WO2019168286A1

WO2019168286A1 - Test socket and test device comprising same test socket

Info

Publication number: WO2019168286A1
Application number: PCT/KR2019/001859
Authority: WO
Inventors: 이승용
Original assignee: 이승용
Priority date: 2018-03-02
Filing date: 2019-02-15
Publication date: 2019-09-06

Abstract

The technical idea of the present invention provides a test socket and a test device comprising the test socket, in which a test can be stably performed by accurately connecting a connector of the test socket to a connector of a product with a microconnector mounted thereon to be tested without damage while adopting both a pogo pin type and an insertion method. The test socket comprises: a pogo pin structure disposed on a printed circuit board (PCB), and having pogo pins electrically connected to terminals of the PCB, and a housing block having two rows of guide holes in which the pogo pins are inserted; a connector guide block disposed on the pogo pin structure and having a through hole at a central portion thereof; and a first microconnector disposed on the pogo pin structure through the through hole and electrically connected to the pogo pins.

Description

Test socket and test device including the test socket

The technical idea of the present invention relates to a test apparatus, and more particularly, to a test socket including a micro connector therein and a test apparatus including the test socket.

Recently, electronic components are becoming miniaturized according to the trend of miniaturization and miniaturization of semiconductor and digital home appliances. In particular, products having a high-performance micro connector or board-to-board connector (BtoB) that directly connect the board, such as a small display module and a camera module, are rapidly increasing. Accordingly, there is a growing demand for the development of high-performance test sockets for testing these products in the industrial field.

Test methods using a micro-connector include a method using a pogo-pin and a male connector inserted into a female connector. The method using the pogo-pin has a problem in that a defective pin frequently occurs due to long-term use and physical force. In addition, when a pin is defective, the terminal part of the micro connector may be depressed and lifted, which may lead to a product quality accident. Furthermore, since only a limited portion of the contact is made when using the pogo-pin, inspection errors may occur due to poor contact. On the other hand, in the case of the insertion method, the connectors may be damaged by misalignment between the connectors, and thus, the life of the test socket may be shortened and the quality of the product may be caused.

The problem to be solved by the technical idea of the present invention is a test socket that can stably perform tests by accurately connecting a micro connector of a test socket to a product's micro connector without damage to a product mounted with a micro connector as a test object. And a test apparatus including the test socket.

In order to solve the above problems, the technical idea of the present invention is disposed on a printed circuit board (PCB), the pogo pins (pogo pins) and the pogo pins that are electrically connected to the terminals of the PCB is inserted A pogo pin structure having a housing block in which two rows of guide holes are formed; A connector guide block disposed on the pogo pin structure and having a through hole formed in a central portion thereof; And a first micro connector disposed on the pogo pin structure through the through hole and electrically connected to the pogo pins, wherein the first micro connector comprises a female or a female of a second micro connector of a test article. It has a male or female connector structure corresponding to a male connector structure, wherein the first micro connector or the second micro connector of the male connector structure is the second micro connector or the first micro connector of the corresponding female connector structure. It provides a test socket, which combines into a structure that is inserted into it.

In addition, the technical idea of the present invention, in order to solve the above problems, disposed on the base printed circuit board (PCB), the pogo pins, electrically connected to the terminals of the PCB, at least four elastic members, and the pogo A pogo pin structure having two rows of guide holes into which pins are inserted and a housing block having elastic member grooves into which the elastic members are inserted; A PCB connector disposed on the pogo pin structure and electrically connected to the pogo pins, the PCB connector being movable while being supported by elastic members; A connector guide block disposed on the PCB connector and the pogo pin structure and having a through hole formed in a central portion thereof; And a first micro connector disposed on the PCB connector through the through hole and electrically connected to the terminals of the PCB connector, wherein the first micro connector comprises at least one arm of a second micro connector of a test product; A male or female connector structure corresponding to the male connector structure, wherein the first micro connector or the second micro connector of the male connector structure is inserted into the second micro connector or the first micro connector of the corresponding female connector structure; It provides a test socket, which combines into a structure.

Furthermore, the technical idea of the present invention, in order to solve the above problems, a rubber connector disposed on a printed circuit board (PCB), and electrically connected to the terminals of the PCB; An interface having a terminal pin disposed on the rubber connector and electrically connected to the rubber connector, the terminal pins being arranged in a row on both sides; A connector guide block disposed on the interface and having a first through hole formed in a central portion thereof; A PCB connector disposed on the interface and electrically connected to the interface, the PCB connector being exposed through the first through hole and whose outer portion is covered by the connector guide block and is movable on the interface; And a first micro connector electrically connected to the PCB connector and fixed on the PCB connector through the first through hole, wherein the first micro connector is a female or male of a second micro connector to be tested. A test socket having a male or female connector structure corresponding to the connector structure is provided.

On the other hand, the technical idea of the present invention, in order to solve the above problems, is disposed on a printed circuit board (PCB), the lower guide block having a first through hole in the central portion; A rubber connector disposed on the PCB through the first through hole and electrically connected to the terminals of the PCB; A connector guide block disposed on the lower guide block and the rubber connector and having a second through hole formed in a central portion thereof; And disposed on the rubber connector and electrically connected to the rubber connector, the second connector is exposed through the second through hole, and an outer portion thereof is covered by the guide block. A PCB connector movable on the rubber connector; And a first micro connector electrically connected to the PCB connector and fixed on the PCB connector, wherein the first micro connector corresponds to a male or male connector structure of a second micro connector to be tested. A test socket having a female connector structure is provided.

Finally, the technical idea of the present invention, in order to solve the above problems, any one of the test socket of the test socket; And a printed circuit board (PCB) having the test socket mounted thereon.

The test socket according to the technical concept of the present invention has a complex structure of a pogo pin structure and a first micro connector, so that a product in which a second micro connector is mounted using the pogo pin structure and the first micro connector can be easily tested. Can

In addition, the test socket according to the technical concept of the present invention further includes a connector PCB to which the first micro connector is fixedly coupled and moves, such that the first micro connector moves on the pogo pin structure through the PCB connector, thereby providing a first micro connector. And the second micro connector can be easily and stably combined to stably perform the test, and also prevent the destruction of the micro connectors.

Furthermore, in the test socket according to the technical concept of the present invention, the connector PCB, to which the first micro connector is fixedly coupled, moves on an interface or a rubber connector, whereby the first micro connector and the second micro connector are stably coupled so that the test can be stably performed. Can be carried out and also the destruction of the micro connectors can be prevented.

As a result, the test socket according to the technical concept of the present invention can improve the life of the test socket, reduce the quality defect of the product, and improve the reliability of the test.

1 is a perspective view of a test socket according to an embodiment of the present invention.

2A and 2B are cutaway perspective views and a cross-sectional view of a portion II ′ of the test socket of FIG. 1, and FIG. 2C is an enlarged plan view of portion A of FIG. 2A.

FIG. 3A is a perspective view of the test socket of FIG. 1, with the connector guide block and the first micro connector omitted, and FIG. 3B is a cut perspective view showing a II-II 'portion of the pogo pin structure of FIG. 3A, and FIG. 3C. Is a perspective view showing an enlarged portion B of FIG. 3B.

4 is an exploded perspective view of the test socket of FIG. 1.

FIG. 5A is a perspective view illustrating in detail the first micro connector of the test socket of FIG. 1, and FIG. 5B is a cross-sectional view illustrating the III-III ′ portion of the first micro connector of FIG. 5A, and FIG. 5C is a cross-sectional view of FIG. 5A. An enlarged perspective view showing an enlarged C portion of the first micro connector.

FIG. 6A is a perspective view illustrating in detail a second micro connector to be tested, and FIG. 6B is a cross-sectional view of the second micro connector of FIG. 6A taken along line IV-IV ′, and FIG. 6C is a second micro connector of FIG. 6A. An enlarged perspective view showing an enlarged portion D of the connector.

7 is a perspective view of a test socket according to an embodiment of the present invention.

8A and 8B are cutaway perspective views and cross-sectional views cut along the line VV ′ of the test socket of FIG. 7.

FIG. 9 is a perspective view of the test socket of FIG. 7, with the connector guide block omitted. FIG.

FIG. 10 is a perspective view of the test socket of FIG. 7 omitting and showing a connector guide block, a first micro connector, and a PCB connector. FIG.

11 is an exploded perspective view of the test socket of FIG. 7.

12 is a perspective view of a test socket according to an embodiment of the present invention.

FIG. 13A is a cross-sectional view of the VI-VI ′ portion of the test socket of FIG. 12, and FIG. 13B is a plan view of the connector guide block in the test socket of FIG. 12.

FIG. 14A is a perspective view of a PCB connector in the test socket of FIG. 12, and FIG. 14B is a cross-sectional view cut along the line 'VIII' of the PCB connector of FIG. 14A.

15 is an exploded perspective view of the test socket of FIG. 12.

16 is a cross-sectional view of a test socket according to an embodiment of the present invention.

17A is a cross-sectional view of a test socket according to an embodiment of the present invention, and FIGS. 17B and 17C are bottom views of a connector guide block in the test socket of FIG. 17A.

18 is an exploded perspective view of a test socket according to an embodiment of the present invention.

19 is a photograph of a test apparatus including a test socket and a test PCB according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment of the present invention; The embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art, and the following examples can be modified in various other forms, and the scope of the present invention is It is not limited to an Example. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

In the following description, when a component is described as being connected to another component, it may be directly connected to another component, but a third component may be interposed therebetween. Similarly, when a component is described as being on top of another component, it may be directly on top of another component, with a third component intervening in between. In addition, in the drawings, the structure or size of each component is exaggerated for convenience and clarity of explanation, and parts irrelevant to the description are omitted. Like numbers refer to like elements in the figures.

Unless defined otherwise, all terms used herein have the same meaning as commonly understood by one of ordinary skill in the art, including technical terms and scientific terms. Also, as used in the prior art, terms as defined in advance should be construed to have a meaning consistent with what they mean in the context of the technology concerned, and in an overly formal sense unless explicitly defined herein. It should not be interpreted. On the other hand, the terms used are used only for the purpose of illustrating the present invention and are not used to limit the scope of the invention described in the meaning or claims.

1 is a perspective view of a test socket according to an embodiment of the present invention. 2A and 2B are cutaway perspective views and a cross-sectional view of a portion II ′ of the test socket of FIG. 1, and FIG. 2C is an enlarged plan view of portion A of FIG. 2A. FIG. 3A is a perspective view of the test socket of FIG. 1, with the connector guide block and the first micro connector omitted, and FIG. 3B is a cut perspective view showing a II-II 'portion of the pogo pin structure of FIG. 3A, and FIG. 3C. Is a perspective view showing an enlarged portion B of FIG. 3B. 4 is an exploded perspective view of the test socket of FIG. 1.

1 to 4, the test socket 100 of the present exemplary embodiment may include a pogo pin structure 110, a first micro connector 120, and a connector guide block 130.

Pogo pin structure 110 may include a number of pogo pins 112 and a housing block 114. Pogo pins 112 may be disposed in the central portion of the housing block 114 in two rows. Each of the pogo pins 112 may be comprised of a plunger, a barrel, a spring, or the like. However, the configuration of the pogo pins 112 is not limited to the above configuration. For example, the pogo pins 112 may be comprised of a top plunger, a barrel, a spring, a bottom plunger, and the like.

The housing block 114 may include an upper block 114u and a lower block 114d. Two rows of guide holes Hg may be formed in each of the upper block 114u and the lower block 114d to accommodate two rows of pogo pins 112. The upper block 114u and the lower block 114d may be separated from each other. Through the separation and coupling structure of the upper block 114u and the lower block 114d, each of the pogo pins 112 may be individually replaced.

In the test socket 100 of the present embodiment, the housing block 114 has a structure in which the upper block 114u and the lower block 114d are separated, but the structure of the housing block 114 is not limited thereto. For example, depending on the embodiment, the housing block 114 may be integrally formed.

Pogo pins 112 may be exposed to the upper and lower surfaces of the housing block 114 through the guide holes (Hg). For example, the lower contact portions of the pogo pins 112 are electrically connected to the terminals 310 of the printed circuit board (PCB) 300, and the upper contact portions of the pogo pins 112 are first connected to the first micro connector 120. And may be electrically connected to the terminal pins (see 122 of FIG. 5A).

On the other hand, as shown in Figure 3c, the cross-sectional area of the upper contact portion of the pogo pins 112 may be smaller than the cross-sectional area of the guide holes (Hg). For example, a gap S may exist between the side surface of the upper contact portion of the pogo pins 112 and the guide holes Hg. Accordingly, the upper contact portion of the pogo pins 112 may move in the horizontal direction by the distance S on the upper surface of the housing block 114. As such, as the upper contact portions of the pogo pins 112 are movable, the first micro connector 120 disposed above may also be movable. However, according to an embodiment, the first micro connector 120 may be mounted in a fixed form on the pogo pin structure 110. In such an embodiment, the first micro connector 120 may not move. In addition, the cross-sectional area of the upper contact portion of the pogo pins 112 may be substantially the same as that of the guide holes Hg.

The first micro connector 120 accommodates a plurality of first terminal pins (see 122 of FIG. 5A) and the first terminal pins 122 and includes a first connector body that retains the shape of the entire first micro connector 120. 124). The first micro connector 120 may have a male connector structure as shown in FIGS. 1 to 4. However, the first micro connector 120 is not limited to the male connector structure and may have a female connector structure. The structure of the first micro connector 120 will be described in more detail in the description of FIGS. 5A to 5C.

The first micro connector 120 may be disposed on the pogo pin structure 110. The first terminal pins 122 of the first micro connector 120 may be electrically connected to the terminals 310 of the PCB 300. The first micro connector 120 can move on the pogo pin structure 110. In other words, the first micro connector 120 is not mounted to be fixed on the pogo pin structure 110 by solder or the like, and may be disposed on the pogo pin structure 110 in a simply raised state. Accordingly, when the first micro connector 120 is moved when coupled with the second micro connector 210 of the product under test, the first micro connector 120 and the second micro connector 210 are stably and accurately coupled. In addition, it may be easily coupled without damaging the

terminal pins

122 and 212 of the

micro connectors

120 and 210. Here, the product under test may be, for example, a small display module and a camera module mounted with a micro connector. However, the type of product under test is not limited thereto. For example, all kinds of electronic devices mounted with a micro connector may be included in a product under test. The movement of the first micro connector 120 will be described in more detail in the following description of the connector guide block 130.

According to an embodiment, the first micro connector 120 may be mounted and fixed on the pogo pin structure 110 by solder or the like. As such, when the first micro connector 120 is mounted in a fixed form, the first micro connector 120 may not move on the pogo pin structure 110.

The connector guide block 130 may be disposed on the pogo pin structure 110. The connector guide block 130 may have a first through hole H1 in the center thereof, and may have a first groove G1 having a multi-stage structure around the first through hole H1. The first micro connector 120 may be disposed on the pogo pin structure 110 through the first through hole H1 of the connector guide block 130. The first through hole H1 has the first micro connector 120 positioned at the pogo pin structure 110, for example, the pogo pins 112 and the first terminal pins 122 of the first micro connector 120. You can guide them to contact. In addition, the first groove G1 may guide the second micro connector 210 of the product under test to be stably coupled with the first micro connector 120. The structure of the first groove G1 may be variously changed according to the structure of the connector part including the second micro connector 210 of the product under test.

The horizontal cross-sectional area of the first through hole H1 of the connector guide block 130 may be larger than the horizontal cross-sectional area of the first micro connector 120. Here, the horizontal cross-sectional area may be defined on a plane parallel to the upper surface of the PCB 300, for example, on a plane in a first direction (x direction) and a second direction (y direction). In addition, the horizontal cross-sectional area of the first through hole H1 and the first micro connector 120 may be defined as a rectangle for convenience of comparison. For example, as illustrated in FIG. 2C, in the case of the first through hole H1, the horizontal cross-sectional area may include a dotted line portion instead of a curved portion. In addition, in the case of the first micro connector 120, the lead portions (see 122l of FIG. 5B) of the terminal pins protruding to both sides in the second direction (y direction) from the lower surface may not be included in the horizontal cross-sectional area.

As illustrated in FIG. 2C, the first through hole H1 may be larger than the first micro connector 120 in each of the first direction (x direction) and the second direction (y direction). For example, when the first micro connector 120 is positioned at the center portion of the first through hole H1, twice the first distance Wx in the first direction (x direction), and the second direction y Direction), the first through hole H1 may be larger than the first micro connector 120 by twice the second distance Wy.

The first micro connector 120 is not fixed on the pogo pin structure 110 and may move on the pogo pin structure 110. However, the moving range of the first micro connector 120 may be defined within the horizontal cross-sectional area of the first through hole H1 and the moving range of the pogo pins 112. For example, the first micro connector 120 may move within the horizontal cross-sectional area of the first through hole H1 in the first direction (x direction) and the second direction (y direction), as indicated by arrows M1 and M2. have. In addition, the movement of the first micro connector 120 may be limited by the movement range of the pogo pins 112 in the guide hole Hg of the pogo pin structure 110 disposed below.

On the other hand, as described above, according to an embodiment, the first micro connector 120 may be mounted on the pogo pin structure 110 in a fixed form through solder or the like. In such an embodiment, the first micro connector 120 may not move on the pogo pin structure 110. In addition, the horizontal cross-sectional area of the first through hole H1 may be substantially the same as the horizontal cross-sectional area of the first micro connector 120.

The test socket 100 of the present exemplary embodiment may have a complex structure of the pogo pin structure 110 and the first micro connector 120. Accordingly, the test socket 100 of the present embodiment can easily test a product that is a test target in which the second micro connector 210 is mounted using the first micro connector 120 while utilizing the pogo pin structure 110. have. In addition, in the test socket 100 of the present embodiment, since the first micro connector 120 moves on the pogo pin structure 110, the first micro connector 120 and the second micro connector 210 can be stably and accurately coupled. In addition, damage to the terminal pins of the

micro connectors

120 and 210 can be prevented.

More specifically, a male or male connector (hereinafter referred to as a 'product connector') is generally mounted and fixed to a product under test, and a male or female connector (hereinafter referred to as a 'socket connector') of a test socket is mounted on a test PCB. Is mounted and fixed. In testing the product, the product connector is coupled to the socket connector. If there is an error in the mounting position of the product connector and / or the socket connector, the product connector and / or socket connector may be damaged by the misalignment according to the error of the mounting position in the bonding process. In some cases, the binding may not be performed at all. This may be due to the product connector being fixed to the product and the socket connector fixed to the test PCB. On the other hand, in the test socket 100 of the present embodiment, the first micro connector 120 corresponding to the socket connector may move in the process of coupling. Accordingly, even if there is an error in the mounting position of the second micro connector 210 corresponding to the product connector, the coupling can be performed stably and accurately, and the damage of the

micro connectors

120 and 210 can also be prevented. .

5A through 5C, the first micro connector 120 may include first terminal pins 122 and a first connector body 124. A plurality of first terminal pins 122 may be disposed along both sides of the first connector body 124. The first terminal pins 122 may include a contact portion 122c surrounding the protruding side of the first connector body 124 and a lead portion 122l protruding laterally from the lower surface of the first connector body 124. Can be. The contact portion 122c of the first terminal pins 122 may be a portion that contacts the contact portion (see 212c of FIG. 6B) of the second terminal pins (see 212 of FIG. 6B) of the second micro connector 210. . In addition, the lead portion 122l of the first terminal pins 122 may be a portion that contacts the pogo pins 112 of the pogo pin structure 110. The first terminal pins 122 of the first micro connector 120 may contact two or three points of the second terminal pins 212 of the second micro connector 210. Two or three point contacts will be described in more detail in the description of FIGS. 6A-6C.

The first connector body 124 may receive and support the first terminal pins 122 and may maintain a shape of the entire first micro connector 120. The first connector body 124 may be formed of an insulating material for insulating the first terminal pins 122 from each other. As shown in FIG. 5A, the first connector body 124 may have a shape such as an open box that has a groove in the center and is elongated in one direction.

When the first micro connector 120 and the second micro connector 210 are coupled to each other, the protruding portion may be coupled into a corresponding groove portion. For example, the protruding portions of the first connector body 124 are inserted into the groove portions of the second connector body (see 214 of FIG. 6A) of the second micro connector 210, and of the center of the second connector body 214. The protrusion may be inserted into the groove portion of the first connector body 124.

Meanwhile, rounding structures R1 and R2 may be formed on the protruding side surfaces of the first connector body 124. The rounding structures R1 and R2 naturally induce insertion when the first micro connector 120 and the second micro connector 210 are coupled to each other, such that the first micro connector 120 and the second micro connector 210 are naturally connected. It is possible to facilitate the coupling, and also to prevent damage to the terminal pins 122 and 212 of the first micro connector 120 and the second micro connector 210. Furthermore, when the first micro connector 120 has a structure that is movable on the pogo pin structure 110, the first micro connector 120 and the second micro connector 210 are more easily coupled, and the terminal pins Damage to the 122 and 212 can be further reduced.

6A through 6C, the second micro connector 210 may include second terminal pins 212 and a second connector body 214. A plurality of second terminal pins 212 may be disposed along both grooves of the second connector body 214. The second terminal pins 212 may include a contact portion 212c surrounding the groove of the second connector body 214 and a lead portion 212l extending from the contact portion 212c to the bottom surface of the second connector body 214. It may include. As described above, the contact portion 212c of the second terminal pins 212 may contact the contact portion 122c of the first terminal pins 122. The lead portion 212l of the second terminal pins 212 contacts the terminals of the PCB of the product under test, and in general, the lead portion 212l is fixed to the PCB of the product by soldering, so that the second micro connector 210 may be mounted to the PCB of the product.

Meanwhile, the first terminal pins 122 of the first micro connector 120 may contact two or three points of the second terminal pins 212 of the second micro connector 210. For example, referring to FIGS. 5B and 6B, when the protruding portions of the first terminal pins 122 are inserted into the groove portions of the second terminal pins 212, both sides of the protruding first terminal pins 122 are inserted. Both sides of the second terminal pins 212 in the groove are in contact with each other. Accordingly, the first terminal pins 122 may make two point contact with the second terminal pins 212. In some embodiments, when the first terminal pins 122 are deeply inserted into the grooves, the upper surface portions of the first terminal pins 122 may contact the bottom portions of the second terminal pins 212. Accordingly, the first terminal pins 122 may make three point contact with the second terminal pins 212.

As the first terminal pins 122 of the first micro connector 120 make two or three point contacts with the second terminal pins 212 of the second micro connector 210, the reliability of the contact can be improved and thus As a result, the reliability of the test can be improved. The first terminal pins 122 of the first micro connector 120 of FIG. 5B and FIG. 6B and the second terminal pins 212 of the second micro connector 210 are an exemplary structure. The structure of the

pins

122 and 212 is not limited thereto. For example, various structures capable of two or three point contact may be employed in the terminal pins of the first micro connector 120 and the second micro connector 210. Furthermore, terminal pins having a one point contact structure may also be employed in the first micro connector 120 and the second micro connector 210.

The second connector body 214 may receive and support the second terminal pins 212 and may maintain a shape of the entire second micro connector 210. The second connector body 214 may be formed of an insulating material for insulating the second terminal pins 212 from each other. As shown in FIG. 6A, the second connector body 214 may have a shape such as an open box elongated in one direction, and an elongated protrusion may be disposed at the center thereof, and the protrusion may surround the groove. have. The structure of the second connector body 214 may correspond to the structure of the first connector body 124 of the first micro connector 120. For example, the protruding portions of the first connector body 124 are inserted into the groove portions of the second connector body 214, and the protrusion of the center of the second connector body 214 is the groove portion of the first connector body 124. Can be inserted in

Meanwhile, rounding structures R3 and R4 may be formed on the outer side surfaces and the central protrusion of the second connector body 214. The rounding structures R3 and R4 naturally induce insertion when the first micro connector 120 and the second micro connector 210 are coupled to each other, such that the first micro connector 120 and the second micro connector 210 are naturally connected. It is possible to facilitate the coupling, and to prevent damage to the terminal pins 122 and 212 of the first micro connector 120 and the second micro connector 210. In addition, in the test socket 100 of the present embodiment, the first micro connector 120 also includes the rounding structures R1 and R2, so that the first micro connector 120 and the second micro connector 210 are more easily. Can be combined. Furthermore, when the first micro connector 120 has a structure that is movable on the pogo pin structure 110, the coupling ease of the first micro connector 120 and the second micro connector 210 may be further increased. .

7 is a perspective view of a test socket according to an embodiment of the present invention. 8A and 8B are cutaway perspective views and cross-sectional views cut along the line VV ′ of the test socket of FIG. 7. FIG. 9 is a perspective view of the test socket of FIG. 7, with the connector guide block omitted. FIG. FIG. 10 is a perspective view of the test socket of FIG. 7 omitting and showing a connector guide block, a first micro connector, and a PCB connector. FIG. 11 is an exploded perspective view of the test socket of FIG. 7. Descriptions already described in the description of FIGS. 1 to 6C are simply described or omitted.

7 to 11, the test socket 100a of this embodiment further includes a PCB connector 140, in that the pogo pin structure 110a structure is modified to accommodate the PCB connector 140. It may be different from the test socket 100 of 1.

Specifically, the test socket 100a of the present embodiment may include a pogo pin structure 110a, a first micro connector 120, a connector guide block 130, and a PCB connector 140. The pogo pin structure 110a may include a plurality of pogo pins 112, a housing block 114a, and elastic members 116. Pogo pins 112 are as described in the description of FIGS. 1 to 4.

The housing block 114a may include an upper block 114ua and a lower block 114d. In each of the upper block 114ua and the lower block 114d, two rows of guide holes Hg may be formed to accommodate two rows of pogo pins 112. The upper block 114ua and the lower block 114d may be separated from each other. Through the separation and coupling structure of the upper block 114ua and the lower block 114d, each of the pogo pins 112 may be individually replaced. Meanwhile, elastic member holes Ge may be formed in the upper block 114ua to accommodate the elastic members 116. In addition, a PCB connector guide groove Gc may be formed on the upper surface of the upper block 114ua to accommodate the PCB connector 140.

As can be seen in FIG. 10, the two rows of guide holes Hg are disposed at the center portion of the PCB connector guide groove Gc, and the elastic member holes Ge are disposed at the outer portion of the PCB connector guide groove Gc. Can be. The elastic member holes Ge may be formed to match the number of elastic members 116. In the test socket 100a of the present embodiment, the pogo pin structure 110a may include six elastic members 116, and thus six elastic member holes Ge may also be disposed. However, the number of the elastic members 116 and the elastic member holes Ge is not limited to six. For example, the number of elastic members 116 and elastic member holes Ge may be less than six or more than seven. However, in order to support the PCB connector 140 in a balanced manner, the elastic members 116 and the elastic member holes Ge may be an even number, and are arranged symmetrically with respect to the center line of the PCB connector guide groove Gc. Can be.

The elastic members 116 support the PCB connector 140 disposed upward, and may also impart mobility to the PCB connector 140. Here, the mobility by the elastic members 116 is not limited to the mobility in the third direction (z direction) that is perpendicular to the upper surface of the PCB 300, the first direction (x) parallel to the upper surface of the PCB 300 Direction) and mobility in the second direction (y direction). In the test socket 100a of the present embodiment, the elastic members 116 may be formed of, for example, a spring. However, the type of elastic members 116 is not limited to the spring. For example, the elastic members 116 may be formed of a rubber having good elastic force.

PCB connector 140 may be disposed on pogo pin structure 110a. More specifically, the PCB connector 140 may be disposed in the PCB connector guide groove Gc of the upper block 114ua. The PCB connector 140 includes terminal pins 144, the terminal pins 144 being electrically connected to the pogo pins 112 of the pogo pin structure 110a to the bottom and the first micro connector 120 to the top. It may be electrically connected to the first terminal pins 122 of the. The terminal pins 144 of the PCB connector 140 may be formed to penetrate the body, which is an insulating material, or may be formed on the upper and lower surfaces of the body and connected to each other through via contacts.

The horizontal cross-sectional area of the PCB connector 140 may be smaller than the horizontal cross-sectional area of the PCB connector guide groove Gc. Here, the horizontal cross-sectional area is as described above with respect to the horizontal cross-sectional area of the first through hole (H1) and the first micro connector 120. As illustrated in FIG. 8B, the PCB connector guide groove Gc may be larger than the PCB connector 140 by the first gap S1 and the second gap S2 in the second direction (y direction). In addition, although not shown, the PCB connector guide groove Gc may be larger than the PCB connector 140 by predetermined intervals even in the first direction (x direction).

As described above, since the PCB connector 140 is supported by the elastic member 116 and provided with mobility, the PCB connector 140 can freely move to some extent within the PCB connector guide groove Gc. For example, the PCB connector 140 may move in the depth range of the PCB connector guide groove Gc in the vertical direction, that is, in the third direction (z direction), as indicated by the M3 arrow, and horizontal, as indicated by the M2 arrow. Direction in the direction of the horizontal cross-sectional area of the PCB connector guide groove Gc.

The first micro connector 120 and the connector guide block 130 may be disposed on the PCB connector 140. In addition, the outer portion of the connector guide block 130 may be disposed in direct contact with the upper surface of the pogo pin structure (110a). Accordingly, the PCB connector 140 may be sealed by the pogo pin structure 110a and the connector guide block 130 and may not be exposed to the outside.

The first micro connector 120 may be mounted on the PCB connector 140 in a fixed form through solder or the like. The first terminal pins 122 of the first micro connector 120 may be electrically connected to the terminal pins 144 of the PCB connector 140. For reference, since the PCB connector 140 is movable, the first micro connector 120 does not need to be mounted to be movable on the PCB connector 140. In other words, since the PCB connector 140 is movable, when the second micro connector 210 is coupled to the first micro connector 120, the PCB connector 140 is moved to thereby move the first micro connector 120. The second micro connector 210 may be aligned with each other.

In addition, as described with reference to FIGS. 1 to 4, the horizontal cross-sectional area of the first micro connector 120 may be smaller than the horizontal cross-sectional area of the first through hole H1 of the connector guide block 130. In addition, the difference in the horizontal cross-sectional area of the first micro connector 120 and the first through hole H1 may correspond to the difference in the horizontal cross-sectional area of the PCB connector 140 and the PCB connector guide groove Gc. In other words, the difference between the horizontal cross-sectional area of the first micro connector 120 and the first through hole H1 is greater than the difference between the horizontal cross-sectional area of the PCB connector 140 and the PCB connector guide groove Gc. ) Can move freely in the horizontal direction in the PCB connector guide groove (Gc). Conversely, when the difference in the horizontal cross-sectional area of the first micro connector 120 and the first through hole H1 is smaller than the difference in the horizontal cross-sectional area of the PCB connector 140 and the PCB connector guide groove Gc, the PCB connector 140 ) May be limited by the horizontal cross-sectional area of the first through hole H1. In the test socket 100a of this embodiment, the difference in the horizontal cross-sectional area of the PCB connector 140 and the PCB connector guide groove Gc is equal to the difference in the horizontal cross-sectional area of the first micro connector 120 and the first through hole H1. May be substantially the same.

The test socket 100a of the present embodiment has a complex structure of the pogo pin structure 110a and the first micro connector 120, and includes a PCB connector 140 to which the first micro connector 120 can be fixedly coupled and moved. It may further include. Accordingly, the test socket 100a of this embodiment moves the first micro connector 120 on the pogo pin structure 110a through the PCB connector 140 to thereby mount the product on which the second micro connector 210 is mounted. When testing, the first micro connector 120 and the second micro connector 210 can be easily and stably coupled to perform the test stably, and also damage the terminal pins of the

micro connectors

120 and 210. Can be prevented.

12 is a perspective view of a test socket according to an embodiment of the present invention. FIG. 13A is a cross-sectional view of the VI-VI ′ portion of the test socket of FIG. 12, and FIG. 13B is a plan view of the test socket of FIG. 12, seen from the top surface FS with respect to the connector guide block. FIG. 14A is a perspective view of a PCB connector in the test socket of FIG. 12, and FIG. 14B is a cross-sectional view cut along the line 'VIII' of the PCB connector of FIG. 14A. 15 is an exploded perspective view of the test socket of FIG. 12.

12 to 15, the test socket 100b according to the present embodiment includes a rubber connector 150, an interface 160, a PCB connector 140, a first micro connector 120, a connector guide block 130, And a lower guide block 170.

The rubber connector 150 may include a rubber body and a plurality of conductive lines formed in the rubber body. The rubber connector 150 may be disposed on the PCB 300 of the test apparatus (see 1000 in FIG. 19), and the conductive lines of the rubber connector 150 may be electrically connected to the terminals 310 of the PCB 300. .

The lower guide block 170 may be disposed on the PCB 300. The lower guide block 170 may have a first through hole H1 in the center, and may have a first groove G1 of a predetermined depth around the first through hole H1. The rubber connector 150 may be disposed on the PCB 300 through the first through hole H1 of the lower guide block 170. The first through hole H1 may guide the rubber connector 150 to be disposed at a position on the PCB 300, for example, a portion of the groove Gp in which the terminals 310 are located. In addition, when the pressure is applied to the rubber connector 150 through the upper interface 160, the first groove G1 may provide a space in which the interface 160 may be bent to provide a buffer function. In some embodiments, the lower guide block 170 may be omitted.

The interface 160 may include a plurality of terminal pins 162 disposed at both sides of the central portion and the support 164 of the outer portion. The interface 160 may be disposed on the rubber connector 150 and the lower guide block 170. The terminal pins 162 of the interface 160 may be electrically connected to conductive lines of the rubber connector 150 disposed below.

In more detail with respect to the interface 160, the interface 160 may include terminal pins 162, a support 164, and a support film (not shown). The terminal pins 162 may be disposed along both sides of the elongated through hole formed in the center portion, and may be electrically and physically separated from each other. The support part 164 may be disposed at both outer portions in the extending direction of the through hole, and may be formed of the same metal material as the terminal pins 162. The interface 160 may be included in the test socket 100b and fixed through the support 164. Meanwhile, the support film is disposed on the upper and lower surfaces of the terminal pins 162 and the support part 164 to fix the terminal pins 162, but the terminal pins 162 are connected to the terminal pins 144 of the PCB connector 140. It can be fixed at a predetermined interval so that it can be contacted. In addition, the support film may be disposed such that portions of the terminal pins 162 adjacent to the through holes are exposed to the outside. The terminal pins 162 may be electrically connected to the upper PCB connector 140 and the lower rubber connector 150 through the exposed portion.

In some embodiments, the interface 160 may be formed to have a structure including a flexible PCB (FPCB) and terminal pins. In this structure, the terminal pins of the interface 160 may be formed on the top and bottom surfaces of the FPCB, and the terminal pins on the top and bottom surfaces may be paired with each other. In addition, the paired two terminal pins may be electrically connected to each other via via contacts formed in the FPCB.

The PCB connector 140 is disposed on the interface 160 and can move on the interface 160. As shown in FIGS. 14A and 14B, the PCB connector 140 may include a body 142, terminal pins 144, and via contacts 146. The body 142 may be formed of a material used for a general PCB. For example, the body 142 may be formed of an resin such as paper phenol, epoxy, PI, BT, Teflon, or an insulator such as ceramic. Of course, the material of the body 142 is not limited to the above-mentioned materials. For reference, the term PCB connector 140 may be derived from the fact that the body 142 is formed of a material used for the PCB and functions as a connector.

The terminal pins 144 may include upper terminal pins 144t formed on the upper surface of the body 142 and lower terminal pins 144b formed on the lower surface of the body 142. The terminal pins 144 are arranged in pairs with the upper and lower terminal pins, and the two paired terminal pins may be electrically connected to each other through the via contacts 146 formed through the body 142. have. Meanwhile, SR or PSR 148 may be coated on the top and bottom surfaces of the body 142 around the terminal pins 144.

The first micro connector 120 includes a plurality of first terminal pins 122 and first terminal pins 122 and a first connector body 124 that retains the shape of the entire first micro connector 120. can do. The first micro connector 120 may have a male connector structure as shown in FIGS. 12 to 15. However, the first micro connector 120 is not limited to the male connector structure and may have a female connector structure. The test socket including the first micro connector of the female connector structure will be described in more detail in the description of FIG. 16.

The first micro connector 120 may be disposed on the PCB connector 140. The first micro connector 120 may be coupled to be disposed on the PCB connector 140 in a fixed form. For example, the first terminal pins 122 of the first micro connector 120 are fixed to the terminal pins 144 of the corresponding PCB connector 140, that is, the upper terminal pins 144t through solder or solder, and electrically. Can be connected.

As described above, the PCB connector 140 can move on the interface 160 and, accordingly, the first micro connector 120 fixed to the PCB connector 140 can also move together. In other words, the PCB connector 140 may not be fixed on the interface 160 by solder or the like, but may be disposed in a simply raised state on the interface 160. Accordingly, when the first micro connector 120 is coupled with the second micro connector 210 of the product under test, the PCB connector 140 and the first micro connector 120 fixed thereto are free to move, thereby providing a first The micro connector 120 and the second micro connector 210 can be coupled stably and accurately. In addition, damage to the terminal pins 122 and 212 of each of the first and second

micro connectors

120 and 210 may be prevented. Here, the product under test may be, for example, a small display module and a camera module mounted with a micro connector. However, the type of product under test is not limited thereto. For example, all kinds of electronic devices mounted with a micro connector may be included in a product under test.

Regarding the movement of the PCB connector 140 and the first micro connector 120 fixed thereto, the connector guide block 130 will be described in more detail below.

The connector guide block 130 may be disposed on the PCB connector 140. The connector guide block 130 may have a second through hole H2 at the center thereof, and may have a second groove G2 having a multi-stage structure around the second through hole H2. The first micro connector 120 may be disposed and fixed on the PCB connector 140 through the second through hole H2 of the connector guide block 130. The second through hole H2 may guide the PCB connector 140 to be disposed at a proper position on the interface 160. In addition, the second groove G2 may guide the second micro connector 210 of the product under test to be stably coupled with the first micro connector 120. The structure of the second groove G2 may be variously changed according to the structure of the connector part including the second micro connector 210 of the product under test.

The horizontal cross-sectional area of the second through hole H2 of the connector guide block 130 may be larger than the horizontal cross-sectional area of the first micro connector 120. Here, the horizontal cross-sectional area may be defined on a plane parallel to the upper surface of the PCB 300, for example, on a plane in a first direction (x direction) and a second direction (y direction). In addition, the horizontal cross-sectional area of the second through hole H2 and the first micro connector 120 may be defined as a rectangle for convenience of comparison. For example, in FIG. 13B, in the case of the second through hole H2, a dotted line portion may be included instead of a curved portion in the horizontal cross-sectional area. In addition, in the case of the first micro connector 120, the lead portions of the first terminal pins 122 protruding from the lower surface to both sides of the first connector body 124 in the second direction (y direction) are excluded from the horizontal cross-sectional area. Can be.

The horizontal cross-sectional area of the second through hole H2 may be greater than the horizontal cross-sectional area of the first micro connector 120 in the first direction (x direction) and the second direction (y direction), respectively. For example, the horizontal cross-sectional area of the second through hole H2 is equal to the first interval Wx1 and the second interval Wx2 in the first direction (x direction), and the first interval Wy1 in the second direction (y direction). ) May be greater than the horizontal cross-sectional area of the first micro connector 120 by the second interval Wy2. In FIG. 13B, the dotted square shows the outer portion of the PCB connector 140 disposed under the connector guide block 130.

As described above, the first micro connector 120 is fixed to the PCB connector 140, but the PCB connector 140 may move on the interface 160. However, since the moving range of the first micro connector 120 is limited within the range of the cross-sectional area of the second through hole H2, the moving range of the PCB connector 140 is also within the range in which the first micro connector 120 can move. May be limited. Therefore, the PCB connector 140 and the first micro connector 120 have a second through hole in the first direction (x direction) by the first interval Wx1 and the second interval Wx2, as indicated by the M1 arrow. Can move within (H2). In addition, the PCB connector 140 and the first micro connector 120 have a second through hole in the second direction (y direction) by the first interval Wy1 and the second interval Wy2, as indicated by the M2 arrow. Can move within (H2).

In FIG. 13A, the connector guide block 130 has a protrusion PS formed around the second through hole H2, and the moving range of the first micro connector 120 in the second direction (y direction) is defined by the protrusion ( PS). However, according to the exemplary embodiment, the protrusion PS of the connector guide block 130 may be omitted, and in such a case, the moving range of the first micro connector 120 in the second direction (y direction) may be the first micro connector. The distance between the first terminal pins 122 of the 120 and the side surface of the second through hole H2 may be limited.

In FIG. 15, the second micro connector 210 is a micro connector mounted and fixed to a product to be tested, and is separated from the product for convenience of description. The second micro connector 210 may have a female connector structure. However, the second micro connector 210 may have a male connector structure. In other words, when the second micro connector 210 of the product has a female connector structure, the first micro connector 120 of the test socket 100b of the present embodiment may have a male connector structure as shown in FIG. 12 and the like. have. On the contrary, when the second micro connector 210 of the product has a male connector structure, the second micro connector 210 may have a female connector structure like the first micro connector 120a of the test socket 100c of FIG. 16. A case in which the first micro connector has a female connector structure will be described in more detail in the description of FIG. 16.

In FIG. 15, the PCB 300 may correspond to a part of the PCB 300 of the test apparatus (see 1000 of FIG. 19) in which the test socket 100b is mounted. In addition, the test socket 100b may be mounted and fixed to the PCB 300 through the coupling member 360, for example, a screw or a bolt.

In the test socket 100b of the present embodiment, the PCB connector 140 and the first micro connector 120 fixed thereto may move on the interface 160. Accordingly, when the first micro connector 120 is coupled to the second micro connector 210 of the product under test, the first micro connector 120 is freely moved and aligned with the second micro connector 210. The first micro connector 120 and the second micro connector 210 may be stably and accurately coupled, and damage to the terminal pins 122 and 212 of the

micro connectors

120 and 210 may be prevented. As a result, the lifespan of the test socket 100b can be improved, the quality defect of the product can be reduced, and the reliability of the test can be improved. In addition, since the PCB connector 140 and the first micro connector 120 are not fixed to the interface 160 through solder or the like, when the PCB connector 140 and the first micro connector 120 have a defect, they are individually. By replacing, the replacement cost of the test socket 100b can be reduced.

FIG. 16 is a cross-sectional view of a test socket according to an embodiment of the present invention and may correspond to FIG. 13A. Descriptions already described in the description of FIGS. 12 to 15 are simply described or omitted.

Referring to FIG. 16, the test socket 100c of the present embodiment is different from the test socket 100b of FIG. 13A in that the first micro connector 120a of the female connector structure is disposed on the PCB connector 140. Can be. The first micro connector 120a of the female connector structure may also include the first terminal pins 122a and the first connector body 124a. The first terminal pins 122a of the first micro connector 120a may be fixed and electrically connected to the terminal pins 144 of the corresponding PCB connector 140 through solder or the like. As the test socket 100c of the present embodiment includes the first micro connector 120a of the female connector structure, the product under test may include the second micro connector of the male connector structure.

Meanwhile, as shown in FIG. 16, the first terminal pins 122a of the first micro connector 120a are different from the first terminal pins 122 of the first micro connector 120 of the male connector structure. 1 may hardly protrude outward from the side of the connector body 124a. Accordingly, a protrusion (see PS of FIG. 13A) covering the protrusion of the first terminal pins 122a may not exist in the second through hole H2 of the connector guide block 130a. In addition, the movement range of the first micro connector 120a in the second direction (y direction) is defined by the side of the first terminal pins 122a or the first connector body 124a and the second penetration of the connector guide block 130a. It may be limited by the spacing between the sides of the hole (H2). Meanwhile, as the moving range of the first micro connector 120a is limited by the second through hole H2, the moving range of the PCB connector 140 fixed to the first micro connector 120a is also correspondingly corresponding thereto. Restrictions are as described above.

17A is a cross-sectional view of a test socket according to an exemplary embodiment of the present invention, and FIGS. 17B and 17C are bottom views of the test socket of FIG. 17A viewed from a bottom surface (BS) of a connector guide block. FIG. 17A may correspond to FIG. 13A, and FIGS. 17B and 17C show a state where the PCB connector is disposed and removed on the bottom surface of the connector guide block, respectively.

17A to 17C, in the test socket 100d of the present embodiment, a connector accommodating groove PG1 is formed on a lower surface of the connector guide block 130b, and a PCB connector 140 is formed in the connector accommodating groove PG1. It may be different from the test socket 100b of FIG. 13A in that it is arranged. As can be seen through FIG. 17B, the horizontal cross-sectional area of the connector receiving groove PG1 may be larger than the horizontal cross-sectional area of the PCB connector 140. For example, the horizontal cross-sectional area of the connector accommodating groove PG1 is equal to the first interval W'x1 and the second interval W'x2 in the first direction (x direction) and the first direction in the second direction (y direction). The horizontal cross-sectional area of the PCB connector 140 may be greater than the distance W'y1 and the second distance W'y2.

The test socket 100d of the present embodiment may also have the first micro connector 120 fixed to the PCB connector 140, and the PCB connector 140 may move on the interface 160. That is, the PCB connector 140 may move in the first direction (x direction), as indicated by the M1 arrow, and in the second direction (y direction), as indicated by the M2 arrow. On the other hand, the PCB connector 140 may move within the range of the horizontal cross-sectional area of the connector accommodating groove PG1 or within the moving range of the first micro connector 120 within the cross-sectional area of the second through hole H2. . In addition, the moving range of the PCB connector 140 may be limited to the narrower of the two ranges.

As shown in FIG. 17C, in the test socket 100d of the present embodiment, a plurality of elastic member accommodation grooves PG2 may be formed in the connector accommodation groove PG1 of the connector guide block 130b. An elastic member (see 116 of FIG. 10) such as a spring may be disposed in the elastic member receiving groove PG2, and the PCB connector 140 may be disposed on the elastic member. As such, the elastic member is disposed between the connector guide block 130b and the PCB connector 140, so that the PCB connector 140 may move in the vertical direction (z direction) together with the horizontal movement. Accordingly, in the test socket 100d of the present embodiment, the first micro connector 120 may be more easily and stably coupled with the second micro connector (see 210 of FIG. 15) of the product under test.

In FIG. 17C, eight elastic member accommodating grooves PG2 are formed in the connector guide block 130b, but the number of elastic member accommodating grooves PG2 is not limited thereto. Further, according to the embodiment, the elastic member receiving groove PG2 is not formed in the connector guide block 130b, and the elastic member may not be disposed. On the other hand, the test socket 100d of the present embodiment is also not limited to the structure of the male connector structure of the first micro connector 120 fixedly disposed on the PCB connector 140. For example, a first micro connector (see 120a of FIG. 16) having a female connector structure may be fixedly disposed on the PCB connector 140.

18 is an exploded perspective view of a test socket according to an embodiment of the present invention. In the description of FIG. 12 to FIG. 17C, the contents already described are simply described or omitted.

Referring to FIG. 18, the test socket 100e of the present embodiment may be different from the test socket 100 of FIG. 15 in that it does not include an interface. More specifically, the test socket 100e of the present embodiment includes a rubber connector 150, a PCB connector 140, a first micro connector 120, a connector guide block 130, and a lower guide block 170. can do. The PCB connector 140 is disposed on the rubber connector 150 and can move on the rubber connector 150. The first micro connector 120 may be fixedly disposed on the PCB connector 140.

The degree of movement of the PCB connector 140 and the first micro connector 120 may be limited by the second through hole H2 formed in the connector guide block 130. In addition, when the PCB connector 140 is disposed in the connector receiving groove (see PG1 of FIG. 17B) on the lower surface of the connector guide block 130, it may be limited by the connector receiving groove. Furthermore, instead of the first micro connector 120 of the male connector structure, the first micro connector of the female connector structure (see 120a of FIG. 16) may be fixedly disposed on the PCB connector 140.

In addition, the rubber connector 150, the first micro connector 120, the connector guide block 130, the lower guide block 170, and the second micro connector 210 are described with reference to FIGS. 12 to 17C. As described in the section.

Referring to FIG. 19, the test apparatus 1000 may include a test socket 100 and a PCB 300. The test socket 100 may be the test socket 100 of FIG. 1. However, the present invention is not limited thereto, and the test sockets 100a to 100e of FIGS. 7, 12, 16, 17a, or 18 may be applied to the test apparatus 1000 of the present embodiment. The test socket 100 may be mounted on the PCB 300. The PCB 300 may be, for example, a test PCB for testing a product mounted with a micro connector, for example, a small display module or a camera module.

The test apparatus 1000 of the present embodiment uses the

test sockets

100, 100a to 100e of FIGS. 1, 7, 12, 16, 17a, or 18 mounted on the PCB 300. By testing a product with a micro connector, the product can be tested reliably and reliably.

So far, the present invention has been described with reference to the embodiments shown in the drawings, which are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. will be. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

According to an embodiment of the present invention, a test socket including a movable PCB connector and a test device including the test socket may include a first micro connector when the first micro connector is coupled with a second micro connector of a product under test. By moving freely through and aligned with the second micro connector, the first micro connector and the second micro connector can be stably and accurately coupled.

Claims

A housing block disposed on a printed circuit board (PCB) and having pogo pins electrically connected to terminals of the PCB, and a housing block formed of two rows of guide holes into which the pogo pins are inserted; Pogo pin structures;

A connector guide block disposed on the pogo pin structure and having a through hole formed in a central portion thereof; And

And a first micro connector disposed on the pogo pin structure through the through hole and electrically connected to the pogo pins.

The first micro connector has a male or female connector structure corresponding to the female or male connector structure of the second micro connector of the test product,

And the first micro connector or the second micro connector of the male connector structure couples into a structure inserted into the second micro connector or the first micro connector of the corresponding female connector structure.
According to claim 1,

When the first micro connector and the second micro connector are coupled, each of the terminal pins of the first micro connector has a structure of two or three point contact with the terminal pins of the corresponding second micro connector. Test socket.
According to claim 1,

And the first micro connector is fixed to the pogo pin structure or movable on the pogo pin structure.
According to claim 1,

The housing block includes an upper block and a lower block,

And the pogo pins are individually replaceable by separating the upper block and the lower block.
Pogo pins disposed on a base printed circuit board (PCB) and electrically connected to terminals of the PCB, at least four elastic members, and two rows of guide holes and the elastic members inserted into the pogo pins are inserted. A pogo pin structure having a housing block in which elastic member grooves are formed and are arranged;

A PCB connector disposed on the pogo pin structure and electrically connected to the pogo pins, the PCB connector being movable while being supported by elastic members;

A connector guide block disposed on the PCB connector and the pogo pin structure and having a through hole formed in a central portion thereof; And

And a first micro connector disposed on the PCB connector through the through hole and electrically connected to terminals of the PCB connector.

The first micro connector has a male or female connector structure corresponding to the female or male connector structure of the second micro connector of the test product,

And the first micro connector or the second micro connector of the male connector structure couples into a structure inserted into the second micro connector or the first micro connector of the corresponding female connector structure.
The method of claim 5,

PCB connector guide groove is formed on the upper surface of the housing block,

And the PCB connector is disposed in the PCB connector guide groove between the connector guide block and the pogo pin structure.
The method of claim 6,

The first micro connector is fixed to the PCB connector by soldering,

And the PCB connector is movable within the PCB connector guide groove when the first micro connector and the second micro connector are coupled to each other.
The method of claim 7, wherein

When the first micro connector and the second micro connector are coupled, each of the terminal pins of the first micro connector has a structure of two or three point contact with the terminal pins of the corresponding second micro connector. Test socket.
The method of claim 7, wherein

When the horizontal cross section is defined by a first direction on a plane parallel to the top surface of the base PCB and a second direction perpendicular to the first direction,

The horizontal cross-sectional area of the PCB connector is smaller than the horizontal cross-sectional area of the PCB connector guide groove,

The PCB connector is movable in at least one of the first direction and the second direction within a horizontal cross-sectional area of the PCB connector guide groove;
The method of claim 6,

The elastic member is a spring,

The guide holes are disposed in the center portion of the PCB connector guide groove,

And the elastic member grooves are disposed at an outer portion of the PCB connector guide groove.
The method of claim 10,

At least six elastic members are disposed,

And the PCB connector is movable in a horizontal direction and a vertical direction in the PCB connector guide groove through the elastic members.
A rubber connector disposed on a printed circuit board (PCB) and electrically connected to terminals of the PCB;

An interface having a terminal pin disposed on the rubber connector and electrically connected to the rubber connector, the terminal pins being arranged in a row on both sides;

A connector guide block disposed on the interface and having a first through hole formed in a central portion thereof;

A PCB connector disposed on the interface and electrically connected to the interface, the PCB connector being exposed through the first through hole and whose outer portion is covered by the connector guide block and is movable on the interface; And

And a first micro connector electrically connected to the PCB connector and fixed on the PCB connector through the first through hole.

And the first micro connector has a male or female connector structure corresponding to the female or male connector structure of the second micro connector to be tested.
The method of claim 12,

And the PCB connector is movable on the interface when the first micro connector and the second micro connector are coupled to each other.
The method of claim 12,

When a horizontal cross-sectional area is defined by a first direction on a plane parallel to the top surface of the PCB and a second direction perpendicular to the first direction,

The horizontal cross-sectional area of the first micro connector is smaller than the horizontal cross-sectional area of the first through hole,

And the PCB connector is movable within a range within which the first micro connector is movable within the horizontal cross-sectional area of the first through hole.
The method of claim 12,

A first groove is formed to receive the PCB connector around the first through hole on the bottom surface of the connector guide block,

When a horizontal cross-sectional area is defined by a first direction on a plane parallel to the top surface of the PCB and a second direction perpendicular to the first direction,

The horizontal cross-sectional area of the PCB connector is smaller than the horizontal cross-sectional area of the first groove,

And the PCB connector is movable within a range of the horizontal cross-sectional area of the first groove.
The method of claim 15,

The test socket comprises at least four elastic members between the connector guide block and the PCB connector,

And the PCB connector is movable in the horizontal direction and the vertical direction in the first groove through the elastic members.
The method of claim 12,

The PCB connector includes a body, a plurality of terminal pins formed on the top and bottom surfaces of the body, and a plurality of via contacts connecting the terminal pins on the bottom surface corresponding to the terminal pins on the top surface through the body. and,

And the terminal pins of the first micro connector are fixedly connected to the terminal pins on the top surface by soldering.
A lower guide block disposed on a printed circuit board (PCB) and having a first through hole in a central portion thereof;

A rubber connector disposed on the PCB through the first through hole and electrically connected to the terminals of the PCB;

A connector guide block disposed on the lower guide block and the rubber connector and having a second through hole formed in a central portion thereof; And

Is disposed on the rubber connector and electrically connected to the rubber connector, exposed through the second through hole, the outer portion is covered by the guide block, A PCB connector movable on the rubber connector; And

A first micro connector electrically connected to the PCB connector and fixed on the PCB connector;

And the first micro connector has a male or female connector structure corresponding to the female or male connector structure of the second micro connector to be tested.
A test socket of any one of the test sockets of claim 1, 5, 12, and 18; And

And a printed circuit board (PCB) on which the test socket is mounted.