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WO2014031567A1 - Systèmes et procédés d'éclairage à led - Google Patents

Systèmes et procédés d'éclairage à led Download PDF

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Publication number
WO2014031567A1
WO2014031567A1 PCT/US2013/055658 US2013055658W WO2014031567A1 WO 2014031567 A1 WO2014031567 A1 WO 2014031567A1 US 2013055658 W US2013055658 W US 2013055658W WO 2014031567 A1 WO2014031567 A1 WO 2014031567A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit structure
led lighting
layered circuit
lighting system
flexible layered
Prior art date
Application number
PCT/US2013/055658
Other languages
English (en)
Inventor
Henry V. Holec
Wm. Todd Crandell
Original Assignee
Metrospec Technology, L.L.C.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/592,090 external-priority patent/US10334735B2/en
Application filed by Metrospec Technology, L.L.C. filed Critical Metrospec Technology, L.L.C.
Priority to EP13763341.8A priority Critical patent/EP2888517A1/fr
Publication of WO2014031567A1 publication Critical patent/WO2014031567A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to light emitting diode (LED) lighting system and methods.
  • Solid state lighting (SSL) circuits (or LED lighting systems) are predicted to achieve widespread adoption in commercial lighting applications. Solid state lighting is more efficient in converting electricity to light than incandescent, fluorescent, and compact fluorescent systems. As such solid state lighting stands to greatly increase the energy efficiency of many lighting applications including street lighting, sign lighting, residential lighting, commercial lighting, etc.
  • Embodiments of the invention include LED lighting systems and methods.
  • an LED lighting system is included.
  • the LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer.
  • the LED lighting system can further include a housing substrate and a mounting structure.
  • the mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate.
  • the distance between the layered circuit structure and the support layer can be at least about 0.5 mm.
  • the flexible layered circuit structure is attached to the mounting structure in a releasable manner. In some embodiments, the flexible layered circuit structure is releasable from the mounting structure without the use of tools. In some embodiments, the flexible layered circuit structure is configured for replacement.
  • an LED lighting system can include a flexible layered circuit structure can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, a plurality of light emitting diodes mounted on the bottom layer, a housing substrate, and a mounting structure.
  • the mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate, wherein the distance between the layered circuit structure and the support layer is at least about 0.5 mm.
  • a method for making an LED lighting system can include obtaining a flexible layered circuit structure that can include, a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer.
  • the method can further include suspending the flexible layered circuit structure above a housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate, wherein the distance between the layered circuit structure and the housing substrate is at least about 0.5 mm, and connecting the flexible layered circuit structure to a power source.
  • a method for operating an LED lighting system can include providing electrical current to an LED lighting circuit, the LED lighting circuit including a plurality of light emitting diodes, the LED lighting circuit disposed upon a flexible layered circuit structure can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and dissipating heat from the light emitting diodes to ambient air through the top surface of the top thermally conductive layer and the bottom surface of the bottom thermally conductive layer.
  • an LED lighting system can include a flexible layered circuit structure can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, a plurality of light emitting diodes mounted on the top layer, the flexible layered circuit structure formed into a loop.
  • the loop can be disposed within a housing.
  • the loop can be separated from the housing by an air gap.
  • the loop can be disposed sideways to the support structure.
  • FIG. 1 A is a cross sectional schematic view of a flexible layered circuit structure in accordance with various embodiments herein.
  • FIG. IB is a cross sectional schematic view of a flexible layered circuit structure in accordance with various embodiments herein.
  • FIG. 1C is a cross sectional schematic view of a flexible layered circuit structure in accordance with various embodiments herein.
  • FIG. ID is a cross sectional schematic view of a flexible layered circuit structure in accordance with various embodiments herein.
  • FIG. 2 is a schematic side view of a flexible layered circuit structure in accordance with various embodiments herein.
  • FIG. 3 is a schematic top view of a flexible layered circuit structure in accordance with various embodiments herein.
  • FIG. 4 is a schematic side view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 5 is a schematic side view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 6 is a schematic side view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 7 is a schematic side view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 8 is a schematic cut away top view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 9 is a schematic view of a portion of a mounting structure in accordance with various embodiments herein.
  • FIG. 10 is a schematic view of a portion of a mounting structure interfaced with a flexible layered circuit structure in accordance with various embodiments herein.
  • FIG. 11 is a schematic side view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 12 is a schematic side view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 13 is a schematic side view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 14 is a schematic side view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 15 is a schematic cross sectional view of a flexible layered circuit structure in accordance with various embodiments herein.
  • FIG. 16 is a schematic cross sectional view of a flexible layered circuit structure in accordance with various embodiments herein.
  • FIG. 17 is a schematic side view of an LED lighting system in accordance with various embodiments herein.
  • FIG. 18 is a flowchart of a method of making an LED lighting system in accordance with various embodiments herein.
  • Solid state lighting stands to greatly increase the energy efficiency of many lighting applications including street lighting, sign lighting, residential lighting, commercial lighting, etc.
  • one design challenge associated with LED lighting systems is the dissipation of heat.
  • LED lighting systems that can provide sufficient heat dissipation without the need for directly mounting the LED carrying circuit onto a large heat sink or any substantial secondary heat sinks. Such embodiments can successfully maintain the junction temperature of the LEDs below the critical temperature.
  • the flexible layered circuit structure can include a top thermally conductive layer 102, a middle electrically insulating layer 104, and a bottom thermally conductive layer 106.
  • the top, middle, and bottom layers combined have a thermal resistance of less than 10 degrees Celsius per Watt.
  • a plurality of light emitting diodes 108 can be mounted on the top thermally conductive layer 102.
  • one or more of the LEDs can be energized and emit visible light.
  • a commercially available FR4 material can be used as a starting material and is modified to create the layered circuit structure.
  • the FR4 material preferably includes a layer of fiberglass sandwiched between two layers of copper.
  • An example of a suitable FR4 material is FR406 manufactured by Isola Group of Chandler, Arizona.
  • the top layer can include one of the two layers of copper
  • the intermediate layer can include a layer of fiberglass
  • the bottom layer can include the other of the two layers of copper. It is recognized that other suitable FR4 materials could be used and that these layers could be either manufactured or purchased in this form.
  • the top layer can be copper approximately 0.5 to 4.0 ounces per square foot and approximately 0.0007 to 0.0056 inch thick, 0.25 to 48.00 inches wide, and 0.50 to 48.00 inches long. Although copper is a preferred material, it is recognized that other suitable electrically conductive materials such as but not limited to aluminum could be used.
  • the top, copper layer can be modified to include a thermally conductive printed or etched electrical circuit using standard electrical circuit design tools and techniques well known in the art and can then be coated with a protective coating using standard solder masking and labeling techniques.
  • An example of a suitable protective coating that could be used is TechniMask ISR 1000 manufactured by Technic, Inc. of Cranston, Rhode Island.
  • the top layer can be designed in such a way as to provide receptacles and mounting surfaces for LEDs and other SMT electrical components proximate the top surface.
  • the intermediate layer can be an electrically insulating thermally conductive layer, in some embodiments made of fiberglass approximately 0.005 to 0.020 inch thick, 0.25 to 48.00 inches wide, and 0.50 to 48.00 inches long.
  • the fiberglass has a breakdown voltage of greater than 5 kilovolts (kV), a tensile strength of 55 kips per square inch (ksi), and a flexural strength of 91 kips per square inch (ksi).
  • the thermal conductivity of the fiberglass can be 0.3 to 0.4 Watts per meter per degrees Kelvin (W/mK).
  • W/mK Watts per meter per degrees Kelvin
  • fiberglass is a preferred material, it is recognized that other suitable materials such as but not limited to polymer or ceramic blended dielectrics may be used.
  • the bottom layer can be copper approximately 0.5 to 4.0 ounces per square foot and can be approximately 0.0007 to 0.0056 inch thick, 0.25 to 48.00 inches wide, and 0.50 to 48.00 inches long.
  • copper is a preferred material, it is recognized that other suitable electrically conductive materials such as but not limited to aluminum could be used.
  • the bottom, copper layer can be modified into a heat spreading copper circuit laterally and along its longitudinal axis proximate the bottom surface in order to rapidly spread the heat through the bottom layer. In some embodiments, the exposed copper proximate the bottom surface of the bottom layer can then be tinned.
  • the bottom layer can include thermally conductive printed circuits, which are printed or etched using solder mask printing, photo etching, and solder masking techniques well known in the art for producing electrical circuits.
  • the bottom layer can include solid coverage of thermally conductive material (such as copper) across an area equal to a majority of the surface area with no direct electrical connection to the top layer.
  • the flexible layered circuit structure can be at least semi-flexible in some embodiments, not rigid.
  • the flexible layered circuit structure can be any desired length, which could be as long as 250 feet or more.
  • the strip can bend (for example along the lengthwise axis in a direction from the top of the flexible layered circuit structure to the bottom of the flexible layered circuit structure, or bottom to top) sufficiently to achieve a radius of curvature of 6 inches. In some embodiments, the strip can bend sufficiently to achieve a radius of curvature of 1 inch.
  • the flexible layered circuit structure can be wrapped about the hub of a reel for storage until use.
  • the flexible layered circuit structure can also twist relative to its longitudinal axis up to 10 degrees per inch.
  • light emitting diodes can be mounted on the bottom layer of the flexible layered circuit structure.
  • FIG. IB a cross sectional schematic view is shown of a flexible layered circuit structure 110 in accordance with various embodiments herein.
  • the fiexible layered circuit structure 110 can include a top thermally conductive layer 102, a middle electrically insulating layer 104, and a bottom thermally conductive layer 106.
  • a plurality of light emitting diodes 108 can be mounted on the bottom thermally conductive layer 106.
  • light emitting diodes can be mounted on both the top and the bottom layers of the flexible layered circuit structure.
  • FIG. 1C a cross sectional schematic view is shown of a fiexible layered circuit structure 120 in accordance with various embodiments herein.
  • the flexible layered circuit structure 120 can include a top thermally conductive layer 102, a middle electrically insulating layer 104, and a bottom thermally conductive layer 106.
  • a plurality of light emitting diodes 108 can be mounted on the top thermally conductive layer 102 and the bottom thermally conductive layer 106.
  • the fiexible layered circuit structure 130 can include a top thermally conductive layer 102, a middle electrically insulating layer 104, and a bottom thermally conductive layer 106.
  • a plurality of light emitting diodes 108 can be mounted on the top thermally conductive layer 102 and the bottom thermally conductive layer 106, but offset such that the positions of the light emitting diodes 108 on the top do not match with the positions of the light emitting diodes 108 on the bottom.
  • fiexible layered circuit structures as used in various embodiments herein can be either be unitary segments or can be formed of multiple segments that are bonded to on another at joints.
  • FIG. 2 a schematic side view is shown of a fiexible layered circuit structure 200 in accordance with various embodiments herein.
  • the fiexible layered circuit structure is formed of a first segment 202, a second segment 204, and a third segment 206.
  • the first segment 202 is bonded to the second segment 204 at a first overlapping joint 208.
  • the first overlapping joint 208 can provide electrical communication between the circuitry on the first segment 202 and the circuitry on the second segment 204.
  • the second segment 204 is bonded to the third segment 206 at a second overlapping joint 210.
  • the second overlapping joint 210 can provide electrical communication between the circuitry on the second segment 204 and the circuitry on the third segment 206. Connections between segments can continue in this manner such that the overall length of the fiexible layered circuit structure can be as long as it desired.
  • the fiexible layered circuit structure includes a top thermally conductive layer 302.
  • a plurality of light emitting diodes 308 are mounted on the top thermally conductive layer 302.
  • a variety of circuitry and/or components 330 can be etched into or mounted on the top thermally conductive layer 302.
  • the circuitry and components 330 can include various items including, but not limited to, resistors, capacitors, traces, linear drivers, and the like.
  • An example of a suitable LED is NS3W083A manufactured by Nichia Corporation of Detroit, Mich.
  • An example of a suitable liner driver is NUD4001 manufactured by ON Semiconductor of Phoenix, Ariz.
  • the light emitting diodes mounted on the top layer have a power of between 0.25 and 3 watts per inch squared of the surface area of the bottom layer.
  • a mounting structure can be used to suspend the flexible layered circuit structure above a housing substrate. It will be appreciated that the mounting structure can take on many different forms.
  • FIG. 4 a schematic side view is shown of an LED lighting system 400 in accordance with various embodiments herein.
  • the LED lighting system 400 can include a flexible layered circuit structure 402 and electrical leads 414 to provide electrical current to the flexible layered circuit structure 402.
  • the flexible layered circuit structure 402 can be suspended above a housing substrate 408, such that there is an air gap 410 disposed in between the bottom thermally conductive layer of the flexible layered circuit structure 402 and the housing substrate 408.
  • the air gap 410 is present under at least about 80% of the surface area of the bottom of the flexible layered circuit structure 402.
  • a mounting structure can be used to suspend the flexible layered circuit structure.
  • the mounting structure can include one or more posts 406 or standoffs.
  • the posts 406 can serve to hold the flexible layered circuit structure 402 in place.
  • the posts can be configured to exert tension on the flexible layered circuit structure in the direction of the lengthwise axis of the flexible layered circuit structure such that it is maintained taut.
  • the air gap 410 can be of various sizes. In some embodiments, the air gap can be at least about 0.5 mm. In some embodiments, the air gap can be from between 0.5 mm and 100 mm. In some embodiments, the air gap can be from between 1 mm and 50 mm. In some embodiments, the air gap can be from between 2 mm and 25 mm. In some embodiments, the air gap can be between about 40% and 60% of the width of the flexible layered circuit structure. The air gap can serve to promote heat dissipation off of the bottom layer of the flexible layered circuit structure.
  • the LED lighting system can be configured so as to have thermal transfer properties sufficient to allow the system to maintain a thermal equilibrium at or below the critical junction temperatures for the LEDs without the need for the addition of secondary heat sinking.
  • the critical junction temperatures can vary based on the specific LED model and manufacturer. However, critical junction temperatures can range from 100 degrees Celsius or less for some LED models to 150 degrees Celsius or more for others. In some
  • the junction temperature can be kept below 150 degrees Celsius. In some embodiments, the junction temperature can be kept below 140 degrees Celsius. In some embodiments, the junction temperature can be kept below 130 degrees Celsius. In some embodiments, the junction temperature can be kept below 120 degrees Celsius. .In some embodiments, the junction temperature can be kept below 110 degrees Celsius. In some embodiments, the junction temperature can be kept below 100 degrees Celsius. In some embodiments, the junction temperature can be kept below 90 degrees Celsius.
  • the mounting structure can include many different specific structural elements.
  • the mounting structure can include a fastener, a hook, a pin, a clip, a spring clip, a tab and/or tab receptacle.
  • the mounting structure can be directly or indirectly attached to the housing substrate.
  • the flexible layered circuit structure can be attached to the mounting structure in a releasable manner.
  • the flexible layered circuit structure can be releasable form the mounting structure in such a way that specialized tools are not required and thus the flexible layered circuit structure can be released from the mounting structure by hand. In this manner, the flexible layered circuit structure can be configured for replacement.
  • the mounting structure can be used to align the flexible layered circuit structure with secondary optics or a diffuser.
  • the housing substrate can include many different materials.
  • the housing substrate can include organic or inorganic structural materials.
  • the housing substrate can be a material including, but not limited to, metals, polymers, cellulosic materials, composites, glass, stone and the like.
  • the housing substrate can be opaque, transparent, or semi-transparent.
  • the mounting structure can be attached to the flexible layered circuit structure in many different ways. For example, in the context of posts, the posts can attach to the bottom, side, or ends of the flexible layered circuit structure.
  • the flexible layered circuit structure can include structural features so as to facilitate connection with the mounting structure.
  • the flexible layered circuit structure can define notches or apertures in order to facilitate connection with the mounting structure.
  • FIG. 5 a schematic top view is shown of a portion of an LED lighting system in accordance with various embodiments herein.
  • the flexible layered circuit structure includes a top thermally conductive layer 502.
  • a plurality of light emitting diodes 508 are mounted on the top thermally conductive layer 502.
  • a variety of circuitry 530 can be etched into or disposed on the top thermally conductive layer 502.
  • a plurality of apertures 532 are formed in the flexible layered circuit structure. These apertures 532 can be configured to engage a mounting structure, or a portion thereof.
  • FIG. 6 a schematic side view is shown of an LED lighting system 600 in accordance with various embodiments herein.
  • the flexible layered circuit structure 602 carrying the light emitting diodes 608 is oriented on its side (or lateral side or lateral edge) relative to posts 606, which can serve as a mounting structure to maintain an air gap in between the flexible layered circuit structure 602 and the housing substrate 610.
  • the mounting structure can engage a lateral side of the flexible layered circuit structure.
  • FIG. 7 a schematic side view is shown of an LED lighting system 700 in accordance with various embodiments herein.
  • the flexible layered circuit structure 702 is suspended above the housing substrate through mounting structure elements 706.
  • the ends of the flexible layered circuit structure interface with the mounting structure elements 706, however, it will be appreciated that other portions of the flexible layered circuit structure 702 can interface with the mounting structure elements 706.
  • FIG. 8 a schematic cut away top view is shown of an LED lighting system 700 in accordance with various embodiments herein.
  • the flexible layered circuit structure 702 can define notches 703 near the ends of the flexible layered circuit structure 702.
  • the mounting structure elements 706 can include an engagement member 710 that passes into the notches 703 in order to grip the flexible layered circuit structure 702.
  • the mounting structure elements 706 can also include a tensioner 712.
  • the tensioner 712 can provide spring force in order to apply tension to the flexible layered circuit structure in order to make it taut.
  • the tensioner 712 can be configured to maintain a tension force of at least about one ounce (0.28 N).
  • the tensioner 712 can be configured to maintain a tension force on the flexible layered circuit structure despite thermal expansion of the flexible layered circuit structure.
  • the tensioner can be configured to maintain a tension force of at least one ounce (0.28 N) despite thermal expansion of the flexible layered circuit structure of up to 1 millimeter per meter in length of the flexible layered circuit structure.
  • the tensioner 712 can include a spring.
  • the mounting structure is used to take up variable length or mechanical tolerances in the construction of the flexible layered circuit structure.
  • FIG. 9 a schematic view of a portion of a mounting structure 800 is shown in accordance with various embodiments herein.
  • the mounting structure 800 can include tabs 824 (or projections).
  • the mounting structure 800 can include a body portion 822 and an aperture 828 to facilitate mounting to another component such as a housing substrate.
  • FIG. 10 a schematic view of a portion of a mounting structure 800 interfaced with a flexible layered circuit structure 802 is shown in accordance with various embodiments herein. In this view, it can be seen that the tabs 824 fit within the notches 830 in the flexible layered circuit structure to support it and hold it in place.
  • the body portion 822 can be capable of being flexed to generate a spring force that can be exerted on the flexible layered circuit structure 802.
  • the mounting structure for a single end of the flexible layered circuit structure can be formed of a single piece of material, such as a metal or a polymer.
  • the mounting structure can include multiple pieces of material.
  • the LED lighting system 900 can include a flexible layered circuit structure 902.
  • the flexible layered circuit structure 902 can be suspended above a housing substrate 910, such that there is an air gap 914 disposed in between the bottom thermally conductive layer of the flexible layered circuit structure 902 and the housing substrate 910.
  • a mounting structure can be used to suspend the flexible layered circuit structure.
  • the mounting structure can include one or more blocks 906. The blocks 906 can serve to hold the flexible layered circuit structure 902 in place.
  • the posts can be configured to exert tension on the flexible layered circuit structure in the direction of the lengthwise axis of the flexible layered circuit structure such that it is maintained taut (e.g., the tension is exerted in a direction away from the middle of the flexible layered circuit structure).
  • a tensioner 912 can be disposed between the block 906 and the flexible layered circuit structure 902.
  • the tensioner 912 can include a spring-loaded connection point (such as a hook or tab receptacle) to exert tension on the flexible layered circuit structure 902.
  • the tensioner 912 can be configured to move with respect to the block 906 in order to apply tension to the flexible layered circuit structure 902.
  • the block 906 can move within a channel formed in the block 906.
  • the LED lighting system 1000 can include a flexible layered circuit structure 1002.
  • Light emitting diodes 1008 can be mounted on the flexible layered circuit structure 1002.
  • the flexible layered circuit structure 1002 can be suspended inside a cavity defined by a housing substrate 1010. There can be an air gap 1016 disposed in between the flexible layered circuit structure 1002 and the housing substrate 1010. Leads 1014 can be arranged to provide electrical current to the flexible layered circuit structure 1002.
  • the LED lighting system 1100 can include a flexible layered circuit structure 1102.
  • Light emitting diodes 1108 can be mounted on the flexible layered circuit structure 1102.
  • the flexible layered circuit structure 1102 can assume a U shape such that the first end 1118 and the second end 1120 are disposed adjacent to one another.
  • the flexible layered circuit structure 1102 can be suspended inside a cavity defined by a housing substrate 1110. There can be an air gap 1116 disposed in between the flexible layered circuit structure 1102 and the housing substrate 1110.
  • Leads 1114 can be arranged to provide electrical current to the flexible layered circuit structure 1102.
  • the LED lighting system 1200 can include a flexible layered circuit structure 1202 and electrical leads to provide electrical current to the flexible layered circuit structure 1202.
  • Material can be disposed over the top of flexible layered circuit structure 1202 (and thus over the top of LEDs in various embodiments) such as optics 1210, secondary optics, or a diffuser.
  • the flexible layered circuit structure 1202 can be suspended above a housing substrate 1208, such that there is an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure 1202 and the housing substrate 1208.
  • a mounting structure can be used to suspend the flexible layered circuit structure.
  • the mounting structure can include one or more posts 1206 or standoffs.
  • the flexible layered circuit structure can include a top thermally conductive layer 1302, a middle electrically insulating layer 1304, and a bottom thermally conductive layer 1306.
  • a plurality of light emitting diodes 1308 can be mounted on the top thermally conductive layer 1302.
  • a coating 1310 can be disposed on the bottom thermally conductive layer 1306, the coating 1310 comprising a material with properties that enhance heat transfer.
  • the coating can be a thermally conductive and emissive material.
  • the coating can be a material such as tinning.
  • additional structural features can be disposed on the bottom layer in order to assist in heat dissipation.
  • structural features including, but not limited to, heat slugs, cooling fins, heat conductive projections, and the like can be mounted on the bottom surface of the bottom layer in order to aid in heat dissipation.
  • the flexible layered circuit structure can be altered in order to enhance heat transfer.
  • FIG. 16 a schematic cross sectional view is shown of a flexible layered circuit structure 1400 in accordance with various embodiments herein in accordance with various embodiments herein.
  • the flexible layered circuit structure can include a top thermally conductive layer 1402, a middle electrically insulating layer 1404, and a bottom thermally conductive layer 1406.
  • a plurality of light emitting diodes 1408 can be mounted on the top thermally conductive layer 1402.
  • the bottom surface 1420 of the bottom thermally conductive layer 1406 can have a surface topology that is different than a standard fiat surface.
  • the surface can have numerous peaks and valleys (or be textured) in order to increase the surface area.
  • the textured surface can have a surface area at least 10 percent greater than an equally sized substantially fiat surface. In some embodiments, the textured surface can have a surface area at least 20 percent greater than an equally sized substantially fiat surface. In some embodiments, the textured surface can have a surface area at least 30 percent greater than an equally sized substantially flat surface. In some embodiments, the textured surface can have a surface area at least 40 percent greater than an equally sized substantially fiat surface. In some embodiments, the textured surface can have a surface area at least 80 percent greater than an equally sized substantially fiat surface. In some embodiments, the textured surface can have a surface area at least 100 percent greater than an equally sized substantially fiat surface.
  • the LED lighting system 1500 can include a flexible layered circuit structure 1502 and electrical leads to provide electrical current to the flexible layered circuit structure 1502.
  • the flexible layered circuit structure 1502 can be suspended above a housing substrate 1508, such that there is an air gap 1510.
  • the top surface 1524 of the housing substrate 1508 can be coated with a layer of material 1522 to enhance heat flow across the air gap 1510.
  • a fan can be included to enhance heat dissipation by causing movement of air over surfaces of the flexible layered circuit structure.
  • the method for making an LED lighting system can include obtaining a flexible layered circuit structure that can include, a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer.
  • the method can further include suspending the flexible layered circuit structure above a housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate, wherein the distance between the layered circuit structure and the housing substrate is at least about 0.5 mm, and connecting the flexible layered circuit structure to a power source.
  • suspending includes attaching the flexible layered circuit structure to a mounting structure.
  • the mounting structure provides the connection to the power source.
  • the method can further include cutting the flexible layered circuit structure to a desired length.
  • the method can include unwinding the flexible layered circuit structure from a storage reel prior to cutting.
  • suspending can include attaching the flexible layered circuit structure to a mounting structure that provides a tension force along the length of the flexible layered circuit structure.
  • the method can further include applying a tension force of at least one ounce (0.28 N) to the flexible layered circuit structure.
  • the method can further include removing the flexible layered circuit structure from the position suspended above a housing substrate.
  • the action of removing the flexible layered circuit structure can be accomplished without tools.
  • the method can further include replacing the flexible layered circuit structure with another flexible layered circuit structure.
  • the method can include an operation of obtaining a flexible layered circuit structure 1602.
  • the method can further include an operation of cutting the flexible layered circuit structure to a desired length 1604. In various embodiments, the method can further include an operation of suspending the flexible layered circuit structure above a housing substrate 1606. In some embodiments, the method can further include an operation of connecting the flexible layered circuit structure to a power source 1608. Optionally, in some embodiments, the method can include a step of replacing the flexible layered circuit structure with another flexible layered circuit structure 1610. In various embodiments the flexible layer circuit structure can be removed, and optionally replaced, without the use of tools (for example without the need to remove soldering from elements of the system). In some embodiments, a method for operating an LED lighting system is included.
  • the method for operating an LED lighting system can include providing electrical current to an LED lighting circuit, the LED lighting circuit including a plurality of light emitting diodes, the LED lighting circuit disposed upon a flexible layered circuit structure can include a top thermally conductive layer, a middle electrically insulating layer, and a bottom thermally conductive layer.
  • the method can further include dissipating heat from the light emitting diodes to ambient air through the top surface of the top thermally conductive layer and the bottom surface of the bottom thermally conductive layer.
  • the phrase “configured” describes a system, apparatus, or other structure that is constructed or configured to perform a particular task or adopt a particular configuration to.
  • the phrase “configured” can be used interchangeably with other similar phrases such as arranged and configured, constructed and arranged, constructed, manufactured and arranged, and the like.
  • an LED lighting system can include a flexible layered circuit structure including a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer.
  • the system can further include a housing substrate and a mounting structure.
  • the mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate.
  • the distance between the layered circuit structure and the support layer can be at least about 0.5 mm.
  • the system can further include a plurality of light emitting diodes mounted on the bottom layer.
  • the system can further include an optically translucent material layer disposed over the top thermally conductive layer.
  • the distance between the layered circuit structure and the support layer can be between about 0.5 mm and 100 mm.
  • the distance between the layered circuit structure and the support layer can be between about 40% and 60% of the width of the flexible layered circuit structure.
  • the mounting structure can include a tensioner to apply tension to the flexible layered circuit structure.
  • the tensioner can provide a spring force applied to the flexible layered circuit structure.
  • the tensioner can include a spring.
  • the tensioner can be configured to maintain a tension force of at least one ounce (0.28 N).
  • the tensioner can be configured to maintain a tension force of at least one ounce (0.28 N) despite thermal expansion of the flexible layered circuit structure of up to 1 millimeter per meter in length of the flexible circuit structure.
  • the mounting structure can include a fastener.
  • the mounting structure can include a hook.
  • the mounting structure can include a pin.
  • the mounting structure can include a clip.
  • the mounting structure can include a spring clip.
  • the mounting structure can include a tab or tab receptacle.
  • the mounting structure can be direct or indirectly attached to the housing substrate.
  • the flexible layered circuit structure can include a first end and a second end, wherein the mounting structure engages the first end and the second end.
  • the flexible layered circuit structure can be in a U shape such that the first end and the second end are disposed adjacent to one another.
  • the flexible layered circuit structure can have a first lateral side and a second lateral side, wherein the mounting structure can engage at least one of the first lateral side and the second lateral side.
  • the housing substrate can include a material that can be selected from the group consisting of organic and inorganic structural materials.
  • the housing substrate can include a material that can be selected from the group consisting of a polymer, a cellulosic material, a composite, a glass, and stone.
  • the housing substrate can include a metal.
  • the light emitting diodes mounted on the top layer can have a power of between 0.25 and 3 watts per inch squared of the surface area of the bottom layer.
  • the flexible circuit structure can have sufficient flexibility to achieve bending with a radius of curvature of at least 1 inch.
  • the flexible layered circuit structure can define apertures, the mounting structure can be configured to engage the apertures to support the flexible layered circuit structure.
  • the bottom thermally conductive layer can include a textured surface having a surface area greater than an equally sized substantially flat surface.
  • the bottom thermally conductive layer can include a plurality of heat sink fins mounted thereon.
  • the bottom thermally conductive layer can include a textured surface having a surface area at least 20 percent greater than an equally sized substantially flat surface.
  • the system can further include a coating over the bottom thermally conductive layer, the coating can include a material with properties that enhance heat transfer.
  • the coating can include tinning.
  • the bottom layer can be covered with a thermally conductive and emissive material.
  • the housing substrate can be coated with a material to enhance heat flow across the air gap.
  • the top layer can include 0.5 to 4.0 ounces per square foot of copper
  • the intermediate layer can include fiberglass 0.005 to 0.020 inches thick
  • the bottom layer can include 0.5 to 4.0 ounces per square foot of copper.
  • the top, intermediate, and bottom layers, together, can have a thermal resistance of less than 10 degrees Celsius per Watt.
  • the system can be configured to have thermal transfer properties sufficient to allow the system to maintain a thermal equilibrium at or below the critical junction
  • the flexible layered circuit structure is attached to the mounting structure in a releasable manner.
  • the flexible layered circuit structure can be releasable from the mounting structure without the use of tools.
  • the flexible layered circuit structure can be configured for replacement.
  • an LED lighting system is included.
  • the LED lighting system can include a flexible layered circuit structure including a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, a plurality of light emitting diodes mounted on the bottom layer, a housing substrate, and a mounting structure.
  • the mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate, wherein the distance between the layered circuit structure and the support layer is at least about 0.5 mm.
  • a method for making an LED lighting system is included.
  • the method for making an LED lighting system can include obtaining a flexible layered circuit structure that includes, a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer.
  • the method can also include suspending the flexible layered circuit structure above a housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate, wherein the distance between the layered circuit structure and the housing substrate is at least about 0.5 mm, and connecting the flexible layered circuit structure to a power source.
  • Suspending can include attaching the flexible layered circuit structure to a mounting structure.
  • the mounting structure can provide the connection to the power source.
  • the method can further include cutting the flexible layered circuit structure to a desired length.
  • the method can further include unwinding the flexible layered circuit structure from a storage reel prior to cutting.
  • Suspending can include attaching the flexible layered circuit structure to a mounting structure that provides a tension force along the length of the flexible layered circuit structure.
  • the method can further include applying a tension force of at least one ounce (0.28 N) to the flexible layered circuit structure.
  • the method can further include removing the flexible layered circuit structure from the position suspended above a housing substrate. The step of removing can be accomplished without tools.
  • the method can further include replacing the flexible layered circuit structure with another flexible layered circuit structure.
  • a method for operating an LED lighting system can include providing electrical current to an LED lighting circuit, the LED lighting circuit including a plurality of light emitting diodes, the LED lighting circuit disposed upon a flexible layered circuit structure.
  • the flexible layered circuit structure can include a top thermally conductive layer, a middle electrically insulating layer, and a bottom thermally conductive layer.
  • the method can further include dissipating heat from the light emitting diodes to ambient air through the top surface of the top thermally conductive layer and the bottom surface of the bottom thermally conductive layer.
  • an LED lighting system can include a flexible layered circuit structure including a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer.
  • the flexible layered circuit structure can be formed into a loop.
  • the loop can be disposed within a housing.
  • the loop can be separated from the housing by an air gap.
  • the loop can be disposed sideways to the support structure.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

Selon certains modes de réalisation, l'invention concerne des systèmes et des procédés d'éclairage à LED. Un système d'éclairage à LED est par exemple inclus dans certains modes de réalisation. Le système d'éclairage à LED peut comprendre une structure de circuit flexible en couches qui peut comprendre une couche supérieure thermoconductrice, une couche intermédiaire électriquement isolante, une couche inférieure thermoconductrice, et une pluralité de diodes électroluminescentes montées sur la couche supérieure. Le système d'éclairage à LED peut comprendre par ailleurs un substrat de logement et une structure de montage. La structure de montage peut être configurée pour que la structure de circuit en couches soit suspendue au-dessus du substrat de logement, un intervalle d'air étant ménagé entre la couche inférieure thermoconductrice de la structure de circuit flexible en couches et le substrat de logement. La distance entre la structure de circuit en couches et la couche de support peut être d'au moins environ 0,5 mm. L'invention concerne également d'autres modes de réalisation.
PCT/US2013/055658 2012-08-22 2013-08-20 Systèmes et procédés d'éclairage à led WO2014031567A1 (fr)

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EP13763341.8A EP2888517A1 (fr) 2012-08-22 2013-08-20 Systèmes et procédés d'éclairage à led

Applications Claiming Priority (2)

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US13/592,090 US10334735B2 (en) 2008-02-14 2012-08-22 LED lighting systems and methods
US13/592,090 2012-08-22

Publications (1)

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WO2014031567A1 true WO2014031567A1 (fr) 2014-02-27

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US9736946B2 (en) 2008-02-14 2017-08-15 Metrospec Technology, L.L.C. Flexible circuit board interconnection and methods
US10334735B2 (en) 2008-02-14 2019-06-25 Metrospec Technology, L.L.C. LED lighting systems and methods
US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof
US11266014B2 (en) 2008-02-14 2022-03-01 Metrospec Technology, L.L.C. LED lighting systems and method

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US10849200B2 (en) 2018-09-28 2020-11-24 Metrospec Technology, L.L.C. Solid state lighting circuit with current bias and method of controlling thereof

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