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WO2016107094A1 - 电路板及其制造方法，和显示装置 - Google Patents

电路板及其制造方法，和显示装置 Download PDF

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Publication number
WO2016107094A1
WO2016107094A1 PCT/CN2015/081530 CN2015081530W WO2016107094A1 WO 2016107094 A1 WO2016107094 A1 WO 2016107094A1 CN 2015081530 W CN2015081530 W CN 2015081530W WO 2016107094 A1 WO2016107094 A1 WO 2016107094A1
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WO
WIPO (PCT)
Prior art keywords
base substrate
circuit module
circuit
circuit board
pad
Prior art date
Application number
PCT/CN2015/081530
Other languages
English (en)
French (fr)
Inventor
毛德丰
武延兵
Original Assignee
京东方科技集团股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/905,507 priority Critical patent/US20160286651A1/en
Publication of WO2016107094A1 publication Critical patent/WO2016107094A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a circuit board and a method of fabricating the same, and a display device including the same.
  • the liquid crystal display device may include a liquid crystal display panel 1 and a control circuit.
  • the liquid crystal display panel 1 may include a color filter substrate 11 and an array substrate 12 .
  • the color filter substrate 11 and the array substrate 12 each include a base substrate, and the control circuit may include a plurality of circuit modules, and the circuit module may be the power module 21, the system module 22, or the timing control module 23, and the like.
  • the power module 21, the system module 22, and the timing control module 23 are respectively disposed on three printed circuit boards (PCBs), and the power module 21 and the system module 22 pass through the copper wires 24 and the timing control module 23, respectively.
  • the timing control module 23 is connected to the liquid crystal display panel 1 through a Flexible Printed Circuit Board (FPC) 25 to realize electrical control performance of the liquid crystal display device.
  • FPC Flexible Printed Circuit Board
  • circuit modules such as power module 21, system module 22 or timing control module 23, etc.
  • circuit modules such as power module 21, system module 22 or timing control module 23, etc.
  • the present invention provides a circuit board in view of the above technical problems existing in the prior art. And a manufacturing method thereof, and a display device including the same, for reducing a production cycle of the product, reducing the thickness of the display device, reducing the space occupied by the circuit module, improving integration, reducing circuit impedance, reducing channel length, and Improve the operating speed of the circuit module.
  • a circuit board including: a base substrate, a circuit module, and a pad, the circuit module and the pad being disposed on the base substrate, and The circuit module is coupled to the pad.
  • the base substrate is a transparent substrate.
  • the material of the base substrate is glass.
  • the material of the pad is a transparent conductive material.
  • the circuit board further includes: an encapsulation layer on the circuit module and the pad and covering the substrate.
  • the circuit board further includes: a package structure, the package structure is located on a package surface of the circuit module, and a package surface of the circuit module faces the base substrate.
  • the pins of the circuit module are connected to the pads.
  • the pin of the circuit module is connected to the pad by a bonding wire
  • a display device including a display panel and any one of the above-described circuit boards connected to the display panel is provided.
  • a method of manufacturing a circuit board including the steps of:
  • the circuit module is connected to the pad.
  • the manufacturing method further includes the steps of:
  • the base substrate is integrally packaged by means of a top drop to form an encapsulation layer on the circuit module and the pad, and the encapsulation layer covers the base substrate.
  • the manufacturing method before the step of disposing the circuit module on the base substrate, the manufacturing method further includes the steps of: forming a package structure on a package surface of the circuit module;
  • the step of disposing a circuit module on the base substrate includes disposing the circuit module on the base substrate such that a package surface of the circuit module faces the base substrate.
  • the step of connecting the circuit module to the pad comprises:
  • a pin of the circuit module is connected to the pad by a bonding wire.
  • the manufacturing method thereof and the technical solution of the display device, the circuit module and the pad are both disposed on the base substrate, and the circuit module is connected to the pad.
  • the invention adopts a base substrate instead of a PCB, so that the base substrate in the circuit board can be made of the same material as the base substrate in the display panel, so that the circuit board and the display panel can be produced by the same manufacturer, thereby reducing the production cycle of the product.
  • the thickness of the substrate substrate is smaller than the thickness of the PCB, thereby reducing the thickness of the display device; the circuit modules are all located on the same substrate, which reduces the space occupied by the circuit module, improves the integration, reduces the circuit impedance, and reduces The length of the path and the speed of the circuit module are increased.
  • FIG. 1 is a schematic structural view of a liquid crystal display device in the prior art
  • FIG. 2 is a schematic structural diagram of a circuit board according to Embodiment 1 of the present invention.
  • FIG. 3 is a schematic structural diagram of a display device according to Embodiment 2 of the present invention.
  • 5a is a schematic view showing the formation of a pad on a base substrate in the third embodiment
  • FIG. 5b is a schematic view showing a circuit module formed on a substrate on which a pad is formed in Embodiment 3;
  • Fig. 5c is a schematic view showing the formation of an encapsulation layer on a substrate on which a circuit module is formed in the third embodiment.
  • Embodiment 1 is a diagrammatic representation of Embodiment 1:
  • the circuit board includes: a base substrate 31, a circuit module and a pad 32, and the circuit module and the pad 32 are provided. It is placed on the base substrate 31, and the circuit module is connected to the pad 32.
  • the number of circuit modules can be one or more.
  • three circuit modules are taken as an example.
  • the three circuit modules can be respectively a power module 33, a system module 34, and a timing control module 35. Therefore, the base substrate 31 is provided with a power module 33, a system module 34, and timing control. Module 35.
  • the circuit module can also be other functional modules, which are not enumerated here.
  • the base substrate 31 may be a transparent substrate. Specifically, the material of the base substrate 31 may be glass.
  • the material of the pad 32 may be a transparent conductive material.
  • the transparent conductive material may be Indium tin oxide (ITO).
  • the circuit board may further include an encapsulation layer (not shown in FIG. 2) on the circuit module and the pad 32 and covering the base substrate 31, thereby encapsulating the base substrate 31, the circuit module, and the pad 32 into A whole.
  • the material of the encapsulation layer may be an epoxy resin.
  • the epoxy resin is used as a packaging material to package the circuit board as a whole, which can reduce the packaging cost.
  • the circuit board may further include a package structure (not shown in FIG. 2), the package structure is located on a package surface of the circuit module, and a package surface of the circuit module faces the base substrate 31, that is, the package structure is located in the circuit module.
  • the package surface is interposed between the surface of the base substrate 31 on which the circuit module is disposed, thereby encapsulating the circuit module on the base substrate 31.
  • the package surface of the circuit module is the lower surface of the circuit module.
  • the material of the package structure may be an epoxy resin.
  • a package structure is disposed on the package surfaces of the power module 33, the system module 34, and the timing control module 35, and the package surfaces of the power module 33, the system module 34, and the timing control module 35 are all directed toward the base substrate 31.
  • the pins of the circuit module are connected to the pads 32.
  • the pins of the circuit module can be connected to the pads 32 by a bonding wire 36.
  • Each circuit module corresponds to one or more pads, the number of pads 32 corresponding to each circuit module is the same as the number of pins of the circuit module, and the pads 32 corresponding to each circuit module surround the circuit module Settings.
  • the pins of the circuit module are connected to the pads 32 through the bonding wires 36.
  • the pins of the power module 33, the system module 34, and the timing control module 35 are connected to the pads 32 through the bonding wires 36.
  • the pins of the circuit module can be connected to the pads 32 through the bonding wires 36, there is no need to additionally provide a lead for connection between the pins of the circuit module and the pads 32, thereby reducing the circuit module and soldering.
  • the distance between the discs allows the distance between the circuit modules and the pads to be shorter, and also increases the strength and reliability of the connections.
  • the circuit board may further include: a wire (not shown in FIG. 2) disposed on the base substrate 31, the wire having one end connected to the pad 32 and the other end connected to the display panel.
  • the circuit module and the pad are disposed on the base substrate, and the circuit module is connected to the pad.
  • the embodiment adopts The base substrate replaces the PCB of the prior art.
  • the base substrate in the circuit board can be made of the same material as the base substrate in the display panel, the circuit board and the display panel can be produced by the same manufacturer, thereby reducing the production cycle of the product; and, the thickness of the base substrate is less than The thickness of the PCB, thereby reducing the thickness of the display device, provides a solution for the subsequent development of ultra-thin display devices; compared with the prior art, the circuit modules need to be disposed on different PCBs, all the circuits in this embodiment The modules are all disposed on the same substrate, which reduces the space occupied by the circuit module, improves the integration, reduces the circuit impedance, reduces the path length and improves the running speed.
  • the substrate is a transparent substrate
  • the material of the pad is made of a transparent conductive material, so that the printed circuit board is transparent except for the soldered area (ie, the area where the circuit module is soldered).
  • a PCB that is opaque in technology can give customers a better visual experience than a PCB.
  • Embodiment 2 is a diagrammatic representation of Embodiment 1:
  • FIG. 3 is a schematic structural diagram of a display device according to Embodiment 2 of the present invention.
  • the display device includes a display panel 1 and a circuit board 3 connected to the display panel 1.
  • the circuit board 3 For a detailed description of the structure of the circuit board 3, reference may be made to the above-mentioned first embodiment and FIG. 2, which will not be repeated here.
  • the display panel 1 may include a color film substrate 11 and an array substrate 12 which are disposed opposite each other.
  • the display panel 1 can be connected to the circuit board 3 via a Flexible Printed Circuit Board (FPC) 4.
  • FPC Flexible Printed Circuit Board
  • the wires connected to the pads 32 in the circuit board 3 are connected to the display panel 1 through the FPC 4.
  • one end of the wire in the circuit board 3 is connected to the pad 32, and the other end of the wire in the circuit board 3 is passed through an anisotropic conductive film (ACF) (not shown in FIG. 3).
  • ACF anisotropic conductive film
  • One end of the FPC 4 is connected, and the display panel 1 is connected to the other end of the FPC 4 through the ACF, thereby realizing the connection of the display panel 1 to the circuit board 3 through the FPC 4.
  • a circuit mode is disposed on a substrate
  • the block and the pad, and the circuit module are connected to the pad.
  • the circuit module is disposed on the PCB, and the present embodiment uses the substrate substrate instead of the PCB in the prior art.
  • the base substrate in the circuit board can be made of the same material as the base substrate in the display panel, the circuit board and the display panel can be produced by the same manufacturer, thereby reducing the production cycle of the product; and, the thickness of the base substrate is less than The thickness of the PCB, thereby reducing the thickness of the display device, provides a solution for the subsequent development of ultra-thin display devices; compared with the prior art, the circuit modules need to be disposed on different PCBs, all the circuits in this embodiment The modules are all disposed on the same substrate, which reduces the space occupied by the circuit module, improves the integration, reduces the circuit impedance, reduces the path length and improves the running speed of the circuit module.
  • Embodiment 3 is a diagrammatic representation of Embodiment 3
  • FIG. 4 is a flowchart of a method for manufacturing a circuit board according to Embodiment 3 of the present invention. As shown in FIG. 4, the method may include steps 101 to 103.
  • Step 101 providing a pad on the base substrate.
  • FIG. 5a is a schematic view showing the formation of the pads 32 on the base substrate 31 in the present embodiment.
  • pads 32 are provided on the base substrate 31 in accordance with a predetermined position.
  • a pad material layer may be deposited on the base substrate 31, and a pad material layer is formed as the pad 32 by a patterning process.
  • a pad material layer may be deposited on the base substrate 31 by a magnetron sputtering process.
  • Step 102 installing a circuit module on the base substrate.
  • FIG. 5b is a schematic view showing the formation of a circuit module on the base substrate 31 on which the pads 32 are formed in the present embodiment. As shown in FIG. 5b, the circuit module is placed on the base substrate 31. Specifically, the power module 33, the system module 34, and the timing control module 35 can be placed around the corresponding pads 32, respectively.
  • Step 103 Connect the circuit module to the pad.
  • This step can be: connecting the pins of the circuit module to the pads. Specifically, as shown in FIG. 2, the pins of the circuit module and the pads 32 are soldered by the bonding wires 36. In this embodiment, the pins of the power module 33, the system module 34, and the timing control module 35 can be soldered to the corresponding pads 32, respectively.
  • the method can also include:
  • Step 104 The base substrate is integrally packaged by means of top dropping to form an encapsulation layer on the circuit module and the pad, and the encapsulation layer covers the substrate.
  • Fig. 5c is a schematic view showing the formation of an encapsulation layer on the base substrate 31 on which the circuit module is formed in the present embodiment.
  • the base substrate 31 is integrally packaged by means of a top drop to form an encapsulation layer 5 on the circuit module and the pad 32, and the encapsulation layer 5 covers the base substrate 31.
  • the method further includes: forming a package structure on a package surface of the circuit module.
  • the circuit module disposed on the base substrate in step 102 is specifically: the circuit module is disposed on the base substrate such that the package surface of the circuit module faces the base substrate.
  • the circuit module and the pad are disposed on the base substrate, and the circuit module is connected to the pad, compared with the circuit module disposed on the PCB in the prior art.
  • the embodiment uses a base substrate instead of the prior art PCB.
  • the base substrate in the circuit board can be made of the same material as the base substrate in the display panel, the circuit board and the display panel can be produced by the same manufacturer, thereby reducing the production cycle of the product; and, the thickness of the base substrate Less than the thickness of the PCB, thereby reducing the thickness of the display device, providing a solution for the subsequent development of ultra-thin display devices; compared with the prior art, the circuit modules need to be disposed on different PCBs, all in this embodiment The circuit modules are all disposed on the same base substrate, thereby reducing the space occupied by the circuit modules, improving the integration degree, reducing the circuit impedance, reducing the path length and increasing the running speed.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)

Abstract

一种电路板及其制造方法和显示装置。该电路板包括：衬底基板（31）、电路模块和焊盘（32），电路模块和焊盘设置于衬底基板上，且电路模块与焊盘连接。采用衬底基板代替了现有技术中的PCB，由于电路板中的衬底基板可以和显示面板中的衬底基板采用相同的材质，故电路板和显示面板可以由同一厂家生产，从而能降低产品的生产周期；而且衬底基板的厚度小于PCB的厚度，从而减小了显示装置的厚度；与现有技术中不同的电路模块需设置在不同的PCB上相比，所有电路模块均设置在同一衬底基板上，故减小了电路模块占用的空间，提高了集成度，降低了电路阻抗，降低了通路长度以及提高了电路模块的运行速度。

Description

电路板及其制造方法，和显示装置 技术领域
本发明涉及显示技术领域，特别涉及一种电路板及其制造方法，和一种包括所述电路板的显示装置。
背景技术
在显示技术领域中，液晶显示装置的应用越来越广泛。图1为现有技术中液晶显示装置的结构示意图，如图1所示，该液晶显示装置可包括液晶显示面板1和控制电路，其中，液晶显示面板1可包括彩膜基板11和阵列基板12，彩膜基板11和阵列基板12均包括衬底基板，控制电路可包括多个电路模块，电路模块可以为电源模块21、系统模块22或时序控制模块23等。其中，电源模块21、系统模块22和时序控制模块23分别设置在三块印刷线路板(Printed Circuit Board，简称：PCB)上，电源模块21和系统模块22分别通过铜导线24与时序控制模块23连接，而时序控制模块23通过挠性印刷电路板(Flexible Printed Circuit board，简称：FPC)25与液晶显示面板1连接，从而实现液晶显示装置的电气控制性能。
但是，现有技术的上述技术方案存在如下技术问题：
1)由于液晶显示面板中的衬底基板的材质和控制电路中的电路模块的载体(即PCB)的材质不同，且衬底基板和PCB一般由不同的厂家分别生产，因而可能会具有较长的产品生产周期；
2)由于PCB的厚度较大，且PCB需要设置于液晶显示面板1的背面，因而增加了液晶显示装置的厚度；
3)不同的电路模块需设置在不同的PCB上，因而导致电路模块(如电源模块21、系统模块22或时序控制模块23等)占用空间大、集成度低、电路阻抗高、通路长度长以及运行缓慢。
发明内容
针对现有技术中存在的上述技术问题，本发明提供了一种电路板 及其制造方法，和包括所述电路板的显示装置，用于降低产品的生产周期，减小显示装置的厚度，减小电路模块占用的空间，提高集成度，降低电路阻抗，降低通路长度以及提高电路模块的运行速度。
为实现上述目的，根据本发明的一方面，提供了一种电路板，包括：衬底基板、电路模块和焊盘，所述电路模块和所述焊盘设置于所述衬底基板上，且所述电路模块与所述焊盘连接。
可选地，所述衬底基板为透明基板。
可选地，所述衬底基板的材料为玻璃。
可选地，所述焊盘的材料为透明导电材料。
可选地，所述电路板还包括：封装层，所述封装层位于所述电路模块和所述焊盘上且覆盖所述衬底基板。
可选地，所述电路板还包括：封装结构，所述封装结构位于所述电路模块的封装面上，且所述电路模块的封装面朝向所述衬底基板。
可选地，所述电路模块的管脚与所述焊盘连接。
可选地，所述电路模块的管脚与所述焊盘通过焊线连接
为实现上述目的，根据本发明的另一方面，提供了一种显示装置，包括显示面板和与所述显示面板连接的上述任意一种电路板。
为实现上述目的，根据本发明的又一方面，提供了一种电路板的制造方法，包括步骤：
在衬底基板上设置焊盘；
在衬底基板上设置电路模块；以及
将所述电路模块与所述焊盘连接。
可选地，在所述将所述电路模块与所述焊盘连接的步骤之后，所述制造方法还包括步骤：
采用顶部滴下的方式对所述衬底基板进行整体封装，以在所述电路模块和所述焊盘上形成封装层，并使所述封装层覆盖所述衬底基板。
可选地，在所述在衬底基板上设置电路模块的步骤之前，所述制造方法还包括步骤：在所述电路模块的封装面上形成封装结构；以及
所述在衬底基板上设置电路模块的步骤包括：将所述电路模块设置于所述衬底基板上，使得所述电路模块的封装面朝向所述衬底基板。
可选地，所述将所述电路模块与所述焊盘连接的步骤包括：
将所述电路模块的管脚与所述焊盘通过焊线连接。
本发明具有以下有益效果：
本发明提供的电路板及其制造方法和显示装置的技术方案中，电路模块和焊盘均设置于衬底基板上，电路模块与焊盘连接。本发明采用衬底基板代替PCB，使得电路板中的衬底基板可以和显示面板中的衬底基板采用相同的材质，使得电路板和显示面板可以由同一厂家生产，从而能降低产品的生产周期；衬底基板的厚度小于PCB的厚度，从而减小显示装置的厚度；电路模块均位于同一个衬底基板上，减小了电路模块占用的空间，提高了集成度，降低了电路阻抗，降低了通路长度以及提高了电路模块的运行速度。
附图说明
图1为现有技术中液晶显示装置的结构示意图；
图2为本发明实施例一提供的电路板的结构示意图；
图3为本发明实施例二提供的显示装置的结构示意图；
图4为本发明实施例三提供的电路板的制造方法的流程图；
图5a为实施例三中在衬底基板上形成焊盘的示意图；
图5b为实施例三中在形成有焊盘的衬底基板上形成电路模块的示意图；
图5c为实施例三中在形成有电路模块的衬底基板上形成封装层的示意图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图和具体实施例对本发明提供的电路板及其制造方法以及包括所述电路板的显示装置进行详细描述。
实施例一：
图2为本发明实施例一提供的电路板的结构示意图，如图2所示，该电路板包括：衬底基板31、电路模块和焊盘32，电路模块和焊盘32设 置于衬底基板31上，且电路模块与焊盘32连接。
电路模块的数量可以为一个或者多个。本实施例以三个电路模块为例，这三个电路模块可以分别为电源模块33、系统模块34和时序控制模块35，因此衬底基板31上设置有电源模块33、系统模块34和时序控制模块35。本实施例中，电路模块还可以为其它功能模块，此处不再一一列举。
衬底基板31可以为透明基板。具体地，衬底基板31的材料可以为玻璃。
焊盘32的材料可以为透明导电材料，例如：该透明导电材料可以为氧化铟锡(ITO,Indium tin oxide)。
该电路板还可以包括封装层(图2中未示出)，该封装层位于电路模块和焊盘32上且覆盖衬底基板31，从而将衬底基板31、电路模块和焊盘32封装成一个整体。该封装层的材料可以为环氧树脂。采用环氧树脂作为封装材料对电路板进行整体封装，可以降低封装成本。
或者，该电路板还可以包括封装结构(图2中未示出)，该封装结构位于电路模块的封装面上，且电路模块的封装面朝向衬底基板31，即，封装结构位于电路模块的封装面与衬底基板31的设置有电路模块的表面之间，从而将电路模块封装在衬底基板31上。图2中，电路模块的封装面为电路模块的下表面。该封装结构的材料可以为环氧树脂。本实施例中，电源模块33、系统模块34和时序控制模块35的封装面上均设置有封装结构，且电源模块33、系统模块34和时序控制模块35的封装面均朝向衬底基板31。
电路模块的管脚与焊盘32连接，具体地，电路模块的管脚可以通过焊线(Bonding Wire)36与焊盘32连接。每个电路模块均对应一个或多个焊盘，与每个电路模块对应的焊盘32的数量与该电路模块的管脚数量相同，且与每个电路模块对应的焊盘32围绕该电路模块设置。本实施例中，电路模块的管脚通过焊线36与焊盘32连接，具体地，电源模块33、系统模块34和时序控制模块35的管脚均通过焊线36与焊盘32连接。由于电路模块的管脚可通过焊线36与焊盘32连接，使得电路模块的管脚与焊盘32之间无需再额外设置用于连接的引线，从而缩小了电路模块与焊 盘之间的距离，使得电路模块与焊盘之间的距离可以更短，还提高了连接的强度和可靠性。
该电路板还可以包括：设置于衬底基板31上的导线(图2中未示出)，该导线的一端与焊盘32连接，另一端与显示面板连接。
本实施例提供的电路板的技术方案中，在衬底基板上设置电路模块和焊盘，且电路模块与焊盘连接，与现有技术中在PCB上设置电路模块相比，本实施例采用衬底基板代替了现有技术中的PCB。由于电路板中的衬底基板可以和显示面板中的衬底基板采用相同的材质，故电路板和显示面板可以由同一厂家生产，从而能降低产品的生产周期；而且，衬底基板的厚度小于PCB的厚度，从而减小了显示装置的厚度，为后续开发超薄型显示装置提供解决方案；与现有技术中不同的电路模块需设置在不同的PCB上相比，本实施例中所有电路模块均设置于同一个衬底基板上，故减小了电路模块占用的空间，提高了集成度，降低了电路阻抗，降低了通路长度以及提高了运行速度。本实施例中，衬底基板采用透明基板，焊盘的材料采用透明导电材料，使得制成的电路板除了焊接区域(即，焊接有电路模块的区域)以外的区域均是透明的，与现有技术中不透明的PCB相比能够给客户带来较佳的视觉感受。
实施例二：
图3为本发明实施例二提供的显示装置的结构示意图。如图3所示，该显示装置包括显示面板1和与显示面板1连接的电路板3。电路板3的结构的具体描述可参见上述实施例一和附图2，此处不再重复。
显示面板1可包括相对设置的彩膜基板11和阵列基板12。显示面板1可通过挠性印刷电路板(Flexible Printed Circuit board，简称：FPC)4与电路板3连接。本实施例中，电路板3中与焊盘32连接的导线通过FPC4与显示面板1连接。具体地，电路板3中的导线的一端与焊盘32连接，电路板3中的导线的另一端通过异方性导电膜(Anisotropic Conductive Film，简称：ACF)(图3中未示出)与FPC 4的一端连接，而显示面板1通过ACF与FPC 4的另一端连接，从而实现了显示面板1通过FPC 4与电路板3连接。
本实施例提供的显示装置的技术方案中，在衬底基板上设置电路模 块和焊盘，且电路模块与焊盘连接，与现有技术中在PCB上设置电路模块相比，本实施例采用衬底基板代替了现有技术中的PCB。由于电路板中的衬底基板可以和显示面板中的衬底基板采用相同的材质，故电路板和显示面板可以由同一厂家生产，从而能降低产品的生产周期；而且，衬底基板的厚度小于PCB的厚度，从而减小了显示装置的厚度，为后续开发超薄型显示装置提供解决方案；与现有技术中不同的电路模块需设置在不同的PCB上相比，本实施例中所有电路模块均设置于同一个衬底基板上，故减小了电路模块占用的空间，提高了集成度，降低了电路阻抗，降低了通路长度以及提高了电路模块的运行速度。
实施例三：
图4为本发明实施例三提供的电路板的制造方法的流程图，如图4所示，该方法可以包括步骤101至103。
步骤101、在衬底基板上设置焊盘。
图5a为本实施例中在衬底基板31上形成焊盘32的示意图。如图5a所示，根据预先设定的位置在衬底基板31上设置焊盘32。具体地，可在衬底基板31上沉积焊盘材料层，并通过构图工艺使焊盘材料层形成为焊盘32。其中，可通过磁控溅射工艺在衬底基板31上沉积焊盘材料层。
步骤102、在衬底基板上设置电路模块。
图5b为本实施例中在形成有焊盘32的衬底基板31上形成电路模块的示意图。如图5b所示，将电路模块放置于衬底基板31上。具体地，可将电源模块33、系统模块34和时序控制模块35分别放置于对应的焊盘32周围。
步骤103、将电路模块与焊盘连接。
本步骤可以为：将电路模块的管脚与焊盘连接。具体地，如图2所示，将电路模块的管脚与焊盘32通过焊线36进行焊接。本实施例中，可将电源模块33、系统模块34和时序控制模块35的管脚分别与对应的焊盘32焊接。
该方法还可以包括：
步骤104、采用顶部滴下的方式对衬底基板进行整体封装，以在电路模块和焊盘上形成封装层，并使封装层覆盖衬底基板。
图5c为本实施例中在形成有电路模块的衬底基板31上形成封装层的示意图。如图5c所示，采用顶部滴下的方式对衬底基板31进行整体封装，以在电路模块和焊盘32上形成封装层5，并使封装层5覆盖衬底基板31。
可选择地，在步骤102之前还可以包括：在电路模块的封装面上形成封装结构。此种情况下，步骤102中的在衬底基板上设置电路模块具体为：将电路模块设置于衬底基板上，使得电路模块的封装面朝向衬底基板。
本实施例提供的电路板的制造方法的技术方案中，在衬底基板上设置电路模块和焊盘，且电路模块与焊盘连接，与现有技术中在PCB上设置电路模块相比，本实施例采用衬底基板代替了现有技术的PCB。由于电路板中的衬底基板可以和显示面板中的衬底基板采用相同的材质，故电路板和显示面板就可以由同一厂家生产，从而降低了产品的生产周期；而且，衬底基板的厚度小于PCB的厚度，从而减小了显示装置的厚度，为后续开发超薄型显示装置提供解决方案；与现有技术中不同的电路模块需设置在不同的PCB上相比，本实施例中所有电路模块均设置于同一个衬底基板上，故减小了电路模块占用的空间，提高了集成度，降低了电路阻抗，降低了通路长度以及提高了运行速度。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (12)

  1. 一种电路板，其特征在于，包括：衬底基板、电路模块和焊盘，所述电路模块和所述焊盘设置于所述衬底基板上，且所述电路模块与所述焊盘连接。
  2. 根据权利要求1所述的电路板，其特征在于，所述衬底基板为透明基板。
  3. 根据权利要求1或2所述的电路板，其特征在于，所述衬底基板的材料为玻璃。
  4. 根据权利要求1所述的电路板，其特征在于，所述焊盘的材料为透明导电材料。
  5. 根据权利要求1所述的电路板，其特征在于，所述电路板还包括：封装层，所述封装层位于所述电路模块和所述焊盘上且覆盖所述衬底基板。
  6. 根据权利要求1所述的电路板，其特征在于，所述电路板还包括：封装结构，所述封装结构位于所述电路模块的封装面上，且所述电路模块的封装面朝向所述衬底基板。
  7. 根据权利要求1所述的电路板，其特征在于，所述电路模块的管脚与所述焊盘通过焊线连接。
  8. 一种显示装置，包括：显示面板和与所述显示面板连接的电路板；其特征在于，
    所述电路板采用上述权利要求1至7中任一所述的电路板。
  9. 一种电路板的制造方法，其特征在于，包括步骤：
    在衬底基板上设置焊盘；
    在衬底基板上设置电路模块；
    将所述电路模块与所述焊盘连接。
  10. 根据权利要求9所述的电路板的制造方法，其特征在于，在所述将所述电路模块与所述焊盘连接的步骤之后还包括步骤：
    采用顶部滴下的方式对所述衬底基板进行整体封装，以在所述电路模块和所述焊盘上形成封装层，并使所述封装层覆盖所述衬底基板。
  11. 根据权利要求9所述的电路板的制造方法，其特征在于，在所述在衬底基板上设置电路模块的步骤之前还包括步骤：在所述电路模块的封装面上形成封装结构；以及
    所述在衬底基板上设置电路模块的步骤包括：将所述电路模块设置于所述衬底基板上，使得所述电路模块的封装面朝向所述衬底基板。
  12. 根据权利要求9所述的电路板的制造的方法，其特征在于，所述将所述电路模块与所述焊盘连接的步骤包括：
    将所述电路模块的管脚与所述焊盘通过焊线连接。
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CN104470210A (zh) 2015-03-25

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