CN105161469A

CN105161469A - 8-inch/12-inch substrate general platform structure

Info

Publication number: CN105161469A
Application number: CN201510594231.4A
Authority: CN
Inventors: 周仁; 廉杰; 方仕彩; 杜广宇
Original assignee: Piotech Shenyang Co Ltd
Current assignee: Piotech Inc
Priority date: 2015-09-17
Filing date: 2015-09-17
Publication date: 2015-12-16
Also published as: WO2017045241A1

Abstract

Provided is an 8-inch/12-inch substrate general platform structure, so that under the condition of not replacing components of equipment, rapid switching of two product production modes can be realized. The platform structure comprises a general equipment front-end module, a general load module and a general wafer transmission module. A mechanical arm of the general equipment front-end module adopts general mechanical arm fingers; the arm fingers have two layers of steps, wherein the step B is used for holding 8-inch wafers, and the step A is used for holding 12-inch wafers, so that the general equipment front-end module can enable the 8-inch/12-inch wafer raw materials to be taken out of a wafer box and transmitted to the load module, and enable the finished wafer products to be taken away from the load module and put into the wafer box. The platform structure can realize diversified production variety and the effect of one machine with multiple purposes to meet different manufacture requirements, reduces equipment purchase cost, has the advantages of being simple is structure and practical, saving equipment adjustment time and improving productivity, and can be widely applied to the technical field of semiconductor film equipment.

Description

A kind of 8 cun of platform structures general with 12 cun of substrates

Technical field

The present invention relates to a kind of 8 cun of platform structures general with 12 cun of substrates, this structure is mainly used in semiconductive thin film deposition preparation process, belongs to the applied technical field of semiconductor film film device.

Background technology

For meeting the joint demand of China's semi-conductor market to 8 cun/12 cun of wafers, semiconductor manufacture industry often needs according to different production tasks frequent transitions between 8 cun/12 cun wafer production patterns.Because the process changing parts and adjustment production line takies the plenty of time, enterprises production efficiency is caused to be lowered, and beginning to speak to change in the process of parts, also easy particle to be brought in device reaction cavity, and then polluting wafer, reduction semiconductor product yield.Thus design 8 cun of platform structures shared with 12 cun of substrates, object is to reduce production line debugging and replacing construction, improves enterprise's production capacity.

Summary of the invention

The present invention is for the purpose of solving the problem, devise the platform structure that a kind of 8 cun/12 cun of substrates are general, under the prerequisite not changing equipment component, realize 8 cun with the rapid switching of 12 cun of wafers, two kinds of production patterns, reduce the Operational preparation time, enhance productivity.

For achieving the above object, the present invention adopts following technical proposals, and a kind of 8 cun of platform structures general with 12 cun of substrates, comprising: common apparatus front-end module (2), Universal load module (3), general biography sheet module (4).Wherein, the manipulator of common apparatus front-end module (2) uses the manipulator finger (5) that 8 cun/12 cun wafers are general, because this finger has two-layer step, step B (9) is for holding 8 cun of wafers (7); Step A (8) is for holding 12 cun of wafers (6), therefore this front equipment end module can realize 8 cun/12 cun two kinds of donor wafers take out from wafer cassette and import load blocks (3) into, and the product wafer processed is taken out from load blocks (3) and puts into wafer cassette.In like manner, employ identical manipulator finger (5) owing to passing in sheet module (4), therefore 8 cun/12 cun two kinds of wafers mutually can be transmitted between load blocks and reaction module.Owing to load blocks (3) using 8 cun/12 cun universal mount frocks (1), this frock there is step C (12) and step D (13), in use, 8 cun of wafers (11) are contained on step D (13), and 12 cun of wafers (10) are contained on step C (12).Therefore, 8 cun/12 cun general front equipment end modules (2), load blocks (3), pass sheet module (4) and together constitute 8 cun/12 cun wafer common platforms, reach the object that 8 cun/12 cun of wafers switch production fast, meet the diversified Production requirement of Client Enterprise.

Beneficial effect of the present invention and feature are:

1, produce diversification of varieties, can be used for the production of 8 cun/12 cun of two kinds of dimensions wafers, optimize the production function of equipment, a tractor serves several purposes meets different Production requirement, reduces equipment purchasing cost;

2, simple and practical, do not need to change the production that any parts just promptly can switch 8 cun and 12 cun two kinds of wafers, save equipment regulation time, shorten the production cycle, improve production capacity.

Accompanying drawing explanation

Fig. 1 is the overall vertical view of universal platform structure.

Fig. 2 is universal machine hand finger vertical view.

Fig. 3 is universal machine hand finger front view.

Fig. 4 is universal mount frock vertical view.

Fig. 5 is universal mount frock front view.

Embodiment

With reference to Fig. 1-Fig. 5,8 cun/12 cun substrate universal platform structures, comprising: common apparatus front-end module 2, Universal load module 3, general biography sheet module 4.Wherein, the manipulator of common apparatus front-end module 2 uses the manipulator finger 5 that 8 cun/12 cun wafers are general, because this finger has two-layer step, step B9 is used for holding 8 cun of wafers 7, step A8 is used for holding 12 cun of wafers 6, therefore this front equipment end module can realize 8 cun/12 cun two kinds of donor wafers take out from wafer cassette and import load blocks 3 into, and the product wafer processed is taken out from load blocks 3 and puts into wafer cassette.In like manner, employ identical manipulator finger 5 owing to passing in sheet module 4, therefore 8 cun/12 cun two kinds of wafers mutually can be transmitted between load blocks and reaction module.Owing to load blocks 3 using 8 cun/12 cun universal mount frocks 1, this frock there is step C12 and step D13.

During use, when carrying out 8 cun of wafer production tasks: 8 cun of wafer 11 raw materials take out with step B9 by the front equipment end module 2 being equipped with manipulator finger 5 from wafer cassette, and put on the step D13 of load blocks 3 li of support frocks 1, then 8 cun of wafers 7 are taken out from load blocks 3 put into reative cell by being equipped with the biography sheet module 4 of manipulator finger 5 chemical reaction occurs; In an identical manner wafer is put back to product wafer box after having reacted.

When carrying out 12 cun of wafer production tasks: without the need to adjusting transporting equipment, 12 cun of donor wafers 6 can be taken out from wafer cassette with step A8 by the front equipment end module 2 being equipped with manipulator finger 5, and put on the step C12 of load blocks 3 li of support frocks 1, then 12 cun of wafers 10 are taken out from load blocks 3 put into reative cell by being equipped with the biography sheet module 4 of manipulator finger 5 chemical reaction occurs; In an identical manner wafer is put back to product wafer box after having reacted.Like this, this platform structure can provide the production of 8 cun/12 cun of wafers to realize transport transmitting function.

Claims

1. one kind 8 cun platform structures general with 12 cun of substrates, it is characterized in that: this platform comprises common apparatus front-end module, Universal load module and general biography sheet module, wherein, the manipulator of common apparatus front-end module uses the manipulator finger that 8 cun/12 cun of wafers are general, this finger has two-layer step, and step B is used for holding 8 cun of wafers; Step A is used for holding 12 cun of wafers, therefore this front equipment end module can realize 8 cun/12 cun two kinds of donor wafers take out from wafer cassette and import load blocks into, and is taken out from load blocks by the product wafer processed and put into wafer cassette.

2. 8 cun of platform structures general with 12 cun of substrates as claimed in claim 1, it is characterized in that: in described biography sheet module, employ identical manipulator finger, therefore 8 cun/12 cun two kinds of wafers mutually can be transmitted between load blocks and reaction module, owing to load blocks using 8 cun/12 cun universal mount frocks, this frock there is step C and step D, in use, 8 cun of wafers are contained on step D, and 12 cun of wafers are contained on step C; Described 8 cun/12 cun general front equipment end modules, load blocks, biography sheet modules together constitute 8 cun/12 cun wafer common platforms, reach the object that 8 cun/12 cun of wafers switch production fast.

3. 8 cun of platform structures general with 12 cun of substrates as claimed in claim 1, it is characterized in that: during use, when carrying out 8 cun of wafer production tasks: 8 cun of donor wafers take out by the front equipment end module step B being equipped with manipulator finger from wafer cassette, and put on the step D of support frock in load blocks, 8 cun of wafers are taken out from load blocks put into reative cell by being equipped with the biography sheet module of manipulator finger chemical reaction occurs again, after having reacted, in an identical manner wafer is put back to product wafer box.

4. 8 cun of platform structures general with 12 cun of substrates as claimed in claim 1, it is characterized in that: during use, when carrying out 12 cun of wafer production tasks: without the need to adjusting transporting equipment, by the front equipment end module step A being equipped with manipulator finger, 12 cun of donor wafers can be taken out from wafer cassette, and put on the step C of support frock in load blocks, 12 cun of wafers are taken out from load blocks put into reative cell by being equipped with the biography sheet module of manipulator finger chemical reaction occurs again, after having reacted, in an identical manner wafer is put back to product wafer box.