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WO2012055206A1 - Alumina/graphite composite ceramic material and led light source utilizing the material as substrate - Google Patents

Alumina/graphite composite ceramic material and led light source utilizing the material as substrate Download PDF

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Publication number
WO2012055206A1
WO2012055206A1 PCT/CN2011/072318 CN2011072318W WO2012055206A1 WO 2012055206 A1 WO2012055206 A1 WO 2012055206A1 CN 2011072318 W CN2011072318 W CN 2011072318W WO 2012055206 A1 WO2012055206 A1 WO 2012055206A1
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Prior art keywords
alumina
substrate
powder
light source
graphite
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PCT/CN2011/072318
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French (fr)
Chinese (zh)
Inventor
余建平
Original Assignee
Yu Jianping
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Publication date
Priority claimed from CN 201010522341 external-priority patent/CN102030518B/en
Priority claimed from CN2010105223455A external-priority patent/CN101968191A/en
Application filed by Yu Jianping filed Critical Yu Jianping
Publication of WO2012055206A1 publication Critical patent/WO2012055206A1/en

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    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
    • C04B35/117—Composites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
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    • H10H20/8581—Means for heat extraction or cooling characterised by their material
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
    • C04B2235/3215—Barium oxides or oxide-forming salts thereof
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3427—Silicates other than clay, e.g. water glass
    • C04B2235/3436—Alkaline earth metal silicates, e.g. barium silicate
    • C04B2235/3454—Calcium silicates, e.g. wollastonite
    • C—CHEMISTRY; METALLURGY
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/349—Clays, e.g. bentonites, smectites such as montmorillonite, vermiculites or kaolines, e.g. illite, talc or sepiolite
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/42—Non metallic elements added as constituents or additives, e.g. sulfur, phosphor, selenium or tellurium
    • C04B2235/422—Carbon
    • C04B2235/425—Graphite
    • C—CHEMISTRY; METALLURGY
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/44—Metal salt constituents or additives chosen for the nature of the anions, e.g. hydrides or acetylacetonate
    • C04B2235/442—Carbonates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the invention relates to the field of lighting equipment, in particular to a novel LED light source using graphite/ceramic as a substrate.
  • LED light source is widely used in the field of lighting equipment. Due to its low cost, long life and low power consumption, it has a good development prospect and its application field is expanding. Generally, LED light source packages require LED chips, LED brackets, gold wires, phosphors and lenses.
  • the package glue and other components form a package structure, and the top of the package internal structure is encapsulated with epoxy resin or encapsulant glue.
  • the function of the optical lens is to collect the light emitted by the side of the die and the interface, and emit it in a desired direction angle, the top ring
  • the oxygen resin is shaped to protect the die from external corrosion; the shape and material properties are used to function as a lens or a diffusing lens to control the divergence angle of the light; after the LED is packaged, it is also required to be fixedly attached to the aluminum substrate and
  • the heat sink LED chip light source can work normally.
  • the structure of the package and the heat dissipation structure determine the LED service life and the light-emitting effect.
  • the traditional LED package parts are independent of each other, and must be processed and assembled to form a whole. It is quite complicated and requires a lot of raw materials. The finished product is not only bulky but also heavy in quality.
  • the LED lighting product itself is an environmentally friendly product that emphasizes energy saving and emission reduction. If the product itself requires a large amount of raw materials, it is not a perfect low-consumption product, especially the radiator part of the LED light source, which requires a large amount of Metal raw materials are not conducive to the development of the LED industry in the era of severe shortage of earth resources.
  • the heat dissipation is generally the use of metal plate heat dissipation, using an aluminum substrate, and adding a few ceramics under the aluminum substrate as needed. Or the pad of other materials, but the thermal conductivity of the metal substrate is good, and it has always been a relatively common heat dissipating medium material.
  • the problem to be solved is to develop a new material that is more suitable for the characteristics of the LED light source to make a heat-dissipating package structure, to simplify the structure, to make the volume smaller and more compact, to save materials and to be environmentally friendly, to simplify the production process and maximize the production efficiency.
  • the invention provides an alumina/graphite composite ceramic material with high thermal conductivity and excellent thermal conductivity in order to solve the above problems, and according to the material characteristics, a production material with simple structure, direct heat dissipation and large saving is designed. And time LED light source.
  • an alumina/graphite composite ceramic material including an alumina ceramic material and a graphite powder, wherein: the mass ratio of the alumina ceramic material to the graphite powder is 100:5 ⁇ 100: 15;
  • the alumina ceramic material comprises alumina powder, talc powder, wollastonite powder and barium carbonate powder according to a mass ratio of 100:10 ⁇ 20:10 ⁇ 20:1 ⁇ 5.
  • An LED light source using the alumina/graphite composite ceramic according to claim 1 as a substrate comprising a heat dissipation substrate, a metal wire printed on the heat dissipation substrate, an LED chip packaged on the heat dissipation substrate, a phosphor, and an optical lens, wherein
  • the heat dissipation substrate is the alumina/graphite composite ceramic substrate, and the metal conductive layer is printed on the composite ceramic substrate, and the LED chip is directly fixed on the ceramic substrate, and the anode and cathode electrodes of the LED chip are respectively printed on the metal conductive layer printed on the composite ceramic substrate. Connected.
  • the protective glaze can protect the circuit from the external environment and oxidize, and can utilize the reflective properties of the nano ceramic glaze to improve the light source effect and the self-cleaning function of the light source surface. It can shape the protective layer on the light source surface and improve the light effect, ensuring the self-cleaning function of the light source surface.
  • the optical lens is formed by using transparent silica water to solidify on the outer surface of the LED chip and the phosphor mixed rubber to form a convex lens.
  • the metal wires on the ceramic substrate are silver wires, and the gold wires on the P/N junction of the LED chip are respectively connected to the silver wires on the ceramic substrate.
  • the invention has the beneficial effects that the alumina/graphite material of the invention has a simple manufacturing method but has excellent heat conduction and heat dissipation effect, and the LED chip is directly packaged on the ceramic substrate, which utilizes the alumina/graphite ceramic material to be super good.
  • the heat dissipation performance completely omits the complicated structure such as heat sink and aluminum substrate, directly causes the ceramic substrate to contact with the outside world to dissipate heat, and the heat dissipation effect is direct and rapid.
  • Such a light source structure is greatly simplified, the cost is reduced, the material requirements and losses are also And reduce.
  • the components of the LED light source are relatively independent and integrated into a module integrating package, light distribution, heat dissipation and circuit wiring.
  • Figure 1 is a block diagram showing an embodiment of the present invention.
  • LED chip In the figure: 1, LED chip; 2, optical lens; 3, ceramic substrate; 4, gold wire; 5, phosphor; 6, metal wire layer; 7, silver wire.
  • An alumina/graphite composite ceramic material comprising an alumina ceramic material and a graphite powder, wherein: the mass ratio of the alumina ceramic material to the graphite powder is 100:5 ⁇ 100:15; the alumina ceramic material comprises Alumina powder, talc powder, wollastonite powder and barium carbonate powder are mixed according to the mass ratio of 100:10 ⁇ 20:10 ⁇ 20:1 ⁇ 5.
  • the preparation method of the alumina/graphite composite ceramic material comprises the steps of preparing graphite powder, preparing alumina ceramic material, preparing composite powder, and sintering alumina/graphite composite ceramic material, wherein each step is performed in a specific manner as follows:
  • alumina ceramic material Preparation of alumina ceramic material: the alumina powder, talc powder, wollastonite powder and barium carbonate powder are mixed and weighed according to the mass ratio of 100:15:20:3, and the quality of the alumina powder is also mixed and added. 1.5% by mass of polyvinyl alcohol;
  • the dispersing agent is sodium dodecylsulfonate, cetyltrimethylammonium bromide, sodium hexadecylbenzenesulfonate.
  • a special LED new light source designed for the characteristics of this alumina/graphite composite ceramic including a heat dissipation substrate, a metal wire 6 printed on the heat dissipation substrate, an LED chip 1 mounted on the heat dissipation substrate, a phosphor 5, and an optical
  • the lens 2 the heat dissipating substrate is the alumina/graphite composite ceramic substrate 3
  • the metal wiring layer 6 is printed on the composite ceramic substrate 3
  • the LED chip is directly fixed on the ceramic substrate, and the anode and cathode of the LED chip are respectively printed and printed.
  • the metal conductive layers of the composite ceramic substrate are connected.
  • the optical lens 2 is formed by using transparent silicone water to cure the outer surface of the LED chip and the phosphor mixed rubber to form a convex lens.
  • the metal wires 6 of the metal wiring layers on the ceramic substrate 3 are silver wires 7, and the gold wires 4 are connected to the silver wires 7 on the ceramic substrate from the P/N junctions of the LED chips, respectively.
  • An alumina/graphite composite ceramic material and a preparation method thereof comprising the preparation of graphite powder, the preparation of alumina ceramic material, the preparation of composite powder, and the sintering of alumina/graphite composite ceramic material, wherein each step
  • the specific method is as follows:
  • alumina ceramic material Preparation of alumina ceramic material: the alumina powder, talc powder, wollastonite powder and strontium carbonate powder are mixed and weighed according to the mass ratio of 100:10:10:1, and the quality of the alumina powder is also mixed and added. 0.5% by mass of polyvinyl alcohol;
  • the dispersing agent is sodium dodecylsulfonate, cetyltrimethylammonium bromide, sodium hexadecylbenzenesulfonate.
  • alumina ceramic material Preparation of alumina ceramic material: The alumina powder, talc powder, wollastonite powder and barium carbonate powder are mixed and weighed according to the mass ratio of 100:20:15:5, and the mass of alumina powder is also mixed and added. 0.1% by weight of polyvinyl alcohol;
  • the dispersing agent is sodium dodecylsulfonate, cetyltrimethylammonium bromide, sodium hexadecylbenzenesulfonate.
  • the performance of the alumina/graphite composite ceramic material obtained in the embodiment 2 was the same as that in the first embodiment, so that the LED light source of the ceramic substrate could be produced by the same structure.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)

Abstract

An alumina/graphite composite ceramic material comprises alumina ceramic material and graphite powder, wherein the mass ratio of alumina ceramic material and graphite powder is 100:5~100:15, and the alumina ceramic material comprises alumina powder, talcum powder, wollastonite powder, and barium carbonate powder at the mass ratio of 100:10~20:10~20:1~5. An LED light source utilizing the alumina/graphite composite ceramic material as substrate comprises a heat-dissipating substrate, metal wirings (6) printed on the heat-dissipating substrate, an LED chip (1) packaged on the heat-dissipating substrate, fluorescent powder (5) and an optical lens (2), wherein the heat-dissipating substrate is an alumina/graphite composite ceramic substrate (3), metal conductive layers (6) are printed on the composite ceramic substrate (3), and the LED chip (1) is directly mounted on the composite ceramic substrate (3).

Description

氧化铝/石墨复合陶瓷材料和采用该材料为基板的LED光源  Alumina/graphite composite ceramic material and LED light source using the material as substrate 技术领域Technical field

本发明涉及照明设备领域，尤其涉及一种采用石墨/陶瓷为基板的LED新型光源。The invention relates to the field of lighting equipment, in particular to a novel LED light source using graphite/ceramic as a substrate.

背景技术Background technique

LED光源广泛应用于照明设备领域，因其造价便宜、寿命长、功耗低等特点发展前景良好，运用领域不断扩展，一般LED光源封装都需要LED芯片、LED支架，金线、荧光粉、透镜，封装胶水等部件组成封装结构，封装内部结构顶部用环氧树脂或者封装胶水包封，光学透镜的作用是收集管芯侧面、界面折射发出的光，向期望的方向角内发射，顶部的环氧树脂做成一定形状，保护管芯不受外界侵蚀；采用不同的形状和材料性质，起透镜或漫射透镜功能，控制光的发散角；LED封装好后，还需固定附着在铝基板和散热器LED芯片光源才能正常工作，封装结构和散热结构的好坏决定了LED的使用寿命和发光效果等指标，传统LED封装各部分彼此独立，必须还要通过加工组装才能形成一个整体，工艺流程相当的复杂，而且需要的原材料也多，做成的成品不但体积大，质量重，面且成本也很高；LED照明产品本身就是强调节能减排的环保产品，如果产品本身就需要耗费大量的原材料，则并非完美的低耗产品，尤其是LED光源的散热器部分，需要大量的金属原材料，在现地球资源严重紧缺的年代，不利于LED产业的发展。LED light source is widely used in the field of lighting equipment. Due to its low cost, long life and low power consumption, it has a good development prospect and its application field is expanding. Generally, LED light source packages require LED chips, LED brackets, gold wires, phosphors and lenses. The package glue and other components form a package structure, and the top of the package internal structure is encapsulated with epoxy resin or encapsulant glue. The function of the optical lens is to collect the light emitted by the side of the die and the interface, and emit it in a desired direction angle, the top ring The oxygen resin is shaped to protect the die from external corrosion; the shape and material properties are used to function as a lens or a diffusing lens to control the divergence angle of the light; after the LED is packaged, it is also required to be fixedly attached to the aluminum substrate and The heat sink LED chip light source can work normally. The structure of the package and the heat dissipation structure determine the LED service life and the light-emitting effect. The traditional LED package parts are independent of each other, and must be processed and assembled to form a whole. It is quite complicated and requires a lot of raw materials. The finished product is not only bulky but also heavy in quality. The LED lighting product itself is an environmentally friendly product that emphasizes energy saving and emission reduction. If the product itself requires a large amount of raw materials, it is not a perfect low-consumption product, especially the radiator part of the LED light source, which requires a large amount of Metal raw materials are not conducive to the development of the LED industry in the era of severe shortage of earth resources.

在LED整个发展过程中，一直在追求散热最佳方式和延长使用寿命和提高光通量，目前散热都是一般是采用金属板散热，使用铝基板，在铝基板之下还会根据需要加几块陶瓷或其他材料的垫板，但是金属基板的导热性较好，一直就是比较常见的散热介质材料。In the whole development process of LED, it has been pursuing the best way of heat dissipation and prolonging the service life and increasing the luminous flux. At present, the heat dissipation is generally the use of metal plate heat dissipation, using an aluminum substrate, and adding a few ceramics under the aluminum substrate as needed. Or the pad of other materials, but the thermal conductivity of the metal substrate is good, and it has always been a relatively common heat dissipating medium material.

亟待解决的问题是研发出新的更适合LED光源特性的材料做散热封装结构，精简结构使其体积更加小巧精致，节约材料做到环保，将生产工艺简单化最大限度提高生产效率。The problem to be solved is to develop a new material that is more suitable for the characteristics of the LED light source to make a heat-dissipating package structure, to simplify the structure, to make the volume smaller and more compact, to save materials and to be environmentally friendly, to simplify the production process and maximize the production efficiency.

技术问题technical problem

本发明为解决上述问题而提供了一种导热系数高、导热性能优良的氧化铝/石墨复合陶瓷材料，并且以根据该材料特性专门设计了一款结构简单、散热直接有效，大幅节约的生产原料和时间的LED光源。 The invention provides an alumina/graphite composite ceramic material with high thermal conductivity and excellent thermal conductivity in order to solve the above problems, and according to the material characteristics, a production material with simple structure, direct heat dissipation and large saving is designed. And time LED light source.

技术解决方案Technical solution

本发明解决上述问题的技术方案是：一种氧化铝/石墨复合陶瓷材料，包括氧化铝陶瓷料和石墨粉，其中：所述的氧化铝陶瓷料与石墨粉的质量比100:5~100:15；所述的氧化铝陶瓷料包括氧化铝粉、滑石粉、硅灰石粉、碳酸钡粉按质量比100：10~20：10~20：1~5进行配比。The technical solution to solve the above problems is: an alumina/graphite composite ceramic material, including an alumina ceramic material and a graphite powder, wherein: the mass ratio of the alumina ceramic material to the graphite powder is 100:5~100: 15; The alumina ceramic material comprises alumina powder, talc powder, wollastonite powder and barium carbonate powder according to a mass ratio of 100:10~20:10~20:1~5.

采用权利要求1所述氧化铝/石墨复合陶瓷为基板的LED光源，包括散热基板、印刷在散热基板上的金属导线、封装在散热基板上的LED芯片、荧光粉和光学透镜，其中，所述散热基板为所述氧化铝/石墨复合陶瓷基板、在复合陶瓷基板印刷有金属导电层，同时LED芯片直接固定在所述陶瓷基板，LED芯片的阴阳两极分别与印刷在复合陶瓷基板的金属导电层相连。An LED light source using the alumina/graphite composite ceramic according to claim 1 as a substrate, comprising a heat dissipation substrate, a metal wire printed on the heat dissipation substrate, an LED chip packaged on the heat dissipation substrate, a phosphor, and an optical lens, wherein The heat dissipation substrate is the alumina/graphite composite ceramic substrate, and the metal conductive layer is printed on the composite ceramic substrate, and the LED chip is directly fixed on the ceramic substrate, and the anode and cathode electrodes of the LED chip are respectively printed on the metal conductive layer printed on the composite ceramic substrate. Connected.

在所述基板安装LED芯片的光源面上涂覆纳米陶瓷釉，将所述纳米陶瓷釉均匀喷涂在光源面上，然后经过T≤150℃的温度烤制形成具有反光特性能提高光源能效的保护釉面。这种保护釉面能保护其电路不受外界环境的侵蚀和氧化，而且能利用纳米陶瓷釉的反光特性提高光源光效，光源面的自洁净功能。能在光源面上形保护层和提高光效，保证光源面的自洁净功能。Coating a nano ceramic glaze on the surface of the substrate on which the LED chip is mounted, uniformly spraying the nano ceramic glaze on the surface of the light source, and then baking at a temperature of T ≤ 150 ° C to form a reflective product with improved performance and energy efficiency Glazed. The protective glaze can protect the circuit from the external environment and oxidize, and can utilize the reflective properties of the nano ceramic glaze to improve the light source effect and the self-cleaning function of the light source surface. It can shape the protective layer on the light source surface and improve the light effect, ensuring the self-cleaning function of the light source surface.

所述光学透镜是采用透明硅胶水在所述LED芯片与荧光粉混合胶外表面固化，形成凸透镜的形状。 The optical lens is formed by using transparent silica water to solidify on the outer surface of the LED chip and the phosphor mixed rubber to form a convex lens.

在所述陶瓷基板上的金属导线是银导线，而从LED芯片的P/N结上分别有金线连接到陶瓷基板上的银导线。The metal wires on the ceramic substrate are silver wires, and the gold wires on the P/N junction of the LED chip are respectively connected to the silver wires on the ceramic substrate.

有益效果 Beneficial effect

本发明的有益效果是：本发明所述的氧化铝/石墨材料制作方式简单，却具有优良的导热散热效果，将LED芯片直接封装在陶瓷基板上，就是利用了氧化铝/石墨陶瓷材料超好的散热性能，完全省略了热沉、铝基板等复杂结构，直接让陶瓷基板与外界接触散热，其散热效果直接而迅速，这样的光源结构大大简化，成本降低、对材料的要求和损耗也一并减少。而且将LED光源相对独立的各个部件集成为一个集封装、配光、散热、电路布线为一体模块的结构。The invention has the beneficial effects that the alumina/graphite material of the invention has a simple manufacturing method but has excellent heat conduction and heat dissipation effect, and the LED chip is directly packaged on the ceramic substrate, which utilizes the alumina/graphite ceramic material to be super good. The heat dissipation performance completely omits the complicated structure such as heat sink and aluminum substrate, directly causes the ceramic substrate to contact with the outside world to dissipate heat, and the heat dissipation effect is direct and rapid. Such a light source structure is greatly simplified, the cost is reduced, the material requirements and losses are also And reduce. Moreover, the components of the LED light source are relatively independent and integrated into a module integrating package, light distribution, heat dissipation and circuit wiring.

附图说明DRAWINGS

图1是本发明一实施例结构示意图。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a block diagram showing an embodiment of the present invention.

图中：1、LED芯片；2、光学透镜；3、陶瓷基板；4、金线；5、荧光粉；6、金属导线层；7、银导线。In the figure: 1, LED chip; 2, optical lens; 3, ceramic substrate; 4, gold wire; 5, phosphor; 6, metal wire layer; 7, silver wire.

本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION

为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

实施例1：Example 1:

一种氧化铝/石墨复合陶瓷材料，包括氧化铝陶瓷料和石墨粉，其中：所述的氧化铝陶瓷料与石墨粉的质量比100:5~100:15；所述的氧化铝陶瓷料包括氧化铝粉、滑石粉、硅灰石粉、碳酸钡粉按质量比100：10~20：10~20：1~5进行配比。An alumina/graphite composite ceramic material, comprising an alumina ceramic material and a graphite powder, wherein: the mass ratio of the alumina ceramic material to the graphite powder is 100:5~100:15; the alumina ceramic material comprises Alumina powder, talc powder, wollastonite powder and barium carbonate powder are mixed according to the mass ratio of 100:10~20:10~20:1~5.

该氧化铝/石墨复合陶瓷材料的制备方法，包括石墨粉的制备、氧化铝陶瓷料的制备、复合粉料的制备、氧化铝/石墨复合陶瓷材料烧结四个步骤，其中每个步骤的具体方式如下：The preparation method of the alumina/graphite composite ceramic material comprises the steps of preparing graphite powder, preparing alumina ceramic material, preparing composite powder, and sintering alumina/graphite composite ceramic material, wherein each step is performed in a specific manner as follows:

（1）、石墨粉的制备：将500目的石墨和质量为石墨质量的1‰的分散剂混合之后，加入质量为石墨质量的3倍的水中，进行球磨；球磨时间为10~20小时，球磨结束后将石墨粉料烘干待用；(1) Preparation of graphite powder: After mixing 500-mesh graphite and 1 ‰ dispersant of graphite mass, add 3 times of water of graphite mass to perform ball milling; ball milling time is 10-20 hours, ball milling After the end, the graphite powder is dried for use;

（2）氧化铝陶瓷料的制备：将氧化铝粉、滑石粉、硅灰石粉、碳酸钡粉按质量比100：15：20：3称量混合待用，同时还混合加入质量为氧化铝粉质量的1.5%的聚乙烯醇；(2) Preparation of alumina ceramic material: the alumina powder, talc powder, wollastonite powder and barium carbonate powder are mixed and weighed according to the mass ratio of 100:15:20:3, and the quality of the alumina powder is also mixed and added. 1.5% by mass of polyvinyl alcohol;

（3）复合粉料的制备：将所述氧化铝陶瓷料与石墨粉以100:15的质量比混合后，进行球磨，球磨时间为10~20小时；球磨结束后将复合粉料烘干待用；(3) Preparation of composite powder: After mixing the alumina ceramic material and graphite powder at a mass ratio of 100:15, ball milling is performed, and the ball milling time is 10-20 hours; after the ball milling is finished, the composite powder is dried. use;

（4）氧化铝/石墨复合陶瓷材料的烧结：将上述所制得的复合粉料经压制成型后，置于保护惰性气氛环境下以1400~1700℃高温烧结2~3小时，即可得到氧化铝/石墨复合材料。(4) Sintering of alumina/graphite composite ceramic material: After the composite powder prepared above is pressed and formed, it is sintered in a protective inert atmosphere at a high temperature of 1400~1700 ° C for 2 to 3 hours to obtain oxidation. Aluminum/graphite composite.

所述分散剂为十二胺基磺酸钠、十六烷基三甲基溴化胺、十六烷基苯磺酸钠。 The dispersing agent is sodium dodecylsulfonate, cetyltrimethylammonium bromide, sodium hexadecylbenzenesulfonate.

针对这种氧化铝/石墨复合陶瓷的特性，而设计的专门的LED新光源，包括散热基板、印刷在散热基板上的金属导线6、封装在散热基板上的LED芯片1、荧光粉5和光学透镜2，所述散热基板为所述氧化铝/石墨复合陶瓷基板3、在复合陶瓷基板3印刷有金属导线层6，同时LED芯片直接固定在所述陶瓷基板，LED芯片的阴阳两极分别与印刷在复合陶瓷基板的金属导电层相连。A special LED new light source designed for the characteristics of this alumina/graphite composite ceramic, including a heat dissipation substrate, a metal wire 6 printed on the heat dissipation substrate, an LED chip 1 mounted on the heat dissipation substrate, a phosphor 5, and an optical The lens 2, the heat dissipating substrate is the alumina/graphite composite ceramic substrate 3, the metal wiring layer 6 is printed on the composite ceramic substrate 3, and the LED chip is directly fixed on the ceramic substrate, and the anode and cathode of the LED chip are respectively printed and printed. The metal conductive layers of the composite ceramic substrate are connected.

所述光学透镜2是采用透明硅胶水在所述LED芯片与荧光粉混合胶外表面固化，形成凸透镜的形状。 The optical lens 2 is formed by using transparent silicone water to cure the outer surface of the LED chip and the phosphor mixed rubber to form a convex lens.

在所述陶瓷基板3上的金属导线层中6的金属导线是银导线7，而从LED芯片的P/N结上分别有金线4连接到陶瓷基板上的银导线7。The metal wires 6 of the metal wiring layers on the ceramic substrate 3 are silver wires 7, and the gold wires 4 are connected to the silver wires 7 on the ceramic substrate from the P/N junctions of the LED chips, respectively.

实施例2Example 2

一种氧化铝/石墨复合陶瓷材料及其制备方法，包括石墨粉的制备、氧化铝陶瓷料的制备、复合粉料的制备、氧化铝/石墨复合陶瓷材料烧结四个步骤，其中每个步骤的具体方式如下：An alumina/graphite composite ceramic material and a preparation method thereof, comprising the preparation of graphite powder, the preparation of alumina ceramic material, the preparation of composite powder, and the sintering of alumina/graphite composite ceramic material, wherein each step The specific method is as follows:

（1）、石墨粉的制备：将500目的石墨和质量为石墨质量的0.1‰的分散剂混合之后，加入质量为石墨质量的1倍的水中，进行球磨；球磨时间为10~20小时，球磨结束后将石墨粉料烘干待用；(1) Preparation of graphite powder: After mixing 500-mesh graphite and 0.1 ‰ dispersing agent of graphite mass, add 1 times of water of mass of graphite to perform ball milling; ball milling time is 10-20 hours, ball milling After the end, the graphite powder is dried for use;

（2）氧化铝陶瓷料的制备：将氧化铝粉、滑石粉、硅灰石粉、碳酸钡粉按质量比100：10：10：1称量混合待用，同时还混合加入质量为氧化铝粉质量的0.5%的聚乙烯醇；(2) Preparation of alumina ceramic material: the alumina powder, talc powder, wollastonite powder and strontium carbonate powder are mixed and weighed according to the mass ratio of 100:10:10:1, and the quality of the alumina powder is also mixed and added. 0.5% by mass of polyvinyl alcohol;

（3）复合粉料的制备：将所述氧化铝陶瓷料与石墨粉以100:5的质量比混合后，进行球磨，球磨时间为10~20小时；球磨结束后将复合粉料烘干待用；(3) Preparation of composite powder: After mixing the alumina ceramic material and graphite powder in a mass ratio of 100:5, ball milling is performed, and the ball milling time is 10-20 hours; after the ball milling is finished, the composite powder is dried. use;

（4）氧化铝/石墨复合陶瓷材料的烧结：将上述所制得的复合粉料经压制成型后，置于保护惰性气氛环境下以1400~1700℃高温烧结2~3小时，即可得到氧化铝/石墨复合材料。(4) Sintering of alumina/graphite composite ceramic material: After the composite powder prepared above is pressed and formed, it is sintered in a protective inert atmosphere at a high temperature of 1400~1700 ° C for 2 to 3 hours to obtain oxidation. Aluminum/graphite composite.

所述分散剂为十二胺基磺酸钠、十六烷基三甲基溴化胺、十六烷基苯磺酸钠。 The dispersing agent is sodium dodecylsulfonate, cetyltrimethylammonium bromide, sodium hexadecylbenzenesulfonate.

实施例2：Example 2:

一种氧化铝/石墨复合陶瓷材料及其制备方法，包括四个步骤： An alumina/graphite composite ceramic material and a preparation method thereof, comprising four steps:

（1）、石墨粉的制备：将500目的石墨和质量为石墨质量的0.8‰的分散剂混合之后，加入质量为石墨质量的2倍的水中，进行球磨；球磨时间为10~20小时，球磨结束后将石墨粉料烘干待用；(1) Preparation of graphite powder: After mixing 500-mesh graphite and 0.8 ‰ dispersing agent of mass mass of graphite, adding 2 times of water of mass of graphite to perform ball milling; ball milling time is 10-20 hours, ball milling After the end, the graphite powder is dried for use;

（2）氧化铝陶瓷料的制备：将氧化铝粉、滑石粉、硅灰石粉、碳酸钡粉按质量比100：20：15：5称量混合待用，同时还混合加入质量为氧化铝粉质量的0.1%的聚乙烯醇；(2) Preparation of alumina ceramic material: The alumina powder, talc powder, wollastonite powder and barium carbonate powder are mixed and weighed according to the mass ratio of 100:20:15:5, and the mass of alumina powder is also mixed and added. 0.1% by weight of polyvinyl alcohol;

（3）复合粉料的制备：将所述氧化铝陶瓷料与石墨粉以100:10的质量比混合后，进行球磨，球磨时间为10~20小时；球磨结束后将复合粉料烘干待用；(3) Preparation of composite powder: After mixing the alumina ceramic material and graphite powder in a mass ratio of 100:10, ball milling is performed, and the ball milling time is 10-20 hours; after the ball milling is finished, the composite powder is dried. use;

（4）氧化铝/石墨复合陶瓷材料的烧结：将上述所制得的复合粉料经压制成型后，置于保护惰性气氛环境下以1400~1700℃高温烧结2~3小时，即可得到氧化铝/石墨复合材料。(4) Sintering of alumina/graphite composite ceramic material: After the composite powder prepared above is pressed and formed, it is sintered in a protective inert atmosphere at a high temperature of 1400~1700 ° C for 2 to 3 hours to obtain oxidation. Aluminum/graphite composite.

所述分散剂为十二胺基磺酸钠、十六烷基三甲基溴化胺、十六烷基苯磺酸钠。 The dispersing agent is sodium dodecylsulfonate, cetyltrimethylammonium bromide, sodium hexadecylbenzenesulfonate.

以实施例2中方案得到的氧化铝/石墨复合陶瓷材料的性能与实施例1中相同，所以也可以用相同的结构来制作陶瓷基板的LED光源。The performance of the alumina/graphite composite ceramic material obtained in the embodiment 2 was the same as that in the first embodiment, so that the LED light source of the ceramic substrate could be produced by the same structure.

以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等，均应包含在本实用新型的保护范围之内。The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the present invention. Within the scope of protection.

本发明的实施方式Embodiments of the invention

工业实用性Industrial applicability

序列表自由内容Sequence table free content

Claims (5)

一种氧化铝/石墨复合陶瓷材料，包括氧化铝陶瓷料和石墨粉，其特征在于：所述的氧化铝陶瓷料与石墨粉的质量比100:5~100:15；所述的氧化铝陶瓷料包括氧化铝粉、滑石粉、硅灰石粉、碳酸钡粉按质量比100：10~20：10~20：1~5进行配比。An alumina/graphite composite ceramic material, comprising an alumina ceramic material and a graphite powder, characterized in that: the mass ratio of the alumina ceramic material to the graphite powder is 100:5~100:15; the alumina ceramic The materials include alumina powder, talc powder, wollastonite powder and barium carbonate powder according to the mass ratio of 100:10~20:10~20:1~5. 一种采用权利要求1所述氧化铝/石墨复合陶瓷为基板的LED光源，包括散热基板、印刷在散热基板上的金属导线、封装在散热基板上的LED芯片、荧光粉和光学透镜，其特征在于，所述散热基板为所述氧化铝/石墨复合陶瓷基板、在复合陶瓷基板印刷有金属导电层，同时LED芯片直接固定在所述陶瓷基板，LED芯片的阴阳两极分别与印刷在复合陶瓷基板的金属导电层相连。An LED light source using the alumina/graphite composite ceramic according to claim 1 as a substrate, comprising a heat dissipation substrate, a metal wire printed on the heat dissipation substrate, an LED chip packaged on the heat dissipation substrate, a phosphor and an optical lens, and the characteristics thereof The heat dissipating substrate is the alumina/graphite composite ceramic substrate, and a metal conductive layer is printed on the composite ceramic substrate, and the LED chip is directly fixed on the ceramic substrate, and the anode and cathode electrodes of the LED chip are respectively printed on the composite ceramic substrate. The metal conductive layers are connected. 根据权利要求4所述的氧化铝/石墨复合陶瓷为基板的LED光源，其特征在于，在所述基板安装LED芯片的光源面上涂覆纳米陶瓷釉，将所述纳米陶瓷釉均匀喷涂在光源面上，然后经过T≤150℃的温度烤制形成具有反光特性能提高光源能效的保护釉面。The LED light source of the aluminum oxide/graphite composite ceramic according to claim 4, wherein a nano ceramic glaze is coated on a surface of the light source on which the LED chip is mounted, and the nano ceramic glaze is uniformly sprayed on the light source. The surface is then baked at a temperature of T ≤ 150 ° C to form a protective glaze with reflective properties to improve the energy efficiency of the light source. 根据权利要求4或5所述所述LED光源，其特征在于，所述光学透镜是采用透明硅胶水在所述LED芯片与荧光粉混合胶外表面固化，形成凸透镜的形状。 The LED light source according to claim 4 or 5, wherein the optical lens is solidified on the outer surface of the LED chip and the phosphor mixed rubber by using transparent silica water to form a convex lens. 根据权利要求4所述所述LED光源，其特征在于，所述在所述陶瓷基板上的金属导线是银导线，而从LED芯片的P/N结上分别有金线连接到陶瓷基板上的银导线。The LED light source according to claim 4, wherein the metal wires on the ceramic substrate are silver wires, and the gold wires are connected to the ceramic substrate from the P/N junctions of the LED chips. Silver wire.
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