WO2008044436A1

WO2008044436A1 - Socket for pga-type ic, and method for assembling the socket for pga-type ic

Info

Publication number: WO2008044436A1
Application number: PCT/JP2007/068121
Authority: WO
Inventors: Shinichi Hashimoto; Hidenori Taguchi
Original assignee: Tyco Electronics Amp K.K.
Priority date: 2006-10-13
Filing date: 2007-09-19
Publication date: 2008-04-17
Also published as: TW200828701A; JP2008098051A

Abstract

Provided is a socket for a PGA-type IC, which keeps the mounted state of an electric part excellently, and which makes the arrangement of a socket contact highly dense. The PGA-type IC socket (1) comprises many contacts (5) to contact with a lead pin (71), a housing (2), in which contact accommodating portions (24) for accommodating the contacts (5) are two-dimensionally arrayed, and drive units (3) and (4) for moving the lead pin (71) in a moving direction (X). The contacts (5) include base portions (51) to be fixed in the contact accommodating portions, and elastic contact members (52) to contact with the lead pin (71) moved in the moving direction. Each of the contact accommodating portions (24) includes a pin receiving portion (25) for receiving the lead pin (71) arranging the elastic contact member (52), and a fixing portion (26) disposed to communicate with the pin receiving portion, for press-fitting the base portion (51) of the contact (5). The pin receiving portion (25) is made larger in the inner size in the moving direction (X) than the fixing portion (26), and continues to the fixing portion (26) across a step (251).

Description

Specification

PGA type IC socket and PGA type IC socket assembly method

Technical field

TECHNICAL FIELD [0001] The present invention relates to an IC socket, and more particularly, to a PGA type IC socket to which a PGA type (pin grid array type) IC having a large number of lead pins is mounted, and an assembling method thereof. Background art

[0002] As a socket for mounting a PGA type IC package, it has a large number of socket contacts for connecting to lead pins, and a cavity that accommodates these contacts. Types of IC sockets are known. When a PGA type IC package is installed in this IC socket, the IC package is first placed on the socket nosing so that the lead pins are inserted into the cavity. Thereafter, the electrical component moves relative to the socket housing in a direction perpendicular to the inserted direction, so that the pin is electrically connected to the socket contact.

In recent years, with the increase in functionality of electronic devices, the number of mounted IC packages has been increased. In order to mount a multi-pin IC package in a limited space, high-density arrangement of lead pins and socket contacts is required for IC packages and IC sockets. In view of this, an IC socket having a higher socket contact arrangement density has been proposed (for example, see Patent Document 1).

FIG. 13 is a partially enlarged sectional view showing the structure of a conventional PGA IC socket.

14 is a diagram showing socket contacts used in the PGA type IC socket shown in FIG.

[0005] A PGA type IC socket 901 shown in FIG. 13 has a plurality of socket contacts 922 that respectively contact a large number of lead pins 952 of an IC package 950, and a cavity 954 that accommodates the socket contacts 922 arranged in a matrix. A thin plate-shaped socket housing 902 and a slide cover 906 that is slidably provided on the upper portion of the socket housing 902 and moves the IC package 950 relative to the socket housing 902 are provided. As shown in FIG. 14, socket contact 922 is a pair of hooks that contact lead pin 952 (see FIG. 13). The elastic contact piece 960 is provided with a strut 966 at the tip thereof. When the IC package 950 is attached to the PGA type IC socket 901 shown in FIG. 13, first, the lead pin 952 is inserted into the cavity 954 through the through hole 910 formed in the slide cover 906. Next, when the slide cover 906 is slid in the direction indicated by the arrow by an operation of a lever or the like (not shown), the lead pin 952 force is sandwiched between the pair of elastic contact pieces 960 of the socket contact 922 and comes into contact with the elastic contact piece 960. The stagger 966 prevents the lead pin 952 from being detached from the elastic contact piece 960.

[0006] In the conventional PGA type IC socket 901 shown in FIG. 13, a notch 978 opened on the IC package 950 side is formed on the inner wall 970 of the cavity 954, and it is adjacent along the moving direction of the lead pin 952. A plurality of such cavities 954 communicate with each other. For this reason, the arrangement interval of the socket contacts 922 can be narrowed by the notch 978, and the socket contacts 922 are arranged with high density.

Patent Document 1: Japanese Patent Laid-Open No. 2005-209617

Disclosure of the invention

Problems to be solved by the invention

[0007] However, in the conventional PGA type IC socket 901 shown in FIG. 13, the inner wall on the IC package 950 side is lacking, which causes an imbalance in the structure of the socket housing 902 viewed in the thickness direction. . For this reason, when the socket housing 902 is manufactured by resin molding, warping tends to occur when the resin is solidified. Further, the socket housing 902 has a thin plate shape and is likely to warp due to a difference in stress between the front surface and the back surface. If a warping force S is generated on the socket nosing 902, it is not easy to evenly connect the socket contacts 922 to the circuit board.In addition, the lead pin 952 of the IC package 950 is inserted into the cavity 954 to the socket contact 922. The contact depth also differs for each lead pin 952.

[0008] The position of the lead pin 952 that contacts the elastically deformed elastic contact piece 960 is

Force determined by the magnitude of the force applied to the 952 in the direction of movement In an IC package 950 with a large number of lead pins 952, the force applied to each one of the lead pins 952 must be kept in a precise and uniform state. Is not easy. Therefore, it is difficult to position each of the lead pins 952 at the target position in the cavity 954. [0009] In view of the above circumstances, the present invention solves a problem that aims to provide a socket for a PGA type IC in which the mounting state of electrical components is maintained well and the arrangement of socket contacts is increased in density. Means for

[0010] The socket for PGA type IC of the present invention that solves the above-mentioned problems accommodates a large number of socket contacts that come into contact with a large number of lead pins provided in the counterpart electrical component, and accommodates this socket contact in the same direction. In addition, socket nosing in which a large number of contact receiving portions into which the large number of lead pins are respectively inserted is two-dimensionally arranged, and a drive for moving the lead pins in a moving direction perpendicular to the inserting direction of the lead pins A pair of elastic contact pieces extending from the base, which are in contact with the base fixed to the contact accommodating portion and the lead pin moved in the moving direction.

Have

Each of the multiple contact accommodating parts

A pin receiving portion for receiving a lead pin, wherein the pair of elastic contact pieces are arranged; and a lead receiving portion in the socket housing that penetrates to the back side opposite to the front side where the lead pin is inserted. Provided with a fixed portion in which the base portions of the multiple contacts are press-fitted and fixed,

The pin receiving portion is characterized in that the inner dimension in the moving direction is larger than that of the fixed portion, and the pin receiving portion continues with a step between the fixed portion.

In the PGA type IC socket of the present invention, after the lead pin is inserted into the pin receiving portion of the contact receiving portion, the lead pin is moved in the moving direction perpendicular to the inserting direction, thereby being arranged in the pin receiving portion. Contact the elastic contact piece of the placed socket contact. The pin receiving part continues with a step between the base part of the socket contact and the press-fitted and fixed part, and the internal dimension in the moving direction is larger than that of the fixed part. Therefore, since the wall is secured at the pin receiving portion for receiving the lead pin, the warp of the socket housing is suppressed, and the lead pin is positioned accurately by being abutted against the pin receiving portion wall. The contact between the contact pin and the lead pin is stabilized. Moreover, it is possible to increase the density of the socket contacts while avoiding interference between the lead pins and the pin receiving portion wall. In addition, since the lead pin is positioned by the wall of the pin receiving portion, the elastic contact piece is not required. For this reason, a pair of elastic contact pieces that only contribute to high density become symmetrical and easy to manufacture.

Here, in the PGA type IC socket of the present invention, the base portion has a pair of first press-fitting protrusions press-fitted into the fixing portion, and the elastic contact piece is formed on the first portion of the base portion. It is preferable that it extends into the pin receiving part from the position on the back surface side to the front surface side with respect to the press-fitting protrusion!

[0013] The position of the first press-fit protrusion is closer to the front surface side of the fixed part, that is, the pin receiving part side, because the elastic contact piece extends from the first press-fit protrusion toward the back side. Can be placed at the position S. Therefore, it is possible to press the force S in the vicinity of the center in the thickness direction, which has little influence on the warp of the socket housing, while securing a depth for receiving the lead pin in the pin receiving portion.

[0014] In the PGA type IC socket of the present invention, the base includes a pair of second press-fit protrusions that are provided on the back surface side of the first press-fit protrusion and press-fitted into the fixed part. Preferably, the distance between the pair of first press-fit protrusions is equal to or less than the distance between the pair of second press-fit protrusions.

Thus, in the manufacturing process of the PGA type IC socket, the socket contact connected to the carrier is inserted into the contact housing portion of the socket housing from the back side, and thereafter

The carrier can be cut on the back side of the contact accommodating portion. Therefore, compared to the case where the carrier is cut on the surface side of the contact receiving portion, the remaining carrier after cutting does not stay in the pin receiving portion, so that the inner size of the pin receiving portion is reduced by this amount to make the socket contact more dense. Can be arranged.

[0016] Further, in the PGA type IC socket of the present invention, a wall between contact accommodating portions adjacent to each other in the moving direction among the plurality of contact accommodating portions is both in the moving direction and the inserting direction. It is preferable that the thickness increases as the distance from the central portion increases in the orthogonal direction. [0017] The thinner the wall between adjacent contact housings, the larger the internal dimensions, or the force with which the socket contacts can be placed at a higher density. The thinner part is when molding the socket housing. In addition, it is difficult to fill with molten mold resin. Thickness increases as the wall between contact housing parts moves away from the central part, ensuring the maximum space for the lead bin to move in the direction of movement, while ensuring good mold resin filling in housing molding Can be done.

[0018] Further, in the socket for PGA type IC of the present invention, the socket contact is formed such that the pair of elastic contact pieces are shifted in the moving direction from the base portion.

The fixing portion is formed with the step between the pin receiving portion and the rear in the moving direction.

The socket contact is preferably fixed to the fixed portion in a direction in which the direction in which the pair of elastic contact pieces are displaced with respect to the base is the front in the moving direction.

Yes

[0019] The lead pin is moved by disposing the elastic contact piece in front of the moving direction and setting the rear side of the moving direction opposite to the side where the step is formed as a position where the lead pin is inserted into the pin receiving portion. Space can be secured to the maximum.

[0020] In addition, the method for assembling the PGA type IC socket of the present invention that achieves the above-described object includes a large number of socket contacts that respectively contact a large number of lead pins provided on the counterpart electrical component, and the socket contacts respectively. Sockets and housings that are accommodated in the same orientation and in which a large number of contact accommodating portions into which the above-mentioned numerous lead pins are respectively inserted are two-dimensionally arranged, and the direction of movement perpendicular to the insertion direction of the lead pins A pair of elastic contact pieces extending from the base, the socket contact being in contact with the base fixed to the contact receiving portion, and the lead pin moved in the moving direction. A method for assembling a socket for a PGA type IC having:

Forming the socket contact in a state where the base is coupled to a carrier for carrying the socket contact;

The surface where the lead pin is inserted into the contact accommodating portion of the socket contact Inserting from the back side opposite to the side,

And a step of cutting the carrier from the socket contact on the back surface side.

[0021] According to the method for assembling the PGA type IC socket of the present invention, since the remaining portion of the carrier after cutting does not remain in the pin receiving portion as compared with the case where the carrier is cut on the surface side of the contact accommodating portion, the pin receiving portion The inner dimension of the part is reduced by this amount, and the socket contact is arranged with higher density by force S.

The invention's effect

[0022] According to the present invention, there is provided a PGA type IC socket and a method of assembling the PGA type IC socket in which the mounting state of the electrical components is maintained well and the socket contact arrangement is densified. Realize.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of a socket for a PGA type IC of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of an IC socket according to an embodiment of the present invention, and FIG. 2 is a front view of the IC socket of FIG.

[0025] An IC socket 1 shown in FIGS. 1 and 2 includes a socket housing (hereinafter simply referred to as a housing) 2, a slide cover 3 slidably provided on the housing 2, and a slide cover 3. It has a lever 4 for sliding. The slide cover 3 and the lever 4 correspond to an example of the drive unit according to the present invention.

[0026] The slide cover 3 is a formed product made of an insulating resin. A plurality of long holes 32 are provided in each of the side walls 31 of the slide cover 3. Each of the long holes 32 is engaged with a protrusion (not shown) of the housing 2. For this reason, the slide cover 3 slides on the housing 2. The slide cover 3 is formed with a large number of through holes 33 arranged in a matrix. When a PGA type IC package as an electrical component is placed on the slide cover 3, a large number of lead pins (see FIG. 11) provided on the lower surface of the PGA type IC package are inserted into the through holes 33, respectively. .

The housing 2 is a formed product made of an insulating resin, and accommodates the socket contact 5 (see FIG. 3) under the through hole 33 of the slide cover 3. The housing 2 has a lever A plurality of holding projections 22 and 23 are provided for holding the pin 4 rotatably.

[0028] The lever 4 is a substantially L-shaped member formed by bending a metal rod, and one side is sandwiched between the holding protrusions 22 and 23 of the housing 2 to form the rotary shaft 4a, and the other side is It is held up and down freely against the housing 2. The tip on the other side is an operation portion 4b. A crank coupled to the slide cover 3 is formed on the rotating shaft 4a sandwiched between the holding protrusions 22 and 23, and the slide cover 3 slides when the lever 4 is raised and lowered.

When a PGA type IC package 70 (see FIG. 5) provided with lead pins is attached to the IC socket 1, first, the lever 4 is operated from the state shown in FIG. Next, from the side of the slide cover 3 of the IC socket 1, the PGA type IC package 70 force lead pin is put through the through hole 33. Next, when the lever 4 is rotated and tilted to the state shown in FIGS. 1 and 2, the slide cover 3 slides. The PGA type IC package 70 is pushed by the slide cover 3 and moves along the moving direction X perpendicular to the insertion direction Z. As the PGA IC package moves, the lead pin 71 is connected to the socket contact 5 (see Fig. 5) housed in the housing 2. In the state before the lever 4 is tilted, the socket contact 5 does not contact the lead pin 2, so the IC socket 1 is placed on the slide cover 3 with zero or low input.

[0030] In the IC socket 1 shown in FIG. 1 and FIG. 2, the direction in which the PGA type IC package moves by the slide of the slide cover 3 is referred to as the moving direction X. Of these, when the lever 4 is tilted, The direction in which the IC package moves is called forward F, and the opposite direction is called backward B. The direction in which the lead pin is inserted is referred to as insertion direction Z. Of these, the direction on the side where the slide cover 3 is disposed is referred to as upward U, and the opposite direction is referred to as downward D.

FIG. 3 is an external view showing the socket contact 5 provided in the IC socket 1 of FIG. Part (a) of FIG. 3 is a plan view of the socket contact 5. Part (b) is a front view, part (c) is a right side view, part (d) is a rear view, and part (e) is a bottom view. FIG. 3 also shows arrows B, F, U, and D indicating the orientation of the IC socket 1 in a state where the socket contact 5 is accommodated in the housing 2.

[0032] The socket contact 5 shown in FIG. 3 is formed by punching and bending a metal plate. A base 51 having a flat plate shape, a pair of elastic contact pieces 52 extending from both sides of the base 51 so as to face each other, and a leg 53 formed at a lower portion of the base 51. It has one.

The base 51 has a main press-fit portion 511, a base main body portion 512, and a sub-press-fit portion 513. The main press-fit portion 511 is provided so as to extend upward via a constricted portion 514 formed on the upper edge of the base main body portion 512, and the sub press-fit portion 513 is formed on the lower edge of the base main body portion 512. A portion 515 is provided so as to extend downward. A pair of first press-fit projections 51 la for press-fitting into the housing 2 are formed on both side edges of the main press-fit portion 511, and a pair of second press-fit projections 513a are formed on both side edges of the sub press-fit portion 513. Is formed. In the present embodiment, the interval W1 between the pair of first press-fit protrusions 511a is formed to be smaller than the interval W2 between the pair of second press-fit protrusions 513a.

The pair of elastic contact pieces 52 includes a base end portion 521 that is bent from both side edges of the base portion main body 512 so as to be substantially perpendicular to the base portion 51 and extend in the movement direction X, and the base end portion 521. And a lead pin contact portion 522 formed so as to incline so as to approach each other. The elastic contact piece 52 is disposed at a position shifted in the movement direction X from the base 51. A guide portion 523 for guiding the lead pin is formed at the tip of the lead pin contact portion 522 so as to protrude rearward B. The pair of guide portions 523 are formed so as to expand on the same side as the base portion 51, that is, in the rearward direction B.

[0035] The leg 53 has a base portion via a constricted portion 516 formed at the lower edge of the sub press-fit portion 513 of the base portion 51.

The elastic contact piece 52 is bent in the same direction as the base end portion 521 of the elastic contact piece 52.

[0036] A pair of connecting pieces 513b that are integrally connected to a carrier for holding the socket contact 5 in the manufacturing process of the socket contact 5 are formed at both ends of the lower edge of the sub press-fit portion 513 of the base 51.

FIG. 4 is a diagram showing a state in which the socket contact shown in FIG. 3 is coupled to the carrier.

Part ( _a ) in FIG. 4 is a front view corresponding to part (b) in FIG. 3, and part (b) in FIG. 4 is a right side view corresponding to part (c) in FIG.

The socket contact 5 is formed by punching and bending a metal plate as described above. More specifically, it is first formed integrally with the carrier 6 by punching. Next, it is bent while being bonded to the carrier, and finally cut from the carrier 6. FIG. 4 shows the socket contact 5 and the carrier 6 when the punching and folding processes are completed. A plurality of socket contacts 5 are connected to the carrier 6 via a pair of connecting pieces 513b. The carrier 6 is arranged on the U side facing down with respect to each socket contact 5.

[0039] Next, the housing in which the contacts shown in FIG. 3 are arranged and the state in which the contact is arranged in the housing will be described.

FIG. 5 is a partially enlarged cross-sectional view of the IC socket 1 in which the socket contact 5 is arranged, and FIG. 6 is a partially enlarged plan view of the IC socket 1 shown in FIG. 7 is a partially enlarged plan view of the housing 2 with the slide cover removed from the IC socket shown in FIG. 5, and FIG. 8 is a partially enlarged bottom view of the housing 2 shown in FIG. FIG. 9 is a cross-sectional view taken along line 9 9 of the IC socket 1 shown in FIG.

As shown in FIG. 7, the housing 2 has a contact accommodating portion for accommodating the socket contact 5.

24 are arranged two-dimensionally. As shown in FIG. 5, the contact accommodating portion 24 is formed with a hole 24a penetrating the housing 2 in the insertion direction Z, and the socket contact 5 is accommodated in the hole 24a. All socket contacts 5 of the IC socket 1 are accommodated in the contact accommodating portion 24 in the same direction. When the PGA type IC package 70 is attached to the IC socket 1, the lead pin 71 of the PGA type IC package 70 is placed in the insertion direction Z, that is, the side where the slide cover 3 is arranged, that is, the housing. Inserted from the surface 2a side of 2. Solder balls 54 for connecting to the circuit board C (see FIG. 2) are attached to the legs 53 of the socket contact 5.

[0042] As shown in FIG. 5, the contact accommodating portion 24 communicates with the pin receiving portion 25 on the front surface 2a side and the pin receiving portion 25, and penetrates to the back surface 2b side opposite to the front surface 2a side. It is composed of a fixed part 26 provided. The socket contact 5 is fixed to the fixing portion 26. An inner wall 253 is secured between the pin receiving portions 25, and the warpage of the housing is suppressed. However, each pin receiving portion 25 has a larger internal dimension in the movement direction X than the fixed portion 26, and continues with a step 251 between the pin receiving portion 25 and the fixed portion 26. The step 251 is formed on the rear B side in the movement direction X. The slide cover 3 shown in FIGS. 5 and 6 is in an initial position, that is, a position before sliding, and the through hole 33 is positioned substantially above the base 51 of the socket contact 5. In the through hole 33, a taper 33a for guiding the lead pin is formed. The lead pin guided by the through hole 33 is inserted into a region R shown in FIG.

As shown in FIG. 7, the inner wall 253 between the contact accommodating portions 24 adjacent to each other in the movement direction X is 253 force away from the central portion in the width direction Y orthogonal to both the movement direction X and the insertion direction Z. It is formed to increase the thickness t as the force increases. The thickness T1 of the inner wall 253 at the center is equal to or greater than the minimum dimension that allows the molten mold resin to enter the mold when the housing 2 is molded. As the distance from the center increases, the thickness becomes thicker than T1. On the contrary, the internal dimension s of the pin receiving portion 25 increases as it approaches the central portion in the width direction Y.

[0045] As shown in FIG. 9, a pair of stepped portions 26 is provided on the upper portion of the wall surface 262 of the fixed portion 26 following the step 251.

261 is formed. For this reason, of the internal dimensions in the width direction Y along the wall surface 262 following the step 251 of the fixed part 26, the dimension U1 at the upper part where the step part 261 is formed is the dimension U2 at the lower part. Smaller than //. This difference in dimension is substantially commensurate with the difference between the distance W1 between the first press-fit protrusions 51la of the socket contact 5 and the distance W2 between the second press-fit protrusions 513a. Further, as shown in FIG. 5, the fixed portion 26 is provided with a pair of guide portions 261a protruding adjacent to the step portion 261. Further, as shown in FIG. 7, the wall surface 264 of the fixing portion 26 is inclined with respect to the wall surface 262 on the opposite side, and the fixing portion 26 is attached to the back surface 2b of the housing 2 even in the movement direction X. The shape becomes wider as it gets closer. In this way, the fixing portion 26 has a shape in which the opening 26b of the back surface 2b is wider than the back side so that the socket contact 5 can be inserted from the back surface 2b when the IC socket 1 is assembled.

[0046] When the socket contact 5 is accommodated in the contact accommodating portion 24, the base portion 51 of the socket contact 5 is press-fitted and fixed to the fixing portion 26, and the elastic contact piece 52 of the socket contact 5 is disposed in the pin receiving portion 25. ing. The socket contact 5 is arranged such that the base 51 is in contact with the wall surface 262 following the step 251 of the fixed portion 26. As shown in FIG. 9, the first press-fitting protrusion 511a is press-fitted between a pair of step portions 261 on the upper side of the fixing portion 26. Further, the second press-fitting protrusion 513a is press-fitted to the lower side of the fixed portion 26. At this time, the internal dimensions Ul and U2 of the fixing part 26 and the socket The intervals Wl and W2 between the press-fitting protrusions of the contact 5 are adjusted to be larger than the press-fitting force 1S by the first press-fitting protrusion 511a and the press-fitting force by the second press-fitting protrusion 513a. Further, the elastic contact piece 52 of the socket contact 5 extends from the position on the back surface 2b side with respect to the first press-fit protrusion 511a, and the first press-fit protrusion 511a is in the thickness direction of the socket housing as shown in FIG. It is press-fitted near the center in the entry direction Z. Therefore, the warpage of the housing 2 is suppressed.

In addition, as shown in FIG. 5, the elastic contact piece 52 of the socket contact 5 is disposed at a position shifted forward F in the movement direction X from the base 51. The socket contact 5 is fixed to the contact accommodating portion 24 in such a direction that the elastic contact piece 52 is displaced forward F from the base portion 51.

Yes

Here, a method of assembling the IC socket 1 shown in FIG. 5 will be described once.

FIG. 10 is a diagram for explaining an assembly method of the IC socket shown in FIG.

[0050] In order to assemble the IC socket 1, first, the housing 2 is obtained by molding in the first step. Further, the socket contact 5 is formed integrally with the carrier 6 in a second step in parallel with or before and after the first step (see FIG. 4). Next, in the third step, as shown in FIG. 10, the socket contact 5 obtained in the second step is inserted into the contact accommodating portion 24 of the housing 2 obtained in the first step. . Since the socket contact 5 is inserted from the back surface 2 b side, the distance W 1 between the pair of first press-fit protrusions 51 la of the socket contact 5 (see FIG. 3) is greater than the distance W2 between the pair of second press-fit protrusions 513a. Is also small. In order to completely insert the small socket contact 5 into the contact accommodating portion 24, the socket contact 5 is inserted into the contact accommodating portion 24 while holding the carrier 6. FIG. 10 shows a state in which the insertion of the socket contact 5 into the right contact accommodation portion 24 of the three contact accommodation portions 24 is completed, and the socket contact 5 is about to be inserted into the central contact accommodation portion 24. It is shown. Next, in the fourth step, the socket contact 5 and the carrier 6 are separated on the back surface 2b side. In this assembling method, since the socket contact 5 is inserted with the back surface 2b side force of the housing 2, the carrier 6 is cut on the back surface 2b side. Therefore, the connecting piece 513b (see FIG. 3), which is the remaining portion of the carrier after cutting, does not stay on the pin receiving portion 25, and accordingly, the arrangement interval of the socket contacts 5 can be reduced. In the next fifth step, Attach the drive unit (see Fig. 1) consisting of lever 4 and slide cover 3 to uzing 2. This completes the IC socket 1.

[0051] Next, the state when the PGA type IC package 70 is mounted in the IC socket 1 will be described.

11 and 12 are partially enlarged views showing a state before and after the slide cover is moved, FIG. 11 is a partially enlarged view corresponding to FIG. 5, and FIG. 12 is a plurality of views shown in FIG. FIG. 5 is a partially enlarged view showing one of the socket contacts. In both FIG. 11 and FIG. 12, part (a) shows the state before moving the slide cover, and part (b) shows the state after moving the sliding force bar. RU

[0053] First, when the PGA type IC package 70 is placed on the slide cover 3, the lead pin 71 passes through the through-hole 33 and the pin receiving portion 25 on the rear B side in the movement direction X, that is, elastic contact. It is inserted on the side opposite to the side where the piece 52 is arranged. The pin receiving portion 25 has a larger internal dimension in the moving direction than the fixed portion, and a pin insertion region R that does not interfere with the negative contact piece 52 is secured under the through hole 33. (See part (a) of Figure 12). Lead pin 71 force By avoiding contact with the elastic contact piece 52 and being inserted into the pin receiving portion 25, the IC socket 1 is placed on the slide cover 3 with zero input.

Next, when the lever 4 is operated and the slide cover 3 moves forward F, the PGA type IC package 70 moves relative to the housing 2 along with the movement of the slide force bar 3. The socket contact 5 is fixed in the housing 2, and the lead pin 71 of the PGA type IC package 70 is guided by a pair of guide portions 523 provided in the socket contact 5 as shown in part (b) of FIG. Between the pair of elastic contact pieces 52. The lead pin 71 is finally positioned against the wall surface 254 of the pin receiving portion 25 opposite to the side where the step 251 is formed. Therefore, all the lead pins 71 are finally precisely positioned at the position of the wall surface 254 without being affected by the magnitude of the force by which the lead pins 71 move.

[0055] In the above-described embodiment, the force S described in the example in which the interval W1 between the first press-fit protrusions 51 la is formed smaller than the interval W2 between the second press-fit protrusions 513a, Not limited to this. For example, the distance between the first press-fit protrusions is the distance between the pair of second press-fit protrusions. Equal to! /, Even stuff! / ...

Brief Description of Drawings

FIG. 1 is a plan view of an IC socket according to an embodiment of the present invention.

FIG. 2 is a front view of the IC socket of FIG.

3 is an external view showing a socket contact 5 provided in the IC socket 1 of FIG.

4 is a view showing a state in which the socket contact shown in FIG. 3 is coupled to a carrier.

FIG. 5 is a partially enlarged cross-sectional view of an IC socket 1 in which socket contacts 5 are arranged.

FIG. 6 is a partially enlarged plan view of the IC socket 1 shown in FIG.

FIG. 7 is a partially enlarged plan view of the housing 2 with the slide cover removed from the IC socket shown in FIG. 5.

8 is a partially enlarged bottom view of the housing 2 shown in FIG.

FIG. 9 is a sectional view taken along line 9-9 of the IC socket 1 shown in FIG.

FIG. 10 is a diagram for explaining a method of assembling the IC socket shown in FIG.

FIG. 11 is a partially enlarged view corresponding to FIG. 5, showing a state before and after the slide cover is moved.

FIG. 12 is a partially enlarged view showing one of the socket contacts showing the state before and after the slide cover is moved.

FIG. 13 is a partially enlarged sectional view showing a structure of a conventional IC socket.

14 is a view showing a socket contact used for the IC socket shown in FIG.

Explanation of symbols

[0057] 1 socket (Socket for PGA type IC)

2 Housing (socket housing)

2a Nosing surface

2b Rear side of housing

24 Contact housing

25 Pin receptacle

251 steps

252 wall surface 253 Inner wall (wall) 26 Fixed part

261 Step

3 Slide cover (drive

4 Lever (drive unit)

5 Soget contact

51 Base

52 Elastic contact piece

53 Leg

511 Main press-fit part

511a First press-fit protrusion

513a Second press-fit protrusion

6 Career

X movement direction

Y width direction

Z Insertion direction

Claims

The scope of the claims

[1] A large number of socket contacts that come into contact with a large number of lead pins provided on an electrical component of the other party, and a large number of contacts that accommodate the socket contacts in the same direction and into which the large number of lead pins are respectively inserted. A socket housing in which the parts are two-dimensionally arranged, and a drive unit that moves the lead pin in a moving direction perpendicular to the insertion direction of the lead pin,

The socket contact has a base portion fixed to the contact housing portion, and a pair of elastic contact pieces extending from the base portion that are in contact with the lead pins moved in the moving direction, and the plurality of contact housing portions. Each of

A pin receiving portion for receiving a lead pin, wherein the pair of elastic contact pieces are disposed; and a lead receiving portion that is in communication with the pin receiving portion and into which the lead pin in the socket housing is inserted. Provided with a fixing portion in which the base portions of the multiple contacts are press-fitted and fixed,

The PGA type IC socket is characterized in that the pin receiving portion has a step difference between the pin receiving portion and the fixed portion having a larger internal dimension in the moving direction than the fixed portion.卜.

[2] The base has a pair of first press-fitting protrusions press-fitted into the fixed part, and the elastic contact piece is located on the front side from a position on the back side with respect to the first press-fitting protrusions on the base. 2. The PGA type IC socket according to claim 1, wherein the socket extends in the pin receiving portion.

[3] The base portion has a pair of second press-fit protrusions that are press-fitted into the fixed portion, provided on the back side of the first press-fit protrusion, and a distance between the pair of first press-fit protrusions. 2. The socket for PGA type IC according to claim 1, wherein the socket is not larger than the distance between the pair of second press-fitting protrusions.

[4] Of the large number of contact accommodating portions, the wall between the contact accommodating portions adjacent to each other in the moving direction increases in thickness as it moves away from the central portion in a direction perpendicular to both the moving direction and the insertion direction. The socket for PGA type IC according to claim 1, wherein the socket is for PGA type IC.

[5] The socket contact is one in which the pair of elastic contact pieces is formed at a position shifted in the movement direction from the base portion.

The fixing portion is formed with the step between the pin receiving portion and the rear in the moving direction,

2. The socket contact according to claim 1, wherein the socket contact is fixed to the fixed portion in a direction in which the direction in which the pair of elastic contact pieces is displaced from the base portion is the front in the moving direction. Socket for PGA type IC.

[6] A large number of socket contacts that come into contact with a large number of lead pins provided on the electrical component of the other party, and a large number of contacts that accommodate the socket contacts in the same direction and into which the large number of lead pins are respectively inserted. A socket housing having two-dimensionally arranged parts, and a drive part for moving the lead pin in a moving direction perpendicular to the insertion direction of the lead pin, and the socket contact is fixed to the contact accommodating part. And a method for assembling a socket for a PGA type IC having a pair of elastic contact pieces extending from the base and contacting the lead pin moved in the moving direction.

Forming the socket contact with the base coupled to a carrier for carrying the socket contact;

Inserting the socket contact into the contact housing portion from the back side opposite to the front side into which the lead pin is inserted;

A method of assembling a socket for a PGA type IC, comprising: a step of cutting the carrier from the socket contact on the back surface side.