[go: up one dir, main page]

WO2020124784A1 - 一种电阻式触摸屏、 oled 显示器及其制作方法 - Google Patents

一种电阻式触摸屏、 oled 显示器及其制作方法 Download PDF

Info

Publication number
WO2020124784A1
WO2020124784A1 PCT/CN2019/076068 CN2019076068W WO2020124784A1 WO 2020124784 A1 WO2020124784 A1 WO 2020124784A1 CN 2019076068 W CN2019076068 W CN 2019076068W WO 2020124784 A1 WO2020124784 A1 WO 2020124784A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover plate
resistance layer
touch screen
carbon
resistive touch
Prior art date
Application number
PCT/CN2019/076068
Other languages
English (en)
French (fr)
Inventor
李旺明
Original Assignee
武汉华星光电半导体显示技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US16/468,010 priority Critical patent/US11309366B2/en
Publication of WO2020124784A1 publication Critical patent/WO2020124784A1/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

Definitions

  • the present application relates to the technical field of displays, and in particular, to a touch screen, an OLED display, and a manufacturing method thereof.
  • Capacitive touch is commonly used in touch screens of smart devices such as mobile phones and tablets.
  • Capacitive touch can be realized by two technologies: the first technology is OGS (One Glass Solution) technology, which is to touch sensing and drive line etching On the cover glass; the second technique is to etch the touch circuit on the film material, and then stick the touch screen part to the cover glass through optical glue.
  • OGS One Glass Solution
  • capacitive touch screens must use conductors to achieve pressure sensing, and non-conductors cannot achieve touch control. For example, after wearing insulating gloves, users must use a professional capacitive pen to achieve touch control on the screen. Moreover, capacitive touch screens may suffer from touch failure in high-temperature or cold environments.
  • the touch circuit in the capacitive touch screen is etched on the cover glass or film, which has a great restriction on the flexible bending of the OLED, thereby greatly restricting the curved surface of the display screen.
  • Embodiments of the present application provide a touch screen, an OLED display, and a manufacturing method thereof, to solve the problem that the existing capacitive touch screen has a narrow range of use and cannot be bent at a large angle.
  • An embodiment of the present application provides a resistive touch screen, including:
  • the conductive circuit and the carbon resistance layer are electrically connected to form an induction resistance layer.
  • a resistance area is provided on the cover plate between the conductive lines, and the carbon resistance layer is printed in the resistance area.
  • the material of the carbon resistance layer is footballene
  • the cover plate is a flexible cover plate.
  • An embodiment of the present application also provides an OLED display, including an OLED display panel and a resistive touch screen;
  • the resistive touch screen is attached to the OLED display panel
  • the resistive touch screen includes:
  • the conductive circuit and the carbon resistance layer are electrically connected to form an induction resistance layer.
  • a resistance area is provided on the cover plate between the conductive lines, and the carbon resistance layer is printed in the resistance area.
  • the material of the carbon resistance layer is footballene
  • the cover plate is a flexible cover plate.
  • An embodiment of the present application also provides a method for manufacturing a resistive touch screen, including:
  • a carbon resistance layer is printed on the cover plate between the conductive lines to electrically connect the conductive lines and the carbon resistance layer to form an induction resistance layer.
  • the forming of the conductive circuit on the cover plate specifically includes:
  • the magnetron sputtering process is used to plate the ITO layer on the cover plate;
  • a laser etching process is used to etch conductive lines on the ITO layer.
  • the printing of the carbon resistance layer on the cover plate between the conductive lines specifically includes:
  • a carbon resistance layer is printed on the resistance area.
  • the printing of the carbon resistance layer on the resistance area specifically includes:
  • a carbon resistive layer is printed on the resistance area using an SMT printing process.
  • the method further includes:
  • the method further includes:
  • the material of the carbon resistance layer is footballene
  • the cover plate is a flexible cover plate.
  • the beneficial effects of the present invention are: forming conductive lines on the cover plate, printing a carbon resistance layer on the cover plate between the conductive lines to electrically connect the conductive lines and the carbon resistance layer to form an induction resistance layer to be changed by external pressure
  • the size of the resistor is used to realize touch control, and the scope of application of the touch screen is improved, and any bending of the touch screen can be realized.
  • the structure is simple and the price is low.
  • FIG. 1 is a front view of a resistive touch screen provided by an embodiment of this application.
  • FIG. 2 is a top view of a resistive touch screen provided by an embodiment of this application.
  • FIG. 3 is a front view of an OLED display provided by an embodiment of this application.
  • FIG. 4 is a schematic flowchart of a method for manufacturing a resistive touch screen provided by an embodiment of the present application.
  • FIG. 1 is a schematic structural diagram of a resistive touch screen provided by an embodiment of the present application.
  • the resistive touch screen includes a cover plate 10 and a sensing resistance layer 13 formed on the cover plate.
  • the sensing resistance layer 13 includes a conductive line 11 and a carbon resistance layer 12.
  • the conductive circuit 11 is formed on the surface of the cover plate 10.
  • the conductive circuit 11 can be designed according to product requirements. That is, the conductive circuit formed on the cover plate 10 is different according to different product requirements.
  • the conductive line 11 is formed on the cover plate 10 by etching the ITO layer (indium tin oxide semiconductor transparent conductive film) on the cover plate 10.
  • the conductive lines 11 are hollowed out to expose the cover plate 10.
  • the exposed cover plate 10 is provided with a resistance area 14.
  • the carbon resistance layer 12 is printed on the surface of the cover plate 10 in the resistance area 14.
  • the resistance region 14 can be designed differently according to different product requirements, that is, the arrangement of the carbon resistance layer between the conductive lines can be designed in advance, and then the resistance region can be designed according to the arrangement of the carbon resistance layer.
  • the carbon resistance layer 12 passes SMT (Surface Mount Technology (Surface Mount Technology) printing process is printed on the resistance area 14. Since the carbon barrier layer is formed on the cover plate by printing, there is no limit to the bending degree of the cover plate.
  • the cover plate can be either a rigid cover plate, such as cover glass, or a flexible cover plate, such as ultra-thin glass Cover plates made of bendable materials such as covers.
  • the flexible cover plate can realize any bending of the touch screen and expand the use range of the touch screen.
  • the price of the carbon barrier layer is low, which can reduce the production cost.
  • the speed of the printing machine for printing the carbon barrier layer can reach 20S/PCS, which improves the production efficiency and reduces the production defect rate.
  • the carbon resistance layer 12 is electrically connected to the conductive circuit 11 to form a sensing resistance layer.
  • the carbon barrier layer 12 is made of footballene C 60 .
  • the atomic structure of footballene is spherical, and the molecular structure is a layered structure.
  • the external pressure causes a connection between the inner layer of the molecule and the layer, resulting in a change in the molecular structure. Changes will also cause changes in resistance.
  • the driver reacts accordingly according to the size and position of the resistance change, thereby realizing touch control.
  • This embodiment can be applied to many areas where capacitive touch is restricted, such as touch on the surface of a car's metal casing, touch on smart doors and windows, metal panel on a range hood, large-size touch TV, touch on the surface of outdoor public facilities, etc. Wait.
  • the resistive touch screen formed in this embodiment forms a conductive line on the cover plate, and prints a carbon resistance layer on the cover plate between the conductive lines to electrically connect the conductive line and the carbon resistance layer to form an inductive resistance layer ,
  • touch sensing can be achieved without the need for conductors, and can be applied to high temperature and cold environments, effectively improving the scope of application of the touch screen;
  • the use of a flexible cover can realize the touch screen It can be bent arbitrarily; there is no need to use polarizers and touchpads in capacitive touch screens, and low-cost carbon resistance layers and conductive lines are used to form sensing resistance layers, simplifying the touch screen structure and reducing costs.
  • FIG. 3 is a schematic structural diagram of an OLED display provided by an embodiment of the present application.
  • the OLED display includes an OLED display panel 20 and a resistive touch screen 21.
  • the resistive touch screen 21 is the above-mentioned resistive touch screen, which will not be described in detail here.
  • the resistive touch screen 21 is attached to the OLED display panel 20.
  • an optical glue is pasted on the OLED display panel, and the resistive touch screen 21 and the OLED display panel 20 are pasted together through a 3D lami process.
  • This embodiment can realize any bending of the OLED display, effectively improving the application range of the OLED display, and the OLED display of this embodiment has a simple structure and low price.
  • FIG. 4 is a schematic flowchart of a method for manufacturing a resistive touch screen provided by an embodiment of the present application.
  • the manufacturing method may include the following steps:
  • the cover plate may be a rigid cover plate, such as cover glass, or a flexible cover plate, such as a cover plate made of a bendable material, such as an ultra-thin glass cover plate.
  • the flexible cover plate can realize any bending of the touch screen and expand the use range of the touch screen.
  • the conductive circuit can be designed differently according to different product requirements.
  • conductive lines can be designed in advance.
  • the forming of the conductive circuit on the cover plate specifically includes:
  • a conductive line is etched on the ITO layer.
  • the magnetron sputtering process is used to plate the ITO layer on the cover plate, and then the ITO layer is etched using the laser etching process to etch the pre-designed conductive lines on the surface of the cover plate to form the surface of the cover plate Line layer.
  • the ITO between the conductive lines is etched away, so that a hollow area is formed between the conductive lines to expose the corresponding cover plate.
  • the carbon barrier layer can be designed in different arrangements according to different product requirements. Before making the touch screen, the arrangement of the carbon resistance layer between the conductive lines can be designed in advance.
  • the material of the carbon barrier layer is football 60 C 60 .
  • the conductive circuit on the cover plate is electrically connected with the carbon resistance layer to form an inductive resistance layer on the cover plate, thereby obtaining a resistive touch screen, and changing the size of the resistance through external pressure to realize touch control.
  • the carbon barrier layer is formed on the cover plate by printing, there is no limit to the bending degree of the cover plate, and the low price of the carbon barrier layer can reduce the manufacturing cost.
  • the printing machine for printing the carbon barrier layer The speed can reach 20S/PCS, which improves the production efficiency and reduces the production defect rate.
  • the printing of the carbon resistance layer on the cover plate between the conductive lines specifically includes:
  • a carbon resistance layer is printed on the resistance area.
  • the cover plate is exposed, and the exposed cover plate is provided with a resistance area, and the carbon resistance layer is printed on the surface of the cover plate in the resistance area.
  • the resistance area may be designed according to the arrangement of the carbon resistance layer between the conductive lines in advance.
  • the SMT printing process is preferably used to print the carbon resistance layer on the resistance region.
  • the screen plate is arranged above the cover plate and maintains a certain distance from the cover plate, and then the carbon resist ink is poured at the initial position of the scraper above the screen plate, so that the scraper uniformly distributes the carbon resist ink at a fixed pressure and speed Is printed onto the surface of the cover plate in the resistance area, thereby forming a carbon resistance layer that meets the pre-design.
  • the method further includes:
  • Plasma cleaning is performed on the cover plate to remove foreign materials on the surface of the cover plate, and make the water drop angle on the surface of the cover plate meet the printing requirements of the carbon barrier layer.
  • the foreign material on the surface of the cover plate will cause a large error in the carbon barrier layer after printing.
  • the water drop angle on the surface of the cover plate is too large, the carbon barrier layer will not have good contact and cannot be completely printed to The surface of the cover plate, so after the cover plate is obtained, the cover plate needs to be cleaned so that the surface of the cover plate is free of foreign matter, and the water drop angle on the surface of the cover plate meets the requirements of carbon resistance printing.
  • the method further includes:
  • the carbon resist ink is liquid, after printing the carbon resist layer on the cover plate, the carbon resist layer needs to be baked to cure the carbon resist layer.
  • the resistive touch screen can be bonded to the OLED display panel to which the optical glue has been bonded using 3D bonding technology to obtain an OLED display.
  • the manufacturing method of the resistive touch screen forms a conductive line on the cover plate, and prints a carbon resistance layer on the cover plate between the conductive lines to electrically connect the conductive line and the carbon resistance layer to form Sensing resistance layer, which realizes touch control by changing the size of the resistance through external pressure, can realize touch sensing without the need of a conductor, and can be applied in high temperature and cold environments, effectively improving the scope of application of the touch screen; using a flexible cover, can Realize any bending of the touch screen; there is no need to use polarizers and touch pads in the capacitive touch screen, and the low-cost carbon resistance layer and conductive circuit are used to form the sensing resistance layer, simplifying the manufacturing process and improving the manufacturing efficiency.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

本申请公开了一种电阻式触摸屏、OLED显示器及其制作方法，所述电阻式触摸屏包括：盖板；形成于所述盖板上的导电线路；印刷于所述导电线路之间的盖板上的碳阻层；其中，所述导电线路与所述碳阻层电性连接，以构成感应电阻层，以通过外部压力改变电阻大小来实现触控。

Description

一种电阻式触摸屏、OLED显示器及其制作方法 技术领域
本申请涉及显示器技术领域，尤其涉及一种触摸屏、OLED显示器及其制作方法。
 背景技术
目前，手机、平板等智能设备的触摸屏普遍采用的是电容触控，电容触控主要可通过两种技术实现：第一种技术是OGS（One Glass Solution）技术，即将触控感应及驱动线路蚀刻于盖板玻璃上；第二种技术是将触控线路蚀刻于薄膜（Film）材质上，然后将触摸屏部分通过光学胶与盖板玻璃贴合在一起。
但是，电容式触摸屏必须采用导体才能实现压力感应，非导体无法实现触控，例如用户戴上绝缘手套后必须采用专业的电容笔才能实现屏幕的触控。而且，电容式触摸屏在高温或寒冷的环境中会出现触控失灵的现象。另外，电容式触摸屏中的触控线路蚀刻于盖板玻璃或薄膜上，其对OLED的柔性弯折有很大限制，从而对显示屏的曲面程度造成很大限制。
 技术问题
本申请实施例提供一种触摸屏、OLED显示器及其制作方法，以解决现有电容式触摸屏使用范围窄，无法实现大角度弯折的问题。
 技术解决方案
本申请实施例提供了一种电阻式触摸屏，包括：
盖板；
形成于所述盖板上的导电线路；
印刷于所述导电线路之间的盖板上的碳阻层；
其中，所述导电线路与所述碳阻层电性连接，以构成感应电阻层。
进一步地，所述导电线路之间的盖板上设有电阻区域，所述碳阻层印刷于所述电阻区域中。
进一步地，所述碳阻层的材料为足球烯，所述盖板为柔性盖板。
本申请实施例还提供了一种OLED显示器，包括OLED显示面板以及电阻式触摸屏；
所述电阻式触摸屏贴合于所述OLED显示面板上；
所述电阻式触摸屏包括：
盖板；
形成于所述盖板上的导电线路；
印刷于所述导电线路之间的盖板上的碳阻层；
其中，所述导电线路与所述碳阻层电性连接，以构成感应电阻层。
进一步地，所述导电线路之间的盖板上设有电阻区域，所述碳阻层印刷于所述电阻区域中。
进一步地，所述碳阻层的材料为足球烯，所述盖板为柔性盖板。
本申请实施例还提供了一种电阻式触摸屏的制作方法，包括：
提供盖板；
在所述盖板上形成导电线路；
在所述导电线路之间的盖板上印刷碳阻层，使所述导电线路与所述碳阻层电性连接，以构成感应电阻层。
进一步地，所述在所述盖板上形成导电线路，具体包括：
采用磁控溅射工艺在所述盖板上镀ITO层；
采用激光蚀刻工艺在所述ITO层上蚀刻出导电线路。
进一步地，所述在所述导电线路之间的盖板上印刷碳阻层，具体包括：
在所述导电线路之间的盖板上设置电阻区域；
在所述电阻区域上印刷碳阻层。
进一步地，所述在所述电阻区域上印刷碳阻层，具体包括：
采用SMT印刷工艺在所述电阻区域上印刷碳阻层。
进一步地，所述在所述盖板上形成导电线路之前，还包括：
对所述盖板进行等离子清洗，以去除所述盖板表面的异物，并使所述盖板表面的水滴角达到所述碳阻层的印刷要求；
所述在所述导电线路之间的盖板上印刷碳阻层之后，还包括：
对所述碳阻层进行烘烤，使所述碳阻层固化。
进一步地，所述碳阻层的材料为足球烯，所述盖板为柔性盖板。
 有益效果
本发明的有益效果为：在盖板上形成导电线路，在导电线路之间的盖板上印刷碳阻层，使导电线路与碳阻层电性连接，构成感应电阻层，以通过外部压力改变电阻大小来实现触控，提高触摸屏的适用范围，且可实现触摸屏的任意弯折，结构简单，价格低廉。
 附图说明
下面结合附图，通过对本申请的具体实施方式详细描述，将使本申请的技术方案及其它有益效果显而易见。
图1为本申请实施例提供的电阻式触摸屏的主视图；
图2为本申请实施例提供的电阻式触摸屏的俯视图；
图3为本申请实施例提供的OLED显示器的主视图；
图4为本申请实施例提供的电阻式触摸屏的制作方法的流程示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
如图1所示，图1是本申请实施例提供的电阻式触摸屏的结构示意图，该电阻式触摸屏包括盖板10以及形成于所述盖板上的感应电阻层13。
结合图2所示，所述感应电阻层13包括导电线路11和碳阻层12。导电线路11形成于盖板10的表面，导电线路11可根据产品需求进行设计，即根据不同的产品需求设计，盖板10上所形成的导电线路不同。在一个具体的实施方式中，导电线路11通过盖板10上的ITO层（铟锡氧化物半导体透明导电膜）的蚀刻而形成于盖板10上。
导电线路11之间为镂空区域，以裸露出盖板10，裸露的盖板10上设有电阻区域14，碳阻层12印刷于电阻区域14中的盖板10的表面。电阻区域14可根据不同的产品需求进行不同的设计，即可预先设计导电线路之间的碳阻层的排列方式，进而根据碳阻层的排列方式对电阻区域进行设计。在一个具体的实施方式中，碳阻层12通过SMT（Surface Mount Technology，表面贴装技术）印刷工艺印刷在电阻区域14上。由于碳阻层采用印刷的方式形成于盖板上，因此对盖板的弯折度没有限制，盖板既可以为刚性盖板，例如盖板玻璃，也可以为柔性盖板，例如超薄玻璃盖板等由可弯折材料制作的盖板。采用柔性盖板可实现触摸屏的任意弯折，扩大触摸屏的使用范围。而且，碳阻层的价格低廉，能够降低制作成本，另外，印刷碳阻层的印刷机的速度可达到20S/PCS，在提高制作效率的同时，降低制作的不良率。
碳阻层12与导电线路11电性连接，以构成感应电阻层。其中，碳阻层12的制作材料为足球烯C 60。足球烯的原子结构为球状，分子构成为层叠结构。当足球烯受到外部压力时，原子变形，导致单层体积发生变化，从而导致电阻阻值变化，此外外部的压力导致分子内部层与层之间出现连接，从而导致分子结构变化，而分子结构的变化也会引起电阻阻值的变化。驱动器根据电阻阻值变化的大小和位置做出相应的反应，从而实现触控。本实施例可应用于许多电容触控受限制的区域，例如汽车金属外壳表面的触控，智能门窗、油烟机金属面板上的触控，大尺寸触控电视、室外公共设施表面的触控等等。
由上述可知，本实施例提供的电阻式触摸屏，在盖板上形成导电线路，在导电线路之间的盖板上印刷碳阻层，使导电线路与碳阻层电性连接，构成感应电阻层，以通过外部压力改变电阻大小来实现触控，无需通过导体即可实现触控感应，且可应用于高温和寒冷的环境中，有效提高触摸屏的适用范围；采用柔性盖板，可实现触摸屏的任意弯折；无需使用电容式触摸屏中的偏振片和触摸板，且使用价格低廉的碳阻层与导电线路构成感应电阻层，简化触摸屏结构，且降低成本。
如图3所示，图3是本申请实施例提供的OLED显示器的结构示意图，该OLED显示器包括OLED显示面板20以及电阻式触摸屏21。其中，所述电阻式触摸屏21为上述电阻式触摸屏，在此不再详细赘述。
电阻式触摸屏21贴合于所述OLED显示面板20上。在一个具体的实施方式中，所述OLED显示面板上贴合有光学胶，通过3D贴合（3D Lami）工艺使电阻式触摸屏21与OLED显示面板20贴合在一起。
本实施例可实现OLED显示器的任意弯折，有效提高OLED显示器的适用范围，且本实施例的OLED显示器结构简单，价格低廉。
如图4所示，图4是本申请实施例提供的电阻式触摸屏的制作方法的流程示意图，该制作方法可以包括如下步骤：
401、提供盖板。
在本实施例中，盖板既可以为刚性盖板，例如盖板玻璃，也可以为柔性盖板，例如超薄玻璃盖板等由可弯折材料制作的盖板。采用柔性盖板可实现触摸屏的任意弯折，扩大触摸屏的使用范围。
402、在所述盖板上形成导电线路。
在本实施例中，导电线路可根据不同的产品需求进行不同的设计。在制作触摸屏前，可预先设计出导电线路。
具体地，所述在所述盖板上形成导电线路，具体包括：
在所述盖板上镀ITO层；
在所述ITO层上蚀刻出导电线路。
需要说明的是，采用磁控溅射工艺在盖板上镀ITO层，再采用激光蚀刻工艺对ITO层进行蚀刻，以将预先设计的导电线路蚀刻在盖板的表面，使盖板的表面形成线路层。导电线路之间的ITO被蚀刻掉，使导电线路之间形成镂空区域，以裸露出相应的盖板。
403、在所述导电线路之间的盖板上印刷碳阻层，使所述导电线路与所述碳阻层电性连接，以构成感应电阻层。
在本实施例中，碳阻层可根据不同的产品需求进行不同的排列设计。在制作触摸屏前，可预先对导电线路之间的碳阻层的排列进行设计。在一个具体的实施方式中，碳阻层的材料为足球烯C 60。
盖板上的导电线路和碳阻层电性连接，形成位于盖板上的感应电阻层，从而获得电阻式触摸屏，通过外部压力改变电阻大小来实现触控。另外，由于碳阻层采用印刷的方式形成于盖板上，因此对盖板的弯折度没有限制，而且，碳阻层的价格低廉，能够降低制作成本，另外，印刷碳阻层的印刷机的速度可达到20S/PCS，在提高制作效率的同时，降低制作的不良率。
具体地，所述在所述导电线路之间的盖板上印刷碳阻层，具体包括：
在所述导电线路之间的盖板上设置电阻区域；
在所述电阻区域上印刷碳阻层。
需要说明的是，导电线路之间为镂空区域，裸露出盖板，裸露的盖板上设有电阻区域，碳阻层印刷于电阻区域中的盖板的表面。电阻区域可预先根据导电线路之间的碳阻层的排列方式进行设计。
在印刷碳阻层时，优先采用SMT印刷工艺在所述电阻区域上印刷碳阻层。具体为，将网板设置在盖板的上方并与盖板保持一定的间距，再将碳阻油墨倾倒在网板上方刮刀起始位置，进而使刮刀按照固定的压力和速度将碳阻油墨均匀的印刷至电阻区域中的盖板表面，从而形成满足预先设计的碳阻层。
进一步地，所述在所述盖板上形成导电线路之前，还包括：
对所述盖板进行等离子清洗，以去除所述盖板表面的异物，并使所述盖板表面的水滴角达到所述碳阻层的印刷要求。
需要说明的是，由于盖板表面有异物会导致碳阻层在印刷完成后具有很大误差，当盖板表面水滴角过大时，会导致碳阻层没有良好的接触性而无法完整印刷至盖板表面，因此在获取盖板后，需对盖板进行清洗，以使盖板表面无异物，且使盖板表面的水滴角达到碳阻印刷的要求。
进一步地，所述在所述导电线路之间的盖板上印刷碳阻层之后，还包括：
对所述碳阻层进行烘烤，使所述碳阻层固化。
需要说明的是，由于碳阻油墨为液态，在盖板上印刷碳阻层后，需对碳阻层进行烘烤，使碳阻层固化。
另外，在制作出电阻式触摸屏后，可采用3D贴合技术将电阻式触摸屏与已贴合有光学胶的OLED显示面板进行贴合，获得OLED显示器。
由上述可知，本实施例提供的电阻式触摸屏的制作方法，在盖板上形成导电线路，在导电线路之间的盖板上印刷碳阻层，使导电线路与碳阻层电性连接，构成感应电阻层，以通过外部压力改变电阻大小来实现触控，无需通过导体即可实现触控感应，且可应用于高温和寒冷的环境中，有效提高触摸屏的适用范围；采用柔性盖板，可实现触摸屏的任意弯折；无需使用电容式触摸屏中的偏振片和触摸板，且使用价格低廉的碳阻层与导电线路构成感应电阻层，简化制作工艺，且提高制作效率。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (12)

  1. 一种电阻式触摸屏，其中，包括：
    盖板；
    形成于所述盖板上的导电线路；
    印刷于所述导电线路之间的盖板上的碳阻层；
    其中，所述导电线路与所述碳阻层电性连接，以构成感应电阻层。
  2. 根据权利要求1所述的电阻式触摸屏，其中，所述导电线路之间的盖板上设有电阻区域，所述碳阻层印刷于所述电阻区域中。
  3. 根据权利要求1所述的电阻式触摸屏，其中，所述碳阻层的材料为足球烯，所述盖板为柔性盖板。
  4. 一种OLED显示器，其中，包括OLED显示面板以及电阻式触摸屏；
    所述电阻式触摸屏贴合于所述OLED显示面板上；
    所述电阻式触摸屏包括：
    盖板；
    形成于所述盖板上的导电线路；
    印刷于所述导电线路之间的盖板上的碳阻层；
    其中，所述导电线路与所述碳阻层电性连接，以构成感应电阻层。
  5. 根据权利要求4所述的OLED显示器，其中，所述导电线路之间的盖板上设有电阻区域，所述碳阻层印刷于所述电阻区域中。
  6. 根据权利要求4所述的OLED显示器，其中，所述碳阻层的材料为足球烯，所述盖板为柔性盖板。
  7. 一种电阻式触摸屏的制作方法，其中，包括：
    提供盖板；
    在所述盖板上形成导电线路；
    在所述导电线路之间的盖板上印刷碳阻层，使所述导电线路与所述碳阻层电性连接，以构成感应电阻层。
  8. 根据权利要求7所述的电阻式触摸屏的制作方法，其中，所述在所述盖板上形成导电线路，具体包括：
    采用磁控溅射工艺在所述盖板上镀ITO层；
    采用激光蚀刻工艺在所述ITO层上蚀刻出导电线路。
  9. 根据权利要求7所述的电阻式触摸屏的制作方法，其中，所述在所述导电线路之间的盖板上印刷碳阻层，具体包括：
    在所述导电线路之间的盖板上设置电阻区域；
    在所述电阻区域上印刷碳阻层。
  10. 根据权利要求9所述的电阻式触摸屏的制作方法，其中，所述在所述电阻区域上印刷碳阻层，具体包括：
    采用SMT印刷工艺在所述电阻区域上印刷碳阻层。
  11. 根据权利要求7所述的电阻式触摸屏的制作方法，其中，所述在所述盖板上形成导电线路之前，还包括：
    对所述盖板进行等离子清洗，以去除所述盖板表面的异物，并使所述盖板表面的水滴角达到所述碳阻层的印刷要求；
    所述在所述导电线路之间的盖板上印刷碳阻层之后，还包括：
    对所述碳阻层进行烘烤，使所述碳阻层固化。
  12. 根据权利要求7所述的电阻式触摸屏的制作方法，其中，所述碳阻层的材料为足球烯，所述盖板为柔性盖板。
PCT/CN2019/076068 2018-12-19 2019-02-25 一种电阻式触摸屏、 oled 显示器及其制作方法 WO2020124784A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/468,010 US11309366B2 (en) 2018-12-19 2019-02-25 Resistive touch screen, organic light emitting diode display, and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201811562430.7 2018-12-19
CN201811562430.7A CN109445642A (zh) 2018-12-19 2018-12-19 一种电阻式触摸屏、oled显示器及其制作方法

Publications (1)

Publication Number Publication Date
WO2020124784A1 true WO2020124784A1 (zh) 2020-06-25

Family

ID=65559570

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/076068 WO2020124784A1 (zh) 2018-12-19 2019-02-25 一种电阻式触摸屏、 oled 显示器及其制作方法

Country Status (3)

Country Link
US (1) US11309366B2 (zh)
CN (1) CN109445642A (zh)
WO (1) WO2020124784A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110618734A (zh) * 2019-08-28 2019-12-27 武汉华星光电半导体显示技术有限公司 显示装置及显示装置的制作方法
CN110597423A (zh) * 2019-09-17 2019-12-20 武汉华星光电半导体显示技术有限公司 电阻式触控屏和柔性显示装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1538772A (zh) * 2003-04-15 2004-10-20 诺基亚公司 便携式无线通信设备
CN1926501A (zh) * 2004-02-10 2007-03-07 泰科电子有限公司 带有可编程显示器盖板的电阻式触摸屏
CN102819336A (zh) * 2011-06-09 2012-12-12 天津富纳源创科技有限公司 触摸屏面板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007122568A (ja) * 2005-10-31 2007-05-17 Matsushita Electric Ind Co Ltd 抵抗膜式タッチパネルおよびその製造方法
TW201435946A (zh) * 2012-11-08 2014-09-16 Ajinomoto Kk 薄膜開關及使用其所成之物品
TWI629459B (zh) * 2013-02-06 2018-07-11 藤倉股份有限公司 Method for manufacturing pressure detecting device, pressure detecting device, pressure detecting device and electronic device
WO2016094580A1 (en) * 2014-12-09 2016-06-16 University Of Southern California Screen printing systems and techniques for creating thin-film transistors using separated carbon nanotubes
CN106293290B (zh) 2015-06-10 2023-08-29 宸鸿科技(厦门)有限公司 触控装置
CN105094441B (zh) * 2015-08-20 2018-09-28 宸鸿科技(厦门)有限公司 一种压力感测装置
CN107128090A (zh) * 2016-02-27 2017-09-05 三亚深海鲸电子科技有限公司 一种柔性阵列压敏传感器的丝网印刷制作方法
CN206039467U (zh) * 2016-07-01 2017-03-22 南昌欧菲光科技有限公司 压力感应器件及触摸显示装置
CN207764760U (zh) * 2017-12-13 2018-08-24 南昌欧菲显示科技有限公司 压力感应模组、触控显示屏和触控电子设备

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1538772A (zh) * 2003-04-15 2004-10-20 诺基亚公司 便携式无线通信设备
CN1926501A (zh) * 2004-02-10 2007-03-07 泰科电子有限公司 带有可编程显示器盖板的电阻式触摸屏
CN102819336A (zh) * 2011-06-09 2012-12-12 天津富纳源创科技有限公司 触摸屏面板

Also Published As

Publication number Publication date
US20210225947A1 (en) 2021-07-22
CN109445642A (zh) 2019-03-08
US11309366B2 (en) 2022-04-19

Similar Documents

Publication Publication Date Title
TWI421581B (zh) Input device and manufacturing method thereof
US20200285330A1 (en) Touch Screen and Manufacturing Method Thereof, and Touch Display Device
US20100164896A1 (en) Capacitive touch panel, manufacturing method therefor and liquid crystal display apparatus provided with the touch panel
CN101853114B (zh) 设有电极的电容触摸屏及其制造方法
TWI610209B (zh) 薄膜感應器、包含該感應器之電容觸控式螢幕及其製作方法與終端產品
US20100066700A1 (en) Capacitive Touch Screen
JP5925659B2 (ja) タッチパネル及びその製造方法
EP3144940B1 (en) Conductive structure and preparation method therefor
US9645688B2 (en) OGS touch screen substrate and method of manufacturing the same, and related apparatus
WO2013143292A1 (zh) 触摸传感器、其制作方法以及具有触摸屏的液晶显示器
CN102262469A (zh) 触控面板、触控显示面板及触控面板的制作方法
CN103279250A (zh) 一种采用镀铜导电基材的电容触控屏
CN104267859A (zh) 触摸屏及其制作方法、触摸显示装置
CN105786264A (zh) 一种触摸屏及其制作方法、触摸装置
CN103294310A (zh) 一种ogs触摸屏的制作方法
WO2020124784A1 (zh) 一种电阻式触摸屏、 oled 显示器及其制作方法
WO2019024217A1 (zh) 导电膜以及触控屏
CN201654751U (zh) 一种电容触摸屏
CN203299798U (zh) 一种采用镀铜导电基材的电容触控屏
TWM453902U (zh) 觸控裝置結構
TWI567615B (zh) The manufacturing method of touch panel and its border line
CN106775073A (zh) 一种传感器玻璃加钢化玻璃结构触摸屏及其制备方法
CN105739759A (zh) 一体化触摸装置的制作方法
TWM466355U (zh) 可撓性基板
TWI610598B (zh) 可撓性基板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19899021

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19899021

Country of ref document: EP

Kind code of ref document: A1