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WO2013015551A3 - 반도체 발광부 연결체 - Google Patents

반도체 발광부 연결체 Download PDF

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Publication number
WO2013015551A3
WO2013015551A3 PCT/KR2012/005676 KR2012005676W WO2013015551A3 WO 2013015551 A3 WO2013015551 A3 WO 2013015551A3 KR 2012005676 W KR2012005676 W KR 2012005676W WO 2013015551 A3 WO2013015551 A3 WO 2013015551A3
Authority
WO
WIPO (PCT)
Prior art keywords
emitting unit
light
semiconductor light
connected body
unit connected
Prior art date
Application number
PCT/KR2012/005676
Other languages
English (en)
French (fr)
Other versions
WO2013015551A2 (ko
Inventor
안상정
Original Assignee
An Sang Jeong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by An Sang Jeong filed Critical An Sang Jeong
Priority to CN201280044379.5A priority Critical patent/CN103828078B/zh
Priority to US14/234,709 priority patent/US9324765B2/en
Publication of WO2013015551A2 publication Critical patent/WO2013015551A2/ko
Publication of WO2013015551A3 publication Critical patent/WO2013015551A3/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

본 개시는 그 하부에 전류 공급층이 형성되어 있는 제1 발광부; 그 하부에 제2 발광부 내로 이어져 있는 전류 공급층이 형성되어 있는 제2 발광부; 제1 발광부가 놓이는 도전부와 제2 발광부가 놓이는 도전부를 가지는 연결판; 그리고, 제1 발광부와 제2 발광부를 전기적으로 연결하는 전기적 패스;를 포함하는 것을 특징으로 하는 반도체 발광부 연결체가 제공된다.
PCT/KR2012/005676 2011-07-26 2012-07-17 반도체 발광부 연결체 WO2013015551A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280044379.5A CN103828078B (zh) 2011-07-26 2012-07-17 半导体发光单元连接体
US14/234,709 US9324765B2 (en) 2011-07-26 2012-07-17 Semiconductor light emitting apparatus comprising connecting plate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0074191 2011-07-26
KR1020110074191A KR101303168B1 (ko) 2011-07-26 2011-07-26 반도체 발광부 연결체

Publications (2)

Publication Number Publication Date
WO2013015551A2 WO2013015551A2 (ko) 2013-01-31
WO2013015551A3 true WO2013015551A3 (ko) 2013-03-07

Family

ID=47601612

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/005676 WO2013015551A2 (ko) 2011-07-26 2012-07-17 반도체 발광부 연결체

Country Status (4)

Country Link
US (1) US9324765B2 (ko)
KR (1) KR101303168B1 (ko)
CN (1) CN103828078B (ko)
WO (1) WO2013015551A2 (ko)

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CN102683376A (zh) 2007-01-22 2012-09-19 科锐公司 高压发光体、发光体及照明装置
TWI411143B (en) * 2009-06-26 2013-10-01 Led package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
US12002915B2 (en) 2011-06-24 2024-06-04 Creeled, Inc. Multi-segment monolithic LED chip
US11251348B2 (en) 2011-06-24 2022-02-15 Creeled, Inc. Multi-segment monolithic LED chip
US11160148B2 (en) 2017-06-13 2021-10-26 Ideal Industries Lighting Llc Adaptive area lamp
US11792898B2 (en) 2012-07-01 2023-10-17 Ideal Industries Lighting Llc Enhanced fixtures for area lighting
KR102080778B1 (ko) * 2013-09-11 2020-04-14 엘지이노텍 주식회사 발광 소자 패키지
TWI536608B (zh) * 2013-11-11 2016-06-01 隆達電子股份有限公司 發光二極體結構
CN111490146B (zh) * 2014-11-18 2024-12-06 首尔半导体株式会社 发光装置
US10529696B2 (en) 2016-04-12 2020-01-07 Cree, Inc. High density pixelated LED and devices and methods thereof
US10381534B2 (en) * 2017-07-18 2019-08-13 Lumileds Llc Light emitting device including a lead frame and an insulating material
CN111357124A (zh) * 2017-07-18 2020-06-30 亮锐有限责任公司 包括引线框和绝缘材料的发光器件
EP3662514B1 (en) 2017-08-03 2024-07-17 CreeLED, Inc. High density pixelated-led chips
US10734363B2 (en) 2017-08-03 2020-08-04 Cree, Inc. High density pixelated-LED chips and chip array devices
US10529773B2 (en) 2018-02-14 2020-01-07 Cree, Inc. Solid state lighting devices with opposing emission directions
US10903265B2 (en) 2018-12-21 2021-01-26 Cree, Inc. Pixelated-LED chips and chip array devices, and fabrication methods
US11817526B2 (en) 2019-10-29 2023-11-14 Creeled, Inc. Texturing for high density pixelated-LED chips and chip array devices
US11437548B2 (en) 2020-10-23 2022-09-06 Creeled, Inc. Pixelated-LED chips with inter-pixel underfill materials, and fabrication methods

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Also Published As

Publication number Publication date
KR20130012798A (ko) 2013-02-05
KR101303168B1 (ko) 2013-09-09
US20140175472A1 (en) 2014-06-26
CN103828078B (zh) 2017-05-17
US9324765B2 (en) 2016-04-26
WO2013015551A2 (ko) 2013-01-31
CN103828078A (zh) 2014-05-28

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