WO2006043629A1

WO2006043629A1 - Adapter, manufacturing method thereof, and electric inspection device for circuit device

Info

Publication number: WO2006043629A1
Application number: PCT/JP2005/019307
Authority: WO
Inventors: Kiyoshi Kimura; Fujio Hara; Daisuke Yamada
Original assignee: Jsr Corporation
Priority date: 2004-10-22
Filing date: 2005-10-20
Publication date: 2006-04-27
Also published as: TW200635159A

Abstract

There is provided an adapter capable of surely achieving a predetermined electric connection regardless of an arrangement pattern of electrodes to be inspected and capable of surely achieving a predetermined electric connection even when the electrodes to be inspected have a minute pitch and are arranged with a high density. There are also disclosed a manufacturing method of the adapter and an electric inspection device for a circuit device. The adapter manufacturing method is as follows. On a contact member complex having a plurality of contact members showing magnetism and formed on a metal foil, there is formed a conductive elastomer material layer containing magnetic conductive particles. On the material layer, a plurality of metal masks having magnetism are arranged so as to oppose to the contact members. A magnetic field is applied in the thickness direction of the material layer and hardening process is performed to form a conductive elastomer layer, which is machined by laser so as to form a plurality of conductive path forming parts. After the metal masks are removed, the contact member complex is superimposed on the adapter main body where an insulation part material layer is formed. A connection electrode and a corresponding conductive path forming part are grounded. The insulation part material layer is hardened so as to form an insulation part.

Description

Technical field of adapter device, manufacturing method thereof, and electrical inspection device for circuit device

The present invention relates to an adapter device used for electrical inspection of a circuit device such as a printed circuit board, a method for manufacturing the same, and an electrical inspection device for a circuit device including the adapter device.

Background art

[0002] Generally, a circuit board for constituting or mounting an integrated circuit device or other electronic components is not suitable before assembling the electronic components or before mounting the electronic components. In order to confirm that the circuit board wiring pattern has the expected performance, it is necessary to inspect its electrical characteristics.

Conventionally, as a method of performing an electrical inspection of a circuit board, an inspection electrode device in which a plurality of inspection electrodes are arranged according to the grid point positions arranged in the vertical and horizontal directions, and the inspection electrode of this inspection electrode device are inspection targets. A method of using a combination with an adapter for electrically connecting an electrode to be inspected on a circuit board is known. In this method, the adapter used is a printed wiring board called a pitch conversion board.

This adapter has a plurality of connection electrodes arranged on one side according to a pattern corresponding to the electrodes to be inspected on the circuit board to be inspected, and has the same pitch as the inspection electrodes of the inspection electrode device on the other side. Having a plurality of terminal electrodes arranged at the grid point positions of the current supply connection electrodes and voltage measurement connection electrodes arranged according to a pattern corresponding to the electrodes to be inspected on the circuit board to be inspected on one side The former has a plurality of connection electrode pairs made of electrodes, and has a plurality of terminal electrodes arranged on the other surface at lattice point positions having the same pitch as the inspection electrodes of the inspection electrode device. This adapter is used for, for example, an open / short test of each circuit on a circuit board, and the latter adapter is used for an electric resistance measurement test of each circuit on the circuit board.

Therefore, in the electrical inspection of a circuit board, in general, in order to achieve a stable electrical connection between the circuit board to be inspected and the adapter, the circuit board to be inspected and the An anisotropic conductive elastomer sheet is interposed between the doveter.

[0003] This anisotropically conductive elastomer sheet has conductivity only in the thickness direction, or there are a number of pressure-conducting conductive portions that exhibit conductivity only in the thickness direction when pressed. It has something.

Such anisotropically conductive elastomer sheets are conventionally known in various structures, and typical examples thereof are those obtained by uniformly dispersing metal particles in an elastomer ( For example, refer to Patent Document 1.) By disperse the conductive magnetic metal particles unevenly in the elastomer, many conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other are formed. (For example, see Patent Document 2), and those in which a step is formed between the surface of the conductive path forming portion and the insulating portion (for example, see Patent Document 3).

For a circuit board having an inspection electrode with a small pitch, an anisotropic conductive elastomer sheet in which a conductive path forming portion is formed according to a pattern corresponding to the pattern of the inspection electrode on the circuit board is high. It is preferable in terms of connection reliability.

[0004] However, such an anisotropically conductive elastomer sheet is manufactured as a single product and handled alone, and is used for an adapter and a circuit board in electrical connection work. Therefore, it is necessary to hold and fix with a specific positional relationship.

However, in the means for achieving the electrical connection of the circuit board by using an independent anisotropic conductive elastomer sheet, the pitch of the electrodes to be inspected in the circuit board to be inspected, that is, the objects adjacent to each other. As the distance between the centers of the inspection electrodes decreases, it becomes difficult to align and hold the anisotropic conductive elastomer sheet.

In addition, even when the desired alignment and holding / fixing is realized, the degree of stress due to thermal expansion and contraction when a thermal history is received due to temperature changes, etc. Therefore, there is a problem that the electrical connection state is changed and a stable connection state is not maintained because the material constituting the material and the material constituting the anisotropic conductive elastomer sheet are greatly different. [0005] Conventionally, in order to solve the above-described problems, a connection electrode arranged according to a pattern corresponding to an electrode to be inspected on a circuit board to be inspected is provided on the surface, and arranged on a back surface according to a grid point position There has been proposed an adapter device comprising an adapter body having a terminal electrode formed thereon and an anisotropic conductive elastomer sheet integrally provided on the surface of the adapter body (for example, Patent Document 4 and Patent Document 5). See).

[0006] In manufacturing such an adapter device, the anisotropic conductive elastomer sheet is formed as follows, for example.

First, as shown in FIG. 38, the surface of the adapter main body 90 on which the connection electrode 91 is formed (the upper surface in FIG. 38) is hardened into a polymer substance forming material that becomes an elastic polymer substance. An anisotropic conductive elastomer material layer 95A is formed by applying an anisotropic conductive elastomer material in which particles are dispersed, for example, by screen printing.

Next, as shown in FIG. 39, for example, the ferromagnetic part 81 is arranged according to the same pattern as the inspected electrode of the circuit board to be inspected, and non-ferromagnetic part 81 is non-exposed. A ferromagnetic body 86 is arranged in accordance with a pattern of one template (hereinafter referred to as “upper mold”) 80 on which the magnetic body portion 82 is arranged, and the inspection target electrode and the palm of the circuit board to be inspected. And the other mold plate (hereinafter referred to as the “lower mold”) 85 in which the non-magnetic body part 87 is disposed in a part other than the ferromagnetic part 86, and the upper mold 80 and the lower mold. The adapter main body 90 in which the anisotropic conductive elastomer material layer 95A is formed between the adapter body 90 and the connecting electrode 91 is the ferromagnetic part 81 of the upper mold 80 and the ferromagnetic body of the lower mold 85. In addition, a pair of electromagnets 83 and 88 are disposed on the upper surface of the upper mold 80 and the lower surface of the lower mold 85. .

[0008] Then, by operating the electromagnets 83 and 88, a parallel magnetic field is applied in the direction of the force from the ferromagnetic body portion 81 of the upper mold 80 to the corresponding ferromagnetic body 86 of the lower mold 85. At this time, each of the ferromagnet part 81 of the upper mold 80 and the ferromagnet part 86 of the lower mold 85 acts as a magnetic pole, so that the ferromagnet part 81 of the upper mold 80 and the ferromagnet part of the lower mold 85 A magnetic field with a larger intensity acts on the region between the two regions than the other regions. As a result, the anisotropic conductive elastomer material layer 95A is dispersed in the anisotropic conductive elastomer material layer 95A. The thus-obtained conductive magnetic particles are located on the portion located between the ferromagnetic portion 81 of the upper die 80 and the ferromagnetic portion 86 of the lower die 85, that is, on the connection electrode 91 of the adapter body 90. It is directed to move to the part to gather, gather at the part, and further aligned in the thickness direction. In this state, the anisotropic conductive elastomer material layer 95A is hardened by heating, for example, so that a plurality of conductive path forming portions 96 extending in the thickness direction are mutually connected as shown in FIG. An anisotropic conductive elastomer sheet 95 composed of an insulating portion 97 that insulates the electrode body 90 is integrally formed on the upper surface of the adapter body 90 with the conductive path forming portion 96 disposed on the connection electrode 91. The adapter device is manufactured.

[0009] According to such an adapter device, it is not necessary to align the anisotropic conductive elastomer sheet in the electrical inspection of the circuit board, and it is possible to cope with environmental changes such as thermal history due to temperature changes. However, a good electrical connection state is stably maintained, and thus high connection reliability can be obtained.

[0010] However, the adapter device has the following problems.

As a circuit board for configuring or mounting an electronic component, it is known that its electrodes are arranged in a frame shape along, for example, four sides of a rectangle, and an electrical inspection of such a circuit board is performed. For this purpose, as shown in FIG. 41, it is necessary to use an adapter device having an adapter body 90 in which connection electrodes 91 are arranged in a frame shape along four sides of a rectangle. In such an adapter device, as shown by a one-dot chain line in FIG. 41, for example, an anisotropic conductive elastomer sheet 95 is provided in a rectangular region including the connection electrode 91 on the surface of the adapter main body 90.

[0011] However, since the anisotropic conductive elastomer sheet 95 has an insulating portion at the center of the anisotropic conductive elastomer sheet 95, an anisotropic conductive elastomer material layer is formed in the formation of the anisotropic conductive elastomer sheet 95. As for the conductive particles existing in the central part of 95A, the moving distance becomes extremely long. As a result, it is difficult to reliably gather the conductive particles in the part to be the conductive path forming part. Therefore, the obtained conductive path forming part 96 is not filled with a required amount of conductive particles, and a considerable amount of conductive particles remains in the insulating part 97. An anisotropic conductive elastomer layer cannot be formed reliably. [0012] In addition, in integrated circuit devices, the number of electrodes increases with the increase in functionality and capacity, and the pitch of electrodes, that is, the distance force between the centers of adjacent electrodes, increases the density. It tends to be further promoted. Therefore, when an electrical inspection is performed on a circuit board for configuring or mounting such an integrated circuit device, an adapter device in which connection electrodes are arranged with high pitch force and high density must be used. is required.

Thus, in the manufacture of such an adapter device, when the anisotropic conductive elastomer sheet 95 is formed on the surface of the adapter body 90, it is natural that the ferromagnetic parts 8 1 and 86 have a very small pitch. It is necessary to use the upper mold 80 and the lower mold 85 arranged in

However, when such an upper die 80 and lower die 85 are used to form the anisotropic conductive elastomer sheet 95 as described above, as shown in FIG. 42, the upper die 80 and the lower die 85 are formed. In each of the molds 85, the separation distance between a certain ferromagnetic part 81a, 86a and the adjacent ferromagnetic part 81b, 86b is also reduced by the thickness of the adapter body 90 due to the presence of the adapter body 90. Since the distance between the upper die 80 and the lower die 85 is considerably large, the direction of the direction of force (indicated by the arrow X) from the ferromagnetic portion 81a of the upper die 80 to the corresponding ferromagnetic portion 86a of the lower die 85. In addition to the ferromagnetic part 8 la of the upper mold 80, for example, the ferromagnetic part 86 b adjacent to the corresponding ferromagnetic part 86 b of the lower mold 85 has a direction of force (indicated by an arrow Y). In addition, a magnetic field is applied. Therefore, in the anisotropic conductive elastomer material layer 95A, the conductive magnetic particles are located between the ferromagnetic portion 81a of the upper mold 80 and the corresponding ferromagnetic portion 86a of the lower mold 85. It becomes difficult to assemble into the part, and the conductive magnetic particles also gather in the part located between the ferromagnetic part 8 la of the upper mold 80 and the ferromagnetic part 86b of the lower mold 85, and Therefore, it becomes difficult to sufficiently orient the conductive magnetic particles in the thickness direction of the anisotropic conductive elastomer material layer 95A, and as a result, the anisotropic conductive elastomer having the desired conductive path forming portion and insulating portion is obtained. One sheet cannot be obtained.

[0014] In addition, in forming the anisotropic conductive elastomer sheet, as described above, two mold plates of the upper mold 80 and the lower mold 85 are necessary. These templates are individually manufactured according to the target adapter device, and the manufacturing process is complicated, so that the manufacturing cost of the adapter device is extremely high, and the length of the template device is increased. Inspect circuit equipment Incurs increased costs.

[0015] In order to solve such a problem, a conductive elastomer layer containing conductive particles aligned in a thickness direction is formed by laser processing so as to be arranged according to a target pattern. A plurality of conductive path forming portions are formed, and the releasable support plate on which the conductive path forming portions are formed is overlaid on the adapter main body on which the insulating material layer is formed. There has been proposed a method of forming an insulating portion by bringing each electrode and a corresponding conductive path forming portion into contact with each other and curing the insulating material layer in this state (see Patent Document 6). ₀

However, it has been found that such a method has the following problems. In order to obtain an anisotropic conductive elastomer sheet having high conductivity, it is important to form a conductive path forming portion containing a high proportion of conductive particles. On the other hand, in order to obtain an anisotropic conductive elastomer sheet having high unevenness absorbability, it is important to form a conductive path forming portion having a large thickness.

Thus, in the manufacturing method described above, in order to form a conductive path forming part with a large thickness containing conductive particles at a high rate, a large thickness containing conductive particles at a high rate is used. It is necessary to form one conductive elastomer layer.

However, since such a conductive elastomer layer is difficult to be formed by laser processing, it is difficult to obtain a desired conductive path forming portion.

Patent Document 1: Japanese Patent Application Laid-Open No. 51-93393

Patent Document 2: Japanese Patent Laid-Open No. 53-147772

Patent Document 3: Japanese Patent Application Laid-Open No. 61-250906

Patent Document 4: Japanese Patent Laid-Open No. 4-151564

Patent Document 5: JP-A-6-82531

Patent Document 6: Japanese Unexamined Patent Application Publication No. 2004-342597

Disclosure of the invention

[0017] The present invention has been made based on the above circumstances, and a first object of the present invention is to provide the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected. Thus, the required electrical connection can be reliably achieved and the electrode to be inspected An object of the present invention is to provide an adapter device that can reliably achieve a required electrical connection for the circuit device even when the pitch is very small and densely arranged, and a method for manufacturing the adapter device.

The second object of the present invention is to ensure that a required electrical inspection can be performed on the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected, and to be the circuit to be inspected. Even when the electrodes to be inspected of the device are arranged with a small pitch and a high density, the electrical inspection of the circuit device can reliably perform the required electrical inspection of the circuit device. To provide an apparatus.

The method for manufacturing an adapter device according to the present invention includes an adapter body having a connection electrode region in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface, and the connection between the adapter body Anisotropic conductivity composed of a plurality of conductive path forming portions extending in the thickness direction and integrally formed on the surface of each of the connection electrodes, and insulating portions that insulate them from each other. A method of manufacturing an adapter device comprising a conductive sheet and a contact member made of metal integrally provided on a conductive path forming portion of the anisotropic conductive sheet,

On the metal foil, a contact member composite is prepared in which a plurality of contact members each made of a metal exhibiting magnetism are formed according to a specific pattern relating to the connection electrode, and the contact member composite is cured on the contact member composite. A liquid polymer substance forming an elastic polymer substance and forming a conductive elastomer material layer containing conductive particles exhibiting magnetism in the forming material, and on each of the conductive elastomer material layers, Each of the plurality of metal masks made of metal exhibiting magnetism is disposed so as to face the contact member with the conductive elastomer material layer interposed therebetween, and in this state, the conductive elastomer material layer is disposed on the conductive elastomer material layer. On the other hand, by applying a magnetic field in the thickness direction and curing the material layer for conductive elastomer, a conductive elastomer layer is formed, and the conductive elastomer layer is formed. The by removing the portion other than the portion located between the contact member and the metal mask by laser machining, by forming a plurality of conductive path-forming parts arranged according to the specific pattern,

The metal mask arranged on each conductive path forming part is removed, and then the conductive path forming part The contact member composite formed with the material is overlapped on the adapter body in which the insulating material layer made of a material that is cured and becomes an elastic polymer substance is formed on the electrode region for connection. Each of the connection electrodes in the connection electrode region of the main body is brought into contact with the corresponding conductive path forming portion, and in this state, the insulating portion material layer is cured to form an insulating portion. It is characterized by that.

The adapter device manufacturing method of the present invention also includes a plurality of connection electrodes each comprising two connection electrodes for current supply and voltage measurement according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface. An adapter body having a connection electrode region in which an electrode pair is formed, and extending in the thickness direction located on the surface of each of the connection electrodes provided integrally on the connection electrode region of the adapter body An anisotropic conductive sheet comprising a plurality of conductive path forming portions and insulating portions that insulate them from each other, and a contact member made of metal integrally provided on the conductive path forming portion of the anisotropic conductive sheet A plurality of contact members made of a metal exhibiting magnetism according to a specific pattern on the connection electrode on the metal foil. It is prepared contact member complex comprising,

On this contact member composite, a conductive elastomer material layer is formed, in which conductive particles exhibiting magnetism are contained in a liquid polymer material forming material that is cured to become an elastic polymer material. A plurality of metal masks each made of a metal exhibiting magnetism are disposed on the material layer for the conductive elastomer so as to face each other through the conductive elastomer material layer and in this state. A conductive elastomer layer is formed by applying a magnetic field in the thickness direction to the conductive elastomer material layer and curing the conductive elastomer material layer, thereby forming the conductive elastomer layer. Laser processing is performed on one layer to remove portions other than the portion located between the contact member and the metal mask, so that the multiple layers arranged according to the specific pattern are removed. The conductive path forming portion formed,

The metal mask disposed on each conductive path forming portion is removed, and then the contact member composite having the conductive path forming portion formed thereon is cured to be an insulating material made of a material that becomes an elastic polymer substance. The layer is overlaid on the adapter body formed on the connecting electrode area In particular, each of the connection electrodes in the connection electrode region of the adapter main body is brought into contact with the corresponding conductive path forming portion, and in this state, the insulating material layer is cured to cure the insulating portion. It has the process of forming.

[0020] Further, the adapter device manufacturing method of the present invention includes an adapter body having a connection electrode region in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface. And a plurality of conductive path forming portions extending in the thickness direction, which are integrally provided on the connection electrode region of the adapter main body and located on the surface of each of the connection electrodes, and insulated from each other A method of manufacturing an adapter device comprising an anisotropic conductive sheet comprising an insulating portion and comprising:

On the releasable support plate, a conductive elastomer material layer in which conductive particles exhibiting magnetism are contained in a liquid polymer material forming material which is cured to become an elastic polymer material is formed. A plurality of metal masks each made of a metal exhibiting magnetism are disposed on the conductive elastomer material layer according to a specific pattern related to the connection electrode, and in this state, the conductive elastomer material layer is formed on the conductive elastomer material layer. On the other hand, by applying a magnetic field in the thickness direction and curing the material layer for the conductive elastomer, a conductive elastomer layer is formed, and the conductive elastomer layer is laser processed to perform the metal mask. By removing the portion other than the portion where is disposed, a plurality of conductive path forming portions arranged according to the specific pattern are formed,

The metal mask disposed on each conductive path forming portion is removed, and then the release support plate on which the conductive path forming portion is formed is cured and the insulating portion material is made of a material that becomes an elastic polymer substance. By overlapping the layer on the adapter body formed on the connection electrode region, each of the connection electrodes in the connection electrode region of the adapter body and the corresponding conductive path forming portion are brought into contact with each other. In this state, the insulating portion material layer is cured to form an insulating portion.

[0021] Further, the manufacturing method of the adapter device according to the present invention includes a plurality of connection electrodes each including two connection electrodes for current supply and voltage measurement according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface. An adapter body having a connection electrode area in which a pair of connection electrodes is formed, and an adapter body integrally provided on the connection electrode area of the adapter body Manufactures an adapter device comprising a plurality of conductive path forming portions extending in the thickness direction located on the surfaces of each of the connection electrodes and an anisotropic conductive sheet comprising insulating portions that insulate them from each other. A conductive elastomer material comprising a liquid polymer substance-forming material that is cured to become an elastic polymer substance and containing conductive particles exhibiting magnetism on a releasable support plate. A plurality of metal masks each made of a metal exhibiting magnetism are arranged on the conductive elastomer material layer according to a specific pattern related to the connection electrode, and in this state, the conductive elastomer is formed. By hardening the material layer for use, a conductive elastomer layer is formed, and the conductive elastomer layer is laser processed to remove portions other than the portion where the metal mask is disposed. Thus, a plurality of conductive path forming portions arranged according to the specific pattern are formed, the metal mask arranged on each conductive path forming portion is removed, and then the conductive path forming portions are formed. By connecting the releasable support plate on the adapter body formed on the connecting electrode region, the insulating material layer made of a material that is cured to become an elastic polymer substance is used to connect the adapter body. Each of the connection electrodes in the electrode region is brought into contact with the corresponding conductive path forming portion, and in this state, the insulating material layer is cured to form an insulating portion. And

In the method for manufacturing an adapter device of the present invention, laser processing using a carbon dioxide laser or an ultraviolet laser can be preferably used.

[0023] The adapter device of the present invention is obtained by the manufacturing method described above.

[0024] An electrical inspection device for a circuit device according to the present invention comprises the adapter device described above.

[0025] According to the method for manufacturing an adapter device of the present invention, the thickness of the conductive elastomer material layer in a state where a metal mask showing magnetism is arranged according to a specific pattern on the conductive elastomer material layer. By applying a magnetic field in the direction and curing the material layer for the conductive elastomer, the conductive elastomer layer obtained is a conductive particle in the portion where the metal mask is arranged, that is, the portion where the conductive path is formed. In addition to becoming dense, the conductive particles in the other part become sparse, so that the part other than the part forming the conductive path in the conductive elastomer layer is removed by laser processing. It becomes extremely easy to do. Therefore, by conducting laser processing on the conductive elastomer layer, it is possible to reliably form the conductive path forming portion of the desired form. Then, after forming a plurality of conductive path forming portions arranged according to a specific pattern, an insulating portion material layer is formed between these conductive path forming portions and cured to form an insulating portion. In the absence of conductive particles, an insulating part can be obtained reliably.

Therefore, according to the adapter device of the present invention obtained by such a method, the required electrical connection can be reliably achieved for the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected. In addition, even if the electrodes to be inspected are arranged with a small pitch and a high density, it is possible to reliably achieve the necessary electrical connection for the circuit device.

[0026] According to the electrical inspection device for a circuit device of the present invention, the adapter device described above is provided. Therefore, regardless of the arrangement pattern of the electrodes to be inspected in the circuit device to be inspected, The electrical inspection can be performed reliably, and the required electrical inspection can be performed for the circuit device even when the electrodes to be inspected of the circuit device are arranged with a small pitch and a high density. It can be executed reliably.

Brief Description of Drawings

FIG. 1 is an explanatory cross-sectional view showing a configuration in a first example of an adapter device according to the present invention.

FIG. 2 is a cross-sectional view illustrating the configuration of the adapter body in the adapter device of the first example.

FIG. 3 is an explanatory sectional view showing, in an enlarged manner, a configuration of a main part of an anisotropic conductive sheet in the adapter device of the first example.

FIG. 4 is an explanatory cross-sectional view showing a state in which a resist layer having a plurality of openings formed according to a specific pattern is formed on a metal foil.

FIG. 5 is an explanatory sectional view showing a state in which a contact member is formed in each opening of a resist layer to form a contact member composite.

FIG. 6 is an explanatory sectional view showing a state in which a resist layer having a plurality of openings formed according to a specific pattern is formed on a metal foil. FIG. 7 is an explanatory cross-sectional view showing a state in which a contact member is formed in each opening of a resist layer to form a metal mask composite.

FIG. 8 is an explanatory cross-sectional view showing a state in which a conductive elastomer material layer is formed on a contact member composite.

[9] FIG. 9 is an explanatory cross-sectional view showing a state in which the metal mask composite is disposed on the surface of the material layer for conductive elastomer.

[10] FIG. 10 is an explanatory sectional view showing a state in which a magnetic field is applied to the material layer for conductive elastomer in the thickness direction.

FIG. 11 is an explanatory sectional view showing a state in which a conductive elastomer layer is formed on a contact member composite.

[12] FIG. 12 is an explanatory sectional view showing a state where the metal foil of the metal mask composite is removed.

FIG. 13 is an explanatory cross-sectional view showing a state in which a plurality of conductive path forming portions are formed according to a specific pattern on the contact member composite.

[14] FIG. 14 is an explanatory cross-sectional view showing a state in which an insulating material layer is formed on the adapter body.

FIG. 15 is a cross-sectional view for explaining a state in which a contact member composite having a conductive path forming portion is superimposed on an adapter main body on which an insulating portion material layer is formed.

FIG. 16 is an explanatory cross-sectional view showing a state in which an insulating portion is formed between adjacent conductive path forming portions.

FIG. 17 is a cross-sectional view illustrating the configuration of the adapter device according to the second example of the present invention.

FIG. 18 is a cross-sectional view illustrating the configuration of the adapter body in the adapter device of the second example.

FIG. 19 is an explanatory cross-sectional view showing, in an enlarged manner, the configuration of the main part of the anisotropic conductive sheet in the adapter device of the second example.

FIG. 20 is a cross-sectional view illustrating the configuration of a third example of an adapter device according to the present invention.

[FIG. 21] The configuration of the main part of the anisotropic conductive sheet in the adapter device of the third example is enlarged. FIG.

FIG. 22 is an explanatory sectional view showing a state in which a conductive elastomer material layer is formed on a releasable support plate.

FIG. 23 is a cross-sectional view for explaining a state in which a metal mask composite is disposed on the surface of the material layer for conductive elastomer.

24] A sectional view for explanation showing a state in which a magnetic field is applied in the thickness direction to the material layer for conductive elastomer.

FIG. 25 is an explanatory cross-sectional view showing a state in which a conductive elastomer layer is formed on a releasable support plate.

FIG. 26 is an explanatory cross-sectional view showing a state where the metal foil of the metal mask composite is removed.

FIG. 27 is an explanatory cross-sectional view showing a state in which a plurality of conductive path forming portions are formed on a releasable support plate according to a specific pattern.

[28] FIG. 28 is an explanatory sectional view showing a state in which an insulating material layer is formed on the adapter body.

29] A sectional view for explanation showing a state in which a releasable support plate on which a conductive path forming portion is formed is superimposed on an adapter main body on which an insulating portion material layer is formed.

FIG. 30 is an explanatory cross-sectional view showing a state where an insulating portion is formed between adjacent conductive path forming portions.

[31] FIG. 31 is a cross-sectional view illustrating the configuration of the adapter device according to the fourth example of the present invention.

FIG. 32 is an explanatory cross-sectional view showing, in an enlarged manner, the configuration of the main part of the anisotropic conductive sheet in the adapter device of the fourth example.

FIG. 33] An explanatory diagram showing the configuration of the first example of the electrical inspection device for a circuit device according to the present invention.

[34] FIG. 34 is an explanatory diagram showing a configuration of the second example of the electrical inspection apparatus for circuit devices according to the present invention.

[35] FIG. 35 is an explanatory view showing a state where the conductive path forming portion is formed by removing only the peripheral portion of the conductive elastomer forming layer in the conductive elastomer forming layer. FIG. 36 is an explanatory cross-sectional view showing a state in which a conductive path forming portion is formed by removing only a peripheral portion of a portion that becomes a conductive path forming portion in a conductive elastomer layer.

FIG. 37 is an explanatory sectional view showing, in an enlarged manner, the configuration of the main part in another example of the adapter device according to the present invention.

FIG. 38 is an explanatory cross-sectional view showing a state in which an anisotropic conductive elastomer material layer is formed on the surface of the adapter body in the manufacture of the conventional adapter device.

FIG. 39 is an explanatory cross-sectional view showing a state in which the adapter main body on which the anisotropic conductive elastomer material layer is formed is disposed between one mold and the other mold.

FIG. 40 is an explanatory cross-sectional view showing a state in which the anisotropic conductive sheet is formed on the surface of the adapter body and the adapter device is manufactured.

FIG. 41 is an explanatory view showing an arrangement state of connection electrodes of the adapter body.

FIG. 42 is an explanatory cross-sectional view showing the direction of the magnetic field applied to the anisotropic conductive elastomer material layer in the manufacture of the conventional adapter device.

Explanation of symbols

la Upper adapter device

lb Lower adapter device

2 Holder

3 Positioning pin

5 Circuit equipment

6, 7 Inspected electrode

10 Anisotropic conductive sheet

11 Conduction path forming part

11A Material layer for conductive elastomer

11B conductive elastomer layer

12 Insulation part

12A Material layer for insulation

13 Contact material

13F contact member composite Metal foil

Resist layer

K opening

Metal foil

Resist layer

K opening

Metal mask

F Metal mask composite releasable support plate

Adapter body

, 21b, 21c Connecting electrode a Connecting electrode pair

Terminal electrode

Internal wiring section

Connecting electrode area Anisotropic conductive sheet a Upper inspection head b Lower inspection head a,, 51b Inspection electrode device a,, 52b Inspection electrode a,, 53b

a, 54b strut

a, 55b Anisotropic conductive sheet a Upper support plate b Lower support plate a, 57b Connector

One template

, 81a, 81b Ferromagnetic part 82 Non-magnetic part

83 electromagnet

85 The other template

86, 86a, 86b Ferromagnetic part

87 Non-magnetic part

88 electromagnet

90 Adapter body

91 Connection electrode

95 Anisotropic conductive elastomer sheet

95A Material layer for anisotropic conductive elastomer

96 Conduction path forming part

97 Insulation

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail.

FIG. 1 is an explanatory cross-sectional view showing a configuration of a first example of an adapter device according to the present invention, and FIG. 2 is an explanatory cross-sectional view showing an adapter body in the adapter device shown in FIG. This adapter device is used, for example, to perform an open / short test on a circuit device such as a printed circuit board, and has an adapter body 20 made of a multilayer wiring board.

A connection electrode in which a plurality of connection electrodes 21 are arranged on the surface of the adapter body 20 (the upper surface in FIGS. 1 and 2) according to a specific pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. Region 25 is formed.

A plurality of terminal electrodes 22 are arranged on the back surface of the adapter body 20 according to the grid point positions of pitches of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, and 2.54 mm, for example. Are electrically connected to the connection electrode 21 by the internal wiring portion 23.

On the surface of the adapter main body 20, the anisotropic conductive sheet 10 is formed on the connection electrode region 25 in a state of being physically adhered or closely adhered. In the example shown, An anisotropic conductive sheet 10 is formed so as to cover the entire surface of the doveter body 20. The anisotropic conductive sheet 10 is arranged according to the same pattern as the specific pattern related to the connection electrode 21 in the adapter body 20 and has a plurality of conductive path forming portions 11 extending in the thickness direction and adjacent conductive paths. Between the path forming portions 11, the conductive path forming portions 11 are formed in a state of being integrally bonded to each of the conductive path forming portions 11, and the conductive path forming portions 11 are insulated from each other. The anisotropic conductive sheet 10 is arranged such that each of the conductive path forming portions 11 is positioned on the connection electrode 21 of the adapter body 20.

As shown in an enlarged view in FIG. 3, each conductive path forming portion 11 is configured to be contained in an insulating elastic polymer material in a state where conductive particles P exhibiting magnetism are aligned in the thickness direction. Yes. On the other hand, the insulating portion 12 is made of an elastic polymer material that does not contain the conductive particles P at all. The elastic polymer material constituting the conductive path forming portion 11 and the elastic polymer material constituting the insulating portion 12 may be of different types or the same type.

In the illustrated example, the conductive path forming portion 11 is formed so as to protrude the surface force of the insulating portion 12. According to such an example, the degree of compression by pressurization is greater in the conductive path forming section 11 than in the insulating section 12, so that the resistance value is sufficiently low! Thus, the change in the resistance value can be reduced with respect to the change or fluctuation of the applied pressure, and as a result, even if the applied pressure acting on the anisotropic conductive sheet 10 is not uniform, It is possible to prevent the occurrence of conductive variation between the conductive path forming portions 11. As the elastic polymer material constituting the conductive path forming portion 11 and the insulating portion 12, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples thereof include polybutadiene rubber, natural rubber, polyisoprene. Conjugated rubbers such as rubber, styrene-butadiene copolymer rubber, acrylonitrile butadiene copolymer rubber and their hydrogenated products, block copolymers such as styrene butadiene gen block copolymer rubber, styrene isoprene block copolymer, etc. Combined rubber and hydrogenated products thereof, black mouth plain, urethane rubber, polyester rubber, epichlorohydrin Examples thereof include rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene copolymer rubber.

In the above, when the anisotropic conductive sheet 10 is required to have weather resistance, it is preferable to use a rubber other than the conjugated-gen rubber. In particular, silicone rubber is used from the viewpoint of moldability and electrical characteristics. It is preferable.

[0032] The silicone rubber is preferably one obtained by crosslinking or condensing liquid silicone rubber.

The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10- ^ ec, and is any of a condensation type, an addition type, a bur group or a hydroxyl group-containing one. May be. Specific examples include dimethyl silicone raw rubber, methyl beer silicone raw rubber, and methyl vinyl silicone raw rubber.

The silicone rubber preferably has a molecular weight Mw (standard polystyrene equivalent weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. In addition, since good heat resistance is obtained in the obtained conductive path forming part 11, the molecular weight distribution index (the value of the ratio MwZMn between the standard polystyrene equivalent weight average molecular weight Mw and the standard polystyrene equivalent number average molecular weight Mn). The same shall apply hereinafter) is preferably 2 or less.

[0033] As the conductive particles P contained in the conductive path forming part 11, conductive particles exhibiting magnetism are used because the particles can be easily aligned in the thickness direction by a method described later. . Specific examples of such conductive particles include particles of magnetic metals such as iron, cobalt and nickel, particles of alloys thereof, particles containing these metals, or particles containing these metals as core particles. The core particles are made of metal particles with good conductivity such as gold, silver, palladium, rhodium, etc., or inorganic particles such as non-magnetic metal particles or glass beads, or polymer particles. For example, the surface of the core particles may be plated with a conductive magnetic metal such as nickel or cobalt.

Among these, it is preferable to use a nickel particle as a core particle and a surface with a gold mesh having good conductivity.

The means for coating the surface of the core particles with the conductive metal is not particularly limited, but for example, an electromechanical or electrolytic plating method, a sputtering method, a vapor deposition method or the like is used. It is.

[0034] When the conductive particles P used are those in which the surface of the core particles is coated with a conductive metal, good conductivity can be obtained. The ratio of the covering area of the conductive metal to the surface area of the core particles is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.

The coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particles, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4%. ~ 20% by mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and still more preferably 3 to 15% by mass.

[0035] The particle size of the conductive particles P is preferably 1 to: LOO / zm, more preferably 2 to 50 μm, still more preferably 3 to 30 μm, particularly preferably 4-20 μm. The particle size distribution (DwZDn) of the conductive particles P is preferably 1 to: LO, more preferably 1.01 to 7, still more preferably 1.05 to 5, particularly preferably 1.1. ~ 4.

By using conductive particles satisfying such conditions, the obtained conductive path forming part 11 can be easily deformed under pressure, and the conductive path forming part 11 has sufficient space between the conductive particles. Electrical contact can be obtained.

In addition, the shape of the conductive particles P is not particularly limited, but is spherical, star-shaped or aggregated in that they can be easily dispersed in the polymer material-forming material. Preferred to be secondary particles.

Further, as the conductive particles P, those whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropic conductive sheet 10 is improved.

[0036] It is preferable that such conductive particles P are contained in the conductive path forming portion 11 at a volume fraction of 15 to 45%, preferably 20 to 40%. When this ratio is too small, the conductive path forming part 11 having a sufficiently small electric resistance value may not be obtained. On the other hand, if this ratio is excessive, the obtained conductive path forming portion 11 is likely to be fragile, and the necessary elasticity as the conductive path forming portion 11 may not be obtained. [0037] On each surface of the conductive path forming portion 11 in the anisotropic conductive sheet 10, a flat plate contact member 13 made of metal is integrally provided in the conductive path forming portion 11! / .

As the metal constituting the contact member 13, a metal exhibiting magnetism is used, and specific examples thereof include nickel, cobalt, and alloys thereof.

Further, the thickness of the contact member 13 is preferably 1 to: LOO / z m, more preferably 5 to 40 μm. .

[0038] In the present invention, the adapter device of the first example is obtained through the following steps (a) to (d).

(a) A contact member composite formed by forming a plurality of contact members 13 made of metal each exhibiting magnetism according to a specific pattern related to the connection electrode 21 in the connection electrode region 25 of the adapter body 20 on the metal foil. To manufacture.

(b) On the contact member composite, a material layer for a conductive elastomer is formed in which a liquid polymer material forming material that is cured to become an elastic polymer material contains conductive particles P exhibiting magnetism. Then, on the conductive elastomer material layer, a plurality of metal masks each made of a metal exhibiting magnetism are arranged so as to face the contact member 13 with the conductive elastomer material layer interposed therebetween, In this state, a magnetic field is applied to the conductive elastomer material layer in the thickness direction, and the conductive elastomer material layer is cured to form a conductive elastomer layer.

(c) A plurality of conductive path forming portions 11 arranged according to a specific pattern are formed by removing a portion other than the portion located between the contact member 13 and the metal mask by laser processing the conductive elastomer layer. To do.

(d) The metal mask disposed on each conductive path forming portion 11 is removed, and then the contact member composite formed with the conductive path forming portion 11 is made of a material that is cured to become an elastic polymer substance. Each of the connection electrodes 21 in the connection electrode region 25 of the adapter body 20 and a corresponding conductive path are formed by superimposing the material layer on the adapter body 20 formed on the connection electrode region 25. The insulating part 12 is integrally formed on the connection electrode region 25 of the adapter body 20 by bringing the insulating part material layer into a hardened state in contact with the part 11. Hereinafter, the manufacturing method of the adapter device of the first example will be specifically described.

As shown in FIG. 4, a resist layer 15 having an opening 15K formed in accordance with a specific pattern is formed on the metal foil 14 by a photolithography technique. After that, the surface of the portion exposed through the opening 15K of the resist layer 15 in the metal foil 14 is subjected to a plating treatment with a metal exhibiting magnetism, thereby forming the opening of the resist layer 15 as shown in FIG. A contact member 13 is formed on each of 15K. Thereby, a contact member composite 13F in which a plurality of contact members 13 are formed on the metal foil 14 according to a specific pattern is obtained.

In the above, as the metal foil 14, copper, nickel or the like can be used. Further, the metal foil 14 may be laminated on a resin film.

The thickness of the metal foil 14 is preferably 0.05-2111, more preferably 0.1-1 μm. If this thickness is too small, a uniform thin layer may not be formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by, for example, etching.

The thickness of the resist layer 15 is set according to the thickness of the contact member 13 to be formed.

[0040] << Manufacture of metal mask composite >>

As shown in FIG. 6, a resist layer 17 having an opening 17K formed in accordance with a specific pattern is formed on the metal foil 16 by a photolithography technique. After that, the surface of the portion exposed through the opening 17K of the resist layer 17 in the metal foil 16 is subjected to a plating treatment with a metal exhibiting magnetism, thereby forming the opening of the resist layer 17 as shown in FIG. A metal mask 18 is formed on each of 17K. Thereby, a metal mask composite 18F in which a plurality of metal masks 18 are formed on the metal foil 16 according to a specific pattern is obtained.

In the above, as the metal foil 16, copper, nickel or the like can be used. The metal foil 16 may be laminated on a resin film.

The thickness of the metal foil 16 is preferably 0.05-2111, more preferably 0.1-1 μm. If this thickness is too small, a uniform thin layer may not be formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by, for example, etching. The thickness of the resist layer 17 is set according to the thickness of the metal mask 18 to be formed.

[0041] << Formation of one layer of conductive elastomer >>

A conductive elastomer material is prepared by dispersing conductive particles exhibiting magnetism in a liquid polymer material-forming material that is cured to become an elastic polymer material. A conductive elastomer material layer 11A is formed by applying a conductive elastomer material on one surface of the body 13F on which the contact member 13 is formed. Then, as shown in FIG. 9, a metal mask composite 18F is placed on the conductive elastomer material layer 11A, and each of the metal masks 18 passes through the conductive elastomer material layer 11A. The contact members 13 are arranged so as to face each other. Here, the conductive elastomer material layer 11A contains the conductive particles P exhibiting magnetism in a dispersed state.

Next, a magnetic field is applied to the conductive elastomer material layer 11A through the contact member 13 and the metal mask 18 in the thickness direction of the conductive elastomer material layer 11A. As a result, since each of the contact member 13 and the metal mask 18 is formed of a metal exhibiting magnetism, the portion of the conductive elastomer material layer 11A located between the contact member 13 and the metal mask 18 is not provided. A magnetic field having a larger intensity than that of other portions is formed. As a result, the conductive particles P dispersed in the conductive elastomer material layer 11 A are gathered in a portion located between the contact member 13 and the metal mask 18 as shown in FIG. Further, the conductive elastomer material layer 11A is oriented in the thickness direction. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 11A, or after stopping the action of the magnetic field, the conductive elastomer material layer 11A is cured and shown in FIG. As described above, the conductive elastomer layer 11B that is contained in the elastic polymer substance in a state in which the conductive particles P are aligned in the thickness direction is integrally formed on the connecting member composite 13F.

In the above, as a method for applying the conductive elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the conductive elastomer material layer 11A is set according to the thickness of the conductive path forming portion to be formed. As means for applying a magnetic field to the conductive elastomer material layer 11A, an electromagnet, a permanent magnet, or the like can be used.

The strength of the magnetic field applied to the conductive elastomer material layer 11A is preferably 0.2 to 2.5 Tesla.

The curing process of the conductive elastomer material layer 11A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer material forming material constituting the conductive elastomer material layer 11A, the time required for the movement of the conductive particles, and the like.

[0043] <Formation of conductive path forming part>

First, as shown in FIG. 12, by removing the metal foil 16 in the metal mask composite 18F disposed on the conductive elastomer layer 11B by etching, the metal mask 18 and the resist layer 17 are removed. Expose. Then, by performing laser processing on the conductive elastomer layer 11B and the resist layer 17, portions other than the portion located between the contact member 13 and the metal mask 18 in the resist layer 17 and the conductive elastomer layer 11B and The resist layer 15 is removed. As a result, as shown in FIG. 13, the conductive path forming portion 11 is formed on each contact member 13 in the contact member composite 13F. Thereafter, the surface force metal mask 18 of the conductive path forming portion 11 is peeled off.

Here, the laser processing is preferably performed using a carbon dioxide gas laser or an ultraviolet laser, whereby the conductive path forming portion 11 having a desired form can be reliably formed.

[0044] << Formation of Insulating Portion >>

As shown in FIG. 14, an insulating material layer 12A is formed on the surface of the adapter body 20 by applying a liquid polymer material forming material that is cured to become an insulating elastic polymer material. Next, as shown in FIG. 15, the contact member composite 13F in which the plurality of conductive path forming portions 11 are formed is overlaid on the adapter main body 20 in which the insulating material layer 12A is formed, so that the adapter main body Each of the connection electrodes 21 in the 20 connection electrode regions 25 is brought into contact with the corresponding conductive path forming portion 11. As a result, the insulating material layer 12A is formed between the adjacent conductive path forming portions 11. Then this In this state, the insulating portion material layer 12A is cured, so that the insulating portion 12 that insulates them from each other between the adjacent conductive path forming portions 11 as shown in FIG. 11 and adapter body 20 are integrally formed.

Then, by removing the metal foil 14 in the contact member composite 13F by, for example, etching, the anisotropic conductive sheet 10 is formed on the surface of the adapter body 20 in a body-like manner. An adapter device is obtained.

As described above, as a method for applying the polymer substance-forming material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.

The thickness of the insulating part material layer 12A is set according to the thickness of the insulating part to be formed. The curing process of the insulating part material layer 12A is usually performed by heat treatment. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the insulating part material layer 12A.

[0046] According to the above manufacturing method, a plurality of contact members 13 each made of a metal exhibiting magnetism are formed on the contact member composite 13F formed by following a specific pattern related to the connection electrode 21. A magnetic layer is formed in the thickness direction of the conductive elastomer material layer 11A in a state in which the material layer 11A is formed and a metal mask 18 showing magnetism is arranged on the conductive elastomer material layer 11A according to a specific pattern. And the conductive elastomer material layer 11A obtained by curing the conductive elastomer material layer 11A is a portion located between the contact member 13 and the metal mask 18, that is, a conductive path forming portion. The conductive particle P in the part becomes dense and the conductive particle P in the other part becomes sparse, so that the conductive path shape in the conductive elastomer layer 11B is reduced. It is extremely easy to portions other than the portion to be a part is removed by laser processing. Therefore, by conducting laser processing on the conductive elastomer layer 11B, it is possible to reliably form the conductive path forming portion 11 having the expected form. Then, after forming a plurality of conductive path forming portions 11 arranged according to a specific pattern, an insulating portion material layer 12A is formed between the conductive path forming portions 11 and cured to form the insulating portion 12 Therefore, it is possible to reliably obtain the insulating part 12 without any conductive particles P.

Therefore, according to the adapter device of the present invention obtained by such a method, the inspection Regardless of the arrangement pattern of the electrodes to be inspected of the target circuit device, the required electrical connection can be reliably achieved for the circuit device, and the electrodes to be inspected have a small pitch and a high density. Even if it is arranged, it is possible to reliably achieve the required electrical connection for the circuit device.

FIG. 17 is an explanatory cross-sectional view showing the configuration of the adapter device according to the second example of the present invention, and FIG. 18 is an explanatory cross-sectional view showing the adapter main body in the adapter device shown in FIG. . This adapter device is used for, for example, a circuit device such as a printed circuit board to perform an electrical resistance measurement test of each wiring pattern, and has an adapter body 20 made of a multilayer wiring board.

On the surface of the adapter body 20 (the upper surface in FIGS. 17 and 18), connection electrodes (hereinafter referred to as “the current supply electrodes”) that are spaced apart from each other and are electrically connected to the same electrode to be inspected. Also referred to as “current supply electrode”.) 21b and connection electrode for voltage measurement (hereinafter also referred to as “voltage measurement electrode”) Connection electrode region in which a plurality of connection electrode pairs 21a made of 21c are arranged 25 is formed. These connection electrode pairs 21a are arranged according to a pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. For example, the pitch of the adapter body 20 on the back surface is 0.8 mm, 0.75 mm, 1 A plurality of terminal electrodes 22 are arranged according to the grid point positions of 5 mm, 1.8 mm, and 2.54 mm. Each of the current supply electrode 21b and the voltage measurement electrode 21c is electrically connected to the terminal electrode 22 by the internal wiring portion 23.

[0048] On the surface of the adapter body 20, the anisotropic conductive sheet 10 is formed on the connection electrode region 25 in a state of being physically adhered or closely adhered. In the illustrated example, the anisotropic conductive sheet 10 is formed so as to cover the entire surface of the adapter body 20.

This anisotropic conductive sheet 10 is adjacent to a plurality of conductive path forming portions 11 that are arranged according to the same pattern as the specific patterns related to the connection electrodes 21b and 21c in the adapter body 20 and extend in the thickness direction. Between the conductive path forming portions 11, the conductive path forming portions 11 are formed in a state of being integrally bonded to each of the conductive path forming portions 11, and the conductive path forming portions 11 are insulated from each other. The anisotropic conductive sheet 10 is conductive Each of the path forming portions 11 is arranged so as to be positioned on the connection electrodes 21b and 21c of the adapter body 20. The conductive path forming portion 11 and the insulating portion 12 in the anisotropic conductive sheet 10 have basically the same configuration as the anisotropic conductive sheet 10 in the adapter device in the first example. That is, as shown in FIG. 19, each of the conductive path forming portions 11 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction. ing. On the other hand, the insulating portion 12 is made of an elastic polymer material that does not contain the conductive particles P at all. In the illustrated example, each of the conductive path forming portions 11 is formed with a protruding portion that also protrudes the surface force of the insulating portion 12.

The elastic polymer material, conductive particles, and other specific configurations of the anisotropic conductive sheet 10 are the same as those of the anisotropic conductive sheet 10 according to the first example.

On each surface of the conductive path forming portion 11 in the anisotropic conductive sheet 10, a flat plate-like contact member 13 made of metal is integrally provided in the conductive path forming portion 11. The material and dimensions of the contact member 13 are the same as those of the anisotropic conductive sheet 10 according to the first example.

In the present invention, the adapter device of the second example can be manufactured in the same manner as the adapter device of the first example.

That is, the adapter device of the second example is obtained through the following steps (a) to (d).

(a) Contact member in which a plurality of contact members 13 each made of a metal exhibiting magnetism are formed on a metal foil according to a specific pattern related to the connection electrodes 2 lb and 21c in the connection electrode region 25 of the adapter body 20 A composite is produced.

(b) On the contact member composite, a material layer for a conductive elastomer is formed in which a liquid polymer material forming material that is cured to become an elastic polymer material contains conductive particles P exhibiting magnetism. Then, on the conductive elastomer material layer, a plurality of metal masks each made of a metal exhibiting magnetism are arranged so as to face the contact member 13 with the conductive elastomer material layer interposed therebetween, In this state, a magnetic field is applied to the conductive elastomer material layer in the thickness direction, and the conductive elastomer material layer is cured to form a conductive elastomer layer. (c) A plurality of conductive path forming portions 11 arranged according to a specific pattern are formed by removing a portion other than the portion located between the contact member 13 and the metal mask by laser processing the conductive elastomer layer. To do.

(d) The metal mask disposed on each conductive path forming portion 11 is removed, and then the contact member composite formed with the conductive path forming portion 11 is made of a material that is cured to become an elastic polymer substance. Each of the connecting electrodes 2 lb and 21c in the connecting electrode region 25 of the adapter main body 20 and the corresponding conductive material layer are superimposed on the adapter main body 20 formed on the connecting electrode region 25. The insulating portion 12 is integrally formed on the connection electrode region 25 of the adapter body 20 by bringing the path forming portion 11 into contact with each other and curing the insulating layer material layer in this state.

According to such a manufacturing method, the contact member composite in which a plurality of contact members 13 each made of a metal exhibiting magnetism are formed according to a specific pattern related to the connection electrodes 2 lb and 21 c. A conductive elastomer material layer is formed on the conductive elastomer material layer, and a metal mask showing magnetism according to a specific pattern is arranged on the conductive elastomer material layer in the thickness direction of the conductive elastomer material layer. By applying a magnetic field and curing the material layer for the conductive elastomer, the resulting conductive elastomer layer is placed on the portion located between the contact member 13 and the metal mask, that is, the portion that forms the conductive path forming portion. The conductive particles P become dense, and the conductive particles P in other parts become sparse, thereby forming a conductive path forming part in the conductive elastomer layer. To the portion other than the partial removal by laser processing becomes extremely easy. Therefore, the conductive path forming portion 11 having the expected form can be formed reliably by laser processing one layer of the conductive elastomer. Then, after forming a plurality of conductive path forming portions 11 arranged according to a specific pattern, an insulating portion material layer is formed between these conductive path forming portions 11 and cured to form an insulating portion. Therefore, it is possible to reliably obtain the insulating portion 11 without any conductive particles P.

Therefore, according to the adapter device of the present invention obtained by such a method, the required electrical connection can be reliably achieved for the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected. And the electrode to be inspected can be Even when the pitch is very small and densely arranged, the required electrical connection can be reliably achieved for the circuit device.

FIG. 20 is an explanatory cross-sectional view showing a configuration in the third example of the adapter device according to the present invention. This adapter device is used, for example, for performing an open 'short test on a circuit device such as a printed circuit board, and has an adapter main body 20 having the same configuration as the adapter device of the first example. .

On the surface of the adapter main body 20, an anisotropic conductive sheet 10 is formed on the connection electrode region 25 in a state of being physically adhered or closely adhered. In the illustrated example, the anisotropic conductive sheet 10 is formed so as to cover the entire surface of the adapter main body 20.

The anisotropic conductive sheet 10 is arranged according to the same pattern as the specific pattern related to the connection electrode 21 in the adapter body 20 and has a plurality of conductive path forming portions 11 extending in the thickness direction and adjacent conductive paths. Between the path forming portions 11, the conductive path forming portions 11 are formed in a state of being integrally bonded to each of the conductive path forming portions 11, and the conductive path forming portions 11 are insulated from each other. The anisotropic conductive sheet 10 is arranged such that each of the conductive path forming portions 11 is positioned on the connection electrode 21 of the adapter body 20. The conductive path forming portion 11 and the insulating portion 12 in the anisotropic conductive sheet 10 have basically the same configuration as the anisotropic conductive sheet 10 in the adapter device in the first example. That is, as shown in FIG. 21, each of the conductive path forming portions 11 is configured to be contained in an insulating elastic polymer material in a state where the conductive particles P exhibiting magnetism are aligned in the thickness direction. Has been. On the other hand, the insulating portion 12 is made of an elastic polymer material that does not contain conductive particles P at all. In the illustrated example, each of the conductive path forming portions 11 is formed with a protruding portion that protrudes from the surface force of the insulating portion 12.

[0052] In the present invention, the adapter device of the third example is obtained via the following steps (al) to (cl).

(al) On the releasable support plate, a material layer for a conductive elastomer comprising a liquid polymer material forming material that is cured to become an elastic polymer material and containing conductive particles P exhibiting magnetism. A plurality of metal masks each made of a metal exhibiting magnetism are formed on the conductive elastomer material layer according to a specific pattern related to the connection electrode 21 in the connection electrode region 25 of the adapter body 20. In this state, a conductive elastomer layer is formed by applying a magnetic field in the thickness direction to the conductive elastomer material layer and curing the conductive elastomer material layer. .

(bl) A plurality of conductive path forming portions 11 arranged according to a specific pattern are formed by laser processing the conductive elastomer layer to remove portions other than the portion where the metal mask is arranged.

(cl) The metal mask disposed on each conductive path forming portion 11 is removed, and then the release support plate on which the conductive path forming portion 11 is formed is made of a material that is cured to become an elastic polymer substance. By superimposing the insulating layer material layer on the adapter body 20 formed on the connection electrode region 25, each of the connection electrodes 21 in the connection electrode region 25 of the adapter body 20 and the corresponding conductive path. The insulating portion 12 is integrally formed on the connection electrode region 25 of the adapter body 20 by bringing the forming portion 11 into contact with each other and curing the insulating portion material layer in this state.

The method for manufacturing the adapter device of the third example will be specifically described below.

[0053] << Manufacture of metal mask composite >>

In the same manner as the manufacturing method of the adapter device of the first example described above, a metal mask composite 18F in which a plurality of metal masks 18 are formed according to a specific pattern on the metal foil 16 is manufactured (FIG. 6 and FIG. 7).

[0054] << Formation of one layer of conductive elastomer >>

A conductive elastomer material is prepared by dispersing conductive particles exhibiting magnetism in a liquid polymer material forming material that is cured to become an elastic polymer material. As shown in FIG. A conductive elastomer material layer 11A is formed on the support plate 19 by applying a conductive elastomer material. Then, as shown in FIG. 23, the metal mask composite 18F is arranged on the conductive elastomer material layer 11A so that each of the metal masks 18 is in contact with the conductive elastomer material layer 11A. To do. Here, the conductive elastomer material layer 11A contains the conductive particles P exhibiting magnetism in a dispersed state. Has been.

Next, a magnetic field is applied to the conductive elastomer material layer 11A through the metal mask 18 in the thickness direction of the conductive elastomer material layer 11A. As a result, each of the metal masks 18 is formed of a metal exhibiting magnetism, so that the portion of the conductive elastomer material layer 11 A where the metal mask 18 is disposed is larger than the other portions! /磁場 A strong magnetic field is formed. As a result, as shown in FIG. 24, the conductive particles P dispersed in the conductive elastomer material layer 11A gather at the portion where the metal mask 18 is disposed, and further, the conductive elastomer P Oriented so as to be aligned in the thickness direction of the material layer 11A. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 11A or stopping the action of the magnetic field, the conductive elastomer material layer 11A is cured to perform the process shown in FIG. As shown, a conductive elastomer layer 11B is formed on the releasable support plate 19 which is contained in the elastic polymer material in a state in which the conductive particles P are aligned in the thickness direction.

[0055] In the above, as a material constituting the releasable support plate 19, metals, ceramics, resins, composite materials thereof, and the like can be used.

The method of applying the conductive elastomer material, the thickness of the conductive elastomer material layer 11 A is the means for applying a magnetic field to the conductive elastomer material layer 11 A, and the conductive elastomer material layer 11 A The strength of the magnetic field to be applied and the conditions for the curing treatment of the conductive elastomer material layer 11A are the same as those of the adapter device manufacturing method of the first example described above.

[0056] <Formation of conductive path forming part>

First, by removing the metal foil 16 in the metal mask composite 18F disposed on the conductive elastomer layer 11B by etching, the metal mask 18 and the resist layer 17 are removed as shown in FIG. Expose. Then, by applying laser processing to the conductive elastomer layer 11B and the resist layer 17, the resist layer 17, the portion other than the portion where the metal mask 18 is disposed in the conductive elastomer layer 11B, and the resist layer 15 are removed. As a result, a conductive path forming portion 11 is formed on the releasable support plate 19 as shown in FIG. Thereafter, the metal mask 18 is peeled off from the surface of the conductive path forming portion 11. The

Here, the laser processing is preferably performed using a carbon dioxide gas laser, whereby the conductive path forming portion 11 having a desired form can be reliably formed.

[0057] <Formation of insulating part>

As shown in FIG. 28, the insulating material layer 12A is formed on the surface of the adapter body 20 by applying a liquid polymer material forming material that is cured to become an insulating elastic polymer material. Next, as shown in FIG. 29, the releasable support plate 19 in which the plurality of conductive path forming portions 11 are formed is overlaid on the adapter main body 20 in which the insulating material layer 12A is formed. Each of the connection electrodes 21 in the connection electrode region 25 of the adapter body 20 is brought into contact with the corresponding conductive path forming portion 11. As a result, the insulating material layer 12A is formed between the adjacent conductive path forming portions 11. Thereafter, in this state, the insulating portion material layer 12A is cured, so that the insulating portions 12 that insulate them from each other between the adjacent conductive path forming portions 11 become conductive paths as shown in FIG. It is formed integrally with the forming part 11 and the adapter body 20.

Then, by removing the releasable support plate 19, an adapter device having the configuration shown in FIG. 20 is obtained, in which the anisotropic conductive sheet 10 is formed on the surface of the adapter body 20 in a body-like manner.

In the above, the method for applying the polymer material forming material, the thickness of the insulating part material layer 12A, the curing condition of the insulating part material layer 12A, etc. It is the same.

[0058] According to the manufacturing method described above, the conductive elastomer material layer 11A is disposed in the thickness direction in a state where the metal mask 18 showing magnetism is arranged according to a specific pattern on the conductive elastomer material layer 11A. A conductive elastomer layer 11 B obtained by applying a magnetic field to the material and curing the material layer 1 1 A for the conductive elastomer is formed in a portion where the metal mask 18 is disposed, that is, a portion where the conductive path forming portion is formed. The conductive particles P become dense, and the conductive particles P in the other portions become sparse, and as a result, the portions other than the conductive path forming portion in the conductive elastomer layer 11B are removed by laser processing. It becomes extremely easy to do. Therefore, conductive elastomer layer 11B By carrying out the machining, the conductive path forming part 11 having the desired form can be reliably formed. Then, after forming a plurality of conductive path forming portions 11 arranged according to a specific pattern, an insulating portion material layer 12A is formed between these conductive path forming portions 11 and cured to perform insulation. Since the portion 12 is formed, the insulating portion 12 without the conductive particles P can be obtained with certainty.

FIG. 31 is a cross-sectional view illustrating the configuration of the adapter device according to the fourth example of the present invention. This adapter device is used for conducting an electrical resistance measurement test of each wiring pattern on a circuit device such as a printed circuit board, for example, and has the same configuration as the adapter device of the second example described above. It has a main body 20.

This anisotropic conductive sheet 10 is adjacent to a plurality of conductive path forming portions 11 that are arranged according to the same pattern as the specific patterns related to the connection electrodes 21b and 21c in the adapter body 20 and extend in the thickness direction. Between the conductive path forming portions 11, the conductive path forming portions 11 are formed in a state of being integrally bonded to each of the conductive path forming portions 11, and the conductive path forming portions 11 are insulated from each other. The anisotropic conductive sheet 10 is arranged such that each of the conductive path forming portions 11 is positioned on the connection electrodes 21b and 21c of the adapter body 20. The conductive path forming portion 11 and the insulating portion 12 in the anisotropic conductive sheet 10 have basically the same configuration as the anisotropic conductive sheet 10 in the adapter device in the first example. That is, as shown in FIG. 32, each of the conductive path forming portions 11 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction. ing. In contrast, the insulating part 12 does not contain any conductive particles P. It is made of an elastic polymer material that does not. In the illustrated example, each of the conductive path forming portions 11 is formed with a protruding portion that also protrudes the surface force of the insulating portion 12.

In the present invention, the adapter device of the fourth example can be manufactured in the same manner as the adapter device of the third example described above.

That is, the adapter device of the fourth example is obtained through the following steps (al) to (cl).

(al) A liquid polymer material forming material that is cured to become an elastic polymer material is formed on a releasable support plate, and a material layer for a conductive elastomer is formed in which conductive particles P exhibiting magnetism are contained in the material. On the conductive elastomer material layer, a plurality of metal masks each made of a metal exhibiting magnetism are placed on a specific pattern related to the connection electrodes 21b and 21c in the connection electrode region 25 of the adapter body 20. In this state, a conductive elastomer layer is formed by applying a magnetic field to the conductive elastomer material layer in the thickness direction and curing the conductive elastomer material layer. To do. (bl) A plurality of conductive path forming portions 11 arranged according to a specific pattern are formed by laser processing the conductive elastomer layer to remove portions other than the portion where the metal mask is arranged.

(cl) The metal mask disposed on each conductive path forming portion 11 is removed, and then the release support plate on which the conductive path forming portion 11 is formed is made of a material that is cured to become an elastic polymer substance. By overlapping the insulating material layer on the adapter body 20 formed on the connection electrode region 25, each of the connection electrodes 2 lb and 21c in the connection electrode region 25 of the adapter body 20 and the corresponding material layer is provided. The insulating path 12 is brought into contact with the conductive path forming section 11 and the insulating section material layer is cured in this state, whereby the insulating section 12 is integrally formed on the connection electrode region 25 of the adapter body 20.

[0061] According to such a manufacturing method, in the thickness direction of the conductive elastomer material layer in a state in which a metal mask showing magnetism is arranged according to a specific pattern on the conductive elastomer material layer. A magnetic field is applied to the conductive elastomer material layer. As a result, the conductive elastomer P in the portion where the metal mask is disposed, that is, the portion where the conductive path is to be formed becomes dense, and the conductive particle P in the other portion is obtained. As a result, it becomes very easy to remove a portion other than the portion forming the conductive path in the layer of the conductive elastomer by laser processing. Therefore, by laser processing one layer of conductive elastomer

Thus, the conductive path forming portion 11 having the desired shape can be reliably formed. Then, after forming a plurality of conductive path forming portions 11 arranged according to a specific pattern, an insulating portion material layer is formed between these conductive path forming portions 11 and cured to form an insulating portion. Therefore, it is possible to reliably obtain the insulating portion 11 in which the conductive particles P are not present at all. Therefore, according to the adapter device of the present invention obtained by such a method, the required electrical connection can be reliably achieved for the circuit device regardless of the arrangement pattern of the electrodes to be inspected of the circuit device to be inspected. In addition, even if the electrodes to be inspected are arranged with a small pitch and a high density, it is possible to reliably achieve the necessary electrical connection for the circuit device.

FIG. 33 is an explanatory diagram showing the configuration of the first example of the electrical inspection apparatus for circuit boards according to the present invention. This electrical inspection device performs, for example, an open / short test on a circuit device 5 such as a printed circuit board on which electrodes 6 and 7 to be inspected are formed on both sides. The holder 2 is provided with a positioning pin 3 for arranging the circuit device 5 at an appropriate position in the inspection execution region E. Above the inspection execution area E, the upper side adapter device la and the upper side inspection head 50a configured as shown in FIG. 1 are arranged in this order, and further above the upper side inspection head 50a, A side support plate 56a is arranged, and the upper side inspection head 50a is fixed to the support plate 56a by a column 54a. On the other hand, below the inspection execution area E, the lower adapter device lb and the lower inspection head 50b configured as shown in FIG. 1 are arranged in this order from the top, and further below the lower inspection head 50b. The lower side support plate 56b is arranged, and the lower side inspection head 50b is fixed to the lower side support plate 56b by a support 54b. The upper inspection head 50a is composed of a plate-shaped inspection electrode device 5la and an anisotropically conductive sheet 55a having elasticity arranged and fixed to the lower surface of the inspection electrode device 5la. The inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged at lattice point positions at the same pitch as the terminal electrodes 22 of the upper-side adapter device la on the lower surface thereof, and each of these inspection electrodes 52a. The electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.

The lower inspection head 50b is composed of a plate-shaped inspection electrode device 5 lb and an anisotropically conductive sheet 55b having elasticity arranged and fixed to the upper surface of the inspection electrode device 51b. The inspection electrode device 5 lb has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device lb. Each is electrically connected to a connector 57b provided on the lower support plate 56b by an electric wire 53b, and further electrically connected to an inspection circuit (not shown) of the tester via this connector 57b. .

[0063] The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b are each formed with a conductive path forming portion that forms a conductive path only in the thickness direction. As such anisotropically conductive sheets 55a and 55b, each of the conductive path forming portions is formed so as to protrude in the thickness direction at least on one surface, and exhibits high electrical contact stability. It is preferable in point to do.

[0064] In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, the upper side support plate 56a and the lower side support As each of the plates 56b moves in a direction approaching the circuit device 5, the circuit device 5 is clamped by the upper adapter device la and the lower adapter device lb.

In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is electrically connected to the connection electrode 21 of the upper adapter 1a 1a through the conductive path forming portion 11 of the anisotropic conductive sheet 10. The terminal electrode 22 of the upper-side adapter device la is electrically connected to the inspection electrode 52a of the inspection electrode device 5la via an anisotropic conductive sheet 55a. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 is electrically connected to the connection electrode 21 of the lower-side adapter device lb through the conductive path forming portion 11 of the anisotropic conductive sheet 10. The terminal electrode 22 of the side adapter device lb is electrically connected to the test electrode 50b of the test electrode device 5 lb via the anisotropic conductive sheet 55b.

[0065] In this way, each force of the electrodes 6 and 7 on both the upper and lower surfaces of the circuit device 5 is inspected at the inspection electrode 52a and the lower inspection head 50b of the inspection electrode device 51a in the upper inspection head 50a. As a result of being electrically connected to each of the test electrodes 52b of the electrode device 51b, a state of being electrically connected to the test circuit of the tester is achieved, and a required electrical test is performed in this state.

[0066] According to the electrical inspection apparatus for a circuit board described above, since the upper side adapter device la and the lower side adapter device lb are configured as shown in FIG. Regardless of the arrangement pattern of 7, the required electrical inspection can be reliably performed on the circuit device 5, and the inspected electrodes 6 and 7 of the circuit device 5 are arranged with a small pitch and a high density. Even in such a case, the required electrical inspection can be reliably performed on the circuit device 5.

FIG. 34 is an explanatory diagram showing the configuration of the second example of the electrical inspection apparatus for circuit boards according to the present invention. This electrical inspection device is for performing an electrical resistance measurement test of each wiring pattern on a circuit device 5 such as a printed circuit board on which both electrodes 6 and 7 are formed on both sides. A holder 2 for holding 5 in the inspection execution area E is provided, and the holder 2 is provided with a positioning pin 3 for arranging the circuit device 5 at an appropriate position in the inspection execution area E.

Above the inspection execution area E, the upper side adapter device la and the upper side inspection head 50a configured as shown in FIG. 17 are arranged in this order, and further above the upper side inspection head 5 Oa, The upper side support plate 56a is arranged, and the upper side inspection head 50a is fixed to the support plate 56a by a support column 54a. On the other hand, below the inspection execution area E, the lower side adapter device lb and the lower side inspection head 50b configured as shown in FIG. 17 are arranged in this order, and further below the lower side inspection head 50b. The lower side support plate 56b is arranged, and the lower side inspection head 50b is fixed to the support plate 56b by the support 54b. Has been.

The upper inspection head 50a is composed of a plate-shaped inspection electrode device 5la and an anisotropically conductive sheet 55a having elasticity arranged and fixed to the lower surface of the inspection electrode device 5la. The inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged at lattice point positions at the same pitch as the terminal electrodes 22 of the upper-side adapter device la on the lower surface thereof, and each of these inspection electrodes 52a. The electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.

The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b have basically the same configuration as that of the electrical inspection apparatus of the first example.

In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, the upper support plate 56a and the lower support plate 56b As each moves toward the circuit device 5, the circuit device 5 is clamped by the upper adapter device la and the lower adapter device lb.

In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is anisotropically connected to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the upper-side adapter device la. The terminal electrode 22 of the upper-side adapter device la is electrically connected to the inspection electrode 52a of the inspection electrode device 51a via the anisotropic conductive sheet 55a. Connected. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 is connected to the connection electrode pair 21a of the lower adapter device lb. Are electrically connected to both the current supply electrode 21b and the voltage measurement electrode 21c via the conductive path forming portion 11 of the anisotropic conductive sheet 10, and the terminal electrode 22 of the lower adapter device lb is It is electrically connected to the inspection electrode 52b of the inspection electrode device 51b via the anisotropic conductive sheet 55b.

[0069] In this way, each of the test electrodes 6 and 7 on both the upper surface and the lower surface of the circuit device 5 is connected to the test electrode 52a and the lower test head 50b of the test electrode device 51a in the upper test head 50a. As a result of being electrically connected to each of the inspection electrodes 52b of the inspection electrode device 51b, a state of being electrically connected to the inspection circuit of the tester is achieved, and a required electrical inspection is performed in this state. Specifically, a constant current is supplied between the current supply electrode 21b in the upper adapter device la and the current supply electrode 21b in the lower adapter device lb, and the upper adapter device la. Designate one of the multiple voltage measurement electrodes 21c in la, the one specified voltage measurement electrode 21c, and the upper surface side inspected electrically connected to the voltage measurement electrode 21c The voltage between the voltage measuring electrode 21c in the lower side adapter device lb electrically connected to the electrode 7 to be inspected on the lower surface side corresponding to the electrode 6 is measured, and based on the obtained voltage value, Electricity of the wiring pattern formed between the inspected electrode 6 on the upper surface side electrically connected to the specified one voltage measuring electrode 21c and the corresponding inspected electrode 7 on the lower surface side corresponding thereto A resistance value is obtained. Then, the electrical resistances of all the wiring patterns are measured by sequentially changing the designated voltage measuring electrode 21c.

[0070] According to the above-described circuit board electrical inspection apparatus, since it has the upper side adapter apparatus la and the lower side adapter apparatus lb configured as shown in FIG. Regardless of the arrangement pattern of 7, the required electrical inspection can be reliably performed on the circuit device 5, and the electrodes 6 and 7 to be inspected of the circuit device 5 have minute pitches and high density. Even if it is arranged, the required electrical inspection can be reliably performed on the circuit device 5.

[0071] The present invention is not limited to the above-described embodiment, and for example, various modifications such as the following can be covered.

(1) In the anisotropic conductive sheet 10, the conductive path forming portion 1 in the anisotropic conductive sheet 10 It is not essential that the protrusions are formed in 1. The entire surface of the anisotropic conductive sheet 10 may be flat.

(2) In the adapter device, the anisotropic conductive sheet 10 may be arranged so as to cover only the connection electrode region 25 of the adapter body 20.

(3) The circuit device to be inspected is not limited to a printed circuit board, but may be a semiconductor integrated circuit device such as a knock IC or MCM, or a circuit device formed on a wafer.

(4) In the formation of the conductive path forming part 11, the conductive path forming part 11 is formed by removing all parts of the conductive elastomer layer 11B other than the part that becomes the conductive path forming part by laser processing. However, as shown in FIGS. 35 and 36, the conductive path forming portion 11 can also be formed by removing only the peripheral portion of the conductive elastomer layer 11B that becomes the conductive path forming portion. . In this case, the remaining part of the conductive elastomer layer 11B can be removed by mechanically peeling from the contact member composite 13F.

(5) In the adapter device of the present invention, as shown in FIG. 37, on the anisotropic conductive sheet 10 integrally provided on the adapter body 20, the conductive particles P are further contained in the elastic polymer substance. A so-called dispersive anisotropic conductive sheet 30 is arranged in such a manner that chains are formed so as to be aligned in the thickness direction and chained by the conductive particles P are dispersed in the plane direction. be able to.

Example

[0072] Hereinafter, the ability to describe specific examples of the present invention The present invention is not limited to the following examples.

(1) Manufacture of adapter body:

An adapter body (20) having the following specifications was manufactured according to the configuration shown in FIG. That is, the adapter body (20) has a vertical and horizontal dimension of 160 mm X 120 mm, and the substrate material is a glass fiber reinforced epoxy resin. The connection electrode region on the surface of the adapter body (20) includes Rectangular connection electrode with dimensions of 120 mX 60 m (21) force 4800 pieces in total with a minimum separation distance of 30 m (minimum center-to-center distance of 90 m) It is. On the back of the adapter body (20), a total of 4800 terminals are arranged at a pitch of a circular terminal electrode (22) force of 750 μm with a diameter of 400 m.

[0074] (2) Production of contact member composite:

Prepare a laminated material in which a metal foil (14) made of copper with a thickness of S18 μm is peeled and laminated on one surface of a 100 μm thick resin film made of polyethylene terephthalate. On the surface of the foil (14), 4800 openings (15K) in a rectangular shape with dimensions of 120 m x m, using a photolithography technique, minimum separation distance force S30 m (minimum center-to-center distance of 90 A resist layer (15) having a thickness of 80 μm was formed (see FIG. 4). Thereafter, electrolytic nickel plating is applied to the surface of the metal foil (14) to form a contact member (13) made of nickel having a thickness of about 80 m in each opening (15K) of the resist layer (15). Therefore, the contact member composite (13F) was manufactured (see Fig. 5).

) o

Here, the plating treatment was performed under the conditions of a plating bath temperature of 50 ° C, a current density of 2.5 AZdm, and a plating treatment time of 2 hours.

[0075] (3) Fabrication of metal mask composite

Prepare a laminated material in which a metal foil (16) made of copper with a thickness of S18 μm is peeled and laminated on one surface of a 100 μm thick resin film made of polyethylene terephthalate. On the surface of the foil (16), using a photolithography technique, 4800 rectangular (17K) forces each with dimensions of 120 m X m Minimum separation distance Force S30 m (minimum center-to-center distance is 90 A resist layer (17) having a thickness of 80 μm was formed (see FIG. 6). Thereafter, an electrolytic nickel plating treatment is applied to the surface of the metal foil (16) to form a metal mask (18) made of nickel having a thickness of about 80 m in each opening (17K) of the resist layer (17). Thus, a metal smack composite (18F) was produced (see FIG. 7).

[0076] (4) Formation of one layer of conductive elastomer:

Addition-type liquid silicone rubber 100 parts by weight of gold is coated on the core particles made of nickel. The conductive elastomer material was prepared by dispersing 70 parts by weight of the resulting conductive particles (number average particle diameter 15 m, ratio force of gold to core particles% by weight). By applying this conductive elastomer material on one surface of the contact member composite (13F) on which the contact member (13) is formed by screen printing, the conductive elastomer material having a thickness of 150 m is applied. A layer (11A) was formed (see Figure 8).

Next, a metal mask composite (18F) is formed on the conductive elastomer material layer (11A), and each of the metal masks (18) is contacted via the conductive elastomer material layer (11A). Each of the members 13 is disposed so as to face each other, and in this state, a magnetic layer of 2 Tesla is applied in the thickness direction by an electromagnet to the conductive conductive elastomer material layer (11A) at 120 ° C By conducting the curing process under the condition of 1 hour, a conductive elastomer layer (11B) having a thickness of 150 m supported on the contact member composite (13F) was formed (see FIGS. 9 to 11).

(5) Formation of conductive path forming portion:

Surface force of metal foil (16) in metal mask composite (18F) Peel off the resin film, and use ferric chloride etching solution for exposed metal foil (16) at 50 ° C for 30 seconds. The metal foil (16) and the resist layer (17) were exposed by removing the metal foil (16) by etching under the conditions described above (see FIG. 12). In this state, the conductive elastomer layer (11B) and the resist layer (27) are subjected to laser processing with a carbon dioxide gas laser device through a metal mask (18), whereby the contact member composites ( 13F) 4800 conductive path forming portions (11) supported on the surface were formed (see FIG. 13). Thereafter, the surface force metal mask (18) of the conductive path forming part (11) was peeled off.

In the above, the laser processing conditions by the carbon dioxide laser device are as follows. In other words, the carbon dioxide laser processing machine “ML-605GTX” (manufactured by Mitsubishi Electric Corporation) was used as the equipment, the laser beam diameter was 60 m, and the laser output was 0.8 mJ. Laser processing was performed by irradiating the laser beam with 10 shots.

[0078] (6) Formation of insulating portion:

By applying addition-type liquid silicone rubber to the surface of the adapter body (20), An insulating material layer (12A) having a thickness of 100 μm was formed, and a contact member composite (13F) with 4800 conductive path forming parts (11) formed on the insulating material layer (12A). ) The upper and lower surfaces of the adapter body (20) are brought into contact with each other and the corresponding conductive path forming portion (11) (FIG. 14). And see Figure 15). Then, by applying a pressure of 800 kgf to the contact member composite (13F), the thickness of the conductive path forming part (11) is inertially compressed from 150 m to 120 m, and in this state, 120 ° C The insulating portion (12) was formed between the adjacent conductive path forming portions (11) by curing the insulating layer material layer (12A) under the conditions of 1 hour (see FIG. 16).

Thereafter, the adapter foil of the present invention was manufactured by removing the metal foil (14) in the contact member composite (13F) by etching (see FIGS. 1 to 3). The anisotropic conductive sheet (10) in this adapter device has a conductive path forming part (11) with a thickness of 150 m, an insulating part (12) with a thickness of 100 m, the smallest of the conductive path forming part (11). The separation distance is 30 m (minimum center distance is 90 m). In addition, the conductive path forming part (11) protrudes from the surface of the insulating part (12), the protruding height of the conductive path forming part (11) is 50 / zm, and the conductive path forming part (11) The proportion of sex particles was 50% in volume fraction.

The adapter device of the present invention was manufactured in the same manner as in Example 1 except that the amount of conductive particles used was changed from 70 parts by weight to 79 parts by weight in the preparation of the conductive elastomer material. The anisotropic conductive sheet (10) in this adapter device has a conductive path forming part (11) thickness of 150 mm, an insulating part (12) thickness of 100 m, and a minimum separation distance of the conductive path forming part (11). Is (the minimum center-to-center distance is 90 / zm). The conductive path forming part (11) protrudes from the surface of the insulating part (12), and the protruding height of the conductive path forming part (11) is 50 μm. The proportion of particles was 56% in volume fraction.

[0080] <Comparative Example 1>

(1) Manufacture of adapter body:

Following the configuration shown in Fig. 2, an adapter body with the following specifications was manufactured.

In other words, the adapter body is 160mm x 120mm in length and width, the substrate material is glass fiber reinforced epoxy resin, and the connection on the surface of the adapter body In the electrode area, a rectangular connecting electrode force with a dimension of 120 / zm X 60 / zm has a minimum separation distance of 30 m (minimum center-to-center distance of 90 m) and a total of 4,800. In addition, a total of 4800 pieces of circular terminal electrode force of 750 / zm with a diameter force of 00 m are arranged on the back of the adapter body.

[0081] (2) Fabrication of anisotropic conductive elastomer single layer forming mold:

According to the configuration shown in FIG. 39, upper and lower molds having the following specifications were produced.

Each of the ferromagnetic parts in the upper die is 160mm x 120mm in length and width, thickness is 10, the material is nickel, and a total of 4800 pieces are arranged according to the pattern of the connection electrode on the adapter body. ing. The nonmagnetic part of the upper mold is 150 μm thick, and is made of a hardened material of dry film resist, and its surface protrudes 50 m from the ferromagnetic part.

Each of the ferromagnetic parts in the lower mold is 160mm x 120mm in length and thickness is 100 μm, the material is nickel, and a total of 4800 pieces according to the same pattern as the connection electrode of the adapter body Has been placed. The nonmagnetic part of the lower mold is 100 μm thick and is a hardened material of dry film resist.

[0082] (3) Formation of anisotropic conductive sheet:

By adding 63 parts by weight of conductive particles with an average particle diameter of 12 m to 100 parts by weight of addition-type liquid silicone rubber, mixing, and then subjecting to degassing treatment under reduced pressure, a material for anisotropic conductive elastomers Was prepared. In the above, as the conductive particles, those obtained by subjecting core particles made of nickel to gold plating (average coating amount: 2% by weight of the weight of the core particles) were used. By applying this conductive elastomer material on the surface of the adapter body by screen printing, a conductive elastomer material layer having a thickness of 150 m was formed on the adapter body.

Next, the adapter body on which the conductive elastomer material layer is formed is aligned and arranged on the surface of the lower mold, and the upper mold is placed on the surface of the conductive elastomer material layer formed on the adapter body. Were aligned and placed. After that, a pair of electromagnets are placed on the upper surface of the upper mold and the lower surface of the lower mold, and the electromagnets are operated, so that a magnetic field of 2 Tesla is formed between the upper and lower ferromagnetic parts. While acting, 120 ° C, 1 By conducting a curing process for one layer of conductive elastomer under time conditions, 4800 conductive path forming portions arranged on each connection electrode integrally provided on the surface of the adapter body, and these conductive paths An anisotropic conductive sheet comprising an insulating portion interposed between the forming portions was formed, and thus a comparative adapter device was manufactured. The anisotropic conductive sheet in this adapter device has a conductive path forming part thickness of 150 mm, an insulating part thickness of 100 m, and a minimum separation distance of the conductive path forming part of 30 m (minimum center-to-center distance of 90 m). It is. The conductive path forming part protrudes from the surface force of the insulating part, the protruding height of the conductive path forming part is 50 / zm, and the ratio of the conductive particles in the conductive path forming part is 45% by volume fraction. It was.

[0083] <Comparative example 2>

A comparative adapter device was manufactured in the same manner as in Comparative Example 1 except that the amount of conductive particles used was changed from 63 parts by weight to 51 parts by weight in the preparation of the conductive elastomer material. The anisotropic conductive sheet in this adapter device has a thickness of the conductive path forming part of 150 mm, an insulating part of 100 m, a minimum separation distance of the conductive path forming part of 30 m (the minimum center-to-center distance is 90 m). m). In addition, the conductive path forming part has a protruding surface force of the insulating part, the protruding height of the conductive path forming part is 50 m, and the proportion of conductive particles in the conductive path forming part is 36% in volume fraction. It was.

An adapter device for comparison was manufactured in the same manner as in Comparative Example 1 except that the amount of conductive particles used was changed from 63 parts by weight to 84 parts by weight in the preparation of the conductive elastomer material. The anisotropic conductive sheet in this adapter device has a thickness of the conductive path forming part of 150 mm, an insulating part of 100 m, a minimum separation distance of the conductive path forming part of 30 m (the minimum center-to-center distance is 90 m). m). In addition, the conductive path forming part has a protruding surface force of the insulating part, the protruding height of the conductive path forming part is 50 m, and the proportion of conductive particles in the conductive path forming part is 60% in volume fraction. It was.

A comparative adapter device was manufactured in the same manner as in Comparative Example 1 except that the amount of conductive particles used was changed from 63 parts by weight to 86 parts by weight in the preparation of the conductive elastomer material. Made. The anisotropic conductive sheet in this adapter device has a thickness of the conductive path forming part of 150 mm, an insulating part of 100 m, a minimum separation distance of the conductive path forming part of 30 m (the minimum center-to-center distance is 90 m). m). In addition, the conductive path forming part has a protruding surface force of the insulating part, the protruding height of the conductive path forming part is 50 m, and the proportion of conductive particles in the conductive path forming part is 61% in terms of volume fraction. It was.

[0086] [Evaluation of adapter device]

Using the adapter devices obtained in Examples 1 and 2 and Comparative Examples 1 to 4, the electrical resistance measuring instrument was used, and each of the conductive path forming portions was compressed by 5% in the thickness direction, and the conductors were introduced. The electrical resistance (hereinafter referred to as “conduction resistance”) between the surface of the electrical path forming portion and the terminal electrode electrically connected to the conductive path forming portion is measured, and this conductive resistance is 0.1 Ω or less. The ratio of the conductive path forming part was calculated.

In addition, the adapter devices obtained in Examples 1 and 2 and Comparative Examples 1 to 4 are adjacent to each other in a state where each of the conductive path forming portions is compressed 5% in the thickness direction using an electric resistance measuring device. Measure the electrical resistance (hereinafter referred to as “insulation resistance”) between two conductive path formation parts (hereinafter referred to as “conductive path formation part pair”), and the insulation resistance is 100ΜΩ or more. The ratio of the forming part pair was determined.

The results are shown in Table 1.

[0087] [Table 1]

Conduction resistance 0.1 Ω Conduction path formation part with insulation resistance of 100 M or less Ratio of formation of conductive path Ω or more (%) Ratio of part pair (%) Example 1 1 0 0 1 0 0 Example 2 1 0 0 1 0 0 Comparative Example 1 9 8 1 0 0 Comparative Example 2 9 6 1 0 0 Comparative Example 3 1 0 0 9 9 Comparative Example 4 1 0 0 9 8 As is apparent from the results in Table 1, the Examples In the adapter device obtained in 1-2, high conductivity is obtained in all the conductive path forming portions, and all the conductive path forming portions are sufficiently between adjacent conductive path forming portions. It is certain that a good insulation state will be achieved.

On the other hand, in the adapter device obtained in Comparative Examples 1 to 4, the insulation state between the conductive path forming part adjacent to the conductive path forming part having high conductivity is sufficiently achieved. On the other hand, high conductivity is not obtained with respect to the conductive path forming part in which the insulation state between the adjacent conductive path forming parts is sufficiently achieved. Therefore, for all the conductive path forming parts, An adapter device having high electrical conductivity and sufficiently achieving an insulation state between adjacent conductive path forming portions could not be obtained.

Claims

The scope of the claims

[1] An adapter body having a connection electrode region in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface, and on the connection electrode region of the adapter body An anisotropic conductive sheet comprising a plurality of conductive path forming portions extending in the thickness direction located on the surface of each of the connection electrodes and an insulating portion that insulates them from each other. A method of manufacturing an adapter device comprising a contact member made of metal integrally provided on a conductive path forming portion of an anisotropic conductive sheet,

A contact member composite comprising a plurality of contact members made of metal each exhibiting magnetism according to a specific pattern related to the connection electrode is prepared on a metal plate, and the contact member composite is cured on the contact member composite. A liquid polymer substance forming an elastic polymer substance and forming a conductive elastomer material layer containing conductive particles exhibiting magnetism in the forming material, and on each of the conductive elastomer material layers, Each of the plurality of metal masks made of metal exhibiting magnetism is disposed so as to face the contact member with the conductive elastomer material layer interposed therebetween, and in this state, the conductive elastomer material layer is disposed on the conductive elastomer material layer. On the other hand, by applying a magnetic field in the thickness direction and curing the material layer for conductive elastomer, a conductive elastomer layer is formed, and the conductive elastomer layer is formed. The by removing the portion other than the portion located between the contact member and the metal mask by laser machining, by forming a plurality of conductive path-forming parts arranged according to the specific pattern,

The metal mask disposed on each conductive path forming portion is removed, and then the contact member composite having the conductive path forming portion formed thereon is cured to be an insulating material made of a material that becomes an elastic polymer substance. From the fact that the layer is superimposed on the adapter body formed on the connection electrode region, each connection electrode in the connection electrode region of the adapter body is brought into contact with the corresponding conductive path forming portion, A method for manufacturing an adapter device, comprising: a step of forming an insulating portion by curing the material layer for the insulating portion in this state.

[2] Follow the pattern corresponding to the electrode to be inspected in the circuit device to be inspected on the surface. An adapter body having a connection electrode area formed with a plurality of connection electrode pairs each consisting of two connection electrodes for current supply and voltage measurement, and an integral body on the connection electrode area of the adapter body An anisotropic conductive sheet comprising a plurality of conductive path forming portions extending in the thickness direction and provided on the surface of each of the connection electrodes, and insulating portions that insulate them from each other. A method of manufacturing an adapter device including a metal contact member integrally provided on a conductive path forming portion of an anisotropic conductive sheet,

[3] An adapter main body having a connection electrode region in which a plurality of connection electrodes are formed in accordance with a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface; A plurality of conductive path forming portions extending in the thickness direction, which are integrally provided on the connection electrode region of the putter main body and located on the surface of each of the connection electrodes, and insulating portions that insulate these from each other A method of manufacturing an adapter device comprising an anisotropic conductive sheet,

The metal mask disposed on each conductive path forming portion is removed, and then the release support plate on which the conductive path forming portion is formed is cured and the insulating portion material is made of a material that becomes an elastic polymer substance. By overlapping the layer on the adapter body formed on the connection electrode region, each of the connection electrodes in the connection electrode region of the adapter body and the corresponding conductive path forming portion are brought into contact with each other. A method for manufacturing an adapter device, comprising: a step of forming an insulating portion by curing the material layer for the insulating portion in this state.

A connection electrode region in which a plurality of connection electrode pairs each comprising two connection electrodes for current supply and voltage measurement are formed according to a pattern corresponding to the electrode to be inspected in a circuit device to be inspected on the surface. An adapter main body, a plurality of conductive path forming portions extending in the thickness direction, which are integrally provided on the connection electrode region of the adapter main body and are positioned on the surfaces of the connection electrodes, and A method for producing an adapter device comprising an anisotropic conductive sheet composed of insulating parts that are insulated from each other, and forming a liquid polymer material that is cured to become an elastic polymer material on a releasable support plate Forming a material layer for a conductive elastomer in which conductive particles exhibiting magnetism are contained in the material And a plurality of metal masks each made of a metal exhibiting magnetism are disposed on the conductive elastomer material layer in accordance with a specific pattern related to the connection electrode, and in this state, the conductive elastomer material is used. By curing the material layer, a conductive elastomer layer is formed, and the conductive elastomer layer is laser processed to remove portions other than the portion where the metal mask is disposed, whereby the specific pattern is formed. Forming a plurality of conductive path forming portions arranged according to

[5] An adapter device obtained by the manufacturing method according to any one of claims 1 to 4.

[6] An electrical inspection device for a circuit device comprising the adapter device according to [5].