WO2012074255A3 - Pcb기판의 유가금속 및 부품 회수장치와 이를 이용한 회수방법 - Google Patents
Pcb기판의 유가금속 및 부품 회수장치와 이를 이용한 회수방법 Download PDFInfo
- Publication number
- WO2012074255A3 WO2012074255A3 PCT/KR2011/009121 KR2011009121W WO2012074255A3 WO 2012074255 A3 WO2012074255 A3 WO 2012074255A3 KR 2011009121 W KR2011009121 W KR 2011009121W WO 2012074255 A3 WO2012074255 A3 WO 2012074255A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- recovering
- pcb substrate
- components
- precious metals
- same
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 239000010970 precious metal Substances 0.000 title abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/02—Obtaining noble metals by dry processes
- C22B11/021—Recovery of noble metals from waste materials
- C22B11/025—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper, or baths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Geology (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Processing Of Solid Wastes (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 PCB기판의 유가금속 및 부품 회수장치에 관한 것으로, 전자부품이 실장된 PCB기판이 고정되고, 외부의 회전동력을 통해 회전하는 회전부; 상기 회전부의 중단에 고정되는 PCB기판을 가열하는 가열부; 및 상기 PCB기판이 고정되는 회전부에 형성되어 이탈된 전자부품과 솔더가 저장되는 회수부;를 포함한다.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100121063A KR101230869B1 (ko) | 2010-12-01 | 2010-12-01 | Pcb기판의 유가금속 및 부품 회수장치와 이를 이용한 회수방법 |
KR10-2010-0121063 | 2010-12-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012074255A2 WO2012074255A2 (ko) | 2012-06-07 |
WO2012074255A3 true WO2012074255A3 (ko) | 2012-10-04 |
Family
ID=46172375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/009121 WO2012074255A2 (ko) | 2010-12-01 | 2011-11-28 | Pcb기판의 유가금속 및 부품 회수장치와 이를 이용한 회수방법 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101230869B1 (ko) |
WO (1) | WO2012074255A2 (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101540104B1 (ko) * | 2015-02-24 | 2015-07-30 | (주)대흥엠앤티 | 회전식 금 추출장치 |
KR101691011B1 (ko) | 2016-10-18 | 2016-12-29 | (주)코어메탈 | 철 분리 효율이 향상된 유가금속 회수장치 |
KR101691014B1 (ko) | 2016-10-18 | 2016-12-29 | (주)코어메탈 | 유가금속 회수장치 |
KR102001065B1 (ko) * | 2017-01-13 | 2019-07-17 | 주식회사 이알메탈 | 인쇄회로기판의 부품분리장치 |
KR102265978B1 (ko) | 2019-02-25 | 2021-06-17 | 주식회사 신화전자 | 열을 가하지 않고 분석용 칩을 분리하는 시스템 및 그 작동 방법 |
KR102106831B1 (ko) | 2020-02-24 | 2020-05-06 | (주)대룡에이치앤씨 | 폐pcb의 유가금속 분리 및 추출 회수장치 |
CN111346900B (zh) * | 2020-03-12 | 2021-03-12 | 武汉亿特智微科技有限公司 | 一种电子贴片pcb板电器元件利用加工方法 |
KR102540080B1 (ko) | 2023-02-10 | 2023-06-05 | (주)코어메탈 | 철분리효율이 향상된 폐금속 회수장치 |
KR102540077B1 (ko) | 2023-02-10 | 2023-06-05 | (주)코어메탈 | 단계 분쇄방식을 이용한 폐금속 회수장치 |
KR20240158669A (ko) | 2023-04-27 | 2024-11-05 | 이용이 | 유가금속의 분리 및 추출기능을 갖는 폐pcb기판용 선별추출장치 |
KR20240158674A (ko) | 2023-04-27 | 2024-11-05 | 이용이 | 하우징 회동분쇄구조를 갖는 폐pcb기판용 선별추출장치 |
KR20250037082A (ko) | 2023-09-08 | 2025-03-17 | 주식회사 엘에프테크 | 하우징 회동분쇄구조를 갖는 폐pcb기판용 선별추출장치 |
KR20250037076A (ko) | 2023-09-08 | 2025-03-17 | 주식회사 엘에프테크 | 유가금속의 분리 및 추출기능을 갖는 폐pcb기판용 선별추출장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08148823A (ja) * | 1994-11-16 | 1996-06-07 | Senju Metal Ind Co Ltd | プリント基板から有価物を回収する方法及びその装置 |
JPH08274462A (ja) * | 1995-03-31 | 1996-10-18 | Sony Corp | 低温溶融物回収装置 |
JPH1161287A (ja) * | 1997-08-25 | 1999-03-05 | Hitachi Ltd | 廃プリント回路のはんだ分離装置 |
JP2000288509A (ja) * | 1999-04-09 | 2000-10-17 | Matsushita Electric Ind Co Ltd | 回路基板の処理方法と処理装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100226228B1 (ko) * | 1997-06-30 | 1999-10-15 | 임지수 | Pcb 리사이클링 장치 및 그 방법 |
-
2010
- 2010-12-01 KR KR1020100121063A patent/KR101230869B1/ko active Active
-
2011
- 2011-11-28 WO PCT/KR2011/009121 patent/WO2012074255A2/ko active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08148823A (ja) * | 1994-11-16 | 1996-06-07 | Senju Metal Ind Co Ltd | プリント基板から有価物を回収する方法及びその装置 |
JPH08274462A (ja) * | 1995-03-31 | 1996-10-18 | Sony Corp | 低温溶融物回収装置 |
JPH1161287A (ja) * | 1997-08-25 | 1999-03-05 | Hitachi Ltd | 廃プリント回路のはんだ分離装置 |
JP2000288509A (ja) * | 1999-04-09 | 2000-10-17 | Matsushita Electric Ind Co Ltd | 回路基板の処理方法と処理装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20120059682A (ko) | 2012-06-11 |
KR101230869B1 (ko) | 2013-02-07 |
WO2012074255A2 (ko) | 2012-06-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2012074255A3 (ko) | Pcb기판의 유가금속 및 부품 회수장치와 이를 이용한 회수방법 | |
WO2012024603A3 (en) | Sustainable process for reclaiming precious metals and base metals from e-waste | |
EP2319947A4 (en) | COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME | |
WO2012094436A3 (en) | Electronic components on paper-based substrates | |
GB201206394D0 (en) | Substrate cooling device, sputtering device, and method for producing an electronic device | |
IN2014KN01462A (ko) | ||
IL210241A0 (en) | Metal-containing composition, process for producing electric contact structures on electronic components and also electronic component | |
EP2412775A4 (en) | SOFT BRAZING ADHESIVE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE COMPRISING THE SAME | |
WO2011009022A3 (en) | Method and apparatus of heat dissipaters for electronic components in downhole tools | |
EP2548685B8 (de) | Lot zum Hochtemperaturlöten und Verfahren zum Reparieren bzw. Herstellen von Bauteilen unter Verwendung dieses Lotes | |
EP2479314A4 (en) | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | |
EP2594997A4 (en) | CONDUCTIVE ELEMENT FOR ELECTRONIC PHOTOGRAPHY, PROCESS CARTRIDGE AND DEVICE FOR ELECTRONIC PHOTOGRAPHY | |
WO2008049006A3 (en) | Materials for use with interconnects of electrical devices and related methods | |
EP2248921A4 (en) | COPPER ALLOY MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING COPPER ALLOY MATERIAL | |
WO2011159417A3 (en) | Thermal interface material assemblies, and related methods | |
EP2260968A4 (en) | MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR TIN OR SOLDERING ALLOY | |
EP2324689A4 (en) | HULL FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING HULL, AND ELECTRONIC DEVICE HAVING HULL | |
WO2014018718A3 (en) | Housing and method to control solder creep on housing | |
EP2182093A4 (en) | METALLIC MATERIAL, METHOD FOR PRODUCING THE SAME, AND ELECTRIC-ELECTRONIC COMPONENT USING THE SAME | |
WO2013083295A8 (de) | Lötverfahren und entsprechende löteinrichtung | |
EP2980048A4 (en) | DEVICE AND METHOD FOR PRODUCING A COATING FOR METAL OR CERAMIC PLATES AND DEVICE AND METHOD FOR PRODUCING A SUBSTRATE FOR POWER MODULES | |
MY166465A (en) | Surface treating composition for copper and copper alloy and utilization thereof | |
EP2270242A4 (en) | COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC DEVICES AND ELECTRICAL AND ELECTRONIC COMPONENTS | |
MY166771A (en) | Surface treating composition for copper and copper alloy and utilization thereof | |
EP3012333A4 (en) | Method of recovering metal from waste electronic substrates |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11845814 Country of ref document: EP Kind code of ref document: A2 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11845814 Country of ref document: EP Kind code of ref document: A2 |