WO2014033879A1 - Power module - Google Patents

Abstract

The present invention is equipped with: lead conductors to which electronic components are mounted; a mold resin that encloses and seals the electronic components and the lead conductors; and electronic components electrically connected to bent parts that include L-shaped portions wherein the lead conductors extend to the outside from the interior of the mold resin and then bend. Thus, it is possible to obtain a power module with which the size of the equipment in which the power module is mounted can be reduced and with which the wiring inductance between connected devices can be lowered, and to obtain a power module that is particularly suitable for a power conversion device.

Description

Power module

The present invention relates to a power module.

For example, a converter unit that converts AC power into DC power and an inverter unit that converts DC power into AC power are provided inside a power converter such as a servo amplifier. Between the converter unit and the inverter unit, a converter unit is provided. A smoothing capacitor for smoothing the DC bus voltage is connected. When the switching element built in the inverter is switched (ON / OFF) at a high speed, a large surge voltage is generated in a transitional state of switching, and the DC bus voltage rises instantaneously, and the switching element itself There is a risk that the inverter will be destroyed.

Surge voltage can be reduced by reducing the inductance between the smoothing capacitor and the inverter. For this reason, the smoothing capacitor is preferably connected in the vicinity of the inverter unit.

In recent years, SiC devices (SiC switching elements) capable of high-speed switching are being put into practical use. However, if the switching is made faster, the above-described surge voltage increases and the loss also increases. For this reason, the inductance reduction between a smoothing capacitor and an inverter part is calculated | required.

In a large-capacity power conversion device that allows a large current to flow, a connection conductor to be screwed is provided on the surface of the power module as a power input / output terminal of the power module including the inverter unit and the converter unit. In many cases, the connection conductors are connected (see, for example, Patent Document 1).

On the other hand, in a small-capacity power conversion device that passes a small current, lead terminals are formed so as to be mounted on a printed circuit board as power input / output terminals of a power module including an inverter unit and a converter unit, focusing on productivity The Then, the power module and the smoothing capacitor are mounted on the printed board, and the power module and the smoothing capacitor are wired and connected by the conductive pattern of the printed board.

JP 2007-324626 A

However, when the power module is connected to the printed board, the smoothing capacitor is connected to the inverter unit in the power module through the conductive pattern of the printed board. For this reason, there existed a problem that there existed a concern that the increase in the wiring inductance between the smoothing capacitor and inverter part by a conduction pattern and the enlargement of the printed circuit board size accompanying mounting of a smoothing capacitor were concerned.

Furthermore, when the power module is mounted on a printed circuit board, a conduction pattern of power input and power output is provided on the printed circuit board to conduct power to an interface unit such as a connector or a terminal block of the power converter. There was a problem that there was a concern about an increase in the size of the printed circuit board.

The present invention has been made in view of the above, and an object of the present invention is to obtain a power module capable of realizing downsizing of a mounted device and low inductance of wiring inductance between devices connected thereto. .

In order to solve the above-described problems and achieve the object, a power module according to the present invention includes a lead conductor on which an electronic component is mounted, a mold resin that encapsulates and seals the electronic component and the lead conductor, The lead conductor includes an electronic component electrically connected to a bent portion including an L-shaped portion that is further bent from the inside of the mold resin.

According to the present invention, it is possible to reduce the size of a device on which a power module is mounted and to reduce the inductance of wiring inductance with a device connected to the power module.

FIG. 1 is a perspective view showing an appearance of the power conversion device according to Embodiment 1 of the present invention. FIG. 2 is a schematic diagram showing components of the power conversion device according to Embodiment 1 of the present invention. FIG. 3 is a schematic diagram showing a connection state of each constituent member in the power conversion device according to Embodiment 1 of the present invention. FIG. 4 is a schematic diagram showing the configuration of the power conversion device according to Embodiment 1 of the present invention. FIG. 5 is a cross-sectional view of a principal part showing a schematic configuration of the power module and the lead conductor in the power conversion device according to Embodiment 1 of the present invention. FIG. 6 is a schematic diagram showing the shape of the bus lead for connecting the smoothing capacitor according to the first embodiment of the present invention. FIG. 7 is an enlarged schematic perspective view showing the vicinity of the connection portion between the smoothing capacitor and the connecting bus lead according to Embodiment 1 of the present invention. FIG. 8 is an enlarged schematic cross-sectional view showing the vicinity of a connection portion between the smoothing capacitor and the connecting bus lead according to the first embodiment. FIG. 9 is a schematic diagram showing the shape of the bus lead for connecting the smoothing capacitor according to the second embodiment of the present invention. FIG. 10 is an enlarged schematic perspective view showing the vicinity of the connection portion between the smoothing capacitor and the connecting bus lead according to the second embodiment of the present invention. FIG. 11 is an enlarged schematic cross-sectional view showing the vicinity of the connecting portion between the smoothing capacitor and the connecting bus lead according to Embodiment 2 of the present invention. FIG. 12 is a schematic diagram showing the shape of the bus lead for connecting the smoothing capacitor according to the third embodiment of the present invention. FIG. 13 is an enlarged schematic perspective view showing the vicinity of a connection portion between the smoothing capacitor and the connecting bus lead according to Embodiment 3 of the present invention. FIG. 14 is a schematic diagram showing the shape of the bus lead for connecting the smoothing capacitor according to the fourth embodiment of the present invention. FIG. 15 is an enlarged schematic perspective view showing the vicinity of the connection portion between the smoothing capacitor and the connecting bus lead according to Embodiment 4 of the present invention. FIG. 16 is an enlarged schematic cross-sectional view showing the vicinity of the connection portion between the smoothing capacitor and the connecting bus lead according to Embodiment 4 of the present invention. FIG. 17 is a schematic diagram showing the shape of the bus lead for connecting the smoothing capacitor according to the fifth embodiment of the present invention. FIG. 18 is an enlarged schematic perspective view showing the vicinity of the connection portion between the smoothing capacitor and the connecting bus lead according to the fifth embodiment of the present invention. FIG. 19 is an enlarged schematic perspective view showing the vicinity of the connection portion between the smoothing capacitor and the connecting bus lead according to Embodiment 6 of the present invention. FIG. 20 is an enlarged schematic cross-sectional view showing the vicinity of the connection portion between the smoothing capacitor and the connecting bus lead according to Embodiment 6 of the present invention.

Hereinafter, embodiments of a power module according to the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to the following description, In the range which does not deviate from the summary of this invention, it can change suitably. In the drawings shown below, the scale of each member may be different from the actual scale for easy understanding. The same applies between the drawings. Further, in the drawings shown below, there are cases where a part of the members is omitted or a state where the parts are seen through.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing an appearance of the power conversion device according to Embodiment 1 of the present invention. FIG. 2 is a schematic diagram showing components of the power conversion device according to Embodiment 1 of the present invention. FIG. 3 is a schematic diagram showing a connection state of each constituent member in the power conversion device according to Embodiment 1 of the present invention. FIG. 4 is a schematic diagram showing the configuration of the power conversion device according to Embodiment 1 of the present invention. FIG. 5 is a cross-sectional view of a principal part showing a schematic configuration of the power module and the lead conductor in the power conversion device according to Embodiment 1 of the present invention. 2 to 5, the resin case 11 is omitted.

The power conversion device according to Embodiment 1 includes a power module 1 sealed and molded with a mold resin 12 inside a resin case 11. In the power module 1, for example, on the bus lead 2 a and the power input / output lead 6, which are lead conductors arranged on an insulating substrate (not shown), the circuit constituting the inverter unit in the power module 1 and the operation of the inverter unit are operated. An electronic component 14 including a switching element (not shown) for switching (ON, OFF) and the like is mounted. In FIG. 5, only two electronic components 14 are shown for simplification, but the number of electronic components 14 is not limited to this.

Also, the electronic component 14 is electrically connected to the lead conductor via the conductor wire 13 or directly connected to the lead directly to the lead conductor. A control lead 5 that is a control lead of the power module 1 and is electrically connected to the electronic component 14 via the bus lead 2a is provided substantially parallel to the bus lead 2a. As the switching element, a SiC device (SiC switching element) capable of high-speed switching is used.

The bus lead 2a and the control lead 5 are provided so as to extend from the inside of the mold resin 12 to the outside, protrude from one side surface of the power module 1, and further have a bent portion bent into an L shape. ing. The power input / output lead 6 extends from the inside of the mold resin 12 to the outside, protrudes from the side surface on the other end side of the power module 1, and is further bent into an L shape.

Such a power module 1 is arranged on one side of the substantially rectangular printed circuit board 10 for the control circuit so as to be separated from the printed circuit board 10. The control lead 5 is electrically connected to a conduction pattern (not shown) of the printed circuit board 10.

The smoothing capacitor 3 is arranged in a state of being separated from the printed circuit board 10 at one end of the power module 1 where the bus lead 2a protrudes. The smoothing capacitor 3 is electrically connected to the bus lead 2a through the smoothing capacitor electrode 4 provided on one end surface of the smoothing capacitor 3 on the side facing the power module 1.

The power input / output connector 7 is disposed in a state of being separated from the printed circuit board 10 at the other end of the power module 1 where the power input / output lead 6 protrudes. The power input / output connector 7 is electrically connected to the power input / output lead 6 via a connector pin 9 provided on one side of the power input / output connector 7 facing the power module 1.

In the printed circuit board 10, a control signal connector 8 is disposed at the end on the side where the power input / output connector 7 is disposed. The control signal connector 8 is electrically connected to a conduction pattern (not shown) of the printed board 10. The power input / output connector 7 and the control signal connector 8 partially protrude from the resin case 11 with an external connection portion (not shown) exposed to the outside so that wiring connection with an external device is possible. Thus, they are arranged on the surface side of the resin case 11 substantially in parallel.

Next, the bus lead 2a according to the first embodiment will be described. FIG. 6 is a schematic diagram showing the shape of the bus lead 2a for connecting the smoothing capacitor according to the first embodiment. FIG. 7 is an enlarged schematic perspective view showing the vicinity of the connection portion between the smoothing capacitor 3 and the connecting bus lead 2a according to the first embodiment. FIG. 8 is an enlarged schematic cross-sectional view showing the vicinity of the connection portion between the smoothing capacitor 3 and the connecting bus lead 2a according to the first embodiment. In FIG. 8, the description in the power module 1 is omitted.

The bus lead 2a is made of a flat conductive material, and two bus leads 2a are provided corresponding to the number of smoothing capacitor electrodes 4. The bus lead 2a includes an extending portion 21a extending in a first direction (corresponding to an extending direction from the inside of the mold resin 12 to the outside), and a bent portion extending in a second direction bent from the extending portion 21a in a right angle direction. And 21b. Further, a connecting hole 21c into which the smoothing capacitor electrode 4 is inserted is provided in the middle portion in the longitudinal direction of the bent portion 21b in order to enable electrical connection with the smoothing capacitor electrode 4. Then, the smoothing capacitor electrode 4 is inserted into each of the connection holes 21c, whereby the bus lead 2a and the smoothing capacitor electrode 4 are electrically connected.

In addition, the power input / output lead 6 also has an extending portion 31a extending in the fifth direction (corresponding to an extending direction from the inside of the mold resin 12 to the outside), and a first bent portion 31b bent in a direction perpendicular to the fifth direction. And a second bent portion 31c bent further in the fifth direction from the first bent portion 31b. The second bent portion 1 c is connected to the connector pin 9 so that the power input / output lead 6 is electrically connected to the power input / output connector 7.

In the first embodiment described above, the smoothing capacitor 3 is directly connected to the bus lead 2a that protrudes and bends from the inside of the power module 1 to the outside of the mold resin 12 as it is. The wiring distance to the capacitor 3 can be shortened. Thereby, the wiring inductance between the smoothing capacitor 3 and the inverter part can be reduced, and the surge voltage when the inverter part is switched can be reduced.

In the first embodiment, the connection between the bus lead 2a and the smoothing capacitor 3 does not involve the conduction pattern of the printed circuit board 10 or another conductor member, so that the printed circuit board 10 and the power conversion device can be reduced in size. .

In the first embodiment, since the inverter section and the smoothing capacitor 3 are directly connected from the inside of the power module 1 with the bus lead 2a that protrudes and bends out of the mold resin 12, the auxiliary member such as a screw is used. Is unnecessary, the number of parts is reduced, and the cost is reduced.

Further, when the wiring distance between the inverter unit in the power module 1 and the smoothing capacitor 3 is shortened or the switching speed of the inverter unit is increased, the temperature of the smoothing capacitor 3 due to heat conduction from the power module 1. There is a concern that the life of the smoothing capacitor 3 and the like may be shortened. However, in the first embodiment, by using a SiC device (SiC switching element) capable of high-speed switching as the switching element, heat generation during switching is reduced, so that the life of the smoothing capacitor 3 and the like is not reduced. The wiring inductance between the power module 1 and the smoothing capacitor 3 can be reduced, and the switching speed can be increased.

Further, in the first embodiment, the power input / output connector 7 is directly connected to the power input / output lead 6 that protrudes from the inside of the power module 1 to the outside of the mold resin 12 and is bent. This eliminates the need for a power input / output pattern that needs to ensure a large area because the heat generation is large among the conductive patterns provided in the printed circuit board 10, thereby reducing wiring inductance and the printed circuit board 10 and power conversion. The apparatus can be miniaturized. Further, the same effect can be obtained even when such a power input / output lead 6 is directly connected to an interface unit such as a power connector or a terminal block as an interface unit for connection with an external device.

Therefore, according to the first embodiment, a power conversion device that is reduced in size and reduced in inductance can be obtained.

Embodiment 2. FIG.
In the second embodiment, a modification of the first embodiment will be described. FIG. 9 is a schematic diagram showing the shape of the smoothing capacitor connecting bus lead 2b according to the second embodiment. FIG. 10 is an enlarged schematic perspective view showing the vicinity of the connection portion between the smoothing capacitor 3 and the connection bus lead 2b according to the second embodiment. FIG. 11 is an enlarged schematic cross-sectional view showing the vicinity of the connecting portion between the smoothing capacitor 3 and the connecting bus lead 2b according to the second embodiment. In FIG. 11, the description in the power module 1 is omitted. Hereinafter, differences between the power conversion device according to the second embodiment and the power conversion device according to the first embodiment will be described.

The bus lead 2b according to the second embodiment is made of a flat conductive material, and two bus leads 2b are provided corresponding to the number of the smoothing capacitor electrodes 4. The bus lead 2b includes an extending portion 22a extending in a first direction (corresponding to an extending direction from the inside to the outside of the mold resin 12), and a first extending in a second direction bent in a right angle direction from the extending portion 22a. It is formed in a U-shape having a bent portion 22b and a second bent portion 22c bent further in the direction opposite to the first direction from the first bent portion 22b.

Further, a connecting hole 22d into which the smoothing capacitor electrode 4 is inserted is provided in the middle portion in the longitudinal direction of the second bent portion 22b in order to enable electrical connection with the smoothing capacitor electrode 4. One connecting hole 22d is provided for one bus lead 2b and two for the other bus lead 2b. Two or more connection holes 22d may be provided in the other bus lead 2b. The smoothing capacitor electrode 4 is inserted into the connection hole 22d, whereby the bus lead 2b and the smoothing capacitor electrode 4 are electrically connected.

Further, in the bus lead 2b according to the second embodiment, both end sides of the bus lead 2b are molded and fixed to the mold resin 12. That is, in the bus lead 2b, one end of the extending portion 22a and one end of the second bent portion 22c are fixed to the mold resin 12. In the bus lead 2b according to the second embodiment, the insulating spacer 15 is resin-molded and fixed between the vicinity of both ends in the longitudinal direction of the second bent portion 22b and the smoothing capacitor electrode 4. Thereby, an arbitrary insulation distance can be ensured between the bus lead 2 b and the smoothing capacitor 3. In addition, the installation location of the insulating spacer 15 is not limited to two locations, and may be provided at one location or three or more locations. By setting the insulating spacer 15 at two or more locations, the insulating distance can be more stably maintained.

In the second embodiment described above, the smoothing capacitor 3 is directly connected to the bus lead 2b that is bent from the inside of the power module 1 to the outside of the mold resin 12 as it is, so that the inverter section in the power module 1 and the smoothing The wiring distance to the capacitor 3 can be shortened. Thereby, the wiring inductance between the smoothing capacitor 3 and the inverter part can be reduced, and the surge voltage when the inverter part is switched can be reduced.

In the second embodiment, the connection between the bus lead 2b and the smoothing capacitor 3 does not involve the conduction pattern of the printed circuit board 10 or another conductor member, so that the printed circuit board 10 and the power conversion device can be downsized. .

Therefore, according to the second embodiment, a power conversion device that is reduced in size and reduced in inductance as in the first embodiment can be obtained.

In the above-described second embodiment, both end sides of the bus lead 2b are fixed to the mold resin 12. As a result, the bus lead 2b according to the second embodiment has improved mechanical strength as compared with the bus lead 2a according to the first embodiment, and prevents deformation of the bus lead 2b due to vibration or bending stress. be able to.

In the second embodiment described above, the smoothing capacitor 3 and the bus lead 2b can be reliably connected even when the arrangement of the smoothing capacitor electrode 4 is different by providing two or more connection holes 22d in one bus lead 2b. Can be electrically connected.

In the second embodiment, the insulating spacer 15 is resin-molded and fixed between the vicinity of both ends in the longitudinal direction of the second bent portion 22b and the smoothing capacitor electrode 4. Thereby, an arbitrary insulation distance can be ensured between the bus lead 2 b and the smoothing capacitor 3. The insulating spacer 15 may be applied to the bent portion 21b of the first embodiment, and the same effect can be obtained.

Embodiment 3 FIG.
In the third embodiment, a modification of the second embodiment will be described. FIG. 12 is a schematic diagram showing the shape of the smoothing capacitor connecting bus lead 2c according to the third embodiment. FIG. 13 is an enlarged schematic perspective view showing the vicinity of the connecting portion between the smoothing capacitor 3 and the connecting bus lead 2c according to the third embodiment. Below, the power converter which concerns on Embodiment 3 differs from the power converter which concerns on Embodiment 2 is demonstrated.

The bus lead 2c according to the third embodiment is made of a flat conductive material, and two bus leads 2c are provided corresponding to the number of the smoothing capacitor electrodes 4. The bus lead 2c is extended in a first direction (corresponding to the extending direction from the inside of the mold resin 12 to the outside), and a first extending in a second direction bent in a right angle direction from the extending portion 23a. A bent portion 23b, a second bent portion 23c bent in a third direction perpendicular to the first direction and the second direction from the first bent portion 23b, and a third bent portion bent in the second direction from the second bent portion 23c. 23d and a fourth bent portion 23e bent in a direction opposite to the first direction from the third bent portion 23d. That is, the bus lead 2c has a stepped shape (crank shape) in a plane perpendicular to the first direction, and a U-shape in a plane along the first direction.

Each of the four stepped portions, that is, the first bent portion 23b and the third bent portion 23d of the two bus lead 2c is provided with a connection hole 23f. The smoothing capacitor electrode 4 is inserted into the connection hole 23f, whereby the bus lead 2b and the smoothing capacitor electrode 4 are electrically connected.

In the above-described third embodiment, the smoothing capacitor 3 is directly connected to the bus lead 2c that protrudes and bends from the inside of the power module 1 to the outside of the mold resin 12 as it is. The wiring distance to the capacitor 3 can be shortened. Thereby, the wiring inductance between the smoothing capacitor 3 and the inverter part can be reduced, and the surge voltage when the inverter part is switched can be reduced.

In the third embodiment, the connection between the bus lead 2c and the smoothing capacitor 3 does not involve the conduction pattern of the printed circuit board 10 or another conductor member, so that the printed circuit board 10 and the power conversion device can be reduced in size. .

Therefore, according to the third embodiment, a power conversion device that is reduced in size and reduced in inductance as in the second embodiment can be obtained.

In the above-described third embodiment, the connection holes 23f are provided in the four steps of the two bus lead 2c, so that the smoothing capacitor 3 and the bus lead 2c can be arranged even when the smoothing capacitor electrode 4 is arranged differently. Can be reliably connected electrically. Two or more connection holes 23f may be provided in each stepped portion.

Further, in the above-described third embodiment, when the surge voltage when the inverter portion in the mold resin 12 is switched is large, a snubber capacitor is additionally connected to the connection hole 23f to which the smoothing capacitor electrode 4 is not connected. By doing so, it is possible to suppress the surge voltage.

Embodiment 4 FIG.
In the fourth embodiment, a modification of the second embodiment will be described. FIG. 14 is a schematic diagram showing the shape of a smoothing capacitor connecting bus lead 2d according to the fourth embodiment. FIG. 15 is an enlarged schematic perspective view showing the vicinity of the connection portion between the smoothing capacitor 3 and the connecting bus lead 2d according to the fourth embodiment. FIG. 16 is an enlarged schematic cross-sectional view showing the vicinity of the connection portion between the smoothing capacitor 3 and the connection bus lead 2d according to the fourth embodiment. In FIG. 16, the description in the power module 1 is omitted. Below, the power converter which concerns on Embodiment 4 differs from the power converter which concerns on Embodiment 2 is demonstrated.

The bus lead 2d according to the fourth embodiment is made of a flat conductive material, and two bus leads 2d are provided corresponding to the number of the smoothing capacitor electrodes 4. The bus lead 2b includes a extending portion 24a extending in a first direction (corresponding to an extending direction from the inside of the mold resin 12 to the outside), and a first extending in a second direction bent in a right angle direction from the extending portion 24a. A bent portion 24b, a second bent portion 24c bent in a direction opposite to the first direction from the first bent portion 24b, a third bent portion 24d bent further in the direction opposite to the second direction from the second bent portion 24c, It is formed in a substantially U-shape having

Further, a connecting hole 24e into which the smoothing capacitor electrode 4 is inserted is provided in the middle portion in the longitudinal direction of the second bent portion 24b in order to enable electrical connection with the smoothing capacitor electrode 4. Further, one connecting hole 24e is provided for one bus lead 2d and two for the other bus lead 2d. Two or more connection holes 24e may be provided in the other bus lead 2d. The smoothing capacitor electrode 4 is inserted into the connection hole 24e, whereby the bus lead 2b and the smoothing capacitor electrode 4 are electrically connected.

Further, a concave portion 12a extending along the side direction is provided on the upper surface corner of the mold resin 12 on the side facing the smoothing capacitor electrode 4.

When only one end side (the mounting side of the electronic component 14) of the protruding portion of the bus lead can be molded and fixed when the mold resin 12 is molded, the other end side (the non-mounting side of the electronic component 14) of the protruding portion of the bus lead The bus lead can be fixed (latched) to the mold resin 12 by hooking the portion to the corner of the mold resin 12. That is, the first bent portion 24b, the second bent portion 24c, and the third bent portion 24d of the bus lead 2d are formed in a size that matches the shape of the concave portion 12a, and the third bent portion 24d is hooked on the concave portion 12a, thereby generating the bus lead. The other end side (the non-mounting side of the electronic component 14) of the 2d protrusion can be fixed to the mold resin 12.

In the above-described fourth embodiment, the smoothing capacitor 3 is directly connected to the bus lead 2d that protrudes and bends from the inside of the power module 1 to the outside of the mold resin 12 as it is, so that the inverter unit in the power module 1 and the smoothing The wiring distance to the capacitor 3 can be shortened. Thereby, the wiring inductance between the smoothing capacitor 3 and the inverter part can be reduced, and the surge voltage when the inverter part is switched can be reduced.

In the fourth embodiment, the connection between the bus lead 2d and the smoothing capacitor 3 does not involve the conduction pattern of the printed circuit board 10 or another conductor member, so that the printed circuit board 10 and the power conversion device can be downsized. .

Therefore, according to the fourth embodiment, a power conversion device that is reduced in size and reduced in inductance as in the second embodiment can be obtained.

In the above-described fourth embodiment, the other end side (the non-mounting side of the electronic component 14) of the protruding portion of the bus lead 2d is molded resin by hooking the third bent portion 24d of the bus lead 2d to the recess 12a. 12 can be fixed. As a result, the bus lead 2d according to the fourth embodiment has improved mechanical strength as compared with the bus lead 2a according to the first embodiment, and prevents deformation of the bus lead 2b due to stress caused by vibration or bending. be able to.

Embodiment 5 FIG.
In the fifth embodiment, a modification of the third embodiment will be described. FIG. 17 is a schematic diagram showing the shape of a smoothing capacitor connecting bus lead 2e according to the fifth embodiment. FIG. 18 is a schematic perspective view showing, in an enlarged manner, the vicinity of the connecting portion between the smoothing capacitor 3 and the connecting bus lead 2e according to the fifth embodiment. Below, the power converter which concerns on Embodiment 5 differs from the power converter which concerns on Embodiment 3 is demonstrated.

In the upper surface corner of the mold resin 12 on the side facing the smoothing capacitor electrode 4, a recess 12 a extending along the side direction is provided as in the fourth embodiment. The bus lead 2e according to the fifth embodiment has a shape obtained by combining the shape of the bus lead 2c according to the third embodiment and the shape of the bus lead 2d according to the fourth embodiment.

The bus lead 2e according to the fifth embodiment is made of a flat conductive material, and two bus leads 2e are provided corresponding to the number of the smoothing capacitor electrodes 4. The bus lead 2e has an extending portion 25a extending in a first direction (corresponding to an extending direction from the inside of the mold resin 12 to the outside), and a first extending in a second direction bent in a right angle direction from the extending portion 25a. A bent portion 25b, a second bent portion 25c bent in a third direction perpendicular to the first direction and the second direction from the first bent portion 25b, and a third bent portion bent in the second direction from the second bent portion 25c. 25d, a fourth bent portion 25e bent from the third bent portion 25d in the direction opposite to the first direction, and a fifth bent portion 25f bent from the fourth bent portion 25e in the direction opposite to the second direction. Has been.

Each of the four stepped portions, that is, the first bent portion 25b and the third bent portion 25d of the two bus lead 2e is provided with a connection hole 25g. The smoothing capacitor electrode 4 is inserted into each of the connection holes 25g, whereby the bus lead 2e and the smoothing capacitor electrode 4 are electrically connected.

In the above-described fifth embodiment, the smoothing capacitor 3 is directly connected to the bus lead 2e that protrudes and bends from the inside of the power module 1 to the outside of the mold resin 12, so that the inverter section in the power module 1 and the smoothing The wiring distance to the capacitor 3 can be shortened. Thereby, the wiring inductance between the smoothing capacitor 3 and the inverter part can be reduced, and the surge voltage when the inverter part is switched can be reduced.

In the fifth embodiment, the connection between the bus lead 2e and the smoothing capacitor 3 does not involve the conduction pattern of the printed circuit board 10 or another conductor member, so that the printed circuit board 10 and the power conversion device can be downsized. .

Therefore, according to the fifth embodiment, a power conversion device that is reduced in size and reduced in inductance as in the third embodiment can be obtained.

Further, in the above-described fifth embodiment, the connection of the smoothing capacitor electrode 4 is different as in the third embodiment by providing the connection holes 25g in the four steps of the two bus lead 2e. The smoothing capacitor 3 and the bus lead 2e can be reliably electrically connected to each other. Two or more connection holes 25g may be provided in each stepped portion.

Further, in the above-described fifth embodiment, the smoothing capacitor electrode 4 is not connected when the surge voltage when the inverter in the mold resin 12 is switched is the same as in the third embodiment. It is possible to suppress the surge voltage by additionally connecting a snubber capacitor to the service hole 25g.

In the fifth embodiment described above, the fifth bent portion 25f of the bus lead 2e is hooked on the recess 12a, so that the other end side (electronic component) of the protruding portion of the bus lead 2e is the same as in the fourth embodiment. 14 on the non-mounting side) can be fixed to the mold resin 12. As a result, the bus lead 2e according to the fifth embodiment has improved mechanical strength as compared with the bus lead 2a according to the first embodiment, and prevents deformation of the bus lead 2e due to vibration or bending stress. be able to.

Embodiment 6 FIG.
In the sixth embodiment, a modification of the second embodiment will be described. FIG. 19 is an enlarged schematic perspective view showing the vicinity of the connecting portion between the smoothing capacitor 3 and the connecting bus lead 2b according to the sixth embodiment. FIG. 20 is an enlarged schematic cross-sectional view showing the vicinity of the connecting portion between the smoothing capacitor 3 and the connecting bus lead 2b according to the sixth embodiment. In FIG. 20, the description in the power module 1 is omitted. Below, the power converter which concerns on Embodiment 6 differs from the power converter which concerns on Embodiment 2 is demonstrated.

In the sixth embodiment, the bus lead 2b according to the second embodiment is used as the bus lead for connection. Further, in the sixth embodiment, a mold resin protrusion 16 is formed instead of the insulating spacer 15. That is, at the same time that the mold resin 12 is molded, the portions of the extending portion 22a and the second bent portion 22c of the bus lead 2b shown in FIG. 9 are also covered with the resin, and up to a position exceeding the first bent portion 22b in the first direction. The mold resin protrusion 16 is formed by resin molding from the side surface of the mold resin 12.

And, by connecting the smoothing capacitor 3 to the first bent portion 22b of the bus lead 2b, a predetermined insulation distance can be secured between the smoothing capacitor 3 and the bus lead 2b. The mold resin protrusion 16 may be applied to the other embodiments described above. Here, two portions of the extended portion 22a and the second bent portion 22c of the bus lead 2b are covered with resin, but either one may be used. However, the insulating distance can be more stably maintained by covering the two portions of the extended portion 22a and the second bent portion 22c of the bus lead 2b with resin.

In the above-described sixth embodiment, the smoothing capacitor 3 is directly connected to the bus lead 2b that is bent from the inside of the power module 1 to the outside of the mold resin 12 as it is. The wiring distance to the capacitor 3 can be shortened. Thereby, the wiring inductance between the smoothing capacitor 3 and the inverter part can be reduced, and the surge voltage when the inverter part is switched can be reduced.

In the sixth embodiment, the connection between the bus lead 2b and the smoothing capacitor 3 does not involve the conductive pattern of the printed circuit board 10 or another conductor member, so that the printed circuit board 10 and the power conversion device can be downsized. .

Therefore, according to the sixth embodiment, a power conversion device that is reduced in size and reduced in inductance as in the second embodiment can be obtained.

Further, in the above-described sixth embodiment, the mold resin protrusion 16 is resin-molded between the vicinity of both ends in the longitudinal direction of the second bent portion 22b and the smoothing capacitor electrode 4. Thereby, an arbitrary insulation distance can be secured between the bus lead 2 b and the smoothing capacitor 3.

As described above, the power module according to the present invention is useful for downsizing and low inductance of the mounted device, and is particularly suitable for a power conversion device.

1 power module, 2a, 2b, 2c, 2d, 2e bus lead, 3 smoothing capacitor, 4 smoothing capacitor electrode, 5 control lead, 6 power input / output lead, 7 power input / output connector, 8 control signal connector, 9 connector pin 10, printed circuit board, 11 resin case, 12 mold resin, 12a recess, 13 conductor wire, 14 electronic parts, 15 insulation spacer, 16 mold resin protrusion, 21a extension part, 21b bending part, 21c connection hole, 22a extension part, 22b 1st bent part, 22c 2nd bent part, 22d connecting hole, 23a extending part, 23b 1st bent part, 23c 2nd bent part, 23d 3rd bent part, 23e 4th bent part, 23f connecting hole, 24a stretched part, 24b first bent part, 24c second bent part, 24d 3rd bent portion, 24e connecting hole, 25a extending portion, 25b first bent portion, 25c second bent portion, 25d third bent portion, 25e fourth bent portion, 25f fifth bent portion, 25g connecting hole, 31a Extension part, 31b 1st bending part, 31c 2nd bending part.

Claims (13)

A lead conductor on which electronic components are mounted;
Mold resin that encapsulates and seals the electronic component and the lead conductor;
An electronic component electrically connected to a bent portion including an L-shaped portion in which the lead conductor extends from the inside of the mold resin to the outside and is further bent;
A power module comprising: The electronic component is a smoothing capacitor;
The smoothing capacitor is connected to a portion of the bent portion facing the mold resin;
The power module according to claim 1. The bent portion has a U-shape, and both ends of the U-shape are molded and fixed to the mold resin;
The power module according to claim 2. The smoothing capacitor has two electrode terminals;
Two lead conductors are provided corresponding to the two electrode terminals,
One of the two lead conductors has one connection hole on the surface facing the mold resin, into which one of the two electrode terminals is inserted,
The other lead conductor of the two lead conductors has two or more connection holes on the surface facing the mold resin, into which the other of the two electrode terminals is inserted,
The power module according to claim 3. The smoothing capacitor has two electrode terminals;
The lead conductor is provided with two portions corresponding to the two electrode terminals in which the portion facing the side surface of the mold resin in the bent portion is stepped in a plane parallel to the side surface,
One of the two lead conductors has a connection hole into which one of the two electrode terminals is inserted in each stepped portion in the stepped shape,
The other lead conductor of the two lead conductors has a connection hole into which the other of the two electrode terminals is inserted in each stepped portion in the stepped shape,
The power module according to claim 3. The bent portion has a U-shape, and one end portion on the mounting side of the electronic component among the both ends of the U-shape is molded and fixed to the mold resin, and the other end portion of the mold resin. Being hooked to the part,
The power module according to claim 2. The smoothing capacitor has two electrode terminals;
Two lead conductors are provided corresponding to the two electrode terminals,
One of the two lead conductors has one connection hole on the surface facing the mold resin, into which one of the two electrode terminals is inserted,
The other lead conductor of the two lead conductors has two or more connection holes on the surface facing the mold resin, into which the other of the two electrode terminals is inserted,
The power module according to claim 6. The smoothing capacitor has two electrode terminals;
The lead conductor is provided with two portions corresponding to the two electrode terminals in which the portion facing the side surface of the mold resin in the bent portion is stepped in a plane parallel to the side surface,
One of the two lead conductors has a connection hole into which one of the two electrode terminals is inserted in each stepped portion in the stepped shape,
The other lead conductor of the two lead conductors has a connection hole into which the other of the two electrode terminals is inserted in each stepped portion in the stepped shape,
The power module according to claim 6. Having a spacer for maintaining an insulation distance between the lead conductor and the smoothing capacitor between the lead conductor and the smoothing capacitor;
The power module according to any one of claims 2 to 8, wherein: Resin protrusions that are resin molded and maintain an insulation distance between the lead conductor and the smoothing capacitor are connected to the smoothing capacitor from both ends of a portion of the U-shaped bent portion that faces the side surface of the mold resin. Having in between,
The power module according to any one of claims 3 to 5, wherein: The electronic component is a first connector;
The power module according to any one of claims 1 to 10, wherein: The control circuit board of the power module on which the second connector is mounted is electrically connected by another lead conductor protruding from the mold resin,
In the power module and the control circuit board, the first connector and the second connector are arranged apart from each other and a part of the first connector and the second connector protrudes. Stored in a storage case,
The power module according to claim 11. Comprising a switching element comprising a SiC device and performing a switching operation in the power module;
The power module according to any one of claims 1 to 12, wherein:

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