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WO2015098724A1 - Procédé de production de capteur piézo-électrique - Google Patents

Procédé de production de capteur piézo-électrique Download PDF

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Publication number
WO2015098724A1
WO2015098724A1 PCT/JP2014/083654 JP2014083654W WO2015098724A1 WO 2015098724 A1 WO2015098724 A1 WO 2015098724A1 JP 2014083654 W JP2014083654 W JP 2014083654W WO 2015098724 A1 WO2015098724 A1 WO 2015098724A1
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WIPO (PCT)
Prior art keywords
detection electrode
piezoelectric
piezoelectric film
manufacturing
detection
Prior art date
Application number
PCT/JP2014/083654
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English (en)
Japanese (ja)
Inventor
河村秀樹
中路博行
山口喜弘
遠藤潤
斉藤誠人
Original Assignee
株式会社村田製作所
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Priority to JP2015554819A priority Critical patent/JP6004123B2/ja
Publication of WO2015098724A1 publication Critical patent/WO2015098724A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
    • H10N30/302—Sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/857—Macromolecular compositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04105—Pressure sensors for measuring the pressure or force exerted on the touch surface without providing the touch position

Definitions

  • the present invention relates to a method for manufacturing a piezoelectric sensor that detects that a pressure has been applied.
  • a piezoelectric sensor may be provided not only to detect a touch position on one main surface (operation surface) of the touch panel but also to detect a pressing amount on the operation surface.
  • Patent Document 1 discloses a plate-like piezoelectric sensor in which a first detection electrode and a second detection electrode are provided on both surfaces of a piezoelectric sheet (piezoelectric film).
  • the piezoelectric sensor is bonded to the other main surface opposite to the operation surface of the touch panel.
  • This piezoelectric sensor can detect the amount of pressing on the operation surface by detecting the voltage.
  • the inventor affixed a piezoelectric film with an adhesive on the first detection electrode of the substrate portion formed by separating the first detection electrode and the second detection electrode on the same surface, and folded the substrate portion,
  • a method for manufacturing a piezoelectric sensor by attaching a second detection electrode to a piezoelectric film with an adhesive and sandwiching the piezoelectric film between the first detection electrode and the second detection electrode.
  • the piezoelectric sensor having such a structure, when the substrate portion is folded and the piezoelectric film is sandwiched between the two detection electrodes, a plurality of minute bubbles may be generated between the detection electrodes and the piezoelectric film. In particular, a plurality of minute bubbles are easily captured in the adhesive.
  • the pressure is relieved by the plurality of minute bubbles, and the pressure is not sufficiently transmitted to the piezoelectric film, or the piezoelectric film and each detection electrode are partially separated by the plurality of minute bubbles. That is, the plurality of minute bubbles prevent a sufficient voltage from being generated in the piezoelectric sensor.
  • An object of the present invention is to provide a method of manufacturing a piezoelectric sensor capable of detecting a press with high accuracy.
  • the present invention relates to a method for manufacturing a piezoelectric sensor including a piezoelectric film and a substrate portion.
  • This method for manufacturing a piezoelectric sensor includes at least a preparation step, a first sticking step, a second sticking step, and a first pressing step.
  • a substrate portion on which the first detection electrode and the second detection electrode are formed is prepared.
  • a piezoelectric film is pasted on the first detection electrode of the substrate portion with an adhesive.
  • the second detection electrode is attached to the piezoelectric film with an adhesive, and the piezoelectric film is sandwiched between the first detection electrode and the second detection electrode.
  • the substrate portion with the piezoelectric film sandwiched is pressed.
  • a plurality of minute bubbles between the first detection electrode and the piezoelectric film are discharged from between the first detection electrode and the piezoelectric film to the outside, A plurality of minute bubbles between the piezoelectric film can be discharged to the outside from between the second detection electrode and the piezoelectric film.
  • the preparing step includes preparing a substrate portion in which the first detection electrode and the second detection electrode are formed side by side on the same surface, In the second attaching step, it is preferable that the substrate portion is folded, the second detection electrode is attached to the piezoelectric film, and the piezoelectric film is sandwiched between the first detection electrode and the second detection electrode.
  • the method for manufacturing the piezoelectric sensor includes a second pressing step.
  • the substrate portion in a state where the piezoelectric film is stuck on the first detection electrode is pressed prior to the second sticking step.
  • a plurality of minute bubbles between the first detection electrode and the piezoelectric film can be discharged to the outside from between the first detection electrode and the piezoelectric film.
  • the pressure can be detected with higher accuracy.
  • the method for manufacturing the piezoelectric sensor includes an electrode forming step.
  • the electrode formation step the first detection electrode and the second detection electrode are formed side by side on the same surface of the substrate portion.
  • a substrate portion on which the first detection electrode and the second detection electrode are formed is prepared.
  • the substrate part is preferably a flexible printed circuit board. Since the flexible printed board is flexible and can be greatly deformed, the board portion is easily folded back in the second attaching step.
  • the piezoelectric sensor preferably has a piezoelectric film formed of a chiral polymer.
  • the piezoelectric sensor can reliably detect the displacement of the piezoelectric film with high sensitivity.
  • the chiral polymer is preferably polylactic acid.
  • the piezoelectric sensor can reliably detect the displacement of the piezoelectric film with high sensitivity.
  • the polylactic acid is preferably L-type polylactic acid.
  • the piezoelectric sensor can reliably detect the displacement of the piezoelectric film with high sensitivity.
  • the piezoelectric sensor manufactured by the manufacturing method of the present invention it is possible to detect the press with high accuracy.
  • FIG. 2 is a cross-sectional view taken along line AA shown in FIG. It is a top view of the piezoelectric sensor 100 shown in FIG.
  • FIG. 4 is a cross-sectional view taken along line BB shown in FIG.
  • FIG. 4 is an exploded plan view of a sensor unit 16 of the piezoelectric sensor 100 shown in FIG. 3. It is sectional drawing at the time of the pressing force detection of the principal part of the display apparatus 10 shown in FIG. It is a flowchart which shows the manufacturing method of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG.
  • FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a top view which shows the manufacturing process of the piezoelectric sensor 100 shown in FIG. It is a flowchart which shows the 1st modification of the manufacturing method of the piezoelectric sensor 100 shown in FIG. It is a flowchart which shows the 2nd modification of the manufacturing method of the piezoelectric sensor 100 shown in FIG. FIG.
  • FIG. 16 is a plan view showing a manufacturing process of the piezoelectric sensor 100 shown in FIG. 15.
  • FIG. 16 is a plan view showing a manufacturing process of the piezoelectric sensor 100 shown in FIG. 15.
  • FIG. 16 is a plan view showing a manufacturing process of the piezoelectric sensor 100 shown in FIG. 15.
  • FIG. 16 is a plan view showing a manufacturing process of the piezoelectric sensor 100 shown in FIG. 15.
  • FIG. 1 is a plan view of a display device 10 including a piezoelectric sensor 100 according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view taken along line AA shown in FIG.
  • the display device 10 includes an operation plate 12, a spacer 14A, a spacer 14B, a detection plate 15, a plate-like sensor unit 16, a columnar pusher 17, and a columnar cushion 21. Although the details will be described later, the display device 10 includes a piezoelectric sensor 100 having a sensor unit 16 and a detection plate 15. Further, the display device 10 includes a housing 11 having a size that is portable.
  • the display device 10 is, for example, a tablet or a smartphone.
  • the housing 11 has a rectangular parallelepiped shape with an open top. As shown in FIGS. 1 and 2, the casing 11 is fitted with an operation plate 12 so as to close the opening surface of the casing 11.
  • the operation plate 12 is a laminated body in which a liquid crystal panel, a touch panel, and a cover glass are laminated.
  • One main surface of the operation plate 12 (specifically, one main surface of the outermost cover glass) serves as the operation surface 101.
  • the operation plate 12 is made of a material having translucency.
  • the operation plate 12, the pusher 17, the sensor unit 16, the detection plate 15, and the cushion 21 are arranged in this order from the operation surface 101 side in the housing 11. .
  • the longitudinal direction of the operation surface 101 is referred to as the X direction
  • the short direction of the operation surface 101 is referred to as the Y direction
  • the direction perpendicular to the operation surface 101 that is, the thickness direction of the housing 11
  • the Z direction is referred to as the Z direction.
  • the spacer 14 ⁇ / b> A is disposed in the vicinity of the first side surface parallel to the X direction among the side surfaces of the housing 11.
  • the spacer 14 ⁇ / b> B is disposed in the vicinity of the second side surface (side surface facing the first side surface) of the housing 11.
  • the spacer 14 ⁇ / b> A and the spacer 14 ⁇ / b> B are disposed at a substantially central portion in the X direction of the housing 11.
  • the material of the spacer 14A and the spacer 14B is, for example, PET resin.
  • the material of the detection plate 15 is SUS (stainless steel).
  • the detection plate 15 is supported inside the housing 11 by spacers 14 ⁇ / b> A, 14 ⁇ / b> B, and a cushion 21 so that the main surface on the operation surface 101 side of the detection plate 15 is parallel to the operation surface 101 of the operation plate 12. .
  • the detection plate 15 is disposed at a substantially central portion in the X direction of the housing 11.
  • the longitudinal direction of the detection plate 15 is parallel to the Y direction.
  • the main surface opposite to the operation surface 101 of the sensor unit 16 is attached to the main surface of the detection plate 15 on the operation surface 101 side.
  • the sensor unit 16 is arranged inside the housing 11 so that the main surface on the operation surface 101 side of the sensor unit 16 is parallel to the operation surface 101 of the operation plate 12. Although details will be described later, the sensor unit 16 is attached to the detection plate 15 and constitutes a part of the piezoelectric sensor 100 (see FIG. 3 described later).
  • the pusher 17 is disposed between the operation plate 12 and the sensor unit 16 so as to contact the operation plate 12 and the sensor unit 16.
  • the pusher 17 is disposed at a substantially central portion of the detection plate 15 in the Y direction.
  • the pusher 17 transmits stress from the operation plate 12 to the detection plate 15 and the sensor unit 16.
  • the material of the pusher 17 is, for example, PET resin.
  • the cushion 21 is disposed between the bottom surface inside the housing 11 and the detection plate 15 so as to contact the bottom surface inside the housing 11 and the detection plate 15.
  • the cushion 21 is disposed at a substantially central portion of the detection plate 15 in the Y direction.
  • the cushion 21 is made of a material softer than the pusher 17.
  • the material of the cushion 21 is, for example, a foamable film.
  • the cushion 21 is disposed at substantially the same position as the pusher 17 when viewed from the Z direction (in plan view) and has substantially the same shape and size as the pusher 17. That is, the cushion 21 overlaps the pusher 17 when viewed from the Z direction (direction perpendicular to the main surface of the detection plate 15).
  • the cushion 21 supports the detection plate 15 and presses the detection plate 15 against the pusher 17 via the sensor unit 16. Thereby, even if the operation plate 12 is warped, the pressure applied to the pusher 12 can be reliably transmitted to the detection plate 15 without creating a gap between the operation plate 12 and the pusher 17.
  • FIG. 3 is a plan view of the piezoelectric sensor 100 shown in FIG. 4 is a cross-sectional view taken along line BB shown in FIG.
  • FIG. 5 is an exploded plan view of the sensor unit 16 of the piezoelectric sensor 100 shown in FIG.
  • FIG. 5A is a plan view of the piezoelectric film 31 of the sensor unit 16.
  • FIG. 5B is a plan view of the sensor unit 16 in a state where the substrate unit 36 and the substrate unit 37 are opened and the piezoelectric film 31 is removed.
  • the piezoelectric sensor 100 includes a detection plate 15, a sensor unit 16, a component mounting unit 38, and a circuit component 39, and is disposed inside the housing 11.
  • the component mounting unit 38 is a part of the flexible printed circuit board 30.
  • the flexible printed circuit board 30 includes a substrate unit 36 and a substrate unit 37 that constitute a part of the sensor unit 16, and a component mounting unit 38.
  • the material of the flexible printed circuit board 30 is a resin such as polyimide.
  • the first terminal 32 and the second terminal 33 which are conductor patterns are formed on the front main surface of the component mounting portion 38. Further, a circuit component 39 is surface-mounted on the front main surface of the component mounting portion 38. The circuit component 39 is connected to the first detection electrode 34 and the second detection electrode 35 via the first terminal 32 and the second terminal 33.
  • the main surface opposite to the operation surface 101 of the sensor unit 16 is attached to the main surface on the operation surface 101 side of the detection plate 15 with an adhesive layer 90 so that the longitudinal direction thereof is the Y direction.
  • the pressure-sensitive adhesive layer 90 is made of, for example, an epoxy adhesive.
  • the sensor unit 16 includes a piezoelectric film 31, an adhesive layer 91 and an adhesive layer 92, a first detection electrode 34, a second detection electrode 35, a substrate unit 36, and a substrate unit 37.
  • the flexible printed board 30 includes the board part 36 and the board part 37 that constitute a part of the sensor part 16 and the component mounting part 38.
  • the first detection electrode 34, the second detection electrode 35, the piezoelectric film 31, the substrate portion 36, and the substrate portion 37 each have a flat main surface and a back main surface that are flat and face each other in the thickness direction.
  • the upper side surface in FIG. 4 is referred to as a front main surface and the lower side surface is referred to as a back main surface.
  • the substrate portion 37, the second detection electrode 35, the adhesive layer 91, the piezoelectric film 31, the adhesive layer 92, the first detection electrode 34, and the substrate portion 36 are arranged in this order from the front main surface side. It is laminated over the back main surface side.
  • the second detection electrode 35 is laminated on the front main surface of the piezoelectric film 31 via the adhesive layer 91, and the substrate portion 37 is further laminated on the front main surface of the second detection electrode 35.
  • the first detection electrode 34 is laminated on the back main surface of the piezoelectric film 31 via the adhesive layer 92, and the substrate portion 36 is further laminated on the back main surface of the first detection electrode 34.
  • the second detection electrode 35, the first detection electrode 34, the piezoelectric film 31, the substrate portion 37, and the substrate portion 36 have a substantially rectangular outer shape in plan view.
  • the outer shapes of the substrate portion 37 and the substrate portion 36 are slightly larger than the outer shape of the piezoelectric film 31.
  • the substrate unit 36 and the substrate unit 37 are a part of the flexible printed circuit board 30.
  • a slit 18 ⁇ / b> A is provided at a position that partitions the substrate unit 37 and the substrate unit 36.
  • the slit 18A extends in parallel with the long side of the substrate part 37 (or the long side of the substrate part 36).
  • connecting portions 18B are provided on both sides of the slit 18A in the direction in which the slit 18A extends.
  • Each connecting portion 18 ⁇ / b> B connects the substrate portion 37 and the substrate portion 36. Note that the slit 18A and the two connecting portions 18B are not necessarily provided, and may have other shapes.
  • the second detection electrode 35 is formed on the back main surface of the substrate portion 37, and the first detection electrode 34 is formed on the front main surface of the substrate portion 36. That is, the first detection electrode 34 and the second detection electrode 35 are formed side by side on the same surface of the flexible printed circuit board 30.
  • the piezoelectric film 31 is stuck to the front main surface of the first detection electrode 34 with an adhesive layer 92.
  • the piezoelectric film 31 is attached to the back main surface of the second detection electrode 35 with an adhesive layer 91.
  • the pressure-sensitive adhesive layer 91 and the pressure-sensitive adhesive layer 92 may be made of a conductive pressure-sensitive adhesive.
  • one end of the first terminal 32 is connected to the first detection electrode 34.
  • the other end of the first terminal 32 is connected to the circuit component 39.
  • One end of the second terminal 33 is connected to the second detection electrode 35.
  • the other end of the second terminal 33 is connected to the circuit component 39.
  • the first detection electrode 34 and the second detection electrode 35 are electrically connected to the circuit component 39 via the first terminal 32 and the second terminal 33, respectively.
  • the piezoelectric film 31 is molecularly oriented in a direction 19 that forms about 45 ° with respect to the long and short sides.
  • the piezoelectric film 31 is a film mainly composed of L-type polylactic acid (PLLA).
  • PLLA is a chiral polymer whose main chain has a helical structure, and has a property of expressing piezoelectricity by being oriented in a predetermined axial direction.
  • This piezoelectricity is represented by a piezoelectric tensor component d 14 with the film thickness direction as the first axis and the PLLA molecule orientation direction as the third axis.
  • the piezoelectric film 31 having the piezoelectric tensor component d 14 is a direction intersecting the long sides and short sides in the front main surface and rear main surface, specifically about 45 ° direction with respect to the long sides and short sides, By setting the direction in which the PLLA molecules are oriented, the pressing force from the thickness direction can be detected.
  • the angle of the direction 19 in the piezoelectric film 31 is not limited to an accurate 45 ° with respect to the long side and the short side, and can be any angle close to 45 °. As the angle in the direction 19 is closer to 45 ° with respect to the long side and the short side, the pressing force from the thickness direction can be detected more efficiently.
  • approximately 45 ° in the present invention means an angle in a predetermined range centered on 45 °, for example, about 45 ° ⁇ 10 °. These specific angles may be appropriately determined according to the overall design based on the use of the displacement sensor, the characteristics of each part, and the like.
  • the piezoelectric film 31 is not limited to a film mainly composed of PLLA, and may be a film mainly composed of D-type polylactic acid (PDLA) or polyvinylidene fluoride (PVDF).
  • PDLA D-type polylactic acid
  • PVDF polyvinylidene fluoride
  • the piezoelectricity of the piezoelectric film 31 mainly composed of a chiral polymer such as PLLA or PDLA is not expressed by the polarization of ions like ferroelectrics such as PVDF and PZT, and is characteristic of molecules. It is derived from the spiral structure.
  • the chiral polymer does not need to exhibit piezoelectricity by poling treatment like other polymers such as PVDF and piezoelectric ceramics using a piezoelectric crystal thin film, and PVDF or the like has a piezoelectric constant over time. Although fluctuations are observed and in some cases the piezoelectric constant may be significantly reduced, the piezoelectric constant of the chiral polymer is very stable over time.
  • the piezoelectric film 31 mainly composed of a chiral polymer can obtain a detection voltage corresponding only to the pressing force without depending on the temperature at the detection position at the time of pressing detection.
  • chiral polymers are polymers and have flexibility, so they do not break with large displacements like piezoelectric ceramics. Therefore, the piezoelectric film 31 mainly composed of a chiral polymer is not damaged even if the displacement amount is large, and the displacement amount can be reliably detected.
  • FIG. 6 is a cross-sectional view when the pressing force of the main part of the display device 10 shown in FIG. 1 is detected.
  • FIG. 6 in order to demonstrate a mode that the operation board 12, the sensor part 16, and the detection board 15 bend, these bending is emphasized and shown.
  • the sensor unit 16 and the detection plate 15 of the piezoelectric sensor 100 are pressed in the thickness direction from the operation plate 12 via the pusher 17, and are bent in the thickness direction to generate charges in the piezoelectric film 31.
  • the detection voltage having a voltage value corresponding to the magnitude of the pressing force is a voltage polarity corresponding to the direction of the pressing force. It occurs in.
  • This detection voltage is input to the circuit component 39 via the first terminal 32 and the second terminal 33 as a press detection signal (see FIG. 3).
  • FIG. 7 is a flowchart showing a manufacturing method of the piezoelectric sensor 100 shown in FIG. 8 to 13 are plan views showing manufacturing steps of the piezoelectric sensor 100 shown in FIG.
  • a plurality of piezoelectric sensors 100 are manufactured in a lump.
  • a scene in which one piezoelectric sensor 100 is manufactured will be described in order to simplify the description.
  • a sheet-like flexible printed circuit board (FPC) 3 having a copper foil 50 attached to the entire main surface is prepared (S1).
  • the flexible printed circuit board 3 may be formed with copper foil on the entire main surface in order to provide the sensor unit 30 with a shield electrode layer that shields noise.
  • the shield electrode may be formed so as to sandwich the signal electrode.
  • the first detection electrode is the signal electrode and the second detection electrode is the shield electrode layer (ground electrode layer)
  • the first detection electrode is formed.
  • the first detection electrode is a shield electrode layer (ground electrode layer)
  • the second detection electrode is a signal electrode on the opposite main surface of the base material portion 36
  • the second detection electrode is formed on the base material portion 37 side.
  • a copper foil may be formed on the opposite main surface.
  • the first detection electrode is formed when the first detection electrode is a signal electrode and the second detection electrode is a shield electrode layer (ground electrode layer).
  • the shield effect can be further enhanced by forming a copper foil on the opposite main surface of the base material portion 36 and conducting the copper foil and the SUS plate with a conductive adhesive or the like.
  • a conductor pattern is formed on one main surface of the flexible printed circuit board 3 by etching or the like (S2). Accordingly, the first detection electrode 34 connected to the first terminal 32 and the second detection electrode 35 connected to the second terminal 33 are formed side by side on the same surface of the flexible printed circuit board 3.
  • the flexible printed circuit board 3 is punched with a press die to form the flexible printed circuit board 30 having the shape shown in FIG. 10 (S3).
  • the flexible printed circuit board 30 on which the first terminal 32, the second terminal 33, the slit 18A, the connecting portion 18B, the first detection electrode 34, the second detection electrode 35, the substrate portion 36, and the substrate portion 37 are formed is prepared.
  • the piezoelectric film 31 is stuck on the first detection electrode 34 of the substrate portion 36 with an adhesive (S4).
  • a plurality of minute bubbles may be generated between the first detection electrode 34 and the piezoelectric film 31.
  • a plurality of minute bubbles are easily captured in the pressure-sensitive adhesive layer 92.
  • the substrate portion 36 with the piezoelectric film 31 attached on the first detection electrode 34 is pressed using, for example, a roller press laminator device (S5).
  • the substrate portion 37 is folded, the second detection electrode 35 is attached to the piezoelectric film 31 with an adhesive, and the piezoelectric film 31 is interposed between the first detection electrode 34 and the second detection electrode 35. (S6). Since the flexible printed board 30 is flexible and can be greatly deformed, the board portion 37 is easily folded back.
  • the flexible printed circuit board 30 is folded back, the flexible printed circuit board 30 is formed with one flexible printed circuit board 30, and this manufacturing method can reduce the dimensional variation of the electrode pattern. Further, when the circuit element is mounted on the flexible printed circuit board 30, electrical connection with the circuit element is easy.
  • a plurality of minute bubbles may be generated between the second detection electrode 35 and the piezoelectric film 31. .
  • a plurality of minute bubbles are easily captured in the pressure-sensitive adhesive layers 91 and 92 (see FIG. 4).
  • the substrate part 36 and the substrate part 37 (that is, the sensor part 16) sandwiching the piezoelectric film 31 are pressed using, for example, a roller press laminator device (S7).
  • the main surface opposite to the operation surface 101 of the sensor unit 16 is attached to the main surface of the detection plate 15 on the operation surface 101 side with an adhesive (S8).
  • the sensor part 16 is affixed on the detection board 15 with an adhesive agent, and the composite_body
  • This adhesive is preferably an acrylic conductive adhesive. Note that an adhesive or pressure-sensitive adhesive having no conductivity can also be used.
  • the circuit component 39 is surface-mounted on the front main surface of the component mounting portion 38 (S9). Accordingly, the first detection electrode 34 and the second detection electrode 35 are connected to the circuit component 39 via the first terminal 32 and the second terminal 33.
  • the piezoelectric sensor 100 of the present embodiment can be manufactured through the above-described steps.
  • the substrate portion 36 and the substrate portion 37 (that is, the sensor portion 16) in a state where the piezoelectric film 31 is sandwiched are pressed.
  • a plurality of minute bubbles between the first detection electrode 34 and the piezoelectric film 31 are discharged from between the first detection electrode 34 and the piezoelectric film 31 to the second detection.
  • a plurality of minute bubbles between the electrode 35 and the piezoelectric film 31 can be discharged to the outside from between the second detection electrode 35 and the piezoelectric film 31.
  • the pressing step of S5 the substrate portion 36 in a state where the piezoelectric film 31 is stuck on the first detection electrode 34 is pressed prior to the step of S6. Thereby, the pressing step of S5 can discharge a plurality of minute bubbles between the first detection electrode 34 and the piezoelectric film 31 from between the first detection electrode 34 and the piezoelectric film 31 to the outside. .
  • this manufacturing method it is possible to further reduce a plurality of minute bubbles that prevent the piezoelectric sensor 100 from generating a sufficient voltage.
  • the piezoelectric sensor 100 manufactured by this manufacturing method the pressure can be detected with higher accuracy.
  • FIG. 14 is a flowchart showing a first modification of the manufacturing method of the piezoelectric sensor 100 shown in FIG.
  • the manufacturing method of the first modification shown in FIG. 14 is different from the manufacturing method shown in FIG. 7 in that the mounting process of the circuit component 39 shown in S9 of FIG. .
  • the manufacturing method of the 1st modification shown in FIG. 14 it carries out between S2 and S3.
  • the circuit component 39 is mounted using a reflow apparatus. Therefore, when the piezoelectric film 31 is formed of a material that is easily affected by temperature, it is preferable to perform the mounting process before the attaching process of the piezoelectric film 31.
  • FIG. 15 is a flowchart showing a second modification of the manufacturing method of the piezoelectric sensor 100 shown in FIG. 16 to 19 are plan views showing manufacturing steps of the piezoelectric sensor 100 shown in FIG.
  • the manufacturing method of the second modification shown in FIG. 15 is different from the manufacturing method of the first modification shown in FIG. 14 in that the process of S6 shown in FIG. 14 is deleted and the processes of S31 to S34 are added. . This will be described in detail below.
  • a sheet-like flexible printed board 3 having a copper foil 50 attached to the entire surface of one main surface is prepared (S1).
  • the flexible printed circuit board 3 may be formed with copper foil on the entire main surface in order to provide the sensor unit 30 with a shield electrode layer that shields noise.
  • the circuit component 39 is surface-mounted on the front main surface of the flexible printed circuit board 3 (S21).
  • the second detection electrode 35 is connected to the circuit component 39 via the second terminal 133.
  • the flexible printed circuit board 3 is punched with a press die to form a flexible printed circuit board 130 having the shape shown in FIG. 16 (S3).
  • the flexible printed circuit board 130 on which the second terminal 133, the second detection electrode 35, and the substrate unit 37 are formed is prepared.
  • the second terminal 133 includes a pad P1.
  • the piezoelectric film 31 is stuck on the second detection electrode 35 of the substrate portion 37 with an adhesive (S4).
  • a plurality of minute bubbles may be generated between the second detection electrode 35 and the piezoelectric film 31.
  • a plurality of minute bubbles are easily captured in the pressure-sensitive adhesive layer 92.
  • the substrate portion 37 with the piezoelectric film 31 attached on the second detection electrode 35 is pressed using, for example, a roller press laminator device (S5).
  • a sheet-like flexible printed board 3 having a copper foil 50 attached to the entire surface of one main surface is prepared (S31).
  • This step has the same contents as the above-described step S1.
  • a conductor pattern is formed on one main surface of the flexible printed circuit board 3 by etching or the like (S32).
  • This step has the same contents as the step S2 described above.
  • the 1st detection electrode 34 connected to the 1st terminal 132 (refer FIG. 18) is formed in the front main surface of the flexible printed circuit board 3.
  • the flexible printed circuit board 3 is punched out with a press die to form the flexible printed circuit board 230 having the shape shown in FIG. 18 (S33).
  • This step has the same contents as the step S3 described above.
  • FIG. 18 differs from FIG. 16 in that the conductor pattern is formed on the back surface of the flexible printed circuit board 230.
  • the flexible printed circuit board 230 on which the first terminal 132, the first detection electrode 34, and the substrate section 36 are formed is prepared.
  • the first terminal 132 includes a pad P2.
  • the two flexible printed boards 130 and 230 are attached with an adhesive so that the pads P1 and P2 are connected (S34).
  • the pads P1 and P2 are made conductive by conductive adhesive, solder, caulking, wire bonding, or the like.
  • the first detection electrode 34 and the second detection electrode 35 are connected to the circuit component 39 via the first terminal 132 and the second terminal 133. That is, the same sensor unit 16 as that in FIG. 12 is obtained.
  • a plurality of minute bubbles may be generated between the first detection electrode 34 and the piezoelectric film 31.
  • a plurality of minute bubbles are easily captured in the pressure-sensitive adhesive layers 91 and 92 (see FIG. 4).
  • the piezoelectric sensor 100 of the present embodiment is manufactured through the above-described steps.
  • the substrate portion 36 and the substrate portion 37 (that is, the sensor portion 16) in a state where the piezoelectric film 31 is sandwiched are pressed.
  • a plurality of minute bubbles between the first detection electrode 34 and the piezoelectric film 31 are discharged to the outside from between the first detection electrode 34 and the piezoelectric film 31, and the second detection electrode A plurality of minute bubbles between the piezoelectric film 31 and the piezoelectric film 31 can be discharged to the outside from between the second detection electrode 35 and the piezoelectric film 31.
  • the pressing step of S5 the substrate portion 36 in a state where the piezoelectric film 31 is stuck on the first detection electrode 34 is pressed prior to the step of S6. Thereby, the pressing step of S5 can discharge a plurality of minute bubbles between the first detection electrode 34 and the piezoelectric film 31 from between the first detection electrode 34 and the piezoelectric film 31 to the outside. .
  • the piezoelectric sensor 100 manufactured by the manufacturing method of the second modification it is possible to detect the press with higher accuracy.
  • the manufacturing method of the second modified example the bending of S6 in FIG. 7 is not performed. Therefore, in the manufacturing method of the second modified example, there is no portion where the electrode bends, and disconnection hardly occurs. Further, in the manufacturing method of the second modified example, there is no deformation in the restoring direction called spring back due to the reaction force generated by bending the flexible printed circuit board. Moreover, since it is difficult to automate the process of bending the flexible printed circuit board, the manufacturing method of the second modification can reduce the manufacturing cost.
  • the mounting process for mounting the circuit component 39 is performed before the attaching process of the piezoelectric film 31, but the attaching process of the piezoelectric film 31 as in the manufacturing method shown in FIG. You may go after.
  • planar shape of the piezoelectric film 31 is a rectangular shape, it is not restricted to this.
  • the planar shape of the piezoelectric film may be other planar shapes such as a square shape, a circular shape, a trapezoidal shape, a parallelogram shape, a polygonal shape of quadrilateral or more, an elliptical shape, an oval shape, or the like.
  • the material of the detection plate 15 is SUS (stainless steel), but is not limited thereto.
  • the material of the detection plate 15 may be a glass plate, for example.
  • the piezoelectric sensor 100 includes the sensor unit 16 and the detection plate 15, but is not limited thereto.
  • the sensor unit 16 may be attached to the operation plate 12 instead of the detection plate 15, and the piezoelectric sensor 100 may have the operation plate 12 instead of the detection plate 15.
  • the pusher 17 is disposed between the operation plate 12 and the sensor unit 16, but is not limited thereto. At the time of implementation, the operation plate 12 and the sensor unit 16 may be directly attached without arranging the pusher 17.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

L'invention concerne la préparation d'un substrat imprimé souple en forme de feuille (3) possédant une feuille de cuivre (50) fixée à la totalité de sa surface principale (S1). Des motifs conducteurs sont formés (S2) sur la surface principale du substrat imprimé souple (3). Le substrat imprimé souple (3) est estampé avec une matrice, et un substrat imprimé souple (30) est formé (S3). Un agent adhésif est utilisé pour fixer (S4) un film piézoélectrique (31) à la partie supérieure d'une première électrode de détection (34) d'une section substrat (36). La section substrat (36) dans un état où elle possède le film piézoélectrique (31) fixé à la partie supérieure de la première électrode de détection (34) associée est pressée (S5). Une section substrat (37) est repliée, l'agent adhésif est utilisé pour fixer une seconde électrode de détection (35) au film piézoélectrique (31), et le film piézoélectrique (31) est intercalé (S6) entre la première électrode de détection (34) et la seconde électrode de détection (35). Une unité de détection (16) dans un état dans lequel le film piézoélectrique (31) est intercalé est pressée (S7).
PCT/JP2014/083654 2013-12-24 2014-12-19 Procédé de production de capteur piézo-électrique WO2015098724A1 (fr)

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JP2017054435A (ja) * 2015-09-11 2017-03-16 株式会社村田製作所 表示装置
JP2017092208A (ja) * 2015-11-09 2017-05-25 三井化学株式会社 エネルギー変換デバイス
CN108268180A (zh) * 2018-04-11 2018-07-10 京东方科技集团股份有限公司 压力触控装置、压力触控的反馈方法、触控显示装置
JPWO2017141460A1 (ja) * 2016-02-15 2018-11-01 京セラ株式会社 圧力センサ
WO2020066936A1 (fr) * 2018-09-28 2020-04-02 日東電工株式会社 Dispositif piézoélectrique et procédé de fabrication de dispositif piézoélectrique
WO2020129346A1 (fr) * 2018-12-20 2020-06-25 株式会社村田製作所 Capteur de pression et dispositif de détection de pression
JP2021162385A (ja) * 2020-03-31 2021-10-11 豊田合成株式会社 センサユニット

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Publication number Priority date Publication date Assignee Title
JP2017054435A (ja) * 2015-09-11 2017-03-16 株式会社村田製作所 表示装置
JP2017092208A (ja) * 2015-11-09 2017-05-25 三井化学株式会社 エネルギー変換デバイス
US10859458B2 (en) 2016-02-15 2020-12-08 Kyocera Corporation Pressure sensor
JPWO2017141460A1 (ja) * 2016-02-15 2018-11-01 京セラ株式会社 圧力センサ
EP3418706A4 (fr) * 2016-02-15 2019-12-04 Kyocera Corporation Capteur de pression
CN108268180B (zh) * 2018-04-11 2020-03-10 京东方科技集团股份有限公司 压力触控装置、压力触控的反馈方法、触控显示装置
CN108268180A (zh) * 2018-04-11 2018-07-10 京东方科技集团股份有限公司 压力触控装置、压力触控的反馈方法、触控显示装置
WO2020066936A1 (fr) * 2018-09-28 2020-04-02 日東電工株式会社 Dispositif piézoélectrique et procédé de fabrication de dispositif piézoélectrique
JP2020057654A (ja) * 2018-09-28 2020-04-09 日東電工株式会社 圧電デバイス、及び圧電デバイスの製造方法
CN112740430A (zh) * 2018-09-28 2021-04-30 日东电工株式会社 压电器件及压电器件的制造方法
JP7501990B2 (ja) 2018-09-28 2024-06-18 日東電工株式会社 圧電デバイス、及び圧電デバイスの製造方法
WO2020129346A1 (fr) * 2018-12-20 2020-06-25 株式会社村田製作所 Capteur de pression et dispositif de détection de pression
JP2021162385A (ja) * 2020-03-31 2021-10-11 豊田合成株式会社 センサユニット
JP7276225B2 (ja) 2020-03-31 2023-05-18 豊田合成株式会社 センサユニット

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