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WO2013108323A1 - 半導体装置製造方法および半導体装置 - Google Patents

半導体装置製造方法および半導体装置 Download PDF

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Publication number
WO2013108323A1
WO2013108323A1 PCT/JP2012/007352 JP2012007352W WO2013108323A1 WO 2013108323 A1 WO2013108323 A1 WO 2013108323A1 JP 2012007352 W JP2012007352 W JP 2012007352W WO 2013108323 A1 WO2013108323 A1 WO 2013108323A1
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WIPO (PCT)
Prior art keywords
solder
semiconductor chip
semiconductor
semiconductor device
semiconductor substrate
Prior art date
Application number
PCT/JP2012/007352
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English (en)
French (fr)
Inventor
大輔 櫻井
和也 後川
Original Assignee
パナソニック株式会社
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Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to CN201280059092.XA priority Critical patent/CN103959451B/zh
Priority to US14/360,228 priority patent/US9331042B2/en
Priority to JP2013554093A priority patent/JP5820991B2/ja
Priority to KR1020147014588A priority patent/KR101607790B1/ko
Publication of WO2013108323A1 publication Critical patent/WO2013108323A1/ja

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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
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    • H01L24/93—Batch processes
    • H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
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    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
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    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating
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    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/381—Pitch distance
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    • H01L2924/30—Technical effects
    • H01L2924/38—Effects and problems related to the device integration
    • H01L2924/384—Bump effects
    • H01L2924/3841—Solder bridging

Definitions

  • the present invention relates to a semiconductor device manufacturing method and a semiconductor device manufactured by the manufacturing method.
  • a semiconductor chip such as LSI is mounted face down on a mounting board.
  • bump electrodes such as solder bumps are formed on the electrode terminals of the semiconductor chip, the bump electrodes are heated and pressed against the electrode terminals of the mounting substrate. Thereby, a bump connection is formed.
  • electrode terminals are arranged on the outer periphery of the semiconductor chip.
  • the progress of the narrowing of the center-to-center distance between adjacent electrode terminals is remarkable, when the electrode terminals are arranged only on the outer periphery of the semiconductor chip, for example, a short circuit occurs between the electrode terminals, Connection failure may occur due to a difference in thermal expansion coefficient from the mounting board.
  • Solder bumps are generally formed by the following method. First, solder is supplied onto the electrode terminals by screen printing, dispenser, or electrolytic plating. Thereafter, the supplied solder is heated to a melting point or higher in a reflow furnace. Thereby, a protruding solder bump is formed on the electrode terminal.
  • Patent Document 1 proposes a bump having a two-layer structure in which an insulating film containing metal particles is formed so as to cover the surface of a protruding electrode made of gold or copper. According to the proposed bump, since the insulating film and the protruding electrode are not melted at the time of flip-chip mounting, it is possible to prevent the occurrence of “solder bridge failure”. Therefore, it becomes possible to cope with the narrowing of the center-to-center distance between adjacent electrode terminals.
  • the bump disclosed in Patent Document 1 is formed on the mounting substrate by a force generated in a direction in which the sealing resin is compressed when the sealing resin injected between the semiconductor chip and the mounting substrate is cured and contracted. Are electrically connected to the electrode terminals.
  • the metal particles in the insulating film do not diffusely bond with the protruding electrode (metal electrode) of the semiconductor chip, and the electrode terminal (metal electrode) of the mounting substrate ) And diffusion bonding.
  • the electrical connection between the protruding electrode of the semiconductor chip and the electrode terminal of the mounting substrate is such that the metal particles in the insulating film contact the protruding electrode (metal electrode) of the semiconductor chip and the electrode terminal (metal electrode) of the mounting substrate. Secured only by doing. For this reason, when the electrode area is reduced, the number of conductive particles interposed between the protruding electrode of the semiconductor chip and the electrode terminal of the mounting substrate is reduced, the connection resistance is increased, and the signal transmission loss is increased. happenss.
  • JP 2003-282617 A Japanese Patent Laid-Open No. 9-97791
  • a low dielectric constant film (so-called low-k film) is used as an interlayer insulating film of a semiconductor chip in order to cope with further miniaturization of wiring rules required in recent years and further speeding up of signal processing (high-speed signal processing).
  • ULK Ultra Low-k
  • the low dielectric constant film has a porous shape (porous) having a large number of pores in order to lower the dielectric constant.
  • the diameter (maximum width) of each hole is several nm.
  • FIG. 5 shows a manufacturing process of the semiconductor device disclosed in Patent Document 2.
  • a bump 120 composed of two layers of a lower layer 103a and an upper layer 103b is formed on the semiconductor chip 101 side.
  • the upper layer 103b is made of solder
  • the lower layer 103a is made of a refractory metal having a melting point higher than that of the solder.
  • the upper layer (solder) 103b having a melting temperature lower than that of the lower layer 103a is melted, and the solder of the lower layer metal 103a and the upper layer 103b provided on the semiconductor chip 101 is diffusion bonded as shown in the middle diagram of FIG. Then, the electrode 111 of the circuit board 110 and the solder of the upper layer 103b are diffusion-bonded.
  • the solder of the upper layer 103b disposed in the vicinity of each of the four corners where adjacent sides of the outer shape of the rectangular semiconductor chip 101 intersect with the semiconductor chip 101 and
  • the concentrated thermal stress is directly below the lower layer metal 103 a disposed in the vicinity of each of the four corners of the semiconductor chip 101.
  • peeling of the fragile low dielectric constant film 102 occurs immediately below an electrode terminal (not shown) arranged in the vicinity of the four corners of the semiconductor chip 101, or cracking occurs in the fragile low dielectric constant film 102.
  • peeling of the fragile low dielectric constant film 102 occurs as shown in the lower diagram of FIG.
  • the use environment of the semiconductor device manufactured by the method for manufacturing a semiconductor device disclosed in Patent Document 2 is an environment in which an abrupt temperature difference occurs, the same applies even under such use environment.
  • the fragile low dielectric constant film 102 may peel off or the fragile low dielectric constant film 102 may crack immediately below the electrode terminal of the semiconductor chip 1. is there.
  • the present invention provides a semiconductor device manufacturing method for manufacturing a semiconductor device capable of ensuring high connection reliability even when the semiconductor chip has a fragile film, and a semiconductor device manufactured by the manufacturing method. Objective.
  • the semiconductor device manufacturing method of the present invention is a semiconductor device manufacturing method for manufacturing a semiconductor device in which a semiconductor chip having a plurality of protruding electrodes is mounted on a semiconductor substrate, wherein the plurality of protruding electrodes of the semiconductor chip include: The plurality of protruding electrodes and the semiconductor substrate of the semiconductor chip are melted in a state where the plurality of electrodes formed on the semiconductor substrate are in contact with the plurality of electrodes via the plurality of solder portions. A first step of forming a plurality of solder joints to be bonded to the plurality of electrodes, and a distance between a part of the semiconductor chip and the semiconductor substrate, and a distance between the other part of the semiconductor chip and the semiconductor substrate.
  • a fourth step of electrically connecting the plurality of protruding electrodes to the plurality of electrodes of the semiconductor substrate is electrically connecting the plurality of protruding electrodes to the plurality of electrodes of the semiconductor substrate.
  • the semiconductor device of the present invention is a semiconductor device in which a semiconductor chip having a plurality of protruding electrodes is mounted on a semiconductor substrate, wherein the plurality of protruding electrodes of the semiconductor chip are formed on the semiconductor substrate.
  • a plurality of solder joints that are electrically connected to a plurality of electrodes are provided, the heights of the plurality of solder joints vary, and at least holes are formed in the solder joints having the maximum height. It is characterized by that.
  • the solder joint where thermal stress is concentrated in the cooling process after melting the solder in the flip chip mounting process can be made into a solder joint including a hole.
  • thermal stress often concentrates on solder joints that are diffusion-bonded to protruding electrodes arranged in the vicinity of four corners where adjacent sides of the outer shape intersect. Since the solder joint including the hole is soft and easily stretched, the thermal stress transmitted directly below the protruding electrode to which the solder joint formed with the hole is connected is reduced. Therefore, it is possible to reduce the thermal stress received by the fragile low dielectric constant film formed immediately below the electrode of the semiconductor chip, and to prevent the fragile low dielectric constant film from peeling and cracking. Therefore, it is possible to ensure high connection reliability.
  • FIG. 1 is a cross sectional view conceptually showing a main part of a semiconductor device in a first embodiment of the present invention. It is sectional drawing which shows a part of manufacturing process of the semiconductor device in Embodiment 1 of this invention. It is sectional drawing which shows a part of manufacturing process of the semiconductor device in Embodiment 1 of this invention. It is sectional drawing which shows a part of manufacturing process of the semiconductor device in Embodiment 1 of this invention. It is sectional drawing which shows a part of manufacturing process of the semiconductor device in Embodiment 1 of this invention. It is sectional drawing which shows a part of manufacturing process of the semiconductor device in Embodiment 1 of this invention. It is sectional drawing which shows a part of manufacturing process of the semiconductor device in Embodiment 2 of this invention. It is sectional drawing which shows a part of manufacturing process of the semiconductor device in Embodiment 2 of this invention.
  • FIG. 1 is an enlarged cross-sectional view of the semiconductor device according to the first embodiment.
  • a semiconductor chip 1 having a plurality of protruding electrodes 4 is mounted on a semiconductor substrate 11.
  • 2A to 2D show a manufacturing process of the semiconductor device in the first embodiment.
  • the semiconductor chip 1 is, for example, an LSI chip in which a large number of electrode terminals 3 are arranged at a narrow pitch on the surface (electrode surface) on the semiconductor substrate 11 side.
  • the pitch of the electrode terminals 3 is the distance between the centers of the adjacent electrode terminals 3.
  • a fine wiring layer made of Cu or Al and a fragile low dielectric constant insulating film (for example, a low-k layer or an Ultra-low-k layer) Etc.) is provided on the inner side of the electrode surface on which the electrode terminal 3 is disposed.
  • a fragile low dielectric constant insulating film for example, a low-k layer or an Ultra-low-k layer
  • Etc. a fragile low dielectric constant insulating film
  • the electrode terminal 3 is made of, for example, Al or Cu.
  • a seed layer made of Ti / Cu or Ti / W / Cu is provided on the surface of the electrode terminal 3.
  • a protruding electrode 4 made of a metal that wets the solder is provided on the surface of the seed layer.
  • the protruding electrode 4 is made of Cu, Ni / Au, Au, or the like.
  • the semiconductor substrate 11 is made of, for example, silicon.
  • An electrode terminal 12 is provided on the semiconductor substrate 11 so as to face the protruding electrode 4 of the semiconductor chip 1.
  • the electrode terminal 12 is made of, for example, electrolytic Ni / Au or electrolytic Ni / Pd / Au.
  • a seed layer is provided on the surface of the electrode terminal 12, and a protruding electrode 13 is provided on the surface of the seed layer.
  • the protruding electrode 4 of the semiconductor chip 1 is electrically and mechanically connected to the protruding electrode 13 of the semiconductor substrate 11 by the solder joint 7.
  • the solder joint 7 and the projecting electrode 4 and the solder joint 7 and the projecting electrode 13 are firmly joined by a solid-liquid diffusion reaction.
  • the height of the plurality of solder joints 7 varies.
  • the distance between the semiconductor chip 1 and the semiconductor substrate 11 is maximum (A in FIG. 1) in the outermost periphery of the semiconductor chip 1.
  • the solder joint portion 7a joined to the protruding electrode 4 disposed in the vicinity of the outermost periphery of the semiconductor chip 1 has the maximum height.
  • the distance between the semiconductor chip 1 and the semiconductor substrate 11 may be maximum in the center of the semiconductor chip 1.
  • the solder joint portion 7 that joins the protruding electrode 4 disposed in the center of the semiconductor chip 1 or in the vicinity of the center has the maximum height.
  • Embodiments 2 and 3 described later The same applies to Embodiments 2 and 3 described later.
  • solder joint portion 7a having the maximum height a constricted portion 16 having a small cross-sectional area is formed at the center in the vertical direction.
  • shape of the solder joint portion 7 located in the vicinity of the center portion of the semiconductor chip 1 is a barrel shape.
  • the solder joint portion 7a having the maximum height has the largest content of voids 8. This is because the constricted portion 16 having a small cross-sectional area is formed in the solder joint portion 7a having the maximum height.
  • the solder joint 7a having the maximum height is disposed at a position where the thermal stress is most concentrated in the cooling process after the solder is melted in the flip chip mounting process.
  • thermal stress is concentrated on solder joints 7 located in the vicinity of each of four corners where adjacent sides of a rectangular semiconductor chip 1 intersect.
  • the solder joint portion 7 located near the corner of the semiconductor chip 1 is also a solder joint portion 7 a located near the outermost periphery of the semiconductor chip 1. Therefore, the thermal stress is most concentrated on the solder joint 7 a having the maximum height located in the vicinity of the outermost periphery of the semiconductor chip 1.
  • the solder joint portion 7 a located in the vicinity of the outermost periphery of the semiconductor chip 1 having the largest distance between the semiconductor chip 1 and the semiconductor substrate 11 receives the largest thermal stress.
  • the solder joint portion 7a that receives the greatest thermal stress has the constricted portion 16 having a small cross-sectional area, and thus the content rate of the voids 8 is maximum, so that the proportion of solder is small. For this reason, when the solder joint portion 7a having the maximum height is subjected to tensile stress, the stress concentration on the solder portion increases, and the stress concentration point moves from the multilayer wiring layer 2 having a fragile film to the solder joint portion 7a.
  • the solder joint portion 7a has a large content of the voids 8, and thus the elongation percentage of the solder joint portion 7a is large. Further, the solder joint portion 7 a is firmly joined to the protruding electrode 4 and the protruding electrode 13. Therefore, even if a large thermal stress is applied, the solder joint portion 7a extends without being damaged. From the above, it is possible to prevent peeling and cracking of the fragile low dielectric constant film of the multilayer wiring layer 2 because the solder joint that receives the greatest thermal stress has a high void content.
  • the composition of the solder can be selected from, for example, SnAg, SnAgCu, SnZn, SnZnBi, SnPb, SnBi, SnAgBiIn, SnIn, In, and Sn.
  • the composition of the solder is preferably selected in consideration of the elongation rate of the solder in accordance with the size of the maximum distance A.
  • the diameter of the protruding electrode 4 is 0.020 mm to 0.035 mm, and the height of the protruding electrode 4 is high.
  • the diameter of the protruding electrode 13 of the semiconductor substrate 11 is 0.015 mm to 0.035 mm, the height of the protruding electrode 13 is 0.002 mm to 0.010 mm, and the solder joint 7 has a height of 0.005 mm to 0.030 mm.
  • the diameter is 0.02 mm to 0.035 mm.
  • the sealing resin 15 may be filled between the semiconductor chip 1 and the semiconductor substrate 11. By filling the sealing resin 15, the reliability is further improved.
  • This semiconductor device can be manufactured by the steps shown in FIGS. 2A to 2D.
  • the protruding electrode 4 is formed on the semiconductor chip 1, first, a seed layer is formed on the entire surface of each electrode surface of the plurality of semiconductor chips 1 in the wafer by sputtering or vapor deposition, and then a photosensitive resist layer. Is formed. Next, after exposing a portion where the protruding electrode 4 is to be formed, the photosensitive resist layer is washed. By this exposure and cleaning, an opening of the photosensitive resist layer is formed at a portion where the protruding electrode 4 on the electrode terminal 3 is to be formed. Next, the plurality of semiconductor chips 1 in the wafer form are immersed in an electrolytic plating bath. Thereby, the protruding electrode 4 is formed on the electrode terminal 3.
  • solder film 6 which is an example of a solder portion is formed on the protruding electrode 4
  • flux is applied to the entire surface of each electrode surface of the plurality of semiconductor chips 1 in a wafer form.
  • the plurality of semiconductor chips 1 in wafer form are heated in a reflow furnace.
  • the solder film 6 is melted into a dome shape.
  • the solder film 6 and the protruding electrode 4 are diffusion-bonded to form an alloy layer 5 between the solder film 6 and the protruding electrode 4.
  • the photosensitive resist layer is peeled off, and the protruding electrode 4 covered with the solder film 6 is formed on the electrode terminal 3 (see FIG. 2A).
  • Ti / Cu is used as the material of the seed layer
  • Cu is used as the material of the protruding electrode 4
  • SnAg is used as the material of the solder film 6.
  • the alloy layer 5 is made of Cu 3 Sn and Cu 6 Sn 5 .
  • the materials of the seed layer, the protruding electrode 4 and the solder film 6 are not limited to these.
  • the semiconductor chip 1 is separated into pieces by means such as blade dicing or laser dicing, and the semiconductor chip 1 in the state shown in FIG. 2A is obtained.
  • the protruding electrode 13 is formed by electrolytic plating.
  • Ni—P / Au is used as the material of the protruding electrode 13.
  • the material of the protruding electrode 13 is not limited to this.
  • the protruding electrode 4 of the semiconductor chip 1 and the protruding electrode 13 of the semiconductor substrate 11 are aligned as shown in FIG. 2A, and the protruding electrode 4 contacts the protruding electrode 13 through the solder film 6. Is done.
  • the semiconductor chip 1 and the semiconductor substrate 11 are heated, and the semiconductor chip 1 is mounted on the semiconductor substrate 11 as shown in FIG. 2B.
  • the tip of the melted solder film 6 and the protruding electrode 13 are diffusion-bonded to form the solder joint portion 7 having the alloy layer 14.
  • the pressurization time is less than 0.1 seconds, the area where the tip of the solder film 6 and the protruding electrode 13 are diffusion-bonded becomes small, and the melted solder is torn off in the pulling process (FIG. 2C) described later. Will occur.
  • the semiconductor chip 1 is heated to a temperature equal to or higher than the melting point of the solder, and a part of the semiconductor chip 1 is pulled away, or a part of the semiconductor chip 1 is removed from the semiconductor chip 1. It is raised more than other parts. Thereby, the interval between a part of the semiconductor chip 1 and the semiconductor substrate 11 becomes larger than the interval between the other part of the semiconductor chip 1 and the semiconductor substrate 11, and at least of the plurality of solder joints 7. A part of the solder joints 7 is stretched in a direction perpendicular to the electrode terminals 12 of the semiconductor substrate 11 in a molten state, and the height of the plurality of solder joints 7 varies.
  • the outer peripheral portion of the semiconductor chip 1 is pulled up, or the outer peripheral portion of the semiconductor chip 1 is pulled up larger than the central portion of the semiconductor chip 1.
  • the interval between the outer peripheral portion of the semiconductor chip 1 and the semiconductor substrate 11 is larger than the interval between the central portion of the semiconductor chip 1 and the semiconductor substrate 11, and is provided at least on the outer peripheral portion of the semiconductor chip 1.
  • the solder joint 7 joined to the protruding electrode 4 is stretched in a direction perpendicular to the electrode terminal 12 of the semiconductor substrate 11 in a molten state. Thereafter, the solder joint 7 is solidified by cooling.
  • the semiconductor chip 1 that generates a large warp (warp during heat) due to the difference in linear expansion coefficient of the internal wiring layer is used, and the semiconductor chip 1 is released in a state where the solder is melted. As a result, the semiconductor chip 1 is warped (warp when heated), and the warp may be used as a driving force.
  • a tilted portion is formed in the semiconductor chip 1.
  • the portion extending from the vicinity of the central part of the semiconductor chip 1 to the outermost part of the semiconductor chip 1 is inclined so that the outermost part of the semiconductor chip 1 is farthest from the semiconductor substrate 11.
  • the solder joint 7 joined to the protruding electrode 4 provided at the inclined portion is stretched in the vertical direction with respect to the electrode terminal 12 of the semiconductor substrate 11 in a molten state.
  • the solder joint portion 7a joined to the protruding electrode 4 disposed in the vicinity of the outermost periphery of the semiconductor chip 1 is stretched most and becomes the highest.
  • the semiconductor chip 1 has a structure in which an internal wiring layer is formed on a substrate. For this reason, when the semiconductor chip 1 is heated, thermal stress is generated due to the difference in elastic modulus and thermal expansion coefficient between the internal wiring layer and the substrate. The thinner the semiconductor chip 1 is, the lower the rigidity of the base material is. Therefore, the semiconductor chip 1 is easily warped, and the driving force described above is easily exhibited. For example, as a result of measuring the warpage amount of the semiconductor chip 1 of 4 mm ⁇ 4 mm with a confocal microscope, the warpage amounts when the thickness of the semiconductor chip 1 is 0.020 mm, 0.060 mm, and 0.150 mm are 0.026 mm, 0.018 mm and 0.007 mm.
  • the thickness of the semiconductor chip 1 be 0.060 mm or less.
  • the semiconductor chip 1 may be damaged due to stress acting on the multilayer wiring layer 2 of a fragile film. Therefore, the thickness t of the semiconductor chip 1 is 0.020mm ⁇ t ⁇ 0.060mm The range of is preferable.
  • the constricted portion 16 is formed in the solder joint portion 7a located in the vicinity of the outermost contour of the semiconductor chip 1.
  • warpage is small near the center of the semiconductor chip 1.
  • the shape of the solder joint portion 7 located in the portion where the warpage is small becomes a barrel shape.
  • a void may be formed in the elongated solder joint portion 7 during the pulling process.
  • voids are likely to be formed in the solder joint 7 that is stretched most and becomes the highest.
  • the semiconductor substrate 11 on which the semiconductor chip 1 is mounted is heated by a heating means such as a reflow furnace, the solder is remelted, and an alloy layer grows.
  • Cu 6 Sn 5 of the alloy layer 5 grows in a columnar shape and reaches the alloy layer 14 on the protruding electrode 13 to form an alloy layer made of (Cu, Ni) 6 Sn 5 .
  • voids 8 are generated in the solder joint portion 7 having a smaller cross-sectional area than the electrode area, as shown in FIG.
  • the solder joint 7a that is most stretched has the smallest constriction 16 and therefore the smallest cross-sectional area.
  • the solder joint portion 7a that has been stretched most has the largest void content, and at the same time, the solder ratio decreases. For this reason, the solder joint portion 7a that has been stretched most easily has a reduced tensile elastic modulus (Young's modulus) and is thus easily stretched.
  • the void content of the solder joint 7a located in the vicinity of the outermost contour of the semiconductor chip 1 is the largest.
  • the heating for growing the alloy layer may be performed under a vacuum or a reducing gas.
  • a vacuum or a reducing gas By melting the solder under vacuum or reducing gas, the amount of oxide film generated while the solder is melting is reduced. Therefore, since the amount of the oxide film that inhibits the growth of the alloy layer is reduced, the growth of the alloy layer can be more easily promoted.
  • the reducing gas for example, carboxylic acids such as formic acid and citric acid can be used.
  • a sealing resin may be injected between the semiconductor chip 1 and the semiconductor substrate 11 by a dispenser or the like, and the injected sealing resin may be cured. Since the sealing resin permeates into the holes 8, it is possible to improve both the tensile strength of the solder joint 7 and the low elastic modulus of the solder joint 7, so that the more fragile semiconductor chip 1 is used. It becomes possible to do. Further, since the sealing resin is bonded to the solder joint portion 7 having unevenness, the anchoring effect improves the interface adhesive strength between the sealing resin and the solder joint portion 7, and the harsher use environment. Even under this, high reliability of the semiconductor device can be ensured.
  • the solder joint portion 7 arranged in the vicinity of the outermost periphery of the semiconductor chip 1 has a plurality of holes 8. did it.
  • the void content of the solder joint portion 7 disposed in the outer peripheral portion of the semiconductor chip 1 is such that the void in the solder joint portion 7 disposed in the inner peripheral portion of the semiconductor chip 1 inside the outer peripheral portion. It was confirmed that the content was larger than the content rate. Further, it was confirmed that no fragile low dielectric constant film was peeled off or cracked in the outermost periphery of the semiconductor chip 1. Furthermore, as a result of putting the semiconductor device of the first embodiment into the temperature cycle test (1 cycle: ⁇ 40 ° C., 85 ° C., 30 minutes each), stable connection resistance can be secured even after 1000 cycles. It could be confirmed.
  • solder joint portion 7a disposed at the position where the distance between the semiconductor chip 1 and the semiconductor substrate 11 is farthest or in the vicinity of the position is provided with the holes 8, so that the fragile low dielectric constant film Stress applied to the (ULK film) is reduced, and high connection reliability can be ensured.
  • the solder joint located at the center of the semiconductor chip 1 may be subjected to the greatest thermal stress during the cooling process after melting the solder in the flip chip mounting process.
  • a semiconductor chip that warps in a convex shape so that the center of the semiconductor chip is farthest from the semiconductor substrate may be used. The same applies to Embodiments 2 and 3 described later.
  • Embodiment 2 are cross-sectional views conceptually showing the method for manufacturing a semiconductor device in the second embodiment.
  • the electrode terminal 12 (seed layer) is covered with an insulating film having an opening at the center. Thereafter, the protruding electrode 13 is formed by electrolytic plating.
  • the opening diameter of the insulating film is reduced, as shown in FIG. 3A, a recess 17a is formed in the protruding electrode 13 depending on the thickness of the insulating film.
  • the electrode terminal 12 has a diameter of 0.025 mm, it is preferable that the opening diameter of the insulating film is 0.015 mm and the thickness of the insulating film is 0.001 mm to 0.002 mm.
  • the semiconductor chip 1 and the semiconductor substrate 11 are heated, and the semiconductor chip 1 is mounted on the semiconductor substrate 11. At this time, the tip of the molten solder film 6 and the protruding electrode 13 are diffusion-bonded to form the solder joint portion 7 having the alloy layer 14.
  • the semiconductor chip 1 is heated to a temperature equal to or higher than the melting point of the solder joint 7, and the outermost portion of the semiconductor chip 1 is pulled up.
  • the portion extending from the vicinity of the central portion of the semiconductor chip 1 to the outermost portion of the semiconductor chip 1 is inclined so that the outermost portion of the semiconductor chip 1 is farthest from the semiconductor substrate 11. Is illustrated.
  • the solder wet in the concave portions 17a of the protruding electrodes 13 is pulled up.
  • the pulled solder collects on the solder on the convex portion 17b around the concave portion 17a due to the surface tension of the solder.
  • the concave portion 17a is not wetted by the solder, and the convex portion 17b around the concave portion 17a is wetted by the solder.
  • holes 8 are formed in the solder joints 7 a located in the vicinity of the outermost periphery of the semiconductor chip 1.
  • the cross-sectional area of the solder portion is smaller than that in the first embodiment.
  • the semiconductor substrate 11 on which the semiconductor chip 1 is mounted is heated by a heating means such as a reflow furnace, and the solder is remelted.
  • a heating means such as a reflow furnace
  • solder joints having more holes 8 can alleviate thermal stress in the use environment and suppress the breakage of the fragile film.
  • the distance between the semiconductor chip 1 and the semiconductor substrate 11 is the largest at the outermost portion of the semiconductor chip 1, and the semiconductor chip in one cross section It was confirmed that the solder joint portion 7a located near the outermost contour of 1 has 8 holes. Further, it was confirmed that even when the fragile low dielectric constant film is an ELK (Extreme Low-k) film, peeling and cracking did not occur. Furthermore, as a result of putting the semiconductor device of the second embodiment into a temperature cycle test (1 cycle: ⁇ 45 ° C., 85 ° C., 5 minutes each), stable connection resistance can be secured even after 1000 cycles. It could be confirmed.
  • the length of the solder joint portion 7a located in the vicinity of the outermost periphery of the semiconductor chip 1 is controlled by causing warpage of the semiconductor chip 1, and the minimum of the solder joint portion 7a is controlled.
  • the case where the solder joint portion 7a is made to have low elasticity by controlling the cross sectional area of the solder joint portion 7a by forming the constricted portion 16 has been described. However, it is possible to reduce the elasticity of the solder joint 7a simply by controlling the length of the solder joint 7a located near the outermost periphery of the semiconductor chip 1.
  • a protruding electrode 13 having an arcuate corner is formed on the electrode terminal 12 of the semiconductor substrate 11. Therefore, the corners of the protruding electrodes 13 of the semiconductor substrate 11 with which the protruding electrodes 4 of the semiconductor chip 1 abut via the solder film 6 are arcuate. Others are the same as those in the first embodiment, and the description thereof is omitted.
  • the protruding electrode 13 is formed by electroless plating.
  • the diameter of the protruding electrode 13 is 0.035 mm, and the thickness of the protruding electrode 13 is 0.010 mm. Since electroless plating grows isotropically, as shown in FIG. 4A, the protruding electrode 13 has an arcuate shape 18 with rounded corners.
  • the semiconductor chip 1 is mounted on the semiconductor substrate 11 with the solder film 6 melted, and the alloy layer 14 is formed on the protruding electrodes 13.
  • the solder spreads out along the rounded arc shape 18 of the protruding electrode 13.
  • the solder joint portion 7 is solidified by being cooled to the solidification point of the solder.
  • the portion extending from the vicinity of the central portion of the semiconductor chip 1 to the outermost portion of the semiconductor chip 1 is inclined so that the outermost portion of the semiconductor chip 1 is farthest from the semiconductor substrate 11. Is illustrated.
  • holes 8 are formed in the elongated solder joint 7a. This is because the amount of solder existing between the top surfaces of the upper and lower protruding electrodes 4 and 13 is equivalent to the amount of solder spreading along the rounded arc shape 18 of the protruding electrodes 13. This is because the number is smaller than those of the first and second embodiments.
  • the mounting body composed of the semiconductor chip 1 and the semiconductor substrate 11 is put into a reflow furnace, and the solder joint 7 is remelted.
  • the solder spreads further along the rounded arc shape 18 of the protruding electrode 13. Since the solder wets and spreads in a rounded shape on the outer surface of the protruding electrode 13 in this way, the volume of solder existing between the top surfaces of the upper and lower protruding electrodes 4 and 13 when the solder is remelted is This is smaller than in the first and second embodiments. Therefore, as time passes, as shown in FIG.
  • solder joint portion 7a located near the outermost periphery of the semiconductor chip 1 than in the first and second embodiments.
  • the solder joint 7a having the maximum height has low elasticity. Therefore, thermal stress can be relaxed and a fragile dielectric film can be applied even to a large-sized semiconductor chip in which a known bump has a large thermal stress and it has been difficult to apply the fragile dielectric film.
  • Embodiment 3 can be combined with Embodiment 3.
  • the semiconductor chip 1 is mounted on the semiconductor substrate 11 has been described as an example.
  • the present invention is not limited to that example. Even if the present invention is applied to an electrical component having a narrow pitch of electrode terminals on which passive components such as capacitors, coils, and resistors are mounted, the same effects as those of the first to third embodiments can be obtained.
  • the semiconductor chip in the wafer form has been described as an example. However, the present invention is not limited to that example.
  • an electronic circuit or a semiconductor circuit may be configured on the surface or inside of the semiconductor substrate 11. Therefore, the semiconductor substrate 11 may be a semiconductor chip.
  • the present invention is particularly useful in the mounting field for mounting a semiconductor chip with a narrow pitch, a semiconductor chip having an interlayer insulating film made of a low dielectric constant material, and the like.

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Abstract

　半導体チップ（１）の複数の突起状電極（４）が、半導体基板（１１）に形成されている複数の電極（１３）に、複数の半田部を介して当接した状態で、複数の半田部が溶融して、半導体チップ（１）の複数の突起状電極（４）と半導体基板（１１）の複数の電極（１３）に接合する複数の半田接合部（７）が形成される。次に、半導体チップ（１）の一部分と半導体基板（１１）との間の間隔（Ａ）が、半導体チップ（１）の他の部分と半導体基板（１１）との間の間隔（Ｂ）よりも大きくなり、複数の半田接合部（７）のうちの少なくとも一部の半田接合部が引き伸ばされる。これにより、複数の半田接合部（７）の高さに、ばらつきが生じる。次に、複数の半田接合部（７）のうちの、少なくとも、高さが最大となる半田接合部（７ａ）内に、空孔（８）が形成される。その後、複数の半田接合部（７）が凝固する。

Description

半導体装置製造方法および半導体装置
　本発明は、半導体装置製造方法およびその製造方法によって製造される半導体装置に関するものである。
　近年、半導体チップの高密度化と半導体チップの電極端子の多ピン化の両立を進めるべく、半導体チップの電極端子の面積縮小化と、半導体チップ内で隣接する電極端子同士の中心間距離の狭小化（電極端子の狭ピッチ化）が図られている。
　通常、フリップチップ実装においては、ＬＳＩなどの半導体チップがフェイスダウンで実装基板に実装される。具体的には、半導体チップの電極端子上に、半田バンプなどの突起電極が形成された後、その突起電極が加熱されて、実装基板の電極端子に対して圧接される。これにより、バンプ接続が形成される。
　また、一般的には、半導体チップの外周部に電極端子が配置される。しかし、隣接する電極端子同士の中心間距離の狭小化の進展は著しいため、半導体チップの外周部にのみ電極端子が配置された場合、例えば、電極端子間で短絡が発生したり、半導体チップと実装基板との熱膨張係数の差により接続不良が発生したりすることがある。
　そこで、半導体チップの電極面の全域にわたって電極端子を配置する設計（エリア配置）が採用されるようになってきた。この電極端子の配置によれば、隣接する電極端子同士の中心間距離（電極端子のピッチ）を広げることが可能となる。しかし、近年では、半導体チップの電極面の全域にわたって電極端子を配置する設計においても、隣接する電極端子同士の中心間距離の狭小化の進展が著しい。
　半田バンプは、一般的には次の工法によって形成される。まず、スクリーン印刷、ディスペンサー、又は電解メッキにより、半田が電極端子上に供給される。その後、その供給された半田がリフロー炉で半田融点以上に加熱される。これにより、電極端子上に突起状の半田バンプが形成される。
　しかし、近年、隣接する半田接合部同士の中心間距離（半田接合部のピッチ）がさらに狭くなってきており、加えて半導体チップと実装基板との間の隙間も狭くなってきた。このため、「半田ブリッジ不良」等の問題が起こることがある。「半田ブリッジ不良」は、フリップチップ実装の加熱工程において、溶融した半田が変形して、半田の表面張力により半田バンプ同士がつながることにより発生する。この「半田ブリッジ不良」の問題を解決するために、半田の量を減らすことが可能な２層構造のバンプが提案されている。例えば特許文献１には、金または銅からなる突起電極の表面を覆うように、金属粒子を含有した絶縁性皮膜が形成されてなる２層構造のバンプが提案されている。この提案されたバンプによれば、フリップチップ実装時に絶縁性皮膜および突起電極が溶融しないので、「半田ブリッジ不良」の発生を防ぐことが可能となる。よって、隣接する電極端子同士の中心間距離の狭小化に対応することが可能となる。特許文献１に開示されているバンプは、半導体チップと実装基板との間に注入された封止樹脂が硬化収縮する際に、その封止樹脂が圧縮される方向に発生する力によって、実装基板の電極端子に電気的に接続される。
　しかしながら、隣接する電極端子同士の中心間距離は、近年、更なる狭小化が求められている。そのため、電極端子の面積縮小化が進展している。特許文献１に開示されているバンプが半導体チップに使用された場合、絶縁性皮膜内の金属粒子は、半導体チップの突起電極（金属電極）と拡散接合せず、実装基板の電極端子（金属電極）とも拡散接合しない。半導体チップの突起電極と実装基板の電極端子との間の電気的接続は、絶縁性皮膜内の金属粒子が、半導体チップの突起電極（金属電極）と実装基板の電極端子（金属電極）に接触することのみによって確保される。このため、電極面積が小さくなると、半導体チップの突起電極と実装基板の電極端子との間に介在する導電粒子の数が少なくなり、接続抵抗が高くなって、信号の伝送損失が増大するという問題が起こる。
　そこで、高融点金属からなる下層金属上に半田からなる上層金属が設けられてなる２層構造のバンプが採用されるようになってきた（例えば、特許文献２を参照。）。この２層構造のバンプによれば、半田のみからなる一層のバンプよりも半田の量を減らすことが可能となる。よって、フリップチップ実装時に平面方向へ飛び出す半田の量が減るので、半田ブリッジの発生を防ぐことが可能となる。さらに、上層金属の半田が、半導体チップに設けられた下層金属（突起電極）と実装基板の電極端子に拡散接合するので、接続抵抗が低くなり、信号の伝送損失が増大することもない。
特開２００３－２８２６１７号公報 特開平９－９７７９１号公報
　しかしながら、近年要求されている配線ルールの更なる微細化と信号処理の更なる高速化（高速信号処理）に対応するために、半導体チップの層間絶縁膜に低誘電率膜（いわゆるLow-k膜やＵＬＫ（Ultra Low-k）膜など）が用いられるようになってきた。低誘電率膜は、誘電率を下げるために、多数の空孔を有するポーラス状（多孔質）となっている。各空孔の径（最大幅）は、数ｎｍである。
　図５は特許文献２に開示された半導体装置の製造工程を示す。
　まず、回路基板１１０に半導体チップ１０１がフリップチップ実装される前に、図５の上図に示すように、半導体チップ１０１の側に、下層１０３ａと上層１０３ｂの二層からなるバンプ１２０が形成される。上層１０３ｂは半田からなり、下層１０３ａは、半田よりも融点が高い高融点金属からなる。次に、そのバンプ１２０が、加熱された状態で回路基板１１０の電極１１１に当接される。これにより、下層１０３ａよりも低い溶融温度を持つ上層（半田）１０３ｂが溶融して、図５の中図に示すように、半導体チップ１０１に設けられた下層金属１０３ａと上層１０３ｂの半田が拡散接合し、回路基板１１０の電極１１１と上層１０３ｂの半田が拡散接合する。
　一般的に、矩形状の外形を持つ半導体チップが実装基板にフリップチップ実装される場合、半田バンプが溶融した後の冷却過程で、半導体チップの隣接する辺同士が交わる４つのコーナーそれぞれの近傍に配置されたバンプに、半導体チップと実装基板との弾性率および線膨張係数の差に起因する熱応力が集中することが多い。
　上記した特許文献２に開示されている半導体装置の製造方法では、上層１０３ｂの半田に集中した熱応力は、下層金属１０３ａの直下に直接伝わる。このため、下層金属１０３ａが設けられた電極端子（図示せず）の直下において、脆弱な低誘電率膜１０２の剥離が発生したり、脆弱な低誘電率膜１０２に亀裂が発生したりすることがある。例えば、上層１０３ｂの半田が溶融した後の冷却過程で、矩形状の半導体チップ１０１の外形の隣接する辺同士が交わる４つのコーナーそれぞれの近傍に配置された上層１０３ｂの半田に、半導体チップ１０１と回路基板１１０との弾性率および線膨張係数の差に起因する熱応力が集中した場合、その集中した熱応力は、半導体チップ１０１の４つのコーナーそれぞれの近傍に配置された下層金属１０３ａの直下に直接伝わる。したがって、半導体チップ１０１の４つのコーナーの近傍に配置された図示しない電極端子の直下において、脆弱な低誘電率膜１０２の剥離が発生したり、脆弱な低誘電率膜１０２に亀裂が発生したりすることがある。例えば、脆弱な低誘電率膜１０２の剥離が、要部を拡大して示す図５の下図のように発生する。
　また、特許文献２に開示されている半導体装置の製造方法により製造された半導体装置の使用環境が、急激な温度差が発生するような環境である場合、そのような使用環境下においても、同様な熱応力の集中が発生して、半導体チップ１の電極端子の直下において、脆弱な低誘電率膜１０２の剥離が発生したり、脆弱な低誘電率膜１０２に亀裂が発生したりすることがある。
　本発明は、半導体チップが脆弱な膜を有する場合でも、高い接続信頼性を確保することが可能な半導体装置を製造する半導体装置製造方法およびその製造方法によって製造される半導体装置を提供することを目的とする。
　本発明の半導体装置製造方法は、複数の突起状電極を有した半導体チップが半導体基板に実装されてなる半導体装置を製造する半導体装置製造方法において、前記半導体チップの前記複数の突起状電極が、前記半導体基板に形成されている複数の電極に、複数の半田部を介して当接した状態で、前記複数の半田部を溶融させて、前記半導体チップの前記複数の突起状電極と前記半導体基板の前記複数の電極に接合する複数の半田接合部を形成する第１工程と、前記半導体チップの一部分と前記半導体基板との間の間隔を、前記半導体チップの他の部分と前記半導体基板との間の間隔よりも大きくして、前記複数の半田接合部のうちの少なくとも一部の半田接合部を引き伸ばし、前記複数の半田接合部の高さに、ばらつきを生じさせる第２工程と、前記複数の半田接合部のうちの、少なくとも、高さが最大となる半田接合部内に、空孔を形成する第３工程と、前記複数の半田接合部を凝固させて、前記半導体チップの前記複数の突起状電極を前記半導体基板の前記複数の電極に電気的に接続させる第４工程と、を有することを特徴とする。
　また、本発明の半導体装置は、複数の突起状電極を有した半導体チップが半導体基板に実装されてなる半導体装置において、前記半導体チップの前記複数の突起状電極を前記半導体基板に形成されている複数の電極に電気的に接続させる複数の半田接合部を備え、前記複数の半田接合部の高さにばらつきがあり、少なくとも、高さが最大の半田接合部内に、空孔が形成されていることを特徴とする。
　本発明によれば、フリップチップ実装工程における半田溶融後の冷却過程で熱応力が集中する半田接合部を、空孔を含む半田接合部にすることが可能となる。半導体チップの外形が矩形状の場合、その外形の隣接する辺同士が交わる４つのコーナーそれぞれの近傍に配置された突起状電極に拡散接合する半田接合部に、熱応力が集中することが多い。空孔を含む半田接合部は、軟らかく伸びやすいので、その空孔が形成された半田接合部が接続する突起状電極の直下に伝わる熱応力は低減される。したがって、半導体チップの電極の直下に形成されている脆弱な低誘電率膜が受ける熱応力を低減することが可能となり、脆弱な低誘電率膜の剥離および亀裂を防ぐことが可能となる。よって、高い接続信頼性を確保することが可能となる。
本発明の実施の形態１における半導体装置の要部を概念的に示す断面図である。 本発明の実施の形態１における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態１における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態１における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態１における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態２における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態２における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態２における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態２における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態３における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態３における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態３における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態３における半導体装置の製造工程の一部を示す断面図である。 本発明の実施の形態３における半導体装置の製造工程の一部を示す断面図である。 従来の半導体装置の製造工程を示す断面図である。
　　（実施の形態１）
　図１と図２Ａ～図２Ｄは実施の形態１を示す。
　図１は実施の形態１における半導体装置の拡大断面図を示す。図１に示すように、複数の突起状電極４を有した半導体チップ１が、半導体基板１１に実装されている。図２Ａ～図２Ｄは実施の形態１における半導体装置の製造工程を示している。半導体チップ１は、例えば、半導体基板１１の側の面（電極面）に多数の電極端子３が狭いピッチで配置されたＬＳＩチップである。電極端子３のピッチとは、隣接する電極端子３同士の中心間距離である。
　半導体チップ１において、電極端子３が配置される電極面の内側には、例えばＣｕまたはＡｌ等からなる微細配線層と脆弱な低誘電率絶縁膜（例えば、Low-k層またはUltra Low-k層など）とを含む多層配線層２が設けられている。その多層配線層２の最表面に、複数の電極端子３が、半導体チップ１の電極面の全域にわたって設けられている。
　電極端子３は、例えばＡｌまたはＣｕ等からなる。電極端子３の表面にＴｉ／Ｃｕ、またはＴｉ／Ｗ／Ｃｕなどからなるシード層が設けられている。そのシード層の表面に、半田が濡れる金属からなる突起状電極４が設けられている。突起状電極４は、Ｃｕ、Ｎｉ／Ａｕ、またはＡｕなどからなる。
　半導体基板１１は、例えばシリコンからなる。半導体基板１１には、半導体チップ１の突起状電極４に対向する配置で、電極端子１２が設けられている。電極端子１２は、例えば、電解Ｎｉ／Ａｕまたは電解Ｎｉ／Ｐｄ／Ａｕ等からなる。その電極端子１２の表面にシード層が設けられ、そのシード層の表面に突起状電極１３が設けられている。
　半導体チップ１の突起状電極４は、半導体基板１１の突起状電極１３に、半田接合部７によって電気的および機械的に接続されている。半田接合部７と突起状電極４との間、および半田接合部７と突起状電極１３との間は、固液拡散反応によって強固に接合されている。
　複数の半田接合部７は、高さにばらつきがある。実施の形態１では、半導体チップ１の最外郭において、半導体チップ１と半導体基板１１との間の間隔が最大（図１中のＡ）となる場合について説明する。この場合、半導体チップ１の最外郭の近傍に配置されている突起状電極４に接合する半田接合部７ａが、最大の高さを持つ。なお、半導体チップ１の中央において、半導体チップ１と半導体基板１１との間の間隔が最大であってもよい。その場合、半導体チップ１の中央またはその中央の近傍に配置された突起状電極４に接合する半田接合部７が、最大の高さを持つ。これは、後述する実施の形態２および３においても同様である。
　最大の高さを持つ半田接合部７ａには、垂直方向の中央に、断面積が小さくなる括れ部１６が形成されている。なお、実施の形態１においては、半導体チップ１の中央部近傍に位置する半田接合部７の形状は、樽状になる。
　最大の高さを持つ半田接合部７ａは、空孔８の含有率が最も大きい。これは、最大の高さを持つ半田接合部７ａに、断面積が小さくなる括れ部１６が形成されているためである。
　高さが最大の半田接合部７ａは、フリップチップ実装工程における半田溶融後の冷却過程で熱応力が最も集中する位置に配置される。実施の形態１では、矩形状の半導体チップ１の外形の隣接する辺同士が交わる４つのコーナーそれぞれの近傍に位置する半田接合部７に熱応力が集中する場合について説明する。半導体チップ１のコーナー近傍に位置する半田接合部７は、半導体チップ１の最外郭近傍に位置する半田接合部７ａでもある。したがって、半導体チップ１の最外郭近傍に位置する高さが最大の半田接合部７ａに、熱応力が最も集中する。このように半導体チップ１と半導体基板１１との間の間隔が最大の半導体チップ１の最外郭近傍に位置する半田接合部７ａが、最も大きな熱応力を受ける。一方で、その最も大きな熱応力を受ける半田接合部７ａは、断面積が小さくなる括れ部１６を持つことにより、空孔８の含有率が最大であるため、半田の割合が少ない。このため、高さが最大の半田接合部７ａが、引張応力を受けると、半田部分への応力集中が増し、応力集中点が脆弱な膜の多層配線層２から半田接合部７ａへ移る。しかし、前述のように半田接合部７ａは空孔８の含有率が大きく、よって半田接合部７ａの伸び率は大きい。また、半田接合部７ａは、突起状電極４および突起状電極１３に強固に接合されている。したがって、大きな熱応力を受けても、半田接合部７ａは破損することなく伸びる。以上のことから、最も大きな熱応力を受ける半田接合部が、高い空孔含有率を持つことにより、多層配線層２の脆弱な低誘電率膜の剥離および亀裂を防ぐことが可能となる。
　半田の組成は、例えば、ＳｎＡｇ、ＳｎＡｇＣｕ、ＳｎＺｎ、ＳｎＺｎＢｉ、ＳｎＰｂ、ＳｎＢｉ、ＳｎＡｇＢｉＩｎ、ＳｎＩｎ、Ｉｎ、Ｓｎなどの中から選択することが可能である。半田の組成は、最大間隔Ａの大きさに合わせて、半田の伸び率を考慮して選択するのが好適である。
　例えば、半導体チップ１の電極端子３同士の中心間距離（電極端子３のピッチ）が０．０５ｍｍの場合では、突起状電極４の径は０．０２０ｍｍ～０．０３５ｍｍ、突起状電極４の高さは０．００５ｍｍ～０．０３０ｍｍ、半導体基板１１の突起状電極１３の径は０．０１５ｍｍ～０．０３５ｍｍ、突起状電極１３の高さは０．００２ｍｍ～０．０１０ｍｍ、半田接合部７の径は０．０２ｍｍ～０．０３５ｍｍである。
　半導体チップ１と半導体基板１１との間には、封止樹脂１５が充填されていても構わない。封止樹脂１５が充填されることにより、信頼性がより向上する。
　この半導体装置は、図２Ａ～図２Ｄに示す工程で製造することが可能である。
　半導体チップ１に突起状電極４が形成される際には、まず、ウェーハ内の複数の半導体チップ１の各電極面の全面に、スパッタリング法または蒸着によってシード層が形成された後、感光レジスト層が形成される。次に、突起状電極４が形成される予定の箇所が露光された後、感光レジスト層の洗浄が行われる。この露光および洗浄によって、電極端子３の上の突起状電極４が形成される予定の部分に感光レジスト層の開口部が形成される。次に、ウェーハ形態の複数の半導体チップ１は、電解めっき浴に浸漬される。これにより、電極端子３の上に突起状電極４が形成される。
　次に、突起状電極４の上に、半田部の一例である半田膜６が形成された後、ウェーハ形態の複数の半導体チップ１の各電極面の全面にフラックスが塗布される。次に、ウェーハ形態の複数の半導体チップ１は、リフロー炉で加熱される。これにより半田膜６が溶融し、ドーム状になる。この半田膜６の溶融工程において、半田膜６と突起状電極４とが拡散接合して、半田膜６と突起状電極４との間に合金層５が形成される。
　次に、感光レジスト層が剥離されて、電極端子３の上に、半田膜６で覆われた突起状電極４が形成される（図２Ａを参照）。例えば、シード層の材料にはＴｉ／Ｃｕが用いられ、突起状電極４の材料にはＣｕが用いられ、半田膜６の材料にはＳｎＡｇが用いられる。この場合、合金層５は、Ｃｕ３ＳｎおよびＣｕ６Ｓｎ５からなる。但し、シード層、突起状電極４および半田膜６の材料は、これらに限られない。
　次に、ブレードダイシングまたはレーザダイシングなどの手段により、半導体チップ１が個片化されて、図２Ａに示す状態の半導体チップ１が得られる。
　一方、半導体基板１１の電極端子１２の上には、半導体チップ１と同様に、電解めっきによって突起状電極１３が形成される。突起状電極１３の材料には、例えばＮｉ－Ｐ／Ａｕが用いられる。但し、突起状電極１３の材料は、これに限られない。
　次に、半導体チップ１の突起状電極４と半導体基板１１の突起状電極１３が図２Ａに示すように位置合わせされて、半田膜６を介して突起状電極４が突起状電極１３に当接される。
　次に、半導体チップ１及び半導体基板１１が加熱されて、図２Ｂのように、半導体チップ１が半導体基板１１上に搭載される。例えば、加熱温度：２２０～２４０°Ｃ、加圧時間：０．１秒～６０秒の条件で、半導体チップ１を半導体基板１１に向けて加圧するのが好適である。この工程において、溶融した半田膜６の先端と突起状電極１３とが拡散接合して、合金層１４を有する半田接合部７が形成される。加圧時間が０．１秒未満の場合、半田膜６の先端と突起状電極１３とが拡散接合する面積が微小になり、後述の引き上げ工程（図２Ｃ）で、溶融した半田が引きちぎられる問題が発生する。一方、加圧時間が６０秒を超える場合、半田接合部７の中の合金層の割合が多くなり、残された半田が少なくなるため、後述の引き上げ工程（図２Ｃ）での半田の伸び量が少なくなる。このため、後述する括れ部１６を形成することが困難になる。
　次に、図２Ｃに示す引き上げ工程では、半導体チップ１が半田の融点以上の温度に加熱されて、半導体チップ１の一部分が引きあがられるか、または、半導体チップ１の一部分が、半導体チップ１の他の部分よりも大きく引き上げられる。これにより、半導体チップ１の一部分と半導体基板１１との間の間隔が、半導体チップ１の他の部分と半導体基板１１との間の間隔よりも大きくなり、複数の半田接合部７のうちの少なくとも一部の半田接合部７が、溶融した状態で、半導体基板１１の電極端子１２に対して垂直方向に引き伸ばされて、複数の半田接合部７の高さに、ばらつきが生じる。実施の形態１では、半導体チップ１の外周部が引き上げられるか、または、半導体チップ１の外周部が、半導体チップ１の中央部よりも大きく引き上げられる。これにより、半導体チップ１の外周部と半導体基板１１との間の間隔が、半導体チップ１の中央部と半導体基板１１との間の間隔よりも大きくなり、少なくとも半導体チップ１の外周部に設けられている突起状電極４に接合する半田接合部７が、溶融した状態で、半導体基板１１の電極端子１２に対して垂直方向に引き伸ばされる。この後、冷却により半田接合部７は凝固する。
　図２Ｃに示す引き上げ工程を実現するには、内部配線層の線膨張係数の違いによって大きな反り（熱時反り）が発生する半導体チップ１を用い、半田が溶融した状態で半導体チップ１を解放することにより、半導体チップ１に反り（熱時反り）を生じさせ、その反りを駆動力とすればよい。
　引き上げの駆動力として半導体チップ１の反りが用いられる場合、半導体チップ１に傾く部分が形成される。実施の形態１では、半導体チップ１の最外郭が半導体基板１１から最も離れるように、半導体チップ１の中央部の近傍から半導体チップ１の最外郭にわたる部分が傾く。その傾いた部分に設けられている突起状電極４に接合する半田接合部７が、溶融した状態で、半導体基板１１の電極端子１２に対して垂直方向に引き伸ばされる。半導体チップ１の最外郭の近傍に配置された突起状電極４に接合する半田接合部７ａが、最も引き伸ばされて、最も高くなる。
　半導体チップ１は、基板上に内部配線層が形成された構造を持つ。このため、半導体チップ１が加熱されると、内部配線層と基板との弾性率および熱膨張係数の違いにより熱応力が発生する。半導体チップ１が薄いほど基材の剛性が下がるため、半導体チップ１は反りやすくなり、上記した駆動力が発揮されやすくなる。例えば、４ｍｍ×４ｍｍの半導体チップ１の反り量を共焦点顕微鏡で測定した結果、半導体チップ１の厚みが０．０２０ｍｍ，０．０６０ｍｍ，０．１５０ｍｍの場合の反り量は、それぞれ０．０２６ｍｍ，０．０１８ｍｍ，０．００７ｍｍであった。したがって、半導体チップ１の反りによる駆動力を十分に発揮するためには、半導体チップ１の厚みは０．０６０ｍｍ以下にすることが望ましい。しかし、半導体チップ１の厚みが０．０２０ｍｍ以下では、脆弱な膜の多層配線層２に応力が作用して、半導体チップ１が破損することがある。ゆえに半導体チップ１の厚さｔは、
　　０．０２０ｍｍ＜ ｔ ≦ ０．０６０ｍｍ
の範囲内が好適である。
　図２Ｃに示す引き上げ工程により、半導体チップ１の最外郭の近傍に位置する半田接合部７ａに括れ部１６が形成される。一方、半導体チップ１の中央部近傍は反りが小さい。反りが小さい部分に位置する半田接合部７の形状は、樽状になる。
　なお、条件によっては、引き上げ工程の際に、引き伸ばされた半田接合部７内に空孔が形成される場合がある。特に、最も引き伸ばされて、最も高くなった半田接合部７内に、空孔は形成されやすい。
　次に、半導体チップ１が実装された半導体基板１１がリフロー炉などの加熱手段によって加熱されて、半田が再溶融され、合金層が成長する。この工程で、合金層５のＣｕ６Ｓｎ５が柱状に大きく成長して、突起状電極１３上の合金層１４にまで届き、（Ｃｕ、Ｎｉ）６Ｓｎ５からなる合金層が形成される。この時、断面積が電極面積よりも小さい半田接合部７の内部に、組織の変態に伴う体積収縮により図２Ｄに示すように空孔８が発生する。最も引き伸ばされた半田接合部７ａは、括れ部１６が最も大きくなるため、断面積が最も小さくなる。よって、最も引き伸ばされた半田接合部７aは、空孔含有率が最も大きくなると同時に、半田の割合が少なくなる。このため、最も引き伸ばされた半田接合部７aは、引張弾性率（ヤング率）が減少して、伸びやすくなる。実施の形態１では、半導体チップ１の最外郭の近傍に位置する半田接合部７ａの空孔含有率が最も大きくなる。
　合金層を成長させる加熱は、真空下あるいは還元ガス下で行っても構わない。真空下あるいは還元ガス下で半田が溶融することにより、半田が溶融している間に生成される酸化膜の量が減る。したがって、合金層の成長を阻害する酸化膜の量が減るので、より容易に合金層の成長を促進することが可能となる。還元ガスには、例えばギ酸、クエン酸などのカルボン酸を用いることが可能である。
　図示しないが、この後、ディスペンサーなどにより半導体チップ１と半導体基板１１との間に封止樹脂が注入され、その注入された封止樹脂が硬化されてもよい。封止樹脂が上記空孔８内に浸透することにより、半田接合部７の引張強度の向上と半田接合部７の低弾性率化の両立が可能となるので、より脆弱な半導体チップ１を使用することが可能となる。さらに、封止樹脂が凸凹を備えた半田接合部７と接着されることになるので、アンカー効果により封止樹脂と半田接合部７との間の界面接着強度が向上し、より過酷な使用環境下においても、半導体装置の高い信頼性を確保することが可能となる。
　この実施の形態１の半導体装置を、断面研磨により断面解析した結果、半導体チップ１の最外郭の近傍に配置されている半田接合部７が、複数個の空孔８を備えていることが確認できた。また、半導体チップ１の外周部に配置されている半田接合部７の空孔含有率が、その外周部よりも内側の半導体チップ１の内周部に配置されている半田接合部７の空孔含有率よりも大きいことが確認できた。また、半導体チップ１の最外郭において、脆弱な低誘電率膜の剥離および亀裂が発生していないことが確認できた。さらに、この実施の形態１の半導体装置を温度サイクル試験（１サイクル：－４０°Ｃ、８５°Ｃ、各３０分）に投入した結果、１０００サイクル後でも安定した接続抵抗が確保されることが確認できた。
　このように、半導体チップ１と半導体基板１１との間の間隔が最も離れている位置またはその位置の近傍に配置される半田接合部７ａが空孔８を備えることにより、脆弱な低誘電率膜（ＵＬＫ膜）が受ける応力が低減され、高い接続信頼性を確保することが可能となる。
　なお、条件によっては、半導体チップ１の中央部に位置する半田接合部が、フリップチップ実装工程における半田溶融後の冷却過程で、最も大きな熱応力を受ける場合がある。この場合は、半導体チップの中央が半導体基板から最も離れるように凸状に反る半導体チップを用いればよい。これは、後述する実施の形態２および３においても同様である。
　　（実施の形態２）
　図３Ａ～図３Ｄはそれぞれ、実施の形態２における半導体装置の製造方法を概念的に示す断面図である。
　実施の形態２では、実施の形態１と異なり、半導体チップ１の電極が、半導体基板１１の電極に、半田部の一例である半田膜６を介して当接する前に、半導体基板１１の電極の、半田膜６が当接する面（当接面）に、凹部１７ａが形成される。その他は実施の形態１と同様であるので、その説明は省略する。
　半導体基板１１に突起状電極１３が形成される前に、中央部が開口された絶縁膜によって電極端子１２（シード層）が覆われる。その後、電解めっきによって突起状電極１３が形成される。絶縁膜の開口径を小さくすると、図３Ａに示すように、絶縁膜の厚みにより突起状電極１３に凹部１７ａが形成される。例えば、電極端子１２が直径０．０２５ｍｍの場合、絶縁膜の開口径は０．０１５ｍｍ、絶縁膜の厚みは０．００１ｍｍ～０．００２ｍｍとするのが好適である。
　次に図３Ｂに示すように、半導体チップ１及び半導体基板１１が加熱され、半導体チップ１が半導体基板１１上へ搭載される。この時、溶融した半田膜６の先端と突起状電極１３とが拡散接合されて、合金層１４を有する半田接合部７が形成される。
　次に、図３Ｃに示すように、半導体チップ１が半田接合部７の融点以上の温度に加熱され、半導体チップ１の最外郭が引き上げられる。実施の形態２では、実施の形態１と同様に、半導体チップ１の最外郭が半導体基板１１から最も離れるように、半導体チップ１の中央部の近傍から半導体チップ１の最外郭にわたる部分が傾く場合を例示する。
　図３Ｃに示す引き上げ工程では、突起状電極１３の凹部１７ａに濡れていた半田が引き上げられる。その引き上げられた半田は、半田の表面張力により、凹部１７ａの周囲の凸部１７ｂ上の半田に集まる。その結果、引き伸ばされた半田接合部７では、凹部１７ａは半田で濡れず、凹部１７ａの周囲の凸部１７ｂが半田で濡れる。このため、引き上げ工程において、半導体チップ１の最外郭近傍に位置する半田接合部７ａ内部に空孔８が形成される。半田部分の断面積が実施の形態１よりも小さくなる。
　次に、半導体チップ１が実装された半導体基板１１がリフロー炉などの加熱手段によって加熱されて、半田が再溶融される。これにより、図３Ｄに示すように、実施の形態１よりも空孔８を多く備えた半田接合部７が形成される。
　より多くの空孔８を備えた半田接合部により、使用環境下での熱応力が緩和され、脆弱膜の破壊を抑制することが可能となる。
　この実施の形態２の半導体装置を、断面研磨により断面解析した結果、半導体チップ１と半導体基板１１との間の間隔が、半導体チップ１の最外郭で最も大きくなり、一つの断面において、半導体チップ１の最外郭近傍に位置する半田接合部７ａが８個の空孔を有することが確認された。また、脆弱な低誘電率膜がＥＬＫ（Extreme Low-k）膜であっても、剥離および亀裂が発生していないことが確認された。さらに、この実施の形態２の半導体装置を温度サイクル試験（１サイクル：－４５°Ｃ、８５°Ｃ、各５分）に投入した結果、１０００サイクル後でも安定した接続抵抗が確保されることが確認できた。
　このように、半導体基板１１の突起状電極１３に凹部１７ａが形成されることによって、より多くの空孔８を半田接合部７内に形成することが可能となり、脆弱な低誘電率膜が受ける応力が低減され、高い接続信頼性が確保できる。
　　（実施の形態３）
　図４Ａ～図４Ｅはそれぞれ、実施の形態３における半導体装置の製造方法を概念的に示す断面図である。
　実施の形態１と実施の形態２では、半導体チップ１の最外郭近傍に位置する半田接合部７ａの長さを、半導体チップ１に反りを発生させてコントロールするとともに、その半田接合部７ａの最小の断面積を、その半田接合部７ａに括れ部１６を形成してコントロールすることにより、半田接合部７ａを低弾性化する場合について説明した。しかし、半導体チップ１の最外郭近傍に位置する半田接合部７ａの長さをコントロールするだけでも、その半田接合部７ａを低弾性化することが可能である。
　この実施の形態３では、実施の形態１と異なり、半導体基板１１の電極端子１２の上に、円弧状の角部を有する突起状電極１３が形成される。したがって、半導体チップ１の突起状電極４が半田膜６を介して当接する半導体基板１１の突起状電極１３の角部が、円弧状１８となっている。その他は実施の形態１と同様であるので、その説明は省略する。
　突起状電極１３は無電解めっきにより形成される。例えば、突起状電極１３の直径は０．０３５ｍｍ、突起状電極１３の厚みは０．０１０ｍｍである。無電解めっきは等方的に成長するため、図４Ａに示すように、突起状電極１３は、角が丸みを帯びた円弧状１８の形状となる。
　次に、図４Ｂに示すように、半田膜６が溶融した状態で半導体チップ１が半導体基板１１上に搭載されて、突起状電極１３上に合金層１４が形成される。このとき、図４Ｂに示すように、突起状電極１３の丸みを帯びた円弧状１８の形状に沿って半田が濡れ広がる。
　次に、図４Ｃに示すように、半田接合部７が溶融した状態で半導体チップ１の最外郭が引き上げられた後、半田の凝固点まで冷却されて半田接合部７は凝固する。実施の形態３では、実施の形態１と同様に、半導体チップ１の最外郭が半導体基板１１から最も離れるように、半導体チップ１の中央部の近傍から半導体チップ１の最外郭にわたる部分が傾く場合を例示する。
　図４Ｃに示す引き上げ工程では、引き伸ばされた半田接合部７ａ内に空孔８が形成される。これは、突起状電極１３の丸みを帯びた円弧状１８の形状に沿って半田が濡れ広がっている分だけ、上下の突起状電極４、１３の頂面同士の間に存在する半田の量が、実施の形態１、２よりも減っているためである。
　次に、半導体チップ１と半導体基板１１からなる実装体がリフロー炉に投入されて、半田接合部７が再溶融される。これにより、図４Ｄに示すように突起状電極１３の丸みを帯びた円弧状１８の形状に沿って更に半田が濡れ広がる。このように突起状電極１３の外面の丸みを帯びた形状に半田が濡れ広がるため、半田の再溶融時に、上下の突起状電極４、１３の頂面同士の間に存在する半田の体積が、実施の形態１，２の場合よりも減る。このため、時間が経過すると、図４Ｅに示すように、半導体チップ１の最外郭近傍に位置する半田接合部７ａには、実施の形態１，２よりも、更に多くの空孔８が形成される。その結果、高さが最大の半田接合部７ａは、低弾性になる。よって、既知のバンプでは熱応力が大きくなり脆弱誘電膜の適用が困難であった大型の半導体チップに対しても、熱応力の緩和が可能となり、脆弱誘電膜を適用することが可能となる。
　なお、実施の形態３に実施の形態２を組み合わせることが可能である。
　上記の各実施の形態１～３では、半導体チップ１が半導体基板１１に実装される場合を例示して説明した。しかし、本発明は、その例に限られない。コンデンサ、コイル、抵抗などの受動部品が実装された電極端子のピッチが狭い電気部品に本発明を適用しても、上記の各実施の形態１～３と同様の効果が得られる。また、上記の各実施の形態１～３では、ウェーハ形態の半導体チップを例示して説明した。しかし、本発明は、その例に限られない。半導体チップがプリント配線基板に実装されてなるパッケージを用いたとしても、あるいは、長方形または正方形の外形となるように個片化された半導体チップを始めから用いたとしても、上記の各実施の形態１～３と同様の効果が得られる。また、半導体基板１１の表面または内部に、電子回路や半導体回路が構成されていてもよい。したがって、半導体基板１１は、半導体チップであってもよい。
　本発明は、狭ピッチ化が進展する半導体チップや、低誘電率材料などからなる層間絶縁膜を有する半導体チップなどを実装する実装分野において特に有用である。

Claims (13)

  1. 　複数の突起状電極を有した半導体チップが半導体基板に実装されてなる半導体装置を製造する半導体装置製造方法において、
    　前記半導体チップの前記複数の突起状電極が、前記半導体基板に形成されている複数の電極に、複数の半田部を介して当接した状態で、前記複数の半田部を溶融させて、前記半導体チップの前記複数の突起状電極と前記半導体基板の前記複数の電極に接合する複数の半田接合部を形成する第１工程と、
    　前記半導体チップの一部分と前記半導体基板との間の間隔を、前記半導体チップの他の部分と前記半導体基板との間の間隔よりも大きくして、前記複数の半田接合部のうちの少なくとも一部の半田接合部を引き伸ばし、前記複数の半田接合部の高さに、ばらつきを生じさせる第２工程と、
    　前記複数の半田接合部のうちの、少なくとも、高さが最大となる半田接合部内に、空孔を形成する第３工程と、
    　前記複数の半田接合部を凝固させて、前記半導体チップの前記複数の突起状電極を前記半導体基板の前記複数の電極に電気的に接続させる第４工程と、
    　を有することを特徴とする半導体装置製造方法。
  2. 　前記第２工程の際に、少なくとも、高さが最大となる半田接合部に、断面積が小さくなった括れ部を形成することを特徴とする請求項１記載の半導体装置製造方法。
  3. 　前記第２工程の際に、前記半導体基板に対して傾く部分を前記半導体チップに形成することを特徴とする請求項２記載の半導体装置製造方法。
  4. 　前記第３工程の際に、前記複数の半田接合部を再溶融させて、前記空孔を形成することを特徴とする請求項３記載の半導体装置製造方法。
  5. 　前記第１工程の前に、前記半導体基板の前記複数の電極に凹部をそれぞれ形成し、
    　前記第２工程の際に、少なくとも、高さが最大となる半田接合部内に、空孔を形成する
    　ことを特徴とする請求項１から請求項４のいずれか１項に記載の半導体装置製造方法。
  6. 　前記第１工程の前に、前記半導体基板に形成されている複数の電極端子上に、円弧状の角部を有する突起状電極をそれぞれ形成して、前記半導体基板の前記複数の電極を形成し、
    　前記第２工程の際に、少なくとも、高さが最大となる半田接合部内に、空孔を形成する
    　ことを特徴とする請求項１から請求項４のいずれか１項に記載の半導体装置製造方法。
  7. 　複数の突起状電極を有した半導体チップが半導体基板に実装されてなる半導体装置において、
    　前記半導体チップの前記複数の突起状電極を前記半導体基板に形成されている複数の電極に電気的に接続させる複数の半田接合部を備え、前記複数の半田接合部の高さにばらつきがあり、少なくとも、高さが最大の半田接合部内に、空孔が形成されている
    　ことを特徴とする半導体装置。
  8. 　前記複数の半田接合部が、空孔の割合が互いに異なる少なくとも２つの半田接合部を含むことを特徴とする請求項７記載の半導体装置。
  9. 　少なくとも、高さが最大の半田接合部が、断面積が小さくなった括れ部を有することを特徴とする請求項８記載の半導体装置。
  10. 　前記半導体チップが、前記半導体基板に対して傾く部分を有することを特徴とする請求項９記載の半導体装置。
  11. 　前記半導体基板の前記複数の電極に凹部がそれぞれ形成されていることを特徴とする請求項７から請求項１０のいずれか１項に記載の半導体装置。
  12. 　前記半導体基板の前記複数の電極が、円弧状の角部を有する突起状電極をそれぞれ含むことを特徴とする請求項７から請求項１０のいずれか１項に記載の半導体装置。
  13. 　前記半導体チップの外周部に設けられた半田接合部内の空孔の割合が、前記外周部よりも内側の前記半導体チップの内周部に設けられた半田接合部内の空孔の割合よりも大きいことを特徴とする請求項７から請求項１０のいずれか１項に記載の半導体装置。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058526A (ja) * 2014-09-09 2016-04-21 富士通株式会社 電子装置及び電子装置の製造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9385098B2 (en) * 2012-11-21 2016-07-05 Nvidia Corporation Variable-size solder bump structures for integrated circuit packaging
US8970026B2 (en) * 2013-02-12 2015-03-03 Freescale Semiconductor, Inc. Methods and structures for reducing stress on die assembly
JP2016225466A (ja) * 2015-05-29 2016-12-28 株式会社東芝 半導体装置および半導体装置の製造方法
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
CN110447094B (zh) * 2017-03-30 2023-12-12 三菱电机株式会社 半导体装置及其制造方法、及电力变换装置
JP7189672B2 (ja) * 2018-04-18 2022-12-14 新光電気工業株式会社 半導体装置及びその製造方法
US10693432B2 (en) * 2018-05-17 2020-06-23 Qualcommm Incorporated Solenoid structure with conductive pillar technology
JP7259942B2 (ja) * 2019-03-29 2023-04-18 株式会社村田製作所 樹脂多層基板、および樹脂多層基板の製造方法
US11101417B2 (en) * 2019-08-06 2021-08-24 X Display Company Technology Limited Structures and methods for electrically connecting printed components
JP2021040012A (ja) * 2019-09-02 2021-03-11 キオクシア株式会社 半導体装置の製造方法
CN114556534A (zh) * 2019-10-17 2022-05-27 三菱电机株式会社 半导体装置及半导体装置的制造方法
US11502056B2 (en) * 2020-07-08 2022-11-15 Taiwan Semiconductor Manufacturing Company, Ltd. Joint structure in semiconductor package and manufacturing method thereof
US11316086B2 (en) 2020-07-10 2022-04-26 X Display Company Technology Limited Printed structures with electrical contact having reflowable polymer core
JP2022183976A (ja) * 2021-05-31 2022-12-13 株式会社村田製作所 電子部品
US20230086180A1 (en) * 2021-09-20 2023-03-23 Intel Corporation Deformable semiconductor device connection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275828A (ja) * 1997-03-31 1998-10-13 Hitachi Ltd 半導体装置の実装構造およびその検査方法
JP2011210773A (ja) * 2010-03-29 2011-10-20 Panasonic Corp 半導体装置の構造および製造方法
JP2011243683A (ja) * 2010-05-17 2011-12-01 Fujitsu Ltd 電子部品の実装方法、電子部品の製造方法および電子部品、電子部品の製造装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS595637A (ja) 1982-07-02 1984-01-12 Hitachi Ltd 半導体素子の実装構造および実装方法
JPH0997791A (ja) 1995-09-27 1997-04-08 Internatl Business Mach Corp <Ibm> バンプ構造、バンプの形成方法、実装接続体
JP3201957B2 (ja) * 1996-06-27 2001-08-27 インターナショナル・ビジネス・マシーンズ・コーポレーション 金属バンプ、金属バンプの製造方法、接続構造体
JPH11214447A (ja) 1998-01-27 1999-08-06 Oki Electric Ind Co Ltd 半導体装置の実装構造及びその実装方法
JP2000269271A (ja) * 1999-03-16 2000-09-29 Toshiba Corp 半導体回路装置およびその製造方法
JP3608536B2 (ja) 2001-08-08 2005-01-12 松下電器産業株式会社 電子部品実装方法
JP2003282617A (ja) 2002-03-25 2003-10-03 Citizen Watch Co Ltd 半導体装置およびその製造方法
JP2004319564A (ja) 2003-04-11 2004-11-11 New Japan Radio Co Ltd 半導体装置の実装方法
JP2005167045A (ja) 2003-12-04 2005-06-23 Mitsubishi Electric Corp 電子部品及びその製造方法
JP2005174981A (ja) 2003-12-08 2005-06-30 Olympus Corp 電子部品の製造方法及び電子部品
JP4220440B2 (ja) 2004-07-01 2009-02-04 Ｔｄｋ株式会社 セラミック素子
JP3905100B2 (ja) 2004-08-13 2007-04-18 株式会社東芝 半導体装置とその製造方法
JP4492330B2 (ja) 2004-12-07 2010-06-30 パナソニック株式会社 電子部品実装構造体およびその製造方法
JP4591399B2 (ja) * 2006-04-03 2010-12-01 パナソニック株式会社 部品接合方法ならびに部品接合構造
JP2009064845A (ja) * 2007-09-05 2009-03-26 Yokogawa Electric Corp 半導体装置の実装方法
US7952207B2 (en) * 2007-12-05 2011-05-31 International Business Machines Corporation Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening
JP5476926B2 (ja) 2009-10-29 2014-04-23 富士通株式会社 半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10275828A (ja) * 1997-03-31 1998-10-13 Hitachi Ltd 半導体装置の実装構造およびその検査方法
JP2011210773A (ja) * 2010-03-29 2011-10-20 Panasonic Corp 半導体装置の構造および製造方法
JP2011243683A (ja) * 2010-05-17 2011-12-01 Fujitsu Ltd 電子部品の実装方法、電子部品の製造方法および電子部品、電子部品の製造装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058526A (ja) * 2014-09-09 2016-04-21 富士通株式会社 電子装置及び電子装置の製造方法

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