WO2024168459A1 - 可绝缘及抑制电磁波的无线电路模块及制造方法 - Google Patents
可绝缘及抑制电磁波的无线电路模块及制造方法 Download PDFInfo
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- WO2024168459A1 WO2024168459A1 PCT/CN2023/075639 CN2023075639W WO2024168459A1 WO 2024168459 A1 WO2024168459 A1 WO 2024168459A1 CN 2023075639 W CN2023075639 W CN 2023075639W WO 2024168459 A1 WO2024168459 A1 WO 2024168459A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- the present invention relates to a wireless circuit module and a manufacturing method capable of insulating and suppressing electromagnetic waves, and more particularly to a wireless circuit module in which electromagnetic waves, noise and other interferences of multiple electronic components and wireless transceiver chips are guided to a metal shielding frame and a copper foil layer inside a circuit board through a shielding heat-conducting layer for grounding and elimination, while the heat energy of the multiple electronic components and the wireless transceiver chips can be conducted to the surface of a protective anti-scratch layer through the shielding heat-conducting layer for rapid dissipation, thereby meeting the trend of electronic devices being lighter, thinner, shorter and smaller, and effectively reducing the production cost of manufacturing wireless circuit modules.
- Portable electronic devices such as smart phones, tablet computers or laptop computers and other electronic products
- Portable electronic devices are becoming more and more common and important in modern life. They have almost become an indispensable part of daily life.
- Internet and social networking sites a single portable electronic device can handle most tasks. Whether it is communication, Internet, multimedia applications (such as videos or games) or various information, they can be easily obtained, used or disseminated in portable electronic devices.
- a gap is formed between the base and the plurality of terminals, and it is easy for external moisture to penetrate into the circuit board through the electrical connector, causing corrosion and oxidation of the plurality of contacts and pins of various electronic components on the circuit board, which can easily affect the operation of the circuit board and cause abnormal phenomena such as short circuit or open circuit.
- the electronic device encounters rainy days or is accidentally splashed with other liquids containing water, the electronic device is easily short-circuited due to moisture inside to affect its functionality. Therefore, the waterproofness of the circuit board has gradually received attention from researchers.
- an object of the present invention is to provide a wireless circuit module and a manufacturing method that can insulate and suppress electromagnetic waves.
- the present invention provides a wireless circuit module capable of insulating and suppressing electromagnetic waves, comprising: a circuit board, on the surface of which a plurality of electronic components and at least one wireless transceiver chip are welded, and a metal shielding frame is arranged around the outer ring of the plurality of electronic components, and the bottom side of the metal shielding frame is connected to the copper foil layer inside the circuit board; an insulating layer, which is coated on the surface of the circuit board and the plurality of electronic components and fused to form an insulating layer, but the insulating layer is not covered on the surface of the metal shielding frame; a shielding heat-conducting layer, which is coated on a part of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame to form a shielding heat-conducting layer; and a protective anti-scratch layer, which is coated on the surface of the shielding heat-conducting layer and a part of the insulating layer, and forms a three-layer structure in
- electromagnetic waves, noise and other interferences of multiple electronic components and wireless transceiver chips are guided to the metal shielding frame and the copper foil layer inside the circuit board through the shielding heat-conducting layer for grounding and elimination, and the heat energy of multiple electronic components and wireless transceiver chips can be conducted to the surface of the protective anti-scratch layer through the shielding heat-conducting layer for rapid dissipation, which can meet the trend of electronic devices being light, thin, short and miniaturized, and can effectively reduce the production cost of manufacturing wireless circuit modules.
- the components of the insulating layer include: 30% to 90% by weight of a base material; 0.5% to 30% by weight of a polymer material cross-linking agent; and 10% to 30% by weight of ionized water.
- the components of the shielding heat-conducting layer include: 20% to 50% by weight of a base material; 0.5% to 20% by weight of an adhesive; 0.5% to 30% by weight of a polymer material cross-linking agent; and 10% to 30% by weight of deionized water.
- the components of the protective anti-scratch layer include: 30% to 90% by weight of a base material; 0.5% to 30% by weight of a polymer material cross-linking agent; and 10% to 30% by weight of deionized water.
- FIG. 1 is a schematic diagram of a first operation of manufacturing a wireless circuit module according to the present invention.
- FIG. 2 is a schematic diagram of a second operation of manufacturing a wireless circuit module according to the present invention.
- FIG. 3 is a schematic diagram of a third operation of manufacturing a wireless circuit module according to the present invention.
- FIG. 4 is a schematic diagram of a fourth operation of manufacturing a wireless circuit module according to the present invention.
- FIG. 5 is a flow chart of a method for manufacturing a wireless circuit module according to the present invention.
- a circuit board with a plurality of electronic components soldered on the surface wherein the plurality of electronic components include at least one wireless transceiver chip with a communication function, and a metal shielding frame is provided around the outer ring of the plurality of electronic components, and the bottom side of the metal shielding frame is connected to a copper foil layer inside the circuit board;
- 83- is coated on a part of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame to form a thin film-shaped shielding heat-conducting layer that can shield the top electromagnetic wave;
- a protective anti-scratch layer is coated on the surface of the shielding thermal conductive layer and on the portion of the insulating layer not covered by the shielding thermal conductive layer, and a three-layer structure is formed in which the protective anti-scratch layer is larger than the insulating layer and the insulating layer is larger than the shielding thermal conductive layer.
- FIG. 1 to FIG. 4 are schematic diagrams of the first, second, third and fourth actions of making a wireless circuit module according to the present invention. It can be clearly seen from the figures that the present invention is a wireless circuit module that can insulate and suppress electromagnetic waves. Its main components and features are described in detail as follows:
- a circuit board 1 has a plurality of electronic components 2 soldered on its surface, and the plurality of electronic components 2 includes at least A wireless transceiver chip 21 with communication function is provided, and a metal shielding frame 3 for shielding electromagnetic waves is provided outside the plurality of electronic components 2, and the bottom side of the metal shielding frame 3 is connected to a copper foil layer 11 inside the circuit board 1 which can be used as grounding.
- the insulating layer 4 is formed by applying the insulating material to the surface of the circuit board 1 and the plurality of electronic components 2 in a non-contact manner through a first piezoelectric dispensing device (not shown) controlled by a computer and fused to form a thin film insulating layer, but the insulating material is not dispensed on the surface of the metal shielding frame 3 to form the insulating layer 4, and the insulating material is or is not dispensed on the surface of the wireless transceiver chip 21 to form the insulating layer 4.
- the aforementioned first piezoelectric dispensing device is no different from the general commercially available products that convert electrical energy into mechanical energy vibration, so no additional drawings or textual explanations are provided, and the first piezoelectric dispensing device can also be implemented by other non-piezoelectric dispensing devices, which is also within the scope of protection of the present invention.
- the shielding heat-conducting layer 5 is sprayed and coated on a part of the insulating layer 4, the surface of the wireless transceiver chip 21 and the metal shielding frame 3 by a first atomizing device 71, and a thin film-like shielding heat-conducting layer 5 is formed which can shield the electromagnetic waves on the top side.
- the shielding heat-conducting layer 5 is directly formed on the surface of the wireless transceiver chip 21, unlike other electronic components 2 where the insulating layer 4 is first formed and then the shielding heat-conducting layer 5 is formed, which can further enhance the shielding and heat-conducting effects of the wireless transceiver chip 21 (the thickness of the shielding heat-conducting layer 5 is relatively large).
- the protective anti-scratch layer 6 is coated and formed on the surface of the shielding heat-conducting layer 5 and the part of the insulating layer 4 not covered by the shielding heat-conducting layer 5 by a second atomizing device 72 or a second piezoelectric dispensing device (not shown), and a three-layer structure is formed in which the protective anti-scratch layer 6 is larger than the insulating layer 4 and the insulating layer 4 is larger than the shielding heat-conducting layer 5.
- the aforementioned second piezoelectric dispensing device is also no different from general commercial products, so no additional drawings or textual explanations are made, and the second piezoelectric dispensing device can also be implemented by other non-piezoelectric dispensing devices, which is also within the protection scope of the present invention.
- the three-layer film structure of the insulating layer 4, the shielding heat-conducting layer 5 and the protective anti-scratch layer 6 formed above the wireless circuit module of the present invention since the areas of the insulating layer 4 and the protective anti-scratch layer 6 are both larger than the shielding heat-conducting layer 5, and the three-layer film structure is bonded to each other through the polymer material cross-linking agent possessed inside, and the edges of the insulating layer 4 and the protective anti-scratch layer 6 located on both sides are in a tightly fitted state and cover the shielding heat-conducting layer 5, thus forming a structure like "hot-pressed toast" (as shown in FIG. 4 ), and when this structure is repaired for the wireless circuit module, it is only necessary to pick up the three-layer film structure from one edge and open it to completely separate it from the circuit board 1, so as to facilitate the reprocessing or repair of the circuit board.
- the components of the insulating layer 4 include: 30% to 90% by weight of a base material; 0.5% to 30% by weight of a polymer cross-linking agent; and 10% to 30% by weight of ionized water; and the base material components of the insulating layer 4 with a weight percentage of 30% to 90% include: polyurethane, polyimide, polycarbonate, One or a combination of polyamide, epoxy resin, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; the polymer material crosslinking agent with a weight percentage of 0.5% to 30% includes: high imine methyl etherified melamine resin (hmmm) or aziridine or carbodiimide (Carbodiimide) or epoxy crosslinking agent, and further targets amino (-NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO-) functional groups.
- the base material components of the insulating layer 4 with a weight percentage of 30% to 90% include: polyurethane
- the components of the above-mentioned shielding heat-conducting layer 5 include: 20% to 50% by weight of the base material; 0.5% to 20% by weight of the binder; 0.5% to 30% by weight of the polymer material cross-linking agent; and 10% to 30% by weight of deionized water; and the shielding heat-conducting layer 5 has 20% to 50% by weight of the base material components including: nano carbon tubes, graphene and silver-coated copper; 0.5% to 20% by weight of the binder including: polyurethane, polyimide, polycarbonate, polyamide , polyethylene terephthalate, polyethylene naphthalate, polyethylene imine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin or a combination thereof; the polymer material crosslinking agent of 0.5% to 30% by weight includes: high imine methyl etherified melamine resin (hmmm) or aziridine or carbodiimide, and further targets amino (-NH2), carboxyl (-COOH), amide
- the thickness of the shielding heat-conducting layer 5 ranges from 1 to 150 ⁇ m (micrometers), and the thickness of the preferred embodiment of the shielding heat-conducting layer 5 can be 20 to 60 ⁇ m (micrometers); and the silver-clad copper is a sheet-like structure, and its particle length ranges from 10 to 100 ⁇ m.
- the components of the above-mentioned protective anti-scratch layer 6 include: 30% to 90% by weight of a base material; 0.5% to 30% by weight of a polymer cross-linking agent; and 10% to 30% by weight of deionized water; and the base material components of the protective anti-scratch layer 6 with a weight percentage of 30% to 90% include: one or a combination of polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethylene imine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; the polymer cross-linking agent with a weight percentage of 0.5% to 30% includes: high imine methyl etherified melamine resin (hmmm) or aziridine or carbodiimide (Carbodiimide), and further targets amino (-NH2), carboxyl (-COOH), amide bond (-CONH- or -NHCO-) functional groups.
- FIG. 5 is a flow chart of a method for manufacturing a wireless circuit module of the present invention, comprising the following steps:
- Step 81 Provide a circuit board with a plurality of electronic components soldered on the surface, wherein the plurality of electronic components include at least one wireless transceiver chip with communication function, and a metal shielding frame is provided around the outer circle of the plurality of electronic components, and the bottom side of the metal shielding frame is connected to a copper foil layer inside the circuit board.
- Step 82 The insulating material is applied to the surfaces of the circuit board and the plurality of electronic components and fused to form a thin film insulating layer, but the insulating material is not applied to the surface of the metal shielding frame to form the insulating layer; the insulating layer is applied to the surfaces of the circuit board and the plurality of electronic components by a first piezoelectric dispensing device controlled by a computer in a non-contact manner, while the insulating material is or is not applied to the surface of the wireless transceiver chip to form the insulating layer.
- Step 83 Apply to a part of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame to form a thin film-like shielding thermal conductive layer that can shield the top electromagnetic waves; the shielding thermal conductive layer is sprayed and applied to a part of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame through a first atomizing device.
- Step 84 A protective anti-scratch layer is coated on the surface of the shielding thermal conductive layer and the portion of the insulating layer not covered by the shielding thermal conductive layer, and a three-layer structure is formed in which the protective anti-scratch layer is larger than the insulating layer and the insulating layer is larger than the shielding thermal conductive layer; the protective anti-scratch layer is formed by coating the surface of the shielding thermal conductive layer and the portion of the insulating layer not covered by the shielding thermal conductive layer through a second atomizing device or a second piezoelectric dispensing device.
- the main features of the present invention are: electromagnetic waves, noise and other interferences of the multiple electronic components 2 and the wireless transceiver chip 21 on the wireless circuit module are guided to the metal shielding frame 3 and the copper foil layer 11 inside the circuit board 1 through the shielding heat conductive layer 5 for grounding and elimination, and the heat energy of the multiple electronic components 2 and the wireless transceiver chip 21 can be conducted to the surface of the protective anti-scratch layer 6 through the shielding heat conductive layer 5 (mainly through the graphene material) for rapid dissipation, which can meet the trend of electronic devices being light, thin, short and small, and can effectively reduce the production cost of manufacturing wireless circuit modules.
- the present invention has excellent practicality in the field of producing wireless communication circuit boards, so an application is filed to seek patent protection.
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Abstract
本发明公开一种可绝缘及抑制电磁波的无线电路模块及制造方法，包括：一电路板，其表面焊接设有复数电子元件及至少一无线收发芯片，并于该复数电子元件外部圈设有金属屏蔽框，且金属屏蔽框底侧连接于电路板内部的铜箔层；一绝缘层，涂布于电路板及该复数电子元件表面并融合形成绝缘层，但于金属屏蔽框表面则未覆盖绝缘层；一屏蔽导热层，涂布于绝缘层的局部、无线收发芯片及金属屏蔽框表面并形成有屏蔽导热层；一保护防刮层，涂布于屏蔽导热层表面及绝缘层的局部，并形成有保护防刮层大于绝缘层且绝缘层大于屏蔽导热层的三层结构。
Description
本发明有关于一种可绝缘及抑制电磁波的无线电路模块及制造方法，尤其是指一种无线电路模块上的复数电子元件及无线收发芯片的电磁波、噪声等干扰经由屏蔽导热层导引至金属屏蔽框及电路板内部铜箔层进行接地消弭，而复数电子元件及无线收发芯片的热能则可通过屏蔽导热层传导至保护防刮层表面进行快速排散，而可符合电子装置轻、薄、短、小化的趋势，并可有效降低制造无线电路模块生产成本。
由于时代的快速变迁以及科技的日新月异，现在人们追求更加便利、快速的生活，而可携式电子装置(如：智能手机、平板电脑或笔记本电脑等电子产品)也在现代生活中更加常见也越来越重要，几乎在日常生活中已经变成不可或缺的一部分，搭配网络及社群网站的崛起，单一可携式电子装置已可处理大多数的工作，而不论是通讯、因特网、多媒体应用(如：影片或游戏)或各式各样的信息皆可在可携式电子装置中轻易的获得、使用或传播。
但，目前各种可携式电子装置在使用时必须利用电力才可启动、运作，所以各种可携式电子装置内部都配置有供应电力的电池，通过电池将电力传送至各种功能的电路板，来供应电路板进行运作所需的电源，且电池与电路板之间，可通过电连接器进行电力的传输。然而，目前用以传输电力的电连接器，在座体与复数端子间，都是利用嵌扣、卡持方式组装、定位后，即直接使用进行电力传输，并在实际应用、实施时，仍存在稍许缺失与不便，例如：在电连接器组装、定位后，其座体与复数端子之间形成有间隙，容易发生外部水气经由电连接器处渗入电路板，而造成电路板上复数接点、各种电子零组件的接脚等锈蚀、氧化等，容易影响电路板的运作，进而发生短路或断路的异常现象，且电子装置遇到下雨天或者不慎泼洒其它含有水份液体时，其电子装置内部很容易因为水气而产生短路状况以影响其功能性，故电路板的防水性逐渐受到研发者重视。
并且，现今电子装置(尤其是指内部设有无线电路模块的)需要进行大量的信号处理，且其信号处理也需变得高速化，所以电子装置在使用过程中，其内部的电
子元件会产生电磁波及串音干扰及高热能，同时会干扰其它电子设备，抑或使内部的电子元件相互干扰而无法正常运作。基于前述，为了解决电磁波及串音干扰以及散热等问题，便有厂商在电子装置的电路板上装设金属盖体，以通过金属盖体来遮盖于电子元件上方处，进而利用金属盖体来感应吸收及屏蔽电磁波及串音干扰及供散热，但是，目前电子装置皆朝轻、薄、短、小化的趋势发展，而通过装设金属盖体会使电子装置整体厚度增加，且金属盖体开模及组装亦会耗费诸多制造时间及成本，以此无法有效提升电子装置的市场竞争力。
是以，要如何设法解决上述电子装置的防水性及防电磁波、串音干扰及散热等问题，且同时符合电子装置轻、薄、短、小化的趋势发展，即为从事此行业的相关厂商所亟欲研究改善的方向所在。
发明内容
因此，有鉴于上述的问题与缺失，本发明的目的在于提供一种可绝缘及抑制电磁波的无线电路模块及制造方法。
本发明提供一种可绝缘及抑制电磁波的无线电路模块，包括：一电路板，其表面焊接设有复数电子元件及至少一无线收发芯片，并于该复数电子元件外部圈设有金属屏蔽框，且金属屏蔽框底侧连接于电路板内部的铜箔层；一绝缘层，涂布于电路板及该复数电子元件表面并融合形成绝缘层，但于金属屏蔽框表面则未覆盖绝缘层；一屏蔽导热层，涂布于绝缘层的局部、无线收发芯片及金属屏蔽框表面并形成有屏蔽导热层；一保护防刮层，涂布于屏蔽导热层表面及绝缘层的局部，并形成有保护防刮层大于绝缘层且绝缘层大于屏蔽导热层的三层结构。通过前述以使复数电子元件及无线收发芯片的电磁波、噪声等干扰经由屏蔽导热层导引至金属屏蔽框及电路板内部铜箔层进行接地消弭，而复数电子元件及无线收发芯片的热能则可通过屏蔽导热层传导至保护防刮层表面进行快速排散，而可符合电子装置轻、薄、短、小化的趋势，并可有效降低制造无线电路模块生产成本。
在本发明一实施例中，该绝缘层的成分包括：重量百分比为30％～90％的基料；重量百分比为0.5％～30％的高分子材料交联剂；以及，重量百分比为10％～30％的离子水。
在本发明一实施例中，该屏蔽导热层的成分包括：重量百分比为20％～50％的基料；重量百分比为0.5％～20％的黏结剂；重量百分比为0.5％～30％的高分子材料交联剂；以及，重量百分比为10％～30％的去离子水。
在本发明一实施例中，该保护防刮层的成分包括：重量百分比为30％～90％的基料；重量百分比为0.5％～30％的高分子材料交联剂；以及重量百分比为10％～30％的去离子水。
图1为本发明制作无线电路模块的第一动作示意图。
图2为本发明制作无线电路模块的第二动作示意图。
图3为本发明制作无线电路模块的第三动作示意图。
图4为本发明制作无线电路模块的第四动作示意图。
图5为本发明无线电路模块的制造方法流程图。
附图标记说明：1-电路板；11-铜箔层；2-电子元件；21-无线收发芯片；3-金属屏蔽框；4-绝缘层；5-屏蔽导热层；6-保护防刮层；71-第一雾化装置；72-第二雾化装置；
81-提供表面已焊接复数电子元件的一电路板，且该复数电子元件中包括至少一具通信功能的一无线收发芯片，并于该复数电子元件外部圈设有一金属屏蔽框，且该金属屏蔽框底侧连接于该电路板内部的一铜箔层；
82-将绝缘材料涂布于该电路板及该复数电子元件表面并融合形成呈薄膜状绝缘层，但于该金属屏蔽框表面则未点设该绝缘材料及形成该绝缘层；
83-涂布于该绝缘层的局部、该无线收发芯片及该金属屏蔽框表面并形成有可屏蔽顶侧电磁波的呈薄膜状屏蔽导热层；
84-涂布于该屏蔽导热层表面及未被该屏蔽导热层覆盖的该绝缘层的局部形成有一保护防刮层，并形成有该保护防刮层大于该绝缘层且该绝缘层大于该屏蔽导热层的三层结构。
为达成上述目的与功效，本发明所采用的技术手段及其构造、实施的方法等，兹绘图就本发明的较佳实施例详加说明其特征与功能如下，以利完全了解。
请参阅图1至图4所示，分别为本发明制作无线电路模块的第一、二、三、四动作示意图，由图中可清楚看出，本发明为可绝缘及抑制电磁波的无线电路模块，其主要构件及特征详述如下：
一电路板1，其表面焊接设有复数电子元件2，且该复数电子元件2中包括至
少一具通信功能的一无线收发芯片21，并于该复数电子元件2外部圈设有可屏蔽电磁波的一金属屏蔽框3，且该金属屏蔽框3底侧连接于该电路板1内部可作为接地的一铜箔层11。
如图1、图2所示，其中绝缘层4是通过以计算机控制的一第一压电点胶装置(图中未示)以非接触方式将绝缘材料点设涂布于该电路板1及该复数电子元件2表面并融合形成呈薄膜状绝缘层，但于该金属屏蔽框3表面则未点设该绝缘材料及形成该绝缘层4，而该无线收发芯片21表面则点设或未点设该绝缘材料及形成该绝缘层4。前述第一压电点胶装置与一般市售将电能转换成机械能振动的产品并无不同，故未另行绘图及做文字解说，而第一压电点胶装置亦可通过其他非压电形式的点胶装置来实施，亦在本发明的保护范围内。
如图3所示，其中屏蔽导热层5是通过一第一雾化装置71喷洒涂布于该绝缘层4的局部、该无线收发芯片21及该金属屏蔽框3表面并形成有可屏蔽顶侧电磁波的呈薄膜状屏蔽导热层5；而通过无线收发芯片21表面直接形成有屏蔽导热层5，未如其他电子元件2表面为先成型有绝缘层4后再成型有屏蔽导热层5，可进一步强化对无线收发芯片21屏蔽及导热效果(屏蔽导热层5的厚度较大)。
如图4所示，其中保护防刮层6是通过一第二雾化装置72或一第二压电点胶装置(图中未示)涂布成型于该屏蔽导热层5表面及未被该屏蔽导热层5覆盖的该绝缘层4的局部，并形成有该保护防刮层6大于该绝缘层4且该绝缘层4大于该屏蔽导热层5的三层结构。前述第二压电点胶装置亦与一般市售产品并无不同，故未另行绘图及做文字解说，而第二压电点胶装置亦可通过其他非压电形式的点胶装置来实施，亦在本发明的保护范围内。
特别要说明的是：本发明的无线电路模块上方所形成绝缘层4、屏蔽导热层5及保护防刮层6的三层膜状结构，由于绝缘层4与保护防刮层6的面积皆大于屏蔽导热层5，并通过三层膜状结构内部所皆具备的高分子材料交联剂形成相互黏合状态，而位于两侧的绝缘层4与保护防刮层6的边缘形成紧密贴合状态且将屏蔽导热层5做一包覆，故形成一种犹如“热压吐司”的结构(如图4所示)，而此种结构于无线电路模块进行维修时，仅需将三层膜状结构由一边缘处抠起并加以掀开即可使其与电路板1完全分离，而便于做电路板重新加工或维修作业。
上述该绝缘层4的成分包括：重量百分比为30％～90％的基料；重量百分比为0.5％～30％的高分子材料交联剂；以及，重量百分比为10％～30％的离子水；而该绝缘层4的重量百分比为30％～90％的基料成分包括：聚胺酯、聚亚酰胺、聚碳酸酯、
聚酰胺、环氧树酯、聚乙烯亚胺、聚二甲基硅氧烷、压克力系聚合物、醚系聚合物或聚烯烃的其中之一或组合；重量百分比为0.5％～30％的该高分子材料交联剂包括：高亚胺甲醚化三聚氰胺树脂(hmmm)或氮丙啶或碳二亚胺(Carbodiimide)或环氧基交联剂，且进一步针对氨基(-NH2)、羧基(-COOH)、酰胺键(-CONH-或-NHCO-)官能基团。
上述屏蔽导热层5的成分包括：重量百分比为20％～50％的基料；重量百分比为0.5％～20％的黏结剂；重量百分比为0.5％～30％的高分子材料交联剂；以及，重量百分比为10％～30％的去离子水；而该屏蔽导热层5重量百分比为20％～50％的该基料成分包括：纳米碳管、石墨烯及银包铜；重量百分比为0.5％～20％的该黏结剂包括：聚胺酯、聚亚酰胺、聚碳酸酯、聚酰胺、聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚乙烯亚胺、聚二甲基硅氧烷、压克力系聚合物、醚系聚合物或聚烯烃的其中之一或组合；重量百分比为0.5％～30％的该高分子材料交联剂包括：高亚胺甲醚化三聚氰胺树脂(hmmm)或氮丙啶或碳二亚胺(Carbodiimide)，且进一步针对氨基(-NH2)、羧基(-COOH)、酰胺键(-CONH-或-NHCO-)官能基团。而屏蔽导热层5厚度范围为1～150μm(微米)，且该屏蔽导热层5的较佳实施例厚度可为20～60μm(微米)；而该银包铜呈片状体结构，其颗粒长度范围为10～100μm。
上述该保护防刮层6的成分包括：重量百分比为30％～90％的基料；重量百分比为0.5％～30％的高分子材料交联剂；以及重量百分比为10％～30％的去离子水；而该保护防刮层6的重量百分比为30％～90％的基料成分包括：聚胺酯、聚亚酰胺、聚碳酸酯、聚酰胺、聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚乙烯亚胺、聚二甲基硅氧烷、压克力系聚合物、醚系聚合物或聚烯烃的其中之一或组合；重量百分比为0.5％～30％的该高分子材料交联剂包括：高亚胺甲醚化三聚氰胺树脂(hmmm)或氮丙啶或碳二亚胺(Carbodiimide)，且进一步针对氨基(-NH2)、羧基(-COOH)、酰胺键(-CONH-或-NHCO-)官能基团。
上述依序形成的绝缘层4、屏蔽导热层5及保护防刮层6，该绝缘层4基料成分的：聚胺酯、聚亚酰胺、聚碳酸酯、聚酰胺、聚乙烯亚胺的其中之一或组合与该屏蔽导热层5黏结剂[Binder]的：聚胺酯、聚亚酰胺、聚碳酸酯、聚酰胺、聚乙烯亚胺的其中之一或组合及保护防刮层6基料成分的：聚胺酯、聚亚酰胺、聚碳酸酯、聚酰胺、聚乙烯亚胺其中之一或组合，与其中各层材料中的高分子材料交联剂，进一步针对绝缘层4、屏蔽导热层5黏结剂与保护防刮层6的氨基(-NH2)、羧基(-COOH)、酰胺键(-CONH-或-NHCO-)官能基团交联，可形成各层高分子材料
间的交联链结、结合，以供绝缘层4、屏蔽导热层5与保护防刮层6间的结合性更佳、结合效果更好。
请参阅图5所示，为本发明无线电路模块的制造方法流程图，包括有下列步骤：
步骤81:提供表面已焊接复数电子元件的一电路板，且该复数电子元件中包括至少一具通信功能的一无线收发芯片，并于该复数电子元件外部圈设有一金属屏蔽框，且该金属屏蔽框底侧连接于该电路板内部的一铜箔层。
步骤82:将绝缘材料涂布于该电路板及该复数电子元件表面并融合形成呈薄膜状绝缘层，但于该金属屏蔽框表面则未点设该绝缘材料及形成该绝缘层；该绝缘层是以计算机控制的一第一压电点胶装置以非接触方式将绝缘材料点设涂布于该电路板及该复数电子元件表面，而该无线收发芯片表面则点设或未点设该绝缘材料及形成该绝缘层。
步骤83:涂布于该绝缘层的局部、该无线收发芯片及该金属屏蔽框表面并形成有可屏蔽顶侧电磁波的呈薄膜状屏蔽导热层；该屏蔽导热层是通过一第一雾化装置喷洒涂布于该绝缘层的局部、该无线收发芯片及该金属屏蔽框表面。
步骤84:涂布于该屏蔽导热层表面及未被该屏蔽导热层覆盖的该绝缘层的局部形成有一保护防刮层，并形成有该保护防刮层大于该绝缘层且该绝缘层大于该屏蔽导热层的三层结构；该保护防刮层是通过一第二雾化装置或一第二压电点胶装置涂布成型于该屏蔽导热层表面及未被该屏蔽导热层覆盖的该绝缘层的局部。
本发明的主要特点在于：无线电路模块上的复数电子元件2及无线收发芯片21的电磁波、噪声等干扰经由屏蔽导热层5导引至金属屏蔽框3及电路板1内部铜箔层11进行接地消弭，而复数电子元件2及无线收发芯片21的热能则可通过屏蔽导热层5(主要为通过石墨烯材料)传导至保护防刮层6表面进行快速排散，而可符合电子装置轻、薄、短、小化的趋势，并可有效降低制造无线电路模块生产成本。本发明应用于生产无线通信电路板领域中具有极佳的实用性，故提出申请以寻求专利权的保护。
以上所述仅为本发明的较佳实施例而已，并非因此即局限本发明的范围，故举凡运用本发明说明书及图式内容所为的简易修饰及等效结构变化，均应同理包含于本发明的保护范围内，合予陈明。
Claims (9)
- 一种可绝缘及抑制电磁波的无线电路模块，其特征在于，包括：一电路板，其表面焊接设有复数电子元件，且该复数电子元件中包括至少一具通信功能的一无线收发芯片，并于该复数电子元件外部圈设有能够屏蔽电磁波的一金属屏蔽框，且该金属屏蔽框底侧连接于该电路板内部作为接地的一铜箔层；一绝缘层，是将绝缘材料涂布于该电路板及该复数电子元件表面并融合形成呈薄膜状绝缘层，但于该金属屏蔽框表面则未点设该绝缘材料及形成该绝缘层；一屏蔽导热层，涂布于该绝缘层的局部、该无线收发芯片及该金属屏蔽框表面并形成有能够屏蔽顶侧电磁波的呈薄膜状屏蔽导热层；以及一保护防刮层，涂布于该屏蔽导热层表面及未被该屏蔽导热层覆盖的该绝缘层的局部，并形成有该保护防刮层大于该绝缘层且该绝缘层大于该屏蔽导热层的三层结构。
- 如权利要求1所述的可绝缘及抑制电磁波的无线电路模块，其特征在于，该绝缘层是以计算机控制的一第一压电点胶装置以非接触方式将绝缘材料点设涂布于该电路板及该复数电子元件表面，而该无线收发芯片表面则点设或未点设该绝缘材料及形成该绝缘层；该屏蔽导热层是通过一第一雾化装置喷洒涂布于该绝缘层的局部、该无线收发芯片及该金属屏蔽框表面；该保护防刮层是通过一第二雾化装置或一第二压电点胶装置涂布成型于该屏蔽导热层表面及未被该屏蔽导热层覆盖的该绝缘层的局部。
- 如权利要求1所述的可绝缘及抑制电磁波的无线电路模块，其特征在于，该绝缘层的成分包括：基料及高分子材料交联剂，该基料成分包括：聚胺酯、聚亚酰胺、聚碳酸酯、聚酰胺、环氧树酯、聚乙烯亚胺、聚二甲基硅氧烷、压克力系聚合物、醚系聚合物或聚烯烃的其中之一或组合；该高分子材料交联剂包括：高亚胺甲醚化三聚氰胺树脂或氮丙啶或碳二亚胺或环氧基交联剂，且进一步针对氨基、羧基、酰胺键官能基团。
- 如权利要求1所述的可绝缘及抑制电磁波的无线电路模块，其特征在于，该屏蔽导热层的成分包括：基料、黏结剂及高分子材料交联剂，该基料成分包括：纳米碳管、石墨烯及银包铜；该黏结剂包括：聚胺酯、聚亚酰胺、聚碳酸酯、聚酰胺、聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚乙烯亚胺、聚二甲基硅氧烷、压克 力系聚合物、醚系聚合物或聚烯烃的其中之一或组合；该高分子材料交联剂包括：高亚胺甲醚化三聚氰胺树脂或氮丙啶或碳二亚胺，且进一步针对氨基、羧基、酰胺键官能基团；而该屏蔽导热层厚度范围为1～150μm，且该屏蔽导热层的厚度进一步为20～60μm；该银包铜呈片状体结构，其颗粒长度范围为10～100μm。
- 如权利要求1所述的可绝缘及抑制电磁波的无线电路模块，其特征在于，该保护防刮层的成分包括：基料及高分子材料交联剂，该基料成分包括：聚胺酯、聚亚酰胺、聚碳酸酯、聚酰胺、聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚乙烯亚胺、聚二甲基硅氧烷、压克力系聚合物、醚系聚合物或聚烯烃的其中之一或组合；该高分子材料交联剂包括：高亚胺甲醚化三聚氰胺树脂或氮丙啶或碳二亚胺，且进一步针对氨基、羧基、酰胺键官能基团。
- 一种可绝缘及抑制电磁波的无线电路模块的制造方法，其特征在于，包括有下列步骤：(A)提供表面已焊接复数电子元件的一电路板，且该复数电子元件中包括至少一具通信功能的一无线收发芯片，并于该复数电子元件外部圈设有一金属屏蔽框，且该金属屏蔽框底侧连接于该电路板内部的一铜箔层；(B)将绝缘材料涂布于该电路板及该复数电子元件表面并融合形成呈薄膜状绝缘层，但于该金属屏蔽框表面则未点设该绝缘材料及形成该绝缘层；(C)涂布于该绝缘层的局部、该无线收发芯片及该金属屏蔽框表面并形成有能够屏蔽顶侧电磁波的呈薄膜状屏蔽导热层；以及(D)涂布于该屏蔽导热层表面及未被该屏蔽导热层覆盖的该绝缘层的局部形成有一保护防刮层，并形成有该保护防刮层大于该绝缘层且该绝缘层大于该屏蔽导热层的三层结构。
- 如权利要求6所述的可绝缘及抑制电磁波的无线电路模块的制造方法，其特征在于，该步骤(B)中，该绝缘层是以计算机控制的一第一压电点胶装置以非接触方式将绝缘材料点设涂布于该电路板及该复数电子元件表面，而该无线收发芯片表面则点设或未点设该绝缘材料及形成该绝缘层。
- 如权利要求6所述的可绝缘及抑制电磁波的无线电路模块的制造方法，其特征在于，该步骤(C)中，该屏蔽导热层是通过一第一雾化装置喷洒涂布于该绝缘层的局部、该无线收发芯片及该金属屏蔽框表面。
- 如权利要求6所述的可绝缘及抑制电磁波的无线电路模块的制造方法，其特征在于，该步骤(D)中，该保护防刮层是通过一第二雾化装置或一第二压电点胶 装置涂布成型于该屏蔽导热层表面及未被该屏蔽导热层覆盖的该绝缘层的局部。
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| JP2003298004A (ja) * | 2002-04-04 | 2003-10-17 | Fujitsu Ltd | 素子間干渉電波シールド型高周波モジュール及び電子装置 |
| CN110325019A (zh) * | 2019-07-02 | 2019-10-11 | 华为技术有限公司 | 一种电子设备 |
| CN112654130A (zh) * | 2019-10-11 | 2021-04-13 | 驿科新材料科技(深圳)有限公司 | 具防水、防电磁波功能的电路板及其制造方法 |
-
2023
- 2023-02-13 WO PCT/CN2023/075639 patent/WO2024168459A1/zh unknown
- 2023-02-13 CN CN202380052983.0A patent/CN119678658A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003298004A (ja) * | 2002-04-04 | 2003-10-17 | Fujitsu Ltd | 素子間干渉電波シールド型高周波モジュール及び電子装置 |
| CN110325019A (zh) * | 2019-07-02 | 2019-10-11 | 华为技术有限公司 | 一种电子设备 |
| CN112654130A (zh) * | 2019-10-11 | 2021-04-13 | 驿科新材料科技(深圳)有限公司 | 具防水、防电磁波功能的电路板及其制造方法 |
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| Publication number | Publication date |
|---|---|
| CN119678658A (zh) | 2025-03-21 |
| WO2024168459A4 (zh) | 2025-01-02 |
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