WO2013120754A3 - Schallwandleranordnung - Google Patents
Schallwandleranordnung Download PDFInfo
- Publication number
- WO2013120754A3 WO2013120754A3 PCT/EP2013/052392 EP2013052392W WO2013120754A3 WO 2013120754 A3 WO2013120754 A3 WO 2013120754A3 EP 2013052392 W EP2013052392 W EP 2013052392W WO 2013120754 A3 WO2013120754 A3 WO 2013120754A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode structure
- sound transducer
- electret material
- electrode
- transducer arrangement
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
- B06B1/0692—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF with a continuous electrode on one side and a plurality of electrodes on the other side
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Abstract
Erfindungsgemäß wird eine Schallwandleranordnung vorgeschlagen, umfassend ein piezoelektrisch aktives Elektretmaterial zwischen einer ersten und einer zweiten Elektrodenstruktur. Auf der ersten Elektrodenstruktur ist das Elektretmaterial aufgebracht, insbesondere so, dass die erste Elektrodenstruktur vollständig mit dem Elektretmaterial bedeckt ist. Auf oder oberhalb des Elektretmaterials ist die zweite Elektrodenstruktur angeordnet, so dass sich das Elektretmaterial zwischen der ersten und der zweiten Elektrodenstruktur befindet. Die erste Elektrodenstruktur ist aus mehreren, unabhängig voneinander adressierbaren Elektrodenelementen ausgebildet. Die Elektrodenelemente definieren damit die einzelnen Schallwandlerelemente, die zusammen eine Schallwandleranordnung, auch als Array bezeichnet, bilden. Dabei ist die erste Elektrodenstruktur erfindungsgemäß auf einer Oberfläche eines mehrlagigen Schaltungsträgers ausgebildet.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/379,071 US20150108873A1 (en) | 2012-02-16 | 2013-02-07 | Sound Transducer Arrangement |
CN201380009363.5A CN104114288A (zh) | 2012-02-16 | 2013-02-07 | 声变换器装置 |
EP13704578.7A EP2814620A2 (de) | 2012-02-16 | 2013-02-07 | Schallwandleranordnung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201210202422 DE102012202422A1 (de) | 2012-02-16 | 2012-02-16 | Schallwandleranordnung |
DE102012202422.0 | 2012-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2013120754A2 WO2013120754A2 (de) | 2013-08-22 |
WO2013120754A3 true WO2013120754A3 (de) | 2014-03-20 |
Family
ID=47720491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2013/052392 WO2013120754A2 (de) | 2012-02-16 | 2013-02-07 | Schallwandleranordnung |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150108873A1 (de) |
EP (1) | EP2814620A2 (de) |
CN (1) | CN104114288A (de) |
DE (1) | DE102012202422A1 (de) |
WO (1) | WO2013120754A2 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105629559A (zh) * | 2016-01-12 | 2016-06-01 | 武汉华星光电技术有限公司 | 彩膜基板的制作方法 |
DE202016100416U1 (de) * | 2016-01-28 | 2016-10-31 | Bundesrepublik Deutschland, Vertreten Durch Den Bundesminister Für Wirtschaft Und Energie, Dieser Vertreten Durch Den Präsidenten Der Bundesanstalt Für Materialforschung Und -Prüfung (Bam) | Luftultraschallwandler zur direkt aktiv fokussierenden Luft-Ultraschallwandlung |
DE102016204031A1 (de) | 2016-03-11 | 2017-09-14 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Elektretanordnung |
DE102016216365A1 (de) * | 2016-08-31 | 2018-03-01 | Robert Bosch Gmbh | Wandlereinrichtung |
JP6490255B1 (ja) * | 2018-01-16 | 2019-03-27 | 三菱電機株式会社 | 車載電子装置 |
DE102021104697A1 (de) | 2021-02-26 | 2022-09-01 | Tdk Electronics Ag | Ultraschallwandler |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5931684A (en) * | 1997-09-19 | 1999-08-03 | Hewlett-Packard Company | Compact electrical connections for ultrasonic transducers |
US20020080684A1 (en) * | 2000-11-16 | 2002-06-27 | Dimitri Donskoy | Large aperture vibration and acoustic sensor |
US20020089834A1 (en) * | 2001-01-10 | 2002-07-11 | Gordon James H. | Reduced crosstalk ultrasonic piezo film array on a printed circuit board |
US20040261251A1 (en) * | 2001-10-23 | 2004-12-30 | Schindel David W | Ultrasonic printed circuit board transducer |
WO2008135004A1 (de) * | 2007-05-04 | 2008-11-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Ultraschallwandler-array für anwendungen in gasförmigen medien |
US20110309716A1 (en) * | 2008-12-13 | 2011-12-22 | Werner Jenninger | Ferroelectret two-layer and multilayer composite and method for production thereof |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2397120A1 (fr) * | 1977-07-04 | 1979-02-02 | Lewiner Jacques | Perfectionnements aux transducteurs electromecaniques |
DE4139024C1 (de) * | 1991-11-27 | 1993-04-15 | Siemens Ag, 8000 Muenchen, De | |
US6894425B1 (en) * | 1999-03-31 | 2005-05-17 | Koninklijke Philips Electronics N.V. | Two-dimensional ultrasound phased array transducer |
JP2002223498A (ja) * | 2000-11-21 | 2002-08-09 | Matsushita Electric Ind Co Ltd | エレクトレットコンデンサマイクロホン |
US6537220B1 (en) * | 2001-08-31 | 2003-03-25 | Siemens Medical Solutions Usa, Inc. | Ultrasound imaging with acquisition of imaging data in perpendicular scan planes |
US20070222339A1 (en) * | 2004-04-20 | 2007-09-27 | Mark Lukacs | Arrayed ultrasonic transducer |
US7449821B2 (en) * | 2005-03-02 | 2008-11-11 | Research Triangle Institute | Piezoelectric micromachined ultrasonic transducer with air-backed cavities |
JP5161773B2 (ja) * | 2005-08-05 | 2013-03-13 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 曲がった二次元アレイ・トランスデューサ |
CN101022683B (zh) * | 2007-03-07 | 2011-04-27 | 山东共达电声股份有限公司 | 耐回流焊数字化驻极体传声器 |
US7892176B2 (en) * | 2007-05-02 | 2011-02-22 | General Electric Company | Monitoring or imaging system with interconnect structure for large area sensor array |
CN201345732Y (zh) * | 2009-01-10 | 2009-11-11 | 宁波鑫丰泰电器有限公司 | 电容式驻极体传声器 |
JP2011114414A (ja) * | 2009-11-24 | 2011-06-09 | Toshiba Corp | 超音波プローブ |
DE102010063555A1 (de) * | 2010-12-20 | 2012-06-21 | Robert Bosch Gmbh | Vorrichtung zum Senden und/oder Empfangen eines Ultraschallsignals |
-
2012
- 2012-02-16 DE DE201210202422 patent/DE102012202422A1/de not_active Withdrawn
-
2013
- 2013-02-07 WO PCT/EP2013/052392 patent/WO2013120754A2/de active Application Filing
- 2013-02-07 CN CN201380009363.5A patent/CN104114288A/zh active Pending
- 2013-02-07 EP EP13704578.7A patent/EP2814620A2/de not_active Withdrawn
- 2013-02-07 US US14/379,071 patent/US20150108873A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5931684A (en) * | 1997-09-19 | 1999-08-03 | Hewlett-Packard Company | Compact electrical connections for ultrasonic transducers |
US20020080684A1 (en) * | 2000-11-16 | 2002-06-27 | Dimitri Donskoy | Large aperture vibration and acoustic sensor |
US20020089834A1 (en) * | 2001-01-10 | 2002-07-11 | Gordon James H. | Reduced crosstalk ultrasonic piezo film array on a printed circuit board |
US20040261251A1 (en) * | 2001-10-23 | 2004-12-30 | Schindel David W | Ultrasonic printed circuit board transducer |
WO2008135004A1 (de) * | 2007-05-04 | 2008-11-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Ultraschallwandler-array für anwendungen in gasförmigen medien |
US20110309716A1 (en) * | 2008-12-13 | 2011-12-22 | Werner Jenninger | Ferroelectret two-layer and multilayer composite and method for production thereof |
Also Published As
Publication number | Publication date |
---|---|
WO2013120754A2 (de) | 2013-08-22 |
EP2814620A2 (de) | 2014-12-24 |
CN104114288A (zh) | 2014-10-22 |
US20150108873A1 (en) | 2015-04-23 |
DE102012202422A1 (de) | 2013-08-22 |
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