JP2007087709A - Anisotropic conductive connector and manufacturing method thereof, adapter device and circuit device electrical inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an anisotropic conductive connector and a method for manufacturing the same, in which a required insulation between electrodes is ensured and a required electrical connection is reliably achieved even if the pitch of the electrodes is minute and arranged at a high density. An adapter device and an electrical inspection device for a circuit device are provided.
An anisotropic conductive connector of the present invention has an elastic anisotropic conductive film in which a plurality of conductive path forming portions extending in the thickness direction are insulated from each other by an insulating portion, and ultraviolet rays are formed only on the conductive path forming portion. Contains absorbent material. The conductive path forming part can be obtained by laser processing a conductive elastomer layer containing an ultraviolet absorbing substance with an ultraviolet laser. The insulating part is obtained by forming an insulating part material layer made of a polymer substance-forming material that is cured and becomes an elastic polymer substance between the conductive path forming parts and performing a curing process.
[Selection] Figure 8

Description

  The present invention relates to an anisotropic conductive connector that can be suitably used for electrical inspection of a circuit device such as a printed circuit board, a method for manufacturing the same, an adapter device including the anisotropic conductive connector, and an adapter device including the adapter device. The present invention relates to an electrical inspection apparatus for circuit devices.

In general, for a circuit board for configuring or mounting an integrated circuit device or other electronic component, the wiring pattern of the circuit board is expected before the electronic component is assembled or before the electronic component is mounted. It is necessary to inspect its electrical characteristics to confirm that it has performance.
Conventionally, as a method of performing an electrical inspection of a circuit board, a test electrode device in which a plurality of test electrodes are arranged according to lattice point positions arranged vertically and horizontally, and a circuit board to be inspected on the test electrodes of this test electrode device A method of using a combination with an adapter for electrically connecting the electrodes to be inspected is known. The adapter used in this method is a printed wiring board called a pitch conversion board.
This adapter has a plurality of connection electrodes arranged in accordance with a pattern corresponding to the inspection target electrode of the circuit board to be inspected on one surface, and a lattice point having the same pitch as the inspection electrode of the inspection electrode device on the other surface. A plurality of terminals having a plurality of terminal electrodes arranged at positions, and comprising a current supply connection electrode and a voltage measurement connection electrode arranged in accordance with a pattern corresponding to an electrode to be inspected on a circuit board to be inspected on one side Are known, and the other adapter has, for example, a plurality of terminal electrodes arranged at lattice point positions at the same pitch as the inspection electrodes of the inspection electrode device on the other surface. It is used for an open / short test of each circuit on a circuit board, and the latter adapter is used for an electrical resistance measurement test for each circuit on the circuit board.
Therefore, in the electrical inspection of a circuit board, generally, in order to achieve a stable electrical connection between the circuit board to be inspected and the adapter, a connector is provided between the circuit board to be inspected and the adapter. As an example, an anisotropic conductive elastomer sheet is interposed.

This anisotropically conductive elastomer sheet has conductivity only in the thickness direction, or has a number of pressurized conductive portions that show conductivity only in the thickness direction when pressed.
As such an anisotropically conductive elastomer sheet, those having various structures are conventionally known, and typical examples thereof are those obtained by uniformly dispersing metal particles in an elastomer (for example, patents). Reference 1), in which conductive magnetic metal particles are non-uniformly dispersed in an elastomer to form a number of conductive path forming portions extending in the thickness direction and insulating portions that insulate them from each other. (For example, refer to Patent Document 2), and those in which a step is formed between the surface of the conductive path forming portion and the insulating portion (for example, refer to Patent Document 3).
For a circuit board having electrodes to be inspected with a small arrangement pitch, an anisotropic conductive elastomer sheet in which a conductive path forming portion is formed according to a pattern corresponding to the pattern of the electrodes to be inspected on the circuit board is high. This is preferable in that connection reliability can be obtained.

However, such an anisotropically conductive elastomer sheet is manufactured as a single product and handled alone, and has a specific positional relationship with respect to the adapter and the circuit board in electrical connection work. It is necessary to hold and fix.
However, in the means for achieving the electrical connection of the circuit board using an independent anisotropic conductive elastomer sheet, the arrangement pitch of the electrodes to be inspected on the circuit board to be inspected (hereinafter referred to as “electrode pitch”), That is, there is a problem in that it becomes difficult to align and hold and fix the anisotropic conductive elastomer sheet as the distance between the centers of the electrodes to be inspected adjacent to each other decreases.
Even when the desired alignment and holding / fixing are realized once, when a thermal history due to a temperature change is received, the degree of stress due to thermal expansion and contraction is determined by the circuit board to be inspected. There is a problem in that since the constituent material and the material constituting the anisotropic conductive elastomer sheet are greatly different, the electrical connection state is changed and a stable connection state is not maintained.
And recently, in order to solve the above-mentioned problem, an anisotropic conductive connector in which the peripheral portion of the anisotropic conductive elastomer sheet is supported by a frame plate made of metal has been proposed (for example, Patent Document 4). reference.).

Such an anisotropic conductive connector is manufactured as follows, for example.
First, a mold having a configuration as shown in FIG. 37 is prepared. In this mold, a ferromagnetic part 82 is arranged on a substrate 81 in accordance with the same pattern as, for example, an electrode to be inspected of a circuit board to be inspected, and a non-magnetic substance is provided in a part other than the ferromagnetic part 82. The ferromagnetic body portion 87 is placed on one template (hereinafter referred to as “upper die”) 80 in which the portion 83 is disposed and on the substrate 86 according to the pattern of the electrodes to be inspected and the palms of the circuit board to be inspected. And the other template (hereinafter referred to as “lower mold”) 85 in which a non-magnetic part 88 is arranged in a part other than the ferromagnetic part 87.
Then, as shown in FIG. 38, a frame plate 90 having an opening 91 is disposed in the mold, and an anisotropic conductive elastomer material layer 95A is formed so as to close the opening 91 of the frame plate 90. This anisotropic conductive elastomer material layer 95A is formed by containing conductive particles P exhibiting magnetism in a liquid polymer material-forming material that is cured to become an elastic polymer material.
Next, a pair of electromagnets (not shown) are arranged on the upper surface of the upper mold 80 and the lower surface of the lower mold 85, and the electromagnet is operated, so that the lower mold 85 corresponding to the lower mold 85 corresponds to this. A parallel magnetic field is applied in the direction toward the ferromagnetic body portion 87 of the. At this time, each of the ferromagnetic body portion 82 of the upper mold 80 and the ferromagnetic body section 87 of the lower mold 85 acts as a magnetic pole, and therefore, the ferromagnetic body section 82 of the upper mold 80 and the ferromagnetic body section 87 of the lower mold 85. A magnetic field having a larger strength than the other regions acts on the region between the two regions. As a result, in the anisotropic conductive elastomer material layer 95 </ b> A, the conductive particles P dispersed in the anisotropic conductive elastomer material layer 95 </ b> A are converted into the ferromagnetic part 82 of the upper mold 80 and the lower mold 85. It moves toward the part located between the ferromagnetic part 87 and gathers in the part, and further aligns in the thickness direction.
In this state, by performing, for example, a curing treatment by heating on the anisotropic conductive elastomer material layer 95A, a large number of conductive paths extending in the thickness direction containing the conductive particles P as shown in FIG. An anisotropic conductive connector is manufactured in which an anisotropic conductive elastomer sheet 95 composed of a forming portion 96 and an insulating portion 97 that insulates them from each other is supported by a frame plate 90.

  According to such an anisotropic conductive connector, it is possible to easily align the anisotropic conductive elastomer sheet with respect to the circuit board in the electrical inspection of the circuit board. Since the thermal expansion can be regulated by the frame plate, a favorable electrical connection state is stably maintained against environmental changes such as thermal history due to temperature changes, and thus high connection reliability can be obtained.

However, the anisotropic conductive connector has the following problems.
As a circuit board for configuring or mounting an electronic component, one in which electrodes are arranged in a frame shape along, for example, four sides of a rectangle is known. Thus, in order to perform an electrical inspection of such a circuit board, the anisotropic conductive film having the anisotropic conductive elastomer sheet 95 in which the conductive path forming portion 96 is arranged in a frame shape along the four sides of the rectangle. It is necessary to use a sex connector. However, in such an anisotropic conductive elastomer sheet 95, since the central portion surrounded by the conductive path forming portion 96 is all the insulating portion 97, the anisotropic conductive elastomer sheet 95 is formed in the anisotropic conductive elastomer sheet 95. As for the conductive particles existing in the central portion of the elastomer material layer 95A, the moving distance becomes extremely long, and as a result, it is difficult to reliably gather the conductive particles in the portion to be the conductive path forming portion. . For this reason, the obtained conductive path forming portion 96 is not filled with a required amount of conductive particles, and a considerable amount of conductive particles remain in the insulating portion 97. A reliable elastomer sheet cannot be formed reliably.

In addition, in integrated circuit devices, the number of electrodes has increased with the increase in functionality and capacity, and the arrangement pitch of electrodes, that is, the distance between the centers of adjacent electrodes has decreased, further increasing the density. Tend to. Therefore, when an electrical inspection is performed on a circuit board for configuring or mounting such an integrated circuit device, anisotropic conductive connectors arranged at high density with a small pitch of the conductive path forming portions are provided. It is necessary to use it.
Thus, in manufacturing such an anisotropic conductive connector, it is naturally necessary to use the upper mold 80 and the lower mold 85 in which the ferromagnetic portions 82 and 87 are arranged at an extremely small pitch. .

  However, when the anisotropic conductive elastomer sheet 95 is formed using the upper mold 80 and the lower mold 85 as described above, each of the upper mold 80 and the lower mold 85 is formed as shown in FIG. In FIG. 5, since the separation distance between a certain ferromagnetic part 82a, 87a and the adjacent ferromagnetic parts 82b, 87b is small, the lower part 85 corresponding to the lower part 85 corresponds to the ferromagnetic part 82a of the upper mold 80. In addition to the direction toward the ferromagnetic part 87a (indicated by the arrow X), for example, the ferromagnetic part adjacent to the ferromagnetic part 87a of the lower mold 85 corresponding to the ferromagnetic part 82a of the upper mold 80, for example. The magnetic field also acts in the direction toward 87b (indicated by arrow Y). Therefore, in the anisotropic conductive elastomer material layer 95A, the conductive magnetic particles are located between the ferromagnetic part 82a of the upper die 80 and the corresponding ferromagnetic part 87a of the lower die 85. It becomes difficult to collect the conductive magnetic particles in the portion located between the ferromagnetic body portion 82a of the upper mold 80 and the ferromagnetic body section 87b of the lower mold 85, and the conductive It is difficult to sufficiently orient the conductive particles in the thickness direction of the anisotropic conductive elastomer material layer 95A, and as a result, an anisotropic conductive connector having a desired conductive path forming portion and insulating portion cannot be obtained.

  Further, in forming the anisotropic conductive elastomer sheet, as described above, two mold plates of the upper mold 80 and the lower mold 85 are necessary. These templates are individually manufactured according to the circuit board to be inspected, for example, and the manufacturing process is complicated, so that the manufacturing cost of the anisotropic conductive connector is extremely high. As a result, the inspection cost of the circuit device is increased.

In order to solve such problems, a conductive elastomer layer supported on a support plate and containing conductive particles oriented in a thickness direction is formed by laser processing with a carbon dioxide laser. Thus, there has been proposed a method of forming a plurality of conductive path forming portions arranged according to a target pattern and forming an insulating portion between these conductive path forming portions (see Patent Document 5).
However, it has been found that such a method has the following problems. (1) Laser processing by a carbon dioxide gas laser is thermal processing in which a portion of the workpiece irradiated with the laser light is locally heated and burned by irradiating the workpiece with a laser beam. However, in such laser processing, the elastic polymer material that forms the conductive elastomer layer, which is the workpiece, cannot be completely burned down, and as a result, between adjacent conductive path forming portions on the support plate. In this case, a carbon material residue is generated. Therefore, in this state, when an insulating portion is formed between the conductive path forming portions, the carbon material residue is transferred to the surface of the insulating portion, so that the electrical resistance between the adjacent conductive path forming portions is reduced. As a result, it becomes difficult to ensure the required insulation.
(2) In order to obtain an anisotropic conductive elastomer sheet having high conductivity, it is important to form a conductive path forming portion containing a high proportion of conductive particles. On the other hand, in order to obtain an anisotropic conductive elastomer sheet having high unevenness absorbability, it is important to form a conductive path forming portion having a large thickness.
Thus, in the above manufacturing method, in order to form a conductive path forming part having a large thickness containing conductive particles, a conductive elastomer having a large thickness containing conductive particles at a high rate. It is necessary to form a layer.
However, since such a conductive elastomer layer is difficult to be molded by laser processing, it is difficult to obtain a desired conductive path forming portion.

JP 51-93393 A Japanese Patent Laid-Open No. 53-147772 JP-A-61-250906 Japanese Patent Laid-Open No. 11-40224 JP 2004-342597 A

The present invention has been made based on the circumstances as described above, and the first object of the present invention is that even when the electrodes to be connected are arranged with a minute pitch and a high density, An object of the present invention is to provide an anisotropic conductive connector that can secure required insulation between adjacent electrodes and reliably achieve a required electrical connection to each of the electrodes, and a method of manufacturing the same.
The second object of the present invention is to provide required insulation between adjacent electrodes to be inspected even when the electrodes to be inspected of the circuit device to be inspected are arranged with a small pitch and a high density. Is provided, and an object of the present invention is to provide an adapter device that can reliably achieve a required electrical connection for the circuit device.
The third object of the present invention is to ensure the required electrical inspection of the circuit device even when the electrodes to be inspected of the circuit device to be inspected are arranged with a small pitch and a high density. It is another object of the present invention to provide an electrical inspection device for a circuit device that can be implemented in the present invention.

In the anisotropic conductive connector of the present invention, a plurality of conductive path forming portions extending in the thickness direction, which are contained in a state where conductive particles exhibiting magnetism are aligned in the thickness direction, are insulated from each other by an insulating portion. In an anisotropic conductive connector having an elastic anisotropic conductive film,
Only the conductive path forming part contains an ultraviolet absorbing material.

In the anisotropic conductive connector of the present invention, a plurality of conductive path forming portions extending in the thickness direction, which are contained in a state where the conductive particles exhibiting magnetism are aligned in the thickness direction, are insulated from each other by the insulating portion. In the anisotropic conductive connector having an elastic anisotropic conductive film,
The conductive path forming portion contains an ultraviolet absorbing material,
The conductive path forming portion is obtained by laser processing a conductive elastomer layer containing an ultraviolet absorbing material and a large number of conductive particles oriented in the thickness direction in an elastic polymer material with an ultraviolet laser. It is characterized by that.

In the anisotropic conductive connector of the present invention, a plurality of conductive path forming portions extending in the thickness direction, which are contained in a state where the conductive particles exhibiting magnetism are aligned in the thickness direction, are insulated from each other by the insulating portion. In the anisotropic conductive connector having an elastic anisotropic conductive film,
The conductive path forming portion contains an ultraviolet absorbing material,
The conductive path forming portion is obtained by laser processing a conductive elastomer layer containing an ultraviolet absorbing material and a large number of conductive particles oriented in the thickness direction in an elastic polymer material with an ultraviolet laser. Is,
The insulating part is obtained by forming and curing a material layer for an insulating part made of a polymer substance forming material that is cured and becomes an elastic polymer substance between the conductive path forming parts. It is characterized by.

In the anisotropic conductive connector of the present invention, the ultraviolet absorbing material is preferably a pigment.
The anisotropic conductive connector of the present invention may have a frame plate having an opening, and the elastic anisotropic conductive film may be formed so as to close the opening of the frame plate.
Further, in the anisotropic conductive connector of the present invention, the conductive elastomer layer is formed on the support, in a liquid polymer material forming material which is cured to become an elastic polymer material, and the conductive material exhibiting an ultraviolet absorbing material and magnetism. A conductive elastomer material layer containing conductive particles is formed, and a metal mask showing magnetism according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed is formed on the surface of the conductive elastomer material layer. In this state, the conductive elastomer material layer is preferably obtained by applying a magnetic field in the thickness direction and curing the conductive elastomer material layer.

In the method for manufacturing an anisotropic conductive connector according to the present invention, a plurality of conductive path forming portions extending in a thickness direction, which are contained in a state where conductive particles exhibiting magnetism are aligned so as to be aligned in the thickness direction, are mutually connected by an insulating portion. A method of manufacturing an anisotropic conductive connector having an elastic anisotropic conductive film that is insulated,
On the support, a material layer for a conductive elastomer is formed in which a liquid polymer substance forming material that is cured to become an elastic polymer substance contains an ultraviolet absorbing substance and conductive particles exhibiting magnetism,
A metal mask showing magnetism is arranged on the surface of the conductive elastomer material layer according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed. In addition, the conductive elastomer layer is formed by applying a magnetic field in the thickness direction and curing the material layer for the conductive elastomer.
A plurality of conductive path forming portions arranged in accordance with the specific pattern on the support by removing a portion other than the portion where the metal mask is arranged by laser processing the conductive elastomer layer with an ultraviolet laser. Forming an insulating portion by forming a material layer for an insulating portion made of a polymer material forming material which is cured and becomes an elastic polymer material between these conductive path forming portions and curing the layer. It is characterized by having.

  In the method for manufacturing an anisotropic conductive connector according to the present invention, a resist layer having an opening formed in accordance with a specific pattern is formed on a metal foil, and the surface of a portion of the metal foil exposed from the opening of the resist layer is formed. A metal mask composite in which a metal mask is formed in each of the openings of the resist layer is manufactured by plating with a metal exhibiting magnetism, and the metal mask composite is formed on the surface of the conductive elastomer material layer. It is preferable to arrange a metal mask exhibiting magnetism according to the specific pattern on the surface of the conductive elastomer material layer by stacking.

The adapter device of the present invention has an adapter body having a connection electrode region in which a plurality of connection electrodes are formed in accordance with a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface;
The anisotropic conductive connector having a plurality of conductive path forming portions arranged on the connection electrode region of the adapter main body and formed according to a pattern corresponding to the connection electrode in the adapter main body. It is characterized by that.

The adapter device according to the present invention has a plurality of connection electrode pairs each formed of two connection electrodes for current supply and voltage measurement according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface. An adapter body having a connecting electrode region;
The anisotropic conductive connector having a plurality of conductive path forming portions arranged on the connection electrode region of the adapter main body and formed according to a pattern corresponding to the connection electrode in the adapter main body. It is characterized by that.

  An electrical inspection device for a circuit device according to the present invention comprises the adapter device described above.

According to the anisotropic conductive connector of the present invention, the conductive path forming portion is obtained by laser processing with an ultraviolet laser capable of non-thermal processing of a conductive elastomer layer containing an ultraviolet absorbing material. Therefore, there is no carbon material residue caused by laser processing between adjacent conductive path forming portions. Moreover, since the insulating part is obtained by forming a conductive path forming part and then forming an insulating part material layer between these conductive path forming parts and curing the conductive part, the conductive particles are An insulating part that does not exist at all can be formed. Therefore, even if the electrodes to be connected are arranged with a small pitch and a high density, the required insulation between the adjacent electrodes is ensured, and the required electrical properties for each of the electrodes are ensured. Connection can be reliably achieved.
Further, as a conductive elastomer layer, a thickness direction of the conductive elastomer material layer in a state where a metal mask showing magnetism is arranged on the conductive elastomer material layer according to a specific pattern of a conductive path forming portion to be formed. By using what is obtained by applying a magnetic field to the conductive elastomer material layer and curing the conductive elastomer material layer, the conductive elastomer layer has dense conductive particles in the portion where the metal mask is disposed, Since the conductive particles in the other portions are sparse, it becomes easy to remove the portions other than the portion where the metal mask is disposed in the conductive elastomer layer by laser processing. A formation part is obtained reliably.

According to the method for manufacturing an anisotropic conductive connector of the present invention, since the conductive elastomer layer contains an ultraviolet absorbing substance, the conductive elastomer layer can be easily laser-processed by an ultraviolet laser. By using an ultraviolet laser, non-thermal processing becomes possible, so that it is possible to avoid the occurrence of carbon material residues due to laser processing between adjacent conductive path forming portions.
In addition, while a metal mask showing magnetism is arranged on the conductive elastomer material layer according to a specific pattern of the conductive path forming portion to be formed, a magnetic field is applied in the thickness direction of the conductive elastomer material layer. By curing the material layer for conductive elastomer, the conductive elastomer layer obtained has dense conductive particles in the portion where the metal mask is arranged, and sparse conductive particles in other portions. Further, it becomes easy to remove a portion other than the portion where the metal mask is disposed in the conductive elastomer layer by laser processing, and thereby, a conductive path forming portion having an intended form can be formed.
In addition, after forming a plurality of conductive path forming portions arranged according to a specific pattern, an insulating portion material layer is formed between these conductive path forming portions, and the insulating portion is formed by curing. Thus, it is possible to reliably obtain an insulating part in which no conductive particles are present.
Therefore, according to the anisotropic conductive connector obtained by such a method, even if the electrodes to be connected are arranged with a minute pitch and a high density, the required insulation between adjacent electrodes is obtained. The required electrical connection can be reliably achieved for each of the electrodes.

  According to the adapter device of the present invention, since the anisotropic conductive connector is provided, the electrodes to be inspected of the circuit device to be inspected are arranged with a small pitch and a high density. In addition, the required insulation between the adjacent electrodes to be inspected is ensured, and the required electrical connection can be reliably achieved for the circuit device.

  According to the electrical inspection device for a circuit device of the present invention, since the adapter device is provided, the electrodes to be inspected of the circuit device to be inspected are arranged with a small pitch and a high density. Even if it exists, a required electrical test | inspection can be reliably performed about the said circuit apparatus.

Hereinafter, embodiments of the present invention will be described in detail.
<Anisotropic conductive connector>
FIG. 1 is an explanatory cross-sectional view showing a configuration of a first example of an anisotropic conductive connector according to the present invention, and FIG. 2 is an enlarged view of a main part of the anisotropic conductive connector shown in FIG. It is sectional drawing for description. In the anisotropic conductive connector 10, a plurality of conductive path forming portions 16 extending in the thickness direction are arranged according to a specific pattern, and an insulating portion 17 that insulates them from each other between adjacent conductive path forming portions 16. Is formed in a state of being integrally bonded to the conductive path forming portion 16, whereby the elastic anisotropic conductive film 15 is formed. The specific pattern of the conductive path forming portion 16 is a pattern corresponding to a pattern of an electrode to be connected, for example, an inspection target electrode of a circuit device to be inspected.
In the illustrated example, the conductive path forming portion 16 is formed so as to protrude from both surfaces of the insulating portion 17. According to such an example, since the degree of compression by pressurization is greater in the conductive path forming section 16 than in the insulating section 17, a sufficiently low conductive path is reliably formed in the conductive path forming section 16, thereby The resistance value change can be reduced with respect to the change or fluctuation of the applied pressure. As a result, even if the applied pressure applied to the anisotropic conductive connector 10 is not uniform, each conductive path forming portion 16 It is possible to prevent the occurrence of conductive variation between the two.

The conductive path forming part 16 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction. On the other hand, the insulating portion 17 is made of an elastic polymer material that does not contain the conductive particles P at all. The elastic polymer material constituting the conductive path forming portion 16 and the elastic polymer material constituting the insulating portion 17 may be of different types or the same type.
The conductive path forming portion 16 contains an ultraviolet absorbing material.

As the ultraviolet absorbing material contained in the conductive path forming portion 16, a pigment can be suitably used.
Such a pigment is not particularly limited as long as it has a property of absorbing ultraviolet rays having a wavelength irradiated from an ultraviolet laser to be described later. For example, a TiO ₂ —NiO—Sb ₂ O ₃ pigment, TiO _{2 is used.} -BaO-NiO pigments, Ti pigments such as TiO ₂ -Sb ₂ O ₃ -Cr ₂ O ₃ pigments, CoO-Al ₂ O ₃ pigments, CoO-SnO-MgO pigments, CoO-Al ₂ O ₃ -Cr ₂ O ₃ pigments, Co pigments such as CoO-ZnO pigments, Cu-Ti pigments, TiO ₂ -CoO-NiO-ZnO pigments, inorganic pigments such as Fe ₂ O ₃ pigments, and various Organic pigments can be used.
The ratio of the ultraviolet absorbing material contained in the conductive path forming portion 16 is appropriately set according to the type of the ultraviolet absorbing material, but is usually 100 parts by weight of the elastic polymer material constituting the conductive path forming portion 16. 0.1 to 10 parts by weight.

The elastic polymer materials constituting the conductive path forming portion 16 and the insulating portion 17 may be the same as or different from each other.
As the elastic polymer material constituting the conductive path forming portion 16 and the insulating portion 17, a polymer material having a crosslinked structure is preferable. Various materials can be used as the curable polymer substance-forming material that can be used to obtain such an elastic polymer substance. Specific examples thereof include polybutadiene rubber, natural rubber, and polyisoprene rubber. , Conjugated diene rubbers such as styrene-butadiene copolymer rubber and acrylonitrile-butadiene copolymer rubber and hydrogenated products thereof, blocks such as styrene-butadiene-diene block copolymer rubber, styrene-isoprene block copolymer, etc. Examples include copolymer rubber and hydrogenated products thereof, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer rubber, and ethylene-propylene-diene copolymer rubber.
In the above, when the anisotropic conductive connector 10 is required to have weather resistance, it is preferable to use one other than the conjugated diene rubber, and in particular, from the viewpoint of molding processability and electrical characteristics, use silicone rubber. Is preferred.

As the silicone rubber, those obtained by crosslinking or condensing liquid silicone rubber are preferable. The liquid silicone rubber preferably has a viscosity of 10 ⁵ poise or less at a strain rate of 10 ⁻¹ sec, and may be any of a condensation type, an addition type, a vinyl group or a hydroxyl group. Good. Specific examples include dimethyl silicone raw rubber, methyl vinyl silicone raw rubber, methyl phenyl vinyl silicone raw rubber, and the like.
The silicone rubber preferably has a molecular weight Mw (referred to as a standard polystyrene-converted weight average molecular weight; the same shall apply hereinafter) of 10,000 to 40,000. Moreover, since favorable heat resistance is acquired in the obtained conductive path formation part 16, it says the value of molecular weight distribution index (ratio Mw / Mn of standard polystyrene conversion weight average molecular weight Mw and standard polystyrene conversion number average molecular weight Mn). The same shall apply hereinafter) is preferably 2 or less.

As the conductive particles P contained in the conductive path forming portion 16, magnetic particles are used because the particles can be easily aligned in the thickness direction by a method described later. Specific examples of such conductive particles include magnetic metal particles such as iron, cobalt and nickel, alloy particles thereof, particles containing these metals, or these particles as core particles. The core particles are made by plating the surface of the core particles with a metal having good conductivity such as gold, silver, palladium, rhodium, or non-magnetic metal particles, inorganic particles such as glass beads, or polymer particles. The surface of the particles may be plated with a conductive magnetic metal such as nickel or cobalt.
Among these, it is preferable to use nickel particles as core particles and the surfaces thereof plated with gold having good conductivity.
The means for coating the surface of the core particles with the conductive metal is not particularly limited, and for example, chemical plating or electrolytic plating, sputtering, vapor deposition or the like is used.

When the conductive particles P used are those in which the surface of the core particles is coated with a conductive metal, good conductivity can be obtained. Therefore, the coverage of the conductive metal on the particle surface (the surface area of the core particles) The ratio of the covering area of the conductive metal with respect to is preferably 40% or more, more preferably 45% or more, and particularly preferably 47 to 95%.
Further, the coating amount of the conductive metal is preferably 0.5 to 50% by mass of the core particle, more preferably 2 to 30% by mass, further preferably 3 to 25% by mass, and particularly preferably 4 to 20%. % By mass. When the conductive metal to be coated is gold, the coating amount is preferably 0.5 to 30% by mass of the core particles, more preferably 2 to 20% by mass, and further preferably 3 to 15%. % By mass.

Moreover, it is preferable that the particle diameter of the electroconductive particle P is 1-100 micrometers, More preferably, it is 2-50 micrometers, More preferably, it is 3-30 micrometers, Most preferably, it is 4-20 micrometers. The particle size distribution (Dw / Dn) of the conductive particles P is preferably 1 to 10, more preferably 1.01 to 7, still more preferably 1.05 to 5, and particularly preferably 1.1. ~ 4.
By using the conductive particles satisfying such conditions, the obtained conductive path forming part 16 can be easily deformed under pressure, and sufficient electric current is provided between the conductive particles in the conductive path forming part 16. Contact is obtained.
In addition, the shape of the conductive particles P is not particularly limited, but spherical particles, star-shaped particles, or agglomerated particles 2 can be easily dispersed in the polymer substance-forming material. Secondary particles are preferred.
Further, as the conductive particles P, those whose surfaces are treated with a coupling agent such as a silane coupling agent or a lubricant can be appropriately used. By treating the particle surface with a coupling agent or a lubricant, the durability of the anisotropically conductive connector is improved.

  Such conductive particles P are preferably contained in the conductive path forming portion 16 at a volume fraction of 15 to 45%, preferably 20 to 40%. When this ratio is too small, the conductive path forming portion 16 having a sufficiently small electric resistance value may not be obtained. On the other hand, when this ratio is excessive, the obtained conductive path forming portion 16 tends to be fragile, and the elasticity necessary for the conductive path forming portion 16 may not be obtained.

In the anisotropic conductive connector 10 of the present invention, the conductive path forming portion 16 includes a conductive elastomer layer in which an elastic polymer material contains an ultraviolet absorbing material and a large number of conductive particles oriented in the thickness direction. Is obtained by laser processing with an ultraviolet laser, and the insulating portion 17 is a material for an insulating portion made of a polymer material forming material that is cured between the conductive path forming portions 16 to become an elastic polymer material. It is obtained by forming a layer and subjecting it to a curing treatment.
And such an anisotropically conductive connector 10 is
On the support, a material layer for a conductive elastomer is formed in which a liquid polymer substance forming material that is cured to become an elastic polymer substance contains an ultraviolet absorbing substance and conductive particles exhibiting magnetism,
A metal mask showing magnetism is arranged on the surface of the conductive elastomer material layer according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed. In addition, the conductive elastomer layer is formed by applying a magnetic field in the thickness direction and curing the material layer for the conductive elastomer.
A plurality of conductive path forming portions arranged in accordance with the specific pattern on the support by removing a portion other than the portion where the metal mask is arranged by laser processing the conductive elastomer layer with an ultraviolet laser. 16 is formed, and between these conductive path forming portions 16, an insulating portion material layer made of a polymer material forming material that is cured to become an elastic polymer material is formed and cured to form an insulating portion. It is preferable that it is obtained by doing.
Hereinafter, a method for manufacturing the anisotropic conductive connector 10 will be specifically described.

<Formation of conductive elastomer layer>
First, a metal mask composite 18F having a plurality of metal masks 18 arranged according to a specific pattern is manufactured.
More specifically, as shown in FIG. 3, the openings 19K are formed on the metal foil 14 according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed, that is, the pattern of the electrode to be connected, by photolithography. Then, a resist layer 19 is formed. Thereafter, the surface of the portion exposed through the opening 19 of the resist layer 19 in the metal foil 14 is subjected to a plating process with a metal exhibiting magnetism, whereby each of the openings 19K of the resist layer 19 is provided as shown in FIG. A metal mask 18 is formed. As a result, a metal mask composite 18F is obtained in which the metal mask 18 is formed on the metal foil 14 according to a specific pattern.

In the above, copper, nickel, etc. can be used as the metal foil 14. The metal foil may be laminated on a resin film.
The thickness of the metal foil 14 is preferably 0.05 to 2 μm, more preferably 0.1 to 1 μm. When this thickness is too small, a uniform thin layer is not formed, which may be inappropriate as a plating electrode. On the other hand, if this thickness is excessive, it may be difficult to remove by, for example, etching.
The thickness of the metal mask 18 is preferably 1 μm or more, more preferably 1 to 100 μm, and particularly preferably 5 to 40 μm. When this thickness is too small, it may be difficult to use as a mask in laser processing described later.
As the metal constituting the metal mask 18, a metal exhibiting magnetism is used, and specific examples thereof include nickel, cobalt, and alloys thereof.
The thickness of the resist layer 19 is set according to the thickness of the metal mask 18 to be formed.

Next, a conductive elastomer material is prepared by dispersing a UV absorbing substance and conductive particles exhibiting magnetism in a liquid polymer substance-forming material that is cured to become an elastic polymer substance, as shown in FIG. Further, the conductive elastomer material layer 16A is formed by applying a conductive elastomer material on the plate-like support 13 for forming the conductive path forming portion. Then, as shown in FIG. 6, the metal mask composite 18F is disposed on the conductive elastomer material layer 16A so that each of the metal masks 18 is in contact with the conductive elastomer material layer 16A. Here, in the conductive elastomer material layer 16A, the conductive particles P exhibiting magnetism are contained in a dispersed state.
Next, a magnetic field is applied to the conductive elastomer material layer 16A via the metal mask 18 in the thickness direction of the conductive elastomer material layer 16A. Thereby, since the metal mask 18 is formed of a metal exhibiting magnetism, a magnetic field having a strength higher than that of the other portions is formed in the portion where the metal mask 18 is disposed in the conductive elastomer material layer 16A. . As a result, as shown in FIG. 7, the conductive particles P dispersed in the conductive elastomer material layer 16A gather at the portion where the metal mask 18 is disposed, and further, the conductive elastomer material layer 16A. Are aligned in the thickness direction. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 16A or after the action of the magnetic field is stopped, the conductive elastomer material layer 16A is cured to perform elasticity as shown in FIG. A conductive elastomer layer 16 </ b> B is formed in a state where the conductive particles P are contained in the polymer material so that the conductive particles P are aligned in the thickness direction so as to be supported on the support 13.

In the above, metals, ceramics, resins, composite materials thereof, and the like can be used as the material constituting the support 13.
As a method for applying the conductive elastomer material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
The thickness of the conductive elastomer material layer 16A is set according to the thickness of the conductive path forming portion to be formed.
As means for applying a magnetic field to the conductive elastomer material layer 16A, an electromagnet, a permanent magnet, or the like can be used.
The strength of the magnetic field applied to the conductive elastomer material layer 16A is preferably 0.2 to 2.5 Tesla.
The curing process of the conductive elastomer material layer 16A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the conductive elastomer material layer 16A, the time required to move the conductive particles, and the like.

<< Formation of conductive path forming part >>
First, by removing the metal foil 14 in the metal mask composite 18F disposed on the conductive elastomer layer 16B by etching, the metal mask 18 and the resist layer 19 are removed as shown in FIG. Expose. Then, by applying laser processing to the conductive elastomer layer 16B and the resist layer 19 with an ultraviolet laser through the metal mask 18, a part of the resist layer 19 and the conductive elastomer layer 16B is removed. As shown in FIG. 10, a plurality of conductive path forming portions 16 arranged according to a specific pattern are formed on a support 13. Thereafter, the metal mask 18 is removed from each surface of the obtained conductive path forming portion 16.
Here, a YAG laser device (center wavelength 355 nm), an Nd-YAG laser device (center wavelength 266 nm), a KrF excimer laser device (center wavelength 248 nm), or the like can be used as a laser device that irradiates an ultraviolet laser.
In addition, the laser processing conditions using an ultraviolet laser are appropriately set depending on the type of the laser apparatus used, but an example of the conditions when using a YAG laser apparatus is that the frequency (number of pulses per second) is 40 kHz. The beam diameter is 20 μm, the energy per pulse is 9.2 μJ, the energy density (irradiation energy per unit area) is 11 J / cm ² , and the number of shots is 5.

<Formation of insulation part>
As shown in FIG. 11, a support 13A for forming an insulating portion is prepared, and a liquid polymer substance forming material that is cured to become an insulating elastic polymer substance is applied to the surface of the support 13A. Thus, the insulating part material layer 17A is formed. Next, as shown in FIG. 12, the support member 13 on which the plurality of conductive path forming portions 16 are formed is superposed on the support member 13A on which the insulating portion material layer 17A is formed, whereby an insulating portion material layer is formed. When the conductive path forming portion 16 is infiltrated into 17A and brought into contact with the support 13A and further pressurized, each of the conductive path forming portions 16 is deformed into a compressed state in the thickness direction, and adjacent conductive path forming portions are formed. Between the portions 16, the insulating portion material layer 17A is formed. Thereafter, in this state, the insulating portion material layer 17A is subjected to a curing process, so that the insulating portions 17 that insulate them from each other between the adjacent conductive path forming portions 16 become conductive paths as shown in FIG. The elastic anisotropic conductive film 15 is formed integrally with the forming portion 16, thereby forming the elastic anisotropic conductive film 15.
Then, by releasing the mold from the supports 13 and 13A, each of the compressed conductive path forming portions 16 is restored to the original form, and as a result, protrudes from both surfaces of the insulating portion 17, and FIG. An anisotropic conductive connector 10 having the structure shown in FIG.

In the above, as the material constituting the support 13A, the same material as the support 13 for forming the conductive path forming portion can be used.
As a method for applying the polymer substance-forming material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
The thickness of the insulating part material layer 17A is set according to the thickness of the insulating part to be formed.
The curing process of the insulating part material layer 17A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the insulating part material layer 17A.

According to the above manufacturing method, since the conductive elastomer layer 16B contains the ultraviolet absorbing substance, the conductive elastomer layer 16B can be easily laser-processed by the ultraviolet laser, and the ultraviolet laser can be used. By using non-thermal processing, it is possible to avoid a carbon material residue due to laser processing between adjacent conductive path forming portions 16.
In addition, a magnetic field is provided in the thickness direction of the conductive elastomer material layer 16A in a state where a metal mask 18 showing magnetism is arranged on the conductive elastomer material layer 16A according to a specific pattern of the conductive path forming portion 16 to be formed. In addition, the conductive elastomer layer 16B obtained by curing the conductive elastomer material layer 16A becomes dense in the conductive particles in the portion where the metal mask 18 is disposed, and in the other portions. Since the conductive particles become sparse, it becomes easy to remove portions other than the portion where the metal mask 18 is disposed in the conductive elastomer layer 16B by laser processing, thereby forming a conductive path forming portion of an intended form. can do.
In addition, after forming a plurality of conductive path forming portions 16 arranged according to a specific pattern, an insulating portion material layer 17A is formed between the conductive path forming portions 16 and subjected to curing treatment, whereby the insulating portions 16 are formed. Therefore, it is possible to reliably obtain the insulating part 17 in which the conductive particles P are not present at all.
Therefore, according to the anisotropic conductive connector 10 obtained by such a method, even if the electrodes to be connected are arranged with a small pitch and a high density, the required connection between adjacent electrodes is required. Insulation is ensured and the required electrical connection can be reliably achieved for each of the electrodes.

FIG. 14 is a cross-sectional view illustrating the configuration of the second example of the anisotropic conductive connector according to the present invention, and FIG. 15 is an enlarged view of the main part of the anisotropic conductive connector shown in FIG. It is sectional drawing for description. The anisotropic conductive connector 10 includes a frame plate 11 having a plurality of openings 12 and a single elastic member supported by the frame plate 11 and arranged to close each of the openings 12 of the frame plate 11. And a conductive film 15.
In the elastic anisotropic conductive film 15, a plurality of conductive path forming portions 16 extending in the thickness direction are arranged so as to be positioned in the openings 12 of the frame plate 11 in accordance with a specific pattern, and the periphery of each of the conductive path forming portions 16. In the present embodiment, an integral insulating portion 17 that insulates adjacent conductive path forming portions 16 from each other is formed in a state of being integrally bonded to the conductive path forming portion 16. The specific pattern of the conductive path forming portion 16 is a pattern corresponding to a pattern of an electrode to be connected, for example, an inspection target electrode of a circuit device to be inspected.
The conductive path forming part 16 is configured by containing conductive particles P exhibiting magnetism in an insulating elastic polymer substance so as to be aligned in the thickness direction. On the other hand, the insulating portion 17 is made of an elastic polymer material that does not contain the conductive particles P at all. In the illustrated example, each of the conductive path forming portions 16 is formed with a protruding portion that protrudes from the surface of the insulating portion 17.

As a material constituting the frame plate 11, various non-metallic materials and metallic materials having high mechanical strength can be used.
Specific examples of non-metallic materials include resin materials such as liquid crystal polymers, polyimide resins, polyester resins, polyaramid resins, polyamide resins, glass fiber reinforced epoxy resins, glass fiber reinforced polyester resins, glass fiber reinforced polyimide resins, etc. Examples thereof include a fiber reinforced resin material, an epoxy resin, and a composite resin material containing an inorganic material such as alumina or poron nitride as a filler.
Examples of the metal material include gold, silver, copper, iron, nickel, cobalt, alloys thereof, and alloy steels.
When the anisotropic conductive connector is used in a high temperature environment, it is preferable to use a frame plate 11 having a linear thermal expansion coefficient of 3 × 10 ⁻⁵ / K or less, more preferably 1 × 10 6. ^{−6 to} 2 × 10 ⁻⁵ / K, particularly preferably 1 × 10 ^{−6 to} 6 × 10 ⁻⁶ / K. By using such a frame plate 11, it is possible to suppress misalignment due to thermal expansion of the elastic anisotropic conductive film 15.
Moreover, it is preferable that the thickness of the frame board 11 is 10-200 micrometers, More preferably, it is 15-100 micrometers. When this thickness is too small, the strength required for the frame plate 11 may not be obtained. On the other hand, when this thickness is excessive, the thickness of the elastic anisotropic conductive film 15 is inevitably large, and therefore, good conductivity may not be obtained.
The elastic polymer material, conductive particles, and other specific configurations of the elastic anisotropic conductive film 15 are the same as those of the anisotropic conductive connector 10 according to the first example.

The anisotropic conductive connector 10 can be manufactured as follows.
<< Formation of conductive path forming part >>
First, in the same manner as the method for manufacturing the anisotropic conductive connector 10 according to the first example, a plurality of conductive path forming portions 16 arranged according to a specific pattern are formed on the support 13 (FIGS. 3 to 3). 10).

<Formation of insulation part>
As shown in FIG. 16, a supporting body 13A for forming an insulating portion is prepared, and a frame plate 11 is arranged on the surface of the supporting body 13A, and a liquid high-temperature material that is cured to become an insulating elastic polymer material. The insulating material layer 17A is formed by applying a molecular substance forming material. Next, as shown in FIG. 17, the support member 13 on which the plurality of conductive path forming portions 16 are formed is superimposed on the support member 13A on which the insulating portion material layer 17A is formed. When the conductive path forming portion 16 is infiltrated into 17A and brought into contact with the support 13A and further pressurized, each of the conductive path forming portions 16 is deformed into a compressed state in the thickness direction, and adjacent conductive path forming portions are formed. Between the portions 16, the insulating portion material layer 17A is formed. Thereafter, in this state, the insulating part material layer 17A is cured to perform insulation between the adjacent conductive path forming parts 16 between the conductive path forming parts 16 as shown in FIG. The elastic anisotropic conductive film 15 is formed integrally with the forming portion 16, thereby forming the elastic anisotropic conductive film 15.
Then, by releasing the mold from the supports 13 and 13A, each of the compressed conductive path forming portions 16 is restored to the original form, and as a result, protrudes from both surfaces of the insulating portion 17, and FIG. An anisotropic conductive connector 10 having the structure shown in FIG.

In the above, as the material constituting the support 13A, the same material as the support 13 for forming the conductive path forming portion can be used.
As a method for applying the polymer substance-forming material, a printing method such as screen printing, a roll coating method, a blade coating method, or the like can be used.
The thickness of the insulating part material layer 17A is set according to the thickness of the insulating part 17 to be formed.
The curing process of the insulating part material layer 17A is usually performed by a heating process. The specific heating temperature and heating time are appropriately set in consideration of the type of polymer substance forming material constituting the insulating part material layer 17A.

According to the above manufacturing method, since the conductive elastomer layer 16B contains the ultraviolet absorbing substance, the conductive elastomer layer 16B can be easily laser-processed by the ultraviolet laser, and the ultraviolet laser can be used. By using non-thermal processing, it is possible to avoid a carbon material residue due to laser processing between adjacent conductive path forming portions 16.
Further, a magnetic field is formed in the thickness direction of the conductive elastomer material layer 16A in a state where a metal mask 18 showing magnetism is arranged on the conductive elastomer material layer 16A according to a specific pattern of the conductive path forming portion 16 to be formed. In addition, the conductive elastomer layer 16B obtained by curing the conductive elastomer material layer 16A becomes dense in the conductive particles in the portion where the metal mask 18 is disposed, and in the other portions. Since the conductive particles become sparse, it becomes easy to remove portions other than the portion where the metal mask 18 is disposed in the conductive elastomer layer 16B by laser processing, thereby forming a conductive path forming portion of an intended form. can do.
In addition, after forming a plurality of conductive path forming portions 16 arranged according to a specific pattern, an insulating portion material layer 17A is formed between the conductive path forming portions 16 and subjected to curing treatment, whereby the insulating portions 16 are formed. Therefore, it is possible to reliably obtain the insulating portion 16 in which the conductive particles P are not present at all.
Therefore, according to the anisotropic conductive connector 10 obtained by such a method, even if the electrodes to be connected are arranged with a small pitch and a high density, the required connection between adjacent electrodes is required. Insulation is ensured and the required electrical connection can be reliably achieved for each of the electrodes.

<Adapter device>
FIG. 19 is an explanatory cross-sectional view showing a configuration of the adapter device according to the first example of the present invention, and FIG. 20 is an explanatory cross-sectional view showing an adapter main body in the adapter device shown in FIG. This adapter device is for inspecting a circuit device used for, for example, performing an open / short test on a circuit device such as a printed circuit board, and has an adapter body 20 made of a multilayer wiring board.
On the surface of the adapter body 20 (upper surface in FIGS. 19 and 20), a connection electrode region in which a plurality of connection electrodes 21 are arranged according to a specific pattern corresponding to the pattern of the electrode to be inspected of the circuit device to be inspected. 25 is formed.
A plurality of terminal electrodes 22 are arranged on the back surface of the adapter main body 20 according to lattice point positions having a pitch of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, 2.54 mm, for example. The internal wiring portion 23 is electrically connected to the connection electrode 21.
On the surface of the adapter body 20, the anisotropic conductive connector 10 having the configuration shown in FIG. 14 is disposed on the connection electrode region 25, and is fixed to the adapter body 20 by appropriate means (not shown). Yes.
In the anisotropic conductive connector 10, a plurality of conductive path forming portions 16 are formed according to the same pattern as the specific pattern related to the connection electrode 21 in the adapter body 20, and the anisotropic conductive connector 10 includes: Each of the conductive path forming portions 16 is disposed on the connection electrode 21 of the adapter body 20.

  According to such an adapter device, since the anisotropic conductive connector 10 having the configuration shown in FIG. 14 is provided, the electrodes to be inspected of the circuit device to be inspected are arranged with a small pitch and a high density. Even so, the required insulation between the adjacent electrodes to be inspected is ensured, and the required electrical connection can be reliably achieved for each of the electrodes to be inspected.

FIG. 21 is an explanatory cross-sectional view showing a configuration of a second example of the adapter device according to the present invention, and FIG. 22 is an explanatory cross-sectional view showing an adapter main body in the adapter device shown in FIG. This adapter device is for testing a circuit device used for conducting an electrical resistance measurement test of each wiring pattern on a circuit device such as a printed circuit board, and has an adapter body 20 made of a multilayer wiring board.
On the surface of the adapter main body 20 (the upper surface in FIGS. 21 and 22), connection electrodes for current supply (hereinafter referred to as “current supply”) that are electrically connected to the same electrode to be inspected and are spaced apart from each other. A connection electrode region 25 in which a plurality of connection electrode pairs 21a each including a connection electrode 21b and a voltage measurement connection electrode (hereinafter also referred to as a "voltage measurement electrode") 21c are formed. Has been. These connection electrode pairs 21a are arranged according to a pattern corresponding to the pattern of the electrodes to be inspected of the circuit device to be inspected.
A plurality of terminal electrodes 22 are arranged on the back surface of the adapter main body 20 according to lattice point positions having a pitch of 0.8 mm, 0.75 mm, 1.5 mm, 1.8 mm, and 2.54 mm, for example.
Each of the current supply electrode 21 b and the voltage measurement electrode 21 c is electrically connected to the terminal electrode 22 by the internal wiring portion 23.
On the surface of the adapter main body 20, the anisotropic conductive connector 10 having the structure shown in FIG. 14 is basically disposed on the connection electrode region 25. The adapter main body 20 is provided with appropriate means (not shown). It is fixed.
In the anisotropic conductive connector 10, a plurality of conductive path forming portions 16 are formed according to the same pattern as the specific pattern related to the connection electrodes 21 b and 21 c in the adapter body 20, and the anisotropic conductive connector 10. Are arranged such that each of the conductive path forming portions 16 is positioned on the connection electrodes 21 b and 21 c of the adapter body 20.

  According to the adapter device described above, since the anisotropic conductive connector 10 having the configuration shown in FIG. 14 is provided, the electrodes to be inspected of the circuit device to be inspected are arranged with a small pitch and a high density. Even if it exists, the required insulation between adjacent to-be-tested electrodes is ensured, and a required electrical connection can be reliably achieved for each of the to-be-tested electrodes.

<Electrical inspection equipment for circuit devices>
FIG. 23 is an explanatory diagram showing a configuration of the first example of the electrical inspection apparatus for circuit boards according to the present invention. This electrical inspection device performs, for example, an open / short test on a circuit device 5 such as a printed circuit board having electrodes 6 and 7 to be inspected on both sides, and the circuit device 5 is placed in an inspection execution region E. The holder 2 for holding is provided with a positioning pin 3 for arranging the circuit device 5 at an appropriate position in the inspection execution region E. Above the inspection execution area E, an upper-side adapter device 1a and an upper-side inspection head 50a configured as shown in FIG. 19 are arranged in this order from the bottom, and further above the upper-side inspection head 50a, A side support plate 56a is disposed, and the upper side inspection head 50a is fixed to the support plate 56a by a column 54a. On the other hand, below the inspection execution area E, a lower-side adapter device 1b and a lower-side inspection head 50b configured as shown in FIG. 19 are arranged in this order from the top, and further below the lower-side inspection head 50b. The lower side support plate 56b is disposed, and the lower side inspection head 50b is fixed to the lower side support plate 56b by a support 54b.
The upper side inspection head 50a includes a plate-like inspection electrode device 51a and an anisotropic conductive sheet 55a having elasticity that is fixed and arranged on the lower surface of the inspection electrode device 51a. The inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged on the lower surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the upper-side adapter device 1a. The electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.
The lower inspection head 50b is composed of a plate-shaped inspection electrode device 51b and an anisotropic conductive sheet 55b having elasticity and fixed to the upper surface of the inspection electrode device 51b. The inspection electrode device 51b has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device 1b. Each of these inspection electrodes 52b The electric wire 53b is electrically connected to a connector 57b provided on the lower support plate 56b, and is further electrically connected to an inspection circuit (not shown) of the tester via the connector 57b.

  The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b are each formed with a conductive path forming portion that forms a conductive path only in the thickness direction. As such anisotropically conductive sheets 55a and 55b, those in which the respective conductive path forming portions are formed so as to protrude in the thickness direction on at least one surface are preferable in terms of exhibiting high electrical contact stability.

In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, each of the upper support plate 56a and the lower support plate 56b is By moving in the direction approaching the circuit device 5, the circuit device 5 is pinched by the upper adapter device 1a and the lower adapter device 1b.
In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is electrically connected to the connection electrode 21 of the upper adapter device 1a via the conductive path forming portion 16 of the anisotropic conductive connector 10. The terminal electrode 22 of the upper adapter device 1a is electrically connected to the inspection electrode 52a of the inspection electrode device 51a via an anisotropic conductive sheet 55a. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 is electrically connected to the connection electrode 21 of the lower-side adapter device 1b via the conductive path forming portion 16 of the anisotropic conductive connector 10, and this lower portion The terminal electrode 22 of the side adapter device 1b is electrically connected to the inspection electrode 52b of the inspection electrode device 51b via the anisotropic conductive sheet 55b.

  In this way, the test electrodes 6 and 7 on both the upper and lower surfaces of the circuit device 5 are respectively connected to the test electrode 52a of the test electrode device 51a in the upper test head 50a and the test electrode device 51b in the lower test head 50b. By being electrically connected to each of the test electrodes 52b, a state of being electrically connected to the test circuit of the tester is achieved, and a required electrical test is performed in this state.

  According to the circuit board electrical inspection apparatus described above, since the upper-side adapter device 1a and the lower-side adapter device 1b are configured as shown in FIG. 19, the inspected electrodes 6 and 7 of the circuit device 5 have their pitches. Even if they are minute and densely arranged, the required electrical inspection can be reliably performed on the circuit device 5.

FIG. 24 is an explanatory diagram showing the configuration of a second example of the electrical inspection apparatus for circuit boards according to the present invention. This electrical inspection device is for performing an electrical resistance measurement test of each wiring pattern on a circuit device 5 such as a printed circuit board on which both electrodes 6 and 7 to be inspected are formed. The holder 2 for holding in the inspection execution area E is provided, and the holder 2 is provided with positioning pins 3 for arranging the circuit device 5 at an appropriate position in the inspection execution area E.
Above the inspection execution area E, an upper-side adapter device 1a and an upper-side inspection head 50a configured as shown in FIG. 21 are arranged in this order from the bottom, and further above the upper-side inspection head 50a, A side support plate 56a is disposed, and the upper side inspection head 50a is fixed to the support plate 56a by a column 54a. On the other hand, below the inspection execution area E, a lower-side adapter device 1b and a lower-side inspection head 50b configured as shown in FIG. 21 are arranged in this order from the top, and further below the lower-side inspection head 50b. The lower side support plate 56b is disposed, and the lower side inspection head 50b is fixed to the support plate 56b by a support column 54b.
The upper side inspection head 50a includes a plate-like inspection electrode device 51a and an anisotropic conductive sheet 55a having elasticity that is fixed and arranged on the lower surface of the inspection electrode device 51a. The inspection electrode device 51a has a plurality of pin-shaped inspection electrodes 52a arranged on the lower surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the upper-side adapter device 1a. The electric wire 53a is electrically connected to a connector 57a provided on the upper support plate 56a, and is further electrically connected to a tester inspection circuit (not shown) via the connector 57a.
The lower inspection head 50b is composed of a plate-shaped inspection electrode device 51b and an anisotropic conductive sheet 55b having elasticity and fixed to the upper surface of the inspection electrode device 51b. The inspection electrode device 51b has a plurality of pin-shaped inspection electrodes 52b arranged on the upper surface thereof at lattice point positions having the same pitch as the terminal electrodes 22 of the lower adapter device 1b. Each of these inspection electrodes 52b The electric wire 53b is electrically connected to a connector 57b provided on the lower support plate 56b, and is further electrically connected to an inspection circuit (not shown) of the tester via the connector 57b.
The anisotropic conductive sheets 55a and 55b in the upper side inspection head 50a and the lower side inspection head 50b have basically the same configuration as that of the electrical inspection apparatus of the first example.

In such an electrical inspection device for circuit boards, the circuit device 5 to be inspected is held in the inspection execution region E by the holder 2, and in this state, each of the upper support plate 56a and the lower support plate 56b is By moving in the direction approaching the circuit device 5, the circuit device 5 is pinched by the upper adapter device 1a and the lower adapter device 1b.
In this state, the electrode 6 to be inspected on the upper surface of the circuit device 5 is connected to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the upper-side adapter device 1a. The terminal electrode 22 of the upper adapter device 1a is electrically connected to the inspection electrode 52a of the inspection electrode device 51a via the anisotropic conductive sheet 55a. ing. On the other hand, the electrode 7 to be inspected on the lower surface of the circuit device 5 is connected to both the current supply electrode 21b and the voltage measurement electrode 21c in the connection electrode pair 21a of the lower adapter device 1b. The terminal electrode 22 of the lower-side adapter device 1b is electrically connected to the inspection electrode 52b of the inspection electrode device 51b via the anisotropic conductive sheet 55b.

  In this way, the test electrodes 6 and 7 on both the upper and lower surfaces of the circuit device 5 are respectively connected to the test electrode 52a of the test electrode device 51a in the upper test head 50a and the test electrode device 51b in the lower test head 50b. By being electrically connected to each of the test electrodes 52b, a state of being electrically connected to the test circuit of the tester is achieved, and a required electrical test is performed in this state. Specifically, a constant value of current is supplied between the current supply electrode 21b in the upper adapter device 1a and the current supply electrode 21b in the lower adapter device 1b, and in the upper adapter device 1a. One of the plurality of voltage measuring electrodes 21c is designated, and the designated one voltage measuring electrode 21c is connected to the inspected electrode 6 on the upper surface side electrically connected to the voltage measuring electrode 21c. The voltage between the voltage measuring electrode 21c in the lower-side adapter device 1b, which is electrically connected to the corresponding lower-surface-side inspected electrode 7, is measured, and based on the obtained voltage value, the designated The electrical resistance value of the wiring pattern formed between the upper electrode under test 6 electrically connected to one voltage measuring electrode 21c and the corresponding other electrode 7 under test is taken. It is. And the electrical resistance of all the wiring patterns is measured by sequentially changing the designated voltage measuring electrode 21c.

  According to the circuit board electrical inspection apparatus described above, since the upper-side adapter device 1a and the lower-side adapter device 1b are configured as shown in FIG. Even if they are minute and densely arranged, the required electrical inspection can be reliably performed on the circuit device 5.

In the present invention, the present invention is not limited to the above-described embodiment, and various modifications such as the following can be added.
(1) In the anisotropic conductive connector 10, it is not essential that the protruding portion is formed in the conductive path forming portion 16 in the elastic anisotropic conductive film 15, and the entire surface of the elastic anisotropic conductive film 15 is flat. It may be anything.
(2) In the adapter device, the anisotropic conductive connector 10 may be arranged so as to cover only the connection electrode region 25 of the adapter body 20.
(3) The circuit device to be inspected is not limited to a printed circuit board, but may be a semiconductor integrated circuit device such as a package IC or MCM, or a circuit device formed on a wafer.

(4) In the method for manufacturing the anisotropic conductive connector 10, the ferromagnetic part is arranged as a support for forming the conductive path forming part according to a pattern corresponding to the pattern of the conductive path forming part 16 to be formed. Things can be used. The structure of an example of such a support is shown in FIG. The support 30 has a metal film 31 having a releasable surface (upper surface in FIG. 25) on which a conductive elastomer material layer is formed, and a conductive path to be formed on the back surface of the metal film 31. The ferromagnetic portion 32 is arranged according to a pattern corresponding to the pattern of the forming portion 16, and the nonmagnetic portion 33 is arranged in the other region.
As a material forming the metal film 31, nickel, gold, copper, or the like can be used.
As a material constituting the ferromagnetic portion 32, nickel, cobalt, an alloy thereof, or the like can be used.
As a material constituting the nonmagnetic part 33, a photoresist can be used.
As shown in FIG. 26, such a support 30 is formed of a photoresist on a nonmagnetic part 33 having openings 33K formed on a metal film 31 in accordance with the pattern of the ferromagnetic part 32 to be formed. Thereafter, the surface of the portion exposed through the opening 33K of the nonmagnetic portion 33 in the metal film 31 can be manufactured by plating.

In such a support 30, the conductive path forming portion 16 is formed as follows. First, as shown in FIG. 27, the conductive elastomer material layer 16A is formed on the surface of the metal film 31 of the support 30, and the metal mask composite 18F is placed on the metal mask composite 18F on the conductive elastomer material layer 16A. Each of 18 is arranged in contact with the conductive elastomer material layer 16A. Next, a magnetic field is applied to the conductive elastomer material layer 16A through the metal mask 18 and the ferromagnetic portion 32 of the support 30 in the thickness direction of the conductive elastomer material layer 16A. In the portion of the elastomer material layer 16 </ b> A located between the metal mask 18 and the ferromagnetic portion 32 of the support 30, a magnetic field that is stronger than the other portions is formed. As a result, the conductive particles P dispersed in the conductive elastomer material layer 16A are located in a portion located between the metal mask 18 and the ferromagnetic portion 32 of the support 30 as shown in FIG. They are assembled and further aligned so as to be aligned in the thickness direction of the conductive elastomer material layer 16A. Then, while continuing the action of the magnetic field on the conductive elastomer material layer 16A, or after stopping the action of the magnetic field, the conductive elastomer material layer 16A is cured, as shown in FIG. A conductive elastomer layer 16 </ b> B is formed in a state in which the conductive particles P are contained in the polymer substance in an aligned state in the thickness direction so as to be supported on the support 30.
Thereafter, the metal foil 14 in the metal mask composite 18F disposed on the conductive elastomer layer 16B is removed by performing an etching process, thereby removing the metal mask 18 and the resist layer 19 as shown in FIG. Expose. Then, the conductive elastomer layer 16B and the resist layer 19 are subjected to laser processing with an ultraviolet laser through the metal mask 18, thereby removing a part of the resist layer 19 and the conductive elastomer layer 16B. As shown in FIG. 31, the plurality of conductive path forming portions 16 arranged according to a specific pattern are formed on the support 30.

  According to such a method using the support 30, a magnetic field having a higher strength can be applied to the portion where the metal mask 18 is disposed on the conductive elastomer material layer 16 </ b> A, than the other portions. In the obtained conductive elastomer layer 16B, the conductive particles P in the portion where the metal mask 18 is disposed become denser, and the conductive particles P in the other portions become more sparse. Therefore, even if the thickness of the conductive elastomer layer 16 is considerably large, it is possible to form the conductive path forming portion 16 of the desired form by laser processing the conductive elastomer layer 16B with an ultraviolet laser. it can.

(5) In the method for manufacturing the anisotropic conductive connector 10, as shown in FIG. 32, as the support 35 for forming the insulating portion, a member in which a metal film 37 is disposed on an elastic substrate 36 is used. it can.
As a material constituting the elastic substrate 36, an elastic polymer substance such as a cured rubber or a thermoplastic elastomer can be used.
As a material constituting the metal film 37, copper, gold, nickel, silver, iron, cobalt, an alloy thereof, or an alloy steel thereof can be used.
According to such a method using the support 35, the conductive path forming portion 16 is infiltrated into the insulating material layer 17A formed on the support 35, brought into contact with the support 35, and further pressurized. Then, the pressurized portion of the support 35 is deformed into a compressed state in the thickness direction, so that the conductive path forming portion 16 is in contact with the insulating portion material layer 17A before the insulating portion material layer 17A is cured. Thus, the anisotropic conductive connector 10 having the protruding portion can be reliably manufactured.

(6) In the formation of the conductive path forming portion 16, the conductive path forming portion may be formed by removing all of the conductive elastomer layer 16B other than the portion that becomes the conductive path forming portion by laser processing. However, as shown in FIGS. 33 and 34, the conductive path forming portion 16 can also be formed by removing only the peripheral portion of the conductive elastomer layer 16B that becomes the conductive path forming portion. In this case, the remaining part of the conductive elastomer layer 16 </ b> B can be removed by mechanically peeling from the support 13.

(7) As shown in FIG. 35, the anisotropically conductive connector 10 includes a frame plate 11 in which a single opening 12 is formed, and a single elastic member disposed so as to close the opening 12 of the frame plate 11. The structure which consists of the anisotropic conductive film 15 may be sufficient.
In addition, as shown in FIG. 36, the anisotropic conductive connector 10 includes a frame plate 11 having a plurality of openings 12 and a plurality of elastic plates each disposed so as to close one opening 12 of the frame plate 11. The structure which consists of the direction conductive film 15 may be sufficient.
Further, the anisotropic conductive connector 10 includes a frame plate in which a plurality of openings are formed, one or more elastic anisotropic conductive films arranged so as to close one opening of the frame plate, and a plurality of frame plates. The structure which consists of 1 or 2 or more elastic anisotropic conductive films arrange | positioned so that the opening of this may be plugged may be sufficient.

It is sectional drawing for description which shows the structure in the 1st example of the anisotropically conductive connector which concerns on this invention. It is sectional drawing for description which expands and shows the structure of the principal part of the anisotropically conductive connector shown in FIG. It is sectional drawing for description which shows the state in which the resist layer which has the some opening formed according to the specific pattern on the metal foil was formed. It is sectional drawing for description which shows the state in which the metal mask was formed in each opening of a resist layer, and the metal mask composite_body | complex was formed. It is sectional drawing for description which shows the state in which the conductive elastomer material layer was formed on the support body. It is sectional drawing for description which shows the state by which the metal mask composite body has been arrange | positioned on the surface of the material layer for conductive elastomers. It is sectional drawing for description which shows the state by which the magnetic field was acted on the thickness direction of the conductive elastomer material layer. It is sectional drawing for description which shows the state in which the conductive elastomer layer was formed on the support body. It is sectional drawing for description which shows the state from which the metal foil of the metal mask composite was removed. It is sectional drawing for description which shows the state in which the several conductive path formation part was formed according to the specific pattern on the support body. It is sectional drawing for description which shows the state by which the insulating part material layer was formed on the support body. It is sectional drawing for description which shows the state with which the support body in which the conductive path formation part was formed was overlaid on the support body in which the material layer for insulation parts was formed. It is sectional drawing for description which shows the state by which the insulating part was formed between the adjacent conductive path formation parts. It is sectional drawing for description which shows the structure in the 2nd example of the anisotropically conductive connector which concerns on this invention. It is sectional drawing for description which expands and shows the structure of the principal part of the anisotropically conductive connector shown in FIG. It is sectional drawing for description which shows the state by which the frame board was arrange | positioned on the support body and the insulating part material layer was formed. It is sectional drawing for description which shows the state with which the support body in which the conductive path formation part was formed was overlaid on the support body in which the material layer for insulation parts was formed. It is sectional drawing for description which shows the state by which the insulating part was formed between the adjacent conductive path formation parts. It is sectional drawing for description which shows the structure in the 1st example of the adapter apparatus which concerns on this invention. It is sectional drawing for description which shows the structure of the adapter main body in the adapter apparatus shown in FIG. It is sectional drawing for description which shows the structure in the 2nd example of the adapter apparatus which concerns on this invention. It is sectional drawing for description which shows the structure of the adapter main body in the adapter apparatus shown in FIG. It is explanatory drawing which shows the structure in the 1st example of the electrical inspection apparatus of the circuit apparatus which concerns on this invention. It is explanatory drawing which shows the structure in the 2nd example of the electrical inspection apparatus of the circuit apparatus which concerns on this invention. It is sectional drawing for description which shows the structure in the other example of the support body for conductive path formation part formation. It is sectional drawing for description which shows the state by which the non-magnetic-material part was formed on the metal film. It is sectional drawing for description which shows the state by which the metal mask composite body is arrange | positioned on the surface of the material layer for conductive elastomers formed on the support body shown in FIG. It is sectional drawing for description which shows the state by which the magnetic field was acted on the thickness direction of the conductive elastomer material layer. It is sectional drawing for description which shows the state in which the conductive elastomer layer was formed on the support body shown in FIG. It is sectional drawing for description which shows the state from which the metal foil of the metal mask composite was removed. It is sectional drawing for description which shows the state in which the several conductive path formation part was formed according to the specific pattern on the support body. It is sectional drawing for description which shows the structure in the other example of the support body for insulation parts formation. It is explanatory drawing which shows the state in which the conductive path formation part was formed by removing only the peripheral part of the part used as the conductive path formation part in a conductive elastomer layer. It is sectional drawing for description which shows the state in which the conductive path formation part was formed by removing only the peripheral part of the part used as the conductive path formation part in a conductive elastomer layer. It is explanatory drawing which shows the structure in the other example of the anisotropically conductive connector which concerns on this invention. It is explanatory drawing which shows the structure in the further another example of the anisotropically conductive connector which concerns on this invention. It is sectional drawing for description which shows the structure of the metal mold | die for shape | molding an anisotropically conductive elastomer sheet in the manufacturing method of the conventional anisotropically conductive connector. It is sectional drawing for description which shows the state by which the frame board was arrange | positioned in the metal mold | die shown in FIG. 37, and the material layer for anisotropic conductive elastomer was formed. It is sectional drawing for description which shows the state by which the conventional anisotropically conductive connector was manufactured. It is sectional drawing for description which shows the direction of the magnetic field which acts on the anisotropically conductive elastomer material layer in the manufacturing method of the conventional anisotropically conductive connector.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a Upper side adapter apparatus 1b Lower side adapter apparatus 2 Holder 3 Positioning pin 5 Circuit apparatus 6,7 Electrode to be inspected 10 Anisotropic conductive connector 11 Frame board 12 Opening 13 and 13A Support body 14 Metal foil 15 Elastic anisotropic conductive film 16 Conductive path forming portion 16A Conductive elastomer material layer 16B Conductive elastomer layer 17 Insulating portion 17A Insulating portion material layer 18 Metal mask 18F Metal mask composite 19 Resist layer 19K Opening 20 Adapter body 21, 21b, 21c Connecting electrode 21a Connection electrode pair 22 Terminal electrode 23 Internal wiring part 25 Connection electrode region 30 Support 31 Metal film 32 Ferromagnetic part 33 Nonmagnetic part 33K Opening 35 Support 36 Elastic substrate 37 Metal film 50a Upper side inspection head 50b Lower part Side inspection heads 51a, 51b Inspection electrode devices 52a, 5 2b Inspection electrodes 53a, 53b Electric wires 54a, 54b Struts 55a, 55b Anisotropic conductive sheet 56a Upper support plate 56b Lower support plates 57a, 57b Connector 80 One template 81 Substrate 82, 82a, 82b Ferromagnetic part 83 Nonmagnetic body portion 85 Other template 86 Substrate 87, 87a, 87b Ferromagnetic portion 88 Nonmagnetic portion 90 Frame plate 91 Opening 95 Anisotropically conductive elastomer sheet 95A Anisotropically conductive elastomer material layer 96 Conductive path formation Part 97 Insulation part

Claims (11)

Anisotropic conductivity having an elastic anisotropic conductive film in which a plurality of conductive path forming portions extending in the thickness direction are contained in a state where conductive particles exhibiting magnetism are aligned so as to be aligned in the thickness direction are insulated from each other by an insulating portion In the sex connector
An anisotropic conductive connector characterized in that an ultraviolet absorbing material is contained only in the conductive path forming portion. Anisotropic conductivity having an elastic anisotropic conductive film in which a plurality of conductive path forming portions extending in the thickness direction are contained in a state where conductive particles exhibiting magnetism are aligned so as to be aligned in the thickness direction are insulated from each other by an insulating portion In the sex connector
The conductive path forming portion contains an ultraviolet absorbing material,
The conductive path forming portion is obtained by laser processing a conductive elastomer layer containing an ultraviolet absorbing material and a large number of conductive particles oriented in the thickness direction in an elastic polymer material with an ultraviolet laser. An anisotropic conductive connector, characterized in that Anisotropic conductivity having an elastic anisotropic conductive film in which a plurality of conductive path forming portions extending in the thickness direction are contained in a state where conductive particles exhibiting magnetism are aligned so as to be aligned in the thickness direction are insulated from each other by an insulating portion In the sex connector
The conductive path forming portion contains an ultraviolet absorbing material,
The conductive path forming portion is obtained by laser processing a conductive elastomer layer containing an ultraviolet absorbing material and a large number of conductive particles oriented in the thickness direction in an elastic polymer material with an ultraviolet laser. Is,
The insulating part is obtained by forming and curing a material layer for an insulating part made of a polymer substance forming material that is cured and becomes an elastic polymer substance between the conductive path forming parts. An anisotropic conductive connector characterized by   The anisotropic conductive connector according to claim 2, wherein the ultraviolet absorbing material is a pigment.   5. The anisotropic conductive film according to claim 2, further comprising a frame plate having an opening, wherein the elastic anisotropic conductive film is formed so as to close the opening of the frame plate. 6. connector.   The conductive elastomer layer is a material layer for a conductive elastomer, wherein a liquid polymer substance forming material that is cured to become an elastic polymer substance contains a UV absorbing substance and conductive particles exhibiting magnetism on the support. And a metal mask showing magnetism according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed is disposed on the surface of the conductive elastomer material layer, and in this state, the conductive elastomer material The magnetic layer is obtained by applying a magnetic field in the thickness direction to the layer and curing the conductive elastomer material layer. Anisotropic conductive connector. Anisotropic structure comprising a plurality of conductive path forming portions extending in the thickness direction, which are contained in a state in which conductive particles exhibiting magnetism are aligned in the thickness direction, and are insulated from each other by an insulating portion. A method of manufacturing a conductive connector, comprising:
On the support, a material layer for a conductive elastomer is formed in which a liquid polymer substance forming material that is cured to become an elastic polymer substance contains an ultraviolet absorbing substance and conductive particles exhibiting magnetism,
A metal mask showing magnetism is arranged on the surface of the conductive elastomer material layer according to a specific pattern corresponding to the pattern of the conductive path forming portion to be formed. In addition, the conductive elastomer layer is formed by applying a magnetic field in the thickness direction and curing the material layer for the conductive elastomer.
A plurality of conductive path forming portions arranged in accordance with the specific pattern on the support by removing a portion other than the portion where the metal mask is arranged by laser processing the conductive elastomer layer with an ultraviolet laser. Forming an insulating portion by forming a material layer for an insulating portion made of a polymer material forming material which is cured and becomes an elastic polymer material between these conductive path forming portions and curing the layer. A method for manufacturing an anisotropically conductive connector, comprising:   A resist layer having openings formed in accordance with a specific pattern is formed on the metal foil, and the surface of the portion exposed from the openings of the resist layer in the metal foil is subjected to a plating treatment with a metal exhibiting magnetism, whereby the resist A metal mask composite in which a metal mask is formed in each of the openings of the layer is manufactured, and the metal mask composite is stacked on the surface of the conductive elastomer material layer to thereby form the conductive elastomer material layer. 8. The method of manufacturing an anisotropic conductive connector according to claim 7, wherein a metal mask exhibiting magnetism is disposed on a surface according to the specific pattern. An adapter body having a connection electrode region in which a plurality of connection electrodes are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface;
7. The device according to claim 1, further comprising: a plurality of conductive path forming portions formed on the connection electrode region of the adapter main body and formed according to a pattern corresponding to the connection electrode in the adapter main body. And an anisotropic conductive connector. An adapter body having a connection electrode region in which a plurality of connection electrode pairs each comprising two connection electrodes for current supply and voltage measurement are formed according to a pattern corresponding to an electrode to be inspected in a circuit device to be inspected on the surface When,
7. The device according to claim 1, further comprising: a plurality of conductive path forming portions formed on the connection electrode region of the adapter main body and formed according to a pattern corresponding to the connection electrode in the adapter main body. And an anisotropic conductive connector. An electrical inspection device for a circuit device, comprising the adapter device according to claim 9 or 10.

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