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WO2009050853A1 - 電子部品及びシールドケースとチップ部品の配置方法 - Google Patents

電子部品及びシールドケースとチップ部品の配置方法 Download PDF

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Publication number
WO2009050853A1
WO2009050853A1 PCT/JP2008/002793 JP2008002793W WO2009050853A1 WO 2009050853 A1 WO2009050853 A1 WO 2009050853A1 JP 2008002793 W JP2008002793 W JP 2008002793W WO 2009050853 A1 WO2009050853 A1 WO 2009050853A1
Authority
WO
WIPO (PCT)
Prior art keywords
opening
parts
grounding
chip
terminal
Prior art date
Application number
PCT/JP2008/002793
Other languages
English (en)
French (fr)
Inventor
Shinji Oguri
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to CN2008801122136A priority Critical patent/CN101828436B/zh
Priority to US12/738,603 priority patent/US8253226B2/en
Priority to EP08839253A priority patent/EP2203040A1/en
Publication of WO2009050853A1 publication Critical patent/WO2009050853A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

　基板（101）上の部品をシールドする電子部品（100）に、両端に接地端子（103A）及び電圧電源を供給するための電極端子（103B）を有し接地端子を揃えて一定間隔で基板上に配置され基板の接地端子ランド（107A）及び電極端子ランド（107B）と接地端子及び電極端子がそれぞれ電気的に接続される複数のチップ部品（102）と、複数のチップ部品をシールドし且つ開口部（105）を有し開口部から樹脂を封入し基板の接地端子ランド及び電極端子ランドと各チップ部品の接地端子及び電極端子のそれぞれの電気的接続部分について強度を確保させ開口部の開口端（106）が各チップ部品の接地端子と平行でたわみ時に開口端と各チップ部品の接地端子が接触し各チップ部品の接地部品以外の部分が開口部と対向したわみ時に開口端と接触しないように開口部が形成されるシールドケース（104）とを備える。
PCT/JP2008/002793 2007-10-18 2008-10-03 電子部品及びシールドケースとチップ部品の配置方法 WO2009050853A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008801122136A CN101828436B (zh) 2007-10-18 2008-10-03 电子部件以及用于布置屏蔽壳体和芯片部件的方法
US12/738,603 US8253226B2 (en) 2007-10-18 2008-10-03 Electronic parts, and method for arranging shielding case and chip parts
EP08839253A EP2203040A1 (en) 2007-10-18 2008-10-03 Electronic parts, and method for arranging shielding case and chip parts

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-270798 2007-10-18
JP2007270798A JP5051532B2 (ja) 2007-10-18 2007-10-18 電子部品及びシールドケースとチップ部品の配置方法

Publications (1)

Publication Number Publication Date
WO2009050853A1 true WO2009050853A1 (ja) 2009-04-23

Family

ID=40567141

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002793 WO2009050853A1 (ja) 2007-10-18 2008-10-03 電子部品及びシールドケースとチップ部品の配置方法

Country Status (5)

Country Link
US (1) US8253226B2 (ja)
EP (1) EP2203040A1 (ja)
JP (1) JP5051532B2 (ja)
CN (1) CN101828436B (ja)
WO (1) WO2009050853A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013055235A (ja) * 2011-09-05 2013-03-21 Sumitomo Electric Printed Circuit Inc シールドケース付きプリント配線板及びシールドケース付きプリント配線板の製造方法
US9437576B1 (en) 2015-03-23 2016-09-06 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method of manufacturing the same
US11101425B2 (en) 2015-12-28 2021-08-24 Teijin Limited Braided piezoelectric element, fabric-like piezoelectric element using braided piezoelectric element, and device using same
WO2017169545A1 (ja) * 2016-03-31 2017-10-05 株式会社村田製作所 高周波モジュール
CN109840238A (zh) * 2017-11-29 2019-06-04 北京搜狗科技发展有限公司 一种主板和翻译机
JP7111514B2 (ja) * 2018-06-08 2022-08-02 加賀Ｆｅｉ株式会社 電子部品モジュール

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03111672A (ja) 1989-09-22 1991-05-13 Kazuhiko Nagashima 重力加速度エネルギーの回収法
JP2000106475A (ja) 1998-09-29 2000-04-11 Kyocera Corp 回路基板装置
JP2001244688A (ja) * 2000-02-28 2001-09-07 Kyocera Corp 高周波モジュール部品及びその製造方法
JP2001274590A (ja) * 2000-03-27 2001-10-05 Mitsumi Electric Co Ltd 電子機器のシールドケース
JP2002064295A (ja) * 2000-08-18 2002-02-28 Mitsubishi Electric Corp シールド装置及びシールド装置の製造方法
JP2003115564A (ja) * 2001-10-03 2003-04-18 Murata Mfg Co Ltd 電子回路装置
JP3111672U (ja) * 2005-04-18 2005-07-28 株式会社村田製作所 高周波電子部品
WO2005101931A1 (ja) * 2004-04-15 2005-10-27 Mitsubishi Denki Kabushiki Kaisha 表面実装部品取り付け構造
JP2007270798A (ja) 2006-03-31 2007-10-18 Honda Motor Co Ltd 内燃機関のリフト可変動弁装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0739979Y2 (ja) * 1990-02-28 1995-09-13 サンウエーブ工業株式会社 容器の取付構造

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03111672A (ja) 1989-09-22 1991-05-13 Kazuhiko Nagashima 重力加速度エネルギーの回収法
JP2000106475A (ja) 1998-09-29 2000-04-11 Kyocera Corp 回路基板装置
JP2001244688A (ja) * 2000-02-28 2001-09-07 Kyocera Corp 高周波モジュール部品及びその製造方法
JP2001274590A (ja) * 2000-03-27 2001-10-05 Mitsumi Electric Co Ltd 電子機器のシールドケース
JP2002064295A (ja) * 2000-08-18 2002-02-28 Mitsubishi Electric Corp シールド装置及びシールド装置の製造方法
JP2003115564A (ja) * 2001-10-03 2003-04-18 Murata Mfg Co Ltd 電子回路装置
WO2005101931A1 (ja) * 2004-04-15 2005-10-27 Mitsubishi Denki Kabushiki Kaisha 表面実装部品取り付け構造
JP3111672U (ja) * 2005-04-18 2005-07-28 株式会社村田製作所 高周波電子部品
JP2007270798A (ja) 2006-03-31 2007-10-18 Honda Motor Co Ltd 内燃機関のリフト可変動弁装置

Also Published As

Publication number Publication date
CN101828436A (zh) 2010-09-08
US8253226B2 (en) 2012-08-28
JP2009099818A (ja) 2009-05-07
CN101828436B (zh) 2012-03-14
EP2203040A1 (en) 2010-06-30
US20100213583A1 (en) 2010-08-26
JP5051532B2 (ja) 2012-10-17

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