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WO2008046785A3 - Verfahren zur stabilisierung und funktionalisierung von porösen metallischen schichten - Google Patents

Verfahren zur stabilisierung und funktionalisierung von porösen metallischen schichten Download PDF

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Publication number
WO2008046785A3
WO2008046785A3 PCT/EP2007/060865 EP2007060865W WO2008046785A3 WO 2008046785 A3 WO2008046785 A3 WO 2008046785A3 EP 2007060865 W EP2007060865 W EP 2007060865W WO 2008046785 A3 WO2008046785 A3 WO 2008046785A3
Authority
WO
WIPO (PCT)
Prior art keywords
ceramic material
porous metallic
stabilizing
pores
metallic layers
Prior art date
Application number
PCT/EP2007/060865
Other languages
English (en)
French (fr)
Other versions
WO2008046785A2 (de
Inventor
Oliver Wolst
Markus Widenmeyer
Alexander Martin
Original Assignee
Bosch Gmbh Robert
Oliver Wolst
Markus Widenmeyer
Alexander Martin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Oliver Wolst, Markus Widenmeyer, Alexander Martin filed Critical Bosch Gmbh Robert
Priority to JP2009532777A priority Critical patent/JP2010507018A/ja
Priority to EP07821232A priority patent/EP2104752A2/de
Publication of WO2008046785A2 publication Critical patent/WO2008046785A2/de
Publication of WO2008046785A3 publication Critical patent/WO2008046785A3/de

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1229—Composition of the substrate
    • C23C18/1241—Metallic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1254—Sol or sol-gel processing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Electrochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Dispersion Chemistry (AREA)
  • Catalysts (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Stabilisierung und Funktionalisierung einer porösen metallischen Schicht (1), wobei die poröse, metallische Schicht (1) eine metallische Matrix (3) mit darin enthaltenen Poren (5) enthält. In einem ersten Schritt wird keramisches Material (7) oder Vorstufen die keramisches Material (7) in die Poren (5) der metallischen Matix (3) eingebracht, in einem zweiten Schritt werden die Vorstufen des keramischen Materials gegebenenfalls in das keramische Material (7) umgewandelt und anschliessend erfolgt gegebenenfalls eine thermische oder chemische Nachbehandlung der porösen metallischen Schicht. Die Erfindung betrifft weiterhin eine poröse metallische Struktur, insbesondere für Gateelektroden von Halbleitertransistoren, die Poren (5) in einer metallischen Matrix (3) umfasst. In den Poren (5) der metallischen Matrix (3) ist keramisches Material enthalten.
PCT/EP2007/060865 2006-10-17 2007-10-12 Verfahren zur stabilisierung und funktionalisierung von porösen metallischen schichten WO2008046785A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009532777A JP2010507018A (ja) 2006-10-17 2007-10-12 多孔質の金属層を安定化しかつ機能化する方法
EP07821232A EP2104752A2 (de) 2006-10-17 2007-10-12 Verfahren zur stabilisierung und funktionalisierung von porösen metallischen schichten

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006048906.3 2006-10-17
DE200610048906 DE102006048906A1 (de) 2006-10-17 2006-10-17 Verfahren zur Stabilisierung und Funktionalisierung von porösen metallischen Schichten

Publications (2)

Publication Number Publication Date
WO2008046785A2 WO2008046785A2 (de) 2008-04-24
WO2008046785A3 true WO2008046785A3 (de) 2009-05-07

Family

ID=39183155

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/060865 WO2008046785A2 (de) 2006-10-17 2007-10-12 Verfahren zur stabilisierung und funktionalisierung von porösen metallischen schichten

Country Status (5)

Country Link
EP (1) EP2104752A2 (de)
JP (1) JP2010507018A (de)
CN (1) CN101535526A (de)
DE (1) DE102006048906A1 (de)
WO (1) WO2008046785A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010001624A1 (de) 2010-02-05 2011-08-11 Robert Bosch GmbH, 70469 Verfahren zur Detektion von zwei oder mehr Gasspezies
DE102010038725A1 (de) 2010-07-30 2012-02-02 Robert Bosch Gmbh Vorrichtung und Verfahren zur Gasdetektion
US20140242374A1 (en) * 2013-02-22 2014-08-28 Infineon Technologies Ag Porous Metal Coating
CN103231185B (zh) * 2013-04-03 2014-12-10 株洲宏大高分子材料有限公司 一种HFSi焊销及其制备方法
KR20180104070A (ko) * 2016-02-24 2018-09-19 다나카 기킨조쿠 고교 가부시키가이샤 가스 센서 전극 형성용 금속 페이스트
CN106350058B (zh) * 2016-08-22 2019-01-22 上海朗研光电科技有限公司 基于纳米多孔金的荧光增强基底的制备方法
EP3296428B1 (de) * 2016-09-16 2019-05-15 ATOTECH Deutschland GmbH Verfahren zur abscheidung eines metalls oder einer metallischen legierung auf einer oberfläche
CN112028652B (zh) * 2020-09-10 2021-11-02 刘树峰 一种超硅粉胶泥复合材料及其制备方法
CN115772662B (zh) * 2022-11-24 2024-09-20 西北有色金属研究院 一种多孔钯膜的制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3773549A (en) * 1971-11-30 1973-11-20 Union Carbide Corp Ceramic coated porous metal structure and process therefor
US5186833A (en) * 1991-10-10 1993-02-16 Exxon Research And Engineering Company Composite metal-ceramic membranes and their fabrication
GB2273672A (en) * 1992-12-24 1994-06-29 Atomic Energy Authority Uk Process for making ceramic membrane filters
WO2003021004A1 (en) * 2001-08-30 2003-03-13 The University Of Dundee Process for making thin film porous ceramic-metal composites and composites obtained by this process
WO2007057166A2 (de) * 2005-11-15 2007-05-24 Atech Innovations Gmbh Verfahren zur herstellung eines keramikbeschichteten metallischen trägersubstrates

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752736B2 (ja) * 1985-10-02 1995-06-05 工業技術院長 化合物半導体装置の製造方法
GB8606045D0 (en) * 1986-03-12 1986-04-16 Emi Plc Thorn Gas sensitive device
JPS63128246A (ja) * 1986-11-19 1988-05-31 Seitai Kinou Riyou Kagakuhin Shinseizou Gijutsu Kenkyu Kumiai 電界効果トランジスタ型酸素ガスセンサ
JP3883646B2 (ja) * 1997-02-14 2007-02-21 日本碍子株式会社 膜の形成方法と膜形成部品
JP4429145B2 (ja) * 2004-11-16 2010-03-10 キヤノン株式会社 半導体素子の製造方法
JP4555116B2 (ja) * 2005-02-18 2010-09-29 大日本印刷株式会社 積層体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3773549A (en) * 1971-11-30 1973-11-20 Union Carbide Corp Ceramic coated porous metal structure and process therefor
US5186833A (en) * 1991-10-10 1993-02-16 Exxon Research And Engineering Company Composite metal-ceramic membranes and their fabrication
GB2273672A (en) * 1992-12-24 1994-06-29 Atomic Energy Authority Uk Process for making ceramic membrane filters
WO2003021004A1 (en) * 2001-08-30 2003-03-13 The University Of Dundee Process for making thin film porous ceramic-metal composites and composites obtained by this process
WO2007057166A2 (de) * 2005-11-15 2007-05-24 Atech Innovations Gmbh Verfahren zur herstellung eines keramikbeschichteten metallischen trägersubstrates

Also Published As

Publication number Publication date
WO2008046785A2 (de) 2008-04-24
DE102006048906A1 (de) 2008-04-30
JP2010507018A (ja) 2010-03-04
EP2104752A2 (de) 2009-09-30
CN101535526A (zh) 2009-09-16

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