WO2014083777A1 - Substrate, light emitting apparatus, lighting light source, and substrate manufacturing method - Google Patents

Abstract

A light emitting apparatus (1) is provided with: a substrate (10) having translucency; and an LED (20) mounted on a first main surface (10a) of the substrate (10). The substrate (10) has a recessed and projected portion (11) on a second main surface (10b) on the reverse side of the first main surface (10a), and the recessed and projected portion (11) is formed at a position facing the LED (20).

Description

Substrate, light emitting device, illumination light source, and method of manufacturing substrate

The present invention relates to a substrate, a light emitting device, a light source for illumination, and a method of manufacturing a substrate, and in particular, a substrate for mounting a light emitting diode (LED) and a method of manufacturing the same, and a light emitting device using the substrate. And an illumination light source and the like.

LEDs are expected as light sources (LED light sources) for various products because of their high efficiency and long life. For example, research and development of LED lamps using LEDs as light sources are underway.

Examples of the LED lamp include a bulb-shaped LED lamp (LED bulb) which substitutes for a bulb-type fluorescent lamp and an incandescent bulb, and a straight-tube-type LED lamp which substitutes for a straight-tube-type fluorescent lamp. For example, Patent Document 1 discloses a conventional bulb-shaped LED lamp. Patent Document 2 discloses a conventional straight tube type LED lamp.

For the LED lamp, an LED module (light emitting device) configured by mounting a plurality of LEDs on a substrate is used as a light source.

JP 2006-313717 A JP, 2009-043447, A

In recent years, a bulb-shaped LED lamp having a configuration in which light distribution characteristics and appearance are simulated to an incandescent bulb has been studied. For example, there has been proposed a bulb-shaped LED lamp configured to hold the LED module in a hollow state at a central position in the globe by using a globe (glass bulb) used for an incandescent lamp. More specifically, a structure is considered in which the LED module is fixed to the top of the support using a support (stem) extending from the opening of the glove toward the center of the glove. In this case, it is preferable to use a double-sided light emitting LED module that emits light to both the top side and the base side of the globe in order to bring the light distribution characteristic closer to the incandescent lamp.

One way to construct a double-sided light emitting LED module is to mount the LEDs on both sides of the substrate. Thereby, light can be emitted from the front surface and the back surface of the substrate.

However, mounting the LEDs on both sides of the substrate requires complicated manufacturing equipment, and there is a problem that the manufacturing cost becomes high. Then, the method of bonding the back surfaces of this board | substrate together is also considered using two board | substrates with which LED was mounted only in single side | surface. However, in this case, since two substrates are required, there is a problem that the material cost becomes high.

In addition, as another method of configuring a double-sided light emitting LED module, there is a method of mounting an LED only on one side of a substrate using a substrate with high light transmittance such as a transparent substrate (for example, a substantially transparent substrate). is there. In this case, the light emitted from the LED is emitted to the outside from the surface (surface) on which the LED is mounted, and is transmitted through the substrate to the outside from the surface (back surface) opposite to the surface on which the LED is mounted Released.

However, in a substrate with high light transmittance, the higher the light transmittance, the more expensive the substrate becomes. On the other hand, the lower the light transmittance, the smaller the amount of light emitted from the back surface of the substrate to the outside. There is a problem that it is not possible to obtain a great amount of light.

The present invention has been made to solve such a problem, and even when a substrate having a low light transmittance such as a white substrate is used, the light emitting element is mounted on the side opposite to the mounting surface It is an object of the present invention to provide a substrate, a light emitting device, a light source for illumination, and a method of manufacturing a substrate capable of obtaining a sufficient amount of light.

In order to achieve the above object, one aspect of a substrate according to the present invention is a substrate on which a light emitting element is mounted, and the substrate has translucency and a surface on which the light emitting element is mounted It has a concavo-convex part in the field on the opposite side, and the concavo-convex part is formed in the position which counters the light emitting element mounted.

In one aspect of the substrate according to the present invention, the substrate is a polycrystalline ceramic substrate formed by bonding a plurality of crystal grains, and the surface shape of the exposed surface of the concavo-convex portion is the surface of the plurality of crystal grains. It may be a shape.

Further, one aspect of the light emitting device according to the present invention includes a light transmitting substrate and a light emitting element mounted on the first main surface of the substrate, and the substrate is a surface on which the light emitting element is mounted. It has an uneven part in the field on the opposite side, and the uneven part is formed in the position which counters the light emitting element.

In one aspect of the light emitting device according to the present invention, the substrate is a polycrystalline ceramic substrate formed by bonding a plurality of crystal grains, and the surface shape of the uneven portion is a surface shape of the plurality of crystal grains. It may be

In one aspect of the light emitting device according to the present invention, a sealing member may be further provided which includes a wavelength conversion material and seals the light emitting element.

In one aspect of the light emitting device according to the present invention, the light emitting device may further include a wavelength conversion member that includes a wavelength conversion material and is formed so as to overlap the uneven portion.

In the light emitting device according to one aspect of the present invention, the uneven portion may be formed so as not to protrude from the wavelength conversion member.

Further, one aspect of the illumination light source according to the present invention includes the light emitting device according to any one of the above and a heat radiating body connected to the light emitting device, the heat radiating body being the above-mentioned in the substrate of the light emitting device. The semiconductor device is characterized in that it is connected to the surface opposite to the surface on which the light emitting element is mounted, and the uneven portion is not formed on the connection surface between the heat dissipating member and the substrate.

Further, in one aspect of the illumination light source according to the present invention, a globe covering the light emitting device is further provided, and the heat radiating body is provided to extend inward of the globe and supports the light emitting device. It may be a post.

Further, one aspect of a method of manufacturing a substrate according to the present invention is a method of manufacturing a substrate on which a light emitting element is mounted, wherein the substrate is a translucent polycrystalline ceramic substrate, and a predetermined region of the substrate An uneven portion is formed on the surface opposite to the surface on which the light emitting element is mounted by etching the acid with an acid.

According to the present invention, even when a substrate having a low light transmittance such as a white substrate is used, a sufficient amount of light can be obtained from the surface opposite to the surface on which the light emitting element is mounted.

Fig.1 (a) is a top view of the light-emitting device using the board | substrate which concerns on Embodiment 1 of this invention, FIG.1 (b) is the same light-emitting device in the XX 'line of FIG. 1 (a). FIG. 1 (c) is a cross-sectional view of the same light-emitting device taken along the line YY 'in FIG. 1 (a). FIG. 2 is an enlarged cross-sectional view around an LED (LED chip) in the light emitting device according to Embodiment 1 of the present invention. FIG. 3 is an enlarged sectional view of an essential part of the light emitting device according to the first embodiment of the present invention. FIG. 4A is a surface SEM image of the substrate in the case where the surface of the unbaked polycrystalline ceramic substrate is etched. FIG. 4B is a surface SEM image of the substrate in the case where the surface of the polycrystalline ceramic substrate is scraped and then etched in order to adjust the thickness. FIG. 5 is a diagram for explaining a method for measuring the transmittance of the translucent substrate. FIG. 6 is a diagram for explaining the relationship between the etching time and the light transmission amount in the polycrystalline ceramic substrate of FIG. 4A. Fig.7 (a) is a top view of the light-emitting device based on Embodiment 2 of this invention, FIG.7 (b) is sectional drawing of the same light-emitting device in the XX 'line of FIG. 7 (a). FIG. 7C is a cross-sectional view of the same light-emitting device taken along line YY ′ of FIG. 7A. FIG. 8 is a cross-sectional view of a light emitting device according to a modification of the second embodiment of the present invention. FIG. 9 is a cross-sectional view of a light bulb-shaped LED lamp according to Embodiment 3 of the present invention. Fig.10 (a) is a top view of the light-emitting device based on Embodiment 3 of this invention, FIG.10 (b) is sectional drawing of the same light-emitting device in the XX 'line of FIG. 10 (a). 10 (c) is a cross-sectional view of the light emitting device taken along line YY 'in FIG. 10 (a), and FIG. 10 (d) is taken along the line ZZ' in FIG. 10 (a). It is sectional drawing of a light-emitting device. FIG. 11 is a cross-sectional view of a lighting device according to Embodiment 4 of the present invention.

Hereinafter, a substrate, a light emitting device, a light source for illumination, a method of manufacturing the substrate, and the like according to the embodiment of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a preferable specific example of the present invention. Therefore, numerical values, shapes, materials, components, arrangement positions and connection forms of the components, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims indicating the highest concept of the present invention are described as optional components.

Each drawing is a schematic view and is not necessarily strictly illustrated. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member.

Embodiment 1
Hereinafter, the configurations of the substrate 10 and the light emitting device 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a view showing a configuration of a light emitting device using a substrate according to Embodiment 1 of the present invention, FIG. 1 (a) is a plan view, and FIG. 1 (b) is an X-- FIG. FIG. 1 (c) is a cross-sectional view taken along line YY ′ of FIG. 1 (a). FIG. 2 is an enlarged cross-sectional view around an LED (LED chip) in the light emitting device according to Embodiment 1 of the present invention.

The light emitting device 1 in the present embodiment is a light emitting module having a light emitting element, and emits light of a predetermined color (wavelength). The light emitting device 1 in the present embodiment is an LED module configured by LEDs.

As shown in FIGS. 1A to 1C, the light emitting device 1 includes a substrate 10 and an LED 20. The light emitting device 1 further includes a sealing member 30, a metal wire 40, a wire 50, and terminals 60a and 60b. The light emitting device 1 in the present embodiment has a COB (Chip On Board) structure in which a bare chip is directly mounted on the substrate 10.

Hereinafter, each component of the light emitting device 1 will be described in detail.

(substrate)
The substrate 10 is a light emitting element mounting substrate for mounting a light emitting element, and the first main surface 10 a (front side), which is a surface on which the LED 20 is mounted, and the surface facing the first main surface 10 a And a second main surface 10b (back side). As shown in FIG. 1A, for example, a rectangular substrate having a rectangular plan view can be used as the substrate 10. In addition, as a planar view shape of the board | substrate 10, not only a rectangle but the thing of other shapes, such as a square or a circle, can also be used.

The substrate 10 is a light transmitting substrate having light transmitting property. The substrate 10 in the present embodiment is a substrate having a low light transmittance with respect to light emitted from the LED 20, for example, a substrate having a total transmittance of 10% or less. As such a substrate 10, a white alumina substrate made of ceramic such as alumina or a resin substrate made of resin such as glass epoxy resin can be used.

In the present embodiment, a polycrystalline alumina substrate (polycrystalline ceramic substrate) having a thickness of about 1 mm and configured by firing alumina particles (ceramic particles) is used as the substrate 10. For example, a white alumina substrate having a thickness of 1 mm and a light reflectance of 94%, or a white alumina substrate having a thickness of 0.635 mm and a light reflectance of 88% can be used.

Thus, by using a substrate having a low light transmittance as the substrate 10, the cost of the substrate can be suppressed. In particular, cost reduction can be realized by using an inexpensive white substrate among ceramic substrates.

The ceramic substrate can be prepared by adding a binder to a mixture of ceramic raw materials such as alumina particles and the like and a scatterer and a sintering aid (additive), followed by pressure forming, and then firing. The raw material alumina particles (ceramic particles) grow and crystallize by firing to form alumina crystal grains having a particle diameter of several micrometers to several tens of micrometers.

Further, as shown in FIGS. 1 (b) and 1 (c), the substrate 10 has an uneven portion 11 on the second major surface 10b. The uneven portion 11 is a minute uneven structure, and is formed at a position facing at least the LED 20. The uneven portion 11 in the present embodiment is formed corresponding to the region where the sealing member 30 is formed, and the region where the uneven portion 11 is formed and the region where the sealing member 30 is formed are the same. ing. That is, the four concavo-convex portions 11 are formed in a long line along the longitudinal direction of the substrate 10.

(LED)
The LED 20 is an example of a light emitting element, and is a semiconductor light emitting element that emits light with a predetermined power. The plurality of LEDs 20 are all the same, and are all bare chips that emit monochromatic visible light. In this embodiment, a blue light emitting LED chip that emits blue light when energized is used. As the blue LED chip, for example, a gallium nitride-based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.

The LEDs 20 are mounted only on the first major surface 10 a of the substrate 10, and a plurality of the LEDs 20 are mounted in a plurality of rows along the long side direction of the substrate 10. In the present embodiment, four rows of elements are arranged in parallel so that an element row in which a plurality of LEDs 20 are in one row is in parallel.

In the present embodiment, the plurality of LEDs 20 are mounted, but the number of mounted LEDs 20 may be changed as appropriate according to the application of the light emitting device 1. For example, in the case of using for a low power type LED lamp replacing a miniature bulb etc., the number of LEDs 20 may be one. On the other hand, when using for a high output type LED lamp, you may further increase the number of mounting of LED20 in one element row. Further, the number of element rows of the LED 20 is not limited to four, and may be one to three, or five or more.

Here, the LED 20 used in the present embodiment will be described with reference to FIG. FIG. 2 is an enlarged cross-sectional view around an LED (LED chip) in the light emitting device according to Embodiment 1 of the present invention.

As shown in FIG. 2, the LED 20 includes a sapphire substrate 21 and a plurality of nitride semiconductor layers 22 stacked on the sapphire substrate 21 and having different compositions.

A cathode electrode 23 and an anode electrode 24 are provided at both ends of the upper surface of the nitride semiconductor layer 22. Further, wire bonding portions 25 and 26 are provided on the cathode electrode 23 and the anode electrode 24, respectively.

In the LED 20 adjacent to each other, the cathode electrode 23 of one LED 20 and the anode electrode 24 of the other LED 20 are connected by wire bonding with the metal wiring 40 by the wire 50. The electrodes of the adjacent LEDs 20 may be directly connected by the wire 50 without the metal wiring 40. That is, a chip-to-chip connection may be used.

Each LED 20 is mounted on the substrate 10 with a translucent chip bonding material 27 so that the surface on the sapphire substrate 21 side faces the first major surface 10 a of the substrate 10. For the chip bonding material 27, a silicone resin containing a filler made of metal oxide can be used. By using a translucent material for the chip bonding material 27, the loss of light emitted from the side surface of the LED 20 can be reduced, and the generation of a shadow by the chip bonding material 27 can be suppressed.

(Sealing member)
The sealing member 30 is made of, for example, a resin, and is formed on the substrate 10 so as to cover the LED 20. As shown in FIG. 1A and FIG. 1B, the sealing member 30 is formed in a long shape so as to collectively seal one row of the plurality of LEDs 20. In the present embodiment, since the element rows of the LEDs 20 are mounted in four rows, four sealing members 30 are formed. Each of the four sealing members 30 is provided linearly on the first major surface 10 a of the substrate 10 along the arranging direction (row direction) of the plurality of LEDs 20.

The sealing member 30 is mainly made of a translucent material, but if it is necessary to convert the wavelength of the light of the LED 20 to a predetermined wavelength, a wavelength conversion material is mixed in the translucent material.

The sealing member 30 in the present embodiment is a wavelength conversion member that contains a phosphor as a wavelength conversion material and converts the wavelength (color) of light emitted by the LED 20. Such a sealing member 30 can be made of, for example, an insulating resin material (phosphor-containing resin) containing phosphor particles. The phosphor particles are excited by the light emitted by the LED 20 to emit light of a desired color (wavelength).

For example, a silicone resin can be used as the resin material constituting the sealing member 30. Further, the light diffusion material may be dispersed in the sealing member 30. The sealing member 30 is not necessarily formed of a resin material, and may be formed of an inorganic material such as a low melting point glass or a sol-gel glass besides an organic material such as a fluorine resin.

For example, when the LED 20 is a blue LED emitting blue light, yellow phosphor particles of YAG type can be used as the phosphor particles contained in the sealing member 30 in order to obtain white light. Thereby, part of the blue light emitted by the LED 20 is wavelength-converted to yellow light by the yellow phosphor particles contained in the sealing member 30. Then, the blue light not absorbed by the yellow phosphor particles and the yellow light whose wavelength is converted by the yellow phosphor particles are diffused and mixed in the sealing member 30 so that the white light from the sealing member 30 It will be emitted. Further, as the light diffusing material, particles such as silica are used.

The sealing member 30 in the present embodiment is a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin, and is formed by applying and curing the first major surface 10 a of the substrate 10 by a dispenser. be able to. In this case, as shown in FIG. 1C, the shape in a cross section perpendicular to the longitudinal direction of the sealing member 30 is substantially semicircular.

The sealing member 30 may be formed so as not to be linear but to be rectangular in plan view. In this case, the sealing member 30 may be formed, for example, to seal all the LEDs 20 on the substrate 10 at one time. Alternatively, the sealing member 30 may be formed to cover each of the LEDs 20 individually. In this case, the sealing member 30 can be formed, for example, in a substantially hemispherical shape.

(Metal wiring)
The metal wiring 40 is a conductive wiring through which a current for making the LED 20 emit light, and is pattern-formed in a predetermined shape on the first major surface 10 a of the substrate 10 as shown in FIG. 1A. Electric power supplied to the light emitting device 1 is supplied to each LED 20 by the metal wiring 40.

The metal wiring 40 is formed to connect the plurality of LEDs 20 in each LED element row in series. For example, the metal wiring 40 is formed in an island shape between adjacent LEDs. The metal wires 40 are formed to connect the element rows in parallel. Each LED 20 is electrically connected to the metal wiring 40 via the wire 50.

The metal wiring 40 can be formed, for example, by patterning or printing a metal film made of a metal material. As a metal material of the metal wiring 40, silver (Ag), tungsten (W), copper (Cu) etc. can be used, for example. The surface of the metal wire 40 may be plated with nickel (Ni) / gold (Au) or the like.

The metal wires 40 exposed from the sealing member 30 are preferably covered with a glass film (glass coat film) of a glass material or a resin film (resin coat film) of a resin material except for the terminals 60a and 60b. . Thereby, the insulation in the light emitting device 1 can be improved, and the reflectance of the surface of the substrate 10 can be improved.

(wire)
The wire 50 is a conductive wire such as a gold wire, for example. As shown in FIG. 1 (b), the wire 50 connects the LED 20 and the metal wiring 40. As described in FIG. 2, the wire bonding portion 25 (or the cathode electrode 23 (or the anode electrode 24) provided on the upper surface of the LED 20 and the metal wiring 40 formed adjacent to both sides of the LED 20 by the wire 50. 26) through wire bonding.

As in the present embodiment, the wire 50 is entirely embedded in the sealing member 30 so as not to be exposed from the sealing member 30.

(Terminal)
The terminals 60 a and 60 b are external connection terminals for receiving DC power for causing the LED 20 to emit light from the outside of the light emitting device 1. The terminals 60 a and 60 b are power feeding parts of the light emitting device 1, and the DC power received by the terminals 60 a and 60 b is supplied to the respective LEDs 20 via the metal wiring 40 and the wire 50.

The terminals 60 a and 60 b are formed on the first major surface 10 a of the substrate 10 in a predetermined shape. Specifically, the terminals 60 a and 60 b are formed continuously with the metal wire 40 and are electrically connected to the metal wire 40. Therefore, the terminals 60 a and 60 b can be simultaneously patterned with the metal wire 40 using the same metal material as the metal wire 40.

(Features of the present invention)
The light emitting device 1 configured as described above includes the substrate 10 on which the uneven portion 11 is formed. The concavo-convex portion 11 is a concavo-convex structure directly formed on the substrate 10, and is constituted by innumerable concave and convex portions formed on the surface of the second major surface 10b of the substrate 10.

The uneven portion 11 in the present embodiment is formed in accordance with the shape of the ceramic crystal grains constituting the ceramic substrate. Hereinafter, this point will be described in detail with reference to FIG. FIG. 3 is an enlarged cross-sectional view of an essential part of the light emitting device according to the first embodiment of the present invention, and schematically showing the cross-sectional configuration of the ceramic substrate.

As shown in FIG. 3, in the substrate 10 which is a polycrystalline ceramic substrate (ceramic sintered substrate), a plurality of ceramic crystal grains (sintered particles) 11a serving as a matrix are connected to adjacent ceramic crystal grains 11a. And the binder 11b. For example, when the substrate 10 is a polycrystalline alumina substrate, the ceramic crystal grains 11a are alumina crystal grains, and the binder 11b is an inorganic material such as a glass material.

In the present embodiment, the surface shape (concave / convex shape) of the concavo-convex portion 11 is the surface shape of the exposed ceramic crystal grain 11a as shown in FIG. That is, the surface shape of the concavo-convex portion 11 is a shape along the unevenness of the plurality of exposed ceramic crystal grains 11 a.

The uneven portion 11 having a minute uneven structure configured in this manner can be formed, for example, by using a polycrystalline ceramic substrate as the substrate 10 and performing surface treatment on the polycrystalline ceramic substrate with an acid.

Specifically, the surface of the second major surface 10b of the substrate 10 (polycrystalline ceramic substrate) is etched with an acid such as hot sulfuric acid. Thereby, the binder 11b in the vicinity of the surface of the second major surface 10b of the substrate 10 is dissolved, and the interface portion of the ceramic crystal grain 11a in which the binder 11b was present appears as a groove (concave portion). That is, before the surface treatment with an acid, the ceramic crystal grains 11a and the binder 11b are exposed on the surface of the substrate 10 (polycrystalline ceramic substrate), but the surface treatment with an acid exposes the surface Binder 11b selectively dissolves. Thereby, the recess can be formed on the surface of the substrate 10. As a result, ceramic crystal grains 11 a appear as protrusions on the surface of the substrate 10. Thus, the uneven portion 11 is formed on the surface of the substrate 10.

Moreover, when forming the uneven part 11 in the predetermined area | region of a part of surface of the board | substrate 10, after performing masking to the area | region which does not form the uneven part 11 among the surfaces of the board | substrate 10, the etching process by an acid is performed. In the present embodiment, as shown in FIG. 3, since the concavo-convex portion 11 is formed at a position facing the sealing member 30 on the second main surface 10 b of the substrate 10, the sealing member 30 on the second main surface 10 b The etching process is performed after masking other than the opposite position. Thereby, the uneven part 11 can be formed only in the position which opposes the sealing member 30 in 2nd main surface 10b.

In addition, the uneven part 11 can be formed also by methods other than surface treatment by an acid. For example, the uneven portion 11 can be formed by polishing the surface of the substrate 10 using a polishing means such as sand paper. In this case, it is preferable to clean the polished surface. Alternatively, the uneven portion 11 can be formed by sandblasting the surface of the substrate 10.

Further, as another method of forming the concavo-convex portion 11 on the substrate 10, it is possible to produce a polycrystalline ceramic substrate having the concavo-convex portion 11 by forming the concavo-convex portion at the stage of the mold before firing and then firing. is there. However, if the concavo-convex part is formed in the mold stage, the thermal contraction rate differs between the part where the concavo-convex part is present and the part where the concavo-convex part is not present when firing. As a result, the mounting of the LED 20 may be difficult. Therefore, in order to form the concavo-convex part 11 in the polycrystalline ceramic substrate, it is preferable to form the concavo-convex part 11 after producing a polycrystalline ceramic substrate having flat surfaces on both sides.

In addition, even when a resin substrate is used as the substrate 10, the concavo-convex portion 11 can be formed by forming the concave portion on the second major surface 10b.

And in this embodiment, concavo-convex part 11 is formed in a position which counters LED20 in the 2nd principal surface 10b of substrate 10. Thereby, compared with the case where the uneven part 11 is not formed, the extraction amount of the light which goes to the 2nd main surface 10b among the lights which LED20 mounted in 1st main surface 10a emits can be made to increase. This point is briefly described below.

The LED 20 mounted on the first major surface 10 a emits light in all directions around the LED 20. Therefore, when the substrate 10 has translucency, the light of the LED 20 enters the substrate 10 from the first major surface 10a, passes through the substrate 10, and travels toward the second major surface 10b. In this case, even when the light reflectance of the substrate 10 is 80% or more and the light transmittance is low, the light of the LED 20 is transmitted as leak light through the substrate 10 and emitted from the second major surface 10b to the outside. .

At this time, if the second major surface 10b is a flat surface without forming the concavo-convex portion 11, the light traveling in the substrate 10 toward the second major surface 10b is oblique to the second major surface 10b. A part of the light incident from the point is reflected by the second major surface 10 b and is not extracted to the outside of the substrate 10. For example, light totally reflected by the second major surface 10 b is not extracted to the outside of the substrate 10.

On the other hand, when the concavo-convex portion 11 is formed, light obliquely incident on the second major surface 10 b is easily extracted to the outside through the concavo-convex structure of the concavo-convex portion 11. As a result, in the region where the concavo-convex portion 11 is formed, the light extraction amount can be increased as compared with the region where the concavo-convex portion 11 is not formed.

Thus, when the concavo-convex portion 11 is provided on the second major surface 10 b of the substrate 10, light transmitted through the inside of the substrate 10 and taken out from the second major surface 10 b as compared with the case where the concavo-convex portion 11 is not provided. Rate can be increased.

Therefore, even if the configuration is such that the LED 20 is disposed only on the first major surface 10 a using the white substrate having translucency as the substrate 10, the uneven portion 11 is formed at the position facing the LED 20. The amount of light transmission from the two major surfaces 10b can be increased.

Here, the structure of the concavo-convex portion 11 actually formed will be described with reference to FIGS. 4A and 4B. FIG. 4A is a surface SEM image of the substrate in the case where the surface of the unbaked polycrystalline ceramic substrate is etched. Moreover, FIG. 4B is a surface SEM image of the substrate in the case where the surface of the polycrystalline ceramic substrate is scraped and then subjected to etching processing in order to adjust the thickness. In each of FIGS. 4A and 4B, an alumina substrate having a thickness of 1 mm was used as the polycrystalline ceramic substrate, and hot sulfuric acid was used as the etching solution.

As shown in FIGS. 4A and 4B, in any case, the binder between the alumina crystal grains is dissolved, and a concavo-convex portion along the surface shape of the alumina crystal grains is formed on the surface of the polycrystalline ceramic substrate. Know that

Moreover, the transmittance | permeability was measured about the polycrystalline ceramic substrate of FIG. 4A and 4B. In addition, the measurement of the transmittance | permeability was performed by the method shown in FIG. FIG. 5 is a diagram for explaining a method for measuring the transmittance of the translucent substrate.

As shown in FIG. 5, the surface of a polycrystalline ceramic substrate to be measured is irradiated with reference blue light through a slit, and light transmitted through the polycrystalline ceramic substrate by a detector (integrating sphere + spectrometer) Amount of light (light transmission amount) was measured.

As a result, it was confirmed that the light transmission amount was increased in any of the polycrystalline ceramic substrates of FIGS. 4A and 4B as compared with the case where the concavo-convex portion was not formed.

Further, when comparing the polycrystalline ceramic substrate of FIG. 4A and the polycrystalline ceramic substrate of FIG. 4B, the polycrystalline ceramic substrate of FIG. It can be seen that a deeper recess is formed than the polycrystalline ceramic substrate.

Therefore, FIG. 4A (when the unbaked polycrystalline ceramic substrate is etched) has a greater amount of etching depending on the etching time than FIG. 4B (when the surface of the polycrystalline ceramic substrate is etched and then etched). Since it is easy to control, the desired uneven portion 11 can be formed. As a result, the polycrystalline ceramic substrate of FIG. 4A is easier to control the amount of light transmission depending on the etching time than the polycrystalline ceramic substrate of FIG. 4B.

Here, the relationship between the etching time and the light transmission amount in the polycrystalline ceramic substrate of FIG. 4A will be described with reference to FIG. FIG. 6 is a diagram for explaining the relationship between the etching time and the light transmission amount in the polycrystalline ceramic substrate of FIG. 4A. In FIG. 6, the horizontal axis represents the etching time, and the vertical axis represents the light output ratio with respect to the light transmission amount (output of light passing through the back surface) of the polycrystalline ceramic substrate at the initial stage (before processing) before etching. ing.

As shown in FIG. 6, when the polycrystalline ceramic substrate (alumina substrate) was etched by thermal sulfuric acid for 2 hours, the amount of light transmission was increased by 6% as compared to the polycrystalline ceramic substrate without etching (initial). Similarly, when etching was performed for 4 hours and 12 hours, the amount of light transmission increased by 12% and 56%, respectively. Thus, it can be seen that the light transmission amount is increased by prolonging the etching time. The thickness itself of the polycrystalline ceramic substrate did not change even if the etching time was increased. This is because the substance dissolved by etching is mainly the binder, not the base alumina crystal grains.

As mentioned above, according to the board | substrate 10 which concerns on this Embodiment, the uneven | corrugated | grooved part 11 is formed in the position which opposes LED20 in 2nd main surface 10b. As a result, even when the LED 20 is disposed only on one side of the first major surface 10 a, the amount of light transmission from the second major surface 10 b can be increased by the uneven portion 11. Thus, not only light can be emitted from the first major surface 10a, but also a sufficient amount of light can be emitted from the second major surface 10b. Therefore, a double-sided light emitting device (LED module) can be realized using a low cost white substrate.

Further, in the present embodiment, the uneven portion 11 is formed by surface-treating the polycrystalline ceramic substrate with an acid. As described above, by using the polycrystalline ceramic substrate as the substrate 10, the uneven portion 11 can be formed by a simple method.

Second Embodiment
Next, a light emitting device 2 according to Embodiment 2 of the present invention will be described using FIG. FIG. 7 is a view showing the configuration of the light emitting device according to the second embodiment of the present invention, and FIG. 7 (a) is a plan view, and FIG. 7 (b) is a line XX ′ in FIG. 7 (a). FIG. 7 (c) is a cross-sectional view taken along the line YY 'in FIG. 7 (a).

As shown in FIGS. 7 (a) to 7 (c), the light emitting device 2 in the present embodiment further includes a wavelength conversion member 70 (second wavelength conversion member) in addition to the light emitting device 1 shown in FIG. Equipped with

The wavelength conversion member 70 is formed on the second main surface 10 b of the substrate 10 at a position facing the LED 20. Since the concavo-convex portion 11 is formed at a position facing the LED 20, the wavelength conversion member 70 is formed to overlap the concavo-convex portion 11 in a plan view of the substrate 10. In the present embodiment, the wavelength conversion member 70 is formed at a position facing the sealing member 30 via the substrate 10. That is, four wavelength conversion members 70 are formed in a long shape.

The wavelength conversion member 70 contains a wavelength conversion material such as a phosphor, and converts the wavelength (color) of the light of the LED 20 that has been transmitted through the substrate 10. The wavelength conversion member 70 in the present embodiment is the same material as the sealing member 30, and is, for example, a phosphor-containing resin in which yellow phosphor particles for converting blue light into yellow light are dispersed in silicone resin. In this case, the wavelength conversion member 70 can be formed by application using a dispenser, as with the sealing member 30.

As described above, in the present modification, the wavelength conversion member 70 is formed at the position facing the LED 20 (the region where the concavo-convex portion 11 is formed), so the substrate 10 is transmitted and emitted from the second major surface 10b. The light of the LED 20 is converted to a predetermined wavelength. In the present embodiment, the LED 20 emits blue light, and the wavelength conversion member 70 wavelength converts blue light to yellow light. Thus, part of the blue light transmitted through the substrate 10 and emitted from the second major surface 10b is wavelength-converted to yellow light by the wavelength conversion member 70 and is not wavelength-converted by the yellow light and the wavelength conversion member 70. The blue light is mixed and emitted from the wavelength conversion member 70 as white light. Therefore, a light emitting device capable of emitting white light from both sides can be realized.

Moreover, since the wavelength conversion member 70 is formed so as to overlap with the concavo-convex portion 11 which increases the light transmission amount, it is possible to increase the light quantity of white light emitted from the second major surface 10b toward the outside. .

In addition, when the concavo-convex portion 11 is formed to protrude from the wavelength conversion member 70, the light from the concavo-convex portion 11 that has protruded is not subjected to color conversion, and the light transmission amount becomes large. As a result, color unevenness occurs. Therefore, it is preferable that the uneven portion 11 be formed so as not to protrude from the wavelength conversion member 70. That is, it is preferable to form the wavelength conversion member 70 so as to cover the uneven portion 11, and it is preferable to make the area in which the uneven portion 11 is formed the same as the area in which the wavelength conversion member 70 is formed.

In this modification, although fluorescent substance containing resin was used as wavelength conversion member 70, it does not restrict to this. For example, the wavelength conversion member 70 may be a phosphor film (phosphor layer) which is a sintered body of phosphor particles and an inorganic binder (binder) such as glass.

(Modification of Embodiment 2)
Next, a light emitting device 2A according to a modification of the second embodiment of the present invention will be described with reference to FIG. FIG. 8 is a cross-sectional view showing a configuration of a light emitting device according to a modification of the second embodiment of the present invention. 8 corresponds to the cross-sectional view of FIG. 7 (c).

The light emitting device 2A in this modification is a device in which the width of the wavelength conversion member 70 in the light emitting device 2 of the second embodiment is increased.

Specifically, as shown in FIG. 8, in the light emitting device 2A in the present modification, the length in the width direction orthogonal to the thickness direction of the substrate 10 in the wavelength conversion member 70A (in the present modification, the width of the substrate 10 The length in the direction) is longer than the length in the same width direction of the sealing member 30.

Thus, by making the length in the width direction of the wavelength conversion member 70A longer than the length in the width direction of the sealing member 30, the light (blue light) of the LED 20 which spreads and travels in the substrate 10 is the wavelength as it is Leakage from the second major surface 10 b of the substrate 10 can be suppressed without being converted.

Further, as the width of the wavelength conversion member 70A is increased, it is preferable to increase the area in which the concavo-convex portion 11 is formed. For example, as in the second embodiment described above, the area in which the concavo-convex portion 11 is formed is It is good to make it the same as the field in which wavelength conversion member 70A was formed.

Third Embodiment
Next, the illumination light source according to Embodiment 3 of the present invention will be described. In the present embodiment, a bulb-shaped LED lamp (LED bulb) 100 will be described as an example of a light source for illumination.

FIG. 9 is a cross-sectional view of a light bulb-shaped LED lamp according to Embodiment 3 of the present invention. In FIG. 9, the alternate long and short dash line drawn along the vertical direction of the drawing shows the lamp axis J (central axis) of the light bulb shaped lamp 100, and in the present embodiment, the lamp axis J is identical to the glove axis. I do. Further, the lamp axis J is an axis serving as a rotation center when attaching the light bulb shaped lamp 100 to a socket of a lighting device (not shown), and coincides with the rotation axis of the base 180. Further, in FIG. 9, the drive circuit 140 is shown not in cross section but in side view.

As shown in FIG. 9, the light bulb shaped lamp 100 according to the present embodiment is a light bulb shaped LED lamp which is a substitute for a light bulb shaped fluorescent lamp or an incandescent lamp, and comprises a light emitting device (LED module) 110 as a light source. A globe 120, a support member 130 for supporting the light emitting device 110, a drive circuit 140 for emitting light from the light emitting device 1, a circuit case 150 configured to surround the drive circuit 140, and the circuit case 150. And a second casing 170 configured to surround the first casing 160 and forming an outer shell, a cap 180 for receiving power from the outside, and a screw 190.

In the light bulb shaped lamp 100, an envelope is constituted by the globe 120, the second housing 170 and the base 180. That is, the globe 120, the second housing 170, and the base 180 are exposed to the outside, and the respective outer surfaces are exposed to the outside air (the atmosphere).

Hereinafter, each component of the light bulb shaped lamp 100 according to the present embodiment will be described in detail with reference to FIG.

(Light-emitting device)
The light emitting device 110 is a double-sided light emitting LED module. As shown in FIG. 9, the light emitting device 110 is disposed inward of the globe 120, and is located at the central position of the spherical shape formed by the globe 120 (e.g., inside the large diameter portion of the large diameter of the globe 120). It is preferred to be arranged. As described above, by arranging the light emitting device 110 at the center position of the globe 120, it is possible to realize light distribution characteristics similar to an incandescent lamp using a conventional filament coil.

The light emitting device 110 is held in the hollow of the globe 120 by the support member 130, and emits light by the power supplied from the drive circuit 140 through the lead wires 143a and 43b.

Here, each component of the light emitting device 110 according to the present embodiment will be described with reference to FIG. FIG. 10 is a diagram showing the configuration of the light emitting device according to the third embodiment of the present invention, and FIG. 10 (a) is a plan view, and FIG. 10 (b) is an XX ′ line in FIG. 10 (a). 10 (c) is a cross-sectional view taken along line YY 'in FIG. 10 (a), and FIG. 10 (d) is a cross-sectional view taken along line ZZ' in FIG. 10 (a).

As shown in FIGS. 10 (a) to 10 (d), the light emitting device 110 in the present embodiment is different from the light emitting device 1 shown in FIG. 1 in the substrate 10 through the through holes 80a, 80b and 81. The structure is provided with

The through holes 80a and 80b are configured to electrically connect the light emitting device 110 to the two lead wires 143a and 143b. As shown in FIG. 9, the lead wire 143a (143b) has its tip end inserted through the through hole 80a (80b) and soldered to the terminal 60a (60b) of the substrate 10. Also, the through hole 81 is configured to be fitted with the convex portion 131 a provided on the top of the support member 130. The light emitting device 110 and the support member 130 are connected by fitting the convex portion 131 a to the through hole 81.

Then, as shown in FIG. 10A, in the present embodiment, at least a connection surface (contact surface) that is a connection portion (contact portion) between the substrate 10 of the light emitting device 110 and the top of the support 131 of the support member 130. 10A, that is, in the area surrounded by the broken line in FIG. 10A, the uneven portion 11 is not formed. Thereby, the thermal contact between the light emitting device 110 and the support member 130 which is the heat dissipating member can be improved.

(Glove)
Returning to FIG. 9, the globe 120 is a substantially hemispherical translucent cover for extracting the light emitted from the light emitting device 110 to the outside of the lamp. The globe 120 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the light emitting device 110 housed in the glove 120 can be viewed from the outside of the glove 120.

The light emitting device 110 is covered by a globe 120. Thereby, the light of the light emitting device 110 that has entered the inner surface of the globe 120 is transmitted through the globe 120 and extracted to the outside of the globe 120. In the present embodiment, the globe 120 is configured to house the light emitting device 110.

The shape of the globe 120 is a shape in which one end is closed spherically and the other end has an opening 121. Specifically, the shape of the globe 120 is such that a part of a hollow sphere is narrowed while extending in a direction away from the center of the sphere, and the opening 121 is located at a position away from the center of the sphere. It is formed. As the globe 120 having such a shape, a glass bulb having the same shape as a general bulb fluorescent lamp or an incandescent bulb can be used. For example, as the globe 120, a glass bulb such as A-shaped, G-shaped or E-shaped can be used.

Also, the opening 121 of the glove 120 is located between the support member 130 and the second housing 170. In this state, the glove 120 is fixed by applying an adhesive such as silicone resin between the support member 130 and the second housing 170.

The globe 120 does not necessarily have to be transparent to visible light, and the globe 120 may have a light diffusing function. For example, a milky white light diffusion film can be formed by applying a resin containing a light diffusion material such as silica or calcium carbonate, a white pigment, or the like on the entire inner surface or outer surface of the glove 120. As described above, by providing the light diffusion function to the globe 120, light incident from the light emitting device 110 to the globe 120 can be diffused, so that the light distribution angle of the lamp can be expanded.

Further, the shape of the globe 120 is not limited to the A-shape or the like, and may be a spheroid or a spheroid. The material of the glove 120 is not limited to the glass material, and a resin such as acrylic (PMMA) or polycarbonate (PC) may be used.

(Supporting member)
The support member 130 is a support for supporting the light emitting device 110, and the light emitting device 110 is attached to the support member 130. The support member 130 can be made of metal or resin. When the support member 130 is made of resin, it can be made of a colored resin material such as white or the like, or can be made of a light-transmitting resin material.

The support member 130 also functions as a heat dissipating member (heat sink) for dissipating the heat generated in the light emitting device 110 (LED 20). Therefore, the support member 130 is preferably made of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe) or the like, or a resin material having a high thermal conductivity. Thus, the heat generated in the light emitting device 110 can be efficiently conducted to the first housing 160 through the support member 130.

The support member 130 is mainly composed of a support column 131 located inside the glove 120 and a pedestal 132 mainly surrounded by the first housing 160. In the present embodiment, each of the columns 131 and the pedestals 132 is formed using aluminum.

The post 131 is provided to extend from the vicinity of the opening 121 of the glove 120 toward the inside of the glove 120. The post 131 functions as a holding member for holding the light emitting device 110. As described above, by providing the light emitting device 110 on the pillars 131 extending inward of the globe 120, the light distribution characteristic of a wide light distribution angle can be realized, and thus the light distribution characteristic similar to that of the incandescent bulb You can get

Further, one end of the support 131 is connected to the light emitting device 110, and the other end of the support 131 is connected to the pedestal 132.

A fixing surface for fixing the substrate 10 of the light emitting device 110 is formed on the top of the support column 131, and the fixing surface is a contact surface in contact with the back surface of the substrate 10. The light emitting device 110 is, for example, mounted on a fixed surface and bonded to the fixed surface by an adhesive or the like. In the present embodiment, on the top of the support column 131, a protrusion 131a that protrudes from the fixing surface is provided. The convex portion 131 a is configured to be fitted with the through hole 81 (see FIG. 10A) provided in the substrate 10 of the light emitting device 110. The convex portion 131a functions as a position restricting portion that restricts the position of the light emitting device 110, and is configured to have a rectangular shape in plan view.

The pedestal 132 is a member for supporting the support column 131, and is configured to close the opening 121 of the glove 120. The pedestal 132 is a disk-like member having a stepped portion, and includes a small diameter portion 132a having a small diameter and a large diameter portion 132b having a large diameter. The difference in diameter between the small diameter portion 132a and the large diameter portion 132b constitutes a step portion of the pedestal 132, and the opening portion 121 of the globe 120 is in contact with the step portion (upper surface of the large diameter portion 132b). Thereby, the opening 121 of the glove 120 is closed.

Further, in a state where the opening 121 of the glove 120 is sandwiched between the support member 130 and the opening end of the first housing 160 at the step portion of the pedestal 132, silicone resin or the like may be formed around these. By applying an adhesive (not shown), the support member 130, the first housing 160, and the opening 121 of the glove 120 can be fixed.

The small diameter portion 132 a is a disk-shaped portion of the pedestal 132, and is configured to support the column 131 and to close the opening 121 of the glove 120. The post 131 is disposed at the center of the small diameter portion 132a. The small diameter portion 132a is provided with two through holes for inserting the lead wires 143a and 143b.

The large diameter portion (fin) 32 b is a portion to be fitted to the first housing 160, and the support member 130 contacts the outer circumferential surface of the large diameter portion 132 b with the inner circumferential surface of the first housing 160. Connected to body 160. Thereby, the heat of the support member 130 (the pedestal 132) can be efficiently conducted to the first housing 160.

The large diameter portion 132 b is configured to extend from the small diameter portion 132 a toward the die, and has, for example, a substantially cylindrical structure in which the outer diameter gradually changes. The large diameter portion 132b can be configured, for example, such that the outer surface is the surface of a truncated cone.

Further, four concave portions are formed in the upper portion (the light emitting device side end portion) of the large diameter portion 132 b as a guide hole when caulking a part of the first housing 160. The recess is formed by cutting out a part of the upper end portion of the large diameter portion 132b.

(Drive circuit)
The drive circuit (circuit unit) 140 is a lighting circuit for causing the light emitting device 110 (LED 20) to emit light (lighting), and supplies predetermined power to the light emitting device 110. For example, the drive circuit 140 converts AC power supplied from the base 180 through the pair of lead wires 143c and 43d into DC power, and applies the DC power to the light emitting device 110 through the pair of lead wires 143a and 43b. It is a power supply circuit for supplying.

The drive circuit 140 is configured of a circuit board 141 and a plurality of circuit elements (electronic components) 142 mounted on the circuit board 141.

The circuit board 141 is a printed wiring board on which metal wiring is pattern-formed, and electrically connects the plurality of circuit elements 142 mounted on the circuit board 141. In the present embodiment, the circuit board 141 is disposed in a posture in which the main surface is orthogonal to the lamp axis. The circuit board 141 is sandwiched and held by the case body 151 and the cap 152.

The circuit element 142 is, for example, a capacitive element such as various capacitors, a resistive element, a rectifier circuit element, a coil element, a choke coil (choke transformer), a noise filter, a semiconductor element such as a diode or an integrated circuit element. Most of the circuit elements 142 are mounted on one main surface of the circuit board 141.

The drive circuit 140 configured in this way is housed in the circuit case 150, and is fixed to the circuit case 150 by, for example, screwing, bonding, or engagement. Thus, the drive circuit 140 is insulated by being covered by the circuit case 150. A dimmer circuit, a booster circuit, or the like may be appropriately selected and combined with the drive circuit 140.

The drive circuit 140 and the light emitting device 110 are electrically connected by a pair of lead wires 143a and 143b. Further, the drive circuit 140 and the base 180 are electrically connected by a pair of lead wires 143c and 143d. These four lead wires 143a to 143d are, for example, alloy copper lead wires, and each consist of a core wire made of alloy copper and an insulating resin film for covering the core wire.

In the present embodiment, the lead wire 143 a is a conducting wire (plus side output terminal wire) for supplying a high voltage from the drive circuit 140 to the light emitting device 110, and the lead wire 143 b is from the drive circuit 140 to the light emitting device 110. Lead wire (minus side output terminal line) for supplying the low voltage side voltage to the The lead wires 143a and 143b are inserted into the through holes provided in the support member 130 and are drawn out to the light emitting device side (inside the globe 120).

Each end (core) of the lead wire 143a (143b) is inserted into the through hole 80a (80b) of the substrate 10 of the light emitting device 110 and soldered to the terminals 60a and 60b. On the other hand, the other ends (cores) of the lead wires 143a and 143b are electrically connected to the metal wiring of the circuit board 141 by solder or the like.

On the other hand, the lead wires 143 c and 143 d are electric wires for supplying the power for lighting the light emitting device 110 from the base 180 to the drive circuit 140. One end (core wire) of each of the lead wires 143c and 143d is electrically connected to the base 180 (shell portion 181 or eyelet portion 183), and the other end (core wire) of each of the lead wires 143c and 143d is a power input portion of the circuit board 141 (Metal wiring) and solder or the like are electrically connected.

(Circuit case)
The circuit case 150 is an insulating case for housing the drive circuit 140, and is housed in the first housing 160 and the base 180. The circuit case 150 is configured of a case body 151 and a cap 152.

The case body 151 is an insulating case (housing) having openings on both sides, and is connected to the first case 151a having a large diameter cylindrical shape substantially the same as the first case 160 and the first case 151a. The second case portion 151 b has a small diameter cylindrical shape substantially the same as the base 180.

The first case portion 151 a located on the glove side is housed in the first housing 160. Most of the drive circuit 140 is covered by the first case portion 151a.

On the other hand, the second case portion 151b located on the cap side is housed in the cap 180, and the cap 180 is externally fitted to the second case portion 151b. As a result, the opening on the base of the circuit case 150 (case body 151) is closed. In the present embodiment, a screwing portion for screwing with the mouthpiece 180 is formed on the outer peripheral surface of the second case portion 151b, and the mouthpiece 180 is screwed into the second case portion 151b. It is fixed to the case body 151). The case body 151 can be configured using, for example, an insulating resin material such as polybutylene terephthalate (PBT).

The cap portion 152 is an insulating substantially bottomed cylindrical member configured in a cap shape. Similarly to the case main body portion 151, the cap portion 152 can also be configured using, for example, an insulating resin material such as PBT.

The top surface shape of the cap portion 152 is configured to follow the inner surface shape of the pedestal 132 of the support member 130. As a result, the cap portion 152 is fitted into the pedestal 132 and tightened and fixed to the support member 130 (basis 132) by the screw 190.

Although the cap portion 152 is provided on the circuit case 150 in the present embodiment, the circuit case 150 may be configured of only the case main portion 151 without providing the cap portion 152.

The circuit case 150 configured in this manner is disposed between the first case portion 151 a and the first housing 160 so as to have a predetermined interval. That is, the outer surface of the first case portion 151a and the inner surface of the first housing 160 are not in contact with each other.

(First case)
The first housing 160 is configured to surround the drive circuit 140. That is, the drive circuit 140 is disposed inward of the first housing 160. In the present embodiment, the first housing 160 encloses the drive circuit 140 via the circuit case 150.

In addition, the first housing 160 functions as a heat sink (radiator) and is connected to the support member 130 in a state of being in contact with the support member 130. Thereby, the heat generated by the light emitting device 110 is conducted to the first housing 160 through the support member 130. Thus, the heat of the light emitting device 110 can be dissipated.

The first housing 160 is preferably made of a material having a high thermal conductivity, and can be, for example, a metal member made of metal. The first housing 160 in the present embodiment is formed using aluminum. The first housing 160 may be formed using a non-metal material such as resin instead of metal. In this case, it is preferable that the first casing 160 be made of a nonmetallic material having high thermal conductivity.

In the present embodiment, the first casing 160 is configured to be fitted to the pedestal 132 of the support member 130, and the fitted portion of the first casing 160 is a taper having a predetermined taper angle. It is a part. In the present embodiment, the inner peripheral surface of the first housing 160 and the outer peripheral surface of the pedestal 132 of the support member 130 are in surface contact.

The first housing 160 is a cylinder having an opening (first opening) on the glove side and an opening (second opening) on the mouthpiece side, and the opening on the glove side is configured to be larger than the opening on the mouthpiece side It is done. Specifically, the first housing 160 is a substantially cylindrical member having a constant thickness and gradually changing the inner diameter and the outer diameter, and is, for example, formed in a skirt shape so that the inner surface and the outer surface become the surface of a truncated cone. There is. The first housing 160 in the present embodiment is configured such that the inner diameter and the outer diameter gradually decrease toward the base 180. Therefore, the inner peripheral surface and the outer peripheral surface of the first housing 160 are tapered surfaces (inclined surfaces) configured to be inclined with respect to the lamp axis J.

The first case 160 configured in this manner has a predetermined gap between the circuit case 150 (first case portion 151a) and the second case 170 so that the circuit case 150 and the second case 160 can be separated. It is arranged between 170 and. That is, between the inner peripheral surface of the first housing 160 and the outer peripheral surface of the circuit case (first case portion 151a), and between the outer peripheral surface of the first housing 160 and the inner peripheral surface of the second housing 170. In between, an air layer exists. Thereby, even if the first housing 160 made of metal having a different thermal expansion coefficient and the second housing 170 or the circuit case 150 made of resin thermally expand, the first housing 160 and the second housing 170 or the circuit The thermal expansion difference with the case 150 can be absorbed by the gap. As a result, the occurrence of cracks in the second housing 170 and the circuit case 150 can be suppressed.

(Second case)
The second housing 170 is an insulating cover configured to surround the first housing 160. By covering the metal second housing 170 with the insulating second housing 170, the insulation of the light bulb shaped lamp 100 can be improved. The second housing 170 can be made of, for example, an insulating resin material such as PBT.

The outer surface of the second housing 170 is exposed to the outside of the lamp (in the air). On the other hand, the inner circumferential surface of the second housing 170 faces the outer circumferential surface of the first housing 160. In the present embodiment, a gap is provided between the outer peripheral surface of the second housing 170 and the inner peripheral surface of the first housing 160.

The second housing 170 is a substantially cylindrical member having a constant thickness and a gradually changing inner diameter and outer diameter, and can be, for example, formed in a skirt shape so that the inner surface and the outer surface are surfaces of a truncated cone. In the present embodiment, the second housing 170 is configured such that the inner diameter and the outer diameter gradually decrease toward the base 180.

(Base)
The base 180 is a power receiving unit that receives power for making the light emitting device 110 (the LED 20) emit light from the outside of the lamp. The base 180 is attached to, for example, a socket of a luminaire. Thus, the base 180 can receive power from the socket of the lighting apparatus when lighting the light bulb shaped lamp 100. For example, AC power is supplied to the base 180 from a commercial power supply of AC 100V. The cap 180 in the present embodiment receives AC power at two contacts, and the power received by the cap 180 is input to the power input portion of the drive circuit 140 through the pair of lead wires 143 c and 43 b.

The base 180 has a cylindrical shape with a bottom and made of metal, and includes a shell portion 181 whose outer peripheral surface is an external thread, and an eyelet portion 183 attached to the shell portion 181 via an insulating portion 182. On the outer peripheral surface of the base 180, a screwing portion for screwing the socket of the lighting apparatus is formed. Further, a screwing portion for screwing with the screwing portion of the case portion 51 (second case portion 151b) of the circuit case 150 is formed on the inner peripheral surface of the base 180.

The type of the base 180 is not particularly limited, but in the present embodiment, a screw-in type Edison type (E-type) base is used. For example, examples of the base 180 include E26 or E17 or E16. In the present embodiment, an E17 base is used. Note that as the base 180, a base having another structure, such as a plug-in base, may be used.

According to the light bulb-shaped lamp 100 according to the present embodiment configured as described above, since the light emitting device 110 of double-sided light emission having the concavo-convex portion 11 is used, the light emitted by the light emitting device 110 It radiates in all directions as the center. As a result, it is possible to realize a bulb-shaped LED lamp having light distribution characteristics of a wide light distribution angle similar to an incandescent lamp.

Furthermore, in the present embodiment, the concavo-convex portion 11 is formed on the substrate 10 of the light emitting device 110, but the concavo-convex portion 11 is formed at the connection portion between the light emitting device 110 (substrate 10) and the support member 130 (post 131). Has not been formed. Thereby, since the thermal contact between the light emitting device 110 and the support member 130 can be made favorable, it is possible to suppress the decrease in the heat dissipation property of the light emitting device 110 due to the uneven portion 11.

In the present embodiment, although the light emitting device 110 has the same configuration as the light emitting device 1 of the first embodiment, the light emitting device having the same configuration as that of the second embodiment or its modification is used. I do not care. As a result, white light is emitted from both sides of the light emitting device, and illumination light closer to an incandescent lamp can be obtained.

Embodiment 4
Next, a lighting apparatus according to Embodiment 4 of the present invention will be described with reference to FIG. FIG. 11 is a cross-sectional view of a lighting device according to Embodiment 4 of the present invention.

As shown in FIG. 11, a lighting device 300 according to the present embodiment is, for example, mounted on a ceiling of a room and used, and includes a light bulb shaped lamp 100 according to the third embodiment and a lighting fixture 200.

The lighting fixture 200 is for turning off and lighting the bulb-shaped lamp 100, and includes a fixture body 210 mounted on a ceiling, and a translucent lamp cover 220 covering the bulb-shaped lamp 100.

The instrument body 210 has a socket 211. The base 180 of the light bulb shaped lamp 100 is screwed into the socket 211. Power is supplied to the light bulb shaped lamp 100 through the socket 211.

Thus, the light bulb shaped lamp 100 according to the above-mentioned embodiment can be used as a light source of a lighting device.

(Others)
As described above, the substrate and the method for manufacturing the same, the light emitting device, the light source for illumination, and the illumination device according to the present invention have been described based on the embodiment and the modified examples. It is not limited.

For example, although the example which applied a light-emitting device to a light bulb shaped lamp was shown in said embodiment, you may utilize the said light-emitting device as a light source of other types of lamps, such as a straight tube | pipe type lamp, The light-emitting device may be used as a light source of lighting equipment such as a downlight, a spotlight, or a base light, and the light-emitting device may be used as a light source of various lighting devices. The light emitting device may be used not only as a light source for illumination but also as a light source for other products such as a display light source.

Moreover, in said embodiment and modification, although the light-emitting device (LED module) was comprised so that white light might be emitted with blue LED chip and yellow fluorescent substance, it does not restrict to this. For example, in order to improve color rendering, in addition to the yellow phosphor, a red phosphor or a green phosphor may be further mixed. In addition, it is also possible to use a phosphor-containing resin containing a red phosphor and a green phosphor without using a yellow phosphor and to emit white light by combining this with a blue LED chip. it can.

In the above-described embodiment and modification, the LED chip may use an LED chip that emits a color other than blue. For example, in the case of using an LED chip that emits ultraviolet light, a combination of phosphor particles that emit light in three primary colors (red, green and blue) can be used as the phosphor particles. Furthermore, wavelength conversion materials other than phosphor particles may be used. For example, as a wavelength conversion material, a semiconductor, a metal complex, an organic dye, a pigment, etc. absorbs light of a certain wavelength and the wavelength is different from the absorbed light A material containing a substance that emits light may be used.

Further, in the above embodiment and modifications, an LED is exemplified as a light emitting element, but other solid light emitting elements such as a semiconductor light emitting element such as a semiconductor laser, organic EL (Electro Luminescence) or inorganic EL may be used. .

In addition, the embodiments can be realized by various combinations that each person skilled in the art may think of for each embodiment, or by combining components and functions in each embodiment without departing from the scope of the present invention. The present invention also includes the form

The present invention can be widely used in a substrate on which a light emitting element is mounted, a light emitting device provided with the same, a lamp provided with the light emitting device, a lighting device, and the like.

1, 2, 2A, 110 light emitting device 10 substrate 10a first main surface 10b second main surface 11 uneven portion 11a ceramic crystal grain 11b binder 20 LED
Reference Signs List 21 sapphire substrate 22 nitride semiconductor layer 23 cathode electrode 24 anode electrode 25, 26 wire bonding portion 27 chip bonding material 30 sealing member 40 metal wiring 50 wire 60a, 60b terminal 70, 70A wavelength conversion member 80a, 80b, 81 through hole 120 Globe 121 Opening 130 Support member 131 Support 131a Convex 132 Base 132a Small diameter 132b Large diameter 140 Drive circuit 141 Circuit board 142 Circuit element 143a, 143b, 143c, 143d Lead wire 150 Circuit case 151 Case body 151a 1 Case portion 151b Second case portion 152 Cap portion 160 First housing 170 Second case 180 Base 180 shell 181 Shell portion 182 Insulating portion 183 Eyelet portion 190 Screw 200 Lighting fixture 210 Fixture Body 211 Socket 220 lamp cover 300 illumination device

Claims (10)

A substrate on which the light emitting element is mounted,
The substrate has translucency, and has an uneven portion on the surface opposite to the surface on which the light emitting element is mounted.
The uneven portion is formed at a position facing the light emitting element to be mounted. The substrate is a polycrystalline ceramic substrate formed by bonding a plurality of crystal grains,
The substrate according to claim 1, wherein a surface shape of the exposed surface of the uneven portion is a surface shape of the plurality of crystal grains. A translucent substrate,
A light emitting element mounted on the first main surface of the substrate;
The substrate has an uneven portion on the surface opposite to the surface on which the light emitting element is mounted,
The light emitting device, wherein the uneven portion is formed at a position facing the light emitting element. The substrate is a polycrystalline ceramic substrate formed by bonding a plurality of crystal grains,
The light emitting device according to claim 3, wherein a surface shape of the uneven portion is a surface shape of the plurality of crystal grains. The light emitting device according to claim 3, further comprising a sealing member that includes a wavelength conversion material and seals the light emitting element. The light emitting device according to claim 5, further comprising a wavelength conversion member that includes a wavelength conversion material and is formed so as to overlap the uneven portion. The light emitting device according to claim 6, wherein the uneven portion is formed so as not to protrude from the wavelength conversion member. A light emitting device according to any one of claims 3 to 7;
And a heat sink connected to the light emitting device.
The heat dissipating member is connected to the surface of the substrate of the light emitting device opposite to the surface on which the light emitting element is mounted.
The uneven portion is not formed on the connection surface between the heat dissipating member and the substrate. And a glove covering the light emitting device.
The illumination light source according to claim 8, wherein the heat dissipating member is a support provided so as to extend inward of the globe and supporting the light emitting device. A method of manufacturing a substrate on which a light emitting element is mounted, comprising
The substrate is a translucent polycrystalline ceramic substrate,
A method of manufacturing a substrate, comprising forming a concavo-convex portion on a surface opposite to the surface on which the light emitting element is mounted by etching a predetermined region of the substrate with an acid, and at a position facing the light emitting element.

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