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WO2007001179A3 - Method and device for supplying and discharging carriers with electronic components - Google Patents

Method and device for supplying and discharging carriers with electronic components Download PDF

Info

Publication number
WO2007001179A3
WO2007001179A3 PCT/NL2006/050101 NL2006050101W WO2007001179A3 WO 2007001179 A3 WO2007001179 A3 WO 2007001179A3 NL 2006050101 W NL2006050101 W NL 2006050101W WO 2007001179 A3 WO2007001179 A3 WO 2007001179A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
supplying
processing station
carriers
discharging carriers
Prior art date
Application number
PCT/NL2006/050101
Other languages
French (fr)
Other versions
WO2007001179A2 (en
Inventor
Driel Albertus Franciscus Van
Johannes Lambertus Ge Venrooij
Original Assignee
Fico Bv
Driel Albertus Franciscus Van
Johannes Lambertus Ge Venrooij
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Driel Albertus Franciscus Van, Johannes Lambertus Ge Venrooij filed Critical Fico Bv
Priority to KR1020077027573A priority Critical patent/KR101236878B1/en
Priority to CN2006800140284A priority patent/CN101167172B/en
Publication of WO2007001179A2 publication Critical patent/WO2007001179A2/en
Publication of WO2007001179A3 publication Critical patent/WO2007001179A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention relates to methods for displacing a carrier (2, 32) with electronic components from a supply container (1, 24, 35) to a processing station (20, 31) , methods for displacing a carrier (2, 32) with electronic components from a processing station(20, 31) to a supply container (3,45) , as well as to methods for supplying to a processing station(20, 31) and discharging from a processing station (20, 31) of carriers (2 , 32) with electronic components. The invention also relates to devices (30) for displacing a carrier (2, 32) with electronic components between a supply container (1, 3, 24, 35,45) and a processing station(20, 31) , and to an assembly of such devices (30) with a processing station (20, 31) for carriers (2, 32) with electronic components .
PCT/NL2006/050101 2005-04-29 2006-04-25 Method and device for supplying and discharging carriers with electronic components WO2007001179A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020077027573A KR101236878B1 (en) 2005-04-29 2006-04-25 Method and device for supplying and discharging carriers with electronic components
CN2006800140284A CN101167172B (en) 2005-04-29 2006-04-25 Method and device for supplying and discharging carriers with electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1028907A NL1028907C2 (en) 2005-04-29 2005-04-29 Method and device for supplying and removing carriers with electronic components.
NL1028907 2005-04-29

Publications (2)

Publication Number Publication Date
WO2007001179A2 WO2007001179A2 (en) 2007-01-04
WO2007001179A3 true WO2007001179A3 (en) 2007-08-16

Family

ID=35756366

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2006/050101 WO2007001179A2 (en) 2005-04-29 2006-04-25 Method and device for supplying and discharging carriers with electronic components

Country Status (6)

Country Link
KR (1) KR101236878B1 (en)
CN (1) CN101167172B (en)
MY (1) MY162382A (en)
NL (1) NL1028907C2 (en)
TW (1) TWI453847B (en)
WO (1) WO2007001179A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6804409B2 (en) * 2017-08-04 2020-12-23 Ｔｏｗａ株式会社 Resin molding equipment and resin molded product manufacturing method
TWI671847B (en) * 2018-02-09 2019-09-11 鴻勁精密股份有限公司 Electronic component working equipment
DE102018205926B3 (en) * 2018-04-18 2019-08-29 Asm Assembly Systems Gmbh & Co. Kg Loading device, assembly system and method for assembling SMT circuit boards with SMT components
JP7068094B2 (en) * 2018-08-10 2022-05-16 アピックヤマダ株式会社 Work transfer device, resin transfer device and resin molding method
KR20220090156A (en) * 2020-12-22 2022-06-29 (주)테크윙 Apparatus for delivering electronic component and handler for testing electronic components

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128940A (en) * 1981-02-04 1982-08-10 Sony Corp Heat treating method for substrate
EP0272141A2 (en) * 1986-12-19 1988-06-22 Applied Materials, Inc. Multiple chamber integrated process system
GB2280141A (en) * 1993-07-22 1995-01-25 Towa Corp Method and apparatus for resin transfer encapsulation of electronic components
EP0713246A1 (en) * 1994-11-18 1996-05-22 Fico B.V. Modular moulding apparatus
US6069342A (en) * 1996-12-18 2000-05-30 Texas Instruments Incorporated Automated multiple lead frame strip radiant die attach material curing apparatus
US20020170672A1 (en) * 1997-06-04 2002-11-21 Ilya Perlov Method and apparatus for improved substrate handling
US20040115032A1 (en) * 2002-11-15 2004-06-17 Rainer Ostermann Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0783899B2 (en) * 1987-09-30 1995-09-13 三菱重工業株式会社 How to drive a roller leveler
NL1003366C2 (en) * 1996-06-18 1997-12-19 Fico Bv Apparatus and method for encapsulating products.
CN100410750C (en) * 2003-06-17 2008-08-13 友达光电股份有限公司 Bearing and overturning platform
NL1028824C2 (en) * 2005-04-20 2006-10-23 Fico Bv Method and device for moving electronic components arranged in a rectangular structure.

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57128940A (en) * 1981-02-04 1982-08-10 Sony Corp Heat treating method for substrate
EP0272141A2 (en) * 1986-12-19 1988-06-22 Applied Materials, Inc. Multiple chamber integrated process system
GB2280141A (en) * 1993-07-22 1995-01-25 Towa Corp Method and apparatus for resin transfer encapsulation of electronic components
EP0713246A1 (en) * 1994-11-18 1996-05-22 Fico B.V. Modular moulding apparatus
US6069342A (en) * 1996-12-18 2000-05-30 Texas Instruments Incorporated Automated multiple lead frame strip radiant die attach material curing apparatus
US20020170672A1 (en) * 1997-06-04 2002-11-21 Ilya Perlov Method and apparatus for improved substrate handling
US20040115032A1 (en) * 2002-11-15 2004-06-17 Rainer Ostermann Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates

Also Published As

Publication number Publication date
WO2007001179A2 (en) 2007-01-04
TW200727383A (en) 2007-07-16
KR20080005447A (en) 2008-01-11
KR101236878B1 (en) 2013-02-26
NL1028907C2 (en) 2006-10-31
CN101167172A (en) 2008-04-23
MY162382A (en) 2017-06-15
TWI453847B (en) 2014-09-21
CN101167172B (en) 2010-05-19

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