WO2012015031A1 - 太陽電池モジュール - Google Patents
太陽電池モジュール Download PDFInfo
- Publication number
- WO2012015031A1 WO2012015031A1 PCT/JP2011/067439 JP2011067439W WO2012015031A1 WO 2012015031 A1 WO2012015031 A1 WO 2012015031A1 JP 2011067439 W JP2011067439 W JP 2011067439W WO 2012015031 A1 WO2012015031 A1 WO 2012015031A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solar cell
- wiring
- back surface
- surface protection
- cell module
- Prior art date
Links
- 230000007704 transition Effects 0.000 claims abstract description 22
- 238000007789 sealing Methods 0.000 claims abstract description 21
- 230000001681 protective effect Effects 0.000 claims description 31
- 238000005452 bending Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 16
- 239000011347 resin Substances 0.000 description 16
- 239000002245 particle Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- -1 Polyethylene Terephthalate Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007771 core particle Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000005042 ethylene-ethyl acrylate Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/93—Interconnections
- H10F77/933—Interconnections for devices having potential barriers
- H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
- H10F77/937—Busbar structures for modules
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- This invention relates to a solar cell module.
- Solar cells are expected as a new energy source because they can directly convert clean and infinitely supplied sunlight into electricity.
- the output per solar cell is about several watts.
- a solar cell module whose output is increased by connecting a plurality of solar cells is used.
- the solar cell module has a structure in which a plurality of solar cells are connected in series and / or in parallel by wiring members (inner leads) electrically connected to the electrodes.
- the solar cell module is configured by electrically connecting a plurality of the solar cell strings.
- the wiring members located at the end of each solar cell string are electrically connected to each other by a crossover wiring and solder.
- the crossover wiring is also used as a wiring for taking out the output generated by all the solar cell strings. Therefore, the crossover wiring collects the output generated from the wiring member, outputs it to the external output of the solar cell module, and is soldered to a conductor that is electrically connected to the external output unit.
- Patent Document 1 Such a solar cell module is proposed in Patent Document 1, for example.
- a solar cell module is generally manufactured by laminating a light-transmitting substrate, a sealing material, a plurality of solar cell strings, a sealing material, and a back surface protective film in this order, and heating and pressing the laminated body with a laminating apparatus. Is done.
- FIG. 7 is a schematic cross-sectional view showing a conventional solar cell module.
- the solar cell module includes a surface protection member 301 made of a translucent member such as glass, a solar cell 303, translucent sealing members 302 and 304, and a back surface protective film 305.
- Electrodes of a plurality of solar cells 303 are connected by a wiring member 306 to form a solar cell string, and the solar cell strings are electrically connected by a wiring 307.
- the solar cell string and the crossover wiring 307 are sandwiched between the surface protection member 301 and the back surface protection film 305 and sealed with the light-transmitting sealing members 302 and 304.
- the wiring members 306 and 306 located at the end of each solar cell string are electrically connected to the crossover wire 307 by solder.
- the tip corner of the wiring member 306 may be located on the back surface protective film 305 side.
- the back surface protective film 305 may be damaged by the front end corner portion of the wiring member 306 due to the pressurization during the laminating process described above. is there. If the back surface protective film 305 is scratched, it will be defective as a product and cause a decrease in yield.
- An object of the present invention is to provide a solar cell module which has been made in view of the above-described conventional problems and suppresses damage to the back surface protective film.
- the present invention provides a surface protection member, a back surface protection film, a plurality of solar cells provided between the surface protection member and the back surface protection film and electrically connected by a wiring member, and the surface protection member and the back surface protection
- a sealing member that seals the plurality of solar cells between the film and a transition wire that is electrically connected to the wiring member, and the wiring member has a length that exceeds the transition wire. And it is connected to the crossover wiring so that the bent part of the wiring member faces the back surface protective film side.
- FIGS. 1 to 3 are enlarged cross-sectional views of main parts of the solar cell module 10 according to this embodiment, and FIG. 3 is a plan view showing a wiring portion of the solar cell module according to this embodiment.
- the solar cell module 10 includes a solar cell 11, a surface protection member 12, a back surface protection film 13, and a sealing member 14.
- the solar cell module 10 is configured by sealing a plurality of solar cells 11 between the surface protection member 12 and the back surface protection film 13.
- the plurality of solar cells 11 are connected to each other by the wiring member 16.
- the solar cell 11 and the wiring member 16 are connected using solder or a resin adhesive.
- the solar cell 11 has a light receiving surface on which sunlight is incident and a back surface provided on the opposite side of the light receiving surface. Electrodes are formed on the light receiving surface and the back surface of the solar cell 11.
- the solar cell 11 is made of, for example, a crystalline semiconductor made of single crystal silicon, polycrystalline silicon, or the like and has a substantially square shape. However, the solar cell 11 is not limited to this, and other solar cells may be used. .
- the solar cell 11 for example, an n-type region and a p-type region are formed in the solar cell 11, and a junction for forming an electric field for carrier separation at an interface portion between the n-type region and the p-type region.
- the wiring member 16 is connected to an electrode formed on the light receiving surface of the solar cell 11 and an electrode formed on the back surface of another solar cell 11 adjacent to the solar cell 11. Thereby, the adjacent solar cells 11 and 11 are electrically connected.
- the wiring member 16 includes a thin plate-like copper foil and solder plated on the surface of the copper foil.
- the solder plated on the surface of the wiring member 16 is melted and connected to the electrode of the solar cell 11.
- a resin adhesive is disposed between the wiring member 16 and the solar cell 11, and the solar cell 11 and the wiring member 16 are connected via the resin adhesive.
- the resin adhesive is preferably cured at a temperature lower than the melting point of the eutectic solder, that is, about 200 ° C. or lower.
- the resin adhesive for example, an anisotropic conductive adhesive film is used.
- the conductive adhesive film one comprising at least a resin adhesive component and conductive particles dispersed therein is used.
- thermosetting resin a composition containing a thermosetting resin is used.
- an epoxy resin, a phenoxy resin, an acrylic resin, a polyimide resin, a polyamide resin, or a polycarbonate resin can be used.
- thermosetting resins are used singly or in combination of two or more, and one or more thermosetting resins selected from the group consisting of epoxy resins, phenoxy resins and acrylic resins are preferable.
- the conductive particles include metal particles such as gold particles, silver particles, copper particles, and nickel particles, or conductive or insulating core particles such as gold plating particles, copper plating particles, and nickel plating particles. Conductive particles formed by coating with a conductive layer such as a layer are used.
- the surface protection member 12 is disposed on the light receiving surface side of the sealing member 14 and protects the surface of the solar cell module 10.
- glass having translucency and water shielding properties, translucent plastic, or the like can be used as the surface protection member 12.
- the back surface protective film 13 is disposed on the back surface side of the sealing member 14 and protects the back surface of the solar cell module 10.
- a resin film such as PET (Polyethylene Terephthalate) or a laminated film having a structure in which an Al (aluminum) foil is sandwiched between these resin films can be used.
- the back surface protective film 13 is made of a resin film such as PET.
- the sealing member 14 seals the solar cell 11 between the front surface protective member 12 and the back surface protective film 13.
- a light-transmitting resin such as EVA (Ethylence-VinylinAcetate), EEA (Ethylene-Ethylacrylate Copolymer), PVB (Polyvinyl Butyral), silicon, urethane, acrylic, epoxy, or the like can be used.
- EVA resin is used.
- a frame such as Al (aluminum) can be attached to the outer periphery of the solar cell module 10 having the above-described configuration.
- the wiring member 16 located at the end of each solar cell string is connected to the crossover wiring 20 that connects the solar cell strings.
- the crossover wiring 20 is also used as a wiring for taking out the power generation output from all the solar cell strings.
- the output transition wiring 20 for taking out the output generated outside is connected to the electrical output from the solar cell 11 to the terminal of a terminal box (not shown).
- the crossover wiring 20 is usually soldered to the wiring member 16 by cutting a copper foil having a thickness of about 0.1 mm to 0.3 mm and a width of 6 mm on the entire surface thereof into a predetermined length.
- wiring is performed from the back surface to the front surface of the crossover wiring 20 so that the tip corner of the wiring member 16 is not located on the back surface protection film 13 side of the crossover wiring 20 but on the surface protection member 12 side.
- the member 16 is arranged.
- the wiring member 16 is bent at the end of the transition wiring 20 from the back surface of the transition wiring 20 to the side surface of the transition wiring 20 and the surface protection member 12 side.
- the transition wire 20 is provided so that the front end portion thereof is located on the surface protection member 12 side.
- FIG. 1 the wiring member 16 connected to the surface protection member 12 side of the solar cell 11 is connected to the crossover wiring 20.
- FIG. 2 shows the connection of the wiring member 16 connected to the back surface protective film 13 side of the solar cell 11 to the crossover wiring 20.
- the created six strings are connected in series as shown in FIG.
- Leftmost string is connected to the output interconnectors 20 1
- second and third strings from the left is connected to the output interconnectors 20 2.
- rightmost output interconnectors 20 4 strings is connected to the output interconnectors 20 4
- the second and third string from right is connected to the output interconnectors 20 3.
- the wiring members 16 of the adjacent solar cell strings are connected by the cross wiring 20. Specifically, the solar cell strings located at the rightmost end and second from the right, third from right and third from left, and leftmost and second from the left are electrically connected.
- the solar cell module 10 includes a plurality of solar cells 11, EVA connected from the lower side by a surface protection member 12, an EVA sheet (sealing member) on the surface side, the wiring member 16 and the crossover wiring 20 described above.
- the sheet (sealing member) and the back surface protective film 13 are stacked and configured in this order.
- each component is stacked and then pressurized with a laminator, and then heated to about 130 ° C. to 200 ° C.
- the EVA sheet is gelled to form a predetermined EVA layer (sealing layer) 14.
- the solar cells 11 are sealed in the EVA layer (sealing layer) 14 in a state of being sandwiched between the front surface side protection member 12 and the back surface side rear surface protection film 13.
- the terminal box is attached to the back surface protective film 13 with silicone resin so as to cover the opening 13a of the back surface protective film 13.
- the output crossover wiring 20 taken out from the opening 13a is connected to the terminal block in the terminal box so that it can be connected to an external circuit, so that the solar cell module 10 is completed.
- a backflow prevention diode is connected between the terminals of the terminal box to which the output wiring lines 20 1 to 20 4 are connected.
- an insulating material 20a for insulation is attached to the output crossover wirings 20 1 to 20 4 .
- the wiring member 16 is set to a length that completely covers the front and back of the crossover wiring 20.
- the wiring member 16 and the transition wiring 20 are connected by solder provided on the front and back of the transition wiring 20.
- the wiring member 16 is bonded to the front and back surfaces of the crossover wiring 20, so that the bonding strength between the wiring member 16 and the crossover wiring 20 can be increased.
- the bent portion of the wiring member 16 faces the back surface protective film 13 and the tip corner of the wiring member 16 is disposed on the surface protective member 12 side.
- the back surface protective film 13 is suppressed from being damaged by the corners of the wiring member 16. As a result, the defective product rate of the solar cell module can be greatly reduced.
- the wiring member 16 is arrange
- the wiring member 16 is provided with a length that reaches the middle of the crossover wiring 20 on the surface protection member 12 side. Even if the wiring member 16 having such a length is used, the back surface protective film 13 can be prevented from being damaged.
- the wiring member 16 is bent at the end of the transition wiring 20 from the back surface of the transition wiring 20 to the side surface of the transition wiring 20. It is configured to face the protection member 12 side. Even if it is such a structure, it can suppress that the back surface protective film 13 is damaged by the wiring member 16.
- FIG. 5 the wiring member 16 is bent at the end of the transition wiring 20 from the back surface of the transition wiring 20 to the side surface of the transition wiring 20. It is configured to face the protection member 12 side. Even if it is such a structure, it can suppress that the back surface protective film 13 is damaged by the wiring member 16.
- the wiring member 16 is bent at the end of the transition wiring 20 from the back surface of the transition wiring 20 to the side surface of the transition wiring 20. As a result, the front end portion of the wiring member 16 is prevented from facing the back surface side protective film 13. In this state, the wiring member 16 and the crossover wiring 20 are connected.
- the solar cell module 10 includes a plurality of solar cells 11 connected by a surface protection member 12, a surface side EVA sheet (sealing member) 14 a, and a wiring member 16 from the lower side, and a crossover.
- the wiring 20, the EVA sheet (sealing member) 14b, and the back surface protective film 13 are stacked and configured in this order.
- each component is stacked and then pressurized with a laminator, and then heated to about 130 ° C. to 200 ° C.
- seat 14a, 14b is gelatinized, and the predetermined EVA layer (sealing layer) 14 is comprised.
- the solar cells 11 are sealed in the EVA layer (sealing layer) 14 with being sandwiched between the surface-side surface protection member 12 and the back-side back surface protective film 13, and the solar cell module 10. Is completed.
- the tip corner portion of the wiring member 16 is laminated without facing the back surface protective film 13, and the back surface protective film 13 is prevented from being damaged. Is done.
Landscapes
- Photovoltaic Devices (AREA)
Abstract
Description
11 太陽電池
12 表面保護部材
13 裏面保護フィルム
13a 開口部
14 封止部材
16 配線部材
20 渡り配線
Claims (3)
- 表面保護部材と、
裏面保護フィルムと、
前記表面保護部材と裏面保護フィルムとの間に設けられ、配線部材によって電気的接続された複数の太陽電池と、
前記表面保護部材と裏面保護フィルムとの間に、前記複数の太陽電池を封止する封止部材と、
前記配線部材と電気的に接続された渡り配線と、を備え、
前記配線部材は、前記裏面保護フィルム側には配線部材の折り曲げ部が対向するように配置し、渡り配線に接続されている、太陽電池モジュール。 - 前記配線部材は、前記渡り配線の裏面側から表面側に折り曲げられ、接続されている、請求項1に記載の太陽電池モジュール。
- 前記配線部材の先端部が、前記表面保護部材に向くように配線部材の長さが設定されている、請求項1に記載の太陽電池モジュール。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011900006385U CN203277411U (zh) | 2010-07-30 | 2011-07-29 | 太阳能电池模块 |
JP2012526591A JP5879513B2 (ja) | 2010-07-30 | 2011-07-29 | 太陽電池モジュール |
EP11812620.0A EP2600419B1 (en) | 2010-07-30 | 2011-07-29 | Solar cell module |
US13/749,864 US20130133725A1 (en) | 2010-07-30 | 2013-01-25 | Solar cell module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-171388 | 2010-07-30 | ||
JP2010171388 | 2010-07-30 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/749,864 Continuation US20130133725A1 (en) | 2010-07-30 | 2013-01-25 | Solar cell module |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012015031A1 true WO2012015031A1 (ja) | 2012-02-02 |
Family
ID=45530230
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/067439 WO2012015031A1 (ja) | 2010-07-30 | 2011-07-29 | 太陽電池モジュール |
Country Status (5)
Country | Link |
---|---|
US (1) | US20130133725A1 (ja) |
EP (1) | EP2600419B1 (ja) |
JP (1) | JP5879513B2 (ja) |
CN (1) | CN203277411U (ja) |
WO (1) | WO2012015031A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012064729A (ja) * | 2010-09-15 | 2012-03-29 | Fuji Electric Co Ltd | 太陽電池モジュールおよびラミネート方法 |
WO2012115188A1 (ja) * | 2011-02-24 | 2012-08-30 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
JP2015012150A (ja) * | 2013-06-28 | 2015-01-19 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
JP2015070143A (ja) * | 2013-09-30 | 2015-04-13 | 三洋電機株式会社 | 太陽電池モジュール |
JPWO2013121549A1 (ja) * | 2012-02-16 | 2015-05-11 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
JP2016103661A (ja) * | 2016-02-19 | 2016-06-02 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール |
JP2018093228A (ja) * | 2018-03-05 | 2018-06-14 | パナソニックIpマネジメント株式会社 | 太陽電池モジュールの製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2960946B1 (en) * | 2014-06-26 | 2020-11-18 | LG Electronics Inc. | Solar cell module |
KR102455605B1 (ko) * | 2014-08-04 | 2022-10-19 | 상라오 징코 솔라 테크놀러지 디벨롭먼트 컴퍼니, 리미티드 | 태양전지 모듈 |
US9673344B2 (en) * | 2014-08-07 | 2017-06-06 | Lumeta, Llc | Apparatus and method for photovoltaic module with tapered edge seal |
US20160359451A1 (en) * | 2015-06-05 | 2016-12-08 | Lumeta, Llc | Apparatus and method for solar panel on-board wiring |
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- 2011-07-29 WO PCT/JP2011/067439 patent/WO2012015031A1/ja active Application Filing
- 2011-07-29 JP JP2012526591A patent/JP5879513B2/ja not_active Expired - Fee Related
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2013
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Cited By (10)
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JP2012064729A (ja) * | 2010-09-15 | 2012-03-29 | Fuji Electric Co Ltd | 太陽電池モジュールおよびラミネート方法 |
WO2012115188A1 (ja) * | 2011-02-24 | 2012-08-30 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
JP5816823B2 (ja) * | 2011-02-24 | 2015-11-18 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール及びその製造方法 |
JPWO2013121549A1 (ja) * | 2012-02-16 | 2015-05-11 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
EP2816611A4 (en) * | 2012-02-16 | 2015-10-07 | Sanyo Electric Co | SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME |
US9196774B2 (en) | 2012-02-16 | 2015-11-24 | Panasonic Intellectual Property Management Co., Ltd. | Solar module and method for manufacturing the same |
JP2015012150A (ja) * | 2013-06-28 | 2015-01-19 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
JP2015070143A (ja) * | 2013-09-30 | 2015-04-13 | 三洋電機株式会社 | 太陽電池モジュール |
JP2016103661A (ja) * | 2016-02-19 | 2016-06-02 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール |
JP2018093228A (ja) * | 2018-03-05 | 2018-06-14 | パナソニックIpマネジメント株式会社 | 太陽電池モジュールの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20130133725A1 (en) | 2013-05-30 |
JP5879513B2 (ja) | 2016-03-08 |
CN203277411U (zh) | 2013-11-06 |
EP2600419B1 (en) | 2018-11-28 |
EP2600419A4 (en) | 2017-04-26 |
JPWO2012015031A1 (ja) | 2013-09-12 |
EP2600419A1 (en) | 2013-06-05 |
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