CN203743911U - Lighting device, bulb-shaped lamp, and lighting device - Google Patents

Abstract

A light-emitting device (LED module (20)) is provided with: a substrate (21); a plurality of first light-emitting elements (LEDs (22a)) arranged in a row on a substrate (21); a first wavelength conversion member (WC1) which is provided in a linear shape on the substrate (21) and converts the wavelength of light emitted from the plurality of first light-emitting elements; and a second wavelength conversion member (WC2) that is provided on the substrate (21) in a linear shape in parallel with the first wavelength conversion member (WC1) and converts the wavelength of light emitted by the plurality of first light-emitting elements, wherein the plurality of first light-emitting elements are present in the first wavelength conversion member (WC1), and the second wavelength conversion member (WC2) does not have a light-emitting element that can emit light whose wavelength has been converted by the second wavelength conversion member (WC 2).

Description

Lighting device, bulb-shaped lamp, and lighting device

technical field

The utility model relates to a light-emitting device, a bulb-shaped lamp and a lighting device, for example, a light-emitting device using a semiconductor light-emitting element, and a bulb-shaped lamp and a lighting device using the light-emitting device. the

Background technique

Semiconductor light-emitting elements such as LED (Light Emitting Diode: Light Emitting Diode) are expected to be used as new light sources for various lamps due to their high efficiency and long life. Research and development of LED lamps using LEDs as light sources are also in progress. . the

As the LED lamp, there is a bulb-shaped LED lamp (bulb-shaped LED lamp) replacing a bulb-shaped fluorescent lamp or an incandescent bulb, or a straight-tube LED lamp (straight-tube LED lamp) replacing a straight-tube fluorescent lamp. For example, Patent Document 1 discloses a conventional bulb-shaped LED lamp. In addition, Patent Document 2 discloses a conventional straight-tube LED lamp. the

In an LED lamp, an LED module (light emitting device) in which a plurality of LEDs are mounted on a substrate is used as a light source. the

(Existing Technical Documents) 

(patent documents)

Patent Document 1 Japanese Patent Application Publication No. 2006-313717

Patent Document 2 Japanese Patent Application Publication No. 2009-043447

Summary of the invention

The problem to be solved by the invention

In recent years, bulb-shaped LED lamps that mimic the configuration of incandescent bulbs in terms of light emission characteristics and appearance have been studied. For example, a bulb-shaped LED lamp has been proposed in which a hollow globe (glass bulb) used in an incandescent bulb is used, and an LED module is held at a central position within the globe. For example, the LED module is fixed on the top of the support by using a support (core rod) extending from the opening of the spherical cover to the center of the spherical cover. The LED module includes, for example, a substrate, a plurality of LED chips mounted in multiple rows on the surface of the substrate, and a plurality of phosphor-containing resins (linear resins) that are collectively sealed for each row of LED chips. the

However, higher beams are required in bulb-shaped lamps, so mounting more LED chips is being studied. When the LED chip emits light, heat is generated from the LED chip itself, which will cause the temperature of the LED chip to rise, thus not only reducing the light output of the LED chip but also shortening the life of the LED chip. Therefore, in the LED module, it is necessary to efficiently dissipate the heat generated by the LED chip. In this case, heat dissipation of the LED module can be ensured by increasing the area of the substrate on which the LED chip is mounted. the

However, if only the area of the substrate is increased, the area (non-light-emitting portion) other than the area (light-emitting portion) where the phosphor-containing resin for sealing the LED chip is formed will increase, so that there is a problem that the A clear difference in light and shade appears between the region where the phosphor-containing resin sealing the LED chip is formed (light-emitting portion) and the region where the phosphor-containing resin is not formed (non-light-emitting portion). the

In particular, when a plurality of linear phosphor-containing resins for sealing the LED chip are formed on the substrate, if the area of the substrate is increased, the distance between the two linear phosphor-containing resins becomes wider. , resulting in uneven brightness. Therefore, when such an LED module is used as a light source of the light bulb-shaped lamp having the above-mentioned configuration, unevenness in brightness of the light source becomes conspicuous. the

Utility model content

A first object of the present invention is to provide a light-emitting device, a bulb-shaped lamp, and a lighting device capable of suppressing a difference in brightness and darkness on a substrate. the

In addition, conventional LED lamps have a sealing member containing phosphor as a wavelength conversion layer that converts the wavelength of light emitted by the LED. By sealing the LED with the sealing member, for example, blue light emitted from the LED passes through the sealing member. Parts become white light is emitted. This phosphor has a characteristic that the conversion efficiency for converting the wavelength of the light decreases when the temperature rises. the

Here, when the LED lamp has a dimming function, the dimming of the LED is controlled by changing the magnitude of the current supplied to the LED. That is, when this dimming is controlled, a large current or a small current is supplied to the LED. In this way, when a large current is supplied to the LED, heat is generated from the LED, and the conversion efficiency of the phosphor decreases due to the heat. Therefore, when the dimming of the LED is controlled, the color of the light emitted from the sealing member changes. the

As described above, in the conventional LED lamp, there is a problem that the color of emitted light changes when dimming is controlled. the

The second object of the present utility model is to provide a light emitting device, a bulb-shaped lamp and a lighting device that can control the change of the color of the emitted light even when the dimming is controlled. the

The means used to solve the problem

In order to achieve the above-mentioned first object, one embodiment of the first light-emitting device according to the present invention includes: a substrate; a first light-emitting element disposed on the substrate; a first wavelength conversion member disposed on On the substrate, the wavelength of the light emitted by the first light-emitting element is converted; and the second wavelength conversion component is arranged adjacent to the first wavelength conversion component, and the The wavelength of light is converted, the first light-emitting element is present in the first wavelength conversion member, and there is no device capable of emitting light whose wavelength is converted by the second wavelength conversion member in the second wavelength conversion member. light emitting element. the

Furthermore, in one embodiment of the first light emitting device according to the present invention, a plurality of the first light emitting elements may be arranged in a row on the substrate, and the first wavelength converting member , are arranged in a line shape on the substrate, and the second wavelength conversion member is arranged in a line shape in parallel with the first wavelength conversion member on the substrate. the

In addition, in one embodiment of the first light emitting device according to the present invention, the first wavelength conversion member includes a first wavelength conversion material and a first sealing member including the first wavelength conversion material, so that The first wavelength conversion material converts the wavelength of light emitted by the plurality of first light emitting elements, the first sealing member is arranged in a line shape, and seals the plurality of first light emitting elements together , the second wavelength conversion component includes a second wavelength conversion material and a first dummy sealing component containing the second wavelength conversion material, and the second wavelength conversion material is effective for the light emitted by a plurality of the first light-emitting elements wavelength conversion. the

Furthermore, in one embodiment of the first light-emitting device according to the present invention, the concentration of the second wavelength conversion material in the first dummy sealing member may be: The concentration of the first wavelength converting material is below. the

Furthermore, in one embodiment of the first light-emitting device according to the present invention, the length of the first dummy sealing member may be equal to or less than the length of the first sealing member. the

Furthermore, in one embodiment of the first light emitting device according to the present invention, the first wavelength conversion material and the second wavelength conversion material may be phosphor particles, and the first sealing member and the The first dummy sealing member is resin. the

Furthermore, in one embodiment of the first light-emitting device according to the present invention, a non-light-emitting electronic element may exist in the first dummy sealing member. the

In addition, in an embodiment of the first light emitting device according to the present invention, the shape of the first wavelength conversion member in a cross section perpendicular to the longitudinal direction of the first wavelength conversion member may be substantially half. In a circular shape, a plurality of the first light emitting elements are arranged in a row, and each of the plurality of first light emitting elements is located substantially in the center of the width of the first wavelength converting member. the

Moreover, one embodiment of the first light-emitting device according to the present invention may be that the light-emitting device further includes: a plurality of second light-emitting elements, along the column direction of the plurality of first light-emitting elements, at The substrate is arranged in a row; and the third wavelength conversion member is arranged in a line on the substrate, and converts the wavelength of light emitted by a plurality of the second light emitting elements. There are multiple second light-emitting elements in the three wavelength conversion components, the second wavelength conversion components are arranged between the first wavelength conversion component and the third wavelength conversion component, and the plurality of the first wavelength conversion components are also arranged. The wavelength of the light emitted by the two light emitting elements is converted. the

In addition, in one embodiment of the first light emitting device according to the present invention, the first wavelength conversion member includes a first wavelength conversion material and a first sealing member including the first wavelength conversion material, so that The first wavelength conversion material converts the wavelength of light emitted by the plurality of first light emitting elements, the first sealing member is arranged in a line shape, and seals the plurality of first light emitting elements together , the second wavelength conversion component includes a second wavelength conversion material and a first dummy sealing component containing the second wavelength conversion material, and the second wavelength conversion material is suitable for the plurality of first light-emitting elements and the plurality of the first light-emitting elements. The wavelength of the light emitted by the second light-emitting element is converted, the third wavelength conversion component includes a third wavelength conversion material and a second sealing component containing the third wavelength conversion material, and the third wavelength conversion material is used for multiple The wavelength of the light emitted by the second light emitting element is converted, and the second sealing member is arranged in a line shape and seals a plurality of the second light emitting elements collectively. the

Furthermore, in one embodiment of the first light-emitting device according to the present invention, the plurality of first light-emitting elements and the plurality of second light-emitting elements may be light-emitting elements capable of emitting light of the same color, The concentration of the second wavelength converting material in the first dummy sealing member is equal to or lower than the concentration of the first wavelength converting material in the first sealing member, and the concentration of the second wavelength converting material in the second sealing member is The concentration of the third wavelength conversion material is below. the

In addition, in one embodiment of the first light emitting device according to the present invention, the concentration of the first wavelength conversion material in the first sealing member may be the same as the concentration of the wavelength conversion material in the second sealing member. The concentration of the third wavelength converting material is almost uniform. the

In addition, in one embodiment of the first light-emitting device according to the present invention, the first wavelength conversion material, the second wavelength conversion material, and the third wavelength conversion material are all phosphors. The particles, the first sealing member, the first dummy sealing member, and the second sealing member are all resin. the

Furthermore, in one embodiment of the first light-emitting device according to the present invention, the shape of the first wavelength conversion member in a cross section perpendicular to the longitudinal direction of the first wavelength conversion member may be substantially half. Circular, the shape of the third wavelength conversion component in a section perpendicular to the length direction of the third wavelength conversion component is basically a semicircle, a plurality of the first light-emitting elements and a plurality of the second light-emitting elements The elements are respectively arranged in a row, each of the plurality of first light emitting elements is located substantially at the center of the width of the first wavelength conversion member, and each of the plurality of second light emitting elements is located substantially at the center of the width of the first wavelength conversion member. The center position of the width of the third wavelength converting member. the

Moreover, one embodiment of the first light-emitting device according to the present invention may be that the light-emitting device further includes: a plurality of third light-emitting elements and a plurality of fourth light-emitting elements, along the plurality of second The column direction of the light-emitting elements is arranged in a row on the substrate; the fourth wavelength conversion member is adjacent to the third wavelength conversion member and arranged in a line on the substrate, and the plurality of the first wavelength conversion members The wavelength of the light emitted by the three light-emitting elements is converted; the fifth wavelength conversion component is arranged in parallel with the fourth wavelength conversion component on the substrate in a line shape, and is used for multiple third light-emitting elements and multiple wavelength conversion components. converting the wavelength of light emitted by each of the fourth light-emitting elements; and a sixth wavelength converting member, adjacent to the fifth wavelength converting member, arranged in a line shape on the substrate, for a plurality of the first wavelength converting members converting the wavelength of light emitted by the four light-emitting elements, a plurality of the third light-emitting elements are present in the fourth wavelength conversion part, and a plurality of the fourth light-emitting elements are present in the sixth wavelength conversion part, The fifth wavelength conversion part is arranged between the fourth wavelength conversion part and the sixth wavelength conversion part, and in the fifth wavelength conversion part, there is no A light-emitting element that converts wavelengths of light. the

In addition, in one embodiment of the first light emitting device according to the present invention, the fourth wavelength conversion member includes a fourth wavelength conversion material and a third sealing member including the fourth wavelength conversion material, so that The fourth wavelength conversion material converts the wavelength of light emitted by the plurality of third light emitting elements, the third sealing member is arranged in a line shape, and seals the plurality of third light emitting elements together , the fifth wavelength conversion component includes a fifth wavelength conversion material and a second dummy sealing component containing the fifth wavelength conversion material, and the fifth wavelength conversion material supports a plurality of the third light-emitting elements and a plurality of the The wavelength of the light emitted by the fourth light-emitting element is converted, the sixth wavelength conversion component includes a sixth wavelength conversion material and a fourth sealing component containing the sixth wavelength conversion material, and the sixth wavelength conversion material is used for multiple The wavelength of the light emitted by the fourth light emitting element is converted, and the fourth sealing member is arranged in a line shape and seals a plurality of the fourth light emitting elements collectively. the

In addition, in one embodiment of the first light emitting device according to the present invention, the light emitting device further includes a seventh wavelength conversion member, and the seventh wavelength conversion member is provided between the third wavelength conversion member and the third wavelength conversion member. Between the fourth wavelength conversion components, the seventh wavelength conversion component includes a seventh wavelength conversion material and a third dummy sealing component containing the seventh wavelength conversion material, and the seventh wavelength conversion material is paired with a plurality of the The wavelength of the light emitted by the second light-emitting element and the plurality of third light-emitting elements is converted, and in the seventh wavelength conversion part, there is no light emitting light that can emit the light whose wavelength is converted by the seventh wavelength conversion part. element. the

Furthermore, in one embodiment of the first light emitting device according to the present invention, the light emitting device may further include an eighth wavelength conversion member provided in at least one of the following wavelength conversion members: On both sides of one of the lengthwise directions, these wavelength conversion components refer to: the first wavelength conversion component, the third wavelength conversion component, the fourth wavelength conversion component, and the sixth wavelength conversion component, so The eighth wavelength conversion part includes an eighth wavelength conversion material and a fourth dummy sealing part containing the eighth wavelength conversion material, and the eighth wavelength conversion material changes the wavelength of light emitted by at least one of the following light emitting elements Transformation, these light-emitting elements refer to: a plurality of the first light-emitting elements, a plurality of the second light-emitting elements, a plurality of the third light-emitting elements, and a plurality of the fourth light-emitting elements, in the eighth In the wavelength conversion member, there is no light emitting element capable of emitting light whose wavelength is converted by the eighth wavelength conversion member. the

Furthermore, in order to achieve the second object, in one embodiment of the first light emitting device according to the present invention, the first wavelength conversion member is arranged to cover at least a part of the first light emitting element, so The second wavelength conversion member is arranged at a position farther from the first light emitting element than the first wavelength conversion member, and the first light emitting element is activated by a change in the magnitude of the supplied current. Dimming, which shows the second wavelength conversion amount of the degree of converting the wavelength of the light emitted by the first light-emitting element in the second wavelength conversion part, and shows the ratio of the second wavelength conversion amount in the first wavelength conversion part The first wavelength conversion amount to the extent of converting the wavelength of light emitted by the first light emitting element is large. the

Furthermore, in one embodiment of the first light emitting device according to the present invention, the first wavelength conversion member may be a sealing member that seals the first light emitting element, and the second wavelength conversion member may be a sealing member that seals the first light emitting element. It is a resin arranged on the side of the first wavelength conversion member on the substrate. the

Furthermore, in one embodiment of the first light-emitting device according to the present invention, the concentration of phosphor particles contained in the second wavelength conversion member may be higher than that in the first wavelength conversion member. the

In addition, one embodiment of the first light emitting device according to the present invention may be that the substrate has light transmittance, and the light emitting device further includes a third wavelength conversion member, and the third wavelength conversion member is controlled by In the phosphor layer formed between the substrate and the first light emitting element, the third wavelength converting member is configured such that light emitted by the first light emitting element becomes more distant from the first light emitting element The greater the amount of wavelength conversion. the

In addition, in one embodiment of the first light emitting device according to the present invention, the third wavelength conversion member may be configured such that the distance between the third wavelength conversion member and the distance from the first light emitting element increases. The thicker the thickness. the

In addition, in one embodiment of the first light emitting device according to the present invention, the third wavelength conversion member may be configured such that the distance between the third wavelength conversion member and the distance from the first light emitting element increases. The higher the concentration of phosphor particles contained, the higher the concentration. the

In addition, in an embodiment of the first light emitting device according to the present invention, the substrate may be light-transmissive, and the first wavelength conversion member and the second wavelength conversion member may be arranged in the An integral phosphor layer is formed between the substrate and the first light emitting element. the

Furthermore, in one embodiment of the first light-emitting device according to the present invention, the thickness of the second wavelength conversion member may be thicker than that of the first wavelength conversion member. the

Furthermore, in one embodiment of the first light-emitting device according to the present invention, the concentration of phosphor particles contained in the second wavelength conversion member may be higher than that in the first wavelength conversion member. the

In addition, one embodiment of the first light bulb-shaped lamp according to the present invention includes: any one of the above-mentioned first light-emitting devices and a light-transmitting globe; A pillar, the light emitting device is arranged in the spherical cover and fixed on the pillar. the

In addition, in one embodiment of the first light bulb-shaped lamp according to the present invention, the light emitting device may be fixed on the top side of the globe cover in such a manner that the first surface of the substrate is located on the top side of the globe cover. The pillar and the first surface of the substrate refer to a surface on which a plurality of the first light emitting elements are provided. the

In addition, in one embodiment of the first light bulb-shaped lamp according to the present invention, the above-mentioned first light-emitting device including the eighth wavelength conversion member; a translucent globe; A pillar extending from the inner space of the spherical cover, the first light-emitting device is arranged in the spherical cover and fixed on the pillar, the first light-emitting device further includes: a plurality of fifth light-emitting elements, arranged in a row on the second surface of the substrate, the second surface of the substrate being the surface opposite to the first surface of the substrate; and the ninth wavelength conversion member on the second The surface is arranged in a line shape to convert the wavelength of light emitted by the plurality of fifth light emitting elements, and there are a plurality of fifth light emitting elements in the ninth wavelength converting member. the

In addition, in an embodiment of the first light bulb-shaped lamp according to the present invention, the light emitting device may further include a tenth wavelength conversion member, and the tenth wavelength conversion member may be connected to the second surface on the second surface. The ninth wavelength conversion component is arranged in parallel in a line, and converts the wavelength of the light emitted by the plurality of fifth light emitting elements. A wavelength converting member is a light emitting element that converts wavelength of light. the

Furthermore, in one embodiment of the first light bulb-shaped lamp according to the present invention, the ninth wavelength conversion member may include a ninth wavelength conversion material and a fifth sealing member including the ninth wavelength conversion material. , the ninth wavelength conversion material converts the wavelength of the light emitted by the plurality of fifth light emitting elements, the fifth sealing member is arranged in a line shape, and the plurality of fifth light emitting elements are collectively sealing, the tenth wavelength conversion component includes a tenth wavelength conversion material and a fifth dummy sealing component containing the tenth wavelength conversion material, and the tenth wavelength conversion material is effective for the light emitted by a plurality of fifth light-emitting elements The wavelength of light is converted. the

Furthermore, in one embodiment of the first light bulb-shaped lamp according to the present invention, the substrate may be composed of a main substrate and a sub-substrate, and a plurality of the first light-emitting substrates are provided on the surface of the main substrate. A component, the surface of the sub-substrate is provided with a plurality of the fifth light-emitting elements, the main substrate and the sub-substrate are configured such that the back of the main substrate is opposite to the back of the sub-substrate, and the main substrate The back surface of the substrate refers to a surface not provided with a plurality of the first light emitting elements, and the back surface of the sub-substrate refers to a surface not provided with a plurality of the fifth light emitting elements. the

Moreover, one Embodiment of the 1st illuminating device which concerns on this invention is equipped with any one of said 1st light bulb-shaped lamps. the

In order to achieve the above-mentioned second object, one embodiment of the second light-emitting device according to the present invention includes: a substrate; a light-emitting element arranged on the substrate; at least a part of the light-emitting element is configured to convert the wavelength of light emitted by the light-emitting element; the second wavelength conversion part is arranged at a distance from the light-emitting element compared with the first wavelength conversion part and convert the wavelength of the light emitted by the light-emitting element, the light-emitting element is dimmed due to the change in the magnitude of the supplied current, showing the second wavelength conversion part The second wavelength conversion amount of the degree of converting the wavelength of the light emitted by the light emitting element is a ratio indicating the degree of converting the wavelength of the light emitted by the light emitting element in the first wavelength converting unit The first wavelength conversion amount is large. the

In addition, in one embodiment of the second light emitting device according to the present invention, the first wavelength conversion part may be a sealing member that seals the first light emitting element, and the second wavelength conversion part It is a resin arranged on the side of the first wavelength converting portion on the substrate. the

Furthermore, in one embodiment of the second light-emitting device according to the present invention, the concentration of phosphor particles contained in the second wavelength conversion part may be higher than that in the first wavelength conversion part. the

Furthermore, in one embodiment of the second light-emitting device according to the present invention, the substrate may be light-transmissive, and the light-emitting device may further include a third wavelength conversion unit, and the third wavelength conversion unit may be In the phosphor layer formed between the substrate and the light-emitting element, the third wavelength converting portion is configured such that, as the distance from the first light-emitting element increases, the light emitted by the first light-emitting element The greater the amount of wavelength conversion. the

In addition, in one embodiment of the second light emitting device according to the present invention, the third wavelength converting unit may be configured such that the distance from the first light emitting element increases, the third wavelength converting member The thicker the thickness. the

In addition, in one embodiment of the second light emitting device according to the present invention, the third wavelength converting unit may be configured such that the distance from the first light emitting element increases, the third wavelength converting member The higher the concentration of phosphor particles contained, the higher the concentration. the

Furthermore, in one embodiment of the second light-emitting device according to the present invention, the substrate may be light-transmissive, and the first wavelength conversion part and the second wavelength conversion part may be in the An integral phosphor layer is formed between the substrate and the light emitting element. the

Furthermore, in one embodiment of the second light emitting device according to the present invention, the thickness of the second wavelength conversion part may be thicker than that of the first wavelength conversion part. the

Furthermore, in one embodiment of the second light-emitting device according to the present invention, the concentration of phosphor particles contained in the second wavelength conversion part may be higher than that in the first wavelength conversion part. the

Also, in one embodiment of the second light bulb-shaped lamp according to the present invention, it may include: any one of the above-mentioned second light-emitting devices; a hollow spherical cover for accommodating the second light-emitting device a base for receiving electric power for causing the second light emitting device to emit light; and a drive circuit for supplying the electric power received by the base to the light emitting element and dimming the light emitting element. the

Moreover, one Embodiment of the 2nd illuminating device which concerns on this invention is provided with the above-mentioned light bulb-shaped lamp. the

Invention effect

According to the respective embodiments of the first light emitting device, the first light bulb-shaped lamp, and the first lighting device according to the present invention, it is possible to suppress the difference between brightness and darkness on the substrate of the first light emitting device. the

According to the respective embodiments of the second light emitting device, the second bulb-shaped lamp, and the second lighting device according to the present invention, even when dimming is controlled, it is possible to suppress a change in the color of emitted light. the

Description of drawings

FIG. 1 is a side view of a light bulb-shaped lamp according to Embodiment 1 of the present invention. the

Fig. 2 is an exploded perspective view of the light bulb-shaped lamp according to Embodiment 1 of the present invention. the

3 is a cross-sectional view of the light bulb-shaped lamp according to Embodiment 1 of the present invention. the

The structure of the LED module in the lightbulb-shaped lamp which concerns on Embodiment 1 of this invention is shown, (a) is a top view, (b), (c), (d), and (e) are sectional views. the

5 is an enlarged cross-sectional view of LEDs in the LED module of the light bulb-shaped lamp according to Embodiment 1 of the present invention. the

6 shows the structure of the LED module periphery in the lightbulb-shaped lamp which concerns on Embodiment 1 of this invention, (a) is a top view, (b) and (c) are sectional views. the

7 is a diagram for explaining the effect of the LED module in the light bulb-shaped lamp according to Embodiment 1 of the present invention, (a) is a partially enlarged cross-sectional view of the LED module of Comparative Example 1, and (b) is a comparison An enlarged cross-sectional view of a part of the LED module of Example 2, (c) is an enlarged cross-sectional view of a part of the LED module in Embodiment 1. FIG. the

8A is a plan view of an LED module in the light bulb-shaped lamp according to Modification 1 of Embodiment 1 of the present invention. the

8B is a plan view of an LED module in the light bulb-shaped lamp according to Modification 2 of Embodiment 1 of the present invention. the

9 shows the configuration around the LED module in the lightbulb-shaped lamp according to Modification 3 of Embodiment 1 of the present invention, (a) is a plan view, and (b), (c) and (d) are cross-sectional views . the

Fig. 10 shows the configuration around the LED module in the lightbulb-shaped lamp according to Modification 4 of Embodiment 1 of the present invention, (a) is a plan view, and (b), (c) and (d) are cross-sectional views . the

Fig. 11 is an external perspective view of a light bulb-shaped lamp according to Embodiment 2 of the present invention. the

Fig. 12 is an exploded perspective view of a light bulb-shaped lamp according to Embodiment 2 of the present invention. the

FIG. 13 shows a cross section of the configuration of the light bulb-shaped lamp according to Embodiment 2 of the present invention. the

FIG. 14 shows another cross section of the configuration of the light bulb-shaped lamp according to Embodiment 2 of the present invention. the

The structure of the LED module which concerns on Embodiment 2 of this invention is shown, (a) is a top view, (b) is sectional drawing. the

16 is a partially enlarged cross-sectional view of a configuration of a sealing member and a wavelength converting member in an LED module according to Embodiment 2 of the present invention. the

FIG. 17 is a diagram for explaining effects achieved by the LED module according to Embodiment 2 of the present invention. the

The structure of the LED module which concerns on the modification 1 of Embodiment 2 of this invention is shown in FIG. 18, (a) is a top view, (b) is sectional drawing. the

19 is an enlarged cross-sectional view of an LED periphery in an LED module according to Modification 1 of Embodiment 2 of the present invention. the

20 is an enlarged cross-sectional view of a main part of an LED module according to Modification 1 of Embodiment 2 of the present invention. the

FIG. 21 is a diagram for explaining effects achieved by the LED module according to Modification 1 of Embodiment 2 of the present invention. the

The structure of the LED module which concerns on the modification 2 of Embodiment 2 of this invention is shown in FIG. 22, (a) is a top view, (b) is sectional drawing. the

23 is an enlarged cross-sectional view of a main part of an LED module according to Modification 2 of Embodiment 2 of the present invention. the

24 is an enlarged cross-sectional view of a main part of an LED module according to Modification 3 of Embodiment 2 of the present invention. the

25 is an enlarged cross-sectional view of a main part of an LED module according to Modification 4 of Embodiment 2 of the present invention. the

Fig. 26 shows the structure of an LED module according to Modification 1 of the present invention, (a) is a plan view, and (b) is a cross-sectional view on line A-A' of (a). the

Fig. 27 is a diagram for explaining the method of assembling the LED module according to Modification 1 of the present invention. the

Fig. 28 is a perspective view showing the structure of an LED module according to Modification 2 of the present invention. the

Fig. 29 is a plan view showing the configuration of another first example of the LED module according to Modification 2 of the present invention. the

Fig. 30 is a plan view showing the configuration of another second example of the LED module according to Modification 2 of the present invention. the

31 is a plan view showing the configuration of another third example of the LED module according to Modification 2 of the present invention. the

Fig. 32 is a plan view showing the configuration of another fourth example of the LED module according to Modification 2 of the present invention. the

Fig. 33 is a cross-sectional view showing the configuration of a first example of an LED module according to another modified example of the present invention. the

FIG. 34 is a cross-sectional view showing the configuration of a second example of an LED module according to another modified example of the present invention. the

35 is a cross-sectional view illustrating a third example configuration of an LED module according to another modified example of the present invention. the

36 is a cross-sectional view of a light bulb-shaped lamp according to another modified example of Embodiment 1 of the present invention. the

Fig. 37 is a schematic cross-sectional view of the lighting device according to the embodiment of the present invention. the

Detailed ways

Embodiments of the present utility model will be described in detail below using the drawings. In addition, all the embodiments described below are one preferable example of the present invention. Numerical values, shapes, materials, components, arrangement positions and connection modes of the components shown in the following embodiments are examples, and do not limit the gist of the present invention. Therefore, among the constituent elements in each of the following embodiments and modifications, constituent elements not described in the independent claims showing the highest concept of the present invention are described as arbitrary constituent elements. the

In addition, each figure is a schematic figure, and is not a strict illustration. In addition, in each figure, the same code|symbol is attached|subjected to the component which is substantially the same, and repeated description is abbreviate|omitted or simplified. the

(implementation mode 1)

Embodiment 1 of this invention is demonstrated below. the

[The overall composition of the bulb-shaped lamp] 

First, the overall configuration of the light bulb-shaped lamp 1 according to Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 3 . the

FIG. 1 is a side view of a light bulb-shaped lamp 1 according to the present embodiment. FIG. 2 is an exploded perspective view of the light bulb-shaped lamp 1 according to this embodiment. FIG. 3 is a cross-sectional view of the light bulb-shaped lamp 1 according to the present embodiment. the

2 and 3, the upper part of the paper is the front (upper) of the light bulb-shaped lamp 1, the lower part of the paper is the rear (below) of the light bulb-shaped lamp 1, and the left and right sides of the paper are the sides of the light bulb-shaped lamp 1. sideways. Here, in this specification, "rear" refers to the direction on the base side based on the substrate of the LED module, and "front" refers to the direction on the opposite side to the base based on the substrate of the LED module. "Side" refers to a direction parallel to the main surface of the substrate of the LED module. In addition, in FIG. 3 , the dashed-dotted line drawn along the vertical direction of the page indicates the lamp axis J (central axis) of the light bulb-shaped lamp 1 . The lamp axis J refers to an axis that becomes the center of rotation when the lightbulb-shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base. In addition, the definition of the above-mentioned direction has nothing to do with the direction when the lightbulb-shaped lamp 1 is attached to a lighting fixture. When the lightbulb-shaped lamp 1 is attached to a lighting fixture, either direction may be upward or downward. The same applies to the definition of this direction hereinafter. the

The lightbulb-shaped lamp 1 is a lightbulb-shaped LED lamp (LED light bulb) that becomes a substitute for a lightbulb-shaped fluorescent lamp or an incandescent bulb. The bulb-shaped lamp 1 includes a translucent glove 10 , an LED module 20 as a light source, a base 30 for receiving power from outside the lamp, a post 40 , a support 50 , a resin case 60 , a lead wire 70 , and a lighting circuit 80 . the

The lightbulb-shaped lamp 1 includes a globe 10 , a resin case 60 (first case portion 61 ), and a base 30 to form a peripheral. Moreover, the structure of the lightbulb-shaped lamp 1 in this embodiment is equivalent to 60W type|mold luminance. the

Hereinafter, each component of the lightbulb-shaped lamp 1 which concerns on this embodiment is demonstrated in detail. the

[Dome cover]

The glove 10 is a translucent cover for accommodating the LED module 20 and transmitting the light from the LED module 20 to the outside of the lamp. The light of the LED module 20 incident on the inner surface of the glove 10 passes through the glove 10 and is extracted to the outside of the glove 10 . the

The glove 10 in this embodiment is made of a material that is transparent to light from the LED module 20 . Such a glove 10 may be, for example, a glass bulb (transparent bulb) made of silica glass that is transparent to visible light. In this case, the LED module 20 accommodated in the glove 10 can be seen from the outside of the glove 10. the

As shown in FIG. 2 , the shape of the glove 10 is that one end is closed in a spherical shape, and the other end has an opening 11 . Specifically, the shape of the glove 10 is such that a part of the hollow ball becomes narrower as it extends away from the center of the ball, and the opening 11 is formed at a position away from the center of the ball. As the glove 10 having such a shape, a glass bulb having the same shape as a general incandescent bulb can be used. For example, glass bulbs such as A-shape, G-shape, or E-shape can be used as the glove 10 . the

In addition, the glove 10 does not need to be transparent to visible light, but the glove 10 may have a light diffusion function. For example, the inner or outer surface of the spherical cover 10 is coated with resin or white pigment containing silica or calcium carbonate light diffusing material, so as to form a milky white light diffusing film. In addition, the material of the glove 10 is not limited to the glass material, and a resin material made of synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used. the

[LED module]

The LED module 20 has an LED (LED chip), is a light emitting module (light emitting device) that emits light by electric power supplied to the LED through the lead wire 70 , and can emit light of a predetermined wavelength (color). The LED module 20 is held in the inner space of the glove 10 by the support 40 . the

The LED module 20 is preferably disposed at the center of the spherical shape formed by the glove 10 (for example, the inner space of the glove 10 having a large inner diameter). Thus, by arranging the LED module 20 at the center of the glove 10, the light distribution characteristic of the bulb-shaped lamp 1 becomes a light distribution characteristic similar to that of a conventional general incandescent light bulb using a filament coil. the

In addition, the detailed structure of the LED module 20 is mentioned later. the

[lamp holder]

The base 30 is a power receiving unit for receiving electric power for causing the LEDs of the LED module 20 to emit light from the outside of the light bulb-shaped lamp 1 . The base 30 receives alternating current through two contacts, and the electric power received by the base 30 is input to the power input part of the lighting circuit 80 via lead wires. For example, the base 30 is supplied with alternating current from a commercial power supply (AC100V). Specifically, the base 30 is attached to a socket of a lighting fixture (lighting device), and receives AC power from the socket. Accordingly, the light bulb-shaped lamp 1 (LED module 20 ) is turned on. the

The base 30 is a bottomed cylindrical shape (cover shape) made of metal, a case part with a male thread on the outer peripheral surface, and a contact piece part attached to the case part through an insulating part. A screwing portion for screwing to a socket of a lighting device is formed on the outer peripheral surface of the base 30 , and a screwing portion for screwing to the resin case 60 is formed on the inner peripheral surface of the base 30 . the

The type of the base 30 is not particularly limited, and the screw-type Edison screw (E-type) base is used in this embodiment. as. The use of the base 30 includes, for example, an E26 shape, an E17 shape, or an E16 shape. In addition, a plug-in type base may be used as the base 30 . the

[pillar]

The post 40 is a metal mandrel (metal post) extending from the vicinity of the opening 11 of the glove 10 to the inner space of the glove 10 , and functions as a holding member for holding the LED module 20 in the glove 10 . One end of the support 40 is connected to the LED module 20 , and the other end is connected to the support stand 50 . the

The pillar 40 functions as a heat dissipation member for dissipating heat generated in the LED module 20 to the base 30 side. Therefore, by using a metal material with high thermal conductivity as the support 40, for example, aluminum (Al), copper (Cu) or iron (Fe) with a thermal conductivity of about 237 [W/m·K] is used as the main component to form the support. 40, so that the heat dissipation efficiency can be improved through the support 40. As a result, it is possible to suppress reductions in luminous efficiency and lifetime of LEDs due to temperature rise. As the metal material of the pillar 40, copper or the like may be used in addition to the aluminum alloy. In addition, as the support 40 , a metal film may be formed on the surface of a support made of resin or the like. the

The support column 40 is constituted by, for example, integral molding of the main shaft portion 41 and the fixing portion 42 . The main shaft portion 41 is a cylindrical member with a constant cross-sectional area. One end of the main shaft part 41 is connected to the fixing part 42 , and the other end is connected to the support stand 50 . The fixing portion 42 has a fixing surface for fixing the LED module 20 , and the fixing surface is in contact with the back surface of the substrate of the LED module 20 . The fixing part 42 further has a protrusion protruding from the fixing surface, and the protrusion is fitted into a through hole provided in the substrate of the LED module 20 . The fixing surfaces of the LED module 20 and the fixing part 42 are adhered with a resin adhesive such as silicone resin, for example. the

Moreover, in this embodiment, the back surface of the board|substrate 21 in the LED module 20 is fixed to the support|pillar 40 so that it may contact the support|support 40. As shown in FIG. According to this, since the heat radiation efficiency of the LED module 20 can be improved, the fall of the luminous efficiency of LED and the fall of lifetime by temperature rise can be suppressed. the

[support stand]

The support stand (support plate) 50 is a member for supporting the support column 40 and is fixed to the resin case 60 . The support stand 50 is connected to the opening end of the opening 11 of the glove 10 and is configured to close the opening 11 of the glove 10 . Specifically, the support stand 50 is constituted by a disk-shaped member having a stepped portion on the peripheral edge thereof, and the stepped portion abuts on the opening end of the opening portion 11 of the glove 10 . And, at the stepped portion, the support table 50, the resin case 60, and the opening end of the opening 11 of the glove 10 are fixed by an adhesive. the

Like the pillar 40 , the support stand 50 is made of a metal material with high thermal conductivity such as aluminum, so that the heat radiation efficiency of the LED module 20 conducted to the pillar 40 can be improved through the support stand 50 . As a result, it is possible to suppress a decrease in luminous efficiency and a decrease in lifetime of the LED due to temperature rise. In addition, the support stand 50 and the pillar 40 may be integrally molded by the same die. the

[Resin shell]

The resin case 60 is not only insulating the support 40 and the lamp cap 30, but also an insulating case (circuit holder) for accommodating the lighting circuit 80. The casing part 62 is formed. The resin case 60 is formed of, for example, polybutylene terephthalate (PBT). the

The outer surface of the first case portion 61 is exposed to the outside, and the heat conducted to the resin case 60 is mainly dissipated from the first case portion 61 . The second housing portion 62 is configured such that its outer peripheral surface is in contact with the inner peripheral surface of the base 30 , and a screwing portion for screwing into the base 30 is formed on the outer peripheral surface of the second housing portion 62 . the

[leader]

The two lead wires 70 are a pair of lead wires for supplying electric power for lighting the LED module 20 from the lighting circuit 80 to the LED module 20 , and are composed of wire-like metal wires such as copper wires. Each lead wire 70 is arranged in the inner space of the glove 10 , and one end is electrically connected to the external terminal of the LED module 20 , and the other end is connected to the power output part of the lighting circuit 80 , that is, is electrically connected to the base 30 . the

The two lead wires 70 are made of a metal core wire and an insulating resin covering the core wire, such as a vinyl resin wire, and are electrically connected to the LED module 20 through the core that is not covered by the insulating resin and thus exposed on the surface. line to connect. At this time, the portions where the two lead wires 70 protrude from the front surface of the substrate 21 and the core wires of the portion that protrudes 3 mm or less from the back surface of the substrate 21 may not be covered with an insulating resin. the

In addition, the connection relationship between the lead wire 70 and the LED module will be described in detail later. the

[lighting circuit]

The lighting circuit 80 is a drive circuit (circuit unit) for lighting the LEDs of the LED module 20 and is covered by the resin case 60 . The lighting circuit 80 includes a circuit for converting the AC power supplied from the base 30 into a DC power, and supplies the converted DC power to the LEDs of the LED module 20 through the two lead wires 70 . the

The lighting circuit 80 is composed of, for example, a circuit board and a plurality of circuit elements (electronic elements) mounted on the circuit board. The circuit board is a printed circuit board formed by patterning metal wiring, and a plurality of circuit elements mounted on the circuit board are electrically connected to each other. In this embodiment, the circuit board is arranged, for example, in a state where the main surface is perpendicular to the lamp axis. In addition, the circuit elements are, for example, various capacitance elements, resistance elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, semiconductor elements such as integrated circuit elements, etc., and the lighting circuit 80 is derived from these It is constructed by properly selecting among circuit elements. the

In addition, the light bulb-shaped lamp 1 does not need to include the lighting circuit 80 . For example, when direct-current power is directly supplied to the lightbulb-shaped lamp 1 from a lighting fixture, a battery, etc., the lightbulb-shaped lamp 1 does not need to be equipped with the lighting circuit 80. In addition, the lighting circuit 80 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like may be appropriately selected and combined. the

[Detailed composition of LED module]

Next, the detailed structure of the LED module 20 is demonstrated using FIG. 4. FIG. FIG. 4 shows the structure of the LED module in the lightbulb-shaped lamp 1 which concerns on this embodiment. 4(a) is a plan view of the LED module 20 viewed from above, FIG. 4(b) is a sectional view of the LED module 20 at the line AA' of (a), and FIG. 4(c ) is a sectional view of the LED module 20 at the BB' line of (a), (d) of FIG. 4 is a sectional view of the LED module 20 at the CC' line of (a), and FIG. 4 (e) is a cross-sectional view of the LED module 20 at the DD' line of (a). the

The LED module 20 is a light-emitting module (light-emitting device) that emits light mainly forward and sideways, and has a COB (Chip On Board: Chip On Board) structure in which bare chips are directly mounted on the surface of the substrate 21 . the

As shown in FIG. 4 , the LED module 20 includes: a substrate 21 , a first main light emitting portion ML1 and a second main light emitting portion ML2 disposed on the substrate 21 , and a first main light emitting portion ML1 and a second main light emitting portion ML1 disposed on the substrate 21 . The first sub light emitting part SL1 between the two main light emitting parts ML2, the third main light emitting part ML3 and the fourth main light emitting part ML4 arranged on the substrate 21, and the third main light emitting part ML3 arranged on the substrate 21 and the second sub-light emitting portion SL2 between the fourth main light-emitting portion ML4. Moreover, the LED module 20 is equipped with the metal wiring 26, the lead wire 27, and the terminal 28 other than this. the

As shown in (a) and (b) of FIG. 4 , the first main light emitting unit ML1 includes a plurality of LEDs 22 a (first light emitting elements) arranged in a row on the surface (first surface) of the substrate 21 , And the 1st wavelength conversion member WC1 which converts the wavelength of the light which LED22a emits. That is, 1st main light emitting part ML1 is a light emitting part which has a light emitting element itself, and some LED22a exists in 1st wavelength conversion member WC1. the

In the first main light emitting unit ML1, a plurality of LEDs 22a are linearly arranged in a row, and the first wavelength conversion member WC1 is provided in a linear manner on the surface of the substrate 21 along the arrangement direction (column direction) of the plurality of LEDs 22a. the

The first wavelength conversion member WC1 includes: a first wavelength conversion material (not shown) that converts the wavelength of light emitted by the LED 22a; and a first seal that includes the first wavelength conversion material and seals a plurality of LEDs 22a together Part 23a. The 1st sealing member 23a is linearly provided on the surface of the board|substrate 21 so that several LED22a arrange|positioned linearly may be covered. the

As shown in FIG. 4( e ), the shape of the first wavelength converting member WC1 in a cross section perpendicular to the longitudinal direction of the first wavelength converting member WC1 (first sealing member 23 a ) is substantially semicircular. And each of some LED22a is arrange|positioned so that it may be located in the center position of the width|variety of 1st wavelength conversion member WC1 substantially. That is, the column centerline (the line passing through the center of each LED22a) along the row direction of a plurality of LED22a, and the centerline (passing through the center line of the first wavelength conversion component WC1) along the longitudinal direction of the first wavelength conversion component WC1 The line at the center of the width) is basically the same. the

The first sub light emitting unit SL1 is composed of a second wavelength conversion member WC2 that converts the wavelength of light emitted by LED22a of the first main light emitting unit ML1 and LED22b of the second main light emitting unit ML2. The first sub-light-emitting part SL1 itself does not have an LED, but is a light-emitting part that emits light from an LED outside the first sub-light-emitting part SL1. As shown in FIG. There is a light-emitting element capable of emitting light whose wavelength is converted by the second wavelength conversion member WC2. In this embodiment, the first sub-light emitting section SL1 is constituted only by the second wavelength conversion member WC2. the

The second wavelength conversion member WC2 of the first sub-light emitting part SL1 includes: a second wavelength conversion material (not shown) for converting the wavelengths of light emitted by both LED22a and LED22b; and a second wavelength conversion material containing the second wavelength conversion material. A dummy sealing member 24a. The first dummy sealing member 24a can be made of the same sealing material as the first sealing member 23a and the second sealing member 23b, and has the same appearance as the first sealing member 23a and the second sealing member 23b. The second wavelength converting member WC2 (first dummy sealing member 24 a ) is provided linearly between the first sealing member 23 a and the second sealing member 23 b on the substrate 21 . the

The configuration of the second main light emitting unit ML2 is the same as that of the first main light emitting unit ML1. In this embodiment, the second main light emitting unit ML2 is composed of a plurality of LEDs 22b (second light emitting elements) arranged in a row on the surface of the substrate 21, and a third wavelength light that converts the wavelength of light emitted by the LEDs 22b. The conversion part WC3 constitutes. That is, the second main light emitting unit ML2 is the same as the first main light emitting unit ML1, and is a light emitting unit having a light emitting element itself, and a plurality of LEDs 22b are present in the third wavelength converting member WC3. the

In the second main light emitting unit ML2, the plurality of LEDs 22b are linearly arranged in a row similarly to the LEDs 22a, and the third wavelength conversion member WC3 is linearly provided along the arrangement direction (column direction) of the plurality of LEDs 22b. on the surface of the substrate 21. the

The third wavelength conversion member WC3 includes: a third wavelength conversion material (not shown) that converts the wavelength of light emitted by the LED 22b; and a second seal that includes the third wavelength conversion material and seals a plurality of LEDs 22b together Part 23b. The 2nd sealing member 23b is linearly provided on the surface of the board|substrate 21 so that several LED22b arrange|positioned linearly may be covered. the

As shown in FIG. 4( e ), the shape of the third wavelength converting member WC3 in a cross section perpendicular to the longitudinal direction of the third wavelength converting member WC3 (second sealing member 23 b ) is approximately semicircular. And each of some LED22b is arrange|positioned so that it may be located in the center position of the width|variety of the 3rd wavelength conversion member WC3 substantially. That is, the column centerline (the line passing through the center of each LED22b) along the column direction of a plurality of LED22b, and the centerline along the direction of the longitudinal direction of the third wavelength conversion component WC3 (passing through the center line of the third wavelength conversion component WC3) The line at the center of the width) is basically the same. the

The configuration of the third main light emitting unit ML3 is the same as that of the first main light emitting unit ML1. In this embodiment, the third main light emitting unit ML3 is composed of a plurality of LEDs 22c (third light emitting elements) arranged in a row on the surface of the substrate 21, and a fourth wavelength light that converts the wavelength of light emitted by the LEDs 22c. Transform component WC4. That is, the third main light emitting unit ML3 is a light emitting unit having a light emitting element itself like the first main light emitting unit ML1, and a plurality of LEDs 22c exist in the third wavelength conversion member WC3. the

In the third main light emitting unit ML3, a plurality of LEDs 22c are linearly arranged in a row like the LEDs 22a, and a fourth wavelength conversion member WC4 is provided in a linear manner on the substrate along the arrangement direction (column direction) of the plurality of LEDs 22c. 21 surfaces. the

As shown in FIG. 4( e ), the shape of the fourth wavelength converting member WC4 in a cross section perpendicular to the longitudinal direction of the fourth wavelength converting member WC4 (third sealing member 23 c ) is substantially semicircular. And each of some LED22c is arrange|positioned so that it may be located in the center position of the width|variety of 4th wavelength conversion member WC4 substantially. That is, the column centerline (the line passing through the center of each LED22c) along the row direction of a plurality of LED22c, and the centerline (passing through the width of the fourth wavelength conversion component WC4) along the longitudinal direction of the fourth wavelength conversion component WC4 Center line) is basically the same. the

The fourth wavelength conversion component WC4 includes: a fourth wavelength conversion material (not shown) that converts the wavelength of light emitted by the LED22c, and a third sealing material (not shown) that contains the fourth wavelength conversion material and seals a plurality of LED22c together. Part 23c. The 3rd sealing member 23c is linearly provided in the surface of the board|substrate 21 so that several LED22c arrange|positioned linearly may be covered. the

The second sub light emitting unit SL2 is composed of a fifth wavelength conversion member WC5 that converts the wavelength of light emitted by the LED 22c in the third main light emitting unit ML3 and the LED 22d in the fourth main light emitting unit ML4. Like the first sub-light emitting portion SL1, the second sub-light emitting portion SL2 does not have an LED itself, and is a light-emitting portion that emits light from an LED outside the second sub-light-emitting portion SL2, and does not exist in the fifth wavelength conversion member WC5. A light-emitting element capable of emitting light whose wavelength is converted by the fifth wavelength converting member WC5. the

In this embodiment, the second sub-light emitting portion SL2 does not have LEDs, and unlike the first sub-light emitting portion SL1, as shown in FIG. Zener diode 25 (semiconductor electronic components, etc.). The Zener diode 25 is for preventing LED22a-22d with a low reverse withstand voltage from being destroyed by the electric power (static electricity etc.) of the reverse direction polarity, and LED22a-22d is provided and connected in parallel by reverse polarity. In this embodiment, one Zener diode 25 is provided on the substrate 21 . the

The fifth wavelength conversion member WC5 of the second sub-light emitting part SL2 includes: a fifth wavelength conversion material (not shown) for converting the wavelengths of light emitted by both LED22c and LED22d; and a fifth wavelength conversion material containing the fifth wavelength conversion material. Two dummy sealing parts 24b. The second dummy sealing member 24b can be made of the same sealing material as the third sealing member 23c and the fourth sealing member 23d, and the third sealing member 23c and the fourth sealing member 23d are identical in appearance. The fifth wavelength conversion member WC5 (second dummy sealing member 24 b ) is provided linearly between the first sealing member 23 a and the second sealing member 23 b on the substrate 21 . the

The Zener diode 25 in the second sub-light emitting portion SL2 is sealed by the second dummy sealing member 24b. In addition, other non-light-emitting semiconductor electronic elements may be used in the second dummy sealing member 24b other than Zener diodes. the

The configuration of the fourth main light emitting unit ML4 is the same as that of the third main light emitting unit ML1. In this embodiment, the fourth main light-emitting unit ML4 is composed of a plurality of LEDs 22d (fourth light-emitting elements) arranged in a row on the surface of the substrate 21, and a sixth wavelength converter that converts the wavelength of light emitted by the LEDs 22d. Component WC6. That is, the fourth main light emitting unit ML4 is a light emitting unit having a light emitting element itself like the third main light emitting unit ML3, and a plurality of LEDs 22d exist in the fourth wavelength conversion member WC4. the

In the fourth main light emitting unit ML4, a plurality of LEDs 22d are linearly arranged in a row like the LEDs 22a, and a sixth wavelength converting member WC6 is formed on the surface of the substrate 21 along the direction in which the plurality of LEDs 22d are arranged (column direction). set in a straight line. the

The sixth wavelength conversion member WC6 includes: a sixth wavelength conversion material (not shown) that converts the wavelength of light emitted by the LED 22d; Part 23d. 4th sealing member 23d is provided linearly on the surface of the board|substrate 21 so that several LED22d arrange|positioned linearly may be covered. the

As shown in (e) of FIG. 4 , the shape of the sixth wavelength conversion member WC6 in a cross section perpendicular to the longitudinal direction of the sixth wavelength conversion member WC6 (fourth sealing member 23 d ) is approximately semicircular. And each of some LED22d is arrange|positioned so that it may be located in the center position of the width|variety of the 6th wavelength conversion member WC6 substantially. That is, a plurality of LED22d along the column center line (the line passing through the center of each LED22d) along the column direction, and the center line (passing the width center of the sixth wavelength conversion component WC6) going along the length direction of the sixth wavelength conversion component WC6 line) are basically the same. the

In the LED module 20 having such a configuration, six wavelength conversion components are arranged side by side. The six wavelength conversion components are: the first wavelength conversion component WC1 (first sealing component 23a), the second wavelength conversion component WC2 (first dummy seal component 24a), third wavelength conversion component WC3 (second sealing component 23b), fourth wavelength conversion component WC4 (third sealing component 23c), fifth wavelength conversion component WC5 (second dummy sealing component 24b), and sixth wavelength conversion component WC5 (second dummy sealing component 24b) Conversion member WC6 (fourth sealing member 23d). In addition, in the present embodiment, these wavelength conversion members are arranged in parallel with each other in the longitudinal direction. the

Furthermore, the second wavelength conversion member WC2 (first dummy sealing member 24a) disposed between the first wavelength conversion member WC1 (first sealing member 23a) and the third wavelength converting member WC3 (second sealing member 23b), Preferably, the first wavelength conversion member WC1 (first sealing member 23 a ) and the third wavelength conversion member WC3 (second sealing member 23 b ) are arranged close to each other so as not to contact each other. Similarly, the fifth wavelength converting member WC5 (second dummy sealing member 24b) disposed between the fourth wavelength converting member WC4 (third sealing member 23c) and the sixth wavelength converting member WC6 (fourth sealing member 23d), Preferably, the fourth wavelength conversion member WC4 (third sealing member 23c ) and the sixth wavelength conversion member WC6 (fourth sealing member 23d ) are arranged close to each other so as not to contact each other. the

Furthermore, in this embodiment, three first to third wavelength conversion members WC1 to WC3 are arranged at equal intervals. Similarly, the three fourth wavelength conversion components WC3 to sixth wavelength conversion components WC6 are also arranged at equal intervals. the

Each component of the LED module 20 will be described in more detail below. the

[substrate]

The substrate 21 can be a translucent substrate or a non-transparent substrate. The substrate 21 is, for example, a ceramic substrate made of a ceramic material such as alumina or aluminum nitride, a resin substrate, a glass substrate, a flexible substrate, or a resin-coated metal substrate (a metal-based substrate). The substrate 21 is a rectangular mounting substrate (substrate for mounting LEDs) on which LED22a, 22b, and 32 are mounted. Substrate 21 adopts a relatively large substrate in order to ensure heat dissipation. For example, if the length of the long side is L1, the length of the short side is L2, and the thickness is d, for example, it can be L1=30mm, L2= 18mm, d=1mm. the

The substrate 21 can be constituted by a white substrate such as a white alumina substrate or a metal substrate having a low transmittance to light emitted by the LEDs 22a to 22d, for example, a white alumina substrate having a total transmittance of 10% or less. In addition, the substrate 21 can be made of a substrate having any one of Al ₂ O ₃ (aluminum oxide), MgO, SiO, and TiO ₂ as a main component having a light reflectance to the light emitted by the LEDs 22a to 22d of 50% or more. to form. In this way, by using a substrate with a low light transmittance as the substrate 21 , it is possible to suppress light that passes through the substrate 21 and is emitted from the rear surface, thereby suppressing color unevenness. In addition, cost reduction can be achieved by using an inexpensive white substrate.

In addition, as the substrate 21 , a translucent substrate having a high light transmittance can also be used. For example, as the substrate 21, a substrate with a total transmittance of 80% or more for visible light, or a substrate that is transparent to visible light, that is, has a very high transmittance and can be seen from the opposite side, can be used. As such a translucent substrate, a translucent ceramic substrate composed of polycrystalline alumina or aluminum nitride, a transparent glass substrate composed of glass, a crystal substrate composed of crystal, a sapphire substrate composed of sapphire or Transparent resin substrates made of transparent resin materials, etc. In this way, by using a light-transmitting substrate with high light transmittance as the substrate 21, even if the LED chip is mounted on only one of the front surface and the back surface of the substrate 21, the light emitted by the LED chip can be made Since light is transmitted through the substrate 21, light can be emitted from the surface on which the LED chip is not mounted. the

One through-hole 21 a for penetrating through the substrate 21 is provided at the central portion of the substrate 21 . This through-hole 21a is used to fix the LED module 20 to the support 40, and the protrusion part 42b of the support 40 is fitted in the through-hole 21a. The through hole 21 a and the protrusion 42 b have a rectangular shape when viewed in plan, and function as a position specifying portion for determining the position or orientation of the substrate 21 . Moreover, even without the through-hole 21a, the LED module 20 can be fixed to the support|pillar 40 with an adhesive agent. Therefore, the through-hole 21a may not be provided. the

In addition, two through-holes 21b for penetrating the substrate 21 are provided at both ends in the longitudinal direction of the substrate 21. These two through-holes 21b constitute the terminal 28 for connecting the lead wire 70 for power feeding and the LED module 20 . the

[LED]

LED22a-22d is a semiconductor light emitting element which emits light with predetermined electric power. A plurality of LED22a to 22d are mounted on the surface (1st surface) of the board|substrate 21, respectively. And the some LED22a-22d is each arranged at the same interval in the longitudinal direction of the board|substrate 21. As shown in FIG. The some LED22a-22d is connected in series in each element row, and the element rows are mutually connected in parallel. the

In the present embodiment, the LEDs 22a to 22d all use the same LED, for example, a blue LED chip that emits blue light when energized. As the blue LED chip, for example, a gallium nitride-based semiconductor light-emitting element with a center wavelength of 440 nm to 470 nm is used, which is made of an InGaN-based material. the

Here, LED22a-22d used for this embodiment is demonstrated using FIG. 5. FIG. FIG. 5 is an enlarged cross-sectional view around LEDs (LED chips) in the LED module 20 of the light bulb-shaped lamp 1 according to Embodiment 1 of the present invention. Moreover, although the periphery of LED22a was shown in FIG. 5, the periphery of LED22b - 22d is also the same structure. the

As shown in FIG. 5 , LED 22 a has a sapphire substrate 122 a and a plurality of nitride semiconductor layers 122 b stacked on the sapphire substrate 122 a and composed of different compositions. the

A cathode electrode 122c and an anode electrode 122d are provided at both ends of the upper surface of the nitride semiconductor layer 122b. In addition, a wire bonding portion 122e is provided on the cathode electrode 122c, and a wire bonding portion 122f is provided on the anode electrode 122d. For example, in adjacent LED22a, the cathode electrode 122c of one LED22a and the anode electrode 122d of the other LED22a are connected by the wire 27 via the wire bonding part 122e and 122f. the

LED22a is fixed to the board|substrate 21 by the translucent die-bonding material 122g so that the surface of the sapphire board|substrate 122a side may oppose the front or back of the board|substrate 21. A silicone resin or the like containing a filler made of metal oxide can be used for the die-bonding material 122g. By using a translucent material for 122 g of die bond materials, the loss of the light emitted from the side surface of LED22a can be reduced, and the shadow by 122g of die bond materials can be suppressed. the

[Sealing parts]

The 1st sealing member 23a, the 2nd sealing member 23b, the 3rd sealing member 23c, and the 4th sealing member 23d seal the metal wiring 26 in addition to collectively sealing each element row of LED22a-22d. In addition, the first dummy sealing member 24a does not seal LEDs and metal wiring. In addition, the second dummy sealing member 24b does not seal the LED, but seals the Zener diode 25 and the metal wiring 26. the

The first sealing member 23a is made of an insulating resin material containing phosphor particles as a first wavelength conversion material. Similarly, the second sealing member 23b is composed of an insulating resin material containing phosphor particles as the third wavelength conversion material, the third sealing member 23c is composed of an insulating resin material containing phosphor particles as the fourth wavelength conversion material, and the third sealing member 23c is composed of an insulating resin material containing phosphor particles as the fourth wavelength conversion material. The fourth sealing member 23d is made of an insulating resin material containing phosphor particles as a sixth wavelength conversion material. the

The first dummy sealing member 24a is made of an insulating resin material containing phosphor particles as the second wavelength conversion material. Similarly, the second dummy sealing member 24b is made of an insulating resin material containing phosphor particles as the fifth wavelength conversion material. the

The phosphor particles in each of the first sealing member 23a to the fourth sealing member 23d and the first dummy sealing member 24a to the second dummy sealing member 24b are excited by the light emitted by the LEDs 22a to 22d to emit desired The color (wavelength) of light. In this embodiment, the first sealing member 23a, the second sealing member 23b, the third sealing member 23c, the fourth sealing member 23d, the first dummy sealing member 24a, and the second dummy sealing member 24b all have the same configuration, Consists of the same phosphor particles and the same sealing resin material. the

As the phosphor particles, when the LEDs 22a to 22d are blue LED chips that emit blue light, phosphor particles that convert the wavelength of blue light into yellow light are used in order to emit white light from each sealing member. For example, YAG (yttrium, aluminum, garnet)-based yellow phosphor particles can be used as the phosphor particles. Accordingly, part of the blue light emitted by the LEDs 22a to 22d is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing members. That is, the yellow phosphor particles emit blue light as excitation light. And, the blue light that is not absorbed by the yellow phosphor particles (without wavelength conversion) and the yellow light that is wavelength-converted by the yellow phosphor particles are diffused and mixed in each sealing member, thereby emitting white light from each sealing member. ejected from the component. the

Each sealing member having such a configuration can be formed, for example, by applying and curing an uncured gel-like sealing member material containing a wavelength conversion material from a dispenser. the

Furthermore, as a material of each sealing member, a transparent resin material such as a silicone resin or an organic material such as a fluorine-based resin can be used. In the present embodiment, as the first sealing member 23a to the fourth sealing member 23d and the first dummy sealing member 24a to the second dummy sealing member 24b, silicone resin containing predetermined phosphor particles dispersed therein can be used. Phosphor resin. In addition, as the material of the sealing member, inorganic materials such as low-melting glass or sol-gel glass can be used in addition to resin. In addition, light diffusion materials such as silicon particles may be dispersed in each sealing member. the

[Metal wiring]

The metal wiring 26 is a conductive wiring for passing a current for causing the LED to emit light, and is patterned in a predetermined shape on the surface (first surface) of the substrate 21 . the

A plurality of metal wirings 26 are formed to connect in series between a plurality of LEDs 22a, a plurality of LEDs 22b, a plurality of LEDs 22c, and a plurality of LEDs 22d in each LED element column. Each of the wires 26 is formed in an island shape between adjacent LEDs. And the metal wiring 26 is for connecting each element row|line|column of LED22a-22d in parallel, and is pattern-formed in the predetermined shape in the both ends of the board|substrate 21. the

And the metal wiring 26 is pattern-formed in the predetermined shape so that the Zener diode 25 and LED22a-22d may be connected in parallel of reverse polarity. the

The metal wiring 26 is simultaneously patterned using the same metal material. As a metal material of the metal wiring 26, silver (Ag), tungsten (W), copper (Cu), etc. can be used, for example. In addition, the surface of the metal wiring 26 may be plated with nickel (Ni) or gold (Au). In addition, the metal wiring 26 may be made of a different metal material, and may be formed in different steps. the

Also, for the metal wiring 26 exposed from the sealing member of each wavelength converting member, except for the terminal 28, it is preferable to use a glass film (glass coating film) formed of a glass material or a resin film (resin coating film) formed of a resin material. film) covering. In this way, insulation in the LED module 20 can be improved. the

[wire]

The wire 27 is an electric wire for connecting LED22a-22d and the metal wiring 26, and the Zener diode 25 and the metal wiring 26, for example, is a gold wire. As illustrated in FIG. 5 , each of the wire bonding portions 122e and 122f provided on the upper surface of the LED 22a and the metal wiring 26 formed adjacent to both sides of the LED 22a are wire-bonded by the wire 27 . the

In order not to expose the lead wire 27 from the sealing member of each wavelength conversion member, the lead wire 27 is completely embedded in the sealing member. the

[terminal]

The terminal 28 is an external connection electrode to be soldered to the lead wire 70 , and is a connection pad formed in a predetermined shape on the surface of the substrate 21 so as to surround the through hole 21 b. The terminal 28 and the metal wiring 26 are integrally formed, and the same metal material as the metal wiring 26 is used, and the metal wiring 26 is patterned at the same time. the

In addition, the terminal 28 is a power supply part of the LED module 20 , and receives power from the outside of the LED module 20 to make the LEDs 22 a to 22 d emit light, and supplies the received power to the LEDs 22 a to 22 d through the metal wiring 26 and the wire 27 . the

[The connection relationship between the LED module and the pillars and the leads] 

Next, the connection relationship of the LED module 20, the support|pillar 40, and the lead wire 70 is demonstrated using FIG. 6. FIG. FIG. 6 shows the configuration around the LED module in the light bulb-shaped lamp 1 according to this embodiment. 6( a ) is a plan view of the LED module 20 viewed from above with the globe 10 removed from the bulb-shaped lamp 1 , and FIG. 6( b ) is the XX' line of (a). 4 (c) is a cross-sectional view of the light bulb-shaped lamp 1 on the YY' line of (a). the

As shown in (a) and (b) of FIG. 6 , the protrusions 42 b of the pillars 40 are fitted into the through holes 21 a of the substrate 21 . Accordingly, the LED module 20 is fixed to the pillar 40 in a state where the position and orientation of the substrate 21 are prescribed. the

The LED module 20 and the lead wire 70 are physically and electrically connected by the conductive adhesive member 29 . The conductive adhesive member 29 is a conductive adhesive such as solder or silver paste that connects the terminal 28 and the lead wire 70 . The conductive adhesive member 29 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28 . The conductive adhesive member 29 is provided so as to close the opening of the through-hole 21b on the front side of the substrate 21 . the

Here, the conductive adhesive member 29 may be covered with an insulating resin. Moreover, the light transmittance of this insulating resin with respect to the light emitted from LED22a-22d is low, for example, 10% or less white resin may be sufficient. the

The LED module 20 is connected to the two lead wires 70 by the conductive adhesive member 29 . At this time, the lead wire 70 is electrically connected to the terminal 28 , and first, the lead wire 70 is inserted through the opening on the back side of the through hole 21 b and inserted through the opening on the front side of the through hole 21 b. Thereafter, the conductive adhesive member 29 is provided so as to be in contact with both the surface side portion of the lead wire 70 and the terminal 28 . the

Moreover, in the LED module 20 shown in FIG. 6, the lead wire 70 is provided so that the front-end|tip may be exposed from the surface of the conductive adhesive member 29, and may be completely covered with a conductive adhesive member. In this case, since the contact area between the lead wire 70 and the conductive adhesive member 29 increases, the connection and fixation of both can be strengthened. the

[Effect]

Next, the effect of the LED module 20 according to this embodiment will be described using FIG. 7 . 7 is a diagram for explaining the effect of the LED module 20 in the light bulb-shaped lamp 1 according to Embodiment 1 of the present invention, (a) is a partly enlarged cross-sectional view of the LED module 200 of Comparative Example 1, (b) ) is a partially enlarged cross-sectional view of the LED module 201 of Comparative Example 2, and (c) is a partially enlarged cross-sectional view of the LED module 20 in the first embodiment. the

As shown in (a) of FIG. 7 , the LED module 200 of Comparative Example 1 is composed of a first sealing member 23 a (containing phosphor resin) that seals LED 22 a and a second sealing member 23 b (containing phosphor resin) that seals LED 22 b. Adjacently, as shown in this embodiment, the first dummy sealing member 24a is not formed. the

In the LED module 200 of Comparative Example 1, as the area of the substrate 21 increases, the distance between the first sealing member 23a and the second sealing member 23b increases. As a result, the region where the first sealing member 23a and the second sealing member 23b are not formed (non-light-emitting portion) increases, resulting in an area of the substrate 21 where the first sealing member 23a and the second sealing member 23b are formed (light-emitting portion). Part) and the region (non-light-emitting part) where the first sealing member 23a and the second sealing member 23b are not formed, there is a significant difference in brightness, resulting in uneven brightness. the

Therefore, as shown in the LED module 201 according to Comparative Example 2 shown in FIG. (LED22a and LED22b). For example, the sealing member 23A is formed so that the planar shape of the sealing member 23A becomes a rectangle. the

However, in such a configuration, since the upper surface of the sealing member 23A is flat, the light emitted from the inside of the sealing member 23A to the outside (the light emitted from the LEDs 22a and 22b and the light emitted from the phosphor particles) passes through the sealing member 23A. The ratio of reflection on the upper surface (the interface between the sealing member 23A and the air layer) increases. In this way, the ratio of light emitted from the inside of the sealing member 23A to the outside decreases, resulting in a decrease in light extraction efficiency. Therefore, in an LED module having such a configuration, it is not possible to achieve a high light beam. the

On the other hand, in the LED module 20 in this embodiment shown in FIG. A first dummy sealing member 24a (first sub-light emitting portion SL1 ) is provided therebetween. the

Accordingly, the light emitted from the LED 22a in the first main light emitting unit ML1 can be excited by the phosphor particles of the first sealing member 23a (first wavelength conversion member WC1) covering itself, and can also be excited by the first sealing member 23a (first wavelength conversion member WC1). Phosphor particles of the first dummy sealing member 24a (second wavelength conversion member WC2 ) adjacent to 23a are excited. Similarly, the light emitted from the LED 22b in the second main light emitting unit ML2 can be excited by the phosphor particles of the second sealing member 23b (third wavelength conversion member WC3) covering itself, and can also be excited by the second sealing member 23b (third wavelength conversion member WC3). Phosphor particles of the first dummy sealing member 24a (second wavelength conversion member WC2 ) adjacent to 23b are excited. the

In this embodiment, both LEDs 22a and 22b are blue LED chips that emit blue light, and the phosphor particles (wavelength conversion material) in the first sealing member 23a, the second sealing member 23b, and the first dummy sealing member 24a ) are yellow phosphor particles. Therefore, the blue light emitted from the first main light emitting part ML1 (first sealing member 23a), the second main light emitting part ML2 (second sealing member 23b), and the first sub light emitting part SL1 (first dummy sealing member 24a) The yellow light converted in wavelength by the yellow phosphor particles is mixed with the blue light not converted in wavelength by the yellow phosphor particles to emit white light as mixed light. the

Thus, with the LED module 20 in this embodiment, not only the first sealing member 23a and the second sealing member 23b can emit light, but the first dummy sealing member 24a can also emit light. That is, the first dummy sealing member 24a can function as a pseudo-light emitting portion. As a result, since the first sealing member 23a, the second sealing member 23b, and the first dummy sealing member 24a can function as light emitting parts, the substrate 21 can be suppressed from The difference between light and shade in the film can be suppressed, and unevenness in brightness can be suppressed. the

Moreover, in the LED module 20 in this embodiment shown in FIG. 7(c), the cross-sectional shape of each of the three sealing members (phosphor-containing resin) is a dome-shaped cross-section (almost semicircular). ), therefore, total reflection can be suppressed at the interface between the sealing member and the air layer when light is emitted from the sealing member to the outside. Therefore, in the LED module 20 of this embodiment, the fall of the light extraction efficiency shown to Fig.7 (b) does not arise. the

Furthermore, in the lightbulb-shaped lamp 1 in this embodiment, since the LED module 20 shown in FIG. the

In addition, in the LED module 20 in this embodiment, the concentration of the phosphor particles (second wavelength conversion material) in the first dummy sealing member 24a and the concentration of the phosphor particles (first wavelength conversion material) in the first sealing member 23a are compared. color conversion material) and/or the concentration of phosphor particles (third wavelength conversion material) in the second sealing member 23b, thereby enabling color adjustment. In this case, it is preferable that the concentration of phosphor particles in the first dummy sealing member 24a is lower than the concentration of phosphor particles in the first sealing member 23a and the second sealing member 23b. This point will be described below. the

In the first sealing member 23a, the second sealing member 23b, and the first dummy sealing member 24a, if the concentrations of phosphor particles in the respective sealing members are the same, the phosphor particles formed on both sides of the central first dummy sealing member 24a The light emitted by the LEDs of both the first sealing member 23a and the second sealing member 23b will be incident on the first dummy sealing member 24a, so that the white light emitted from the first dummy sealing member 24a will be larger than that of the first sealing member 23a and the first dummy sealing member 24a. The white light emitted from the second sealing member 23b turns yellow (light with strong yellow). In this way, color unevenness occurs between the first dummy seal member 24a, the first seal member 23a, and the second seal member 23b. the

Therefore, by making the concentration of phosphor particles in the first dummy sealing member 24a smaller than the concentrations of phosphor particles in the first sealing member 23a and the second sealing member 23b, the wavelength in the first dummy sealing member 24a can be reduced. The conversion efficiency is lower than the wavelength conversion efficiency in the first sealing member 23a and the second sealing member 23b. Accordingly, it is possible to suppress the generation of yellow light in the first dummy sealing member 24a, and it is possible to make the light emitted by the first dummy sealing member 24a closer to white. In this way, color unevenness between the first dummy sealing member 24a, the first sealing member 23a, and the second sealing member 23b can be suppressed. the

For example, the concentration of the phosphor particles in the first dummy sealing member 24a can be set to 15% to 40% of the concentrations of the phosphor particles in the first sealing member 23a and the second sealing member 23b. the

In addition, for the suppression (color adjustment) of color unevenness in the first sealing member 23a, the second sealing member 23b, and the first dummy sealing member 24a, it is not necessary to adjust the concentration of the phosphor particles of each sealing member, but to It is to adjust the height of each sealing part. For example, the concentrations of phosphor particles in the first sealing member 23a, the second sealing member 23b, and the first dummy sealing member 24a are set to be the same, and the height of the first dummy sealing member 24a is set to be higher than that of the first sealing member. 23a and the second sealing member 23b are low in height, so that the wavelength conversion efficiency of the first dummy sealing member 24a can be reduced. Accordingly, it is possible to suppress generation of yellow light in the first dummy sealing member 24a. As a result, color unevenness between the first dummy sealing member 24a, the first sealing member 23a, and the second sealing member 23b can be suppressed. the

Alternatively, by adjusting the lengths of the first sealing member 23a, the second sealing member 23b, and the first dummy sealing member 24a, the first sealing member 23a, the second sealing member 23b, and the first Color adjustment (suppression of color unevenness) in the dummy sealing member 24a. For example, the concentrations of phosphor particles in the first sealing member 23a, the second sealing member 23b, and the first dummy sealing member 24a are set to be the same, and the length of the first dummy sealing member 24a is set to be equal to that of the first sealing member 23a. And below the length of the second sealing member 23b, the color between the first dummy sealing member 24a and the first sealing member 23a and the second sealing member 23b is not uniform like this. the

Moreover, in FIG. 7(c), although the first main light emitting portion ML1 (first sealing member 23a), the second main light emitting portion ML2 (second sealing member 23b), and the first sub light emitting portion SL1 (first sealing member 23b ) A dummy sealing member 24a) has been described, the third main light-emitting portion ML3 (third sealing member 23c), the fourth main light-emitting portion ML4 (fourth sealing member 23d), and the second auxiliary light-emitting portion SL2 (second dummy sealing member 23d). The same applies to component 24b). the

In addition, in this embodiment, the first sub-light-emitting part SL1 (first dummy part 23b) exists between the first main light-emitting part ML1 (first sealing member 23a) and the second main light-emitting part ML2 (second sealing member 23b). The sealing member 24a) has been described, however, only one of the first main light emitting portion ML1 (first sealing member 23a) and the second main light emitting portion ML2 (second sealing member 23b) is connected to the first sub light emitting portion SL1 ( It is also applicable to the case where the first dummy sealing member 24a) exists. That is, the present invention can also be applied to the case where only one main light emitting part is adjacent to one sub light emitting part. In this way, by arranging the sub-light emitting portion adjacent to the main light-emitting portion, it is possible to suppress the difference in brightness and darkness on the substrate. the

(Modification of Embodiment 1)

Next, a modified example of the LED module 20 included in the light bulb-shaped lamp 1 will be described. the

(Modification 1 of Embodiment 1)

Next, Modification 1 of Embodiment 1 will be described using FIG. 8A . 8A is a plan view of an LED module 20A in Modification 1 of Embodiment 1 of the present invention. the

As shown in FIG. 8A , the configuration of the LED module 20A in this modified example is further provided with a third sub-light emitting portion SL3 compared with the LED module 20 shown in FIG. 4 . the

The third sub-light emitting unit SL3 is composed of a seventh wavelength conversion member WC7 that converts the wavelength of light emitted by the LED 22b in the second main light-emitting unit ML2 and the LED 22c in the third main light-emitting unit ML3. That is, the third sub-light emitting portion SL3 does not have an LED itself like the first sub-light-emitting portion SL1, but is a light-emitting portion that emits light from an LED outside the third sub-light-emitting portion SL3. Inside, there is no light-emitting element that emits light whose wavelength is converted by the seventh wavelength converting member. In this modified example, the third sub light emitting unit SL3 is constituted only by the seventh wavelength conversion member WC7. the

The seventh wavelength conversion member WC7 includes a seventh wavelength conversion material (not shown) that converts the wavelengths of light emitted by both LED22b and LED22c, and a third dummy sealing member 24c including the seventh wavelength conversion material. The third dummy sealing member 24c is made of the same sealing material as the first dummy sealing member 24a and the second dummy sealing member 24b, and is also identical in appearance to the first dummy sealing member 24a and the second dummy sealing member 24b. the

In this modified example, the third dummy sealing member 24c (seventh wavelength converting member WC7) is linearly provided on the substrate 21 between the second sealing member 23b (third wavelength converting member WC3) and the third sealing member 23c ( between the fourth wavelength conversion components WC4). That is, in this modified example, in the LED module 20 shown in FIG. Three dummy sealing members 24c. the

As described above, according to the LED module 20A in this modified example, the third dummy sealing member 24c (second sealing member 24c) is provided between the second sealing member 23b (second main light emitting portion ML2) and the third sealing member 23c (third main light emitting portion ML3). Three sub-light emitting parts SL3). Accordingly, the pseudo light-emitting portion can also be generated in the region between the second sealing member 23b and the third sealing member 23c. As a result, in the LED module 20 in FIG. 4 , the difference between brightness and darkness in the substrate 21 can be further suppressed, and unevenness in luminance can be further suppressed. the

Furthermore, in this modified example as well, color unevenness can be suppressed by adjusting the concentration of phosphor particles in each sealing member or adjusting the height of each sealing member. the

(Modification 2 of Embodiment 1)

Next, Modification 2 of Embodiment 1 will be described using FIG. 8B . 8B is a plan view of an LED module 20B in Modification 2 of Embodiment 1 of the present invention. the

As shown in FIG. 8B , the structure of the LED module 20B in this modified example is compared with the LED module 20 shown in FIG. 4 , and the fourth sub-light emitting part SL4 is further provided. the

In this modified example, four fourth sub-light emitting parts SL4 are provided, and each fourth sub-light emitting part SL4 consists of two ends in the longitudinal direction (longitudinal direction) of the first main light-emitting part ML1 to the fourth main light-emitting part ML4. The eighth wavelength conversion member WC8 for converting the wavelength of light emitted by the LEDs 22a to 22d is configured. That is, like the first sub-light emitting part SL1, the fourth sub-light emitting part SL4 does not have an LED itself, but is a light-emitting part that emits light from an LED outside the fourth sub-light emitting part SL4. In WC8, there is no light-emitting element that emits light whose wavelength is converted by the eighth wavelength conversion member WC8. In this modified example, the fourth sub-light emitting section SL4 is composed of only the eighth wavelength conversion member WC8. the

The eighth wavelength conversion member WC8 includes an eighth wavelength conversion material (not shown) that converts the wavelength of light emitted by the LEDs 22a to 22d, and a fourth dummy sealing member 24d including the eighth wavelength conversion material. The fourth dummy sealing member 24d is made of the same sealing material as that of the first dummy sealing member 24a, and is also identical in appearance to the first dummy sealing member 24a. the

In this modified example, four fourth dummy sealing members 24d (eighth wavelength conversion members WC8) are provided on the first sealing member so as to sandwich the first sealing member 23a to the fourth sealing member 23d in the longitudinal direction. 23a to both ends of the fourth sealing member 23d. The longitudinal directions of the four fourth dummy sealing members 24d are almost perpendicular to the longitudinal directions of the first to fourth sealing members 23a to 23d. That is, in this modified example, in the LED module 20 shown in FIG. 4 , the fourth dummy sealing member is provided so as to fill up spaces on both sides in the longitudinal direction from the first sealing member 23 a to the fourth sealing member 23 d. 24d, as the fourth sub-light emitting part SL4. the

As mentioned above, according to the LED module 20B in this modified example, the first sealing member 23a (first main light emitting portion ML1 ) to the fourth sealing member 23d (fourth main light emitting portion ML4 ) are provided on both sides in the longitudinal direction. Four dummy sealing members 24d (fourth sub-light emitting portion SL4). Accordingly, pseudo light emitting portions can also be generated in regions on both sides in the longitudinal direction from the first sealing member 23 a (first main light emitting portion ML1 ) to the fourth sealing member 23 d (fourth main light emitting portion ML4 ). As a result, in the LED module 20 in FIG. 4 , the difference between light and shade in the substrate 21 can be further suppressed, and unevenness in luminance can be further suppressed. the

Moreover, the structure of this modification can also be applied to 20 A of LED modules in FIG. 8A. Furthermore, in this modified example as well, color unevenness can be suppressed by adjusting the concentration of phosphor particles in each sealing member or adjusting the height of each sealing member. the

(Modification 3 of Embodiment 1)

Next, a light bulb-shaped lamp according to Modification 3 of Embodiment 1 will be described with reference to FIG. 9 . (a) of FIG. 9 is a plan view of the LED module viewed from above with the glove removed in the lightbulb-shaped lamp according to this modification, and (b) of FIG. 9 is XX' of (a). The sectional view of this bulb-shaped lamp on the line, (c) of Fig. 9 is the sectional view of this bulb-shaped lamp on the YY' line of (a), and (d) of Fig. 9 is the Z- Sectional view of the bulb-shaped lamp on the Z' line. the

Compared with the LED module 20 shown in FIG. 4 , the LED module 20C in this modified example has a light-emitting element and a sealing member formed on the back surface (second surface) of the substrate 21, and is equipped with an LED module that mainly emits light toward the front and sideways. The main LED module (first light-emitting module) 20a, and the sub-LED module (second light-emitting module) 20b that mainly emits light toward the rear and sides. the

As shown in (a) to (d) of FIG. 9 , the main LED module (main light-emitting module) 20a includes: a substrate 21, a plurality of LEDs 22a to 22d, a first sealing member 23a to a fourth sealing member 23d, a first dummy seal The member 24 a and the second dummy sealing member 24 b , Zener diode 25 (not shown), metal wiring 26 , lead wire 27 , terminal 28 , and conductive adhesive member 29 . the

In addition, the sub-LED module (sub-light-emitting module) 20b includes a substrate 21, a plurality of LEDs 32a (fifth light-emitting elements) and a plurality of LEDs 32b (sixth light-emitting elements) provided on the back surface (second surface) of the substrate 21, and includes Phosphor particles (ninth wavelength conversion material) and fifth sealing member 33a (ninth wavelength conversion member) that collectively seals a plurality of LEDs 32a, including phosphor particles (tenth wavelength conversion material) and fifth sealing member The fifth dummy sealing member 34a (tenth wavelength conversion member) adjacent to 33a, the sixth sealing member 33b (eleventh wavelength conversion member) containing phosphor particles (eleventh wavelength conversion material) and collectively sealing a plurality of LEDs 32b converting member), sixth dummy sealing member 34b (twelfth wavelength converting member) containing phosphor particles (twelfth wavelength converting material) adjacent to sixth sealing member 33b, metal wiring 36, lead wire 37, terminal 38, and the conductive adhesive member 39. the

In addition, in this modified example, it is considered that two modules, the main LED module 20a and the sub LED module 20b, are integrated into one LED module. In this case, one LED module is composed of one substrate 21 , a plurality of LEDs mounted on the front surface and the rear surface of the substrate 21 , a sealing member collectively sealing each LED row, and a dummy sealing member. That is, the substrate 21 is a substrate shared by the main LED module 20a and the sub LED module 20b. the

In this modified example, since the structure of the main LED module 20a is the same as that of the LED module 20 shown in FIG. 4, the description is abbreviate|omitted. the

In the sub LED module 20b, several LED32a, 32b of the back side are arrange|positioned at the same interval in the longitudinal direction of the board|substrate 21, respectively. Several LED32a, 32b is connected in series in each element row, and each element row is connected in parallel. LED32a and 32b on the back side are opposed to LED22a and 23d on the front side with the board|substrate 21 interposed in between. LED32a and 32b in this modification are the same as LED22a-22d, and are blue LED chips. the

Furthermore, the fifth sealing member 33a and the sixth sealing member 33b on the back side are formed in a linear shape facing the first sealing member 23a and the fourth sealing member 23d with the substrate 21 interposed therebetween. The fifth sealing member 33a and the sixth sealing member 33b have the same configuration as the first sealing member 23a to the fourth sealing member 23d, and collectively seal each element row of the LEDs 32a and 32b and seal the metal wiring 36 . the

In this modified example, the fifth sealing member 33a and the sixth sealing member 33b are the same as the first sealing member 23a to the fourth sealing member 23d, and a phosphor-containing resin in which predetermined phosphor particles are dispersed in silicone resin is used. the

Furthermore, the fifth dummy sealing member 34a and the sixth dummy sealing member 34b on the rear side are formed in a straight line to face the first dummy sealing member 24a and the second dummy sealing member 24b with the substrate 21 interposed therebetween. The configuration of the fifth dummy sealing member 34a and the sixth dummy sealing member 34b is the same as that of the first dummy sealing member 24a, they do not include LEDs themselves, and are light emitting parts that emit light from external LEDs. the

Specifically, the fifth dummy sealing member 34a is a silicone resin (phosphor-containing resin) containing phosphor particles (wavelength conversion material) that converts the wavelength of light emitted by the LED 32a. And the 6th dummy sealing member 34b is silicone resin (phosphor-containing resin) containing the phosphor particle (wavelength conversion material) which converts the wavelength of the light which LED32b emits. the

In addition, in this modified example, the configurations of the metal wiring 36, the lead wire 37, the terminal 38, and the conductive adhesive member 39 are the same as those of the metal wiring 26, the lead wire 27, the terminal 28, and the conductive adhesive member 29, and thus are omitted. illustrate. the

As mentioned above, according to the LED module 20C in this modified example, not only the surface of the substrate 21, but also the back surface of the substrate 21 is formed with the sealing member (light emitting part) having the LED, therefore, not only the top side of the dome cover can emit light, but also the base side can emit light. It can also emit light. Accordingly, light distribution characteristics with a large light distribution angle can be realized, and a light bulb-shaped LED lamp having a light distribution characteristic closer to that of an incandescent light bulb can be realized. the

Furthermore, in this modified example, the fifth dummy sealing member 34a and the second dummy sealing member 34a can be provided adjacent to the main light emitting part (LED32a, 32b and fifth and sixth sealing members 33a, 33b) provided on the back side of the substrate 21. Six dummy sealing members 34b. According to this, even on the back side of the substrate 21 , pseudo light-emitting portions adjacent to the fifth sealing member 33 a and the sixth sealing member 33 b can be formed. As a result, not only the front side of the substrate 21 but also the back side can suppress the brightness difference, and the brightness unevenness on the back side of the substrate 21 can be suppressed. the

In addition, in this modified example, in the fifth sealing member 33a and the fifth dummy sealing member 34a, and in the sixth sealing member 33b and the sixth dummy sealing member 34b, it is also possible to The concentration of particles is adjusted, or the height of each sealing member is adjusted to suppress color unevenness. the

(Modification 4 of Embodiment 1)

Next, a light bulb-shaped lamp according to Modification 4 of Embodiment 1 will be described with reference to FIG. 10 . (a) of FIG. 10 is a plan view of the LED module viewed from above with the glove removed in the lightbulb-shaped lamp according to this modification, and (b) of FIG. 10 is the XX' line of (a). The cross-sectional view of the light bulb-shaped lamp above, (c) of Figure 10 is the cross-sectional view of the light bulb-shaped lamp on the Y-Y' line of (a), and (d) of Figure 10 is the Z-Z of (a) 'A cutaway view of the bulb-shaped lamp on the line. the

In the lightbulb-shaped lamp in Modification 3 described above, the main LED module 20a and the sub-LED module 20b are constituted by providing the light source and the wiring for making the light source emit light on both the front and back surfaces of one substrate 21. With two modules, light can be extracted from the top side of the globe of the bulb-shaped lamp as well as from the head side. On the other hand, in this modified example, light-emitting elements and wiring for making the light-emitting elements emit light are respectively provided on the surfaces of the two substrates, and the back surfaces of the two substrates are bonded to form one substrate 21 . Even in such a configuration, light can be taken out from the globe top side and base side of the bulb-shaped lamp 1 . Therefore, the lightbulb-shaped lamp 1 according to this modification differs from the above-mentioned lightbulb-shaped lamp 1 in Embodiment 1 in that, on the respective surfaces of the substrate 21 of the LED module, the light-emitting element and the The two substrates of the wiring where the light-emitting element emits light. Hereinafter, it demonstrates in detail centering on the difference from the lightbulb-shaped lamp 1 of Embodiment 1 mentioned above. the

Like the LED module 20C in Modification 3, the LED module 20D in this modification includes: a main LED module (first light emitting module) 20a that mainly emits light forward and sideways; The sub-LED module (second light-emitting module) 20b, the LED module 20D in this modification is different from the modification 3, the substrate 21 is composed of a substrate 21X (first substrate) as a main substrate and a substrate 21Y (second substrate) as a sub-substrate. substrate) configuration. the

As shown in (a) to (d) of FIG. 10 , the main LED module 20a includes a substrate 21X (first substrate), a plurality of LEDs 22a to 22d provided on the surface of the substrate 21X, and a plurality of LEDs 22a to 22d provided on the surface of the substrate 21X. The first sealing member 23a to the fourth sealing member 23d, the first dummy sealing member 24a and the second dummy sealing member 24b provided on the surface of the substrate 21X. And the main LED module 20a is provided with the Zener diode 25 (not shown) provided in the board|substrate 21X, the metal wiring 26, the lead wire 27, the terminal 28, and the electroconductive adhesive member 29. the

Furthermore, the sub LED module (sub light emitting module) 20b includes: a substrate 21Y, a plurality of LEDs 32a and 32b provided on the surface of the substrate 21Y, a fifth sealing member 33a and a sixth sealing member provided on the surface of the substrate 21Y 33b, fifth dummy seal member 34a and sixth dummy seal member 34b adjacent to fifth seal member 33a and sixth seal member 33b, metal wiring 36, lead wire 37, terminal 38, and conductive adhesive member 39. the

The substrates 21X and 21Y have the same configuration and shape, and their back surfaces are adhered with an adhesive 90 to constitute one substrate 21 . The substrates 21X and 21Y can have the same configuration as the substrate 21 described above. the

Two through-holes 21Xb for penetrating the substrate 21X are provided at both ends in the longitudinal direction of the substrate 21X, and two through-holes 21Xb for penetrating the substrate 21Y are provided at both ends in the longitudinal direction of the substrate 21Y. 21Yb. The through hole 21Xb constitutes the terminal 28 for connecting the lead wire 70 for power feeding and the main LED module 20a, and the through hole 21Yb constitutes the terminal 38 for connecting the lead wire 70 for power feeding and the sub LED module 20b. The through-holes 21Xb and 21Yb are arranged to pass through, thereby constituting the through-hole 21 b of the substrate 21 . Therefore, one lead wire 70 can pass through one through-hole 21Xb and 21Yb penetrating with each other. the

One through-hole 21Xa penetrating the substrate 21X is provided at the central portion of the substrate 21X, and one through-hole 21Ya penetrating the substrate 21Y is provided at the central portion of the substrate 21Y. The through holes 21Xa and 21Ya are used to fix the main LED module 20a and the sub LED module 20b to the pillar 40 , are arranged to pass through each other, and constitute one through hole 21a of the substrate 21 . Therefore, the projection part 42b of the support|pillar 40 is fitted in the through-hole 21Xa and 21Ya which penetrate mutually. The through hole 21 a and the protrusion 42 b function as a position specifying portion for determining the position or orientation of the substrate 21 as described above. the

The adhesive 90 is provided between the back surface of the substrate 21X and the back surface of the substrate 21Y for adhering them together, and is made of, for example, a resin such as silicone resin or a metal paste such as Ag paste. In the case of the metal paste, since the thermal conductivity between the substrate 21X and the substrate 21Y can be increased to increase the thermal conductivity of the substrate 21 , the heat dissipation efficiency of the substrate 21 can be improved. As a result, it is possible to suppress reductions in luminous efficiency and lifetime of LEDs due to temperature rise. In addition, since the light-shielding properties of the adhesive 90 , that is, the light-shielding properties of the substrate 21 are improved, color unevenness due to light from the front surface toward the back surface of the substrates 21X and 21Y can be suppressed. the

Adhesive 90 is not provided at least part of the space between through-holes 21Xb and 21Yb between the rear surface of substrate 21X and substrate 21Y so as not to interfere with the passage of lead wire 70 through through-holes 21Xb and 21Yb. In addition, the adhesive 90 is not covered in the entire space between the through-holes 21Xa and 21Ya between the back surface of the substrate 21X and the back surface of the substrate 21Y so as not to prevent the fitting of the through-holes 21Xa and 21Ya with the protrusions of the pillar 40 . set up. the

As mentioned above, the LED module 20D in this modification can achieve the same effect as Modification 3. As shown in FIG. That is, it is possible to realize a bulb-shaped LED lamp having a light distribution characteristic with a large light distribution angle. In addition, not only the front side of the substrate 21 but also the back side can be suppressed from the difference in brightness, and the brightness unevenness on the back side of the substrate 21 can be suppressed. the

Furthermore, even in this modified example, in the fifth sealing member 33a and the fifth dummy sealing member 34a, and in the sixth sealing member 33b and the sixth dummy sealing member 34b, the concentration of phosphor particles in each sealing member Adjustment or adjustment of the height of each sealing member can suppress color unevenness. the

Furthermore, in this modified example, the substrate 21 is composed of a substrate 21X on which LEDs are provided on the surface, and a substrate 21Y on which LEDs are provided on the surface. Furthermore, the board|substrates 21X and 21Y are arrange|positioned so that the back surface which does not provide LED faces each other. At this time, the sub-LED module 20 b may also be fixed to the pillar 40 by adhesive. Accordingly, the LED module 20D can be easily manufactured by preparing the substrates 21X and 21Y separately in advance, adhering each component on the surface, and manufacturing the LED module 20D in this way. As a result, a light bulb-shaped lamp that is easy to manufacture can be realized. the

Furthermore, in this modified example, the sub LED module 20 b is directly attached to the support 40 , and the heat generated in the sub LED module 20 b is conducted to the support 40 . And the main LED module 20a is indirectly attached to the support|pillar 40 via the sub LED module 20b, and the heat generated in the main LED module 20a is indirectly conducted to the support 40 via the sub LED module 20b. Furthermore, an adhesive 90 as a thermally conductive member is provided between the main LED module 20a and the sub LED module 20b. The adhesive 90 is any one of thermally conductive resin, ceramic paste, and metal paste. Accordingly, since the heat dissipation efficiency and light-shielding performance of the substrate 21 can be improved, not only reduction in luminous efficiency and lifetime of LEDs can be suppressed, but also color unevenness between the main LED module 20a and the sub-LED module 20b can be suppressed. the

In addition, in this modified example, the pillar 40 may pass through the through-hole 21Yb of the substrate 21Y and be in contact with the back surface of the substrate 21X. That is, the through hole 21Yb is formed to fit the entire fixing portion 42 of the support 40 , and the fixing surface of the fixing portion 42 of the support 40 and the back surface of the substrate 21X can be adhered with the adhesive 90 . Thereby, fixing of the main LED module 20a and the sub LED module 20b to the support|pillar 40 becomes easy, and it becomes possible to realize the easy-to-manufacture lightbulb-shaped lamp. In addition, the main LED module 20a is adhesively fixed to the pillar 40, so that the heat dissipation path from the substrate 21X to the pillar 40 can be shortened, and the inner wall of the through-hole 21Yb of the substrate 21Y can be fixed to the pillar 40 through a thermally conductive member such as grease. The portion 42 is in contact with each other, so that the heat dissipation path from the substrate 21Y to the pillar 40 can be enlarged. As a result, reduction in luminous efficiency and lifetime of LED can be suppressed. the

(implementation mode 2)

Hereinafter, Embodiment 2 of this invention is demonstrated. the

(The overall composition of the bulb-shaped lamp)

First, the overall configuration of the light bulb-shaped lamp 2 according to Embodiment 2 will be described with reference to FIGS. 11 and 12 . Fig. 11 is an external perspective view of a light bulb-shaped lamp according to Embodiment 2 of the present invention. Furthermore, Fig. 12 is an exploded perspective view of a light bulb-shaped lamp according to Embodiment 2 of the present invention. the

As shown in FIGS. 11 and 12 , the lightbulb-shaped lamp 2 according to this embodiment is a lightbulb-shaped LED lamp as a substitute for a lightbulb-shaped fluorescent lamp or an incandescent bulb, and includes a globe 210 , an LED module 220 as a light source, The supporting member 240 supporting the LED module 220, the housing 250 in which the driving circuit 270 is disposed, the metal member 260 disposed in the housing 250, the driving circuit 270 supplying power to the LED module 220, and the Lamp cap 280. In addition, the light bulb-shaped lamp 2 includes lead wires 270 a to 270 d, an annular coupling member 230 , and screws 290 . In addition, the bulb-shaped lamp 2 includes a glove 210 , a frame body 250 (outer frame body portion 252 ), and a base 280 to form an enclosure. That is, the glove 210, the frame body 250 (outer frame body portion 252), and the base 280 are exposed to the outside, and their respective outer surfaces are exposed to the outside air. Moreover, the structure of the lightbulb-shaped lamp 2 in this embodiment is equivalent to 40W type in brightness, for example. the

Hereinafter, each component of the lightbulb-shaped lamp 2 which concerns on this embodiment is demonstrated using FIG. 13 and FIG. 14 with reference to FIG. 12. FIG. FIG. 13 has shown one cross section of the light bulb-shaped lamp 1 which concerns on Embodiment 2 of this invention. FIG. 14 shows another cross-section of the structure of the light bulb-shaped lamp 1 according to Embodiment 2 of the present invention, and is a cross-sectional view showing a rotation of about 90° around the lamp axis from the state of FIG. 13 . In addition, the lamp axis is an axis that becomes the center of rotation when the light bulb-shaped lamp 2 is attached to the socket of the lighting device, and coincides with the rotation axis of the base 280 . In addition, in FIG. 13 and FIG. 14, except for the circuit element, only the cross-sectional portion of each component is shown. In addition, illustration of circuit elements is omitted in FIG. 14 . the

[Dome cover]

As shown in FIGS. 12 to 14 , the configuration of the glove 210 is the same as that of the glove 10 in the first embodiment. the

[LED module]

The LED module 220 is the same as the LED module 20 in Embodiment 1. It is a light-emitting module (light-emitting device) that has an LED (LED chip) and emits light by the power supplied to the LED through the lead wires 270a and 270b, and emits a predetermined wavelength. of light. The LED module 220 is held by the support member 240 in the inner space of the glove 210 . the

As shown in FIGS. 13 and 14 , the LED module 220 is arranged in the inner space of the glove 210 . The LED module 220 is preferably disposed at the center of the spherical shape formed by the glove 210 (for example, the inner space portion of the glove 210 having a large inner diameter). In this way, by arranging the LED module 220 at the center of the globe 210, the light distribution characteristics of the bulb-shaped lamp 2 can be approximated to that of a conventional incandescent bulb using a filament coil. the

In addition, the detailed configuration of the LED module 220 will be described later. the

[joint parts] 

The bonding member 230 is a member for bonding the glove 210 , the supporting member 240 , and the metal member 260 . As shown in FIG. 12 , the coupling member 230 is formed in a ring shape and surrounds the base 242 (small diameter portion 242 a ) of the supporting member 240 . The coupling member 230 can be molded by curing a fluid insulating resin (for example, silicon) that has flowed into the gap between the outer peripheral surface of the pedestal 242 of the support member 240 and the outer edge portion 252 a of the outer frame portion 252 . the

As shown in FIGS. 13 and 14 , the connecting member 230 includes: a vertical groove portion 230a formed in an annular shape for inserting into the opening 211 of the spherical cover 210; a flange portion (annular convex portion) 230b formed by It is formed to protrude in the lateral direction to be fitted into a lateral groove provided on the pedestal 242 of the support member 240 ; Furthermore, the outer surface of the coupling member 230 is in contact with the inner surface of the outer frame portion 252 of the frame body 250 . the

[support parts]

The supporting member 240 is a member for supporting the LED module 220 and is made of metal. The support member 240 (metal support) is mainly composed of a support 241 positioned in the inner space of the glove 10 and a pedestal 242 mainly surrounded by a frame 250 (outer frame portion 252 ). In this embodiment, the pillar 241 and the pedestal 242 are integrally formed of the same material. the

The strut 241 is a metal mandrel extending from the vicinity of the opening 211 of the glove 210 toward the inner space of the glove 210 . The post 241 functions as a holding member for holding the LED module 220 , one end of the post 241 is connected to the LED module 220 , and the other end of the post 241 is connected to the pedestal 242 . the

Furthermore, since the pillar 241 is made of a metal material, it can function as a heat dissipation member that dissipates heat generated by the LED module 220 . The pillar 241 in this embodiment is made of aluminum alloy. In this way, since the support 241 is made of a metal material, heat generated by the LED module 220 can be efficiently conducted to the support 241 . Thereby, the fall of the light emission efficiency of LED222 by temperature rise, and the fall of a lifetime can be suppressed. the

The support column 241 is comprised of the main shaft part 241a and the fixed part 241b. The main shaft portion 241 a is formed of a cylindrical body with a constant cross-sectional area, one end of the main shaft portion 241 a is connected to the fixed portion 241 b, and the other end of the main shaft portion 241 a is connected to the pedestal 242 . the

And the fixing part 241b has the base 221 of the LED module 220, and the fixing surface (upper surface) to be fixed. This fixing surface is a contact surface where the fixing part 241b (pillar 241) contacts the back surface of the base 221 (the LED module 220). The LED module 220 is placed on the fixing surface of the fixing part 241b, and is adhered to the fixing surface with an adhesive or the like. Furthermore, the fixing part 241b is provided with the protrusion part 241b1 which protrudes toward a fixing surface. The protrusion part 241b1 is comprised so that it may fit in the through-hole 221a provided in the base 221 of the LED module 220. As shown in FIG. The protrusion part 241b1 functions as a position regulation part which regulates the position of the LED module 220, and is comprised in the shape of an elongated shape in planar view. the

The pedestal 242 is a member that supports the pillar 241 , and is configured to close the opening 211 of the glove 210 as shown in FIGS. 13 and 14 . The pedestal 242 is made of a metal material, and is made of an aluminum alloy in the same manner as the pillar 241 in this embodiment. Accordingly, the heat of the LED module 220 conducted to the pillar 241 can be efficiently conducted to the pedestal 242 . Furthermore, the pedestal 242 is a cover-shaped member having a stepped portion, and is composed of a small-diameter portion 242a with a small diameter and a large-diameter portion 242b with a large diameter. the

At the boundary between the small-diameter portion 242a and the large-diameter portion 242b, a lateral groove portion is formed along the circumferential direction of the small-diameter portion 242a. In addition, the connecting member 230 is disposed on the step portion (on the large diameter portion 242b) of the pedestal 242, and the flange portion 230b of the connecting member 230 is fitted into the horizontal groove portion of the pedestal 242, so that the connecting member 230 is fixed to the pedestal. 242. the

As shown in FIGS. 13 and 14 , the small-diameter portion 242 a not only supports the support column 241 , but also is a disk-shaped member configured to close the opening 211 of the glove 210 . The strut 241 is formed in the center of the small-diameter portion 242a. In addition, the outer peripheral surface of the small-diameter portion 242a is in surface-to-surface contact with the inner peripheral surface of the coupling member 230 . In addition, two through-holes 242a1 through which the lead wires 270a and 270b are passed are provided in the small-diameter portion 242a. the

The large-diameter portion 242b is basically formed in a cylindrical shape, and its outer peripheral surface is in surface-to-surface contact with the inner peripheral surface of the metal member 260 . Accordingly, the heat of the support member 240 (pedestal 242 ) can be efficiently conducted to the metal member 260 . In addition, four concave portions 242b1 are formed in the large-diameter portion 242b as guide holes for caulking with the metal member 260 . the

[framework]

The housing 250 is an insulative insulating case in which the driving circuit 270 is arranged, and is composed of an inner housing part (first housing part) 251 and an outer housing part (second housing part) 252 . The frame body 250 can be formed of an insulating resin material, for example, resin molded from polybutylene terephthalate (PBT). the

As shown in FIGS. 13 and 14, the inner frame portion 251 is disposed so as to surround the drive circuit 270, and is an internal component (circuit case) disposed so that it cannot be seen from the outside of the lamp. The inner frame portion 251 has a circuit cover portion 251 a arranged to cover the drive circuit 270 , and a circuit holding portion 251 b arranged to cover the periphery of the drive circuit 270 . The circuit cover part 251a and the circuit holding part 251b are provided separately, and the circuit cover part 251a and the circuit holding part 251b are arranged in a non-contact state. the

The upper surface shape of the circuit cover portion 251 a is configured along the inner surface shape of the pedestal 242 of the supporting member 240 . Accordingly, the circuit cover portion 251 a is fitted into the base 242 of the support member 240 and is screwed to the support member 240 by the screws 290 . the

The circuit holding portion 251b is formed in a cylindrical shape. The cap-side end portion of the circuit holding portion 251b is connected to the outer frame portion 252, and in this embodiment, the circuit holding portion 251b and the outer frame portion 252 are integrally formed. In addition, a stepped portion on which the circuit board 271 of the driving circuit 270 is placed is formed at the end portion of the circuit holding portion 251 b on the glove side. the

In addition, the outer frame portion 252 is at least a part of the lamp enclosure, and is an external member arranged in a state visible from the outside of the lamp. A region other than the portion covered by the cap 280 on the outer peripheral surface of the outer frame portion 252 is exposed to the outside of the lamp. In the present embodiment, the outer frame portion 252 has an outer edge portion 252a exposed to the outside of the lamp and a screwing portion 252b screwed to the base 280 . the

The outer edge portion 252a is formed of a substantially cylindrical member having a diameter larger than that of the screwing portion 252b. In this embodiment, the diameter of the outer edge portion 252a is gradually reduced toward the base 280 side. That is, the inner peripheral surface and the outer peripheral surface of the outer edge portion 252a are inclined with respect to the lamp axis. Since the outer surface of the outer edge portion 252a is exposed to the atmosphere, the heat conducted to the housing 250 is mainly dissipated from the outer surface of the outer edge portion 252a. the

The screwing portion 252b is formed of a substantially cylindrical member having a diameter smaller than that of the outer edge portion 252a. The base 280 is screwed into the screwing part 252b. That is, the outer peripheral surface of the screwing portion 252 b is configured to be in contact with the inner peripheral surface of the base 280 . the

Outer frame portion 252 (outer edge portion 252 a ) having the above configuration is configured to surround inner frame portion 251 , metal member 260 , pedestal 242 of support member 240 , and coupling member 230 . A predetermined interval is provided between the inner surface of the outer frame portion 252 (outer edge portion 252a) and the outer surface of the inner frame portion 251 (circuit cover portion 251a and circuit holding portion 251b). Moreover, in this embodiment, the outer frame body part 252 (outer edge part 252a) is not in contact with the metal member 260, as shown in FIG. There is a certain gap between the outer surfaces. the

[Metal parts]

The metal member 260 is configured in a sleeve shape so as to surround the inner frame portion 251 of the frame body 250 , and is disposed between the inner frame portion 251 and the outer frame portion 252 . Accordingly, the metal member 260 can be in a non-contact state with the drive circuit 270 , and the insulation of the drive circuit 270 can be ensured. the

Furthermore, the metal member 260 is made of a metal material and functions as a heat sink. Accordingly, the heat generated by the LED module 220 and the drive circuit 270 can be efficiently dissipated by the metal member 260 . Specifically, heat from the LED module 220 and the driving circuit 270 is conducted to the outer frame portion 252 via the inner frame portion 251 and the metal member 260 , and is dissipated from the outer frame portion 252 to the outside of the lamp. the

As the metal material of the metal member 260, for example, Al, Ag, Au, Ni, Rh, Pd, or an alloy composed of two or more of these metals, or an alloy of Cu and Ag can be used. Such a metal material can efficiently conduct heat to the metal component 260 due to its good thermal conductivity. the

Also, the metal member 260 is in contact with the supporting member 240 . In the present embodiment, as described above, the inner peripheral surface of the metal member 260 is in surface-to-surface contact with the outer peripheral surface of the pedestal 242 (large-diameter portion 242 b ) of the supporting member 240 . Since both the metal member 260 and the support member 240 are made of metal, the heat of the LED module 220 conducted to the support member 240 can be efficiently conducted to the metal member 260 . the

In addition, the metal member 260 in this embodiment does not contact the outer frame body part 252 (the outer edge part 252a, the twisted part 252b) in the frame body 250, nor does it contact the inner frame body part 251 (the circuit cover part 251a, the circuit The holding portion 251b) is in contact. That is, the metal member 260 is arranged in a non-contact state with both the inner frame portion 251 and the outer frame portion 252 . Accordingly, it is possible to sufficiently ensure the insulation of the entire frame body 250 . the

[Drive circuit]

The drive circuit (circuit unit) 270 has a lighting circuit (power supply circuit) for lighting (lighting) the LED 222 of the LED module 220 , and supplies predetermined electric power to the LED module 220 . For example, the drive circuit 270 includes a circuit for converting AC power supplied from the base 280 into DC power through a pair of lead wires 270c and 270d, and supplies the DC power to the LED module 220 through a pair of lead wires 270a and 270b. the

Moreover, the drive circuit 270 also has the dimming circuit which controls dimming of LED222. That is, the drive circuit 270 controls dimming of the LED 222 by changing the magnitude of the current supplied to the LED 222. the

Here, the drive circuit 270 is composed of a circuit board 271 and a plurality of circuit elements (electronic elements) 272 mounted on the circuit board 271 . The circuit board 271 is a printed circuit board in which metal wiring is patterned, and the plurality of circuit elements 272 mounted on the circuit board 271 are electrically connected to each other. In the present embodiment, the circuit board 271 is arranged such that the main surface is perpendicular to the lamp axis. As shown in FIG. 14 , the circuit board 271 is placed on and sandwiched by the circuit holding portion 251 b of the inner frame portion 251 . the

The circuit element 272 is, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise suppression filters, diodes, or integrated circuit elements. the

The driving circuit 270 having such a configuration is covered by the inner frame portion 251 of the frame body 250 , and thus is in a non-contact state with the metal member 260 . In this way, the insulation of the drive circuit 270 can be ensured. the

In addition, the drive circuit 270 is not limited to a lighting circuit or a dimming circuit, and a booster circuit and the like can be appropriately selected and combined. the

[leader]

The lead wires 270a to 270d are all alloy copper lead wires, and are composed of a core wire made of alloy copper and an insulating resin film covering the core wire. the

A pair of lead wires 270 a and 270 b are wires for supplying direct current power for lighting the LED module 220 from the drive circuit 270 to the LED module 220 . The driving circuit 270 is electrically connected to the LED module 220 by a pair of lead wires 270a and 270b. Specifically, the ends (core wires) at one ends of the lead wires 270a and 270b are electrically connected to the power output portion (metal wiring) of the circuit board 271 by solder or the like, and the ends (core wires) at the other ends It is electrically connected to the power input portion (electrode terminal) of the LED module 220 by solder or the like. the

Furthermore, the pair of lead wires 270c and 270d are wires for supplying AC power from the base 280 to the drive circuit 270 . The drive circuit 270 is electrically connected to the base 280 via a pair of lead wires 270c and 270d. Specifically, the ends (core wires) at one ends of the lead wires 270c and 270d are electrically connected to the lamp base 280 (shell portion or contact piece portion), and the ends (core wires) at the other ends are connected to the circuit board by solder or the like. The power input part (metal wiring) of 271 is electrically connected. the

[lamp holder]

As shown in FIGS. 13 and 14 , the base 280 is a power receiving unit that receives power for causing the LED 222 of the LED module 220 to emit light from the outside of the lamp. The base 280 is attached to, for example, a socket of a lighting fixture, and when the light bulb-shaped lamp 2 is turned on, the base 280 receives electric power from the socket of the lighting fixture. For example, the base 280 is supplied with alternating current from a commercial power supply (AC100V). The base 280 in this embodiment receives AC power through two contacts, and the power received by the base 280 is input to the power input part of the drive circuit 270 through a pair of lead wires 270c and 270b. the

The base 280 has a bottomed cylindrical shape made of metal, and has a case part whose outer peripheral surface is a male thread, and a contact piece part attached to the case part through an insulating part. In addition, the outer peripheral surface of the lamp cap 280 is formed with a screwing part for screwing into the socket of the lighting device, and the inner peripheral surface of the lamp cap 280 is formed with a screwing part 252b for screwing to the outer frame part 252. department. the

The type of the base 280 is not particularly limited, but in this embodiment, a screw-type Edison screw (E-type) base is used. For example, the base used as the base 280 has, for example, an E26 shape, an E17 shape, or an E16 shape. In addition, a plug-in type base may be used as the base 280 . the

[Detailed composition of LED module]

Next, each component of the LED module 220 which concerns on Embodiment 2 of this invention is demonstrated using FIG.15 and FIG.16. FIG. 15 has shown the structure of the LED module which concerns on Embodiment 2 of this invention. That is, (a) of FIG. 15 is a top view (plan view) of the LED module, and (b) of FIG. 15 is a cross-sectional view of the LED module cut along line A1-A1' of (a). the

As shown in (a) and (b) of FIG. 15, the LED module 220 has the base 221, LED222, the sealing member 223a, the wavelength conversion member 223b, and the metal wiring 224. The LED module 220 in this embodiment is the same as the LED module 20 in Embodiment 1, and has a COB structure. Hereinafter, each component of the LED module 220 will be described in detail. the

First, base station 221 is performed. The base 221 is a board|substrate for LED mounting for mounting LED222. The substrate 21 in Embodiment 1 can be used as the base 221 . The base 221 in the present embodiment is composed of a member that is transparent to visible light. By employ|adopting the base 221 which has translucency, the light of LED222 can pass through the inside of the base 221, and can be emitted from the surface (rear surface) to which LED222 is not mounted. Therefore, even when the LED 222 is mounted on only one surface (front) of the base 221, light can be emitted from the other surface (back surface), thereby obtaining a light distribution characteristic similar to that of an incandescent bulb. the

The abutment 221 is preferably made of components with high total transmittance. For example, a ceramic substrate made of sintered alumina (Al ₂ O ₃ ) having a total transmittance of 90% or more for visible light can be used as the base 221 . In addition, as the base 221, a ceramic substrate made of AlN or MgO can also be used.

Furthermore, as the shape of the base 221 in this embodiment, a rectangular substrate having an elongated shape in plan view (when viewed from the top of the glove 210 ) is adopted. In this way, the LED module 20 also has an elongated shape in plan view. the

Furthermore, through-holes 221 a and 221 b are provided in the base 221 . The through-hole 221 a is provided for fitting the base 221 with the fixing part 241 b of the pillar 241 of the support member 240 . In the present embodiment, the through-hole 221 a has a rectangular shape in plan and is formed at a position deviated from the center of the base 221 in the longitudinal direction. On the other hand, two through-holes 221b are provided because they are electrically connected to the two lead wires 270a and 270b, and are provided at both ends in the longitudinal direction of the base 221 in the present embodiment. the

In addition, although a translucent substrate is used as the base 221, a substrate with a low transmittance to the light emitted by the LED 222 (such as a white alumina substrate with a total transmittance of 10% or less) may also be used. and other white substrates). In addition, as the base 221 , an opaque substrate (such as a metal-based substrate) with a total transmittance of almost zero may also be used. Moreover, when using these bases, two bases 221 with LED222, sealing member 223a, and wavelength conversion member 223b formed only on the surface are used, and by bonding the back surfaces of the two bases 221 to each other, a single LED modules. Or one LED module can be comprised by forming LED222, the sealing member 223a, and the wavelength conversion member 223b on both surfaces of one base. the

Next, LED222 is demonstrated. The LED 222 is an example of a semiconductor light emitting element that emits light with predetermined electric power, and is a bare chip that emits monochromatic visible light and is placed on the base 221 . The LED 222 is dimmed by changing the magnitude of the current supplied from the drive circuit 270 . In this embodiment, a blue LED chip capable of emitting blue light when energized is used. And LED222 is mounted only in the surface (surface) of one side of the base 221, and the element row which arrange|positioned some (for example, 12) LED222 in 1 row is arrange|positioned in 4 rows linearly. the

Moreover, although some LED222 was attached in this embodiment, the number of objects of LED222 can be changed suitably according to the use of a lightbulb-shaped lamp. For example, there may be only one LED 222 in a low-output LED lamp that replaces a micro light bulb. Moreover, in the high output type LED lamp, the number of objects of LED222 in one row may be 12 or more. Moreover, in this Embodiment, although some LED222 was mounted in four rows on the base 221, it may be one row or multiple rows other than four rows. the

Moreover, the structure of LED222 used in this embodiment is the same as LED22a (LED chip) in Embodiment 1 shown in FIG. the

Next, the sealing member 223 a and the wavelength conversion member 223 b will be described in detail using FIG. 16 with reference to FIG. 15 . FIG. 16 has shown the structure of the sealing member and the wavelength converting member in the LED module concerning Embodiment 2 of this invention. Specifically, Fig. 16 shows a partially enlarged cross-sectional view of the sealing member and the wavelength conversion member in the LED module cut along the line B1-B1' of Fig. 15(a) . the

The sealing member 223a corresponds to the main light emitting unit (wavelength conversion member) in Embodiment 1, is a light emitting unit having a light emitting element itself, and a plurality of LEDs 222 exist in the sealing member 223a. The sealing member 223a is formed linearly so as to cover (seal collectively) a plurality of LEDs 222 in one row. In this embodiment, since the element rows of LED222 are mounted in four rows, four sealing members 223a are formed. In addition, the sealing member 223a includes a phosphor as an optical wavelength conversion material, and functions as a first wavelength conversion part (first wavelength conversion member) that converts the wavelength of light emitted by the LED222. layer. A phosphor-containing resin in which predetermined phosphor particles (not shown) and a light diffusing material (not shown) are dispersed in a silicone resin can be used as the sealing member 223a. the

As the phosphor particles, when the LED 222 is a blue LED chip that emits blue light, in order to obtain white light, similar to Embodiment 1, YAG-based yellow phosphor particles, for example, can be used. In addition, in this embodiment, since the base 221 having translucency is used, the white light emitted from the sealing member 223 a passes through the inside of the base 221 and is emitted from the back surface of the base 221 . the

Furthermore, similarly to Embodiment 1, red phosphor particles can also be added as phosphor particles included in the sealing member 223a. the

The sealing member 223a having such a configuration can be applied from a dispenser by applying, for example, an uncured paste-like sealing member material (such as silicone resin) containing a wavelength conversion material (such as phosphor particles) as in Embodiment 1. Apply and allow to harden to form. the

Furthermore, the sealing member 223a does not need to be formed of silicone resin, and may be formed of inorganic materials such as low-melting glass or sol-gel glass in addition to organic resins such as fluorine-based resins. the

The wavelength converting member 223b is arranged at a position farther from the LED 222 than the sealing member 223a, and functions as a second wavelength converting member that converts the wavelength of light emitted by the LED 222. Transform layer. Specifically, the wavelength conversion member 223b is a resin disposed on the side of the sealing member 223a on the base 221. That is, two wavelength conversion members 223b are formed linearly between two sealing members 223a. the

The wavelength converting member 223b corresponds to the sub-light emitting unit (dummy sealing member) in Embodiment 1, does not have an LED itself, and is a light emitting unit that emits light from an LED outside the wavelength converting member 223b. In the wavelength conversion member 223b, there is no light-emitting element capable of emitting light through wavelength conversion by the wavelength conversion member 223b. the

The wavelength converting member 223b in this embodiment contains phosphor particles as an optical wavelength converting material similarly to the sealing member 223a, and the wavelength converting member 223b is configured to contain phosphor particles at a higher concentration than the sealing member 223a. Here, the higher the concentration of the phosphor particles, the larger the amount of wavelength conversion of light (wavelength conversion amount). The wavelength conversion amount indicates the degree of conversion of the wavelength of light, and the larger the wavelength conversion amount is, the higher the degree of conversion of the wavelength of light is. That is, the second wavelength conversion amount showing the degree of converting the wavelength of light emitted by the LED 222 in the wavelength converting member 223b is greater than the second wavelength conversion amount showing the degree of converting the wavelength of light emitted by the LED 222 in the sealing member 223a. The first wavelength conversion amount is large. In addition, since the phosphor particles contained in the wavelength conversion member 223b are the same as the phosphor particles contained in the sealing member 223a, detailed description thereof will be omitted. the

Similar to the sealing member 223a, the wavelength conversion member 223b can be formed by, for example, applying an uncured paste-like sealing member material (such as silicone resin) containing a wavelength conversion material (such as phosphor particles) from a dispenser and curing it. form. the

In this embodiment, the sealing member 223a and the wavelength conversion member 223b employ a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin. the

Next, the metal wiring 224 will be described. The metal wiring 224 is, like the metal wiring 26 in Embodiment 1, a wiring made of metal such as Ag patterned on the LED mounting surface (surface), and supplies power to the LED module 220 from the lead wires 270a and 270b. It is supplied to each LED222. Each LED 222 is electrically connected to the metal wiring 224 through the gold wire 225 . the

In addition, the metal wiring 224 formed around the through hole 221b serves as a power feeding portion. The front ends of the two lead wires 270a and 270b pass through the through hole 221b shown in FIG. 13, and are electrically and physically connected to the metal wiring 224 by solder or the like. the

As mentioned above, the light bulb-shaped lamp 2 provided with the LED module 220 which concerns on this embodiment is comprised. In this way, the bulb-shaped lamp 2 in the present embodiment adopts a globe cover (glass bulb) having the same shape as that of an incandescent bulb, and LEDs are arranged on the pillar 241 extending to the inner space of the globe cover 210. Module 220. According to this, a light distribution characteristic with a large light distribution angle can be realized, and a light distribution characteristic similar to that of an incandescent light bulb can be obtained. the

Furthermore, the LED module 220 included in the light bulb-shaped lamp 2 in this embodiment includes a sealing member 223a as a first wavelength converting portion and a wavelength converting member 223b as a second wavelength converting portion, and the wavelength converting member 223b is It is arrange|positioned at the position farther from LED222 than the sealing member 223a. In addition, the degree of converting the wavelength of light emitted by the LED 222 in the wavelength converting member 223b (amount of wavelength conversion) is larger than the degree of converting the wavelength of light emitted by the LED 222 in the sealing member 223a (amount of wavelength conversion). . Here, the effects achieved by the LED module 220 having the above-mentioned configuration will be described using FIG. 17 . the

FIG. 17 is a diagram for explaining effects achieved by the LED module according to Embodiment 2 of the present invention. Specifically, (a) of FIG. 17 has shown the irradiation state of the light which LED222 emits when the electric current supplied to LED222 is small at the time of dimming control. And (b) of FIG. 17 has shown the irradiation state of the light which LED222 emits when the electric current supplied to LED222 is large at the time of dimming control. the

As shown in (a) of FIG. 17 , when the current supplied to the LED 222 is small during dimming control, since the weak light L1 is irradiated from the LED 222 , after passing through the sealing member 223a, the light reaches the wavelength conversion member 223b. The amount of light is less. Here, when the electric current supplied to LED222 is small, since the heat emitted from LED222 is relatively small, the amount of fall of the wavelength conversion efficiency of the sealing member 223a is small. Therefore, the light transmitted through the sealing member 223a is not affected by the decrease in the wavelength conversion efficiency, and can be visually observed by the user. the

And, as shown in (b) of FIG. 17 , when the current supplied to the LED 222 is increased during the dimming control, since the strong light L2 is irradiated from the LED 222 , after passing through the sealing member 223 a, the reaching wavelength is converted. The amount of light of the part 223b increases. Here, when the electric current supplied to LED222 is large, the wavelength conversion efficiency of the sealing member 223a falls because many heat generate|occur|produces from LED222. Therefore, although the light transmitted through the sealing member 223a is affected by the reduction of the wavelength conversion efficiency, the light can also pass through the wavelength conversion member 223b. the

Here, the degree of converting the wavelength of the light emitted by the LED 222 in the wavelength conversion member 223b is larger than the degree of converting the wavelength of the light emitted by the LED 222 in the sealing member 223a. Therefore, since the light can also pass through the wavelength conversion member 223b, the influence of the decrease in the wavelength conversion efficiency due to the sealing member 223a can be reduced. the

As described above, according to the LED module 220 according to Embodiment 2 of the present invention, even in the case of dimming control, it is possible to reduce the influence of the decrease in the wavelength conversion efficiency caused by the light emitted by the LED 222, thereby Changes in the color of emitted light can be suppressed. the

Furthermore, the wavelength converting member 223 b is a resin disposed on the side of the sealing member 223 a on the base 221 . In this way, in the LED module 220, by arranging the wavelength conversion member 223b on the side of the sealing member 223a, the influence of the decrease in the wavelength conversion efficiency due to the light emitted by the LED 222 can be easily reduced, and the output of the emitted light can be suppressed. color change. the

Furthermore, the concentration of phosphor particles contained in the wavelength conversion member 223b is higher than that of the sealing member 223a. In this way, in the LED module 220 , by adjusting the concentration of the phosphor particles, the influence of the decrease in the wavelength conversion efficiency due to the light emitted by the LED 222 can be easily reduced, and the change in the color of the emitted light can be suppressed. the

Moreover, in said Embodiment 2, although the sealing member 223a was arrange|positioned so that the periphery of LED222 may be covered, the sealing member 223a may be arrange|positioned so that at least one part of LED222 may be covered. the

(Modification of Embodiment 2)

Next, a modified example of the LED module 220 included in the light bulb-shaped lamp 2 will be described. In addition, in the following modified examples, the constituent elements other than the LED module included in the light bulb-shaped lamp are the same as the constituent elements included in the light bulb-shaped lamp 2 in Embodiment 2 described above, so the description of the constituent elements other than the LED module is omitted. instruction of. the

(Modification 1 of Embodiment 2)

Each component of 220 A of LED modules which concerns on the modification 1 of Embodiment 2 of this invention is demonstrated using FIGS. 18-20. FIG. 18 has shown the structure of the LED module which concerns on the modification 1 of Embodiment 2 of this invention. That is, (a) of FIG. 18 is a plan view of the LED module, and (b) of FIG. 18 is a cross-sectional view of the LED module cut along line A2-A2' of (a). the

As shown in (a) and (b) of FIG. 18, 220 A of LED modules have the base 221, LED222, the sealing member 223a, the metal wiring 224, and the phosphor layer 227. As shown in FIG. That is, the LED module 220A in this modified example does not have the wavelength converting member 223b of the LED module 220 in Embodiment 2 described above. Furthermore, LED module 220A in this modified example has phosphor layer 227 . Furthermore, the base 221, LED 222, sealing member 223a, and metal wiring 224 included in the LED module 220A are the same as the base 221, LED 222, sealing member 223a, and metal wiring 224 included in the LED module 220 in Embodiment 2 described above. are the same, so detailed description is omitted. the

Phosphor layer 227 will be described with reference to FIGS. 19 and 20 . Fig. 19 is an enlarged cross-sectional view of the LED periphery in the LED module according to Modification 1 of Embodiment 2 of the present invention. Moreover, FIG. 20 is an enlarged cross-sectional view of main parts of an LED module according to Modification 1 of Embodiment 2 of the present invention. Specifically, FIG. 20 is an enlarged cross-sectional view of the configuration around one sealing member of the LED module cut along the line B2-B2' of FIG. 18( a ). the

The phosphor layer 227 is formed between the base 221 and each of the plurality of LEDs 222 , and is a printed phosphor (wavelength conversion member) containing an optical wavelength conversion material that converts the wavelength of light emitted by the LEDs 222 . That is, the phosphor layer 227 is printed on the base 221 , and the LED 222 is mounted on the printed phosphor layer 227 . the

Here, as the optical wavelength conversion material contained in the phosphor layer 227, similar to the sealing member 223a, phosphor particles that are excited by light emitted from the LED 222 and emit light of a desired color (wavelength) are used. For example, the phosphor layer 227 is a sintered body film formed of phosphor particles and a binder for sintering. In addition, since the phosphor particles included in the phosphor layer 227 are the same as the phosphor particles included in the sealing member 223a, detailed description thereof will be omitted. the

In addition, as the binder for sintering, inorganic materials such as glass frit composed of a material mainly composed of silicon dioxide (SiO ₂ ) can be used. The glass frit is a bonding material (bonding material) for bonding phosphor particles to the base 221, and is made of a material with a high transmittance to visible light. Glass frit can be formed by heating and dissolving glass powder. The glass powder used as the glass frit can be SiO ₂ -B ₂ O ₃ -R2 _O system, B ₂ O ₃ -R ₂ O system or P ₂ O ₅ -R ₂ O system (However, R ₂ O is both, Li ₂ O, _Na2O , or _K2O ). In addition, as the material of the binder for sintering, SnO ₂ -B ₂ O ₃ composed of low melting point crystals, etc. can be used other than glass frit.

Moreover, the phosphor layer 227 is formed by being adhered to the base 221 between the base 221 and the LED 222 . That is, the phosphor layer 227 is fixed to the base 221 by the adhesive agent which the phosphor layer 227 itself has. Phosphor layer 227 in this modified example is located directly below each LED 222 and is formed in an island shape on base 221 . That is, the phosphor layer 227 is formed in plural corresponding to every some LED222. And the phosphor layer 227 is formed so that it may not contact the metal wiring 224 formed between adjacent LED222. the

In addition, as shown in FIG. 20, the phosphor layer 227 has a central portion 227a at a central position (the central position on the XY plane), and has an end portion 227b outside the central portion 227a (around the central portion 227a on the XY plane). That is, the central part 227a and the edge part 227b are the phosphor layers formed integrally between the base 221 and LED222. the

The central portion 227a is arranged to cover at least a part of the LED 222, and functions as a first wavelength converting portion that converts the wavelength of light emitted by the LED 222. That is, the center part 227a is a rectangular light wavelength conversion material arrange|positioned below (directly below) LED222. the

The edge part 227b is arrange|positioned at the position farther from LED222 than the center part 227a, and functions as a 2nd wavelength conversion part which converts the wavelength of the light which LED222 emits. That is, the end part 227b is the ring-shaped light wavelength conversion material arrange|positioned so that LED222 may surround. the

And the fluorescent substance layer 227 is comprised so that thickness (width|variety of Z-axis direction) becomes thicker so that it distances from LED222. That is, the end portion 227b is thicker than the center portion 227a. Specifically, the upper surface of the end portion 227b is formed into a curved surface, and the thickness becomes thicker as it is farther away from the center portion 227a. For example, the thickness of the central portion 227a is several tens of μm, and the maximum thickness of the end portion 227b is several hundreds of μm. the

Here, the thicker the thickness, the larger the amount of conversion of the wavelength of light (wavelength conversion amount). The wavelength conversion amount indicates the degree of conversion of the wavelength of light, and the larger the wavelength conversion amount is, the higher the degree of conversion of the wavelength of light is. That is, the second wavelength conversion amount showing the degree of converting the wavelength of light emitted by the LED 222 in the end portion 227b is larger than the second wavelength conversion amount showing the degree of converting the wavelength of light emitted by the LED 222 in the central portion 227a. A large amount of wavelength conversion. In this way, the fluorescent substance layer 227 is comprised so that the wavelength conversion amount of the light which LED222 emits will become large so that it becomes apart from LED222. the

As described above, the LED module 220A in this modified example includes a central portion 227a as a first wavelength conversion portion and an end portion 227b as a second wavelength conversion portion, and the end portion 227b is arranged at a lower distance than the central portion. 227a away from the location of the LED 222 . And the base 221 has translucency, and the central part 227a and the edge part 227b are the phosphor layers formed integrally between the base 221 and LED222. In addition, the degree of converting the wavelength of light emitted by the LED 222 in the end portion 227b (amount of wavelength conversion) is greater than the degree of converting the wavelength of light emitted by the LED 222 in the central portion 227a (amount of wavelength conversion). Therefore, 220 A of LED modules in this modification can achieve the same effect as the LED module 220 in Embodiment 2 mentioned above. Specifically, the effects achieved by the LED module 220A having the above-mentioned configuration will be described using FIG. 21 . the

FIG. 21 is a diagram for explaining effects achieved by the LED module according to Modification 1 of Embodiment 2 of the present invention. Specifically, (a) of FIG. 21 has shown the irradiation state of the light emitted from LED222 when the electric current supplied to LED222 is small at the time of dimming control. Moreover, (b) of FIG. 21 has shown the irradiation state of the light emitted from LED222 when the electric current supplied to LED222 is large at the time of dimming control. the

As shown in (a) of FIG. 21 , when the current supplied to the LED 222 is small during dimming control, the light L3 directed toward the back side of the base 221 reaches the end because the LED 222 is irradiated with weak light. The amount of light of 227b is less. Here, when the electric current supplied to LED222 is small, since the heat which LED222 generate|occur|produces is small, the amount of fall of the wavelength conversion efficiency of the phosphor layer 227 is also small. Therefore, the light irradiated from LED222 is not affected by the fall of wavelength conversion efficiency, and can be seen visually by a user. the

And, as shown in FIG. 21( b ), when the current supplied to the LED 222 is large during dimming control, since the LED 222 is irradiated with strong light, the light L4 directed toward the back side of the base 221 The amount of light reaching the end portion 227b increases. Here, when the electric current supplied to LED222 is large, since the heat which LED222 generate|occur|produces increases, the wavelength conversion efficiency of the phosphor layer 227 falls. Therefore, although the light irradiated from LED222 is affected by the fall of wavelength conversion efficiency, this light can pass through the end part 227b. the

Here, the degree of converting the wavelength of the light emitted by the LED 222 in the end portion 227b is larger than the degree of converting the wavelength of the light emitted by the LED 222 in the center portion 227a. Therefore, since the light can pass through the end portion 227b, the influence of the decrease in the wavelength conversion efficiency can be reduced. the

As described above, according to the LED module 220A according to Embodiment 2 of the present invention, even when the light is adjusted, the light emitted by the LED 222 can be reduced in the light directed toward the back side of the base 221 . The influence caused by the reduction of the wavelength conversion efficiency of the laser beam can be suppressed, and the change of the color of the emitted light can be suppressed. the

In addition, the end portion 227b is thicker than the center portion 227a. In this way, in the LED module 220A, by adjusting the thickness of the phosphor layer 227 , the influence of the decrease in the wavelength conversion efficiency of the light emitted by the LED 222 can be easily reduced, and the change in the color of the emitted light can be suppressed. the

(Modification 2 of Embodiment 2)

Each component of the LED module 220B which concerns on the modification 2 of Embodiment 2 of this invention is demonstrated using FIG.22 and FIG.23. 22 and 23 have shown the structure of the LED module which concerns on the modification 2 of Embodiment 2 of this invention. That is, (a) of FIG. 22 is a plan view of the LED module 220B, and (b) of FIG. 22 is a cross-sectional view of the LED module 220B cut along line A3-A3' of (a). 23 is an enlarged cross-sectional view of main parts showing the configuration around the sealing member 223a and the wavelength converting member 223b of the LED module 220B cut along the line B3-B3' in FIG. 22(a). the

As shown in FIGS. 22 and 23 , LED module 220B includes base 221 , LED 222 , sealing member 223 a , wavelength conversion member 223 b , metal wiring 224 , and phosphor layer 227 . That is, the LED module 220B in this modification has the wavelength conversion member 223b similarly to the LED module 220 in Embodiment 2 mentioned above. Furthermore, the LED module 220B in this modified example has the phosphor layer 227 similarly to the LED module 220A in the above-mentioned modified example 1. As shown in FIG. the

Furthermore, the base 221 , LED 222 , sealing member 223 a , wavelength conversion member 223 b , and metal wiring 224 included in the LED module 220B are the same as the base 221 , LED 222 , and sealing member included in the LED module 220 in Embodiment 2 described above. 223a, the wavelength conversion member 223b, and the metal wiring 224 are the same, and therefore detailed description thereof will be omitted. In addition, since the phosphor layer 227 included in the LED module 220B is the same as the phosphor layer 227 included in the LED module 220A in Modification 1 described above, detailed description thereof will be omitted. the

That is, the sealing member 223a functions as a first wavelength conversion unit, the wavelength conversion member 223b functions as a second wavelength conversion unit, and the phosphor layer 227 functions as a third wavelength conversion unit. the

As described above, according to the LED module 220B in this modified example, the same effect as that of the LED module 220 in Embodiment 2 and the LED module 220A in the modified example 1 described above can be achieved. the

(Modification 3 of Embodiment 2)

The structure of 220 C of LED modules which concerns on the modification 3 of Embodiment 2 of this invention is performed using FIG. 24. FIG. 24 is an enlarged sectional view of a main part of an LED module according to Modification 3 of Embodiment 2 of the present invention. Specifically, FIG. 24 is a partial cross-sectional view of the sealing member 223a of the LED module 220C. Here, this modification can be applied to the LED module 220A in the modification 1 and the LED module 220B in the modification 2 described above. the

As shown in FIG. 24 , a phosphor layer 228 is provided in an LED module 220C instead of the phosphor layer 227 provided in Modification 1 and Modification 2 described above. In addition, in the LED module 220C in this modification, the components other than the phosphor layer 228 are the same as the components other than the phosphor layer 227 in the above-mentioned modification 1 and modification 2, and thus detailed description thereof will be omitted. the

The phosphor layer 228 is formed between the base 221 and each of the plurality of LEDs 222 , and is a printed phosphor containing an optical wavelength conversion material that converts the wavelength of light emitted by the LEDs 222 . The phosphor layer 228 has a central portion 228a at the central position (the central position on the XY plane), and has an end portion 228b outside the central portion 228a (around the central portion 228a on the XY plane). the

In addition, the end portion 228b is thicker than the central portion 228a in thickness (width in the Z-axis direction). Specifically, the upper surface of the end portion 228b is formed as a stepped plane, and the thickness becomes thicker as it is farther away from the central portion 228a. That is, while the thickness of the end portion 227b in the above-mentioned modification 1 and modification 2 has a shape whose thickness gradually changes, the end portion 228b in this modification has a shape whose thickness changes stepwise. In addition, except for the shape, the phosphor layer 228 in this modification is the same as the phosphor layer 227 in the above-mentioned modification 1 and modification 2, and thus detailed description thereof will be omitted. the

That is, the second wavelength conversion amount showing the degree of converting the wavelength of the light emitted by the LED 222 in the end portion 228b is larger than the second wavelength conversion amount showing the degree of converting the wavelength of the light emitted by the LED 222 in the central portion 228a. A large amount of wavelength conversion. the

Furthermore, when this modification is applied to the LED module 220A in Modification 1 described above, the central portion 228a functions as a first wavelength conversion portion, and the end portion 228b functions as a second wavelength conversion portion. In addition, when this modification is applied to the LED module 220B in the above-mentioned modification 2, the sealing member 223a functions as the first wavelength conversion part, the wavelength conversion member 223b functions as the second wavelength conversion part, and the phosphor Layer 228 functions as a third wavelength conversion unit. the

As described above, with the LED module 220C in this modification, the same effect as that of the LED module 220A in the modification 1 and the LED module 220B in the modification 2 described above can be achieved. the

(Modification 4 of Embodiment 2)

The structure of the LED module 220D which concerns on the modification 4 of Embodiment 2 of this invention is demonstrated using FIG. 25. FIG. 25 is an enlarged cross-sectional view of a main part of an LED module according to Modification 4 of Embodiment 2 of the present invention. Specifically, FIG. 25 is a partial cross-sectional view of the sealing member 223a of the LED module 220D. Here, this modification can be applied to the LED module 220A in the modification 1 and the LED module 220B in the modification 2 described above. the

As shown in FIG. 25 , the LED module 220D includes a phosphor layer 229 instead of the phosphor layer 227 included in the modification 1 and modification 2 described above. In addition, in the LED module 220D of this modification, the components other than the phosphor layer 229 are the same as the components other than the phosphor layer 227 in the above-mentioned modification 1 and modification 2, and thus detailed description thereof will be omitted. the

The phosphor layer 229 is formed between the base 221 and each of the plurality of LEDs 222 , and is a printed phosphor containing an optical wavelength conversion material that converts the wavelength of light emitted by the LEDs 222 . The phosphor layer 229 has a central portion 229a located at the central position (central position on the XY plane), and end portions 229b located outside the central portion 229a (around the central portion 229a on the XY plane). the

And the fluorescent substance layer 229 is comprised so that the density|concentration of the fluorescent substance particle contained becomes high so that it becomes apart from LED222. That is, the thickness of the end portion 229b is the same as the thickness (width in the Z-axis direction) of the central portion 229a, but the concentration of phosphor particles contained therein is higher than that of the central portion 229a. Specifically, the end portion 229b is configured such that the concentration of phosphor particles becomes higher as the position is farther from the central portion 229a. That is, in the end 227b and the end 228b in the above-mentioned modification examples 1 to 3, the thickness becomes thicker the farther away from the LED 222, and the end 229b in this modification is configured so as to be farther away from the LED 222. The higher the position, the higher the concentration of phosphor particles. In addition, since the phosphor particles included in the phosphor layer 229 in this modification are the same as the phosphor particles included in the phosphor layer 227 in the above-mentioned Modification 1 and Modification 2, detailed description thereof will be omitted. the

With such a configuration, the second wavelength conversion amount showing the degree of converting the wavelength of light emitted by the LED 222 in the end portion 229b is compared to the second wavelength conversion amount showing the degree of converting the wavelength of light emitted by the LED 222 in the central portion 229a. The degree of conversion of the first wavelength is large. the

Furthermore, when this modification is applied to the LED module 220A in Modification 1 described above, the central portion 229a functions as a first wavelength conversion portion, and the end portion 229b functions as a second wavelength conversion portion. In addition, when this modification is applied to the LED module 220B in the above-mentioned modification 2, the sealing member 223a functions as the first wavelength conversion part, the wavelength conversion member 223b functions as the second wavelength conversion part, and the phosphor Layer 229 functions as a third wavelength conversion unit. the

As described above, according to the LED module 220D in this modified example, the same effect as that of the LED module 220A in the modified example 1 and the LED module 220B in the modified example 2 described above can be achieved. That is, in this modified example, the concentration of phosphor particles contained in the end portion 229b is higher than that in the central portion 229a. In this way, in the LED module 220D, by adjusting the concentration of the phosphor particles, it is possible to easily reduce the influence of the decrease in the wavelength conversion efficiency of the light emitted by the LED 222, and to suppress the color variation of the emitted light. Variety. the

(Modification)

Hereinafter, modification examples of the present invention will be described. the

(Modification 1)

Fig. 26 shows the structure of an LED module according to Modification 1 of the present invention, (a) is a plan view, and (b) is a cross-sectional view on line A-A' of (a). Moreover, FIG. 27 is a figure for demonstrating the method of assembling the LED module which concerns on the modification 1 of this invention. the

As shown in Fig. 26 and Fig. 27, a plurality of main light-emitting parts composed of LED222 (light-emitting element) and sealing member 223 are provided on the base 221. The mask 324 of the resin (wavelength conversion member) 323 is superimposed on the base 221 on which a plurality of main light emitting parts are arranged, so that the LED module 320 can be configured. the

Phosphor-containing resin 323 in mask 324 is formed by dispersing phosphor (wavelength conversion material) in resin such as silicone resin. The phosphor-containing resin 323 corresponds to a dummy sealing member, and light-emitting elements such as LEDs do not exist in the phosphor-containing resin 323 . the

When the base 221 and the mask 324 are stacked, the sealing member 223 and the phosphor-containing resin 323 are arranged adjacent to each other. In this modified example, the sealing member 223 is arranged between the adjacent phosphor-containing resins 323 between. That is, the sealing members 223 and the phosphor-containing resin 323 are arranged alternately with each other in both the row direction and the column direction. the

As described above, according to the LED module 320 according to this modified example, since the base 221 provided with the light-emitting part composed of the LED 222 and the sealing member 223 can be overlapped with the mask 324 including the phosphor-containing resin 323 , it is possible to reinforce the The light emission color of the LED module 320 as a whole. Furthermore, color adjustment can be performed by changing the ratio of the phosphor-containing resin 323 in the mask 324 . the

(Modification 2)

FIG. 28 is a perspective view showing the structure of an LED module according to Modification 2 of the present invention. the

As shown in FIG. 28 , in the LED module 420 according to this modified example, the main light-emitting part composed of the LED 222 and the sealing member 223 that seals the LED 222, and the sub-light-emitting part that is a dummy sealing member 24X that does not include the LED, Instead of being formed in a linear shape, both are formed in a dome shape. the

The sealing member 223 is provided adjacent to the dummy sealing member 24X, and in this modified example, the sealing member 223 is arranged between the dummy sealing members 24X adjacent to each other. That is, the sealing members 223 and the dummy sealing members 24X are arranged alternately with each other in both the row direction and the column direction. the

Also in this modified example, the same effects as those of Embodiments 1 and 2 can be achieved. the

Furthermore, in this modified example, by disabling the color conversion function of the dummy sealing member 24X, it is possible to cause a color shift in the light emission color of the LED module. the

For example, as shown in FIG. 29 , a part or all of the plurality of dummy sealing members 24X are temporarily provided, and the temporarily provided dummy sealing member 24X is removed, whereby the color can be shifted. the

And, as shown in FIG. 30 , by covering a part or all of the plurality of dummy sealing members 24X with the reflective member 400, color shifting can be performed. The reflective member 400 is, for example, formed in a cup shape so as to cover the dummy sealing member 24X, and the outer surface of the reflective member 400 has a reflective function. the

Furthermore, as shown in FIG. 31 , color shift can be realized by blackening the surface of the dummy seal members 24X by blackening a part or all of the dummy seal members 24X with black ink. the

Furthermore, as shown in FIG. 32 , by covering a part or all of the plurality of dummy sealing members 24X with the black mask 500 , color shift can be realized. the

(Other modified examples, etc.)

As mentioned above, although the lightbulb-shaped lamp which concerns on this invention was demonstrated based on Embodiment 1, 2, and those modification examples, this invention is not limited to these embodiment and modification examples. the

For example, in the above-mentioned Embodiments 1 and 2 and modifications, color shift may be achieved by adding a special phosphor or a light absorber to the sealing member that does not contain LEDs. For example, as shown in FIG. 33 , an LED module may be configured by mixing a red phosphor into a dummy sealing member 24Y containing a yellow phosphor. According to this, red shift can be realized. Alternatively, a green phosphor may be mixed into the dummy sealing member 24Y containing a yellow phosphor to realize a green shift. Furthermore, color shift can also be realized by mixing neodymium powder (light absorber) into the dummy sealing member 24Y containing a yellow phosphor and removing the yellow component. the

In addition, in the above-mentioned Embodiments 1 and 2 and the modifications, the color shift is realized by adding a phosphor-containing resin to the main light emitting portion. For example, as shown in (a) and (b) of FIG. 34, color shift is realizable by forming the fluorescent substance containing resin 423 on the sealing member 223 which seals LED222. In this case, phosphor-containing resin 423 should just be formed directly above LED222. Phosphor-containing resin 423 is formed by dispersing a phosphor (wavelength conversion material) in resin such as silicone resin. Furthermore, the cross-sectional shape of the sealing member 223 may be substantially semicircular as shown in FIG. 34( a ), or may be substantially rectangular as shown in FIG. 34( b ). the

Furthermore, in Embodiments 1 and 2 and the modifications described above, the phosphor layer may be formed on the back surface of the translucent substrate so as to face the main light emitting portion. For example, as shown in FIG. 35( a ), the phosphor layer 527 is formed on the back surface of the translucent base 221 so as to face the main light emitting portion (LED 222 and sealing member 223 ). That is, the main light emitting portion and the phosphor layer 527 may be formed so as to sandwich the translucent base 221 . Phosphor layer 527 is a wavelength conversion member including an optical wavelength conversion material that converts the wavelength of light emitted by LED 222 . With this configuration, the light emitted from the LED 222 passes through the inside of the base 221 and is converted in color by the phosphor layer 527, so that light of a desired color (such as white light) can be emitted from the back of the base 221. In addition, as shown in FIG. 35( b ), a part of the phosphor layer 527 may be trimmed. Thereby, the color of the light (back light) emitted from the base 221 can be suppressed. the

In addition, in the above-mentioned Embodiments 1 and 2 and the modifications, the LED module is configured to emit white light from the blue LED chip and the yellow phosphor, but it is not limited thereto. For example, a configuration may be employed in which a phosphor-containing resin containing red phosphors and green phosphors is used and combined with blue LED chips to emit white light. the

In addition, in the above-mentioned Embodiments 1 and 2 and modifications, LEDs that emit colors other than blue may be used. For example, when LED chips that emit ultraviolet light are used as the LEDs 22a to 22d, 32a, and 32b, phosphor particles that emit each of the three primary colors (red, green, and blue) can be combined as phosphor particles. Moreover, wavelength conversion materials other than phosphor particles can also be used. For example, wavelength conversion materials containing semiconductors, metal complexes, organic dyes, pigments, etc. that absorb light of a certain medium wavelength and emit and absorb light can be used as wavelength conversion materials. The material of the substance of light with different wavelengths of light. the

In addition, in the above-mentioned Embodiments 1 and 2 and the modified examples, although LEDs are illustrated as light-emitting elements, semiconductor light-emitting elements such as semiconductor lasers, or organic EL (Electro Luminescence: electroluminescence) or inorganic EL may also be used. Other solid light-emitting components such as EL components. the

In addition, in the first and second embodiments and the modifications described above, the LED module adopts the COB type structure in which the LED chip is directly mounted as the light emitting element on the substrate, but the present invention is not limited thereto. For example, an SMD-type LED module can also be used. Specifically, an LED chip is mounted in a recess (cavity) of a resin container, and a phosphor-containing resin is sealed in the recess to form a package-type LED element. In this package type LED element, a surface mount type (SMD: Surface Mount Device) LED module is formed by mounting a plurality of the LED element as a light-emitting element on a substrate on which a metal arrangement is formed. the

In addition, in the above-mentioned Embodiments 1 and 2 and the modifications, the case where the LED module is applied to a light bulb-shaped lamp has been described as an example. However, the LED module according to this embodiment can also be applied to a straight tube-shaped lamp or round lights etc. In this case, the shape of the substrate on which the LEDs are mounted can be formed for each lamp. Furthermore, the LED module in the present invention can also be applied to light sources of devices other than lamps. the

In addition, in the above-mentioned first embodiment and the modified example, although the lead wires are provided outside the pillars, it is also possible to provide a cavity in the pillar 40A as shown in the cross-sectional view of the light bulb-shaped lamp 1A in FIG. It is arranged through the cavity of the pillar 40A. In this case, the lead wire 70 is directly inserted into the cavity in the support 40A from the support base 50 , and is exposed from the upper side of the support in the vicinity of the LED module 20 to be connected to the LED module 20 . In this way, it is possible to reduce the phenomenon that the light of the LED module 20 is blocked by the lead wire 70 . In addition, in FIG. 36, although the lead wire 70 is provided so as to pass through the substrate from the back side of the substrate, it may also be provided so as to go around the front side of the substrate and pass out from the front side of the substrate. the

In addition, in the first embodiment and the modified examples described above, the wavelength converting members (the first to sixth sealing members, the first to sixth dummy sealing members) are formed in a straight line, but they may be curved, meandering, Or other shapes such as a circle or a rectangular ring. In this case, LEDs can be arranged in the shape of the wavelength conversion member. the

In addition, in the first embodiment and the modified example described above, only the non-light-emitting semiconductor electronic element (zener diode) is incorporated in the second dummy sealing member 24b, but the present invention is not limited thereto. For example, non-luminescent semiconductor electronic elements (zener diodes) may be embedded in dummy sealing members other than the second dummy sealing member 24b such as the first dummy sealing member 24a. In this case, non-luminous semiconductor electronic elements can be built in a plurality of dummy sealing members. the

In addition, in the above-mentioned second embodiment and the modified example, the twisted portion 252b is used as a part of the outer frame body portion 252 , but it may also be used as a part of the inner frame body portion 251 . That is, the screwing portion 252b may be used as a part of the circuit case for accommodating the driving circuit 270, and more specifically, the screwing portion 252b may be used as a part of the circuit holding portion 251b. the

Moreover, this invention can be realizable as the illuminating device provided with the above-mentioned lightbulb-shaped lamp. For example, as shown in FIG. 37 , as the lighting device according to the embodiment of the present invention, it is possible to configure the light bulb-shaped lamp 1 according to the above-mentioned first embodiment and a lighting device (lighting device) equipped with the light bulb-shaped lamp 1 . 3 lighting fixtures. In this case, the lighting device 3 is used to turn off and light the light bulb-shaped lamp 1 , and includes, for example, a device main body 4 attached to the ceiling and a translucent or non-translucent shade 5 for covering the light bulb-shaped lamp 1 . . Among them, the device main body 4 is mounted with the base of the light bulb-shaped lamp 1 and has a socket 4 a for supplying power to the light bulb-shaped lamp 1 . In addition, a light-transmitting plate may be provided in the opening of the globe 5 . In addition, as the lightbulb-shaped lamp mounted on the lighting fixture 3, the lightbulb-shaped lamp 2 in Embodiment 2 or the lightbulb-shaped lamp in the modified examples of Embodiments 1 and 2 can also be used. the

In addition, without departing from the gist of the present invention, various modifications conceivable by those skilled in the art may be implemented in the configurations of the present embodiment and modifications, or components in the embodiments and modifications may be combined. The latter configurations are all included within the scope of the present utility model. the

Industrial applicability

The present invention can be used in lamps with light-emitting elements such as LEDs, especially in bulb-shaped lamps replacing conventional incandescent bulbs, and can be widely used as light sources in lighting devices and other equipment. the

Symbol Description

1, 1A, 2 bulb shaped lights

3 lighting fixtures

4 Appliance body

4a socket

5 lampshades

10,210 spherical cover

11,211 Opening part

20, 20A, 20B, 20C, 20D, 200, 201, 220, 220A, 220B, 220C, 220D, 320, 420 LED modules

20a main LED module

20b Secondary LED module

21, 21X, 21Y Substrate

21a, 21b, 21Xa, 21Xb, 21Ya, 21Yb, 221a, 221b, 242a1 Through hole

22a, 22b, 22c, 22d, 32a, 32b, 222LED

23a The first sealing part

23b Second sealing part

23c The third sealing part

23d The fourth sealing part

23A, 223, 223a Sealing parts

24a The first dummy sealing part

24b Second dummy sealing part

24c The third dummy sealing part

24d The fourth dummy sealing part

24X, 24Y Dummy sealing parts

25 Zener diode

26, 36, 224 metal wiring

27, 37 wire

28, 38 Terminals

29, 39 Conductive adhesive parts

30 lamp holder

33a Fifth sealing part

33b The sixth sealing part

34a The fifth dummy sealing part

34b The sixth dummy sealing part

40, 40A, 241 pillar

41, 241a Main shaft part

42, 241b fixed part

42b, 241b1 protrusion

50 support table

60 resin case

61 The first shell part

62 Second shell part

70, 270a to 270b lead wires

80 lighting circuit

90 Adhesives

122a sapphire substrate

122b Nitride semiconductor layer

122c cathode electrode

122d anode electrode

122e, 122f wire junction

122g chip bond material

221 Abutment

223b wavelength conversion component

225 gold wire

227, 228, 229, 527 Phosphor layer

227a, 228a, 229a central part

227b, 228b, 229b ends

230 Combined parts

230a Vertical groove part

230b flange part

230c Convex part

240 Supporting parts

242 pedestal

242a Small diameter part

242b Most of the diameter

242b1 recessed part

250 frame

251 Inner frame part

251a Circuit Cover

251b Circuit maintenance department

252 Outer frame part

252a outer edge

252b Twist part

260 metal parts

270 drive circuit

271 circuit substrate

272 circuit components

280 Lamp Holder

290 screw

323, 423 Phosphor-containing resin

324 mask

400 reflective parts

500 black mask

ML1 The first main light emitting part

ML2 Second main light emitting part

ML3 The third main light-emitting part

ML4 The fourth main light-emitting part

SL1 The first sub-light emitting part

SL2 The second sub-light emitting part

SL3 The third sub-luminous part

SL4 The fourth sub-luminous part

WC1 The first wavelength conversion component

WC2 second wavelength conversion component

WC3 third wavelength conversion component

WC4 fourth wavelength conversion component

WC5 fifth wavelength conversion component

WC6 Sixth wavelength conversion component

WC7 Seventh wavelength conversion component

WC8 The eighth wavelength conversion component.

Claims (34)

1. A light emitting device, characterized in that it has: Substrate; a first light-emitting element configured on the substrate; The first wavelength conversion component is arranged on the substrate and converts the wavelength of the light emitted by the first light-emitting element; and The second wavelength conversion component is arranged adjacent to the first wavelength conversion component, and converts the wavelength of the light emitted by the first light-emitting element, The first light-emitting element is present in the first wavelength conversion component, In the second wavelength conversion member, there is no light emitting element capable of emitting light whose wavelength is converted by the second wavelength conversion member. the 2. The light emitting device according to claim 1, characterized in that, The first light-emitting elements are arranged in columns on the substrate with a plurality of, The first wavelength conversion component is arranged in a linear shape on the substrate, The second wavelength conversion member is provided in a line on the substrate in parallel with the first wavelength conversion member. the 3. The lighting device according to claim 2, characterized in that, The first wavelength conversion component includes a first wavelength conversion material and a first sealing component containing the first wavelength conversion material, and the first wavelength conversion material converts wavelengths of light emitted by the plurality of first light-emitting elements. Alternatively, the first sealing member is arranged in a linear shape, and seals a plurality of the first light-emitting elements together, The second wavelength conversion component includes a second wavelength conversion material and a first dummy sealing component containing the second wavelength conversion material, and the second wavelength conversion material has different wavelengths of light emitted by the plurality of first light-emitting elements. Make a transformation. the 4. The lighting device according to claim 3, characterized in that, The concentration of the second wavelength conversion material in the first dummy sealing member is equal to or less than the concentration of the first wavelength conversion material in the first sealing member. the 5. The lighting device according to claim 3, characterized in that, The length of the first dummy sealing member is equal to or less than the length of the first sealing member. the 6. The lighting device according to any one of claims 3 to 5, characterized in that, The first wavelength conversion material and the second wavelength conversion material are phosphor particles, The first sealing member and the first dummy sealing member are resin. the 7. The lighting device according to any one of claims 3 to 5, characterized in that, Electronic components that do not emit light exist within the first dummy sealing member. the 8. The lighting device according to claim 2, characterized in that, The shape of the first wavelength conversion component in a section perpendicular to the length direction of the first wavelength conversion component is basically a semicircle, A plurality of the first light-emitting elements are arranged in a row, Each of the plurality of first light emitting elements is located substantially in the center of the width of the first wavelength conversion member. the 9. The lighting device according to claim 2, characterized in that, The lighting device also has: A plurality of second light-emitting elements are arranged in a row on the substrate along the column direction of the plurality of first light-emitting elements; and The third wavelength conversion component is arranged in a linear shape on the substrate, and converts the wavelength of light emitted by a plurality of the second light emitting elements, There are a plurality of the second light-emitting elements in the third wavelength conversion component, The second wavelength conversion member is disposed between the first wavelength conversion member and the third wavelength conversion member, and also converts wavelengths of lights emitted by the plurality of second light emitting elements. the 10. The lighting device according to claim 9, characterized in that, The first wavelength conversion component includes a first wavelength conversion material and a first sealing component containing the first wavelength conversion material, and the first wavelength conversion material converts wavelengths of light emitted by the plurality of first light-emitting elements. Alternatively, the first sealing member is arranged in a linear shape, and seals a plurality of the first light-emitting elements together, The second wavelength conversion member includes a second wavelength conversion material and a first dummy sealing member containing the second wavelength conversion material, and the second wavelength conversion material is compatible with the plurality of first light-emitting elements and the plurality of first light-emitting elements. The wavelength of the light emitted by the two light-emitting elements is converted, The third wavelength conversion component includes a third wavelength conversion material and a second sealing component containing the third wavelength conversion material, and the third wavelength conversion material converts wavelengths of light emitted by the plurality of second light-emitting elements Alternatively, the second sealing member is arranged in a line shape, and seals a plurality of the second light emitting elements collectively. the 11. The lighting device according to claim 10, characterized in that, A plurality of the first light-emitting elements and a plurality of the second light-emitting elements are light-emitting elements capable of emitting light of the same color, The concentration of the second wavelength converting material in the first dummy sealing member is equal to or lower than the concentration of the first wavelength converting material in the first sealing member, and the concentration of the second wavelength converting material in the second sealing member is The concentration of the third wavelength conversion material is below. the 12. The lighting device according to claim 10 or 11, characterized in that, The concentration of the first wavelength converting material in the first sealing member almost coincides with the concentration of the third wavelength converting material in the second sealing member. the 13. The lighting device according to claim 10 or 11, characterized in that, The first wavelength conversion material, the second wavelength conversion material, and the third wavelength conversion material are phosphor particles, The first sealing member, the first dummy sealing member, and the second sealing member are all resin. the 14. The lighting device according to claim 9, characterized in that, The shape of the first wavelength conversion component in a section perpendicular to the length direction of the first wavelength conversion component is basically a semicircle, The shape of the third wavelength conversion component in a section perpendicular to the length direction of the third wavelength conversion component is basically a semicircle, A plurality of the first light-emitting elements and a plurality of the second light-emitting elements are respectively arranged in a row, Each of the plurality of first light-emitting elements is substantially located at the center of the width of the first wavelength conversion component, Each of the plurality of second light emitting elements is located substantially in the center of the width of the third wavelength conversion member. the 15. The lighting device according to claim 9, characterized in that, The lighting device also has: A plurality of third light-emitting elements and a plurality of fourth light-emitting elements are arranged in columns on the substrate along the column direction of the plurality of second light-emitting elements; The fourth wavelength conversion component is adjacent to the third wavelength conversion component and arranged in a linear shape on the substrate to convert the wavelength of light emitted by a plurality of the third light-emitting elements; The fifth wavelength conversion member is arranged in parallel with the fourth wavelength conversion member in a line on the substrate, and controls the light emitted by the plurality of third light-emitting elements and the plurality of fourth light-emitting elements. wavelength conversion; and The sixth wavelength conversion component is adjacent to the fifth wavelength conversion component and arranged in a linear shape on the substrate, and converts the wavelength of light emitted by a plurality of the fourth light-emitting elements, There are a plurality of the third light-emitting elements in the fourth wavelength conversion component, There are a plurality of fourth light-emitting elements in the sixth wavelength conversion component, The fifth wavelength conversion component is arranged between the fourth wavelength conversion component and the sixth wavelength conversion component, In the fifth wavelength conversion member, there is no light emitting element capable of emitting light whose wavelength is converted by the fifth wavelength conversion member. the 16. The lighting device according to claim 15, characterized in that, The fourth wavelength conversion component includes a fourth wavelength conversion material and a third sealing component including the fourth wavelength conversion material, and the fourth wavelength conversion material converts wavelengths of light emitted by the plurality of third light-emitting elements. Alternatively, the third sealing member is arranged in a linear shape, and seals a plurality of the third light-emitting elements together, The fifth wavelength conversion component includes a fifth wavelength conversion material and a second dummy sealing component containing the fifth wavelength conversion material, and the fifth wavelength conversion material is compatible with the plurality of third light-emitting elements and the plurality of first wavelength conversion elements. The wavelength of the light emitted by the four light-emitting elements is converted, The sixth wavelength conversion component includes a sixth wavelength conversion material and a fourth sealing component containing the sixth wavelength conversion material, and the sixth wavelength conversion material converts wavelengths of light emitted by the plurality of fourth light-emitting elements. Alternatively, the fourth sealing member is arranged in a line shape, and seals a plurality of the fourth light emitting elements collectively. the 17. The lighting device according to claim 16, characterized in that, The light emitting device further includes a seventh wavelength conversion member disposed between the third wavelength conversion member and the fourth wavelength conversion member, The seventh wavelength conversion component includes a seventh wavelength conversion material and a third dummy sealing component containing the seventh wavelength conversion material, and the seventh wavelength conversion material is compatible with the plurality of second light-emitting elements and the plurality of second light-emitting elements. The wavelength of the light emitted by the three light-emitting elements is converted, In the seventh wavelength conversion member, there is no light emitting element capable of emitting light whose wavelength is converted by the seventh wavelength conversion member. the 18. The lighting device according to claim 16 or 17, characterized in that, The light emitting device further includes an eighth wavelength conversion member, and the eighth wavelength conversion member is arranged on both sides in the longitudinal direction of at least one of the following wavelength conversion members, and these wavelength conversion members refer to: the first wavelength conversion component, the third wavelength conversion component, the fourth wavelength conversion component, and the sixth wavelength conversion component, The eighth wavelength conversion part includes an eighth wavelength conversion material and a fourth dummy sealing part containing the eighth wavelength conversion material, and the eighth wavelength conversion material has a wavelength of light emitted by at least one of the following light emitting elements For conversion, these light-emitting elements refer to: a plurality of the first light-emitting elements, a plurality of the second light-emitting elements, a plurality of the third light-emitting elements, and a plurality of the fourth light-emitting elements, In the eighth wavelength conversion member, there is no light emitting element capable of emitting light whose wavelength is converted by the eighth wavelength conversion member. the 19. The lighting device of claim 1, wherein, The first wavelength conversion member is arranged to cover at least a part of the first light emitting element, The second wavelength conversion member is arranged at a position farther from the first light-emitting element than the first wavelength conversion member, The first light-emitting element is dimmed by a change in the magnitude of the supplied current, The second wavelength conversion amount indicating the degree of conversion of the wavelength of light emitted by the first light-emitting element in the second wavelength conversion member is greater than the degree of conversion of the wavelength of light emitted by the first wavelength conversion member in the first wavelength conversion member. The first wavelength conversion amount to the extent that the wavelength of the light emitted by the first light emitting element is converted is large. the 20. The lighting device of claim 19, wherein The first wavelength conversion component is a sealing component that seals the first light-emitting element, The second wavelength conversion member is a resin disposed on the side of the first wavelength conversion member on the substrate. the 21. The lighting device of claim 20, wherein The concentration of phosphor particles contained in the second wavelength conversion member is higher than that of the first wavelength conversion member. the 22. The light emitting device according to claim 20 or 21, characterized in that, The substrate has light transmittance, The light emitting device further includes a third wavelength conversion member that is a phosphor layer formed between the substrate and the first light emitting element, The third wavelength converting member is configured such that the wavelength conversion amount of light emitted by the first light emitting element increases as it is farther away from the first light emitting element. the 23. The lighting device of claim 22, wherein The third wavelength conversion member is configured such that the thickness of the third wavelength conversion member becomes thicker as it is farther away from the first light emitting element. the 24. The lighting device of claim 22, wherein The third wavelength conversion member is configured such that the concentration of phosphor particles contained in the third wavelength conversion member increases the farther it is from the first light emitting element. the 25. The lighting device of claim 19, wherein, The substrate has light transmittance, The first wavelength conversion member and the second wavelength conversion member are phosphor layers integrally formed between the substrate and the first light emitting element. the 26. The lighting device of claim 25, wherein The thickness of the second wavelength conversion member is thicker than that of the first wavelength conversion member. the 27. The lighting device of claim 25, wherein The concentration of phosphor particles contained in the second wavelength conversion member is higher than that of the first wavelength conversion member. the 28. A bulb-shaped lamp, characterized in that it has: The light-emitting device according to any one of claims 1 to 27; light-transmitting dome cover; and a pillar extending to the inner space of the dome cover, The light emitting device is disposed in the spherical cover and fixed to the pillar. the 29. The bulb-shaped lamp of claim 28, wherein: The light-emitting device is fixed on the pillar in such a way that the first surface of the substrate is located on the top side of the spherical cover, the first surface of the substrate is provided with a plurality of the first light-emitting devices. The face of the component. the 30. The bulb-shaped lamp of claim 29, wherein: The light emitting device also has: A plurality of fifth light-emitting elements are arranged in a column on the second surface of the substrate, and the second surface of the substrate is the surface opposite to the first surface of the substrate; and The ninth wavelength conversion component is arranged in a line shape on the second surface, and converts the wavelength of the light emitted by the plurality of fifth light-emitting elements, A plurality of the fifth light emitting elements are present in the ninth wavelength conversion part. the 31. The bulb-shaped lamp of claim 30, wherein: The light emitting device further includes a tenth wavelength conversion member arranged in line with the ninth wavelength conversion member on the second surface, and the plurality of fifth light emitting elements The wavelength of the emitted light is converted, In the tenth wavelength conversion member, there is no light emitting element capable of emitting light whose wavelength is converted by the tenth wavelength conversion member. the 32. The light bulb-shaped lamp of claim 31 , wherein: The ninth wavelength conversion component includes a ninth wavelength conversion material and a fifth sealing component containing the ninth wavelength conversion material, and the ninth wavelength conversion material converts wavelengths of light emitted by a plurality of fifth light-emitting elements. In other words, the fifth sealing member is arranged in a linear shape, and seals a plurality of the fifth light-emitting elements together, The tenth wavelength conversion part includes a tenth wavelength conversion material and a fifth dummy sealing part containing the tenth wavelength conversion material, and the tenth wavelength conversion material has different wavelengths of light emitted by the plurality of fifth light-emitting elements. Make a transformation. the 33. The bulb-shaped lamp of any one of claims 30 to 32, wherein The substrate is composed of a main substrate and a sub-substrate, the surface of the main substrate is provided with a plurality of the first light-emitting elements, and the surface of the sub-substrate is provided with a plurality of the fifth light-emitting elements, The main substrate and the sub-substrate are configured such that the back of the main substrate is opposite to the back of the sub-substrate, and the back of the main substrate refers to the surface where a plurality of the first light-emitting elements are not provided, so The back surface of the sub-substrate refers to the surface where the plurality of fifth light emitting elements are not provided. the 34. A lighting device comprising the light bulb-shaped lamp according to any one of claims 28 to 33. the