WO2016059914A1 - カメラモジュールの製造方法および製造装置 - Google Patents
カメラモジュールの製造方法および製造装置 Download PDFInfo
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- WO2016059914A1 WO2016059914A1 PCT/JP2015/075371 JP2015075371W WO2016059914A1 WO 2016059914 A1 WO2016059914 A1 WO 2016059914A1 JP 2015075371 W JP2015075371 W JP 2015075371W WO 2016059914 A1 WO2016059914 A1 WO 2016059914A1
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- WIPO (PCT)
- Prior art keywords
- actuator
- optical lens
- camera module
- substrate
- lens
- Prior art date
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/62—Optical apparatus specially adapted for adjusting optical elements during the assembly of optical systems
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B43/00—Testing correct operation of photographic apparatus or parts thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
Definitions
- the present invention relates to a manufacturing method and a manufacturing apparatus for a camera module.
- the camera module includes an imaging block composed of an imaging device such as a CCD or CMOS and a substrate on which the imaging device is mounted, a lens fixing material including an optical lens that forms an image on the imaging device, and the lens fixing material.
- a movable actuator block is integrated.
- the camera module is manufactured as follows, for example.
- the actuator block includes an optical lens provided so as to be movable in the optical axis direction, and a lens barrel that fixes the optical lens.
- an adhesive such as an ultraviolet curable resin.
- focus adjustment is performed by adjusting the position of the lens barrel in the optical axis direction.
- an adhesive such as an ultraviolet curable resin is applied and fixed between the optical block and the lens barrel.
- the camera module assembled through the above-mentioned processes is inspected for each imaging characteristic, and products that have no problems including appearance inspection are shipped.
- the problem of resolving power shows an ideal resolving power when the central axis of the lens makes 90 ° with respect to the surface of the image sensor, but an inclination occurs when the image sensor is fixed, and the image sensor and the lens central axis are When 90 ° cannot be achieved, the resolving power decreases, leading to a decrease in production yield.
- Patent Document 1 a method as disclosed in Patent Document 1 has been proposed.
- substrate support means for supporting the substrate from below is provided for the problem that an error occurs in the verticality between the image sensor and the lens surface due to warpage of the substrate (PCB).
- PCB warpage of the substrate
- a technique is described in which the image sensor is mounted in an inclined manner according to the inclination of the substrate by die bonding using the provided rim tool, and the lens housing module (corresponding to an AF actuator) and the mounting standard of the image sensor are matched.
- a substrate support means can be used, but the lens housing is disposed on one surface of the substrate.
- the substrate support means cannot be used.
- the warpage is larger than that of the resin, and when the opening is provided at the center of the substrate, the warpage becomes more remarkable.
- the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method and an apparatus for manufacturing a camera module that can easily solve a decrease in resolution due to an inclination of an image sensor. It is.
- a camera module manufacturing apparatus includes an optical lens, a lens fixing member that houses and holds the optical lens, and moves the lens fixing member, An actuator block that drives the optical lens to be displaced in the optical axis direction, and an imaging block on which the actuator block is mounted via an adhesive, and an imaging element that captures an image formed by the light from the optical lens
- a camera module including an imaging block that is mounted on a support unit that supports the imaging device horizontally from the side opposite to the imaging surface, and a central axis of the optical lens is supported by the support unit.
- the actuator block is horizontally mounted in a non-contact state on the substrate so as to be perpendicular to the imaging surface of the image sensor. And a mounting portion.
- (A), (b), (d) is a figure which shows an example of the manufacturing method of the camera module in Embodiment 1
- (c) is a top view which shows an example of the manufacturing method of the camera module in Embodiment 1.
- (A)-(c) is a figure which shows the holding method of the actuator block with which the camera module of Embodiment 1 is provided. It is a figure which shows the holding method of the actuator block of Embodiment 1.
- FIG. It is a figure which shows the holding method of the actuator block of Embodiment 1.
- (A) is a figure which shows an example of the manufacturing method of the camera module in Embodiment 2
- (b) is a top view which shows an example of the manufacturing method of the camera module in Embodiment 2.
- FIG. 10 is a cross-sectional view showing a manufacturing process of the camera module and showing a state in which the optical unit is positioned and fixed in the lens holder in a state where the lens driving device is placed on the height positioning jig. It is a sectional view showing the manufacturing process of the camera module and showing a state in which the height positioning jig is removed from the lens driving device.
- FIG. 10 is a cross-sectional view illustrating a process of manufacturing a camera module, which is a process of chucking the top surface side of the lens driving device by a mounting device and preparing an imaging unit.
- (A)-(c) is a figure which shows an example of the camera module of a prior art.
- FIGS. 13A to 13C are diagrams showing an example of a conventional camera module.
- the actuator block 1 for moving the lens fixing member 5 including the optical lens 11 is coupled to an imaging block configured by mounting the imaging element 3 on the substrate 2 via an adhesive 6 or the like.
- an ideal resolving power is exhibited.
- the stage 4 used in the actuator block mounting process is ideally installed at an angle of 90 ° with the central axis 7, and the imaging device 3 assembled as designed. Are located in parallel.
- the substrate 2 on which the image sensor 3 is mounted actually has a warp, and it is difficult to suppress the warp particularly in a substrate made of ceramic.
- the image pickup device 3 is mounted with an inclination with respect to the central axis 7 of the optical lens 11 due to warpage of the substrate 2.
- the tower mounting surface 8 on which the actuator block 1 of the substrate 2 is mounted is also affected by warping, so that the actuator block 1 itself is inclined and mounted on the substrate 2, and a complex inclination with respect to the image sensor 3 is also provided. Will have.
- FIG. 13 (C) of FIG. 13 is a figure which shows an example of another prior art.
- the mounting surface 9 on which the image pickup device 3 is mounted With respect to the warpage of the substrate 2, the mounting surface 9 on which the image pickup device 3 is mounted, the tower mounting surface 8 on which the actuator block 1 is mounted, and the contact with the stage 4 are contacted.
- the surface 10 is also affected.
- These three factors can be cited as factors of the tilt related to the warp of the substrate 2, and it is very difficult for the central axis 7 and the image sensor 3 to make 90 ° due to these tilts.
- the present invention provides a camera module manufacturing method and a manufacturing apparatus capable of solving the disadvantages caused by the tilt factors related to the warp of the substrate 2 as described above.
- embodiments of the present invention will be described in detail.
- FIGS. 1A to 1D are schematic views showing an example of a method for manufacturing a camera module according to the first embodiment.
- the camera module 100 moves the lens fixing member 29 that accommodates the optical lens 28 to move the optical lens 28 in the direction of the optical axis.
- an imaging block configured by mounting the imaging element 23 on the substrate 22.
- the actuator block 21 is coupled to the imaging block via the adhesive 25 in the stage 24.
- the imaging block has a configuration in which the imaging element 23 is mounted with the imaging surface facing the mounting surface 22 c of the substrate 22. More specifically, as shown in FIG. 1C, which is a top view of the state excluding the actuator block 21, mounting is performed by flip-chip bonding between the terminal portion 23a of the image sensor 23 and the substrate 22. .
- substrate 22 has the protrusion part 22b which protruded in the mounting surface 22c side in the whole periphery, and the back surface (tower mounting surface) 22a in which the actuator block 21 is provided in the other side of the mounting surface 22c.
- the actuator block 21 is provided after the adhesive 25 or the like is applied to the back surface 22 a of the substrate 22. Further, the protruding portion 22 b surrounds the image sensor 23 and is designed to be longer than the thickness of the image sensor 23.
- the stage 24 used in the actuator block mounting step has a pedestal portion 27 having a predetermined height, and the back surface (opposite side of the imaging surface) of the imaging element 23 is the pedestal. Receiving on the flat surface 27a of the unit 27, the imaging block is held. Further, the pedestal portion 27 is set to such a height that the protruding portion 22b does not contact the stage 24 when the imaging block is arranged.
- the image sensor 23 can be kept parallel to the stage 24 even if the substrate 22 is warped as shown in FIG. Even when the image sensor 23 is mounted with an inclination with respect to the substrate 22, the image sensor 23 is not affected by the warp of the substrate 22.
- the actuator block 21 and the imaging block are fixed with the adhesive 25 or the like, the actuator block 21 is in a non-contact state or partly in contact with the back surface 22a of the substrate 22 (at least partly floats). In this state, the central axis 26 of the optical lens 28 of the actuator block 21 is adjusted so as to be approximately 90 ° (with an error of about ⁇ 5 °) with respect to the image sensor 23.
- the actuator block 21 is held by an actuator block mounting head 32, and the contact surface 20 between the actuator block mounting head 32 and the actuator block 21 is The pedestal 27 holding the image sensor 23 is adjusted to be parallel to the flat surface 27a.
- the actuator block 21 and the imaging block are fixed with an adhesive 25 or the like in a state where the actuator block 21 is lifted from the back surface 22a of the substrate 22 so that the actuator block 21 is not affected by the warp of the substrate 22.
- the adhesive 25 that couples the actuator block 21 and the imaging block is an ultraviolet curing resin, and is cured by being irradiated with ultraviolet rays 34 by a UV irradiator 33 and fixed.
- the adhesive 25 may be a thermosetting resin, or may be fixed by curing the resin with a spot heater or the like.
- the actuator block 21 and the imaging block are fixed using an ultraviolet curable resin, a thermosetting resin, or the like, ultraviolet rays or hot air emitted from a UV irradiator or a spot heater is generated.
- the coating amount is adjusted so that the adhesive 25 is protruded from the actuator block 21 and the substrate 22.
- the adhesive strength after curing the protruding adhesive 25a is temporarily fixed so that the actuator block 21 and the imaging block are not misaligned, tilted, etc. After this step, they are put into a thermostatic chamber.
- the main fixing work such as thermosetting or irradiating with ultraviolet rays is performed.
- FIGS. 3A to 3C are diagrams showing the flow of the mounting process of the actuator block mounting head.
- the actuator block mounting head 32 has suction holes 36 formed therein for connecting the suction ports on the upper surface and the lower surface.
- the actuator block mounting head 32 holds the contact surface 20 of the actuator block 21 adsorbed by air from the suction port.
- the actuator block mounting head 32 holding the actuator block 21 performs an operation of pressing the actuator block 21 against the substrate 22 so as to crush the adhesive 25 as shown in FIG. To do. Thereafter, as shown in FIG. 3C, the actuator block 21 is lifted to a predetermined height. Thereby, the actuator block 21 can always be kept at the same height with reference to the back surface 22 a of the substrate 22, and the actuator block 21 and the imaging block can be reliably connected via the adhesive 25.
- the adhesive is cured with a UV irradiator, a spot heater, or the like.
- a UV fiber fixing member 39 may be attached to both the left and right sides of the head 32, and the UV fiber 37 may be integrated with the actuator block mounting head 32. Further, a structure in which a spot heater is mounted instead of the UV fiber 37 may be used.
- the cover 41 may be attached to the actuator block mounting head 32. Further, as shown in FIG. 5, the cover 41 may be attached to the UV fiber fixing member 39. The cover 41 extends along the irradiation direction from the side of the UV fiber 37 to the protruding adhesive 25a. Thereby, the ultraviolet ray 42 irradiated from the UV fiber 37 attached to the actuator block mounting head 32 is applied by the cover 41 to another imaging block arranged next to the ultraviolet curable resin (adhesive) 25. Therefore, it is possible to eliminate the inconvenience of curing the ultraviolet curable resin (adhesive) 25 applied to another imaging block. Further, since the cover 41 always operates integrally with the actuator block mounting head 32, the cover 41 can be reliably covered in a space-saving manner in the apparatus.
- the cover 41 is attached to the UV fiber fixing member 39 here, the cover 41 is not limited to the cover 41 as long as it is a member that prevents diffusion outside the irradiation region of the ultraviolet ray 34. The same applies when using a spot heater or the like.
- FIGS. 6A and 6B are diagrams illustrating an example of a method for manufacturing a camera module according to the second embodiment.
- the camera module 100A according to the second embodiment is different from the camera module 100 according to the first embodiment in that the substrate 22 is changed to the substrate 22A and the stage 24 is changed to the stage 24A.
- the description is not repeated here.
- the imaging block is configured by mounting the imaging element 23 on the substrate 22A.
- the image pickup device 23 is mounted on the substrate 22A in a state where the surface opposite to the image pickup surface of the image pickup device 23 is opposed to the back surface 22a.
- the mounting is performed by flip-chip bonding between the terminal portion 23a of the image sensor 23 and the substrate 22A.
- the substrate 22A of the second embodiment is different from the substrate 22 of the first embodiment in that three through holes 22d are provided, and the stage 24A of the second embodiment is replaced with a pedestal portion 27 of the stage 24 of the first embodiment.
- the difference is that three pins 24a are provided.
- the imaging block is configured such that the pin 24a fits into the through hole 22d in a state where the back surface 22a opposite to the mounting surface 22c of the substrate 22A is opposed to the stage 24A (the protruding portion 22b faces the actuator block 21).
- the three pins 24a support the image sensor 23 from below. Thereby, it can be set as the structure which hold
- the actuator block 21 is fixed to the imaging block by applying an adhesive 25 to the front end surface of the protruding portion 22 b of the substrate 22. Even in this case, as shown in FIG. 6C, the actuator block 21 and the imaging block are affected by the warpage of the substrate 22A (the unevenness of the height of the protruding portion 22b). It is fixed via the adhesive 25 etc. in a state where it floats from the front end surface of the protruding portion 22b.
- the pin 24a can be substituted for the pedestal 27 of the stage 24 of the first embodiment.
- the three pins 24 a are arranged on the stage 24 so as to stably support the image sensor 23.
- the actuator block 21 is arranged in the imaging block in a state parallel to the flat surface 27 a of the pedestal portion 27 using the actuator block mounting head 32, but the central axis 26 of the optical lens 28 is In order to be perpendicular to the imaging surface of the imaging element 23, the contact surface 20 with the actuator block mounting head 32 in the actuator block 21 is accommodated so as to be perpendicular to the central axis 26 of the optical lens 28. More preferred.
- the configuration of the actuator block 21 for realizing such a configuration will be described in detail below.
- FIG. 7 is a diagram showing a detailed configuration of the actuator block.
- the optical unit 52 of the camera module 100 includes one or more optical lenses 28 and a lens barrel 51 that supports the optical lenses 28.
- a lens driving device 54 is provided around the optical unit 52.
- the lens driving device 54 includes a lens holder 53.
- the lens driving device 54 corresponds to the actuator block 21, and the lens holder 53 corresponds to the lens fixing member 29.
- the lens holder 53 the lens barrel 51 of the optical unit 52 is bonded and fixed with an adhesive 55 inside, and the lens barrel 51 is held. Before being fixed with the adhesive 55, the lens barrel 51 (or the optical unit 52) can slide in the optical axis direction with respect to the lens holder 53. That is, the outer surface of the lens barrel 51 and the inner surface of the lens holder 53 have a fitting structure (gap fitting) instead of a screw structure.
- the lens driving device 54 includes a lens holder 53, an intermediate support 57, and a fixing portion.
- the fixing part includes a module cover 61 (metal cover), an OIS (Optical Image Stabilizer) coil 62, a base 63, and the like.
- the lens holder 53 to which the optical unit 52 is fixed by an adhesive 55 is movably supported in the optical axis direction with respect to the intermediate support 57 by two upper and lower AF (autofocus) springs 56a and 56b.
- An AF coil 58 is fixed to the outer periphery of the lens holder 53.
- a projection 53a is formed at the lower part of the lens holder 53.
- the projection 53a is a mechanical end of the focal point on the infinity side in the movable range in the optical axis direction (reference position on the image sensor side of the movable range). In contact with the intermediate support 57.
- a permanent magnet for AF driving and a permanent magnet for camera shake correction are fixed to the intermediate support 57.
- a dual-purpose permanent magnet 59 that shares these two types of permanent magnets is fixed to the intermediate support 57.
- the intermediate support 57 is supported by four suspension wires 60 (two shown in the figure) so as to be movable in two axial directions perpendicular to the optical axis with respect to the fixed portion (here, with respect to the base 63).
- the intermediate support 57, the permanent magnet 59, the AF springs 56a and 56b, the lens holder 53, the AF coil 58, the lens barrel 51, and the optical lens 28 are integrally driven in a direction perpendicular to the optical axis.
- the gap between the lens barrel 51 and the opening 63a of the base 63 it is necessary to set the gap between the lens barrel 51 and the opening 63a of the base 63 to an appropriate value.
- the reason for this is that when the lens holder 53 is displaced in the lateral direction due to a drop impact or the like, the lens barrel 51 and the base 63 collide with the displacement of the lens holder 53 in the lateral direction, resulting in a large impact force. This is because there is a possibility that the lens barrel 51 may be damaged or the optical lens 28 in the lens barrel 51 may fall off. Therefore, in the present embodiment, even when the lens holder 53 is displaced maximum in the lateral direction, the gap between the lens barrel 51 and the opening 63a of the base 63 is prevented so that the lens barrel 51 does not directly contact the base 63.
- the size of is set.
- the module cover 61 is fixed to the base 63 and is disposed so as to cover the side surface and the upper surface of the intermediate support 57.
- An OIS coil 62 is fixed to the inner side surface of the module cover 61.
- the resin reference member 64 is fixed to the top surface inside the module cover 61.
- the resin reference member 64 includes a portion 64a (second portion) serving as a stopper for the lens holder 53, a portion 64b (second portion) serving as a stopper for the intermediate support 57, and a protruding portion 64c (first portion). .
- the portion 64a serving as a stopper regulates the movable range when the lens holder 53 is driven in the optical axis direction for the autofocus function.
- the portion 64b serving as a stopper regulates a range in which the intermediate support member 57 serving as a movable portion for the camera shake correction function can move in the optical axis direction that is not the original driving direction.
- a portion 64 a and a portion 64 b that serve as stoppers for the resin reference member 64 are disposed inside the module cover 61.
- the protruding portion 64 c passes through a hole provided on the top surface side of the module cover 61 and protrudes to the top surface side from the module cover 61. That is, in the lens driving device 54, the protruding portion 64c of the resin reference member 64 protrudes most toward the top surface.
- the protruding portion 64 c protrudes to the top surface side from the other portions of the resin reference member 64 and is exposed from the module cover 61.
- at least three protrusions 64c are provided in the lens driving device 54.
- the protrusions 64c form a reference surface, and if there are three protrusions 64c, the reference surface is defined. For example, four or more protrusions 64c that define the reference surface may be provided.
- the flatness of the reference surface defined by the plurality of protrusions 64c is preferably 20 ⁇ m or less, and more preferably 10 ⁇ m or less.
- the protruding portion 64c of the resin reference member 64 protrudes to the top surface side from the module cover 61, but is not limited thereto.
- the height of the protrusion 64 c from the inner surface of the module cover 61 may be about half the thickness of the module cover 61.
- a plurality of projecting portions corresponding to the projecting portions 64c are provided in the height positioning jig 71 described later.
- FIG. 8 is a diagram showing the manufacturing process of the actuator block. As shown in FIG. 8, the optical unit 52 and the lens driving device 54 are individually assembled and a height positioning jig 71 is prepared separately.
- the process is started in a state where the lens drive device 54 and the optical unit 52 are turned upside down. That is, in the present embodiment, the top surface side (subject side) of the lens driving device 54 is placed on the height positioning jig 71.
- the height positioning jig 71 is provided with a flat surface 71a and a protruding portion 71b protruding from the flat surface 71a.
- the lens driving device 54 is placed so that the plurality of protrusions 64c of the resin reference member 64 are in contact with the flat surface 71a.
- the lens barrel 51 of the optical unit 52 is placed on the protruding portion 71b.
- the difference in height between the protrusion 71 b and the flat surface 71 a defines the height position between the lens driving device 54 and the optical unit 52.
- the lens driving device 54 is mounted on the flat surface 71 a of the height positioning jig 71, and as a result, the protrusion 71 b is on the top surface side of the lens driving device 54 and inside the opening 61 a of the module cover 61. I'm stuck in.
- the lens driving device 54 is mounted on the flat surface 71a of the height positioning jig 71, a pressing force is applied to the lens driving device 54 in the direction indicated by the hatching arrow A in the drawing. It is desirable to keep it. This is because, as described above, since it is necessary to determine the position of the lens barrel 51 with high accuracy with respect to the top surface of the lens driving device 54, the lens driving device 54 floats with respect to the height positioning jig 71 ( This is to prevent separation.
- the plurality of protrusions 64 c (the subject-side reference surface) of the lens driving device 54 abut on the flat surface 71 a (first reference surface) of the height positioning jig 71.
- the lens barrel 51 (optical unit 52) is mounted on the lens driving device 54 so that the lens barrel 51 abuts on the protruding portion 71b of the height positioning jig 71
- the top surface side of the lens barrel 51 is placed on the height positioning jig 71.
- the optical unit 52 is slid and inserted into the lens holder 53 of the lens driving device 54.
- a pressing force is applied in the direction indicated by the hatching arrow B in the drawing so that the upper end surface (surface on the subject side) of the lens barrel 51 is in contact with the protruding portion 71b (second reference surface) of the height positioning jig 71. It is desirable to keep it. Note that it is desirable to continuously apply the pressing force to the lens driving device 54 described with reference to the hatched arrow A in FIG. This is because both the lens driving device 54 and the optical unit 52 set the reference position by mechanical contact (mechanism contact) between members, so that an error occurs if there is a float.
- the lens barrel 51 is bonded and fixed to the lens holder 53 by the adhesive 55 in a state where the pressing force is applied in this way (at a position where the lens barrel 51 abuts on the protruding portion 71 b). At this time, the protrusion 53 a of the lens holder 53 is in contact with the intermediate support 57.
- the adhesive 55 is applied to the boundary portion between the lens holder 53 and the lens barrel 51 on the bottom surface side (upper side in the figure), but the present invention is not limited to this.
- An adhesive may be injected into the gap between the lens barrel 51 and the lens holder 53 in advance, and the adhesive may be cured after positioning.
- the adhesive used here is preferably a UV curable adhesive, a thermosetting adhesive, or a UV + thermosetting adhesive. When it is difficult to heat cure the whole assembly apparatus in a furnace, UV + thermosetting adhesive is used and UV curing is performed in the assembly apparatus. It is good to put in a furnace in a state where it is placed on the surface or removed from the height positioning jig 71 and heat cure.
- the adhesive on the bottom surface side is cured and temporarily fixed, and then the adhesive is replenished from the top surface to the concave portion 51a of the lens barrel 51. It doesn't matter.
- the lens barrel 53 is brought into contact with the intermediate support 57 and the lens barrel 51 is inserted into the lens holder 53.
- the lens barrel 51 does not follow the accuracy of the hole of the lens holder 53, but the accuracy according to the protrusion 71 b of the height positioning jig 71. It is attached with. That is, the lens barrel 51 is fixed to the lens holder 53 with reference to a plane (a top surface side plane) defined by the plurality of protrusions 64 c of the resin reference member 64.
- the tilt (tilt) of the lens barrel 51 is not influenced by the tilt of the lens holder 53, and is fixed with respect to the top surface of the lens driving device 54.
- the above process is a lens combine process.
- the height positioning jig 71 is removed from the lens driving device 54.
- the height positioning jig 71 is merely a jig for positioning the optical unit 52 with respect to the lens driving device 54 and is not required after the lens barrel 51 is bonded and fixed to the lens holder 53.
- the lens driving device 54 to which the optical unit 52 is attached is chucked (temporarily fixed) by the mounting device 72.
- the plurality of protrusions 64 c of the resin reference member 64 abut on the flat surface 72 a of the mounting device 72 (reference surface of the mounting device).
- a plane defined by the plurality of protrusions 64 c of the resin reference member 64 is a reference surface of the lens driving device 54.
- the mounting device 72 may suck and chuck the lens driving device 54 by air suction, or may chuck the lens driving device 54 with the arm portion 72b of the mounting device 72 interposed therebetween.
- a spring mechanism (not shown) may be provided in the arm portion 72b so that the arm portion 72b sandwiches the lens driving device 54.
- the lens barrel 51 is attached by a height positioning jig 71 so that the tilt is minimized with respect to the top surface of the lens driving device 54, and the reference surface (a plurality of protrusions) on the top surface side of the lens driving device 54 is mounted.
- the flat surface formed by the portion 21 c is in contact with the flat surface 72 a of the mounting device 72. Therefore, the tilt of the lens barrel 51 with respect to the flat surface 72a of the mounting device 72 is also set to a minimum.
- the mounting device 72 arranges the lens driving device 54 on the mounting surface 22a (rear surface) of the imaging block via an adhesive while the lens driving device 54 incorporating the optical unit 52 is chucked.
- the lens driving device 54 is adhered and fixed in a state where it is chucked on the mounting device 72.
- the lens driving device 54 remains chucked on the mounting device 72 until the adhesive is cured, and the inclination (angle) and position (height position) of the lens driving device 54 are set to the inclination (angle) of the mounting device 72. ) And position (height position).
- the lens driving device 54 and the imaging block are bonded and fixed in a state where the tilt of the mounting surface 22a of the imaging block with respect to the flat surface 72a of the mounting device 72 is minimized, the optical lens 28 with respect to the imaging device 23 is fixed. It is possible to minimize the tilt of the optical axis.
- the imaging block is placed on the pedestal 27 and the mounting device 72 applies a pressing force in the direction of the hatching arrow D so as to press the lens driving device 54 toward the imaging block.
- the angle adjustment of the mounting device 72 when the lens driving device 54 is arranged in the imaging block is performed in advance with respect to the imaging blocks having typical dimensions. Also good. Alternatively, if it is necessary to absorb dimensional variations of parts (imaging blocks), the angle of the mounting device 72 may be adjusted for each imaging block to be assembled.
- the camera module manufacturing apparatus moves the optical lens 28, a fixing member (lens fixing member 29) that holds and holds the optical lens 28, and the fixing member (lens fixing member 29).
- the camera module 100 including an imaging block configured by mounting on the substrate 22 an imaging device 23 that captures an image formed by the light of the image, the imaging device 23 is directly supported horizontally from the side opposite to the imaging surface.
- the support portion (pedestal portion 27) and the central axis 26 of the optical lens 28 are supported by the support portion (pedestal portion 27).
- a mounting portion (actuator block) that horizontally mounts and fixes the actuator (actuator block 21) on the substrate 22 so as to be perpendicular to the imaging surface of the image sensor 23 Mounting head 32).
- the support portion (the pedestal portion 27) supports from the side opposite to the imaging surface of the image sensor 23, so that the image sensor 23 is affected by the warp of the substrate 22. There is no. Further, since the actuator (actuator block 21) is fixed to the substrate 22 in a non-contact state, the optical lens 28 can be fixed perpendicularly to the imaging surface of the image sensor 23 without being affected by the warp of the substrate 22. . Further, the substrate 22 can be used without narrowing the selection range of the material (ceramic, resin).
- the mounting portion causes the actuator (actuator block 21) to adsorb onto the upper surface of the actuator (actuator block 21) by air adsorption.
- the substrate 22 is held horizontally with at least part of it floating.
- the release of holding is easier than the method of holding with an adhesive member, and it is easier to hold horizontally and stably than the method of holding it from both sides.
- the mounting portion (actuator block mounting head 32) is attached with an irradiation fiber (UV fiber 37) that irradiates ultraviolet rays 42 toward the adhesive 25. Yes.
- the mounting portion (actuator block mounting head 32) is attached with a heater that blows hot air toward the adhesive 25.
- the apparatus can be made compact by an integrated structure.
- the mounting portion prevents diffusion of the ultraviolet rays 42 radiated to the adhesive 25 to the outside of the camera module 100.
- Part (cover 41) the mounting portion prevents diffusion of the ultraviolet rays 42 radiated to the adhesive 25 to the outside of the camera module 100.
- the mounting portion (actuator block mounting head 32) is configured to prevent the diffusion of the hot air applied to the adhesive 25 from the camera module 100 to the outside.
- a cover 41 A cover 41
- the actuator includes a metal cover and a resin reference member on a subject side, and at least a first portion of the resin reference member is the other part of the resin reference member.
- the optical lens 28 is positioned relative to the actuator (actuator block 21) with the first portion of the resin reference member as a reference, protruding from the portion toward the subject side and exposed from the metal cover. ing.
- the optical lens 28 is positioned with reference to the first portion of the resin reference member protruding toward the subject side. Therefore, the assembly standard of the optical lens 28 and the assembly standard when the actuator (actuator block 21) is mounted on the imaging block can be matched.
- the optical lens 28, a fixing member (lens fixing member 29) that houses and holds the optical lens 28, and the fixing member (lens fixing member 29) are moved.
- An actuator (actuator block 21) that drives the optical lens 28 to be displaced in the optical axis direction and an image sensor 23 that captures an image formed by the light from the optical lens 28 are mounted on the substrate 22.
- a manufacturing method of manufacturing the camera module 100 including an imaging block, a supporting step of directly supporting the imaging element 23 horizontally from the side opposite to the imaging surface, and the actuator (actuator block 21) as an adhesive 25.
- the actuator (actuator block 21) is horizontally mounted with at least a part floating on the substrate 22 so that 6 is perpendicular to the imaging surface of the imaging device 23 supported in the supporting step. , Fix.
- the mounting step causes the actuator (actuator block 21) to be horizontal with respect to the substrate 22 by air-adsorbing the upper surface of the actuator (actuator block 21).
- a holding step of holding is included.
- holding and releasing can be performed more easily than a method of holding with an adhesive member or a method of holding an actuator with magnetism and holding it with a magnet.
- the mounting step includes a fixing step of fixing the actuator (actuator block 21) to the substrate 22 in a non-contact state.
- the actuator (actuator block 21) is fixed to the substrate 22 in a non-contact state, so that the optical lens 28 is fixed perpendicularly to the imaging surface of the image sensor 23 without being affected by the warp of the substrate 22. can do.
- the adhesive 25 is preferably an ultraviolet curable adhesive or a thermosetting adhesive.
- the bonding is performed between the actuator (actuator block 21) and the substrate 22. It is applied to such an extent that the agent 25 protrudes.
- the optical lens is slidable with respect to the fixing member before being fixed to the fixing member, and the reference surface on the subject side of the actuator is set to be high.
- An optical unit fixing step for fixing the optical lens to the fixing member, and in the mounting step, the actuator is mounted on the imaging block via an adhesive after removing the height positioning jig. To do.
- the optical lens 28 is positioned and fixed with respect to the actuator with reference to the reference surface on the subject side of the actuator (actuator block 21). Thereby, the assembly standard of the optical lens 28 and the assembly standard when the actuator (actuator block 21) is mounted on the imaging block can be matched.
- the present invention relates to a manufacturing method and a manufacturing apparatus for a camera module incorporated in a portable device such as a portable information terminal and a mobile phone, and more specifically, a lens fixing member including an optical lens and an actuator for moving the lens fixing member.
- the present invention relates to a method and an apparatus for manufacturing a camera module in which a block and an image sensor are adjusted in parallel and fixed.
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Abstract
Description
図13の(a)~(c)は、従来技術のカメラモジュールの一例を示す図である。図13の(a)において、光学レンズ11を含むレンズ固定部材5を可動させるアクチュエータブロック1は、撮像素子3を基板2に実装して構成する撮像ブロックと接着剤6等を介して結合される。この時、撮像素子3と光学レンズ11の中心軸7とは、90°をなすと理想的な解像力を示す事になる。
図1の(a)~(d)は、実施形態1におけるカメラモジュールの製造方法の一例を示す概略図である。図1の(a)~(d)に示されるように、カメラモジュール100は、光学レンズ28を収容するレンズ固定部材29を可動させて、光学レンズ28を光軸方向に変位駆動させるアクチュエータブロック21と、撮像素子23を基板22に実装して構成する撮像ブロックとを含む。アクチュエータブロック21は、ステージ24において、撮像ブロックと接着剤25を介して結合される。
図6の(a),(b)は、実施形態2におけるカメラモジュールの製造方法の一例を示す図である。実施形態2のカメラモジュール100Aが実施形態1のカメラモジュール100と異なる点は、基板22が基板22Aに変更された点、ステージ24がステージ24Aに変更された点である。それら以外は、実施形態1と同様であるので、ここでは説明を繰り返さない。
実施形態1,2において、アクチュエータブロック搭載用ヘッド32を用いて、アクチュエータブロック21を台座部27の平坦面27aに対して平行な状態で撮像ブロックに配置したが、光学レンズ28の中心軸26を撮像素子23の撮像面に対して垂直とするには、アクチュエータブロック21内のアクチュエータブロック搭載用ヘッド32との接触面20が光学レンズ28の中心軸26と垂直となるように収容されることがより好ましい。そのような構成を実現するためのアクチュエータブロック21の構成について、以下詳細に説明する。
本発明の態様1に係るカメラモジュール製造装置は、光学レンズ28と、前記光学レンズ28を収容し、保持する固定部材(レンズ固定部材29)と、前記固定部材(レンズ固定部材29)を可動させて、前記光学レンズ28を光軸方向に変位駆動させるアクチュエータ(アクチュエータブロック21)と、前記アクチュエータ(アクチュエータブロック21)が接着剤25を介して搭載される撮像ブロックであって、前記光学レンズ28からの光が結像する像を撮像する撮像素子23を基板22に実装して構成される撮像ブロックとを備えるカメラモジュール100について、前記撮像素子23を、撮像面と反対側から水平に直接支持する支持部(台座部27)と、前記光学レンズ28の中心軸26が、前記支持部(台座部27)により支持された撮像素子23の撮像面に対して垂直となるように、前記アクチュエータ(アクチュエータブロック21)を前記基板22に少なくとも一部が浮いている状態で水平に搭載し、固定する搭載部(アクチュエータブロック搭載用ヘッド32)とを備える。
22,22A 基板
22d 貫通穴
23 撮像素子
24,24A ステージ
24a ピン
25 接着剤
25a はみ出た接着剤
26 中心軸
27 台座部
27a 平坦面
28 光学レンズ
29 レンズ固定部材(固定部材)
32 アクチュエータブロック搭載用ヘッド(搭載部)
33 UV照射器
34 紫外線
37 UVファイバー
39 UVファイバー固定用部材
41 カバー
42 紫外線
64 樹脂基準部材
71 高さ位置決め治具
100,100A カメラモジュール
Claims (6)
- 光学レンズと、
前記光学レンズを収容し、保持する固定部材と、
前記固定部材を可動させて、前記光学レンズを光軸方向に変位駆動させるアクチュエータと、
前記アクチュエータが接着剤を介して搭載される撮像ブロックであって、前記光学レンズからの光が結像する像を撮像する撮像素子を基板に実装して構成される撮像ブロックと、を備えるカメラモジュールについて、
前記撮像素子を、撮像面と反対側から水平に直接支持する支持部と、
前記光学レンズの中心軸が、前記支持部により支持された撮像素子の撮像面に対して垂直となるように、前記アクチュエータを前記基板に少なくとも一部が浮いている状態で水平に搭載し、固定する搭載部とを備える、カメラモジュール製造装置。 - 前記アクチュエータは、その被写体側に金属製カバーと樹脂基準部材とを備え、
前記樹脂基準部材の少なくとも第1部分は、該樹脂基準部材の他の部分より被写体側に突出しており、かつ、前記金属製カバーから露出しており、
前記樹脂基準部材の前記第1部分を基準として、前記アクチュエータに対する前記光学レンズの位置決めがされている、請求項1に記載のカメラモジュール製造装置。 - 光学レンズと、前記光学レンズを収容し、保持する固定部材と、前記固定部材を可動させて、前記光学レンズを光軸方向に変位駆動させるアクチュエータと、前記光学レンズからの光が結像する像を撮像する撮像素子を基板に実装して構成される撮像ブロックと、を備えるカメラモジュールを製造する製造方法であって、
前記撮像素子を、撮像面と反対側から水平に直接支持する支持工程と、
前記アクチュエータを接着剤を介して撮像ブロックに搭載する搭載工程と、を含み、
前記搭載工程において、前記光学レンズの中心軸が、前記支持工程において支持された撮像素子の撮像面に対して垂直となるように、前記アクチュエータを前記基板に少なくとも一部が浮いている状態で水平に搭載し、固定する、カメラモジュール製造方法。 - 前記搭載工程は、前記アクチュエータを前記基板に非接触状態で固定する固定工程を含む、請求項3に記載のカメラモジュール製造方法。
- 前記搭載工程において、前記アクチュエータを前記基板に搭載する際、前記アクチュエータと前記基板の間から前記接着剤がはみ出す程度に塗布される、請求項3または4に記載のカメラモジュール製造方法。
- 前記光学レンズは、前記固定部材に固定される前は前記固定部材に対して摺動可能であり、
前記アクチュエータの被写体側の基準面を、高さ位置決め治具の第1基準面に当接させる配置工程と、
前記光学レンズを前記固定部材内で摺動させ、前記光学レンズが前記高さ位置決め治具の第2基準面に当接する位置にて、前記光学レンズを前記固定部材に固定する光学部固定工程と、を含み、
前記搭載工程において、前記高さ位置決め治具を取り外したうえで、前記アクチュエータを接着剤を介して撮像ブロックに搭載する、請求項3~5のいずれか1項に記載のカメラモジュール製造方法。
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US15/518,308 US20170307842A1 (en) | 2014-10-16 | 2015-09-07 | Camera module manufacturing method and camera module manufacturing apparatus |
CN201580056278.3A CN107076958B (zh) | 2014-10-16 | 2015-09-07 | 相机模块的制造方法和制造装置 |
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CN106793930B (zh) * | 2015-06-16 | 2018-08-07 | 奥林巴斯株式会社 | 摄像模块、内窥镜系统以及摄像模块的制造方法 |
JP6938649B2 (ja) * | 2017-08-29 | 2021-09-22 | 京セラ株式会社 | 撮像装置、移動体、および製造方法 |
EP3840353A4 (en) * | 2018-08-21 | 2021-09-15 | Ningbo Sunny Opotech Co., Ltd. | CAMERA MODULE, PHOTOSENSITIVE MOLDING ASSEMBLY AND ITS MANUFACTURING PROCESS, AND ELECTRONIC DEVICE |
US12237096B2 (en) * | 2019-05-01 | 2025-02-25 | Dexerials Corporation | Connection structure, method of manufacturing connection structure, connection material, and coated conductive particle |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004335794A (ja) * | 2003-05-08 | 2004-11-25 | Fuji Photo Film Co Ltd | 固体撮像素子及びカメラモジュール及びカメラモジュールの製造方法 |
JP2005086659A (ja) * | 2003-09-10 | 2005-03-31 | Sony Corp | カメラモジュール生産方法およびその方法を用いた組立装置 |
JP2006308987A (ja) * | 2005-04-28 | 2006-11-09 | Nidec Copal Corp | カメラモジュールの調整装置及び調整方法 |
JP2012027063A (ja) * | 2010-07-20 | 2012-02-09 | Konica Minolta Opto Inc | カメラモジュールの製造方法及びカメラモジュールのレンズユニット |
JP2012256040A (ja) * | 2011-02-10 | 2012-12-27 | Sharp Corp | カメラモジュールの製造方法、カメラモジュール、及び電子機器 |
WO2013190918A1 (ja) * | 2012-06-18 | 2013-12-27 | シャープ株式会社 | カメラモジュール、および当該カメラモジュールを搭載した電子機器、ならびに当該カメラモジュールの製造方法 |
JP2014093632A (ja) * | 2012-11-02 | 2014-05-19 | Konica Minolta Inc | カメラモジュールの製造方法、カメラモジュール及び携帯端末 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6654187B2 (en) * | 2001-07-16 | 2003-11-25 | Alex Ning | Camera lens carrier for circuit board mounting |
WO2006080443A1 (ja) * | 2005-01-31 | 2006-08-03 | Konica Minolta Opto, Inc. | 撮像装置及び電子機器 |
JP5460406B2 (ja) * | 2010-03-24 | 2014-04-02 | 富士フイルム株式会社 | 撮像素子の位置調整方法、カメラモジュール製造方法及び装置、カメラモジュール |
JP5037719B1 (ja) * | 2011-02-10 | 2012-10-03 | シャープ株式会社 | カメラモジュールの製造方法、カメラモジュール、及び電子機器 |
JP5372986B2 (ja) * | 2011-03-11 | 2013-12-18 | シャープ株式会社 | カメラモジュールおよびその製造方法 |
-
2015
- 2015-09-07 WO PCT/JP2015/075371 patent/WO2016059914A1/ja active Application Filing
- 2015-09-07 US US15/518,308 patent/US20170307842A1/en not_active Abandoned
- 2015-09-07 CN CN201580056278.3A patent/CN107076958B/zh not_active Expired - Fee Related
- 2015-09-07 JP JP2016554014A patent/JP6316979B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004335794A (ja) * | 2003-05-08 | 2004-11-25 | Fuji Photo Film Co Ltd | 固体撮像素子及びカメラモジュール及びカメラモジュールの製造方法 |
JP2005086659A (ja) * | 2003-09-10 | 2005-03-31 | Sony Corp | カメラモジュール生産方法およびその方法を用いた組立装置 |
JP2006308987A (ja) * | 2005-04-28 | 2006-11-09 | Nidec Copal Corp | カメラモジュールの調整装置及び調整方法 |
JP2012027063A (ja) * | 2010-07-20 | 2012-02-09 | Konica Minolta Opto Inc | カメラモジュールの製造方法及びカメラモジュールのレンズユニット |
JP2012256040A (ja) * | 2011-02-10 | 2012-12-27 | Sharp Corp | カメラモジュールの製造方法、カメラモジュール、及び電子機器 |
WO2013190918A1 (ja) * | 2012-06-18 | 2013-12-27 | シャープ株式会社 | カメラモジュール、および当該カメラモジュールを搭載した電子機器、ならびに当該カメラモジュールの製造方法 |
JP2014093632A (ja) * | 2012-11-02 | 2014-05-19 | Konica Minolta Inc | カメラモジュールの製造方法、カメラモジュール及び携帯端末 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2020240968A1 (ja) * | 2019-05-24 | 2021-11-11 | 三菱電機株式会社 | カメラモジュールの製造方法及び製造装置、並びに光学モジュールの製造方法 |
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