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WO2023011640A1 - 多层堆叠封装组件及多层组件的封装方法 - Google Patents

多层堆叠封装组件及多层组件的封装方法 Download PDF

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Publication number
WO2023011640A1
WO2023011640A1 PCT/CN2022/110608 CN2022110608W WO2023011640A1 WO 2023011640 A1 WO2023011640 A1 WO 2023011640A1 CN 2022110608 W CN2022110608 W CN 2022110608W WO 2023011640 A1 WO2023011640 A1 WO 2023011640A1
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Prior art keywords
contact surface
height
layer
shielding
shielding member
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PCT/CN2022/110608
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English (en)
French (fr)
Inventor
姚力
付发田
马海燕
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展讯通信（上海）有限公司
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Priority to US18/681,388 priority Critical patent/US20240341029A1/en
Publication of WO2023011640A1 publication Critical patent/WO2023011640A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers

Definitions

  • the invention belongs to the technical field of packaging, and in particular relates to a multilayer stacked packaging component and a packaging method for the multilayer component.
  • the technical problem to be solved by the present invention is to provide a multi-layer stack package assembly and a packaging method for the multi-layer assembly in order to overcome the above-mentioned defects in the prior art.
  • a multi-layer stacked package assembly which includes at least two layers of circuit boards, an adapter plate is provided between adjacent two layers of circuit boards, and the upper contact surface and/or lower contact of the adapter plate in contact with the circuit board There are shielding parts on the surface;
  • the shield surrounds all the electrical components on the corresponding contact surface, and the height of the shield is not less than the height of all the electrical components.
  • the outer surface of the package assembly includes a shielding coating generated based on EMI Coating;
  • the shielding coating and the shielding member constitute a shielding assembly of the multi-layer stack package assembly.
  • connection method between the shielding member and the adapter plate includes pasting or welding
  • the shielding element is formed on the adapter plate by means of electroplating.
  • the material of the shielding member includes conductive metal.
  • the shielding member is made of copper.
  • the shape of the shielding member includes any one of hollow circle, square and rectangle.
  • a packaging method for a multilayer assembly includes at least two layers of circuit boards, the method comprising:
  • a shield is provided on the upper contact surface and/or the lower contact surface of the adapter plate, the shield surrounds all the electrical components on the corresponding contact surface, and the height of the shield is not less than the height of all the electrical components;
  • the adapter boards are respectively arranged between any two layers of circuit boards
  • a shielding coating is generated on the outer surface of the multilayer assembly and the adapter board based on EMI Coating.
  • the packaging method further includes:
  • the step of arranging the shield on the upper contact surface and/or the lower contact surface of the adapter plate specifically includes:
  • the step of arranging the shield on the upper contact surface and/or the lower contact surface of the adapter plate specifically includes:
  • the shielding element is formed on the adapter plate by electroplating.
  • the positive progress effect of the present invention is: by setting the shielding part on the adapter part of the multi-layer component, combined with the EMI Coating process, while ensuring the small size of the entire package component, EMI caused by the gap caused by the substrate stacking is avoided Poor protection.
  • FIG. 1 is a schematic side sectional view of a multi-layer stacked package assembly according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic top view of the shielding element in the multilayer stacked package assembly according to Embodiment 1 of the present invention.
  • FIG. 3 is a flow chart of a packaging method for a multi-layer component according to Embodiment 2 of the present invention.
  • a multi-layer stacked packaging assembly which includes at least two layers of circuit boards 1, an adapter plate 2 is provided between adjacent two layers of circuit boards 1, as shown in Figure 1, the adapter plate 2 and the circuit board 1
  • the upper contact surface and/or the lower contact surface of the contact is provided with a shielding member 3;
  • shielding elements 3 are provided on required contact surfaces according to actual needs.
  • the shield 3 surrounds all the electrical components 4 on the corresponding contact surface, and the height of the shield 3 is not less than the height of all the electrical components 4 .
  • the height of the shielding member 3 is the same as the maximum height of the electrical component 4 .
  • the electrical component 4 may be a basic circuit structure such as a copper pad, a solder point or a solder ball 7 and the like.
  • the outer surface of the package assembly includes a shielding coating 6 generated based on EMI Coating;
  • the shielding coating 6 and the shielding member 3 constitute a shielding assembly of the multi-layer stacked package assembly.
  • the shield 3 surrounds all the electrical components 4 on the corresponding contact surface, and after the adapter board 2 is installed between two adjacent circuit boards 1, a shielding coating is generated on the outer surface of the packaging component based on EMI Coating 6.
  • the shielding coating 6 just wraps the entire multilayer assembly, and the shielding coating 6 just physically connects with the shielding member 3 provided in the gap between the stacked substrates, thereby forming a complete shielding layer.
  • connection method between the shielding member 3 and the adapter plate 2 includes sticking or welding
  • the shielding element 3 is formed on the adapter board 2 by means of electroplating.
  • this situation is mainly due to the fact that if the height of the electrical element 4 on the corresponding contact surface is relatively low, it is more convenient to form the shielding member 3 directly on the surface of the adapter plate 2 by electroplating when manufacturing the adapter plate 2 .
  • the material of the shielding member 3 includes conductive metal, preferably, the material of the shielding member 3 is copper.
  • the shape of the shielding member 3 includes any one of hollow circle, square, and rectangle.
  • the shape of the shielding member 3 is mainly determined according to the shape of the circuit board 1 and the distribution of the electrical components 4 on the circuit board 1 and the adapter board 2. It is general, considering that most of the circuit board 1 is rectangular, so , The shielding member 3 is also rectangular. Referring to FIG. 2 , a schematic top view of the shielding member is shown.
  • a packaging method of a multilayer assembly includes at least two layers of circuit boards, as shown in Figure 3, the method includes:
  • Step 11 A shield is provided on the upper contact surface and/or the lower contact surface of the adapter board, the shield surrounds all the electrical components on the corresponding contact surface, and the height of the shield is not less than the height of all the electrical components; wherein, the electrical Components can be basic circuit structures such as copper pads, solder joints, or solder balls.
  • Step 12 respectively setting up an adapter board between any two layers of circuit boards
  • Step 13 Generate a shielding coating on the outer surface of the multilayer component and the adapter board based on EMI Coating.
  • the packaging method before step 11, the packaging method further includes:
  • Step 100 obtaining the maximum height of the electrical element on the corresponding contact surface
  • Step 101 generate a shielding member whose height is not less than the maximum height.
  • step 11 specifically includes:
  • step 11 is provided in this embodiment, which specifically includes:
  • the maximum height of the electrical element on the corresponding contact surface is obtained, and if the maximum height is less than a preset value, the shielding element is formed on the adapter plate by means of electroplating.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本发明公开了一种多层堆叠封装组件及多层组件的封装方法，多层堆叠封装组件包括至少两层电路板，相邻两层电路板之间设有转接板，其特征在于，所述转接板与所述电路板接触的上接触面和/或下接触面上设有屏蔽件；所述屏蔽件包围对应接触面上的所有电元件，且所述屏蔽件的高度不小于所述所有电元件的高度。本申请通过在多层组件的转接件上设置屏蔽件，结合EMI Coating工艺，在确保整个封装组件的体积小的同时，避免了因为基板堆叠带来的空隙造成的EMI保护不良。

Description

多层堆叠封装组件及多层组件的封装方法 技术领域
本发明属于封装技术领域，特别涉及一种多层堆叠封装组件及多层组件的封装方法。
背景技术
传统的单层SIP/Module(系统级封装或模块级封装)封装过程中，通常采用外部EMI Coating(电磁干扰涂层工艺)或者Metal CAN(金属盖工艺)的形式达到屏蔽电磁干扰的目的。
但是，对于多层堆叠结构的SIP/Module，基本方法还是采用的EMI Coating或Metal CAN，其存在以下问题：
对于EMI Coating：由于涂层材料的导电特性，为防止电性不良，在不同基板结合处的区域是无法使用的，导致基板结合处的区域不能被有效屏蔽。
对于Metal CAN：由于其采用的是整个覆盖的方式，随着堆叠结构的增多，整个封装组件的尺寸会因为屏蔽盖的原因而变的更大。
发明内容
本发明要解决的技术问题是为了克服现有技术中的上述缺陷，提供一种多层堆叠封装组件及多层组件的封装方法。
本发明是通过下述技术方案来解决上述技术问题：
一种多层堆叠封装组件，其包括至少两层电路板，相邻两层电路板之间设有转接板，所述转接板与所述电路板接触的上接触面和/或下接触面上设有屏蔽件；
所述屏蔽件包围对应接触面上的所有电元件，且所述屏蔽件的高度不小于所述所有电元件的高度。
较佳地，所述封装组件的外表面包括基于EMI Coating生成的屏蔽涂层；
所述屏蔽涂层与所述屏蔽件构成所述多层堆叠封装组件的屏蔽组件。
较佳地，所述屏蔽件与所述转接板的连接方式包括粘贴或焊接；
或，若所述屏蔽件的高度小于预设值，则通过电镀的方式在所述转接板上生成所述屏蔽件。
较佳地，所述屏蔽件的材质包括导电金属。
较佳地，所述屏蔽件的材质包括铜。
较佳地，所述屏蔽件的形状包括中空的圆形、正方形、长方形中的任意一种。
一种多层组件的封装方法，多层组件包括至少两层电路板，所述方法包括：
在转接板的上接触面和/或下接触面上设置屏蔽件，所述屏蔽件包围对应接触面上的所有电元件，且所述屏蔽件的高度不小于所述所有电元件的高度；
在任意两层电路板之间分别设置所述转接板；
基于EMI Coating在所述多层组件和所述转接板的外表面生成屏蔽涂层。
较佳地，所述在转接板的上接触面和/或下接触面上设置屏蔽件的步骤之前，所述封装方法还包括：
获取所述对应接触面上的电元件的最大高度；
生成高度不小于所述最大高度的屏蔽件。
较佳地，所述在转接板的上接触面和/或下接触面上设置所述屏蔽件的步骤具体包括：
将所述屏蔽件粘贴或焊接在所述对应接触面上。
较佳地，所述在转接板的上接触面和/或下接触面上设置屏蔽件的步骤具体包括：
获取所述对应接触面上的电元件的最大高度；
若所述最大高度小于预设值，则通过电镀的方式在所述转接板上生成所述屏蔽件。
本发明的积极进步效果在于：通过在多层组件的转接件上设置屏蔽件，结合EMI Coating工艺，在确保整个封装组件的体积小的同时，避免了因为基板堆叠带来的空隙造成的EMI保护不良。
附图说明
图1为本发明实施例1的多层堆叠封装组件的侧视剖面示意图。
图2为本发明实施例1的多层堆叠封装组件中屏蔽件的俯视示意图。
图3为本发明实施例2的多层组件的封装方法的流程图。
具体实施方式
下面通过实施例的方式进一步说明本发明，但并不因此将本发明限制在所述的实施例范围之中。
实施例1
一种多层堆叠封装组件，其包括至少两层电路板1，相邻两层电路板1之间设有转接板2，如图1所示，所述转接板2与所述电路板1接触的上接触面和/或下接触面上设有屏蔽件3；
需要说明的是，实际应用中，根据实际需要在需要的接触面上设置屏蔽件3。
所述屏蔽件3包围对应接触面上的所有电元件4，且所述屏蔽件3的高度不小于所述所有电元件4的高度。优选的，为了整个封装组件的尺寸更加紧凑，屏蔽件3的高度与所述电元件4的最大高度相同。其中，电元件4可以是基本的电路结构比如铜垫、焊点或焊球7等。
另外，参见图1，每层电路板1上均设有电子元件5。所述封装组件的外表面包括基于EMI Coating生成的屏蔽涂层6；
所述屏蔽涂层6与所述屏蔽件3构成所述多层堆叠封装组件的屏蔽组件。
需要说明的是，屏蔽件3包围对应接触面上的所有电元件4，转接板2安装在相邻两层电路板1之间后，再基于EMI Coating对封装组件的外表面生成屏蔽涂层6，屏蔽涂层6刚好包裹整个多层组件，且屏蔽涂层6刚好与基板堆叠的间隙设置的屏蔽件3物理连接上，进而构成了一个完整的屏蔽层。
其中，所述屏蔽件3与所述转接板2的连接方式包括粘贴或焊接；
需要说明的是，这种情况主要是考虑到因为存在基板间焊接缝隙较大的情况，例如BGA焊接，所以有的场合需要准备有一定厚度的屏蔽件3，使得其能够与焊球7高度匹配。
或，若所述屏蔽件3的高度小于预设值，则通过电镀的方式在所述转接板2上生成所述屏蔽件3。
需要说明的是，这种情况主要是考虑到，若对应接触面上的电元件4的高度较低，在制作转接板2时，可以直接在其表面电镀生成屏蔽件3，更加便利。
本实施例中，所述屏蔽件3的材质包括导电金属，优选的，所述屏蔽件3的材质为铜。
本实施例中，所述屏蔽件3的形状包括中空的圆形、正方形、长方形中的任意一种。
需要说明的是，屏蔽件3的形状主要是根据电路板1的形状以及电路板1和转接板2上的电元件4的分布决定，通用的，考虑到电路板1大部分为长方形，因此，屏蔽件3也才用长方形，参见图2，示出了屏蔽件的俯视示意图。
本实施例中，通过在多层组件的转接件上设置屏蔽件，结合EMI Coating工艺，在确 保整个封装组件的体积小的同时，避免了因为基板堆叠带来的空隙造成的EMI保护不良。
实施例2
一种多层组件的封装方法，多层组件包括至少两层电路板，如图3所示，所述方法包括：
步骤11、在转接板的上接触面和/或下接触面上设置屏蔽件，屏蔽件包围对应接触面上的所有电元件，且屏蔽件的高度不小于所有电元件的高度；其中，电元件可以是基本的电路结构比如铜垫、焊点或焊球等。
需要说明的是，实际应用中，根据实际需要在需要的接触面上设置屏蔽件。
步骤12、在任意两层电路板之间分别设置转接板；
步骤13、基于EMI Coating在多层组件和转接板的外表面生成屏蔽涂层。
本实施例中，步骤11之前，所述封装方法还包括：
步骤100、获取对应接触面上的电元件的最大高度；
步骤101、生成高度不小于最大高度的屏蔽件。
进一步的，步骤11具体包括：
将所述屏蔽件粘贴或焊接在所述对应接触面上。
需要说明的是，这种情况主要是考虑到，因为存在基板间焊接缝隙较大的情况，例如BGA焊接，所以有的场合需要准备有一定厚度的屏蔽件，使得其能够与焊球高度匹配。
另外，本实施例中提供步骤11的另一种实现方式，具体包括：
获取所述对应接触面上的电元件的最大高度，若所述最大高度小于预设值，则通过电镀的方式在所述转接板上生成所述屏蔽件。
需要说明的是，这种情况主要是考虑到，若对应接触面上的电元件的高度较低，在制作转接板时，可以直接在其表面电镀生成屏蔽件，更加便利。
本实施例中，通过在多层组件的转接件上设置屏蔽件，结合EMI Coating工艺，在确保整个封装组件的体积小的同时，避免了因为基板堆叠带来的空隙造成的EMI保护不良。
虽然以上描述了本发明的具体实施方式，但是本领域的技术人员应当理解，这仅是举例说明，本发明的保护范围是由所附权利要求书限定的。本领域的技术人员在不背离本发明的原理和实质的前提下，可以对这些实施方式做出多种变更或修改，但这些变更和修改均落入本发明的保护范围。

Claims (20)

  1. 一种多层堆叠封装组件，其包括至少两层电路板，相邻两层电路板之间设有转接板，其特征在于，所述转接板与所述电路板接触的上接触面和/或下接触面上设有屏蔽件；
    所述屏蔽件包围对应接触面上的所有电元件，且所述屏蔽件的高度不小于所述所有电元件的高度。
  2. 如权利要求1所述的多层堆叠封装组件，其特征在于，所述封装组件的外表面包括基于EMI Coating生成的屏蔽涂层；
    所述屏蔽涂层与所述屏蔽件构成所述多层堆叠封装组件的屏蔽组件。
  3. 如权利要求1所述的多层堆叠封装组件，其特征在于，所述屏蔽件与所述转接板的连接方式包括粘贴或焊接；
    或，若所述屏蔽件的高度小于预设值，则通过电镀的方式在所述转接板上生成所述屏蔽件。
  4. 如权利要求1所述的多层堆叠封装组件，其特征在于，所述屏蔽件的材质包括导电金属。
  5. 如权利要求3所述的多层堆叠封装组件，其特征在于，所述屏蔽件的材质包括铜。
  6. 如权利要求1所述的多层堆叠封装组件，其特征在于，所述屏蔽件的形状包括中空的圆形、正方形、长方形中的任意一种。
  7. 如权利要求1所述的多层堆叠封装组件，其特征在于，所述屏蔽件的高度为所述所有电元件中具有最大高度的电元件的高度。
  8. 如权利要求1所述的多层堆叠封装组件，其特征在于，所述电元件的电路结构为：铜垫、焊点或焊球。
  9. 如权利要求2所述的多层堆叠封装组件，其特征在于，所述屏蔽涂层与所述屏蔽件物理连接。
  10. 如权利要求1所述的多层堆叠封装组件，其特征在于，所述屏蔽件的形状根据所述电路板的形状，以及所述电路板和所述转接板上的电元件的分布决定。
  11. 一种多层组件的封装方法，多层组件包括至少两层电路板，其特征在于，所述方法包括：
    在转接板的上接触面和/或下接触面上设置屏蔽件，所述屏蔽件包围对应接触面上的所有电元件，且所述屏蔽件的高度不小于所述所有电元件的高度；
    在任意两层电路板之间分别设置所述转接板；
    基于EMI Coating在所述多层组件和所述转接板的外表面生成屏蔽涂层。
  12. 如权利要求11所述的多层组件的封装方法，其特征在于，所述在转接板的上接触面和/或下接触面上设置屏蔽件的步骤之前，所述封装方法还包括：
    获取所述对应接触面上的电元件的最大高度；
    生成高度不小于所述最大高度的屏蔽件。
  13. 如权利要求12所述的多层组件的封装方法，其特征在于，所述在转接板的上接触面和/或下接触面上设置所述屏蔽件的步骤具体包括：
    将所述屏蔽件粘贴或焊接在所述对应接触面上。
  14. 如权利要求11所述的多层组件的封装方法，其特征在于，所述在转接板的上接触面和/或下接触面上设置屏蔽件的步骤具体包括：
    获取所述对应接触面上的电元件的最大高度；
    若所述最大高度小于预设值，则通过电镀的方式在所述转接板上生成所述屏蔽件。
  15. 如权利要求11所述的多层组件的封装方法，其特征在于，所述屏蔽件的材质包括导电金属。
  16. 如权利要求11所述的多层组件的封装方法，其特征在于，所述屏蔽件的形状包括中空的圆形、正方形、长方形中的任意一种。
  17. 如权利要求11所述的多层组件的封装方法，其特征在于，所述屏蔽件的高度为所述所有电元件中具有最大高度的电元件的高度。
  18. 如权利要求11所述的多层组件的封装方法，其特征在于，所述电元件的电路结构为：铜垫、焊点或焊球。
  19. 如权利要求11所述的多层组件的封装方法，其特征在于，所述屏蔽涂层与所述屏蔽件物理连接。
  20. 如权利要求11所述的多层组件的封装方法，其特征在于，所述屏蔽件的形状根据所述电路板的形状，以及所述电路板和所述转接板上的电元件的分布决定。
PCT/CN2022/110608 2021-08-06 2022-08-05 多层堆叠封装组件及多层组件的封装方法 WO2023011640A1 (zh)

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