JP2007234696A - Semiconductor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor module having an external connection terminal capable of bonding an external electrode to the external connection terminal by ultrasonic bonding without trouble. <P>SOLUTION: The semiconductor module 10 comprises: an electronic component 12, such as a semiconductor device; and planar external connection terminals 13, 14 of which one end side is connected to the electronic component 12 electrically. The external connection terminals 13, 14 pass through a support section 15 made of resin provided at the upper portion of a base section 11 where the electronic components 12 are arranged, a part at the upper portion of the support section 15 is extended along the upper surface of the support section 15, and the tip is bent toward the side of the base section 11. The external connection terminals 13, 14 are fixed to the support section 15 while the tip is being buried to the support section 15. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor module, and more particularly to a semiconductor module suitable for use in power control.

  When the power semiconductor module is connected to, for example, a capacitor, as shown in FIG. 9, one end is a plus terminal of the capacitor 43 with respect to the positive side and negative side external connection terminals 41 and 42 supported by the cover 40 of the semiconductor module. Copper plate wiring bars 44 and 45 connected to 43 a and the negative terminal 43 b are fastened and fixed by screws 46.

  As shown in FIG. 10, as a support structure for the external connection terminals of the semiconductor module, a plate-like external connection terminal 48 is insert-molded in the case 47 of the semiconductor module, and an end portion 48 a of the external connection terminal 48 is an upper surface of the case 47. The structure bent so that it may contact | abut is disclosed (for example, refer patent document 1).

In a high power semiconductor device (high power semiconductor module), an electrode terminal of a semiconductor chip fixed on a substrate is connected to an electrode terminal block formed on the substrate, and at least a joining end portion is connected to the electrode terminal block. A configuration in which one end of a plate-like external electrode terminal is connected by ultrasonic bonding is disclosed (for example, see Patent Document 2). A part of the external electrode terminal, the substrate, the semiconductor chip fixed on the substrate, and the electrode terminal block are accommodated in a resin case.
JP 2000-183278 A Japanese Patent Laid-Open No. 11-195725

  In the power semiconductor module, it is necessary to reduce the wiring inductance between the positive and negative external connection terminals 41 and 42 and the plus terminal 43 a and the minus terminal 43 b of the capacitor 43. Among these, the inductance of the portion where the wiring bars 44 and 45 are arranged in parallel vertically is almost zero because the direction of the current flowing through the wiring bars 44 and 45 is opposite. However, in the connection portion between the positive and negative external connection terminals 41, 42 and the wiring bars 44, 45, the connection between the external connection terminals 41, 42 and both the wiring bars 44, 45 is performed by tightening with screws 46. Therefore, although it is apparently the upper surface contact, it is actually a point (line) contact of the tightening portion by the screw 46, and the inductance is not reduced. As a result, the semiconductor module is damaged or the durability is lowered due to a surge voltage at the time of switching of the power semiconductor elements constituting the semiconductor module. Further, in the case of fixing with the screw 46, the height of the semiconductor module is increased by the height of the head of the screw 46, which hinders the thinning of the physique of the semiconductor module. Further, in order to tighten with the screw 46, it is necessary to form holes through which the screw 46 is inserted in both the external connection terminals 41 and 42 and the wiring bars 44 and 45, and accordingly, the contact area is reduced. Therefore, in order to ensure the necessary contact area, it is necessary to increase the area at the joint between the external connection terminals 41 and 42 and the wiring bars 44 and 45 at least for the holes.

  As a method for suppressing the generation of inductance at the connection portion between the positive and negative external connection terminals 41 and 42 and the wiring bars 44 and 45, the positive and negative external connection terminals 41 and 42 and the wiring bars 44 and 45 are provided. A method of joining the entire surface by ultrasonic joining is conceivable. However, in the case of performing ultrasonic bonding, it is necessary to apply vibration in a state where the bonding portion is strongly pressed by a bonding tool (horn). Therefore, it is necessary that the portion that supports the bonding target has a strength that does not deform due to the pressing force. It is necessary to suppress the horizontal displacement due to vibration. Therefore, it is difficult to ultrasonically bond an object that is in a state of being lifted from the support portion, such as an electrode terminal, or an object that is supported by a support portion that is easily bent.

Patent Document 1 discloses a configuration in which the end of the external connection terminal 48 is bent so that the end of the external connection terminal 48 contacts the upper surface of the case 47, although there is no description regarding ultrasonic bonding. In this configuration, when the wiring bar is joined to the end portion of the external connection terminal 48 by ultrasonic joining, it is possible to cope with the pressing force by the joining tool, but it is difficult to suppress the horizontal displacement due to vibration.

  In Patent Document 2, a plate-like external electrode terminal is connected to an electrode terminal block by ultrasonic bonding. However, Patent Document 2 does not describe anything regarding ultrasonic bonding to an object such as an electrode terminal that is floating from a support portion or an object that is supported by a support portion that is easily bent.

  The object of the present invention is to suppress the generation of inductance at the joint between the external connection terminal and the external electrode by providing the external connection terminal capable of joining the external electrode to the external connection terminal without any problem by ultrasonic bonding. Another object of the present invention is to provide a semiconductor module that can be made smaller and thinner.

  In order to achieve the above object, an invention according to claim 1 is a semiconductor module including a plate-like external connection terminal having one end side electrically connected to an electronic component. The plate-like external connection terminal passes through a resin support portion provided above the base portion on which the electronic component is disposed, and a portion above the support portion is an upper surface of the support portion. And the tip is bent into the base portion side.

  In this invention, the plate-like external connection terminal penetrates the resin support part, and the upper part of the support part extends along the upper surface of the support part and the tip is bent to the base part side. Has been. Therefore, in order to join the external electrode to the external connection terminal by ultrasonic bonding, the external connection terminal is kept at a fixed position even if a pressing force and horizontal vibration are applied from the welding tool to the external connection terminal via the external electrode. Thus, ultrasonic bonding can be performed without any problem. As a result, it is possible to suppress the generation of inductance at the joint between the external connection terminal and the external electrode, and it is possible to reduce the size and thickness (lower height) of the module body.

  According to a second aspect of the present invention, in the first aspect of the present invention, the support portion is provided so as to be erected from the base portion, and the external connection terminal is integrally formed with the support portion by insert molding. Is formed. In this invention, compared to a configuration in which there is a space between the support portion and the base portion, the support portion bears a pressing force that acts on the support portion from the bonding tool when the external electrode is ultrasonically bonded to the external connection terminal. easy. Also, the external connection terminal is in the state where the surface facing the support part is in close contact with the support part by insert molding, so that when the external tool is vibrated from the joining tool, relative movement with the support part is prevented. Thus, ultrasonic bonding can be performed satisfactorily.

  According to a third aspect of the present invention, in the first aspect of the present invention, the support portion constitutes a cover of a housing that houses the electronic component, and the external connection terminal penetrates the support portion and A portion protruding upward from the support portion is bent and fixed to the support portion with resin. Here, “fixed with resin” means a state in which the bent portion is arranged at a position corresponding to the concave portion formed in the support portion, and the concave portion is a thermosetting resin, a photocurable resin, or a thermosetting resin. It means that it is buried in a plastic resin or is bonded to the support portion with an adhesive in a state where the bent portion is arranged at a position corresponding to the notch portion formed in the support portion.

In the present invention, when the external connection terminal is provided on the cover of the housing of the semiconductor module, the external electrode can be bonded to the external connection terminal by ultrasonic bonding without any trouble.
According to a fourth aspect of the present invention, in the third aspect of the present invention, the support portion is fixed to the main body of the housing. In the present invention, when the external electrode is joined to the external connection terminal, the external connection terminal is less likely to be moved by vibration.

  The invention according to claim 5 is the invention according to any one of claims 2 to 4, wherein the support portion is a structure provided on the base portion side on the side facing the base portion. A space for avoiding the interference is provided. In this invention, it becomes possible to make the physique of a semiconductor module small compared with the structure which does not provide the said space.

  According to the present invention, it is possible to suppress the generation of inductance at the joint between the external connection terminal and the external electrode by providing the external connection terminal capable of joining the external electrode to the external connection terminal without any problem by ultrasonic bonding. In addition, the module size can be reduced in size and thickness.

(First embodiment)
A first embodiment embodying the present invention will be described below with reference to FIGS.
As shown in FIGS. 1A and 1B, a semiconductor module 10 includes a base portion 11 and an electronic component 12 as a power semiconductor element provided on the base portion 11 (shown in FIG. 1A). And plate-like external connection terminals 13 and 14 whose one ends are electrically connected to the electronic component 12 via bonding wires 12a.

  Both external connection terminals 13 and 14 pass through a resin-made support portion 15 provided so as to stand up from the base portion 11, and a portion above the support portion 15 extends along the upper surface of the support portion 15. In addition, the tip is formed in a shape bent toward the base portion 11 side. As a material of the support portion 15, for example, PPS (polyphenylene sulfide), PBT (polybutylene terephthalate), or the like is used. In this embodiment, the external connection terminals 13 and 14 are integrally formed with the support portion 15 by insert molding. That is, the external connection terminals 13, 14 have the upper surface of the portion extending along the upper surface of the support portion 15 exposed from the support portion 15, and the lower surface and the bent portion at the tip are supported in close contact with the support portion 15.

  Next, the operation of the semiconductor module 10 configured as described above will be described. The semiconductor module 10 is used, for example, as a part of a power supply device of an automobile. As shown in FIG. 2, both external connection terminals 13 and 14 are capacitors via plate-like external electrodes 16 and 17. The 18 positive terminals 18a and the negative terminals 18b are electrically connected. Both external electrodes 16 and 17 are joined in a state where an electrical insulating member (not shown) is interposed in a portion excluding a portion joined to the external connection terminals 13 and 14. The output terminal 19 is connected to a motor (none of which is shown) via wiring.

  The external electrodes 16 and 17 are bonded to the external connection terminals 13 and 14 at one end thereof over the entire surfaces facing each other by ultrasonic bonding. In ultrasonic bonding, the external electrodes 16 and 17 are placed on the external connection terminals 13 and 14, and the upper surfaces of the external electrodes 16 and 17 are pressed by a bonding tool (horn) (not shown) for ultrasonic bonding. In addition, horizontal vibration can be applied. At this time, since the support portion 15 is erected from the base portion 11, even if a pressing force is applied to the external electrodes 16, 17 and the external connection terminals 13, 14, the pressing force is carried by the support portion 15, Ultrasonic bonding is performed in a state where the bending of the connection terminals 13 and 14 and the external electrodes 16 and 17 is suppressed.

  In addition, since the external connection terminals 13 and 14 are formed so that their tips do not extend parallel to the upper surface of the support portion 15 but bend toward the base portion 11 side, horizontal vibrations from the tool cause external electrodes 16. , 17 is held at a fixed position without moving relative to the support portion 15. As a result, the external electrodes 16 and 17 cause a relative sliding motion with a high frequency with respect to the external connection terminals 13 and 14, and ultrasonic bonding is performed well.

  When the semiconductor module 10 in which the external electrodes 16 and 17 are electrically connected to the external connection terminals 13 and 14 by ultrasonic bonding as described above is used, the connection between the external connection terminals 13 and 14 and the external electrodes 16 and 17 is achieved. Generation of inductance at the joint is suppressed. Therefore, generation of a surge voltage at the time of switching of the power semiconductor element constituting the semiconductor module 10 is suppressed. As a result, damage to the semiconductor module 10 due to the surge voltage is suppressed, and it is possible to use an electronic component 12 constituting the semiconductor module 10 having a low withstand voltage, which contributes to cost reduction.

  Further, unlike the case where the external connection terminals 13 and 14 and the external electrodes 16 and 17 are tightened with screws, the height of the semiconductor module 10 can be lowered by the height of the screw head, and the physique of the semiconductor module 10 can be reduced in thickness. It becomes possible. Further, it is not necessary to form holes through which the screws are inserted in the external connection terminals 13 and 14 and the external electrodes 16 and 17, and accordingly, the external connection terminals 13 and 14 and the external connection terminals 13 and 14 necessary for securing a necessary contact area. The area at the joint between the external electrodes 16 and 17 can be reduced, and the semiconductor module 10 can be downsized.

According to this embodiment, the following effects can be obtained.
(1) The semiconductor module 10 includes an electronic component 12 such as a semiconductor element, and plate-like external connection terminals 13 and 14 whose one end side is electrically connected to the electronic component 12. The external connection terminals 13 and 14 pass through the resin support portion 15 provided above the base portion 11 on which the electronic component 12 is disposed, and a portion above the support portion 15 is the support portion 15. The tip is formed in a shape that extends along the upper surface of the substrate and the tip is bent toward the base portion 11. Therefore, the external electrodes 16 and 17 can be bonded to the external connection terminals 13 and 14 by ultrasonic bonding without any trouble. As a result, when the semiconductor module 10 is used, the generation of inductance at the junction between the external connection terminals 13 and 14 and the external electrodes 16 and 17 can be suppressed, and the electronic component 12 having a low withstand voltage can be used. Can do. In addition, as compared with the case where screws are used for joining the external connection terminals 13 and 14 and the external electrodes 16 and 17, it is possible to make the physique of the semiconductor module 10 smaller and thinner (lower profile). it can.

  (2) Since the support portion 15 is provided so as to be erected from the base portion 11, the external connection terminals 13 and 14 are externally connected as compared with a configuration in which a space is provided between the support portion 15 and the base portion 11. When the electrodes 16 and 17 are ultrasonically bonded, the support portion 15 easily bears a pressing force acting on the support portion 15 from the bonding tool.

  (3) Since the external connection terminals 13 and 14 are in insert molding and the surface facing the support portion 15 is in close contact with the support portion 15, when vibration is applied to the external electrodes 16 and 17 from the joining tool. Further, relative movement with the support portion 15 is prevented, and ultrasonic bonding can be performed better.

(Second Embodiment)
Next, a second embodiment embodying the present invention will be described with reference to FIGS. The second embodiment is significantly different from the first embodiment in that the support portion that supports the other end side of the external connection terminals 13 and 14 forms a cover of a housing that houses the electronic component 12. ing. Parts that are basically the same as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 3 and 4, the housing 20 of the semiconductor module 10 includes a main body 21 having a base portion 11, and a cover 23 as a support portion fixed to upper portions of side walls 22 a, 22 b, and 22 c of the main body 21. It has. As shown in FIG. 4, a stepped portion for restricting the lateral movement of the cover 23 is formed on the upper portions of the side walls 22a and 22b, and the cover 23 is attached to be engaged with the stepped portion. An adhesive (not shown) is applied between the cover 23 and the upper portions of the side walls 22 a to 22 c, and the cover 23 is fixed to the main body 21.

  The external connection terminals 13 and 14 are partially embedded in a side wall 22c provided between a pair of opposing side walls 22a and 22b, and one end side to which the bonding wire 12a is connected extends in parallel with the base portion 11. It is exposed and insert-molded so that the other end protrudes from the upper end of the side wall 22c. And the part which protruded from the upper end of the side wall 22c penetrates the cover 23, protrudes above the cover 23, the protruded part extends along the upper surface of the cover 23, and the front-end | tip part bent to the base part 11 side. It is formed into a shape.

  A concave portion 23a is formed on the upper surface of the cover 23, and the portions of the external connection terminals 13 and 14 that are bent toward the base portion 11 are disposed at positions corresponding to the concave portion 23a, and the resin 24 ( For example, it is fixed to the cover 23 with an epoxy resin as a thermosetting resin.

  The cover 23 is a portion where the recess 23a is formed in order to bear a pressing force acting on the external connection terminals 13 and 14 when the external electrodes 16 and 17 are ultrasonically bonded to the external connection terminals 13 and 14. The thickness is greater than the thickness of the other part. However, interference between the bonding wire 12a as a structure for connecting the electronic component 12 and the external connection terminals 13 and 14 and the cover 23 between the portion corresponding to the recess 23a and the base portion 11 is avoided. A space S is provided. That is, the cover 23 is formed on the side facing the base portion 11 so as to provide a space S that avoids interference with a structure provided on the base portion 11 side.

  Next, a method for attaching the cover 23 to the main body 21 and a method for attaching the external connection terminals 13 and 14 to the cover 23, which are one step in the method of manufacturing the semiconductor module 10, will be described.

  After the work in the main body 21 such as the connection work between the one end of the external connection terminals 13 and 14 and the electronic component 12 by the bonding wire 12a is completed, the upper end of the side wall 22c of the external connection terminals 13 and 14 as shown in FIG. The cover 23 is attached to the main body 21 so as to penetrate the cover 23 in a state in which the portion protruding from the straight line extends. The output terminal 19 (not shown) penetrates the cover 23 in the same manner.

  Next, after a portion corresponding to the concave portion 23 a at the tip of the external connection terminals 13, 14 is bent toward the concave portion 23 a, the protruding portion of the external connection terminals 13, 14 from the cover 23 is almost abutted along the upper surface of the cover 23. The outer connection terminals 13 and 14 are bent so as to extend in contact with each other, and the tips of the external connection terminals 13 and 14 are accommodated in the recess 23a. Next, an epoxy resin is injected as a thermosetting resin into the recess 23a, and is then cured by heating so that the tips of the external connection terminals 13 and 14 are fixed to the recess 23a with the resin 24. Further, a portion of the output terminal 19 (not shown) protruding above the cover 23 is bent along the upper surface of the cover 23, and the mounting of the cover 23 to the main body 21 and the mounting of the external connection terminals 13 and 14 to the cover 23 are completed. To do.

  Similarly to the semiconductor module 10 of the first embodiment, the semiconductor module 10 of this embodiment is electrically connected to the capacitor 18 via the external electrodes 16 and 17 that are joined to the external connection terminals 13 and 14 by ultrasonic bonding. Connected and used. The external connection terminals 13, 14 are inserted into the cover 23 at the tip side so as to penetrate the cover 23, and then the protrusions are bent and attached to the cover 23, but the tips are fixed with the resin 24. Therefore, even when vibration is applied in the horizontal direction, that is, in the direction along the upper surface of the cover 23 via ultrasonic waves 16 and 17 during ultrasonic bonding, relative movement with respect to the cover 23 is prevented, and ultrasonic bonding is not hindered. Done.

Therefore, according to this embodiment, the following effect can be obtained in addition to the effect similar to (1) in the first embodiment.
(4) The support portion that supports the portions of the external connection terminals 13 and 14 joined to the external electrodes 16 and 17 constitutes the cover 23 of the housing 20 that houses the electronic component 12, and the external connection terminals 13 and 14 are A portion that penetrates the cover 23 and protrudes upward from the cover 23 is bent and fixed to the cover 23 with a resin 24. Therefore, when the external connection terminals 13 and 14 are provided on the cover 23 of the housing 20 of the semiconductor module 10, the external electrodes 16 and 17 can be joined to the external connection terminals 13 and 14 by ultrasonic joining without any trouble.

  (5) The cover 23 is fixed to the main body 21 of the housing 20. Accordingly, when the external electrodes 16 and 17 are joined to the external connection terminals 13 and 14, the external connection terminals 13 and 14 are less likely to be moved by vibration applied to the external electrodes 16 and 17. As a result, it becomes easy for the external electrodes 16 and 17 to cause a relative sliding motion at a high frequency with respect to the external connection terminals 13 and 14, and ultrasonic bonding can be performed more favorably.

  (6) The cover 23 is provided with a space S on the side facing the base portion 11 so as to avoid interference with the bonding wire 12a as a structure provided on the base portion 11 side. Therefore, the physique of the semiconductor module 10 can be made smaller compared to a configuration in which the space S is not provided.

The embodiment is not limited to the above, and may be embodied as follows, for example.
A space for avoiding interference with a structure provided on the side of the base portion 11 on the side facing the base portion 11 of the support portion that supports the portions of the external connection terminals 13 and 14 that are joined to the external electrodes 16 and 17. The configuration in which S is provided is not limited to the configuration in which the cover 23 is fixed to the upper part of the side walls 22a to 22c of the housing 20 and the space S is provided between the structures as in the second embodiment. For example, as shown in FIG. 6A, in a configuration in which the support portion 15 is erected from the base portion 11, a space that avoids interference with the bonding wire 12 a on the side facing the base portion 11 of the support portion 15. S may be provided.

  In the configuration in which the support portion 15 is erected from the base portion 11 as in the first embodiment, the distal end portions of the external connection terminals 13 and 14 supported on the upper portion of the support portion 15 are embedded in the support portion 15. It is not limited to the configuration. For example, as shown in FIG. 6B, the end portions of the external connection terminals 13 and 14 may be insert-molded so that the outer surfaces of the bent portions are exposed.

  The housing 20 is not limited to the configuration in which the cover 23 is attached to the upper part of the side walls 22a to 22c of the main body 21. For example, as shown in FIG. 7, the side wall 23 b may protrude from the lower surface of the cover 23, and the lower end of the side wall may be fixed to the base portion 11 with an adhesive. Moreover, it is good also as a structure which replaces with the side wall 23b, forms a some leg part so that it may protrude from the lower surface of the cover 23, and fixes the lower end of a leg part to the base part 11. FIG.

  ○ In the configuration in which the support portion 15 is erected from the base portion 11, after the external connection terminals 13 and 14 are insert-molded so as to protrude straight above the support portion 15, the protruding portion is formed on the upper surface of the support portion 15. You may bend and form so that a front end may face the base part 11 side. If there is a gap between the external connection terminals 13 and 14 and the support portion 15, an adhesive may be injected into the gap to fix the external connection terminals 13 and 14 to the support portion 15.

  The cover 23 is not limited to a configuration that covers the entire upper portion of the base portion 11. For example, as shown in FIG. 8, the cover 23 is provided so as to cover the external connection terminals 13, 14 side of the base portion 11. It is good also as a structure which covers the part which is not covered with a part of external electrodes 16 and 17 joined to the external connection terminals 13 and 14. FIG.

  In the configuration in which the support portion 15 is erected from the base portion 11, the protruding portion from the support portion 15 of the external connection terminals 13 and 14 is bent to form the joint portion of the external electrodes 16 and 17. A recess or notch having the same width as that of the external connection terminals 13 and 14 and a length that allows bending of the distal ends of the external connection terminals 13 and 14 is formed on the upper surface of 15. And after bending the front-end | tip of the external connection terminals 13 and 14 so that it may accommodate in a recessed part or a notch, resin may be filled in a recessed part or a notch.

  In the second embodiment, the resin 24 filled in the recesses 23a is not limited to a thermosetting resin, but may be a photocurable resin or a thermoplastic resin. In the case of a photocurable resin, after filling an uncured photocurable resin, it is cured by irradiation with light. Further, in the case of a thermoplastic resin, the resin is heated and melted to fill the recess 23a, and then cooled.

  The structure accommodated in the space S provided at a position corresponding to the lower side of the external connection terminals 13 and 14 of the cover 23 or the support portion 15 is not limited to the bonding wire 12a, and may accommodate a part of the electronic component 12. Good.

  In the configuration in which the cover 23 is attached to the step portions formed on the side walls 22a and 22b, the cover 23 can be fixed to the side walls 22a and 22b by simply fitting the side walls 22a and 22b without using an adhesive or the like. Good.

The 1st Embodiment is shown, (a) is an AA line schematic sectional view of (b), and (b) is a partial schematic top view of a semiconductor module. The schematic plan view of the state which connected the semiconductor module and the capacitor | condenser. The schematic cross section of the semiconductor module in 2nd Embodiment. FIG. 4 is a schematic cross-sectional view taken along line BB in FIG. 3. The schematic cross section in the middle of manufacture. (A), (b) is a fragmentary sectional view of another embodiment. The schematic cross section of another embodiment. The schematic plan view in another embodiment. The schematic top view of a prior art. The schematic cross section of another prior art.

Explanation of symbols

  DESCRIPTION OF SYMBOLS S ... Space, 10 ... Semiconductor module, 11 ... Base part, 12 ... Electronic component, 13, 14 ... External connection terminal, 15 ... Support part, 20 ... Housing, 21 ... Main body, 23 ... Cover, 24 ... Resin.

Claims (5)

A semiconductor module having a plate-like external connection terminal whose one end is electrically connected to an electronic component,
The plate-like external connection terminal passes through a resin support portion provided above the base portion on which the electronic component is disposed, and a portion above the support portion extends along the upper surface of the support portion. And a semiconductor module that is formed in a shape that is bent toward the base portion.   2. The semiconductor module according to claim 1, wherein the support portion is provided so as to be erected from the base portion, and the external connection terminal is integrally formed with the support portion by insert molding.   The support portion constitutes a cover of a housing that accommodates the electronic component, and the external connection terminal is bent at a portion protruding through the support portion and protruding upward from the support portion. The semiconductor module according to claim 1, which is fixed with resin.   The semiconductor module according to claim 3, wherein the support portion is fixed to a main body of the housing.   5. The semiconductor according to claim 2, wherein the support portion is provided with a space on the side facing the base portion so as to avoid interference with a structure provided on the base portion side. module.

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