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WO2020215224A1 - 转接板及其制作方法 - Google Patents

转接板及其制作方法 Download PDF

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Publication number
WO2020215224A1
WO2020215224A1 PCT/CN2019/083964 CN2019083964W WO2020215224A1 WO 2020215224 A1 WO2020215224 A1 WO 2020215224A1 CN 2019083964 W CN2019083964 W CN 2019083964W WO 2020215224 A1 WO2020215224 A1 WO 2020215224A1
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WO
WIPO (PCT)
Prior art keywords
connection pads
span
fixing
board
plate
Prior art date
Application number
PCT/CN2019/083964
Other languages
English (en)
French (fr)
Inventor
彭满芝
刘瑞武
何明展
Original Assignee
庆鼎精密电子（淮安）有限公司
鹏鼎控股(深圳)股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 庆鼎精密电子（淮安）有限公司, 鹏鼎控股(深圳)股份有限公司 filed Critical 庆鼎精密电子（淮安）有限公司
Priority to US16/767,878 priority Critical patent/US20210235581A1/en
Priority to CN201980006089.3A priority patent/CN112514065B/zh
Priority to PCT/CN2019/083964 priority patent/WO2020215224A1/zh
Priority to TW108116984A priority patent/TWI740144B/zh
Publication of WO2020215224A1 publication Critical patent/WO2020215224A1/zh
Priority to US17/536,321 priority patent/US11665820B2/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09445—Pads for connections not located at the edge of the PCB, e.g. for flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0169—Using a temporary frame during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer

Definitions

  • the invention relates to an adapter plate and a manufacturing method thereof, in particular to an adapter plate with different connecting pad spans at two ends and a manufacturing method thereof.
  • the adapter board is used to electrically connect the upper and lower circuit boards, or connect the circuit board and electronic components. If the centerline spans of the two solder pads of the two layers of circuit boards to be connected are not the same, at least two additional conversion layers are required to be connected. This method will increase the overall thickness of the adapter plate and increase the production process and cost.
  • An adapter board includes a board body and a plurality of wires arranged in the board body.
  • the board body includes a first surface and a second surface arranged opposite to each other.
  • the first surface is provided with A plurality of first connection pads, a plurality of second connection pads are provided on the second surface, each of the first connection pads is connected to one of the second connection pads through a wire, and a plurality of the first connections
  • the pad has a first span, a plurality of the second connecting pads have a second span, and the first span is not equal to the second span.
  • a method for manufacturing an adapter plate includes the following steps: providing a mold in which a plurality of first fixing plates and second fixing plates are arranged alternately at intervals, and the first fixing plate is provided with a plurality of The first fixing hole, the second fixing plate is provided with a plurality of second fixing holes; a plurality of wires are provided, and the plurality of wires are passed through the first fixing holes and the second fixing holes sequentially The first fixing plate and the second fixing plate; the non-conductive material is poured into the mold to form a blank; the blank is cut along both sides of the first fixing plate and the second fixing plate to obtain more
  • a board body the board body includes a first surface and a second surface that are opposed to each other; a plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface, each The first connection pad is connected to one second connection pad via a wire.
  • the method for manufacturing the adapter plate of the present invention can produce the adapter plate through the pouring and cutting process, and the process is simple and the cost is low.
  • the prepared adapter board does not need an intermediate conversion layer, and its volume is small.
  • Fig. 1 is a perspective schematic view of an adapter plate according to an embodiment of the present invention.
  • Fig. 2 is a cross-sectional view of the adapter plate shown in Fig. 1 along the line II-II.
  • Fig. 3 is a cross-sectional view of wires arranged in a mold according to an embodiment of the present invention.
  • FIG. 4 is a cross-sectional view of a green body formed after pouring the mold shown in FIG. 3.
  • Fig. 5 is a cross-sectional view of cutting the blank shown in Fig. 4 to form a plate.
  • the first fixed board 210 The first fixed board 210
  • an element when an element is considered to be “connected” to another element, it may be directly connected to another element or a centrally arranged element may exist at the same time.
  • an element When an element is considered to be “disposed on” another element, it can be directly disposed on another element or a centrally disposed element may also exist at the same time.
  • the present invention provides an adapter board 100 for electrically connecting substrates or components.
  • the substrate may be a circuit board, and the component may be an electronic component.
  • the adapter board 100 is used to electrically connect the first component and the second component.
  • the adapter board 100 includes a board body 10 and a plurality of wires 30 arranged in the board body 10.
  • the material of the plate body 10 may be polyether ether ketone (PEEK), polytetrafluoroethylene (Poly Tetra Fluoro Ethylene, PTFE), polyphenylsulfone resin (Poly Phenylene Sulfone Resins, PPSU), Non-conductive materials such as Liquid Crystal Polymer (LCP), Polyphenylene Sulfide (PPS), Fusible Polytetrafluoroethylene (PFA), and ceramic powder.
  • PEEK polyether ether ketone
  • PEEK polytetrafluoroethylene
  • PTFE Poly Tetra Fluoro Ethylene
  • PPSU polyphenylsulfone resin
  • Non-conductive materials such as Liquid Crystal Polymer (LCP), Polyphenylene Sulfide (PPS), Fusible Polytetrafluoroethylene (PFA), and ceramic powder.
  • the board body 10 includes a first surface 101 and a second surface 102.
  • the first surface 101 and the second surface 102 are arranged opposite to each other.
  • the areas of the first surface 101 and the second surface 102 are not equal.
  • the plate body 10 is substantially in the shape of a pyramid, and the area of the first surface 101 is smaller than the area of the second surface 102.
  • the projections of the first surface 101 on the plane where the second surface 102 is located all fall inside the second surface 102.
  • the first surface 101 is provided with a plurality of first connection pads 11, and the second surface 102 is provided with a plurality of second connection pads 12.
  • the area of the first connection pad 11 is smaller than that of the second connection pad 12 The area.
  • the distance between the center lines of two adjacent first connecting pads 11 is a first span.
  • any two adjacent first spans are equal.
  • the plurality of first connection pads 11 correspond to the plurality of solder pads (or component feet) of the first component one to one. That is, the distance between the center lines of two adjacent first component pads is also the first span.
  • the distance between the center lines of two adjacent second connecting pads 12 is a second span.
  • any two adjacent second spans are equal.
  • the plurality of second connection pads 12 correspond to the plurality of solder pads (or component feet) of the second component one to one. That is, the distance between the center lines of two adjacent second component pads is also the second span.
  • the first span and the second span are not equal, and preferably, the first span is smaller than the second span.
  • the plurality of first connection pads 11 are respectively used to connect the plurality of bonding pads of the first component.
  • the plurality of second connection pads 12 are respectively used for connecting the plurality of bonding pads of the second component.
  • the first connection pad 11 can protrude completely or partially from the first surface 101, and can also be embedded in the board body 10, and the second connection pad 12 can protrude completely or partially from the second surface 102. , Can also be embedded in the board body 10.
  • connection pad 11 and the connection pad 12 may be a conductor such as copper, aluminum, silver, gold, copper alloy or aluminum alloy.
  • the resistance of the connection pad 11 and the connection pad 12 is less than 0.00001 ohm.
  • Each wire 30 connects a first connection pad 11 and a second connection pad 21 respectively.
  • the distance between the center lines of two adjacent wires 30 is a third span, and the third span is greater than the first span of the two first connecting pads 11 connected to it, and smaller than the two connected to it.
  • the material of the wire 30 may be a conductor such as copper, aluminum, silver, gold, copper alloy or aluminum alloy.
  • the resistance of the wire 30 is less than 0.00001 ohm.
  • the cross-sectional area of the wire 30 is smaller than the cross-sectional area of the first connection pad 11 and the second connection pad 12 to prevent the adjacent wires 30 from contacting and short-circuiting.
  • the present invention provides a method for manufacturing an adapter plate, which includes the following steps.
  • a mold is provided.
  • the molding cavity of the mold is provided with a plurality of first fixing plates 210 and second fixing plates 220 arranged alternately at intervals, and the first fixing plate 210 is provided with A plurality of first fixing holes 2101, and a plurality of second fixing holes 2201 are provided on the second fixing plate 220.
  • the plurality of first fixing holes 2101 correspond to the preset positions of the plurality of first connection pads 11; the plurality of second fixing holes 2201 correspond to the preset positions of the plurality of second connection pads 12.
  • the distance between the center lines of two adjacent first fixing holes 2101 is smaller than the distance between the center lines of two adjacent second fixing holes 2201.
  • the second step please continue to refer to FIG. 3, provide a plurality of wires 30, and pass the plurality of wires 30 through the first fixing holes 2101 and the second fixing holes 2201 through the plurality of first fixing plates 210 and the second fixing holes.
  • Fixing board 220 The distance between the center lines of the first fixing hole 2101 is smaller than the third span of the two wires connected to it, and the distance between the center lines of the second fixing hole 2201 is larger than the third span of the two wires connected to it. distance. As the wire extends from the second fixing hole 2201 to the first fixing hole 2101, the third span becomes smaller and smaller.
  • the material of the wire 30 may be a conductor such as copper, aluminum, silver, gold, copper alloy or aluminum alloy.
  • the resistance of the wire 30 is less than 0.00001 ohm.
  • a non-conductive material is poured into the molding cavity of the mold to form a blank 300.
  • the non-conductive material may be polyether ether ketone (PEEK), polytetrafluoroethylene (polytetrafluoroethylene, PTFE), polyphenylsulfone resin (Poly Phenylene Sulfone Resins, PPSU), liquid crystal high Molecular polymer (Liquid Crystal Polymer, LCP), Poly Phenylene Sulfide (PPS), Fusible Polytetrafluoroethylene (PFA), Ceramic powder, etc.
  • PEEK polyether ether ketone
  • PEEK polytetrafluoroethylene
  • PTFE polytetrafluoroethylene
  • PPSU polyphenylsulfone resin
  • LCP Liquid Crystal Polymer
  • PPS Poly Phenylene Sulfide
  • PFA Fusible Polytetrafluoroethylene
  • the blank 300 is cut along both sides of the first fixing plate 210 and the second fixing plate 220 respectively to obtain a plurality of plates 10.
  • laser cutting can be used, or mechanical cutting with a knife can be used.
  • the board body 10 includes a first surface 101 and a second surface 102 opposite to each other.
  • a plurality of wires 30 are arranged in the board body 10, and two ends of the wires 30 are respectively exposed from the first surface 101 and the second surface 102.
  • a plurality of first connection pads 11 are formed on the first surface 101, and a plurality of second connection pads 12 are formed on the second surface 102.
  • the distance between the center lines of two adjacent first fixing holes 2101 is smaller than the corresponding first span of the first connecting pad 11, and the centers of two adjacent second fixing holes 2201 The line spacing is greater than the second span of the second connecting pad 12 corresponding to it.
  • a plurality of grooves are formed on the first surface 101 and the second surface 102 by laser ablation of the board body 10, and then the grooves are electroplated or filled with conductive material to form the first connection pad 11 and the second connection pad 12 .
  • first connection pad 11 and the second connection pad 12 can be formed by etching and electroplating, and other common methods in other industries can also be used.
  • Each of the first connection pads 11 is connected to one of the second connection pads 12 through a wire 30.
  • the board body 10 is cut along the outermost first connecting pad 11 and the second connecting pad 12.
  • the part of the board body 10 removed by cutting does not contain the wire 30.
  • the plate body 10 After being cut, the plate body 10 is roughly in the shape of a prism, and its occupied space is reduced. It can be understood that in other embodiments, this step may be omitted.
  • the method for manufacturing the adapter plate of the present invention can produce the adapter plate 100 through the pouring and cutting process, and the process is simple and the cost is low.
  • the prepared adapter board 100 does not require an intermediate conversion layer, and its volume is small.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

一种转接板(100)及其制作方法，包括：提供一模具，所述模具内设有多个第一固定板(210)与第二固定板(220)，第一固定板(210)上设有多个第一固定孔(2101)，第二固定板(220)上设有多个第二固定孔(2201)；提供多个导线(30)，将多个导线(30)依次穿过多个第一固定板(210)与第二固定板(220)；成型腔内灌注非导电材料形成坯体(300)；沿第一固定板(210)及第二固定板(220)的两侧分别对坯体(300)进行切割以得到多个板体(10)，板体(10)包括相对设置的第一表面(101)及第二表面(102)；在第一表面(101)形成多个第一连接垫(11)，在第二表面(102)形成多个第二连接垫(12)。

Description

转接板及其制作方法 技术领域
本发明涉及一种转接板及其制作方法，尤其涉及一种两端的连接垫跨距不同的转接板及其制作方法。
背景技术
转接板用于电性连接上下两层电路板，或是连接电路板与电子元件。如果待连接的两层电路板的两焊垫中心线跨距不相同，则至少需要额外设置两个转换层，才能进行连接。这种方式会提高转接板的整体厚度并增加制作流程及成本。
发明内容
鉴于以上内容，有必要提供一种转接板及其制作方法以解决上述问题。
一种转接板，所述转接板包括板体及设于所述板体中的多个导线，所述板体包括相对设置的第一表面与第二表面，所述第一表面设有多个第一连接垫，所述第二表面设有多个第二连接垫，每一所述第一连接垫通过一所述导线连接一个所述第二连接垫，多个所述第一连接垫具有第一跨距，多个所述第二连接垫具有第二跨距，所述第一跨距与所述第二跨距不相等。
一种转接板制作方法，其包括以下步骤：提供一模具，所述模具内设有多个交替间隔设置的第一固定板与第二固定板，所述第一固定板上设有多个第一固定孔，所述第二固定板上设有多个第二固定孔；提供多个导线，将多个所述导线通过所述第一固定孔及第二 固定孔依次穿过多个所述第一固定板与第二固定板；向所述模具内灌注非导电材料形成坯体；沿所述第一固定板及第二固定板的两侧分别对所述坯体进行切割以得到多个板体，所述板体包括相对设置的第一表面及第二表面；在所述第一表面形成多个第一连接垫，在所述第二表面形成多个第二连接垫，每个所述第一连接垫通过一个导线连接一个所述第二连接垫。
本发明的转接板制作方法通过灌注切割工艺即可制得转接板，其工艺简单，成本较低。制得的转接板无需中间的转换层，其体积较小。
附图说明
图1是本发明实施方式的转接板的立体示意图。
图2是图1所示转接板沿II-II线的剖视图。
图3是本发明实施方式的导线排布于模具中的剖视图。
图4是对图3所示模具灌注后形成坯体的剖视图。
图5是对图4所示坯体切割形成板体的剖视图。
主要元件符号说明
转接板                          100
板体                            10
第一表面                        101
第二表面                        102
第一连接垫                      11
第二连接垫                      12
导线                            30
第一固定板                      210
第一固定孔                      2101
第二固定板                      220
第二固定孔                      2201
坯体                            300
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中设置的元件。当一个元件被认为是“设置在”另一个元件，它可以是直接设置在另一个元件上或者可能同时存在居中设置的元件。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参阅图1及图2，本发明提供一种转接板100，所述转接板100用于电性连接基板或元件。所述基板可以是电路板，所述元件可以是电子元件。本实施例中，所述转接板100用于电性连接第一 元件与第二元件。
所述转接板100包括板体10及设于所述板体10中的多个导线30。
所述板体10的材质可以是聚醚醚酮(Poly Ether Ether Ketone，PEEK)、聚四氟乙烯(Poly Tetra Fluoro Ethylene，PTFE)、聚亚苯基砜树脂(Poly Phenylene Sulfone Resins，PPSU)、液晶高分子聚合物(Liquid Crystal Polymer，LCP)、聚苯硫醚(Poly Phenylene Sulfide，PPS)、可熔性聚四氟乙烯(Polytetrafluoro ethylene，PFA)、陶瓷粉等非导电材料。
所述板体10包括第一表面101与第二表面102，优选地，所述第一表面101与第二表面102相对设置。
所述第一表面101与第二表面102的面积不相等，优选地，所述板体10大致呈棱台状，其第一表面101的面积小于第二表面102的面积。优选地，所述第一表面101在第二表面102所在平面的投影全部落在所述第二表面102内部。
所述第一表面101设有多个第一连接垫11，所述第二表面102设有多个第二连接垫12，优选地，所述第一连接垫11的面积小于第二连接垫12的面积。相邻两所述第一连接垫11中心线之间的距离为第一跨距，优选地，任意相邻两个所述第一跨距相等。多个所述第一连接垫11与所述第一元件的多个焊垫(或零件脚)一一对应。即，相邻两所述第一元件焊垫中心线之间的距离也为第一跨距。相邻两所述第二连接垫12中心线之间的距离为第二跨距，优选地，任意相邻两个所述第二跨距相等。多个所述第二连接垫12与所述第二元件的多个焊垫(或零件脚)一一对应。即，相邻两所述第二元件焊垫中心线之间的距离也为第二跨距。所述第一跨距与所述第二跨距不相等，优选的，所述第一跨距小于第二跨距。多个所述第 一连接垫11分别用于连接所述第一元件的多个焊垫。多个所述第二连接垫12分别用于连接所述第二元件的多个焊垫。
所述第一连接垫11可全部或部分凸出于所述第一表面101，还可内埋于所述板体10，第二连接垫12可全部或部分凸出于所述第二表面102，还可内埋于所述板体10。
所述连接垫11及连接垫12的材质可以是铜、铝、银、金、铜合金或铝合金等导体。优选地，所述连接垫11及连接垫12的电阻小于0.00001欧姆。
每个导线30分别连接一个第一连接垫11与一个第二连接垫21。相邻两所述导线30中心线之间的距离为第三跨距，所述第三跨距大于与之相连接的两第一连接垫11的第一跨距，小于与之相连接的两第二连接垫12的第二跨距。随着两导线30由第二连接垫12向第一连接垫11延伸，其第三跨距越来越小。
所述导线30的材质可以是铜、铝、银、金、铜合金或铝合金等导体。优选地，所述导线30的电阻小于0.00001欧姆。
优选地，导线30的截面面积小于第一连接垫11及第二连接垫12的截面面积，以防止相邻导线30接触短路。
请参阅图1至图5，本发明提供一种转接板制作方法，其包括以下步骤。
第一步，请参见图3，提供一模具，所述模具的成型腔内设有多个交替间隔设置的第一固定板210与第二固定板220，所述第一固定板210上设有多个第一固定孔2101，所述第二固定板220上设有多个第二固定孔2201。
多个第一固定孔2101与预设的多个第一连接垫11的位置相对应；多个第二固定孔2201与预设的多个第二连接垫12的位置相对应。
在本实施方式中，相邻两所述第一固定孔2101的中心线的间距小于相邻两所述第二固定孔2201的中心线的间距。
第二步，继续请参见图3，提供多个导线30，将多个所述导线30通过所述第一固定孔2101及第二固定孔2201依次穿过多个第一固定板210与第二固定板220。所述第一固定孔2101的中心线的间距小于与之相连接的两导线的第三跨距，所述第二固定孔2201的中心线的间距大于与之相连接的两导线的第三跨距。随着所述导线由第二固定孔2201向第一固定孔2101延伸，所述第三跨距越来越小。
所述导线30的材质可以是铜、铝、银、金、铜合金或铝合金等导体。优选地，所述导线30的电阻小于0.00001欧姆。
第三步，请参见图4，向所述模具的成型腔内灌注非导电材料形成坯体300。
所述非导电材料可以是聚醚醚酮(Poly Ether Ether Ketone，PEEK)、聚四氟乙烯(Poly Tetra Fluoro Ethylene，PTFE)、聚亚苯基砜树脂(Poly Phenylene Sulfone Resins，PPSU)、液晶高分子聚合物(Liquid Crystal Polymer，LCP)、聚苯硫醚(Poly Phenylene Sulfide，PPS)、可熔性聚四氟乙烯(Polytetrafluoro ethylene，PFA)、陶瓷粉等。
第四步，请参见图5，沿所述第一固定板210及第二固定板220的两侧分别对所述坯体300进行切割以得到多个板体10。
在本步骤中，可以通过激光进行切割，还可以通过刀具机械切割。
所述板体10包括相对设置的第一表面101与第二表面102。多个导线30设于所述板体10中，且其两端分别从第一表面101与第二表面102露出。
第五步，请参见图1及图2，在所述第一表面101形成多个第一连接垫11，在所述第二表面102形成多个第二连接垫12。
在本实施方式中，相邻两所述第一固定孔2101的中心线的间距小于与之相对应的第一连接垫11的第一跨距，相邻两所述第二固定孔2201的中心线的间距大于与之相对应的第二连接垫12的第二跨距。
本实施例中，通过镭射烧蚀板体10于第一表面101和第二表面102形成多个凹槽，然后于凹槽内电镀或填充导电材料形成第一连接垫11及第二连接垫12。
其他实施方式中，所述第一连接垫11及第二连接垫12可以通过蚀刻、电镀形成，还可以采用其他行业通用方法。
每个所述第一连接垫11通过一个导线30连接一个所述第二连接垫12。
第六步，请参见图1，沿最外侧的第一连接垫11及第二连接垫12切割板体10。
切割去除的部分板体10中不含有导线30。
切割后所述板体10大致呈棱台状，其占用空间减小。可以理解，在其他实施例中，可以省略本步骤。
本发明的转接板制作方法通过灌注切割工艺即可制得转接板100，其工艺简单，成本较低。制得的转接板100无需中间的转换层，其体积较小。
另外，本领域技术人员还可在本发明精神内做其它变化，当然，这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围。

Claims (10)

  1. 一种转接板，其特征在于：所述转接板包括板体及设于所述板体中的多个导线，所述板体包括相对设置的第一表面与第二表面，所述第一表面设有多个第一连接垫，所述第二表面设有多个第二连接垫，每一所述第一连接垫通过一所述导线连接一个所述第二连接垫，多个所述第一连接垫具有第一跨距，多个所述第二连接垫具有第二跨距，所述第一跨距与所述第二跨距不相等。
  2. 如权利要求1所述的转接板，其特征在于：多个所述导线具有第三跨距，所述第三跨距大于与之相连接的两所述第一连接垫的第一跨距，小于与之相连接的两所述第二连接垫的第二跨距。
  3. 如权利要求2所述的转接板，其特征在于：随着所述导线由所述第二连接垫向所述第一连接垫延伸，所述第三跨距越来越小。
  4. 如权利要求1所述的转接板，其特征在于：所述导线的截面面积小于所述第一连接垫及所述第二连接垫的截面面积。
  5. 如权利要求1所述的转接板，其特征在于：所述第一表面的面积小于所述第二表面的面积，所述第一表面在所述第二表面所在平面的投影全部落在所述第二表面内部。
  6. 如权利要求1所述的转接板，其特征在于：所述板体的材质为聚醚醚酮、聚四氟乙烯、聚亚苯基砜树脂、液晶高分子聚合物、聚苯硫醚、可熔性聚四氟乙烯、陶瓷粉中的一种。
  7. 如权利要求1所述的转接板，其特征在于：所述导线的材质为铜、铝、银、金、铜合金或铝合金中的一种。
  8. 一种转接板制作方法，其包括以下步骤：
    提供一模具，所述模具内设有多个交替间隔设置的第一固定板与第二固定板，所述第一固定板上设有多个第一固定孔，所述第二固定板上设有多个第二固定孔；
    提供多个导线，将多个所述导线通过所述第一固定孔及第二固定孔依次穿过多个所述第一固定板与第二固定板；
    向所述模具内灌注非导电材料形成坯体；
    沿所述第一固定板及第二固定板的两侧分别对所述坯体进行切割以得到多个板体，所述板体包括相对设置的第一表面及第二表面；
    在所述第一表面形成多个第一连接垫，在所述第二表面形成多个第二连接垫，每个所述第一连接垫通过一个导线连接一个所述第二连接垫。
  9. 如权利要求8所述的转接板制作方法，其特征在于：相邻两所述第一固定孔的中心线的间距小于相邻两所述第二固定孔的中心线的间距。
  10. 如权利要求8所述的转接板制作方法，其特征在于：在所述第一表面形成多个第一连接垫，在所述第二表面形成多个第二连接垫步骤之后，还包括步骤：沿最外侧的第一连接垫及第二连接垫切割板体。
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