WO2017045241A1 - General platform structure for 8-inch and 12-inch substrates - Google Patents
General platform structure for 8-inch and 12-inch substrates Download PDFInfo
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- WO2017045241A1 WO2017045241A1 PCT/CN2015/092266 CN2015092266W WO2017045241A1 WO 2017045241 A1 WO2017045241 A1 WO 2017045241A1 CN 2015092266 W CN2015092266 W CN 2015092266W WO 2017045241 A1 WO2017045241 A1 WO 2017045241A1
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- 239000000758 substrate Substances 0.000 title claims abstract description 12
- 235000012431 wafers Nutrition 0.000 claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 claims abstract description 26
- 238000006243 chemical reaction Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
Definitions
- the present invention relates to a platform structure common to 8-inch and 12-inch substrates, which is mainly used in the preparation process of semiconductor thin film deposition, and belongs to the technical field of application of semiconductor thin film devices.
- the present invention aims to solve the above problems, and designs a universal platform structure of an 8-inch/12-inch substrate, and realizes two production modes of 8-inch and 12-inch wafers without replacing equipment components. Rapid switching, reducing production preparation time and improving production efficiency.
- the present invention adopts the following technical solutions, a platform structure common to 8-inch and 12-inch substrates, including: general equipment front-end module (2), universal load module (3), universal transfer module (4).
- the general-purpose device front-end module (2) uses a robotic finger (5) of 8 inch/12-inch wafer on the robot. Since the finger has two steps, the step B (9) is used to hold the 8-inch crystal. Circle (7); Step A (8) is used to hold 12-inch wafers (6), so the front-end module of the device can take 8 inch/12 inch wafer materials out of the wafer cassette and into the load. Module (3), and the processed finished wafer is taken out of the load module ( 3 ) and placed in the wafer cassette.
- the 8-inch/12-inch wafer can be transferred between the load module and the reaction module.
- the load module (3) uses an 8-inch/12-inch universal bracket tooling (1)
- the tooling has Step C (12) and Step D (13), on the ⁇ , 8 inch wafer (11) is placed on step D (13), and 12 inch wafer (10) is placed on step C (12). Therefore, the 8-inch/12-inch universal device front-end module (2), load module (3), and transfer module (4) together form an 8-inch/12-inch wafer sharing platform, which is 8 inch/12-inch wafer fast.
- the purpose of switching production is to meet the diversified production needs of the customer's enterprise.
- [0005] 1 the variety of production, can be used for the production of 8 inch / 12 inch two size wafers, optimized the production function of the equipment, a multi-purpose machine to meet different production needs, reducing equipment purchase costs;
- 1 is a general plan view of a general platform structure.
- FIG. 2 is a top view of a finger of a general robot.
- 3 is a front view of a general robot finger.
- FIG. 4 is a top plan view of the universal bracket tooling.
- FIG. 5 is a front view of the universal bracket tooling.
- the 8-inch/12-inch substrate common platform structure includes: a universal device front end module 2, a universal load module 3, and a universal transfer module 4.
- the robot head of the universal device front end module 2 uses a robot finger 5 which is universal for 8 inch/12 inch wafer. Since the finger has two steps, the step B9 is for holding the 8-inch wafer 7, and the step A8 is for The 12-inch wafer 6 is placed, so the front-end module of the device can take 8 inch/12 inch wafer materials out of the wafer cassette and transfer them into the load module 3, and process the finished wafer from the load module. Remove the 3 and place it in the wafer cassette.
- the 8 inch/12 inch wafer can be transferred between the load module and the reaction module. Since the load module 3 uses the 8-inch/12-inch universal bracket tooling 1, the tool has a step C12 and a step D13.
- the 12-inch wafer material 6 can be taken out of the wafer cassette by the step A8 of the equipment front end module 2 equipped with the robot finger 5, and placed in the load
- the 12-inch wafer 10 is taken out from the load module 3 into the reaction chamber by the transfer module 4 equipped with the robot finger 5 to generate a chemical reaction; after the reaction is completed, the same manner will be The wafer is returned to the finished wafer cassette.
- the platform structure can provide 8 inch / 12 inch wafer production for transport transfer.
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A general platform structure for 8-inch and 12-inch substrates. In a case in which device components are not replaced, two production modes of products can be rapidly switched. The platform structure comprises a general device front-end module (2), a general load module (3), and a general wafer transfer module (4). General mechanical arm fingers (5) are used on a mechanical arm of the general device front-end module (2). The fingers have two layers of steps, a step B (9) is used for holding 8-inch wafers (7), and a step A (8) is used for holding 12-inch wafers (6), and accordingly, the general device front-end module (2) can take the 8-inch/12-inch wafer raw materials out of a wafer box and transfer the 8-inch/12-inch wafer raw materials to the load module (3), and can take the finished wafer products out of the load module and place the finished wafer products into the wafer box. Diversification of produced products can be achieved, one machine for multiple purposes meets different manufacturing requirements, and device purchase cost is reduced. The general platform structure has the characteristics: the general platform structure has a simple and practical structure, saves device adjustment time and improves the production capacity. The general platform structure can be widely used in the technical field of semiconductor film devices.
Description
一种 8寸与 12寸基板通用的平台结构 A platform structure common to 8-inch and 12-inch substrates
技术领域 Technical field
[0001] 本发明涉及一种 8寸与 12寸基板通用的平台结构， 此结构主要应用于半导体薄 膜沉积制备过程中， 属于半导体薄膜设备的应用技术领域。 [0001] The present invention relates to a platform structure common to 8-inch and 12-inch substrates, which is mainly used in the preparation process of semiconductor thin film deposition, and belongs to the technical field of application of semiconductor thin film devices.
背景技术 Background technique
[0002] 为满足我国半导体市场对 8寸 /12寸晶圆的共同需求， 半导体制造企业常需要 根据不同的生产任务在 8寸 /12寸晶圆生产模式间频繁转换。 由于更换零部件和调 整生产线的过程占用大量吋间， 导致企业生产效率被降低， 并且在幵腔更换零 部件的过程中， 也容易将颗粒带入设备反应腔中， 进而污染晶圆、 降低半导体 产品良率。 因而设计 8寸与 12寸基板共用的平台结构， 目的在于减少生产线调试 和更换吋间， 提高企业产能。 [0002] In order to meet the common demand of 8-inch / 12-inch wafers in China's semiconductor market, semiconductor manufacturers often need to frequently switch between 8-inch / 12-inch wafer production modes according to different production tasks. Since the process of replacing parts and adjusting the production line takes up a lot of time, the production efficiency of the enterprise is reduced, and in the process of replacing the parts in the cavity, it is easy to bring the particles into the reaction chamber of the device, thereby contaminating the wafer and reducing the semiconductor. Product yield. Therefore, the platform structure shared by the 8-inch and 12-inch substrates is designed to reduce the production line debugging and replacement of the daytime, and to improve the production capacity of the enterprise.
技术问题 technical problem
[0003] 本发明以解决上述问题为目的， 设计了一种 8寸 /12寸基板通用的平台结构， 在 不更换设备零部件的前提下， 实现 8寸与 12寸晶圆两种产品生产模式的迅速切换 ， 降低生产准备吋间， 提高生产效率。 [0003] The present invention aims to solve the above problems, and designs a universal platform structure of an 8-inch/12-inch substrate, and realizes two production modes of 8-inch and 12-inch wafers without replacing equipment components. Rapid switching, reducing production preparation time and improving production efficiency.
问题的解决方案 Problem solution
技术解决方案 Technical solution
[0004] 为实现上述目的， 本发明采用下述技术方案， 一种 8寸与 12寸基板通用的平台 结构， 包括： 通用设备前端模块 （2) 、 通用负载模块 （3) 、 通用传片模块 （4 ) 。 其中， 通用设备前端模块 （2) 的机械手上使用的是 8寸 /12寸晶圆通用的机 械手手指 （5) ， 由于该手指具有两层台阶， 台阶 B (9) 用于盛放 8寸晶圆 (7); 台阶 A (8) 用于盛放 12寸晶圆 （6) ， 故该设备前端模块可以实现将 8寸 /12寸两 种晶圆原料从晶圆盒中取出并传入负载模块 （3) ， 并将加工好的成品晶圆从负 载模块 （3) 中取出并放入晶圆盒。 同理， 由于传片模块 （4) 中使用了相同的 机械手手指 （5) ， 故可以将 8寸 /12寸两种晶圆在负载模块与反应模块之间相互 传输。 由于负载模块 （3) 上使用的是 8寸 /12寸通用支架工装 （1) ， 该工装上有
台阶 C (12) 和台阶 D (13) ， 在使用吋， 8寸晶圆 （11) 盛放在台阶 D (13) 上 ， 12寸晶圆 （10) 盛放在台阶 C (12) 上。 因此， 8寸 /12寸通用的设备前端模块 (2) 、 负载模块 （3) 、 传片模块 （4) 共同构成了 8寸 /12寸晶圆共用平台， 达 到 8寸 /12寸晶圆快速切换生产的目的， 满足客户企业多样化的生产需求。 [0004] In order to achieve the above object, the present invention adopts the following technical solutions, a platform structure common to 8-inch and 12-inch substrates, including: general equipment front-end module (2), universal load module (3), universal transfer module (4). Among them, the general-purpose device front-end module (2) uses a robotic finger (5) of 8 inch/12-inch wafer on the robot. Since the finger has two steps, the step B (9) is used to hold the 8-inch crystal. Circle (7); Step A (8) is used to hold 12-inch wafers (6), so the front-end module of the device can take 8 inch/12 inch wafer materials out of the wafer cassette and into the load. Module (3), and the processed finished wafer is taken out of the load module ( 3 ) and placed in the wafer cassette. Similarly, since the same robot finger (5) is used in the transfer module (4), the 8-inch/12-inch wafer can be transferred between the load module and the reaction module. Since the load module (3) uses an 8-inch/12-inch universal bracket tooling (1), the tooling has Step C (12) and Step D (13), on the 吋, 8 inch wafer (11) is placed on step D (13), and 12 inch wafer (10) is placed on step C (12). Therefore, the 8-inch/12-inch universal device front-end module (2), load module (3), and transfer module (4) together form an 8-inch/12-inch wafer sharing platform, which is 8 inch/12-inch wafer fast. The purpose of switching production is to meet the diversified production needs of the customer's enterprise.
发明的有益效果 Advantageous effects of the invention
有益效果 Beneficial effect
[0005] 1、 生产品种多样化， 可用于 8寸 /12寸两种尺寸规格晶圆的生产， 优化了设备 的生产功能， 一机多用满足不同生产需求， 减少设备购置成本； [0005] 1, the variety of production, can be used for the production of 8 inch / 12 inch two size wafers, optimized the production function of the equipment, a multi-purpose machine to meet different production needs, reducing equipment purchase costs;
[0006] 2、 结构简单实用， 不需要更换任何零部件就可以迅速地切换 8寸和 12寸两种 晶圆的生产， 节省设备调整吋间， 缩短生产周期， 提高产能。 [0006] 2. The structure is simple and practical. It can quickly switch between 8-inch and 12-inch wafers without replacing any parts, saving equipment adjustment time, shortening production cycle and increasing production capacity.
对附图的简要说明 Brief description of the drawing
附图说明 DRAWINGS
[0007] 图 1是通用平台结构总体俯视图。 1 is a general plan view of a general platform structure.
[0008] 图 2是通用机械手手指俯视图。 2 is a top view of a finger of a general robot.
[0009] 图 3是通用机械手手指主视图。 3 is a front view of a general robot finger.
[0010] 图 4是通用支架工装俯视图。 [0010] FIG. 4 is a top plan view of the universal bracket tooling.
[0011] 图 5是通用支架工装主视图。 [0011] FIG. 5 is a front view of the universal bracket tooling.
本发明的实施方式 Embodiments of the invention
[0012] 实施例 [0012] Embodiment
[0013] 参照图 1-图 5， 8寸 /12寸基板通用平台结构， 包括： 通用设备前端模块 2、 通用 负载模块 3、 通用传片模块 4。 其中， 通用设备前端模块 2的机械手上使用的是 8 寸 /12寸晶圆通用的机械手手指 5， 由于该手指具有两层台阶， 台阶 B9用于盛放 8寸晶圆 7， 台阶 A8用于盛放 12寸晶圆 6， 故该设备前端模块可以实现将 8 寸 /12寸两种晶圆原料从晶圆盒中取出并传入负载模块 3， 并将加工好的成品晶 圆从负载模块 3中取出并放入晶圆盒。 同理， 由于传片模块 4中使用了相同的机 械手手指 5， 故可以将 8寸 /12寸两种晶圆在负载模块与反应模块之间相互传输。
由于负载模块 3上使用的是 8寸 /12寸通用支架工装 1， 该工装上有台阶 C12和台阶 D13。 1 to 5, the 8-inch/12-inch substrate common platform structure includes: a universal device front end module 2, a universal load module 3, and a universal transfer module 4. Among them, the robot head of the universal device front end module 2 uses a robot finger 5 which is universal for 8 inch/12 inch wafer. Since the finger has two steps, the step B9 is for holding the 8-inch wafer 7, and the step A8 is for The 12-inch wafer 6 is placed, so the front-end module of the device can take 8 inch/12 inch wafer materials out of the wafer cassette and transfer them into the load module 3, and process the finished wafer from the load module. Remove the 3 and place it in the wafer cassette. Similarly, since the same robot finger 5 is used in the film transfer module 4, the 8 inch/12 inch wafer can be transferred between the load module and the reaction module. Since the load module 3 uses the 8-inch/12-inch universal bracket tooling 1, the tool has a step C12 and a step D13.
[0014] 使用吋， 在进行 8寸晶圆生产任务吋： 配备机械手手指 5的设备前端模块 2用 台阶 B9将 8寸晶圆 11原料从晶圆盒中取出， 并放入负载模块 3里支架工装 1 的台阶 D13上， 再由配备机械手手指 5的传片模块 4将 8寸晶圆 7从负载模块 3 中取出放入反应室内发生化学反应； 反应完成后以相同的方式将晶圆放回成品 晶圆盒。 [0014] Using 吋, in the 8-inch wafer production task 吋: The device front-end module 2 equipped with the robot finger 5 takes the 8-inch wafer 11 material out of the wafer cassette with the step B9, and puts it into the load module 3 On the step D13 of the tooling 1, the 8-inch wafer 7 is taken out from the load module 3 into the reaction chamber by the transfer module 4 equipped with the robot finger 5, and a chemical reaction takes place; after the reaction is completed, the wafer is returned in the same manner. Finished wafer cassette.
[0015] 在进行 12寸晶圆生产任务吋： 无需对运输设备调整， 可由配备机械手手指 5的 设备前端模块 2用台阶 A8将 12寸晶圆原料 6从晶圆盒中取出， 并放入负载模 块 3里支架工装 1的台阶 C12上， 再由配备机械手手指 5的传片模块 4将 12寸 晶圆 10从负载模块 3中取出放入反应室内发生化学反应； 反应完成后以相同的 方式将晶圆放回成品晶圆盒。 这样， 该平台结构可提供 8寸 /12寸晶圆的生产实 现运输传送功能。 [0015] In the 12-inch wafer production task: Without the adjustment of the transportation equipment, the 12-inch wafer material 6 can be taken out of the wafer cassette by the step A8 of the equipment front end module 2 equipped with the robot finger 5, and placed in the load On the step C12 of the fixture tooling 1 in the module 3, the 12-inch wafer 10 is taken out from the load module 3 into the reaction chamber by the transfer module 4 equipped with the robot finger 5 to generate a chemical reaction; after the reaction is completed, the same manner will be The wafer is returned to the finished wafer cassette. In this way, the platform structure can provide 8 inch / 12 inch wafer production for transport transfer.
工业实用性 Industrial applicability
[0016] 在此处键入工业实用性描述段落。 [0016] Enter the paragraph of industrial applicability description here.
序列表自由内容 Sequence table free content
[0017] 在此处键入序列表自由内容描述段落。
[0017] Type the sequence table free content description paragraph here.
Claims
[权利要求 1] 一种 8寸与 12寸基板通用的平台结构， 其特征在于： 该平台包括通用 设备前端模块、 通用负载模块及通用传片模块， 其中， 通用设备前端 模块的机械手上使用的是 8寸 /12寸晶圆通用的机械手手指， 该手指具 有两层台阶， 台阶 B用于盛放 8寸晶圆； 台阶 A用于盛放 12寸晶圆， 故 该设备前端模块可以实现将 8寸 /12寸两种晶圆原料从晶圆盒中取出并 传入负载模块， 并将加工好的成品晶圆从负载模块中取出并放入晶圆 品- ° [Claim 1] A platform structure common to 8-inch and 12-inch substrates, characterized in that: the platform includes a universal device front-end module, a universal load module, and a universal transfer module, wherein the universal device front-end module is used on a robot hand It is a general-purpose robot finger for 8-inch/12-inch wafers. The finger has two steps. Step B is used to hold 8-inch wafers. Step A is used to hold 12-inch wafers. Therefore, the front-end module of the device can be realized. The 8 inch/12 inch wafer material is taken out of the wafer cassette and passed into the load module, and the processed finished wafer is taken out of the load module and placed in the wafer - °
[权利要求 2] 如权利要求 1所述的 8寸与 12寸基板通用的平台结构， 其特征在于： 所 述传片模块中使用了相同的机械手手指， 故可以将 8寸 /12寸两种晶圆 在负载模块与反应模块之间相互传输， 由于负载模块上使用的是 8寸 / 12寸通用支架工装， 该工装上有台阶 C和台阶 D， 在使用吋， 8寸晶圆 盛放在台阶 D上， 12寸晶圆盛放在台阶 C上； 所述的 8寸 /12寸通用的 设备前端模块、 负载模块、 传片模块共同构成了 8寸 /12寸晶圆共用平 台， 达到 8寸 /12寸晶圆快速切换生产的目的。 [Claim 2] The platform structure common to the 8-inch and 12-inch substrates according to claim 1, wherein: the same robot finger is used in the film transfer module, so that 8 inch/12 inch can be used. The wafer is transferred between the load module and the reaction module. Since the load module uses an 8-inch/12-inch universal bracket tooling, the tool has a step C and a step D. After use, the 8-inch wafer is placed. On the step D, the 12-inch wafer is placed on the step C; the 8-inch/12-inch universal device front-end module, the load module, and the transfer module together form an 8-inch/12-inch wafer sharing platform, reaching 8 Inch / 12-inch wafers quickly switch production purposes.
[权利要求 3] 如权利要求 1所述的 8寸与 12寸基板通用的平台结构， 其特征在于： 使用吋， 在进行 8寸晶圆生产任务吋： 配备机械手手指的设备前端模 块用台阶 B将 8寸晶圆原料从晶圆盒中取出， 并放入负载模块里支 架工装的台阶 D上， 再由配备机械手手指的传片模块将 8寸晶圆从负 载模块中取出放入反应室内发生化学反应， 反应完成后以相同的方式 将晶圆放回成品晶圆盒。 [Claim 3] The platform structure common to the 8-inch and 12-inch substrates according to claim 1, wherein: the use of 吋, in the 8-inch wafer production task 吋: the front end module equipped with the robot finger uses the step B The 8-inch wafer material is taken out of the wafer cassette and placed in the step D of the fixture tool in the load module, and then the 8-inch wafer is taken out from the load module into the reaction chamber by the transfer module equipped with the robot finger. Chemical reaction, after the reaction is completed, the wafer is returned to the finished wafer cassette in the same manner.
[权利要求 4] 如权利要求 1所述的 8寸与 12寸基板通用的平台结构， 其特征在于： 使用吋， 在进行 12寸晶圆生产任务吋： 无需对运输设备调整， 可由配 备机械 2手手指的设备前端模块用台阶 A将 12寸晶圆原料从晶圆盒中 取出， 并放入负载模块里支架工装的台阶 C上， 再由配备机械手手指 的传片模块将 12寸晶圆从负载模块中取出放入反应室内发生化学反 应， 反应完成后以相同的方式将晶圆放回成品晶圆盒。
[Claim 4] The platform structure common to the 8-inch and 12-inch substrates according to claim 1, wherein: the use of 吋, in the 12-inch wafer production task 吋: no need to adjust the transportation equipment, can be equipped with machinery 2 The front-end module of the hand and finger device takes the 12-inch wafer material out of the wafer cassette with the step A, and puts it into the step C of the mounting tool in the load module, and then passes the 12-inch wafer from the transfer module equipped with the robot finger. The chemical reaction takes place in the load module and is placed in the reaction chamber. After the reaction is completed, the wafer is returned to the finished wafer cassette in the same manner.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510594231.4A CN105161469A (en) | 2015-09-17 | 2015-09-17 | 8-inch/12-inch substrate general platform structure |
| CN201510594231.4 | 2015-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2017045241A1 true WO2017045241A1 (en) | 2017-03-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2015/092266 WO2017045241A1 (en) | 2015-09-17 | 2015-10-20 | General platform structure for 8-inch and 12-inch substrates |
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| CN (1) | CN105161469A (en) |
| WO (1) | WO2017045241A1 (en) |
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| US20080199283A1 (en) * | 2007-02-15 | 2008-08-21 | Ichiro Mitsuyoshi | Substrate processing apparatus |
| CN201611653U (en) * | 2009-11-10 | 2010-10-20 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor wafer clamping device |
| CN102779776A (en) * | 2011-05-12 | 2012-11-14 | 联达科技设备私人有限公司 | Handler configured to handle component panes of multiple sizes |
| CN103187345A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Taking and placing device |
| CN103199049A (en) * | 2012-01-04 | 2013-07-10 | 沈阳芯源微电子设备有限公司 | Bernoulli wafer bearing table capable of containing wafers with different sizes in compatible mode |
| CN204481014U (en) * | 2015-02-03 | 2015-07-15 | 北京七星华创电子股份有限公司 | Wafer carrier and annealing device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080175694A1 (en) * | 2007-01-19 | 2008-07-24 | Dong-Seok Park | Unit and method for transferring substrates and apparatus and method for treating substrates with the unit |
| TWI678751B (en) * | 2013-12-13 | 2019-12-01 | 日商昕芙旎雅股份有限公司 | Equipment front-end module (EFEM) |
-
2015
- 2015-09-17 CN CN201510594231.4A patent/CN105161469A/en active Pending
- 2015-10-20 WO PCT/CN2015/092266 patent/WO2017045241A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1388988A (en) * | 2000-09-06 | 2003-01-01 | 奥林巴斯光学工业株式会社 | Substrate transporting device |
| US20080199283A1 (en) * | 2007-02-15 | 2008-08-21 | Ichiro Mitsuyoshi | Substrate processing apparatus |
| CN201611653U (en) * | 2009-11-10 | 2010-10-20 | 中芯国际集成电路制造(上海)有限公司 | Semiconductor wafer clamping device |
| CN102779776A (en) * | 2011-05-12 | 2012-11-14 | 联达科技设备私人有限公司 | Handler configured to handle component panes of multiple sizes |
| CN103187345A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Taking and placing device |
| CN103199049A (en) * | 2012-01-04 | 2013-07-10 | 沈阳芯源微电子设备有限公司 | Bernoulli wafer bearing table capable of containing wafers with different sizes in compatible mode |
| CN204481014U (en) * | 2015-02-03 | 2015-07-15 | 北京七星华创电子股份有限公司 | Wafer carrier and annealing device |
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| CN105161469A (en) | 2015-12-16 |
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