WO2016025280A1

WO2016025280A1 - Wearable band assembly including connection device

Info

Publication number: WO2016025280A1
Application number: PCT/US2015/043934
Authority: WO
Inventors: Yoji Hamada; Edward Siahaan; Hsiang Hung Chen; Naoto Matsuyuki; Ying-liang SU
Original assignee: Apple Inc.
Priority date: 2014-08-11
Filing date: 2015-08-06
Publication date: 2016-02-18

Abstract

A wearable band assembly (100) including a band clasp, and methods of forming the wearable band assembly (100) including the band clasp. The wearable band assembly (100) may include a woven material (102) including an interfused portion of threads positioned at an end (106). The interfused portion of threads may form an aperture through a width of the woven material (102). The wearable band assembly (100) may also include a pin positioned through the aperture of the interfused portion of threads, and a connection device (104) coupled to the pin. The connection device (104) may be positioned directly adjacent the interfused portion of threads of the woven material (102). The connection device (104) may substantially cover the interfused portion of threads, such that the interfused portion of threads of the woven material (102) may not be visible or exposed.

Description

WEARABLE BAND ASSEMBLY INCLUDING CONNECTION DEVICE

Cross-Reference to Related Application

[0001] This Patent Cooperation Treaty patent application claims priority to U.S. Provisional Patent Application No. 62/036,027, filed on August 11 , 2014, and entitled "Wearable Band Assembly Including Connection Device," and U.S. Non-provisional Patent Application No. 14/693,828, filed on April 22, 2015, and entitled "Wearable Band Assembly Including Connection Device," the disclosures of which are hereby incorporated herein in their entireties.

Technical Field [0002] The disclosure relates generally to a wearable band assembly formed from a woven material, and more particularly, to a wearable band assembly including a connection device, and methods of forming the wearable band assembly including the connection device.

Background

[0003] Conventional woven material or fabric is used in a plurality of applications or industries. For example, woven material is used in clothing/apparel (e.g., shirts, pants, skirts, etc.), in fashion accessories (e.g., bracelets, watch bands, necklaces, etc.), in electronics (e.g., woven conductive layers, protective outer sheaths for optical fiber cables), and other various industrial applications (e.g., rope, tape, protective gear,

household/kitchenware, and so on). Due to the many uses and applications, conventional woven material is manufactured using specific material and/or manufactured to include specific physical properties. For example, where the woven material is used to form a bracelet or necklace, it may be desired that the woven material be flexible to contour around the surface in which the woven material is worn (e.g., wrist, neck), and be durable, flexible and/or capable of withstanding typical wear/treatment of a bracelet or necklace. [0004] Conventional bracelets or necklaces formed from woven material include clasps positioned at an end to couple the bracelet or necklace to the user. These clasps are typically coupled to a pre-fabricated end of the woven material forming the bracelet or necklace. More specifically, conventional clasps included in bracelets or necklaces may be coupled to an end of the woven material by stitching or weaving auxiliary threads through an end of the woven material and around a portion of the clasp. The auxiliary threads may not be included in the threads used to form the woven material, but may instead be woven through the woven material to couple the clasp to the end of the bracelet or necklace. [0005] The use of these auxiliary threads to couple the clasp to the bracelet or necklace formed from conventional woven material typically presents cosmetic and structural issues. For example, as a result of the auxiliary threads being woven into the woven material after fabrication (e.g., completion) of the woven material, the auxiliary threads may not be formed integrally with the woven material. As such, the auxiliary threads may be unwoven from woven material, and may show through or be exposed around the clasp, causing unwanted cosmetic defects (e.g., frayed edge, loss threads). Additionally, where the auxiliary threads become unwoven from the woven material, the clasp may also become unattached to the bracelet or necklace. Finally, by only coupling the clasp to woven material using the auxiliary threads, the clasp or buckle may be uncoupled or pulled from the bracelet or necklace. That is, the strength of the auxiliary threads may directly affect the clasp's ability to remain coupled to the woven material when a force is applied to the clasp.

Summary

[0006] Generally, embodiments discussed herein are related to a wearable band assembly including a connection device, and methods of forming the wearable band assembly including the connection device. The wearable band may be formed from a woven material including a four layer construction, where the woven material may be cut to form a pin aperture for receiving a pin of the connection device at an end, and may be subsequently melted to form an interfused portion around the pin aperture and/or the pin. By cutting the woven material to form an end including a pin aperture and subsequently melting the threads formed at the end, the interfused threads at the end of the woven material forming the wearable band may increase the strength of the wearable band, while preventing and/or eliminating the risk of the threads being unwoven from the woven material and/or exposed or visible to a user. The woven material may not be melted, however, and may only be cut. When the threads are not melted, additional high tensile fibers may be woven through the cut end including the pin aperture, to substantially strengthen the edge of the wearable band including the connection device.

[0007] One embodiment may include a wearable band assembly including a woven material including an interfused portion of threads positioned at an end. The interfused portion of threads may form an aperture through a width of the woven material. The wearable band assembly may also include a pin positioned through the aperture of the interfused portion of threads, and a connection device coupled to the pin. The connection device may be positioned directly adjacent the interfused portion of threads of the woven material.

[0008] Another embodiment may include a method of forming a wearable band assembly. The method may include forming a pin aperture through a width of a woven material, cutting the woven material adjacent the pin aperture to form an end of the woven material, and melting the end of the woven material to interfuse a portion of threads of the woven material adjacent the pin aperture.

[0009] An additional embodiment may include a wearable band assembly including a woven material having a first end. The first end may include a pin aperture formed through a width of the woven material. The wearable band assembly may also include a pin positioned through the aperture of the interfused portion of threads, and a connection device coupled to the pin. The connection device may be positioned directly adjacent the interfused portion of threads of the woven material. [0010] A further embodiment may include a method of forming a wearable band assembly. The method may include forming a pin aperture through a width of a woven material, and cutting the woven material adjacent the pin aperture to form an end of the woven material. The end of the woven material may receive and be covered by a connection device.

Brief Description of the Drawings [0011] The disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and in which:

[0012] FIG. 1 depicts an illustrative front view of a wearable band formed from a woven material, according to embodiments. [0013] FIG. 2 depicts an illustrative enlarged front view of a woven material used to form the wearable band of FIG. 1 , according to embodiments.

[0014] FIG. 3 depicts a cross-section view of a first section of the woven material of FIG. 2 taken along line 3-3, according to embodiments.

[0015] FIG. 4 depicts a cross-section view of a second section of the woven material of FIG. 2 taken along line 4-4, according to embodiments.

[0016] FIG. 5 depicts a flow chart of an example process for forming a wearable band assembly formed from a woven material, according to embodiments.

[0017] FIGs.6A-6G depict illustrative enlarged front and side views, respectively, of a woven material undergoing processes of forming wearable band assembly as depicted in FIG. 5. [0018] FIG. 7 depicts a flow chart of an example process for forming a wearable band assembly formed from a woven material, according to additional embodiments.

[0019] FIGs. 8A-8E depict illustrative enlarged front and side views, respectively, of a woven material undergoing processes of forming wearable band assembly as depicted in FIG. 7. [0020] FIG. 9 depicts a flow chart of an example process for forming a hole in a wearable band assembly formed from a woven material, according to embodiments.

[0021] FIGs. 10A-10D depict illustrative enlarged side views of a portion of woven material undergoing processes of forming a hole in a wearable band assembly, as depicted in FIG. 9.

[0022] FIG. 1 1 depicts an illustrative enlarged side view of a portion of woven material including a hole and an eyelet, according to embodiments.

[0023] FIGs. 12A-12D depict illustrative enlarged side views of a portion of woven material undergoing processes of forming a second end of a wearable band assembly, according to embodiments.

[0024] FIGs. 13A and 32B depict illustrative enlarged side views of a portion of woven material undergoing processes of forming a first end including a loop and pin of a wearable band assembly, according to embodiments.

[0025] FIG. 14 depicts a flow chart of an example process for forming a retention loop in a wearable band assembly formed from a woven material, according to embodiments.

[0026] FIG. 15A depicts an illustrative enlarged perspective view of a length of woven material of a wearable band assembly, according to embodiments.

[0027] FIG. 15B depicts an illustrative side view of an embossing system including a length of woven material undergoing processes of embossing, as depicted in FIG. 14.

[0028] FIGs. 15C and 15D depict illustrative enlarged perspective views of a length of woven material of a wearable band assembly undergoing processes of forming a retention loop, as depicted in FIG. 14.

[0029] FIGs. 16A and 16B depict illustrative enlarged perspective views of a length of woven material of a wearable band assembly undergoing embossing processes, as depicted in FIG. 14.

[0030] It is noted that the drawings of the invention are not necessarily to scale. The drawings are intended to depict only typical aspects of the invention, and therefore should not be considered as limiting the scope of the invention. In the drawings, like numbering represents like elements between the drawings.

Detailed Description

[0031] Reference will now be made in detail to representative embodiments illustrated in the accompanying drawings. It should be understood that the following descriptions are not intended to limit the embodiments to one preferred embodiment. To the contrary, it is intended to cover alternatives, modifications, and equivalents as can be included within the spirit and scope of the described embodiments as defined by the appended claims.

[0032] The following disclosure relates generally to a wearable band assembly formed from a woven material, and more particularly, to a wearable band assembly including a connection device, and methods of forming the wearable band assembly including the connection device.

[0033] In one embodiment the wearable band may be formed from a woven material having a four layer construction, and the woven material may be cut to form a pin aperture for receiving a pin of the connection device at an end, and may be subsequently melted to form an interfused portion around the pin aperture and/or the pin. By cutting the woven material to form an end including a pin aperture and subsequently melting the threads formed at the end, the interfused threads at the end of the woven material forming the wearable band may increase the strength of the wearable band, while reducing and/or eliminating the risk of the threads being unwoven from the woven material and/or exposed or visible to a user. The woven material may not be melted however, and may only be cut. When the threads are not melted, additional high tensile fibers may be woven through the cut end including the pin aperture, to substantially strengthen the edge of the wearable band including the connection device. [0034] These and other embodiments are discussed below with reference to FIGs. 1-16B. However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these Figures is for explanatory purposes only and should not be construed as limiting.

[0035] FIG. 1 shows an illustrative front view of a wearable band assembly 100 including woven material 102, according to embodiments. In non-limiting examples, wearable band assembly 100 may include a decorative band (e.g., wristband, armband, headband, necklace, etc.), a watch band, and a wearable band for holding or attaching to an electronic device including, but not limited to: a smartphone, a gaming device, a display, a digital music player, a wearable computing device or display, a health monitoring device or other suitable electronic device. As shown in FIG. 1 , wearable band assembly 100 may form a watch band.

[0036] Wearable band assembly 100 may include connection device 104 positioned at a first end 106 of wearable band assembly 100. Connection device 104 may be formed within wearable band assembly 100 to couple ends 106, 108 and/or secure wearable band assembly 100 to a user. Connection device 104 may be any suitable coupling mechanism or embodiment capable of releasably coupling ends 106, 108 of wearable band assembly 100. In a non-limiting example, as shown in FIG. 1 , connection device 104 may include a buckle 1 10. More specifically, first end 106 of wearable band assembly 100 may include buckle 1 10 having a tongue 1 12 coupled to buckle 1 10. Buckle 1 10 may receive a portion of second end 108 of wearable band assembly 100, and tongue 1 12 may be positioned within one of a plurality of holes 1 18 formed adjacent second end 108 to secure wearable band assembly 100 to a user. The plurality of holes 1 18 formed through wearable band assembly 100 may be formed using a laser cutting process discussed in detail below.

Additionally, and as discussed herein, connection device 104 (e.g., buckle 1 10, tongue 1 12) may be coupled to woven material 102 forming wearable band assembly 100 using a pin (see, e.g., FIGs. 6A and 6C) positioned through a portion of woven material 102.

[0037] Second end 108 may be further secured to wearable band assembly 100 using retention loop 120 positioned substantially around wearable band assembly 100. Retention loop 120 may form an opening (not shown) located between wearable band assembly 100 and retention loop 120, where the opening may receive second end 108 and/or position second end 108 against a portion of wearable band assembly 100. As discussed herein, retention loop 120 may also be made from woven material 102. By making both wearable band assembly 100 and retention loop 120 from woven material 102, the cost and/or time of manufacturing wearable band assembly 100 including retention loop 120 may be

substantially reduced.

[0038] Woven material 102 forming wearable band assembly 100 may be formed from a large piece of woven material 102 that may be substantially cut or shaped to a desired size. In a non-limiting example, woven material 102 may be cut from a larger piece of woven material 102 to form wearable band assembly 100 using a laser cutting process. The laser used in the laser cutting process may substantially cut the woven material 102 to a desired dimension of wearable band assembly 100 from the larger piece of woven material.

Additionally, the laser in the laser cutting process may simultaneously cauterize and/or round the edges of woven material 102 forming wearable band assembly 100 to prevent fraying of woven material 102 . [0039] Additionally, the laser cutting process may also form woven material 102 to include second end 108 that may be secured to the remaining portion of wearable band assembly 100 without altering the cosmetic appearance and/or geometry of woven material 102 and/or wearable band assembly 100. That is, second end 108 may be cut to include a specific geometry during the laser cutting process, such that when coupled or secured to wearable band assembly 100 and/or retention loop 120, second end 108 is cosmetically and/or geometrically similar to the remaining portion of woven material 102.

[0040] FIG. 2 shows an illustrative enlarged front view of a portion of woven material 102 used to form wearable band assembly 100. The portion of woven material 102 shown in FIG. 2 may include woven material 102 prior to the inclusion or attachment of connection device 104, and ultimately the formation of wearable band assembly 100 (see, e.g., FIG. 1 ). That is, the enlarged portion of woven material 102 may include a length of woven material 102 that has not yet undergone processing for forming wearable band assembly 100, as discussed herein with respect to FIGs. 5-6G. [0041 ] As shown in FIG. 2, woven material 102 may include a textured pattern. As discussed herein, woven material 102 may be formed from a plurality of warp threads, at least one weft thread coupled to, woven, and/or interlaced between the plurality of warp threads, and a plurality of connecting yarns. As a result of the formation of woven material 102 using warp threads, weft thread(s) and connecting yarns, woven material 102 may include distinct configurations within different portions of a continuous length of woven material 102. That is, woven material 102 may be woven or manufactured to include a first portion 122, and a second portion 124 positioned adjacent first portion 122, where first portion 122 and second portion 124 may include distinct configurations or weave patterns within woven material 102. As discussed herein, first portion 122 may be utilized to couple connection device 104 to woven material 102 to form wearable band assembly 100 (see, FIG. 1 ).

[0042] FIG. 3 shows a cross-section view of first portion 122 of woven material 102 of FIG. 2 taken along line 3-3. The cross-section view of FIG. 3 may be taken at a crossing of woven material 102 prior to the transition or position change of the warp threads within the woven material 102. That is, and as discussed herein, the plurality of warp threads may be coupled to, or continuously woven with (e.g., above, below) at least one weft thread to form woven material 102. As such, in the cross-section of woven material 102 in FIG. 3, the warp threads are depicted as being in an instantaneous position about the weft thread, prior to and/or subsequent to the warp threads being woven through the weft thread. It is understood that the position of the warp threads in FIG. 3 is not permanent, and/or the warp threads are not fixed in the depicted position.

[0043] It is also understood that the number of threads shown in FIG. 3 to form woven material 102 may be merely exemplary, and may not represent the actual number of warp threads and/or weft threads used to form woven material 102. In a non-limiting example, woven material 102 may be formed from more than 200 warp threads and a single weft thread coupled to, woven or interlaced between the plurality of warp threads. In conjunction, the spacing between the warp threads and/or weft threads as shown in FIG. 3 may also be merely exemplary for the purpose of clearly and completely describing woven material 102. It is understood that the space between the threads of woven material 102 may only be large enough to couple and/or weave at least one weft thread through the plurality of warp threads (e.g., 200 warp threads) to form woven material 102. Additionally, the spacing between the threads of woven material 102 may be substantially minimal such that a user may not be able to see through woven material 102. [0044] As discussed herein, woven material 102 includes a plurality of warp threads 126 (many of which are shown, but only some of which are numbered in order to maintain clarity of the figure) and at least one weft thread 128 coupled to the warp threads 126. More specifically, woven material 102 may include warp threads 126 positioned along the length of wearable band assembly 100, and at least one weft thread 128 positioned perpendicular to, and coupled to, woven or interlaced between the plurality of warp threads 126. It is understood that the plurality of warp threads 126 may run the entire length of woven material 102 forming wearable band assembly 100. Additionally, it is understood that the at least one weft thread 128 may be formed from a single thread that may be continuously woven between warp threads 126, or may be formed from a plurality of threads that may be woven between warp threads 126. In the example of FIG. 3, weft thread 128 is shown as a single spiral thread. Woven material 102, as discussed herein, may be formed using any suitable weaving technique and/or weaving machinery. In a non-limiting example, woven material 102 may be formed using a dobby loom.

[0045] Warp threads 126 and the weft thread 128 may be formed from any suitable material capable of being coupled, woven or interlaced within each other to form woven material 102. In a non-limiting example, warp threads 126 and weft thread 128 of woven material 102 may be formed from or include a polyamide (e.g., nylon) material, a polyester material or a polypropylene material. Warp threads 126 and weft thread 128 of woven material 102 may also be formed from any other suitable polymer material that may include similar physical characteristics as polyester and/or polypropylene. Warp threads 126 and weft thread 128 may be formed from the same material or may be formed from distinct materials when forming woven material 102.

[0046] As shown in FIG. 3, woven material 102 may include a first group 130 of warp threads 126, and a second group 132 of warp threads 126 substantially surrounding first group 130 of warp threads 126. That is, first group 130 of warp threads 126 may form an inner portion of woven material 102, and second group 132 of warp threads 126 may form an outer portion or a top surface 134 and a bottom surface 136 of woven material 102. The first group 130 of warp threads 126 may not be seen by a user of wearable band assembly 100, and the second group 132 of warp threads 126 forming top surface 134 and bottom surface 136 of woven material 102 may be seen by the user of wearable band assembly 100.

[0047] Woven material 102 may include a single weft thread 128 coupled to, woven or interlaced between first group 130 and second group 132 of warp threads 126. More specifically, the single weft thread 128 may include an exterior weft thread portion 138 coupled to the second group 132 of warp threads 126, and an interior weft thread portion 140 coupled to the first group 130 of warp threads 126. As shown in FIG. 3, top surface 134 of woven material 102 may include a portion of exterior weft thread portion 138 coupled to a top portion of the second group 132 of warp threads 126. Additionally, bottom surface 136 of woven material 102 may include a portion of exterior weft thread portion 138 coupled to a bottom portion of the second group 132 of warp threads 126. The weft thread 128 woven between warp threads 126 may form consecutive cross-layers with respect to warp threads 126 in order to form woven material 102.

[0048] By including first group 130 and second group 132 of warp threads 126, and exterior weft thread portion 138 and interior weft thread portion 140 of weft thread 128, woven material 102 may not need filler material (not shown). That is, first group 130 and second group 132 of warp threads 126, and exterior weft thread portion 138 and interior weft thread portion 140 of weft thread 128 may form a four layer (L_1-4) construction for woven material 102, which may provide a desired strength, structural support and/or stiffness to wearable band assembly 100 formed from woven material 102, without the need for filler material. It should be appreciated that more or fewer layers may be used.

[0049] As a result of weft thread 128 being a single thread, exterior weft thread portion 138 and interior weft thread portion 140 may form, in part, a double weave or thickness of weft thread 128 in woven material 102, as shown in FIG. 3. Additionally, weft thread 128 may be continuously woven through and/or coupled to warp threads 126 to form the various layers or rows of woven material 102. That is, and as discussed herein, woven material 102 may be formed by coupling or continuously weaving weft thread 128 through the warp threads 126 to form four distinct layers (L_1-4) of woven material 102. As such, and as shown in FIG. 3, weft thread 128 of woven material 102 may include a prior layer portion 142, which may form the beginning of weft thread 128 for the displayed or current layer, and a subsequent layer portion 144 positioned opposite prior layer portion 142. Prior layer portion 142 may be a portion of weft thread 128 that may be positioned in the prior layer of woven material 102, and previously woven through warp threads 126. Conversely, subsequent layer portion 144 of weft thread 128 may be woven through the warp threads 126 of the displayed or current layer of woven material 102, and may be positioned to be subsequently woven through the subsequent layer of woven material 102.

[0050] As shown in FIG. 3, and discussed herein, woven material 102 including first group 130 and second group 132 of warp threads 126, and weft thread 128 may form four distinct layers (L_1-4) of warp threads 126 and weft thread 128 within woven material 102. A first layer (Li) may include the top portion of the second group 132 of warp threads 126 and the portion of exterior weft thread portion 138 coupled to the second group 132 of warp threads 126. As shown in FIG. 3, first layer (L^, and the various components included therein, may substantially form top surface 134 of woven material 102. A second layer (L₂) of woven material 102 may be positioned directly adjacent first layer (L^. Second layer (L₂) may include a first portion of the first group 130 of warp threads 126 and a portion of interior weft thread portion 140. A third layer (L₃) may be positioned directly adjacent the second layer (L₂), and may include a second portion of the first group 130 of warp threads 126 and the remaining portion of interior weft thread portion 140. As shown in FIG. 3, second layer (L₂) and third layer (L₃) may, collectively, form the inner portion of woven material 102, and may not be seen by a user of wearable band assembly 100 formed from woven material 102, as discussed herein. Finally, woven material 102 may include a fourth layer (L₄) positioned directly adjacent third layer (L₃), and opposite first layer (L^. Fourth layer (L₄) may substantially form bottom surface 136 of woven material 102, and may include the bottom portion of second group 132 of warp threads 126, and the portion of exterior weft thread portion 138 coupled to second group 132 of warp threads 126. [0051] Woven material 102 forming wearable band assembly 100 may also include a plurality of connecting yarns 150a, 150b coupled to weft thread 128. More specifically, as shown in FIG. 3, connecting yarns 150a, 150b of woven material 102 may include a plurality of connecting yarns 150a, 150b coupled to interior weft thread portion 140 of weft thread 128 and/or exterior weft thread portion 138 of weft thread 128. In a non-limiting example embodiment shown in FIG. 3, connecting yarns 150a, 150b in first portion 122 may only be positioned through portions of woven material 102. More specifically, a first collection of connecting yarns 150a may be coupled to exterior weft thread portion 138 included in top surface 134, and interior weft thread portion 140 coupled to first group 130 of warp threads 126 positioned adjacent top surface 134. That is, the first collection of connecting yarns 150a may only be positioned within and/or may be substantially coupled to first layer (L^ and second layer (L₂) in first portion 122 of woven material 102. Additionally, a second collection of connecting yarns 150b may be positioned opposite the first collection of connecting yarns 150a, and may be coupled to the exterior weft thread portion 138 included in bottom surface 136, and interior weft thread portion 140 coupled to first group 130 of warp threads 126 positioned adjacent bottom surface 136. As shown in FIG. 3, the second collection of connecting yarns 150b may only be positioned within and/or may be substantially coupled to third layer (L₃) and fourth layer (L₄) in first portion 122 of woven material 102.

[0052] As a result of first collection and second collection of connecting yarns 150a, 150b being coupled to and/or substantially positioned within only a portion of woven material 102 in first portion 122, an opening 152 may be formed within woven material 102 between top surface 134 and bottom surface 136. More specifically, opening 152 may be formed within woven material 102 as a result of coupling first layer (L^ and second layer (L₂) using the first collection of connecting yarns 150a, and coupling third layer (L₃) and fourth layer (L₄) using the second collection of connecting yarns 150b. As shown in FIG. 3, opening 152 may be positioned between warp threads 126 included in first group 130. Opening 152 may provide a space within woven material 102 that may be utilized to improve the functions and/or characteristics of woven material 102 forming wearable band assembly 100. In a non- limiting example, opening 152 formed in first portion 122 of woven material 102 may be utilized in the formation of an end of woven material 102 used to form wearable band assembly 100 and/or may be utilized to couple connection device 104 to woven material 102 forming wearable band assembly 100.

[0053] FIG. 4 shows a cross-section view of second portion 124 of woven material 102 forming wearable band assembly 100 of FIG. 2 taken along line 4-4. That is, FIG. 4 shows a cross-section of second portion 124 of woven material 102, positioned adjacent first portion 122 of woven material 102 depicted in FIG. 3. It is understood that similarly numbered components may function in a substantially similar fashion. Redundant explanation of these components has been omitted for clarity.

[0054] As shown in FIG. 4, second portion 124 of woven material 102 may also include a plurality of connecting yarns 151 . In a non-limiting example shown in FIG. 4, connecting yarns 151 may be positioned completely through second portion 124 of woven material 102, and more specifically, through the four layers (L_{1 -4}) formed within second portion 124 of woven material 102. That is, connecting yarns 151 may be coupled to exterior weft thread portion 138 included in top surface 134, and exterior weft thread portion 138 included in bottom surface 136 of woven material 102. Additionally as shown in FIG. 4, connecting yarn 151 may be coupled to exterior weft thread portion 138 positioned within first layer (L^ and fourth layer (L₄), respectively.

[0055] FIG. 5 depicts an example process for forming a wearable band assembly from a woven material. Specifically, FIG. 5 is a flowchart depicting one example process 500 for forming a wearable band assembly out of a woven material. In some cases, the woven material may be used to form one or more wearable band assemblies, as discussed above with respect to FIG. 1 .

[0056] In operation 502, a pin aperture may be formed through a width of a woven material. More specifically, a pin aperture may be formed through the width of a distinct first portion of the woven material including a center opening. The first portion of the woven material may also include a four distinct layers of woven threads where a first layer and a second layer may form a top portion of the woven material, and a third layer and fourth layer form a bottom portion of the woven material. The center opening is formed in the first portion of the woven material between the second layer and third layer of woven threads. The forming of the center opening may further include coupling the first layer of woven threads to the second layer of woven threads using a first collection of connecting yarns, and distinctly coupling the third layer of woven threads to the fourth layer of woven threads using a second collection of connecting yarns. The forming the pin aperture through the first portion of the woven material including the center opening may also include creating corresponding holes on opposite sides of the woven material in the first portion including the center opening. The corresponding holes may be created in substantial alignment with the center opening formed in the first portion of the woven material. As such, the center opening and the corresponding holes in the first portion of the woven material may substantially form the pin aperture formed through the width of the woven material.

[0057] In operation 504, the woven material may be cut adjacent the pin aperture to form an end. More specifically, the first portion of the woven material including the pin aperture and/or the center opening in the woven material may be cut to form an end of the woven material and/or an end of the portion of the wearable band assembly formed from the woven material. The cutting of the woven material to form the end of the woven material may also include forming at least one recess within the woven material including the pin aperture and/or the center opening. More specifically, at least one recess may be formed within the woven material including the pin aperture, such that a portion of a pin may be substantially exposed when positioned within the pin aperture.

[0058] The pin may be positioned through the pin aperture formed through the woven material for coupling a connection device of the wearable band assembly to the woven material. Additionally, the pin may be positioned through the pin aperture prior to, or subsequent to the cutting of the woven material in operation 504. That is, the pin may be positioned within the pin aperture after the pin aperture is formed, but prior to the cutting of the woven material, or the pin may be positioned within the pin aperture after cutting the woven material including the pin aperture. Where the pin is positioned within the pin aperture prior to the cutting of the woven material, the woven material may be cut around the pin, and a portion of the pin may be exposed in the at least one recess formed in the woven material during the cutting process of operation 504.

[0059] In operation 506, the end of the woven material including the pin aperture and pin may be melted. More specifically, the cut end of the woven material may be melted to interfuse a portion of threads of the woven material adjacent the pin aperture. The melting of the cut end of the woven material may be achieved by hot forming the portion of threads in the first portion of the woven material. That is, the cut end of the woven material including the pin and the pin aperture may be hot formed to include and/or maintain the at least one recess formed within the cut end of the woven material. The recess formed within the interfused/hot formed portion of threads at the cut end of the woven material may be formed/maintained such that a portion of the pin positioned through the pin aperture may remain exposed after the melting process of operation 506.

[0060] The melting of the end of the woven material may also include coupling at least a portion of the interfused portion of threads of the woven material to the pin positioned through the pin aperture. That is, during the melting process in operation 506, the interfused portion of threads may be fused together and may also be melted onto or coupled to the pin positioned through the pin aperture. By coupling the interfused portion of threads of the woven material to the pin, an improved connection strength between the woven material and the pin may be established. The improved connection between the pin and the interfused portion of the woven material may ultimately result in an increased connection strength between a connection device of the wearable band assembly coupled to the woven material via the pin.

[0061] Turning to FIGs. 6A-6G, woven material 602 is shown undergoing various operations that may be performed in accordance with process 500 of FIG. 5. That is, woven material 602, as shown in FIGs. 6A-6G, may be shown undergoing various operations to form wearable band assembly 600, as discussed herein with respect to process 500 of FIG. 5. It is understood that similarly numbered components may function in a substantially similar fashion. Redundant explanation of these components has been omitted for clarity.

[0062] As shown in FIG. 6A, a length of woven material 602 may be provided for forming wearable band assembly 600 (see, FIG. 6G). Woven material 602, as shown in FIG. 6A, may be substantially similar to woven material 102 shown and discussed herein with respect to FIGs. 2-4. That is, woven material 602 may be woven or pre-fabricated to include a first portion 622 and a second portion 624 positioned adjacent first portion 622. As similarly discussed herein with respect to FIGs. 2 and 3, first portion 622 of woven material 602 may include a center opening (see, FIG. 3; center opening 152) formed between the plurality of threads. The center opening may be formed in first portion 622 of woven material 602 by coupling distinct portions or layers (see, FIG. 3; L^) of woven material 602 using connecting yarns (see, FIG. 3; connecting yarns 150a, 150b). Additionally, and as similarly discussed herein with respect to FIGs. 2 and 4, second portion 624 of woven material 602 may include a solid portion of woven material 602 (e.g., no center opening) formed by a plurality of connecting yarns positioned completely through and/or coupled to each layer of woven material 602 (see, FIG. 4; connecting yarns 151 ). Redundant explanation of these features have been omitted for clarity.

[0063] A pin aperture 654 may be formed through a width of woven material 602. More specifically, as shown in FIGS. 6A and 6B, corresponding holes or openings 655 (see, FIG. 6B) may be created or formed on either side of woven material 602 in first portion 622 to form pin aperture 654. The corresponding openings 655 may be in substantial alignment with the center opening formed in first portion 622 of woven material 602 to form pin aperture 654. As shown in FIG. 6B, corresponding openings 655 created in woven material 602 may be formed through the warp threads and weft thread(s) (see, FIG. 3) forming woven material 602. More specifically, and with reference to FIG. 3, the corresponding openings 655 may be formed through exterior weft thread portion 138 and interior weft thread portion 140 of woven material 602, respectively, to form pin aperture 654. Corresponding openings 655 may be formed in first portion 622 of woven material 602 using any suitable material cutting or material removal technique. In a non-limiting example, corresponding openings 655 may be formed using a laser cutting process. The laser used to form corresponding opening 655 may form corresponding openings 655 and simultaneously cauterize and round the edges of corresponding openings 655 to prevent fraying of woven material 602 around pin aperture 654. The creation of corresponding openings 655 in first portion 622 of woven material 602 to form pin aperture 654, as shown in FIGs. 6A and 6B, may correspond to operation 502 of FIG. 5. [0064] By forming corresponding openings 655 in first portion 622, and/or by weaving or pre-fabricating first portion 622 to include the center opening between the various layers of woven material 602, pin aperture 654 may be formed through the width of woven material 602 without having to substantially cut or otherwise disturb the internal layers or components (e.g., FIG. 3; warp threads 126) of woven material 602. That is, by creating the center opening in woven material 602 using connection yarns as discussed herein, pin aperture 654 may be formed without substantially disturbing or disrupting woven material 602, warp or weft thread(s) forming woven material 602 and/or the weave pattern of woven material 602. As such, the structural or weave integrity of woven material 602 may not be negatively affected, nor will the weave or aesthetic pattern of woven material 602 be negatively affected.

[0065] As shown in FIG. 6A, and as discussed herein, a pin 656 (shown in phantom) may be positioned with pin aperture 654 of woven material 602. Pin 656 may be positioned through pin aperture 654 and may couple a connection device 604 (see, FIG. 6G) to woven material 602 to form wearable band assembly 600 (see, FIG. 6G), as discussed herein. In a non- limiting example, pin 656 may be positioned within pin aperture 654 immediately after the formation of pin aperture 654 within woven material 602, as shown in FIG. 6A. In another non-limiting example, and as discussed herein, pin 656 may be positioned within pin aperture 654 subsequent to performing a cutting process on woven material 602. Pin 656 may be formed from any suitable rigid material that may couple the connection device 604 to woven material 602, and ultimately couple wearable band assembly 600 (see, FIG. 6G) to a user. In addition, and as discussed herein, pin 656 may also be formed from a material having a substantially higher melting point than the melting point of the material forming woven material 602 (e.g., polyamide material), as discussed herein with respect to FIG. 3. In a non-limiting example, pin 656 may be formed from a stainless steel spring pin.

[0066] Turning to FIGs. 6C and 6D, a cutting process may be performed on woven material 602. Specifically, first portion 622 of woven material 602 including pin aperture 654 may be substantially cut and/or shaped to form end 658 of woven material 602. As discussed herein, end 658 may be formed in woven material 602 and may include connection device 604 (see, FIG. 6G) of wearable band assembly 600 (see, FIG. 6G). Woven material 602 may be cut at first portion 622 to form end 658 using any suitable cutting or material removal process. In a non-limiting example first portion 622 of woven material 602 may be cut using a laser cutting process. Where a laser cutting process is used to cut first portion 622 of woven material 602 to form end 658, the threads (e.g., warp threads, weft thread(s), connecting yarns) forming the edges of cut end 658 of woven material 602 may be substantially cauterized or melted together to prevent undesirable fraying of woven material 602 and/or to maintain pin aperture 654 formed through woven material 602. Additionally, where a laser cutting process is used to form cut end 658, the edges of cut end 658 may be substantially rounded to also prevent undesirable fraying of woven material 602. The cutting of first portion 622 to form end 658 of woven material 602, as shown in FIGs. 6C and 6D, may correspond to operation 504 of FIG. 5.

[0067] As shown in FIG. 6C, cutting the woven material 602 at first portion 622 to form end 658 may also form at least one recess 660 within first portion 622 of woven material 602. Recess 660 may be formed in first portion 622 of woven material 602 by cutting or recessing a portion of woven material 602 in first portion 622 to or substantially adjacent to second portion 624 of woven material 602. As shown in FIG. 6C, recess 660 formed within end 658 of woven material 602 may result in a portion of pin 656 positioned in pin aperture 654 to be exposed. That is, and as discussed herein, recess 660 may be formed within woven material 602 to expose a portion of pin 656, where the exposed portion of pin 656 may receive a component (e.g., tongue) of the connection device 604 (e.g., buckle) of wearable band assembly 600 (see, FIG. 6G).

[0068] The cutting of woven material 602 to form end 658 may also form a plurality of loops 662 in first portion 622 of woven material 602. As shown in FIG. 6C, first portion 622 of woven material 602 may include two distinct loops 662 that may be positioned on either side of recess 660. Loops 662 may be formed in first portion 622 when cutting or recessing a portion of woven material 602 to form end 658 and/or recess 660. Additionally as shown in FIG. 6C, loops 662 may be formed substantially inward from each side of woven material 602. That is, loops 662 of first portion 622 of woven material 602 may be positioned substantially toward the center and/or substantially out of alignment with the sides of woven material 602. As discussed herein, loops 662 may be formed substantially toward the center of and/or away from the sides of woven material 602 to ensure that the melted, interfused portion of threads (see, FIG. 6E) do not extend beyond the sides of woven material 602 and/or are not substantially visible when the connection device 604 of wearable band assembly 600 (see, FIG. 6G) is coupled to pin 656.

[0069] As shown in FIGs. 6E and 6F, first portion 622 of woven material 602 forming end 658 may be substantially melted. More specifically, the threads included in first portion 622 of woven material 602 may undergo a hot forming process to form an interfused portion of threads 664 at end 658 of woven material 602. The hot forming process utilized to form interfused portion of threads 664 may substantially melt and shape the threads forming first portion 622 of woven material 602, such that the interfused portion of threads 664 formed in the hot forming process are a substantially hardened, solidary component that is formed to a desired shape. That is, interfused portion of threads 664 positioned at end 658 may include the melted and/or fused threads of first portion 622 of woven material 602 that may be formed in a desired shape to be implemented within wearable band assembly 600 (see, FIG. 6G). As shown in FIG. 6E, interfused portion of threads 664 at end 658 may form a substantially hardened, solidary component that may be reshaped to span the width of woven material 602, and include recess 660. As similarly discussed herein with respect to FIG. 6C, recess 660 formed in interfused portion of threads 664 may allow a portion of pin 656 to be exposed at end 658, where recess 660 and/or exposed portion of pin 656 may receive a component (e.g., tongue) of connection device 604 (e.g., buckle) of wearable band assembly 600 (see, FIG.6G).

[0070] Additionally, as shown in FIG. 6F, the thickness of interfused portion of threads 664 may be substantially smaller than the thickness of woven material 602, as a result of performing the melting process. As discussed herein, by including a thickness smaller than that of woven material 602, interfused portion of threads 664 may be substantially covered and/or may not be visible to a user when connection device 604 is coupled to pin 656 to form wearable band assembly 600. The melting process for forming interfused portion of threads 664 at end 658 of woven material 602, as shown in FIGs. 6E and 6F, may correspond to operation 506 of FIG. 5.

[0071 ] During the melting or hot forming process, pin 656 may remain in pin aperture 654 formed through first portion 622 of woven material 602. Pin 656 may remain in pin aperture 654 to maintain pin's 656 connection to end 658 of woven material 602 during the melting or hot forming process and/or to ensure pin aperture 654 does not become closed or melted shut during the melting process. As discussed herein, pin 656 may be formed from a substantially rigid material that may include a melting temperature substantially higher than the melting temperature of the material forming threads (e.g., warp threads, weft thread(s)) of woven material 602. As such, when first portion 622 of woven material 602 is melted to form interfused portion of threads 664 at end 658, pin 656 may be substantially unchanged or unaffected, and may ultimately be coupled to interfused portion of threads 664. That is, and as shown in FIG. 6F, interfused portion of threads 664 at end 658 of woven material 602 may be melted around and/or substantially melted to or coupled to pin 656. The coupling of interfused portion of threads 664 to pin 656 may increase the bond or connection of pin 656 to woven material 602, which may also result in an increased connection between connection device 604 (see, FIG. 6G) and woven material 602.

[0072] FIG. 6G shows a portion of wearable band assembly 600 formed from woven material 602. Wearable band assembly 600 may be formed using the process as discussed herein with respect to FIGs. 5-6F, and by coupling connection device 604 to pin 656 (shown in phantom) positioned at end 658 of woven material 602. As shown in FIG. 6G, connection device 604 may be positioned directly adjacent to interfused portion of threads 664 (shown in phantom) of woven material 602. More specifically, connection device 604 may be coupled to pin 656 and may substantially cover interfused portion of threads 664, such that neither pin 656, nor interfused portion of threads 664 positioned at end 658 are visible to a user of wearable band assembly 600. In a non-limiting example pin 656 may be a spring pin, and connection device 604 may be a buckle 610, such that buckle 610 may be coupled to spring pin (e.g., pin 656), and ultimately woven material 602. More specifically, buckle 610 may include apertures (not shown) positioned at each end for receiving pin 656 to couple buckle 610 to pin 656, and ultimately, couple buckle 610 to woven material 602. In addition, buckle 610 may also include a slot (not shown) having a shape corresponding to the shape of interfused portion of threads 664, such that interfused portion of threads 664 may be positioned within the slot of buckle 610. That is, buckle 610 may include a slot for receiving substantially rigid interfused portion of threads 664 at end 658 of woven material 602, where slot may engage and/or be coupled to interfused portion of threads 664 to aid in the coupling of buckle 610 to woven material 602 when forming wearable band assembly 600.

[0073] Additionally as shown in FIG. 6G, and as discussed herein with respect to FIG. 1 , connection device 604 formed as a buckle 610 may also include tongue 612 coupled to pin 656 and contacting buckle 610. More specifically, tongue 612 may be positioned or received within recess 660 formed in interfused portion of threads 664 and may be coupled to the exposed portion of pin 656 positioned within recess 660. As similarly discussed herein with respect to FIG. 1 , tongue 612 may aid in coupling wearable band assembly 602 to a user by feeding a distinct end (see, FIG. 1 ) of woven material 602 through buckle 610, and positioning tongue 612 through one of a plurality of holes (see, FIG. 1 ) formed through the distinct end of woven material 602.

[0074] Although not shown, it is also understood that the cutting processes shown and discussed with respect to FIG. 6C and/or the melting processes shown and discussed with respect to FIG. 6E may also include forming a tapered portion in woven material 602 forming wearable band assembly 100 (see, FIG. 1 ). In a non-limiting example, end 658 of woven material 602 may include a converging taper and/or a taper that allows a portion of woven material 602 at end 658 to have a width smaller than the width of the remaining portion of woven material 602. The taper at end 658 may aid in securing connection device 604 (e.g., buckle 610) to end 658 of woven material 602. [0075] FIG. 7 depicts another example process for forming a wearable band assembly from a woven material. Specifically, FIG. 7 is a flowchart depicting one example process 700 for forming a wearable band assembly out of a woven material. In some cases, the woven material may be used to form one or more wearable band assemblies, as discussed above with respect to FIG. 1 .

[0076] In operation 702, a pin aperture may be formed through a width of a woven material. More specifically, a pin aperture may be formed through the width of a distinct first portion of the woven material including a center opening. The first portion of the woven material may also include four distinct layers of woven threads where a first layer and a second layer may form a top portion of the woven material, and a third layer and fourth layer form a bottom portion of the woven material. The center opening is formed in the first portion of the woven material between the second layer and third layer of woven threads. The forming of the center opening may further include coupling the first layer of woven threads to the second layer of woven threads using a first collection of connecting yarns, and distinctly coupling the third layer of woven threads to the fourth layer of woven threads using a second collection of connecting yarns. The forming the pin aperture through the first portion of the woven material including the center opening may also include creating corresponding holes on opposite sides of the woven material in the first portion including the center opening. The corresponding holes may be created in substantial alignment with the center opening formed in the first portion of the woven material. As such, the center opening and the corresponding holes in the first portion of the woven material may substantially form the pin aperture formed through the width of the woven material.

[0077] In operation 704, the woven material may be cut adjacent the pin aperture to form an end. More specifically, the first portion of the woven material including the pin aperture and/or the center opening in the woven material may be cut to form an end of the woven material and/or an end of the portion of the wearable band assembly formed from the woven material. The cutting of the woven material to form the end of the woven material may also include forming at least one recess within the woven material including the pin aperture and/or the center opening. More specifically, at least one recess may be formed within the woven material including the pin aperture, such that a portion of a pin may be substantially exposed when positioned within the pin aperture.

[0078] The pin may be positioned through the pin aperture formed through the woven material for coupling a connection device of the wearable band assembly to the woven material. Additionally, the pin may be positioned through the pin aperture prior to, or subsequent to the cutting of the woven material in operation 704. That is, the pin may be positioned within the pin aperture after the pin aperture is formed, but prior to the cutting of the woven material, or the pin may be positioned within the pin aperture after cutting the woven material including the pin aperture. Where the pin is positioned within the pin aperture prior to the cutting of the woven material, the woven material may be cut around the pin, and a portion of the pin may be exposed in the at least one recess formed in the woven material during the cutting process of operation 704.

[0079] In operation 706, a plurality of high tensile fibers may be coupled to the cut end of the woven material. More specifically, a plurality of high tensile fibers may be coupled to, woven or interlaced through the first portion of the woven material, including the pin positioned through the pin aperture. That is, the plurality of high tensile fibers may be woven or positioned completely through the threads included in the first portion of the woven material. In addition, the plurality of high tensile fibers may be woven completely around the pin and the pin aperture formed at the end of the woven material. The plurality of high tensile fibers may provide additional tensile strength to the pin positioned within the cut end of the woven material. As discussed herein, by providing additional tensile strength to the pin positioned in the cut end of the woven material, the connection device of the wearable band assembly coupled to the pin may also be provided with additional tensile strength and may be substantially secured to the end of the woven material forming the wearable band assembly.

[0080] Turning to FIGs. 8A-8D, woven material 802 is shown undergoing various operations that may be performed in accordance with process 700 of FIG. 7. That is, woven material 802, as shown in FIGs. 8A-8D, may be shown undergoing various operations to form wearable band assembly 800, as discussed herein with respect to process 700 of FIG. 7. It is understood that similarly numbered components may function in a substantially similar fashion. Redundant explanation of these components has been omitted for clarity. [0081 ] As shown in FIG. 8A, a length of woven material 802 may be provided for forming wearable band assembly 800 (see, FIG. 8E). Woven material 802, as shown in FIG. 8A, may be substantially similar to woven material 102 shown and discussed herein with respect to FIGs. 2-4. As certain features have been previously described with respect to other embodiments, explanation of these features is omitted for clarity and brevity. [0082] A pin aperture 854 may be formed through a width of woven material 802. More specifically, as shown in FIGS. 8A and 8B, corresponding holes or openings 855 (see, FIG. 8B) may be created or formed on either side of woven material 802 in first portion 822 to form pin aperture 854. The corresponding openings 855 may be in substantial alignment with the center opening formed in first portion 822 of woven material 802 to form pin aperture 854. As shown in FIG. 8B, corresponding openings 855 created in woven material 802 may be formed through the warp threads and weft thread(s) {see, FIG. 3) forming woven material 802. More specifically, and with reference to FIG. 3, the corresponding openings 855 may be formed through exterior weft thread portion 138 and interior weft thread portion 140 of woven material 802, respectively, to form pin aperture 854. Corresponding openings 855 may be formed in first portion 822 of woven material 802 using any suitable material cutting or material removal technique. The creation of corresponding openings 855 in first portion 822 of woven material 802 to form pin aperture 854, as shown in FIGs. 8A and 8B, may correspond to operation 702 of FIG. 7.

[0083] By forming corresponding openings 855 in first portion 822, and/or by weaving or pre-fabricating first portion 822 to include the center opening between the various layers of woven material 802, pin aperture 854 may be formed through the width of woven material 802 without having to substantially cut or otherwise disturb the internal layers or components (e.g., FIG. 3; warp threads 126) of woven material 802. That is, by creating the center opening in woven material 802 using connection yarns as discussed herein, pin aperture 854 may be formed without substantially disturbing or disrupting woven material 802, warp or weft thread(s) forming woven material 802 and/or the weave pattern of woven material 802. As such, the structural or weave integrity of woven material 802 may not be negatively affected, nor will the weave or aesthetic pattern of woven material 802 be negatively affected. [0084] As shown in FIG. 8A, and as discussed herein, a pin 856 (shown in phantom) may be positioned with pin aperture 854 of woven material 802. Pin 856 may be positioned through pin aperture 854 and may couple a connection device 804 (see, FIG. 8E) to woven material 802 to form wearable band assembly 800 (see, FIG. 8E), as discussed herein. In a non- limiting example, pin 856 may be positioned within pin aperture 854 immediately after the formation of pin aperture 854 within woven material 802, as shown in FIG. 8A. In another non-limiting example, and as discussed herein, pin 856 may be positioned within pin aperture 854 subsequent to performing a cutting process on woven material 802. Pin 856 may be formed from any suitable rigid material that may couple the connection device 804 to woven material 802, and ultimately couple wearable band assembly 800 (see, FIG. 8E) to a user. In addition, and as discussed herein, pin 856 may also be formed from a material having a substantially higher melting point than the melting point of the material forming woven material 802 (e.g., polyamide material), as discussed herein with respect to FIG. 3. In a non-limiting example, pin 856 may be formed from a stainless steel spring pin.

[0085] Turning to FIGs. 8C and 8D, a cutting process may be performed on woven material 802. Specifically, first portion 822 of woven material 802 including pin aperture 854 may be substantially cut and/or shaped to form end 858 of woven material 802. As discussed herein, end 858 may be formed in woven material 802 and may include connection device 804 (see, FIG. 8E) of wearable band assembly 800 (see, FIG. 8E). Woven material 802 may be cut at first portion 822 to form end 858 using any suitable cutting or material removal process. In a non-limiting example first portion 822 of woven material 802 may be cut using a laser cutting process. Where a laser cutting process is used to cut first portion 822 of woven material 802 to form end 858, the threads (e.g., warp threads, weft thread(s), connecting yarns) forming the edges of cut end 858 of woven material 802 may be substantially melted together to prevent undesirable fraying of woven material 802 and/or to maintain pin aperture 854 formed through woven material 802. The cutting of first portion 822 to form end 858 of woven material 802, as shown in FIG. 8C and 8D, may correspond to operation 704 of FIG. 7.

[0086] As shown in FIG. 8C, cutting the woven material 802 at first portion 822 to form end 858 may also form at least one recess 860 within first portion 822 of woven material 802. Recess 860 may be formed in first portion 822 of woven material 802 by cutting or recessing a portion of woven material 802 in first portion 822 to or substantially adjacent to second portion 824 of woven material 802. As shown in FIG. 8C, recess 860 formed within end 858 of woven material 802 may result in a portion of pin 856 positioned in pin aperture 854 to be exposed. That is, and as discussed herein, recess 860 may be formed within woven material 802 to expose a portion of pin 856, where the exposed portion of pin 856 may receive a component (e.g., tongue) of the connection device 804 (e.g., buckle) of wearable band assembly 800 (see, FIG. 8E).

[0087] The cutting of woven material 802 to form end 858 may also form a plurality of loops 862 in first portion 822 of woven material 802. As shown in FIG. 8C, first portion 822 of woven material 802 may include two distinct loops 862 that may be positioned on either side of recess 860. Loops 862 may be formed in first portion 822 when cutting or recessing a portion of woven material 802 to form end 858 and/or recess 860. Additionally as shown in FIG. 8C, loops 862 may be formed substantially inward from each side of woven material 802. That is, loops 862 of first portion 822 of woven material 802 may be positioned substantially toward the center and/or substantially out of alignment with the sides of woven material 802. As discussed herein, loops 862 may be formed substantially toward the center of and/or away from the sides of woven material 802 to ensure that the melted, interfused portion of threads (see, FIG. 6E) do not extend beyond the sides of woven material 802 and/or are not substantially visible when the connection device 804 of wearable band assembly 800 (see, FIG. 8E) is coupled to pin 856. [0088] FIG. 8C and 8D may also show a plurality of high tensile fibers 866 coupled to first portion 822 of woven material 802 at end 858. More specifically, a plurality of high tensile fibers 866 may be coupled to, woven or interlaced through each loop 862 formed at end 858 of woven material 802. The coupling of the plurality of high tensile fibers 866 to woven material 802, as shown in FIGs. 8C and 8D, may correspond to operation 706 of FIG. 7. As shown in FIGs. 8C and 8D, the plurality of high tensile fibers 866 may be woven through loops 862 in a similar fashion as the connecting yarns 150, as discussed herein with respect to FIG. 4. That is, the plurality of high tensile fibers 866 may be woven completely through the various layers of the threads including within loops 862 and/or first portion 822 of woven material 802. The plurality of high tensile fibers 866 may also be warped or woven completely around pin 856 positioned through pin aperture 854 at end 858, as shown in FIG. 8D, to substantially aid in the coupling of pin 856 to woven material 802. The plurality of high tensile fibers 866 may include any suitable fiber material having a high tensile strength that may be woven into woven material 802. In non-limiting examples, the high tensile fibers 866 may include carbon fibers or flexible metalized fibers.

[0089] FIG. 8E shows a portion of wearable band assembly 800 formed from woven material 802. Wearable band assembly 800 may be formed using the process as discussed herein with respect to FIGs. 7-8D, and by coupling connection device 804 to pin 856 (shown in phantom) positioned at end 858 of woven material 802. As shown in FIG. 8E, connection device 804 may be positioned directly adjacent to first portion 822 including loops 862

(shown in phantom) of woven material 802. More specifically, connection device 804 may be coupled to pin 856 and may substantially cover loops 862, such that neither pin 856, nor loops 862 positioned at end 858 are visible to a user of wearable band assembly 800. In addition, connection device 804 may also cover the plurality of high tensile fibers 866 coupled to loops 862 of woven material 802. In a non-limiting example pin 856 may be a spring pin, and connection device 804 may be a buckle 810, such that buckle 810 may be coupled to spring pin (e.g., pin 856), and ultimately woven material 802. More specifically, buckle 810 may include apertures (not shown) positioned at each end for receiving pin 856 to couple buckle 810 to pin 856, and ultimately, couple buckle 810 to woven material 802. In addition, buckle 810 may also include a slot (not shown) having a shape corresponding to the shape of loops 862 formed at end 858, such that loops 862 may be positioned within the slot of buckle 810. That is, buckle 810 may include a slot for receiving loops 862 of woven material 802, where slot may engage and/or be coupled to loops 862 formed at end 858 to aid in the coupling of buckle 810 to woven material 802 when forming wearable band assembly 800. [0090] Additionally as shown in FIG. 8E, and as discussed herein with respect to FIG. 1 , connection device formed as a buckle 810 may also include tongue 812 coupled to pin 864 and contacting buckle 810. More specifically, tongue 812 may be positioned or received within recess 860 formed between loops 862 and may be coupled to the exposed portion of pin 856 positioned within recess 860. As similarly discussed herein with respect to FIG. 1 , tongue 812 may aid in coupling wearable band assembly 802 to a user by feeding a distinct end (see, FIG. 1 ) of woven material 802 through buckle 810, and positioning tongue 812 through one of a plurality of holes (see, FIG. 1 ) formed through the distinct end of woven material 802. [0091 ] FIG. 9 depicts an example process for forming a hole within a wearable band assembly formed from a woven material. Specifically, FIG. 9 is a flowchart depicting one example process 900 for forming a hole in wearable band assembly. In some cases, the woven material may be used to form one or more wearable band assemblies, as discussed above with respect to FIG. 1 .

[0092] In operation 902, a portion of wearable band assembly 100 may be debossed or hot formed. More specifically, a portion of wearable band assembly 100 may undergo a debossing or hot forming process using debossing tools. The debossing tools may be heated to a temperature of approximately 250°C, and may subsequently contact wearable band assembly 100 to melt and/or indent a portion of wearable band assembly 100 in contact with debossing tools. Debossing tools may contact wearable band assembly 100 on opposite sides or nearby, to substantially indent, melt and/or fuse the weft and warp threads of woven material 102 in the portion of wearable band assembly 100 in contact with the debossing tools. Additionally, debossing tools may melt and/or fuse, but may not indent or compress, a portion of the woven material 102 positioned directly adjacent the melted and indented portion of woven material 102. The melting, but not indenting or compressing of the woven material 102 positioned directly adjacent the embossed portion of woven material 102 may substantially prevent fraying of woven material 102 in that area after a hole or other feature is formed.

[0093] In operation 904, the debossed or hot formed portion of the wearable band assembly 100 may be cut. Specifically, the melted and indented portion of the woven material 102 forming wearable band assembly 100 may be laser cut to remove the debossed or hot formed portion. The laser cutting of the debossed or hot formed portion may create hole 1 18 within wearable band assembly 100. The laser cutting of wearable band assembly 100 may cauterize the edges of the cut portion. Additionally, the melted, but not indented portion may also prevent fraying of woven material 102 subsequent to the laser cutting process. [0094] Turning to FIGs. 10A-10D, a process of forming a hole within wearable band assembly 100 is shown. Woven material 102 is shown in FIG. 10A prior to processing. As shown in FIG. 10A, woven material 102 may include a desired thickness (TD) for wearable band assembly 100 of electronic device. Desired thickness (TD) may correspond to a final thickness for wearable band assembly 100 of electronic device.

[0095] FIGs. 10B and 10C show wearable band assembly 100 being embossed or hot formed. More specifically, as shown in FIG. 10B, embossing tools 170 may contact a portion of wearable band assembly 100 on opposite sides to substantially melt and indent or compress the contacted portion of woven material 102 forming wearable band assembly 100. Embossing tools 170 may be heated to a temperature above the melting temperature of the woven material 102 forming wearable band assembly 100 in order to substantially melt or fuse the threads of woven material 102 in contact with embossing tools 170. As such, embossed portion 172 of woven material 102 may be substantially fused or melted together. [0096] Additionally, because woven material 102 is compressed between embossing tools 170 during the embossing or hot forming process, the embossed portion 172 may be substantially indented or compressed. That is, embossing tools 170 may decrease the thickness of embossed portion 172 of woven material 102 to a reduced thickness (TR). As shown in FIG. 10B, the reduced thickness (TR) may be substantially smaller than the desired thickness (TD) of woven material 102 forming wearable band assembly 100. As discussed herein, reduced thickness (TR) may aid in the cutting of woven material 102 to form holes 1 18.

[0097] Also, as a result of the temperature of embossing tools 170 being greater than the melting temperature of woven material 102, adjacent portions 174 of woven material 102 of wearable band assembly 100 may also be melted or fused by embossing tools 170. The adjacent portions 174 may substantially surround the embossed portion 172, and may be melted or fused as a result of indirect heat emitted by embossing tools 170 during the embossing process, as discussed herein. Although the woven material 102 in adjacent portion 174 is melted or fused, no pressure is applied to adjacent portion 174. As such, adjacent portion 174 may only be melted or fused but not indented or compressed like embossed portion 172, and may maintain the desire thickness (TD), or may have a somewhat increased thickness due to reflow from embossed portion 172. The embossing of FIGs. 10B and 10C corresponds to operation 902 in FIG. 9.

[0098] As shown in FIG. 10C, the embossing tools 170 may include an end 176 that may contact woven material 102 during the embossing process. End 176 of embossing tools 170 may include geometry 178 or shape that may substantially correspond to the size of hole 1 18 to be formed within wearable band assembly 100. As such, geometry 178 of end 176 of embossing tools 170 may be created and or transferred to embossed portion 172 of woven material 102 when forming hole 1 18 in wearable band assembly 100. Bottom embossing tool 170 may be omitted from FIG. 10C for clarity, but may include substantially similar features as discussed herein and shown in FIG. 10C.

[0099] End 176 of embossing tools 170 may also include texture surface 180. Texture surface 180 may be formed over the majority of the exterior surface of end 176. In a non- limiting example, textured surface 180 may be formed on end 176 by making exterior surface of end 176 substantially rough, non-smooth or by casting a specific pattern on end 176 when forming embossing tools 170.

[00100] Texture surface 180 of end 176 of embossing tools 170 may transfer a texture to embossed portion 172 and/or adjacent portion 174 of woven material 102 during the embossing process. That is, texture surface 180 of end 176 may contact embossed portion 172 and/or adjacent portion 174 of woven material 102 for forming a texture within and/or substantially around hole 1 18 of wearable band assembly 100. As discussed herein, embossing tools 170 may be heated to a temperature greater than the melting temperature of the material forming woven material 102. As such, the inclusion of texture surface 180 of end 176 of embossing tools 170 may form (by melting, imprinting or the like) a textured exposed surface of woven material 102.

[00101] FIG. 10D shows woven material 102 undergoing a laser cutting process. As shown in FIG. 10D, laser 182 may emit a laser beam 184 for cutting hole 118 in wearable band assembly 100. More specifically, laser beam 184 may be emitted substantially around the outer circumference of embossed portion 172 of woven material 102 to substantially remove embossed portion 172 from woven material 102. Laser beam 184 may only remove embossed portion 172 of woven material 102, while leaving adjacent portion 174 of woven material 102 intact with wearable band 100. By melting the threads of woven material 102 in embossed portion 172 and adjacent portion 174, laser beam 184 may remove embossed portion 172 of woven material 102 without fraying the edges of hole 1 18. Additionally, by forming embossed portion 172 in the woven material 102 that has a reduced thickness (RT), laser beam 184 may cut holes 1 18 more accurately, by detecting (e.g., visual monitor, thickness detection system, and the like) reduced thickness portion and only cutting that material. Laser beam 184 may also more easily cut woven material 102 at embossed portion 172 as a result of reduced thickness (RT) in embossed portion 172. The laser cutting of FIG. 10D corresponds to operation 904 in FIG. 9. [00102] Although not shown, it is understood that the embossing portion may be used separately on the woven material 102 to form visual or aesthetically appealing features on the woven material 102. That is, a portion of woven material 102 may be embossed by embossing tools 170, which may include a design feature, such as a logo, on end 176. The embossing tools 170 may emboss a logo on woven material 102 to be viewed by a user of an electronic device including wearable band assembly 100 formed from woven material 102.

[00103] FIG. 1 1 shows a hole of wearable band assembly 100 including an eyelet 186, according to certain embodiments. More specifically, an eyelet 186 may be formed within hole 1 18 of wearable band assembly 100 to provide additional support and structure to hole 1 18. Eyelet 186 may be inserted after hole 1 18 is formed, or may be woven into and/or have woven material 102 woven around eyelet 186 prior to the formation of hole 1 18. Where eyelet 186 is positioned within woven material 102 prior to the formation of hole 1 18, woven material 102 may be processed to form hole 1 18 in a similar fashion as discussed herein with respect to FIGs. 10A-10D. However, each process (e.g., embossing, laser cutting) may be performed only on the portion of woven material 102 formed within eyelet 186. In a non- limiting example, during the embossing process, embossed portion 172 (shown in phantom) may be formed within the boundaries or an opening of eyelet 186. Additionally, the cutting of hole 1 18 may consist of the laser cutting away of the woven material 102 formed within the opening of eyelet 186.

[00104] Second end 108 of wearable band assembly 100 positioned adjacent holes 1 18 may be formed using similar processes as discussed herein with respect to hole 1 18 and FIGs. 10A-10D. That is, second end 108 may include a curved geometry 190 (see, FIG. 12D) that may be formed using similar processes as discussed herein with respect to FIGs. 10A-10D. FIGs. 12A-12D may depict a portion of woven material 102 undergoing processes for forming second end 108 of wearable band assembly 100.

[00105] Turning to FIG. 12A, second end 108 may be shown prior to forming curved geometry 190. Second end 108 may include a rough cut formed from a laser cutting process. An initial rough cut of the second end 108 may to give wearable band assembly 100 a desired length, but may require additional processing on second end 108 to form a desired, curved geometry 190 (see, FIG. 12D).

[00106] FIGs. 12B and 12C show second end 108 undergoing an embossing or hot forming process. As similarly discussed herein with respect to hole 1 18, embossing may substantially melt the threads forming woven material 102, and may indent or compress the embossed portion 172 of woven material 102 to reduce the thickness of woven material 102 at embossed portion 172.

[00107] As discussed herein, embossing tools 170 may include end 176 that may include a specific or desired geometry that corresponds to a final geometry to be formed in wearable band assembly 100. As shown in FIG. 12C, end 176 of embossing tools 170 may include geometry 178, such as a substantially curved surface 188. Substantially curved 188 surface of geometry 178 of end 176 may be formed over second end 108 of woven material 102 of wearable band assembly 100.

[00108] FIG. 12D shows a second end 108 undergoing a laser cutting process after second end 108 has been embossed by embossing tools 170. As shown in FIG. 12D, laser beam 184 of laser 182 may cut away excess material or embossed portion 172, shown in phantom. Additionally, as shown in FIG. 12D, laser beam 184 may cut directly adjacent to curved geometry 190 of second end 108 formed during the embossing process. By laser cutting away embossed portion 172 of woven material 102, second end 108 of wearable band assembly 100 may include substantially curved geometry 190.

[00109] Pin 656 may be retained within first end 106 of wearable band assembly 100 in other configurations. That is, as shown in FIGs. 13A and 13B first end 106 may undergo distinct processes from those discussed herein with respect to FIGs. 6A-6G for coupling pin 656 to first end 106 of wearable band assembly 100. As shown in FIGs. 13A and 13B, and discussed herein in detail, a portion of wearable band assembly 100 including first end 106 may be folded around pin 656, to retain pin 656 in a loop 192 of wearable band assembly 100.

[00110] FIG. 13A shows a portion of wearable band assembly 100 including first end 106. As shown in FIG. 13A a predetermined length (L) of wearable band assembly 100 including first end 106 may include a smaller thickness than the remaining thickness of wearable band assembly 100. Specifically, a portion of the thickness of wearable band assembly 100 in the predetermined length (L) may have a reduced thickness on an interior surface 194 that may contact a user's skin and may not be visible when a user is wearing electronic device and/or wearable band assembly 100. The thickness of wearable band assembly 100 may be reduced at any region of the predetermined length (L) by any suitable technique, including: embossing predetermined length (L), as discussed herein; cutting or removing thread from the predetermined length (L) of wearable band assembly 100; and/or by altering the weave pattern and/or technique of woven material 102 over predetermined length (L) of wearable band assembly 100. [00111] FIG. 13B shows first end 106 of wearable band assembly 100 folded around and coupled to interior surface 194 of wearable band assembly 100. More specifically, first end 106 may be coupled to interior surface 194 in a portion of predetermined length (L) of wearable band having a reduced thickness. First end 106 may be coupled to interior surface 194 of wearable band assembly 100 using any suitable technique including, but not limited to, melting, ultrasonic welding, use of a bonding agent or the like. When first end 106 of wearable band assembly 100 is coupled to interior surface 194, loop 192 may be formed in wearable band assembly 100. Pin 656 may then be positioned within loop 192, and as discussed herein, may allow for buckle assembly to be coupled to pin 656 and/or wearable band assembly 100.

[00112] By reducing the thickness in predetermined length (L) of wearable band assembly 100, first end 106 may be folded over more easily, and may be coupled to interior surface 194 of wearable band assembly 100 to form loop 192, as shown in FIG. 13B. More specifically, by reducing the thickness in predetermined length (L), the stiffness of wearable band assembly 100 at predetermined length (L) may also be reduced, allowing loop 192 to be formed wrapping first end 106 under to be coupled to interior surface 194. Additionally, the reduced thickness may reduce the bulk of loop 192 formed in wearable band assembly 100, and may also allow first end 106 to be coupled to interior surface 194 without substantially increasing the thickness of wearable band assembly 100. As shown in FIG. 13B, first end 106, including the reduced thickness, may be coupled to interior surface 194 of wearable band assembly 100, in the predetermined length (L) still including the reduced thickness. As such, even when two pieces of reduced thickness of wearable band assembly 100 included in predetermined length (L) are coupled and/or stacked, they may include substantially the same thickness as the rest of wearable band assembly 100. [00113] FIG. 14 depicts an example process for forming a retention loop for a wearable band assembly formed from a woven material. Specifically, FIG. 14 is a flowchart depicting one example process 1400 for forming a plurality of retention loops from a length of woven material. In some cases, the retention loops formed from woven material may be used with one or more wearable band assemblies, as discussed above with respect to FIG. 1. [00114] In operation 1402, a length of woven material 102 may be debossed or hot formed. Specifically, a length of woven material 102 including an opening in the center of the woven material 102 may undergo a debossing process to form indentations of compressed boundaries in the length of woven material 102. The indentations or compressed boundaries formed in the woven material 102 during the debossing process may form the outer limits for the retention loop 120 to be used in wearable band assembly 100. The debossing process may further include compressing at least two sides of the woven material 102 between two heated, debossing tools.

[00115] In operation 1404, the length of embossed woven material 102 may be formed into a desired shape or geometry. More specifically, the woven material 102 including the plurality of embossed portions may undergo a forming process which may result in the woven material 102 having a substantially rectangular shape. The forming process may further include inserting a substantially rectangular mandrel into the opening of the woven material 102. The forming process may also include heating the mandrel to melt and ultimately harden at least a portion of threads of the woven material 102 to form the rectangular shape.

[00116] In operation 1406, the length of embossed, shaped woven material 102 may be cut. More specifically, the woven material 102 may be laser cut along each of the embossed portions of the shaped woven material 102. The laser cutting of the woven material 102 may form a retention loop 120 having a desired size and shape for the wearable band assembly of the electronic device. The cutting process may further comprise performing multiple laser cuts in each embossed portion over the length of the woven material 102 to form a plurality of retention loops from a single length of the woven material 102.

[00117] Turning to FIG. 15A, a length of woven material 102 may undergo processes for forming retention loop 120. FIG. 15 depicts an illustrative perspective view of a length of woven material 102 used to form a plurality of retention loop 120 (see, FIG. 15D) prior to processing. The length of woven material 102 may include a uniform thickness, and may be substantially flexible. Additionally, as shown in FIG. 15A, woven material 102 may include an opening 196 formed therein, such that woven material 102 is substantially tubular in shape. [00118] FIG. 15B depicts a side view of the length of woven material 102 positioned on a roller belt 198. Woven material 102 may be positioned on roller belt 198, and may be continuously moved by roller belt 198 in a direction (D). As woven material 102 moves along roller belt 198 in direction (D), embossing tool 170 may contact a portion of woven material 102. More specifically, and as shown in FIG. 15B, after a predetermined amount of woven material 102 has traveled along roller belt 198, and beyond embossing tool 170, embossing tool 170 may move toward, and contact woven material 102 to form an embossed portion 172 on woven material 102. The predetermined distance may be substantially equal to the width of the final retention loop 120 formed from woven material 102. When embossing tool 170 contacts woven material 102, it forms embossed portion 172, which includes substantially melted and indented or compressed portions of threads of woven material 102. Once embossed, woven material 102 may continue in the direction (D), and the single length of woven material 102 may include a plurality of embossed portions. Embossing tool 170 may be substantially similar to those embossing tools discussed herein with respect to FIGs. 10B and 10C. As such, redundant explanation of these components is omitted for clarity. [00119] FIG. 15C depicts an illustrative perspective view of embossed woven material 102 positioned on a mandrel 199. More specifically, a substantially rectangular mandrel 199 may be positioned within opening 196 of embossed woven material 102. As shown in FIG. 15C, mandrel 199 may form embossed woven material 102 into a desired rectangle for use with wearable band assembly 100. In a non-limiting example, woven material 102 may be left on rectangular mandrel 199 for a predetermined period of time until woven material 102 takes the shape of mandrel 199. In another non-limiting example, rectangular mandrel 199 may be heated, or may be configured to heat woven material 102 after woven material 102 is positioned over mandrel 199. Rectangular mandrel 199 may be heated to a specific temperature to melt at least a portion of woven material 102. Specifically, rectangular mandrel 199 may be heated to melt an inside portion or non-cosmetic (e.g., visible) portion of threads of woven material 102. Once these threads are melted, embossed woven material 102 may be substantially stiffer and woven material 102 may be formed into a substantially rigid rectangular shape.

[00120] FIG. 15D shows an illustrative perspective view of embossed woven material 102 undergoing a cutting process. More specifically, embossed and formed woven material 102 may be laser cut in embossed portions 172 to form distinct retention loops 120. As discussed herein, embossed portions 172 may form as the boundaries for each discrete retention loop 120 to be utilized in wearable band assembly 100. Once each embossed portion 172 of the length of woven material 102 is cut, a plurality of retention loops 120 (one shown) may be formed.

[00121] Turning to FIGs. 16A and 16B, a length of woven material 102 may undergo distinct processes for forming retention loop 120. Specifically, length of woven material 102, shown in FIGs. 16A and 16B, may depict the formation of retention loop 120 using distinct processes and/or distinct components as those discussed herein with respect to FIGs. 15A- 15D.

[00122] FIG. 16A shows an illustrative perspective view of a length of woven material 102 positioned on a rectangular, moveable mandrel 1699. Rectangular, moveable mandrel 1699 may be substantially similar to mandrel 199 in FIG. 15C, discussed herein, and may aid in forming woven material 102 to a desired rectangular shape. [00123] However, distinct from FIG. 15C, rectangular mandrel 1699 of FIGs. 16A and 16B may be configured to move in a direction (D) rotate in a direction (R). That is, after woven material 102 is positioned on mandrel 1699, embossing tools 170 may be positioned on opposite sides of woven material 102 and mandrel 1699, and may contact woven material 102 to emboss portions of woven material 102. Mandrel 1699 may move predetermined spaces in direction (D) to form multiple embossed portions using embossing tools 170. Once embossed portions are formed on two opposite sides of woven material 102, mandrel 1699 may rotate 90 degrees in direction (R), as shown in FIG. 16B. Once rotated, embossing tools 170 may contact and emboss portions of woven material 102 again, and mandrel 1699 may move in a direction (D) again to aid in the embossing. Distinct from the embossing process discussed herein, embossed woven material 102, as shown in FIGs. 15C and 15D, may include embossed portions completely around the perimeter of woven material 102.

[00124] Once the embossing process is complete, and rectangular mandrel 1699 has formed woven material 102 to the desired rectangular shape, woven material 102 may be laser cut into discrete retention loops in a similar manner as discussed herein with respect to FIG. 15D

[00125] By cutting the woven material to form an end including a pin aperture and subsequently melting the threads formed at the end, the interfused threads at the end of the woven material forming the wearable band may increase the strength of the wearable band, while preventing and/or eliminating the risk of the threads being unwoven from the woven material and/or exposed or visible to a user. The woven material may not be melted however, and may only be cut. When the threads are not melted, additional high tensile fibers may be woven through the cut end including the pin aperture, to substantially strengthen the edge of the wearable band including the connection device.

[00126] The foregoing description, for purposes of explanation, used specific

nomenclature to provide a thorough understanding of the described embodiments.

However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the described embodiments. Thus, the foregoing descriptions of the specific embodiments described herein are presented for purposes of illustration and description. They are not targeted to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to one of ordinary skill in the art that many modifications and variations are possible in view of the above teachings.

Claims

CLAIMS We claim:

1 . A wearable band assembly comprising:

a woven material including an interfused portion of threads positioned at an end, the interfused portion of threads forming an aperture through a width of the woven material; a pin positioned through the aperture of the interfused portion of threads; and a connection device coupled to the pin, the connection device positioned directly adjacent the interfused portion of threads of the woven material.

2. The wearable band assembly of claim 1 , wherein the interfused portion of threads is coupled to the pin.

3. The wearable band assembly of claim 1 , wherein the connection device substantially covers the interfused portion of threads.

4. The wearable band assembly of claim 1 , wherein the interfused portion of threads includes at least one recess.

5. The wearable band assembly of claim 4, wherein the connection device includes a band clasp.

6. The wearable band assembly of claim 5, further comprises a tongue coupled to the pin and contacting the band clasp,

wherein the tongue is positioned within the at least one recess of the interfused portion of threads.

7. The wearable band assembly of claim 1 , wherein the woven material includes a material selected from a group consisting of polyamide material, polyester material, and polypropylene material.

8. A method of forming a wearable band assembly comprising:

forming a pin aperture through a width of a woven material;

cutting the woven material adjacent the pin aperture to form an end of the woven material; and

melting the end of the woven material to interfuse a portion of threads of the woven material adjacent the pin aperture.

9. The method of claim 8 further comprising:

positioning a pin through the pin aperture formed through the woven material, wherein the pin is positioned through the pin aperture one of prior to, or subsequent to, the cutting of the woven material.

10. The method of claim 9, wherein the melting of the end of the woven material to interfuse the portion of threads of the woven material further comprises:

coupling at least a portion of the interfused portion of threads of the woven material to the pin positioned through the pin aperture.

1 1 . The method of claim 8, further comprising forming a center opening in a first portion the woven material.

12. The method of claim 1 1 , wherein the forming of the center opening in the first portion of the woven material further comprises:

coupling a first layer of woven threads to a second layer of woven threads using a first collection of connecting yarns, the first layer of woven threads and the second layer of woven threads forming a top portion of the woven material; and

distinctly coupling a third layer of woven threads to a fourth layer of woven threads using a second collection of connecting yarns, the third layer of woven threads and the fourth layer of woven threads forming a bottom portion of the woven material positioned adjacent the top portion of the woven material

wherein the center opening is positioned between the second layer of woven threads and the third layer of woven threads.

13. The method of claim 1 1 , wherein the forming of the pin aperture through the woven material further comprises:

creating corresponding holes on opposite sides of the woven material in the first portion of the woven material including the center opening.

14. The method of claim 1 1 , wherein the melting of the end of the woven material to interfuse the portion of threads of the woven material further comprises:

hot forming the end of the woven material to include at least one recess within the interfused portion of threads.

15. A wearable band assembly comprising:

a woven material having a first end, the first end including a pin aperture formed through a width of the woven material;

a pin positioned through the pin aperture of an interfused portion of threads; and a connection device coupled to the pin, the connection device positioned directly adjacent the interfused portion of threads of the woven material.

16. The wearable band assembly of claim 15, wherein the woven material comprises:

a first portion positioned at the first end of the woven material; and

a second portion positioned adjacent the first portion,

wherein each of the first portion and the second portion of the woven material includes:

a first layer of woven threads forming a top surface of the woven material; a second layer of woven threads positioned adjacent the first layer, the second layer forming an inner portion of woven threads;

a third layer of woven threads positioned adjacent the second layer, the third layer forming a distinct inner portion of woven threads; and

a fourth layer of woven threads positioned adjacent the third layer, the fourth layer of threads forming a bottom surface of the woven material.

17. The wearable band assembly of claim 16, wherein the first portion of the woven material positioned at the first end further comprises:

a top collection of connecting yarns coupling the first layer of woven threads to the second layer of woven threads;

a bottom collection of connecting yarns distinctly coupling the third layer of woven threads to the fourth layer of woven threads; and

a center opening positioned between the second layer of woven threads and the third layer of woven threads.

18. The wearable band assembly of claim 15, the woven material further comprising a plurality of high tensile fibers coupled to the first end including the pin aperture.

19. The wearable band assembly of claim 18, wherein the connection device substantially covers the first end of the woven material including the plurality of high tensile fibers.

20. A method of forming a wearable band assembly comprising:

forming a pin aperture through a width of a woven material; and

cutting the woven material adjacent the pin aperture to form an end of the woven material, the end of the woven material for receiving and covered by a connection device.

21 . The method of claim 20 further comprising coupling a plurality of high tensile fibers to the cut end of the woven material.

22. The method of claim 21 further comprising: positioning a pin through the pin aperture formed in the cut end including the plurality of high tensile fibers of the woven material, the pin for coupling the connection device to the cut end of the woven material.