有机层设为柔性膜层。
  8. 如权利要求6所述的显示面板,其中,所述有机层的外边缘超出所述玻璃基板的外边缘1-2mm。
  9. 如权利要求6所述的显示面板,其中,所述有机层相对两侧的外边缘超出所述玻璃基板的外边缘;或,所述有机层四周的外边缘均超出所述玻璃基板的外边缘。
  10. 如权利要求6所述的显示面板,其中,所述显示面板还包括:
    发泡层,设于所述玻璃基板上远离所述显示面板主体的一侧;
    网格胶层,设于所述发泡层与所述玻璃基板之间。
  11. 如权利要求10所述的显示面板,其中,所述网格胶层和所述发泡层的外边缘不超出所述玻璃基板的外边缘。
  12. 如权利要求6所述的显示面板,其中,所述显示面板还包括背板,所述背板设于所述显示面板主体未覆盖所述玻璃基板的区域,且所述背板与所述玻璃基板设于所述显示面板主体的同一侧。
  13. 如权利要求12所述的显示面板,其中,所述背板的厚度小于所述玻璃基板的厚度,所述厚度方向为所述玻璃基板至所述曲面盖板的堆叠方向。
  14. 如权利要求12所述的显示面板,其中,所述背板与所述玻璃基板的交接处设有封胶连接部。
  15. 如权利要求14所述的显示面板,其中,所述封胶连接部设为UV胶。
  16. 如权利要求14所述的显示面板,其中,所述封胶连接部的顶部不超过所述玻璃基板远离所述显示面板主体的端面。
  17. 如权利要求6所述的显示面板,其中,所述显示面板还包括设于所述光学胶层与所述曲面盖板之间的油墨层,所述油墨层覆盖所述显示面板主体的非显示区域。
  18. 一种显示面板的制作方法,其中,包括:
    提供玻璃基板;
    在所述玻璃基板上制备所述显示面板主体,所述显示面板主体包括设于所述玻璃基板上的有机层;
    将外边缘预设范围内的所述玻璃基板去除剥离,完整保留所述有机层;
    在所述显示面板主体上远离所述玻璃基板的一侧依次贴合光学胶层和曲面盖板。
  19. 如权利要求18所述的显示面板的制作方法,其中,所述外边缘预设范围设为1-2mm。
  20. 如权利要求18所述的显示面板的制作方法,其中,所述将外边缘预设范围内的所述玻璃基板去除剥离,完整保留所述有机层之后,还包括:
    在所述显示面板主体上已剥离所述玻璃基板的区域制备背板;
    所述背板与所述玻璃基板的交接处进行封胶。
PCT/CN2023/133924 2023-03-28 2023-11-24 显示面板及显示面板的制作方法 WO2024198420A1 (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107978623A (zh) * 2017-11-30 2018-05-01 武汉天马微电子有限公司 一种显示装置
CN110429105A (zh) * 2019-06-25 2019-11-08 华为技术有限公司 显示组件与电子设备
CN110571362A (zh) * 2019-09-18 2019-12-13 云谷(固安)科技有限公司 柔性显示面板及其制备方法
CN112002227A (zh) * 2020-08-17 2020-11-27 武汉华星光电半导体显示技术有限公司 柔性显示面板及柔性显示设备
CN114220932A (zh) * 2021-12-13 2022-03-22 武汉华星光电半导体显示技术有限公司 一种显示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107978623A (zh) * 2017-11-30 2018-05-01 武汉天马微电子有限公司 一种显示装置
CN110429105A (zh) * 2019-06-25 2019-11-08 华为技术有限公司 显示组件与电子设备
CN110571362A (zh) * 2019-09-18 2019-12-13 云谷(固安)科技有限公司 柔性显示面板及其制备方法
CN112002227A (zh) * 2020-08-17 2020-11-27 武汉华星光电半导体显示技术有限公司 柔性显示面板及柔性显示设备
CN114220932A (zh) * 2021-12-13 2022-03-22 武汉华星光电半导体显示技术有限公司 一种显示装置

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