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WO2009020180A1 - Ｓｎメッキ導電材料及びその製造方法並びに通電部品 - Google Patents

Ｓｎメッキ導電材料及びその製造方法並びに通電部品 Download PDF

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Publication number
WO2009020180A1
WO2009020180A1 PCT/JP2008/064224 JP2008064224W WO2009020180A1 WO 2009020180 A1 WO2009020180 A1 WO 2009020180A1 JP 2008064224 W JP2008064224 W JP 2008064224W WO 2009020180 A1 WO2009020180 A1 WO 2009020180A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive material
plated conductive
manufacturing
carrying component
electricity carrying
Prior art date
Application number
PCT/JP2008/064224
Other languages
English (en)
French (fr)
Inventor
Song-Zhu Chu
Jun-Ichi Kumagai
Original Assignee
Mitsubishi Shindoh Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008185061A external-priority patent/JP2009057630A/ja
Application filed by Mitsubishi Shindoh Co., Ltd. filed Critical Mitsubishi Shindoh Co., Ltd.
Publication of WO2009020180A1 publication Critical patent/WO2009020180A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

　このＳｎメッキ導電材料は、導電性の金属からなる基材２の上に、Ｓｎ又はＳｎ合金からなるＳｎメッキ層５が形成されたＳｎメッキ導電材料１であって、基材２とＳｎメッキ層５との積層方向に沿った断面において、Ｓｎメッキ層５の表層部分にＡｇ－Ｓｎ粒子が凝集したＡｇ－Ｓｎ合金層６が形成されている。
PCT/JP2008/064224 2007-08-07 2008-08-07 Ｓｎメッキ導電材料及びその製造方法並びに通電部品 WO2009020180A1 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007205571 2007-08-07
JP2007-205571 2007-08-07
JP2008185061A JP2009057630A (ja) 2007-08-07 2008-07-16 Ｓｎメッキ導電材料及びその製造方法並びに通電部品
JP2008-185061 2008-07-16

Publications (1)

Publication Number Publication Date
WO2009020180A1 true WO2009020180A1 (ja) 2009-02-12

Family

ID=40341411

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064224 WO2009020180A1 (ja) 2007-08-07 2008-08-07 Ｓｎメッキ導電材料及びその製造方法並びに通電部品

Country Status (1)

Country Link
WO (1) WO2009020180A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2868773A4 (en) * 2012-06-27 2016-05-25 Jx Nippon Mining & Metals Corp METAL MATERIAL FOR AN ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THEREOF AND CONNECTING END, CONNECTOR AND ELECTRONIC COMPONENT WITH THE METAL MATERIAL FOR AN ELECTRONIC COMPONENT
EP3089277A4 (en) * 2013-12-27 2017-08-23 Hitachi Automotive Systems, Ltd. In-vehicle electronic module
US20220336400A1 (en) * 2021-04-15 2022-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Connecting structure, package structure and manufacturing method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5236529A (en) * 1975-09-18 1977-03-19 Nippon Electric Co Method of surface treatment
JPH0855521A (ja) * 1994-08-10 1996-02-27 Mitsubishi Shindoh Co Ltd 通電部材およびその製造方法
JP2003171790A (ja) * 2001-01-19 2003-06-20 Furukawa Electric Co Ltd:The めっき材料とその製造方法、それを用いた電気・電子部品
JP2005353542A (ja) * 2004-06-14 2005-12-22 Furukawa Electric Co Ltd:The 導電性被覆材料とその製造方法、この被覆材料を用いたコネクタ端子または接点
JP2007284762A (ja) * 2006-04-18 2007-11-01 Sumitomo Metal Mining Co Ltd スズめっき皮膜の形成方法および半導体装置
JP2008240018A (ja) * 2007-03-26 2008-10-09 Sumitomo Metal Mining Co Ltd すずメッキ皮膜およびウィスカー防止方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5236529A (en) * 1975-09-18 1977-03-19 Nippon Electric Co Method of surface treatment
JPH0855521A (ja) * 1994-08-10 1996-02-27 Mitsubishi Shindoh Co Ltd 通電部材およびその製造方法
JP2003171790A (ja) * 2001-01-19 2003-06-20 Furukawa Electric Co Ltd:The めっき材料とその製造方法、それを用いた電気・電子部品
JP2005353542A (ja) * 2004-06-14 2005-12-22 Furukawa Electric Co Ltd:The 導電性被覆材料とその製造方法、この被覆材料を用いたコネクタ端子または接点
JP2007284762A (ja) * 2006-04-18 2007-11-01 Sumitomo Metal Mining Co Ltd スズめっき皮膜の形成方法および半導体装置
JP2008240018A (ja) * 2007-03-26 2008-10-09 Sumitomo Metal Mining Co Ltd すずメッキ皮膜およびウィスカー防止方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2868773A4 (en) * 2012-06-27 2016-05-25 Jx Nippon Mining & Metals Corp METAL MATERIAL FOR AN ELECTRONIC COMPONENT, METHOD OF MANUFACTURING THEREOF AND CONNECTING END, CONNECTOR AND ELECTRONIC COMPONENT WITH THE METAL MATERIAL FOR AN ELECTRONIC COMPONENT
US10826203B2 (en) 2012-06-27 2020-11-03 Jx Nippon Mining & Metals Corporation Metallic material for electronic components and method for producing same, and connector terminals, connectors and electronic components using same
EP3089277A4 (en) * 2013-12-27 2017-08-23 Hitachi Automotive Systems, Ltd. In-vehicle electronic module
US20220336400A1 (en) * 2021-04-15 2022-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Connecting structure, package structure and manufacturing method thereof

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