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WO2009060687A1 - 粘着シート及びそれを用いた半導体装置の製造方法 - Google Patents

粘着シート及びそれを用いた半導体装置の製造方法 Download PDF

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Publication number
WO2009060687A1
WO2009060687A1 PCT/JP2008/068340 JP2008068340W WO2009060687A1 WO 2009060687 A1 WO2009060687 A1 WO 2009060687A1 JP 2008068340 W JP2008068340 W JP 2008068340W WO 2009060687 A1 WO2009060687 A1 WO 2009060687A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
semiconductor wafer
semiconductor device
same
base film
Prior art date
Application number
PCT/JP2008/068340
Other languages
English (en)
French (fr)
Inventor
Yoshio Terada
Fumiteru Asai
Hirokuni Hashimoto
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007291254A external-priority patent/JP2009117718A/ja
Priority claimed from JP2007291248A external-priority patent/JP5060249B2/ja
Priority claimed from JP2007295526A external-priority patent/JP2009135124A/ja
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Priority to CN200880001164.9A priority Critical patent/CN101568611B/zh
Priority to US12/513,316 priority patent/US8048690B2/en
Publication of WO2009060687A1 publication Critical patent/WO2009060687A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)

Abstract

本発明に係る粘着シートは、基材フィルム上に粘着剤層が設けられた粘着シートであって、前記基材フィルムは導電性繊維からなり、前記粘着剤層と基材フィルムの間に電気的な導通経路が形成されていることを特徴とする。これにより、半導体ウェハ、又は半導体ウェハのダイシングにより形成された半導体チップを貼り合わせた状態でも電気的な導通検査を行うことができ、その検査における半導体ウェハの変形（反り）や破損、裏面のキズやスクラッチの発生を防止することができる。
PCT/JP2008/068340 2007-11-08 2008-10-09 粘着シート及びそれを用いた半導体装置の製造方法 WO2009060687A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880001164.9A CN101568611B (zh) 2007-11-08 2008-10-09 粘合片以及使用其的半导体装置的制造方法
US12/513,316 US8048690B2 (en) 2007-11-08 2008-10-09 Pressure-sensitive adhesive sheet and process for producing semiconductor device having same

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007-291254 2007-11-08
JP2007-291248 2007-11-08
JP2007291251 2007-11-08
JP2007-291251 2007-11-08
JP2007291254A JP2009117718A (ja) 2007-11-08 2007-11-08 ダイシング用粘着シート
JP2007291248A JP5060249B2 (ja) 2007-11-08 2007-11-08 検査用粘着シート
JP2007-295526 2007-11-14
JP2007295526A JP2009135124A (ja) 2007-11-08 2007-11-14 ダイシング用粘着シート

Publications (1)

Publication Number Publication Date
WO2009060687A1 true WO2009060687A1 (ja) 2009-05-14

Family

ID=40625588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068340 WO2009060687A1 (ja) 2007-11-08 2008-10-09 粘着シート及びそれを用いた半導体装置の製造方法

Country Status (1)

Country Link
WO (1) WO2009060687A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130330546A1 (en) * 2011-03-03 2013-12-12 Nitto Denko Corporation Heat-peelable adhesive sheet
WO2016031786A1 (ja) * 2014-08-28 2016-03-03 リンテック株式会社 導電性粘着シート
WO2016031787A1 (ja) * 2014-08-28 2016-03-03 リンテック株式会社 導電性粘着シート
WO2016031788A1 (ja) * 2014-08-28 2016-03-03 リンテック株式会社 導電性粘着シート

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526465A (en) * 1975-07-05 1977-01-18 Sankenshiya:Kk Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPH07294585A (ja) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd 電子部品の通電検査方法
JP2000290616A (ja) * 1999-04-06 2000-10-17 Tomoegawa Paper Co Ltd 導電性接着剤組成物、導電性接着剤シート及びそれを用いた電磁波シールド材料ならびに電磁波シールド性フレキシブルプリント基板。
JP2003020462A (ja) * 2001-07-09 2003-01-24 Somar Corp 難燃性に優れた導電性粘着剤組成物及びそれを用いた粘着加工品
JP2005263876A (ja) * 2004-03-16 2005-09-29 Lintec Corp 両面粘着シートおよび脆質部材の転写方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526465A (en) * 1975-07-05 1977-01-18 Sankenshiya:Kk Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPH07294585A (ja) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd 電子部品の通電検査方法
JP2000290616A (ja) * 1999-04-06 2000-10-17 Tomoegawa Paper Co Ltd 導電性接着剤組成物、導電性接着剤シート及びそれを用いた電磁波シールド材料ならびに電磁波シールド性フレキシブルプリント基板。
JP2003020462A (ja) * 2001-07-09 2003-01-24 Somar Corp 難燃性に優れた導電性粘着剤組成物及びそれを用いた粘着加工品
JP2005263876A (ja) * 2004-03-16 2005-09-29 Lintec Corp 両面粘着シートおよび脆質部材の転写方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130330546A1 (en) * 2011-03-03 2013-12-12 Nitto Denko Corporation Heat-peelable adhesive sheet
WO2016031786A1 (ja) * 2014-08-28 2016-03-03 リンテック株式会社 導電性粘着シート
WO2016031787A1 (ja) * 2014-08-28 2016-03-03 リンテック株式会社 導電性粘着シート
WO2016031788A1 (ja) * 2014-08-28 2016-03-03 リンテック株式会社 導電性粘着シート
KR20170046659A (ko) * 2014-08-28 2017-05-02 린텍 가부시키가이샤 도전성 점착 시트
JPWO2016031787A1 (ja) * 2014-08-28 2017-06-15 リンテック株式会社 導電性粘着シート
JPWO2016031786A1 (ja) * 2014-08-28 2017-06-15 リンテック株式会社 導電性粘着シート
JPWO2016031788A1 (ja) * 2014-08-28 2017-06-15 リンテック株式会社 導電性粘着シート
KR102390524B1 (ko) 2014-08-28 2022-04-25 린텍 가부시키가이샤 도전성 점착 시트

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