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WO2017113749A1 - 成像模组及电子装置 - Google Patents

成像模组及电子装置 Download PDF

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Publication number
WO2017113749A1
WO2017113749A1 PCT/CN2016/090060 CN2016090060W WO2017113749A1 WO 2017113749 A1 WO2017113749 A1 WO 2017113749A1 CN 2016090060 W CN2016090060 W CN 2016090060W WO 2017113749 A1 WO2017113749 A1 WO 2017113749A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
imaging module
circuit board
camera
camera modules
Prior art date
Application number
PCT/CN2016/090060
Other languages
English (en)
French (fr)
Inventor
申成哲
王昕�
Original Assignee
深圳欧菲光科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201610120468.3A external-priority patent/CN107155021A/zh
Priority claimed from CN201620162899.1U external-priority patent/CN205545557U/zh
Priority claimed from CN201620163163.6U external-priority patent/CN205647690U/zh
Priority claimed from CN201620162944.3U external-priority patent/CN205545560U/zh
Priority claimed from CN201620163024.3U external-priority patent/CN205545563U/zh
Priority claimed from CN201610120773.2A external-priority patent/CN107155028A/zh
Priority claimed from CN201620162728.9U external-priority patent/CN205545551U/zh
Priority claimed from CN201620162718.5U external-priority patent/CN205545549U/zh
Priority claimed from CN201610120876.9A external-priority patent/CN107155041A/zh
Priority claimed from CN201610120777.0A external-priority patent/CN107155029A/zh
Priority claimed from CN201620163009.9U external-priority patent/CN205545562U/zh
Priority claimed from CN201620162868.6U external-priority patent/CN205545555U/zh
Priority claimed from CN201620163142.4U external-priority patent/CN205545573U/zh
Priority claimed from CN201610120898.5A external-priority patent/CN107155043A/zh
Priority claimed from CN201620162897.2U external-priority patent/CN205566466U/zh
Priority claimed from CN201620162763.0U external-priority patent/CN205545552U/zh
Priority claimed from CN201610120711.1A external-priority patent/CN107155024A/zh
Priority claimed from CN201610120584.5A external-priority patent/CN107155023A/zh
Priority claimed from CN201610120745.0A external-priority patent/CN107155025A/zh
Priority claimed from CN201610120880.5A external-priority patent/CN107155042A/zh
Priority claimed from CN201610120867.XA external-priority patent/CN107155040A/zh
Priority claimed from CN201620162720.2U external-priority patent/CN205545550U/zh
Priority claimed from CN201610120911.7A external-priority patent/CN107155046A/zh
Application filed by 深圳欧菲光科技股份有限公司 filed Critical 深圳欧菲光科技股份有限公司
Publication of WO2017113749A1 publication Critical patent/WO2017113749A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums

Definitions

  • the priority and interest of the patent applications of 201620163009.9, 201610120867.X, 201620162868.6, 201610120876.9, 201620162728.9, 201610120745.0, 201620162720.2, 201610120468.3, 201620162718.5, 201610120773.2 and 201620162944.3 are hereby incorporated by reference in its entirety.
  • the present invention relates to the field of camera technologies, and in particular, to an imaging module and an electronic device.
  • the dual camera module includes two camera modules whose optical axes are parallel and directed toward the same side. How to reduce the volume of the dual camera modules while fixing the two camera modules becomes an urgent problem to be solved.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention provides an imaging module and an electronic device.
  • the imaging module of the embodiment of the invention comprises a flexible circuit board, at least two camera modules and a cover.
  • the flexible circuit board includes at least two module mounting portions and a connector mounting portion that connects at least two module mounting portions.
  • At least two camera modules are respectively disposed on at least two module mounting portions, and at least two camera modules are spaced apart.
  • the cover body is provided with at least two camera modules and is fixedly connected to at least two camera modules.
  • the cover body comprises a frame surrounding at least two camera modules, and the distance between the frame body and the camera module ranges from 0.1 to 0.5 mm.
  • the imaging module of the embodiment of the invention can bond the frame body and the camera module through the colloid. Since the distance between the frame body and the camera module ranges from 0.1 to 0.5 mm, the frame and the camera module can not only be firmly connected, but also Can reduce imaging mode The volume of the group is advantageous for miniaturization of the imaging module.
  • the number of the module mounting portions and the number of the camera modules are two.
  • the distance between the frame and the camera module ranges from 0.15 to 0.3 mm.
  • the frame is fixedly coupled to the camera module by a glue.
  • the cover includes a top cover coupled to the top of the frame, the top cover being fixedly coupled to the two camera modules by a glue.
  • the two module mounting portions are spaced apart, and the flexible circuit board includes two connecting portions that are spaced apart, and the two connecting portions respectively connect the two module mounting portions and the The connector mounting portion is described.
  • each of the camera modules includes a printed circuit board and an image sensor disposed on the printed circuit board and electrically connected to the printed circuit board, the printed circuit board being disposed in the The module mounting portion is electrically connected to the module mounting portion.
  • the module mounting portion includes a first electrical connection pad
  • the printed circuit board includes a second electrical connection pad correspondingly connected to the first electrical connection pad, the printed circuit The board is electrically connected to the module mounting portion through the second electrical connection pad and the first electrical connection pad.
  • the camera module includes a lens module disposed on the printed circuit board and positioned above the image sensor.
  • each of the lens modules includes a lens and a voice coil motor, the lens being disposed in the voice coil motor, each of the voice coil motors including a housing, two of the housings Interval setting.
  • the imaging module includes a connector assembly including a substrate and a connector disposed on the substrate, the substrate being disposed on the connector mounting portion and The connector mounting portion is electrically connected.
  • the imaging module includes a colloid disposed between the two camera modules and bonding the two camera modules.
  • the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by soldering the connection side.
  • An electronic device includes the above-described imaging module.
  • the imaging module can bond the top cover and the camera module through the colloid. Since the distance between the top cover and the camera module ranges from 0 to 0.1 mm, the top cover and the camera module can not only The connection is firm, and the thickness of the imaging module can also be reduced, which is advantageous for miniaturization of the electronic device group.
  • FIG. 1 is a schematic structural view of an imaging module according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the imaging module of FIG. 2 taken along the line III-III.
  • FIG. 4 is an enlarged schematic view of an IV portion of the imaging module of FIG. 3.
  • FIG. 5 is an exploded perspective view of an imaging module according to an embodiment of the present invention.
  • FIG. 6 is another exploded schematic view of an imaging module according to an embodiment of the present invention.
  • FIG. 7 is a perspective view of a cover body of an imaging module according to an embodiment of the present invention.
  • FIG. 8 is a schematic structural view of a flexible circuit board of an imaging module according to an embodiment of the present invention.
  • Figure 9 is an enlarged schematic view of a portion IX of the imaging module of Figure 3.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present invention, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature "above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • FIG. 1 is a schematic structural view of an imaging module according to an embodiment of the present invention.
  • the cover of the imaging module is not shown in FIG.
  • the imaging module 100 of the embodiment of the present invention includes a flexible circuit board 10, two camera modules 20, and a cover 50.
  • the flexible circuit board 10 includes two module mounting portions 11 and a connector mounting portion 12.
  • the connector mounting portion 12 connects the two module mounting portions 11.
  • the two camera modules 20 are respectively disposed on the module mounting portion 11, and the two camera modules 20 are spaced apart.
  • the cover 50 covers two camera modules 20 and is fixedly connected to the two camera modules 20 .
  • the cover 50 includes a frame 51 that surrounds the two camera modules 50.
  • the distance D between the frame 51 and the camera module 20 ranges from 0.1 to 0.5 mm.
  • the imaging module 100 of the embodiment of the present invention can bond the frame 51 and the camera module 20 by colloid, because the distance D between the frame 51 and the camera module 20 ranges from 0.1 to 0.5 mm.
  • the frame 51 and the camera module 20 can not only be firmly connected, but also reduce the volume of the imaging module 100, which is advantageous for miniaturization of the imaging module 100.
  • the two camera modules 20 are respectively fixed to the module mounting portion 11, and then one of the camera modules 20 can be clamped by a robot and passed through a robot.
  • the position of the other camera module 20 is adjusted such that the optical axes of the two camera modules 20 are parallel, and then the two camera modules 20 are fixed by gel bonding or welding.
  • a colloid may be applied to the frame 51, and the frame 51 and the camera module 20 may be fixedly connected by a colloid.
  • the frame 51 includes a first surface 51a
  • the camera module 20 includes a second surface 20a opposite to the first surface 51a.
  • the distance D between the frame 51 and the camera module 20 is the minimum distance between the first surface 51a and the second surface 20a.
  • the number of the module mounting portion and the camera module may be three or more, and three or more camera modules are spaced apart. More than three module mounting sections are spaced apart. Three or more camera modules are respectively disposed on three or more module mounting portions.
  • the distance D between the frame 51 and the camera module 20 ranges from 0.15 to 0.3 mm.
  • the frame body 51 is fixedly coupled to the camera module 20 by a gel.
  • the frame body 51 of the cover 50 is connected to the two camera modules 20 by the glue body, and the cover body 50 and the two camera modules 20 are easily connected. The cost of the imaging module 100 can be reduced.
  • the cover 50 includes a top cover 52 connected to the top of the frame 51.
  • the top cover 52 is fixedly connected to the two camera modules 20 by a glue.
  • the top cover 52 can increase the connection area between the cover 50 and the two camera modules 20, and further facilitate the connection between the cover 50 and the two camera modules 20.
  • the top cover 52 is provided with two light-passing holes 251, and the two camera modules 20 are respectively exposed through the two light-passing holes 251, so that the two camera modules 20 can collect external images.
  • both of the light-passing holes 251 have a cylindrical shape.
  • the shapes of the two light-passing holes may be specifically determined. Therefore, the shape of the light-passing hole 251 of the present embodiment is not to be construed as limiting the invention.
  • the light passing hole 251 is disposed coaxially with the optical axis of the camera module 20.
  • the two module mounting portions 11 are spaced apart.
  • the flexible circuit board 10 includes two connecting portions 13 that are spaced apart, and the two connecting portions 13 connect the two module mounting portions 11 and the connector mounting portion 12, respectively.
  • the two connecting portions 13 are spaced apart to further facilitate the deformation of the flexible circuit board 10, thereby facilitating adjustment of the positions of the two camera modules 20 such that the optical axes of the two camera modules 20 are parallel.
  • each camera module 20 includes a printed circuit board (PCB) and an image sensor 22 .
  • the sensing faces of the two image sensors 22 are parallel or coplanar and face the same side.
  • the printed circuit board 21 is disposed on the module mounting portion 11 and is electrically connected to the module mounting portion 11.
  • the image sensor 22 is disposed on the printed circuit board 21 and electrically connected to the printed circuit board 21.
  • the image sensor 22 can acquire an image of the object and transmit the image to the external device through the printed circuit board 21 and the flexible circuit board 10.
  • the image sensor 22 may be a complementary metal oxide semiconductor (CMOS) image sensor or a charge-coupled device (CCD) image sensor.
  • CMOS complementary metal oxide semiconductor
  • CCD charge-coupled device
  • the module mounting portion 11 includes a first electrical connection pad 111
  • the printed circuit board 21 includes a second electrical connection pad 211 correspondingly connected to the first electrical connection pad 111, and the printed circuit board 21 passes through the second The electrical connection pad 211 and the first electrical connection pad 111 are electrically connected to the module mounting portion 11 .
  • the first electrical connection pad 111 and the second electrical connection pad 211 electrically connect and communicate between the flexible circuit board 10 and the camera module 20 .
  • the first electrical connection pad 111 and the second electrical connection pad 211 are each made of a conductive paste.
  • each printed circuit board 21 corresponds to the shape and size of the corresponding module mounting portion 11.
  • Imaging module 100 This makes the structure of the imaging module 100 more compact, and is advantageous for reducing the volume of the imaging module 100. Imaging mode When the group 100 is applied to an electronic device, the volume of the electronic device can be further reduced.
  • each printed circuit board 21 and the corresponding module mounting portion 11 have a flat shape and the same size.
  • the shape of each printed circuit board and the corresponding module mounting portion may be specifically set according to actual needs. The size between the printed circuit board and the corresponding module mounting portion can be adjusted as needed.
  • the camera module 20 includes a lens module 23 disposed on the printed circuit board 21 and located above the image sensor 22 .
  • the lens module 23 can obtain an image of better quality by the image sensor 22, thereby improving the shooting quality of the imaging module 100.
  • each lens module 23 includes a lens 231 and a voice coil motor 232.
  • the lens 231 is disposed in the voice coil motor 232.
  • Each voice coil motor 232 includes a housing 2321, and the two housings 2321 are spaced apart.
  • the voice coil motor 232 can drive the lens 231 to move along the optical axis of the lens 231 to adjust the distance between the lens 231 and the image sensor 22, thereby achieving autofocus of the imaging module 100, so that the imaging module 100 can obtain a better quality image. .
  • a filter 24 is disposed between the lens 231 and the image sensor 22.
  • the filter 24 can filter the light of a predetermined frequency such that the image sensor 22 forms a better image based on the filtered light.
  • the filter 24 is an infrared cut filter.
  • the infrared cut filter can filter the infrared rays to avoid image distortion of the image sensor 22.
  • the lens module 23 further includes a base 233.
  • the base 233 defines a recess 2331.
  • the bottom surface of the recess 2331 defines a through hole 2332.
  • the filter 24 is disposed in the recess 2331 and supported on the bottom surface of the recess 2331, and the light filtered by the filter 24 can pass through the through hole 2332 to reach the image sensor 22.
  • the base 233 is provided with a connecting groove 2333, and the connecting groove 2333 communicates with the groove 2331.
  • the imaging module 100 includes a connector assembly 30 including a substrate 31 and a connector 32 disposed on the substrate 31.
  • the substrate 31 is disposed on the connector mounting portion 12 and electrically connected to the connector mounting portion 12.
  • the connector 32 can quickly mount the imaging module 100 to the electronic device.
  • the substrate 31 and the connector mounting portion 12 have the same shape and size. This makes the structure of the connector 32 and the flexible circuit board 10 more compact.
  • the imaging module 100 includes a colloid 40 disposed between the two camera modules 20 and bonding the two camera modules 20 .
  • the colloid 40 is inserted between the two camera modules 20.
  • the colloid 40 can ensure that the two camera modules 20 are relatively fixed, the colloid and the connection strength of the two camera modules 20 can be increased, and the probability of the optical axis offset of the two camera modules 20 can be reduced.
  • the colloid 40 is located at a lower portion of the gap between the two camera modules 20 .
  • the colloid can fill the gap between the two camera modules.
  • the colloid 40 may be, for example, a colloidal colloid such as UV glue (Ultraviolet Glue).
  • the camera module includes a connection side opposite to another camera module, and the two camera modules are fixedly connected by a solder connection side.
  • the two camera modules can be firmly fixed together by welding.
  • the connection side of each camera module can be fixedly connected to another camera module by laser spot welding or solder paste or tin wire bonding.
  • the imaging module 100 further includes a reinforcing plate 60, and the two module mounting portions 11 are fixed on the reinforcing plate 60.
  • the reinforcing plate 60 can further fix the positions of the two camera modules 20, improve the anti-collision capability of the imaging module 100, and thereby improve the shooting quality.
  • the imaging module 100 further includes an electromagnetic interference preventing member 70, and the reinforcing plate 60 is disposed on the electromagnetic interference preventing member 70.
  • the anti-electromagnetic interference component 70 can prevent the imaging module 100 from being interfered by electromagnetic waves, and ensure that the imaging module 100 obtains a better quality image.
  • the electromagnetic wave preventing member 70 can be made of, for example, a metal material.
  • the electronic device of the embodiment of the present invention includes the imaging module 100 described above.
  • the electronic device can be a mobile phone or a tablet computer or the like.
  • the imaging module 100 can bond the top cover 52 and the camera module 20 by colloid. Since the distance between the top cover 52 and the camera module 20 ranges from 0 to 0.1 mm, the top cover 52 Not only can the camera module 20 be firmly connected, but also the thickness of the imaging module 100 can be reduced, which is advantageous for miniaturization of the electronic device.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)

Abstract

本发明公开了一种成像模组及电子装置。成像模组包括柔性电路板、至少两个摄像模组及罩体。柔性电路板包括至少两个模组安装部及连接至少两个模组安装部的连接器安装部。至少两个摄像模组分别设置在至少两个模组安装部上，至少两个摄像模组间隔设置。罩体罩设至少两个摄像模组且与至少两个摄像模组固定连接，罩体包括围绕至少两个摄像模组的框体，框体与摄像模组之间的距离范围为0.1-0.5毫米。

Description

成像模组及电子装置
优先权信息
本申请请求2015年12月30日向中国国家知识产权局提交的、专利申请号为201511025532.1、201521132821.7、201511024922.7及201521131513.2及2016年03月03日向中国国家知识产权局提交的、专利申请号为201610120714.5、201620163180.X、201610120781.7、201620162943.9、201610120780.2、201620163035.1、201610120778.5、201620163163.6、201610120775.1、201620163152.8、201610120713.0、201620162941.X、201610120772.8、201620163154.7、201610120584.5、201620162897.2、201610120711.1、201620163024.3、201610120911.7、201620162763.0、201610120898.5、201620162899.1、201610120880.5、201620163142.4、201610120777.0、201620163009.9、201610120867.X、201620162868.6、201610120876.9、201620162728.9、201610120745.0、201620162720.2、201610120468.3、201620162718.5、201610120773.2及201620162944.3的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本发明涉及摄像技术领域，尤其涉及一种成像模组及一种电子装置。
背景技术
随着人们对拍摄图像的质量要求提高，双摄像头拍照技术应运而生。一般地，双摄像头模组包括两个光轴平行且朝向同一侧面拍摄的摄像头模组，如何在固定两个摄像头模组的同时减小双摄像头模组的体积成为亟待解决的问题。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明提供一种成像模组及一种电子装置。
本发明实施方式的成像模组包括柔性电路板、至少两个摄像模组及罩体。柔性电路板包括至少两个模组安装部及连接至少两个模组安装部的连接器安装部。至少两个摄像模组分别设置在至少两个模组安装部上，至少两个摄像模组间隔设置。罩体罩设至少两个摄像模组且与至少两个摄像模组固定连接。罩体包括围绕至少两个摄像模组的框体，框体与摄像模组之间的距离范围为0.1-0.5毫米。
本发明实施方式的成像模组可通过胶体粘结框体及摄像模组，由于框体与摄像模组之间的距离范围为0.1-0.5毫米，框体与摄像模组不仅可以连接牢固，还可以减小成像模 组的体积，有利于成像模组小型化。
在某些实施中，所述模组安装部的数量及所述摄像模组的数量均为两个。
在某些实施方式中，所述框体与所述摄像模组之间的距离范围为0.15-0.3毫米。
在某些实施方式中，所述框体通过胶体与所述摄像模组固定连接。
在某些实施方式中，所述罩体包括与所述框体的顶部连接的顶盖，所述顶盖通过胶体与两个所述摄像模组固定连接。
在某些实施方式中，两个所述模组安装部间隔设置，所述柔性电路板包括间隔设置的两个连接部，所述两个连接部分别连接两个所述模组安装部及所述连接器安装部。
在某些实施方式中，每个所述摄像模组包括印刷电路板及设置在所述印刷电路板上且与所述印刷电路板电性连接的图像传感器，所述印刷电路板设置在所述模组安装部上且与所述模组安装部电性连接。
在某些实施方式中，所述模组安装部包括第一电性连接垫，所述印刷电路板包括与所述第一电性连接垫对应连接的第二电性连接垫，所述印刷电路板通过所述第二电性连接垫与所述第一电性连接垫电性连接所述模组安装部。
在某些实施方式中，所述摄像模组包括设置在所述印刷电路板上并位于所述图像传感器上方的镜头模组。
在某些实施方式中，每个所述镜头模组包括镜头及音圈马达，所述镜头设置在所述音圈马达内，每个所述音圈马达包括壳体，两个所述壳体间隔设置。
在某些实施方式中，所述成像模组包括连接器组件，所述连接器组件包括基板及设置在所述基板上的连接器，所述基板设置在所述连接器安装部上并与所述连接器安装部电性连接。
在某些实施方式中，所述成像模组包括胶体，所述胶体设置在两个所述摄像模组之间并粘接两个所述摄像模组。
在某些实施方式中，所述摄像模组包括与另一个所述摄像模组相对的连接侧，两个所述摄像模组通过焊接所述连接侧固定连接。
本发明实施方式的电子装置包括上述的成像模组。
本实施实施方式的电子装置中，成像模组可通过胶体粘结顶盖及摄像模组，由于顶盖与摄像模组之间的距离范围为0-0.1毫米，顶盖与摄像模组不仅可以连接牢固，还可以降低成像模组的厚度，有利于电子装置组小型化。本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
图1是本发明实施方式的成像模组的结构示意图。
图2是本发明实施方式的成像模组的立体示意图。
图3是图2中的成像模组沿III-III向的剖面示意图。
图4是图3中的成像模组的IV部分的放大示意图。
图5是本发明实施方式的成像模组的分解示意图。
图6是本发明实施方式的成像模组的另一个分解示意图。
图7是本发明实施方式的成像模组的罩体的立体示意图。
图8是本发明实施方式的成像模组的柔性电路板的结构示意图。
图9是图3中的成像模组的IX部分的放大示意图。
具体实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
图1是本发明实施方式的成像模组的结构示意图。图1中未示出成像模组的罩体。
请一并参图1-图3及图7，本发明实施方式的成像模组100包括柔性电路板10、两个摄像模组20及罩体50。
柔性电路板10包括两个模组安装部11及连接器安装部12。连接器安装部12连接两个模组安装部11。
两个摄像模组20分别设置在模组安装部11上，两个摄像模组20间隔设置。
罩体50罩设两个摄像模组20且与两个摄像模组20固定连接。罩体50包括框体51，框体51围绕两个摄像模组50。框体51与摄像模组20之间的距离D范围为0.1-0.5毫米。
本发明实施方式的成像模组100可通过胶体粘结框体51及摄像模组20，由于框体51与摄像模组20之间的距离D范围为0.1-0.5毫米。框体51与摄像模组20不仅可以连接牢固，还可以减小成像模组100的体积，有利于成像模组100小型化。
具体地，在一个例子中，在组装成像模组100的时候，先将两个摄像模组20分别固定至模组安装部11，然后可用机械手夹持固定其中一个摄像模组20，并通过机械手调整另一个摄像模组20的位置以使两个摄像模组20的光轴平行，然后将两个摄像模组20通过胶体粘接或焊接固定。之后，可在框体51上涂上胶体，通过胶体可将框体51与摄像模组20固定连接。
需要说明的是，框体51包括第一表面51a，摄像模组20包括与第一表面51a相对第二表面20a。框体51与摄像模组20之间的距离D为第一表面51a与第二表面20a之间的最小距离。
可以理解，在其他实施方式中，模组安装部及摄像模组的数量均可为三个以上，三个以上的摄像模组间隔设置。三个以上的模组安装部间隔设置。三个以上的摄像模组分别设置在三个以上的模组安装部上。
为了方便说明，下文以模组安装部的数量及摄像模组的数量均为两个的实施方式作进一步说明，但不能理解为对本发明的限制。
本实施方式中，较佳地，框体51与摄像模组20之间的距离D范围为0.15-0.3毫米。
本实施方式中，框体51通过胶体与摄像模组20固定连接。如此，罩体50的框体51通过胶体与两个摄像模组20连接，容易实现罩体50与两个摄像模组20固定连接， 可降低成像模组100的成本。
本实施方式中，罩体50包括与框体51顶部连接的顶盖52，顶盖52通过胶体与两个摄像模组20固定连接。
如此，顶盖52可以增大罩体50与两个摄像模组20的连接面积，进一步有利于罩体50与两个摄像模组20连接牢固。
具体地，顶盖52开设有两个通光孔251，两个摄像模组20分别通过两个通光孔251暴露，以使两个摄像模组20可以采集外界图像。
需要说明的是，本实施方式中，两个通光孔251均呈圆柱形状。在其他实施方式中，两个通光孔的形状可分别具体而定。因此，本实施方式的通光孔251的形状不能理解为对本发明的限制。
本实施方式中，较佳地，通光孔251与摄像模组20的光轴同轴设置。
请结合图8，本实施方式中，两个模组安装部11间隔设置。柔性电路板10包括间隔设置的两个连接部13，两个连接部13分别连接两个模组安装部11及连接器安装部12。
两个连接部13间隔设置可进一步有利于柔性电路板10变形，从而有利于调整两个摄像模组20的位置以使两个摄像模组20的光轴平行。
请结合图4，本实施方式中，每个摄像模组20包括印刷电路板21(Printed Circuit Board，PCB)及图像传感器22。两个图像传感器22的感测面相平行或共面并且朝向同一侧。印刷电路板21设置在模组安装部11上且与模组安装部11电性连接。图像传感器22设置在印刷电路板21上且与印刷电路板21电性连接。
如此，图像传感器22可获取物体的图像，并将图像通过印刷电路板21及柔性电路板10传至外部装置。
具体地，图像传感器22可以采用互补金属氧化物半导体(Complementary Metal Oxide Semiconductor，CMOS)影像感测器或者电荷耦合元件(Charge-coupled Device，CCD)影像感测器。
本实施方式中，模组安装部11包括第一电性连接垫111，印刷电路板21包括与第一电性连接垫111对应连接的第二电性连接垫211，印刷电路板21通过第二电性连接垫211与第一电性连接垫111电性连接模组安装部11。
如此，第一电性连接垫111及第二电性连接垫211实现柔性电路板10与摄像模组20之间电性连接并通信。例如，第一电性连接垫111及第二电性连接垫211均采用导电胶。
本实施方式中，每个印刷电路板21与对应的模组安装部11的形状及尺寸相对应。
这样可使成像模组100的结构更加紧凑，有利于减小成像模组100的体积。成像模 组100应用于电子装置时，可进一步减小电子装置的体积。
本实施方式中，作为一个示例，每个印刷电路板21及与对应的模组安装部11的形状呈平板状且大小相同。而在其他实施方式中，每个印刷电路板及与对应的模组安装部的形状可根据实际需求而具体设置。印刷电路板与对应的模组安装部之间的尺寸可以根据需要进行调整。
请结合图5及图6，本实施方式中，摄像模组20包括设置在印刷电路板21上并位于图像传感器22上方的镜头模组23。
如此，镜头模组23可使图像传感器22获得品质较佳的图像，从而可提高成像模组100的拍摄品质。
本实施方式中，每个镜头模组23包括镜头231及音圈马达232，镜头231设置在音圈马达232内，每个音圈马达232包括壳体2321，两个壳体2321间隔设置。
音圈马达232可以驱动镜头231沿镜头231的光轴方向移动以调整镜头231与图像传感器22之间的距离，进而实现成像模组100的自动对焦，使成像模组100获取品质较佳的图像。
进一步地，镜头231与图像传感器22之间设置有滤光片24。滤光片24可以过滤预设频率的光线，使得图像传感器22根据过滤后的光线形成较佳的图像。
较佳地，滤光片24为红外截止滤光片。如此，红外截止滤光片可以过滤红外线，避免图像传感器22的图像失真。
具体地，镜头模组23还包括基座233，基座233开设有凹槽2331，凹槽2331的底面开设有通孔2332。滤光片24设置在凹槽2331内且支撑在凹槽2331的底面上，经过滤光片24过滤的光线可以通过通孔2332到达图像传感器22。
为了方便拿取滤光片24，基座233上开设有连接槽2333，连接槽2333连通凹槽2331。
本实施方式中，成像模组100包括连接器组件30，连接器组件30包括基板31及设置在基板31上的连接器32。基板31设置在连接器安装部12上并与连接器安装部12电性连接。
如此，连接器32可将成像模组100快速地安装到电子设备上。
较佳地，基板31与连接器安装部12的形状及尺寸一致。这样可使连接器32与柔性电路板10的结构更加紧凑。
本实施方式中，成像模组100包括胶体40，胶体40设置在两个摄像模组20之间并粘接两个摄像模组20。
在将两个摄像模组20的光轴调至相互平行后，在两个摄像模组20间点入胶体40。胶体40可保证两个摄像模组20相对固定，胶体并且可增加两个摄像模组20的连接强度，可降低两个摄像模组20的光轴偏移的概率。
需要说明的是，本实施方式中，如图3中的方位所示，胶体40位于两个摄像模组20之间的间隙的下部。而在其他实施方式中，胶体可填满两个摄像模组之间的间隙。
胶体40例如可为UV胶(Ultraviolet Glue)等具有黏性的胶体。
在一些实施方式中，摄像模组包括与另一个摄像模组相对的连接侧，两个摄像模组通过焊接连接侧固定连接。
如此，两个摄像模组通过焊接可将牢固地固定在一起。例如，每个摄像模组的连接侧可通过激光点焊或锡膏或锡线焊接而与另一个摄像模组固定连接。
进一步地，成像模组100还包括加强板60，两个模组安装部11固定在加强板60上。
如此，加强板60可进一步固定两个摄像模组20的位置，提高成像模组100的抗冲撞的能力，进而提高拍摄品质。
本实施方式中，成像模组100还包括防电磁干扰件70，加强板60设置在防电磁干扰件70上。
防电磁干扰件70可防止成像模组100受到电磁波的干扰，保证成像模组100获取品质较佳的图像。防电磁波干扰件70例如可采用金属材料制成。
本发明实施方式的电子装置包括上述的成像模组100。电子装置可以是手机或平板电脑等。
本实施实施方式的电子装置中，成像模组100可通过胶体粘结顶盖52及摄像模组20，由于顶盖52与摄像模组20之间的距离范围为0-0.1毫米，顶盖52与摄像模组20不仅可以连接牢固，还可以降低成像模组100的厚度，有利于电子装置小型化。
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“示意性实施方式”、“示例”、“具体示例”、或“一些示例”等的描述意指结合所述实施方式或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施方式或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施方式或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施方式或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施方式，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施方式进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (14)

  1. 一种成像模组，其特征在于，包括：
    柔性电路板，所述柔性电路板包括至少两个模组安装部及连接所述至少两个模组安装部的连接器安装部；
    至少两个摄像模组，所述至少两个摄像模组分别设置在所述至少两个模组安装部上，所述至少两个摄像模组间隔设置；及
    罩体，所述罩体罩设所述至少两个摄像模组且与所述至少两个摄像模组固定连接，所述罩体包括围绕所述至少两个摄像模组的框体，所述框体与所述摄像模组之间的距离范围为0.1-0.5毫米。
  2. 如权利要求1所述的成像模组，其特征在于，所述模组安装部的数量及所述摄像模组的数量均为两个。
  3. 如权利要求2所述的成像模组，其特征在于，所述框体与所述摄像模组之间的距离范围为0.15-0.3毫米。
  4. 如权利要求2所述的成像模组，其特征在于，所述框体通过胶体与所述摄像模组固定连接。
  5. 如权利要求2所述的成像模组，其特征在于，所述罩体包括与所述框体的顶部连接的顶盖，所述顶盖通过胶体与两个所述摄像模组固定连接。
  6. 如权利要求2所述的成像模组，其特征在于，两个所述模组安装部间隔设置，所述柔性电路板包括间隔设置的两个连接部，所述两个连接部分别连接两个所述模组安装部及所述连接器安装部。
  7. 如权利要求2所述的成像模组，其特征在于，每个所述摄像模组包括印刷电路板及设置在所述印刷电路板上且与所述印刷电路板电性连接的图像传感器，所述印刷电路板设置在所述模组安装部上且与所述模组安装部电性连接。
  8. 如权利要求7所述的成像模组，其特征在于，所述模组安装部包括第一电性连接垫，所述印刷电路板包括与所述第一电性连接垫对应连接的第二电性连接垫，所述印刷 电路板通过所述第二电性连接垫与所述第一电性连接垫电性连接所述模组安装部。
  9. 如权利要求7所述的成像模组，其特征在于，所述摄像模组包括设置在所述印刷电路板上并位于所述图像传感器上方的镜头模组。
  10. 如权利要求9所述的成像模组，其特征在于，每个所述镜头模组包括镜头及音圈马达，所述镜头设置在所述音圈马达内，每个所述音圈马达包括壳体，两个所述壳体间隔设置。
  11. 如权利要求2所述的成像模组，其特征在于，所述成像模组包括连接器组件，所述连接器组件包括基板及设置在所述基板上的连接器，所述基板设置在所述连接器安装部上并与所述连接器安装部电性连接。
  12. 如权利要求2所述的成像模组，其特征在于，所述成像模组包括胶体，所述胶体设置在两个所述摄像模组之间并粘接两个所述摄像模组。
  13. 如权利要求2所述的成像模组，其特征在于，所述摄像模组包括与另一个所述摄像模组相对的连接侧，两个所述摄像模组通过焊接所述连接侧固定连接。
  14. 一种电子装置，其特征在于，包括如权利要求1-13任一项所述的成像模组。
PCT/CN2016/090060 2015-12-30 2016-07-14 成像模组及电子装置 WO2017113749A1 (zh)

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