WO2005031820A1 - 投影露光装置及び投影露光装置の洗浄方法、メンテナンス方法並びにデバイスの製造方法 - Google Patents
投影露光装置及び投影露光装置の洗浄方法、メンテナンス方法並びにデバイスの製造方法 Download PDFInfo
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- WO2005031820A1 WO2005031820A1 PCT/JP2004/013906 JP2004013906W WO2005031820A1 WO 2005031820 A1 WO2005031820 A1 WO 2005031820A1 JP 2004013906 W JP2004013906 W JP 2004013906W WO 2005031820 A1 WO2005031820 A1 WO 2005031820A1
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- Prior art keywords
- liquid
- exposure apparatus
- projection exposure
- cleaning
- flow rate
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
Definitions
- Projection exposure apparatus cleaning method of projection exposure apparatus, maintenance method, and device manufacturing method
- the present invention relates to a method for transferring a mask pattern onto a photosensitive substrate in a lithographic process for manufacturing a device such as a semiconductor device, an imaging device (such as a CCD), a liquid crystal display device or a thin-film magnetic head.
- a device such as a semiconductor device, an imaging device (such as a CCD), a liquid crystal display device or a thin-film magnetic head.
- TECHNICAL FIELD The present invention relates to a projection exposure apparatus used for lithography, a cleaning method, a maintenance method, and a device manufacturing method for a liquid immersion type projection exposure apparatus. Background art
- each shot on a wafer (or a glass plate or the like) coated with a resist as a photosensitive substrate is projected via a projection optical system through an image of a reticle pattern as a mask.
- a projection exposure apparatus for transferring to an area is used.
- a step-and-repeat type reduction projection type exposure apparatus has been frequently used as a projection exposure apparatus.
- a step-and-scan method in which exposure is performed by synchronously scanning a reticle and a wafer. are also attracting attention.
- the resolution of the projection optical system provided in the projection exposure apparatus increases as the exposure wavelength used decreases and as the numerical aperture of the projection optical system increases. For this reason, with the miniaturization of integrated circuits, the exposure wavelength used in projection exposure apparatuses has been decreasing year by year, and the numerical aperture of projection optical systems has also increased. At present, the mainstream exposure wavelength is 248 nm of KrF excimer laser, but 193 nm of shorter wavelength ArF excimer laser is also in practical use.
- the depth of focus (DOF) is important as well as the resolution.
- the resolution R and the depth of focus ⁇ are respectively represented by the following equations.
- ⁇ is the exposure wavelength
- ⁇ is the numerical aperture of the projection optical system
- k and k are process coefficients.
- the focal depth is becoming narrower due to the shorter wavelength of the exposure light and the increase in the numerical aperture of the projection optical system.
- studies have been made on shorter exposure wavelengths, and if this is left as it is, the depth of focus may become too narrow, resulting in insufficient margin during exposure operation. There is.
- an immersion method has been proposed as a method for substantially shortening the exposure wavelength and widening the depth of focus.
- the space between the lower surface of the projection optical system and the wafer surface is filled with a liquid such as water or an organic solvent, and the wavelength of the exposure light in the liquid is The resolution is improved and the depth of focus is increased by using lZn times in air ( ⁇ is the refractive index of the liquid, which is usually about 1.2.1.6).
- ⁇ is the refractive index of the liquid, which is usually about 1.2.1.6.
- No. 303114, and WO 99-49504 pamphlet Disclosure of the invention
- an immersion type projection exposure apparatus impurities dissolved in a liquid are deposited and deposited on the tip of a projection optical system in contact with a pipe or a liquid due to long-term use, and the immersion type exposure apparatus is used. There is a possibility that the performance of the exposure apparatus may be deteriorated.
- fluorite (CaF) and barium fluoride (BaF) which can be used as lens materials at ultraviolet wavelengths, use pure water or aqueous solutions as liquids.
- the liquid used in the immersion type projection exposure apparatus includes minute solids such as calcium, magnesium, iron, nickel, and chromium, which are metal salts, and resin such as PTFE (polytetrafluoroethylene). May contain fine solids. These are also trace amounts of impurity components contained in the liquid itself, and constitute a flow path through which the liquid flows. It is also a component such as piping.
- minute solids such as calcium, magnesium, iron, nickel, and chromium, which are metal salts, and resin such as PTFE (polytetrafluoroethylene).
- PTFE polytetrafluoroethylene
- An object of the present invention is to prevent performance degradation of a projection exposure apparatus to which the immersion method is applied.
- a projection exposure apparatus illuminates a mask with an exposure beam, transfers the pattern of the mask onto a substrate via a projection optical system, and optically illuminates the surface of the substrate and the projection optical system on the substrate side.
- the scale is prevented by the scale adhesion preventing mechanism provided in the supply pipe for supplying a predetermined liquid between the surface of the substrate and the substrate-side optical element of the projection optical system. Can be prevented from adhering. Therefore, for example, it is possible to prevent the flow of the liquid from being deteriorated due to the accumulation of scale such as impurities dissolved in the predetermined liquid on the inner wall of the supply pipe, and to stably supply the liquid. .
- the projection exposure apparatus of the present invention is further characterized by further comprising the scale attachment prevention mechanism provided on the liquid recovery pipe.
- the liquid collecting pipe is also provided with the scale adhesion preventing mechanism, it is possible to accurately prevent the performance of the projection exposure apparatus from deteriorating due to the adhesion of the scale. The performance of the exposure apparatus can be stabilized.
- the projection exposure apparatus of the present invention is characterized in that the scale adhesion preventing mechanism prevents the scale from being attached based on an external magnetic field applied to the liquid supply pipe or the liquid recovery pipe.
- the scale adhesion preventing mechanism prevents the scale from being attached based on an external magnetic field applied to the liquid supply pipe or the liquid recovery pipe.
- the scale adhesion preventing mechanism prevents the scale from adhering based on an electric signal flowing through a coil wound around the liquid supply pipe or the liquid recovery pipe. It is characterized by the following.
- an electric excitation that is, an electric excitation, occurs when a predetermined liquid crosses a magnetic line generated by a magnetic field generated by passing an electric signal, that is, an electric current to a wire wound in a coil shape. Then, it is possible to prevent the adhesion of the scale by using the electronic excitation action.
- the projection exposure apparatus of the present invention is characterized in that the exposure beam is ArF laser light. According to the projection exposure apparatus of the present invention, high resolution can be obtained by using ArF laser light, and fine integrated circuit patterns can be appropriately exposed.
- the projection exposure apparatus of the present invention is characterized in that a base material of the optical element is fluorite. According to the projection exposure apparatus of the present invention, since fluorite is used as the base material of the optical element, a short-wavelength exposure beam, for example, an ArF laser beam can be surely transmitted.
- the projection exposure apparatus of the present invention supplies the liquid to an immersion type projection exposure apparatus that fills a gap between an optical component and an exposure target with a liquid to expose the exposure target. And a cleaning means for removing the deposits in the liquid flow path. According to the projection exposure apparatus of the present invention, it is possible to provide an excellent projection exposure apparatus capable of maintaining desired performance even when used for a long time.
- the projection exposure apparatus includes a supply flow rate grasping unit in which the cleaning means grasps the liquid supply flow rate per unit time, and a flow rate variation control unit for varying the liquid supply flow rate per unit time.
- a supply flow rate grasping unit in which the cleaning means grasps the liquid supply flow rate per unit time
- a flow rate variation control unit for varying the liquid supply flow rate per unit time.
- the projection exposure apparatus of the present invention includes a liquid discharge mechanism for discharging the partial force filled with the liquid, and the cleaning means includes a discharge flow rate for grasping a liquid discharge flow rate per unit time.
- the liquid supply mechanism and the liquid discharge mechanism are controlled so as to interlock and fluctuate.
- the liquid supply flow rate per unit time may be the liquid supply flow rate. It fluctuates with an amplitude of 0.1% or more with respect to the time average of the flow rate.
- the projection exposure apparatus of the present invention has a function of removing the deposit from the flow path by mixing one or more bubbles having a volume of 1 mL or less into the liquid.
- the projection exposure apparatus of the present invention is configured to operate the cleaning means in accordance with the time when the exposure is stopped so that the deposits can be removed from the inside of the flow path.
- the optical component may be a synthetic calcium fluoride single crystal.
- the outermost surface of the optical component can be coated with magnesium fluoride.
- pure water or an aqueous solution in which salts are dissolved can be used as the liquid.
- a cleaning method for a projection exposure apparatus is a cleaning method in a liquid immersion type projection exposure apparatus that exposes the exposure target object by filling a gap between an optical component and the exposure target object with a liquid.
- the liquid supply flow rate and the liquid discharge flow rate are varied to remove the deposits in the liquid flow path.
- the liquid supply amount per unit time is varied with an amplitude of 0.1% or more with respect to a time average value of the liquid supply flow rate. Deposits in the road can be removed.
- a cleaning method for a projection exposure apparatus is a cleaning method in a liquid immersion type projection exposure apparatus that fills a gap between an optical component and an object to be exposed with a liquid and exposes the object to be exposed.
- a liquid immersion type projection exposure apparatus that fills a gap between an optical component and an object to be exposed with a liquid and exposes the object to be exposed.
- one or more bubbles having a volume of 1 mL or less are mixed into the liquid to wash the inside of the flow path of the liquid.
- the projection exposure apparatus of the present invention is a projection exposure apparatus that fills a space between a first object and a second object with a predetermined liquid, and irradiates exposure light to an object to be exposed through the liquid.
- a liquid supply for supplying the liquid through the liquid supply pipe and collecting the liquid through the liquid recovery pipe. It is provided with a supply / discharge mechanism and an adhesion preventing mechanism for preventing adhesion of impurities to a member forming a liquid flow path.
- the projection exposure apparatus of the present invention it is possible to prevent impurities from being mixed into the liquid and prevent the flow of the liquid from being deteriorated, and to maintain the performance as an immersion type projection exposure apparatus.
- the projection exposure apparatus of the present invention is a liquid immersion type projection exposure apparatus that fills a space between a first object and a second object with a liquid and irradiates exposure light to an object to be exposed through the liquid. It has a liquid supply mechanism for supplying, a liquid discharge mechanism for discharging the liquid, and a cleaning mechanism for cleaning the liquid flow path. According to the projection exposure apparatus of the present invention, it is possible to prevent impurities from being mixed into the liquid and prevent the flow of the liquid from being deteriorated, and to maintain the performance of the immersion type projection exposure apparatus.
- the maintenance method for a projection exposure apparatus is a maintenance method for a liquid immersion type projection exposure apparatus that exposes an object to be exposed by filling a gap between a first member and a second member with a liquid. This is to clean the liquid flow path when the body object is not exposed.
- the flow path of a liquid is washed without affecting the exposure of an object to be exposed, thereby preventing impurities from being mixed into the liquid and the flow of the liquid from being deteriorated.
- the performance of the liquid immersion type projection exposure apparatus can be maintained.
- an excellent device having a good yield can be manufactured using the above-described projection exposure apparatus and the maintenance method.
- FIG. 1 is a diagram showing a schematic configuration of a projection exposure apparatus used in a first embodiment.
- FIG. 2 is a diagram showing a positional relationship between a distal end portion 4A of an optical element 4 of a projection optical system PL and a discharge nozzle and an inflow nozzle for the X direction, which are applied to the first embodiment.
- FIG. 3 shows a positional relationship between a distal end portion 4A of an optical element 4 of a projection optical system PL and a discharge nozzle and an inflow nozzle for supplying and recovering liquid in a Y-direction, which are used in the first embodiment.
- FIG. 4 is an enlarged view of a main part showing how liquid 7 is supplied and recovered between optical element 4 and wafer W according to the first embodiment.
- FIG. 5 is a front view showing a lower end portion of a projection optical system PLA of a projection exposure apparatus used in a second embodiment, a liquid supply device 5, a liquid recovery device 6, and the like.
- FIG. 6 is a diagram showing a positional relationship between a distal end portion 32A of an optical element 32 of a projection optical system PLA and a discharge nozzle and an inflow nozzle for the X direction, which are used in a second embodiment.
- FIG. 7 shows a positional relationship between a distal end portion 32A of an optical element 32 of a projection optical system PLA and a discharge nozzle and an inflow nozzle for supplying and recovering a liquid in a Y-direction, according to a second embodiment.
- FIG. 8 is a diagram showing a schematic configuration of a liquid immersion type projection exposure apparatus according to a third embodiment.
- FIG. 9 is a diagram showing a schematic configuration of a liquid immersion type projection exposure apparatus according to a fourth embodiment.
- FIG. 10 is an explanatory diagram of a fluctuation in a liquid supply flow rate exerted on a third embodiment.
- FIG. 11 is an explanatory diagram of a fluctuation in a liquid supply flow rate exerted on a third embodiment.
- FIG. 12 is an explanatory diagram of a fluctuation in a liquid supply flow rate exerted on a third embodiment.
- FIG. 13 is an explanatory diagram of a conventional liquid supply flow rate.
- FIG. 14 is a flowchart illustrating an example of a semiconductor device manufacturing process.
- FIG. 1 is a diagram showing a schematic configuration of a step-and-repeat type projection exposure apparatus that is focused on the first embodiment.
- the XYZ orthogonal coordinate system shown in FIG. 1 is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system.
- the XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the wafer W, and the Z axis is set in a direction orthogonal to the wafer W.
- the XY plane is actually set as a plane parallel to the horizontal plane, and the Z axis is set vertically upward.
- the projection exposure apparatus includes an ArF excimer laser light source as an exposure light source, and includes an optical integrator (homogenizer), a field stop, and a condenser lens.
- the illumination optical system 1 is provided.
- Light source power Exposure light (exposure beam) IL composed of ultraviolet pulse light having a wavelength of 193 nm passes through the illumination optical system 1 and illuminates a pattern provided on a reticle (mask) R.
- the light that has passed through the reticle R passes through a telecentric projection optical system PL on both sides (or on one side on the Ueno or W side), and onto the exposure area on the photoresist (wafer (substrate)) W coated with the photoresist, a predetermined projection magnification ⁇ ( For example, reduction projection exposure is performed at ⁇ ⁇ 4, 1Z5 or the like.
- the exposure light IL includes KrF excimer laser light (wavelength 248 nm) and F laser light (wavelength
- reticle R is held on reticle stage RST, and reticle stage RST incorporates a mechanism for finely moving reticle R in the X direction, the Y direction, and the rotation direction.
- the position of the reticle stage RST in the X direction, the Y direction, and the rotation direction is measured and controlled in real time by a reticle laser interferometer (not shown).
- the wafer W is fixed on the Z stage 9 via a wafer holder (not shown).
- the Z stage 9 is fixed on an XY stage 10 that moves along an XY plane substantially parallel to the image plane of the projection optical system PL, and focuses on the wafer W (position in the Z direction). And the tilt angle.
- the position of the Z stage 9 in the X direction, the Y direction, and the rotation direction is measured and controlled in real time by a wafer laser interferometer 13 using a movable mirror 12 located on the Z stage 9.
- the XY stage 10 is mounted on the base 11 and controls the X direction, the Y direction, and the rotation direction of the wafer W.
- the main control system 14 provided in the projection exposure apparatus adjusts the position of the reticle R in the X direction, the Y direction, and the rotational direction based on the measurement value measured by the reticle laser interferometer. Do. That is, the main control system 14 transmits a control signal to a mechanism incorporated in the reticle stage RST, and adjusts the position of the reticle R by slightly moving the reticle stage RST.
- the main control system 14 adjusts the surface on the wafer W to the image plane of the projection optical system PL by the auto-focus method and the auto-leveling method. And adjustment of the tilt angle. That is, the main control system 14 transmits a control signal to the wafer stage drive system 15 and drives the Z stage 9 by the wafer stage drive system 15 to adjust the focus position and the tilt angle of the wafer W. Furthermore, main control The system 14 adjusts the position of the wafer W in the X direction, the Y direction, and the rotation direction based on the measurement value measured by the wafer laser interferometer 13. That is, the main control system 14 transmits a control signal to the wafer stage drive system 15 and drives the XY stage 10 by the wafer stage drive system 15 to adjust the position of the wafer W in the X, Y, and rotation directions. Do
- the main control system 14 transmits a control signal to the wafer stage drive system 15, and drives the XY stage 10 by the wafer stage drive system 15, thereby controlling each shot area on the wafer W. Stepwise moving to the exposure position sequentially. That is, the operation of exposing the pattern image of the reticle R onto the wafer W by the step-and-repeat method is repeated.
- an immersion method is applied to substantially shorten the exposure wavelength and improve the resolution.
- an immersion type projection exposure apparatus to which the immersion method is applied, at least while the pattern image of the reticle R is being transferred onto the wafer W, the surface of the wafer W and the wafer W side of the projection optical system PL are used.
- a predetermined liquid 7 is filled between the optical element 4 and the tip surface (lower surface) of the optical element 4.
- the projection optical system PL includes a lens barrel 3 that houses a plurality of optical elements made of quartz or fluorite that constitute the projection optical system PL.
- the optical element 4 closest to the wafer W is formed of fluorite, and only the tip 4A of the optical element 4 on the wafer W side (see FIG. 2) comes into contact with the liquid 7. It is configured. This prevents corrosion of the lens barrel 3, which also has a metallic force, and the like.
- the base material of the optical element 4 is fluorite, and magnesium fluoride (MgF 2) is vacuum-deposited on the tip 4A of the optical element 4, that is, the portion that comes into contact with the liquid 7, as a dissolution preventing film.
- the film is formed.
- FIG. 2 is a diagram showing a positional relationship between the tip 4A and the wafer W of the optical element 4 of the projection optical system PL, and two pairs of discharge nozzles and inflow nozzles that sandwich the tip 4A in the X direction.
- FIG. 3 is a diagram showing the positional relationship between the tip 4A of the optical element 4 of the projection optical system PL and two pairs of discharge nozzles and inflow nozzles that sandwich the tip 4A in the Y direction.
- the projection exposure apparatus includes a liquid supply device 5 for controlling the supply of the liquid 7 and a liquid recovery device 6 for controlling the discharge of the liquid 7.
- the liquid supply device 5 includes a tank (not shown) for the liquid 7, a pressure pump (not shown), a temperature control device (not shown), and the like.
- the liquid supply device 5 is provided with a discharge nozzle 2 la having a narrow end on the + X direction side of the distal end 4A via a supply pipe 22 via a supply pipe 22 as shown in FIG.
- a discharge nozzle 22a having a thin tip on the X direction side of the tip 4A is connected.
- the supply pipe 21 is provided with a scale adhesion preventing mechanism 210 for preventing the scale, which is an impurity dissolved in the liquid 7, from adhering to the supply pipe 21, the nozzle 21a, and the like.
- the liquid supply device 5 is provided with a discharge nozzle 27a having a thin tip on the + Y direction side of the tip 4A via a supply pipe 27, and a feed nozzle 4a via the supply pipe 28.
- a discharge nozzle 28a having a thin tip is connected to the Y direction side of A.
- the supply pipe 27 is provided with a scale adhesion preventing mechanism 270 for preventing scale, which is an impurity dissolved in the liquid 7, from adhering to the supply pipe 27, the nozzle 27a, and the like.
- a scale adhesion preventing mechanism 280 is provided.
- the liquid supply device 5 adjusts the temperature of the liquid 7 by a temperature control device, and supplies at least one of the discharge nozzles 21a, 22a, 27a, and 28a to the supply pipes 21, 22, 27, and 28.
- the liquid 7 whose temperature has been adjusted is supplied onto the wafer W through at least one supply pipe.
- the temperature of the liquid 7 is set by a temperature control device to, for example, about the same as the temperature in the chamber in which the projection exposure apparatus according to the present embodiment is housed.
- the liquid supply device 5 of the exposure apparatus does not necessarily need to have all the tanks, pressure pumps, and temperature control devices. Such equipment may be used instead.
- the liquid recovery device 6 includes a tank (not shown) for the liquid 7, a suction pump (not shown), and the like.
- the liquid recovery device 6 has inflow nozzles 23a and 23b having a wide end on the X direction side of the front end 4A via the recovery pipe 24 via the recovery pipe 23.
- the inflow nozzles 24a and 24b having a wide end on the + X direction side of the end 4A are connected.
- the inflow nozzles 23a, 23b, 24a, and 24b are arranged so as to open in a fan shape with respect to an axis passing through the center of the distal end portion 4A and parallel to the X axis.
- the collection pipe 23 is provided with a scale adhesion preventing mechanism 230 for preventing scale, which is an impurity dissolved in the liquid 7, from adhering to the collection pipe 23, the nozzles 23a, 23b, and the like.
- the recovery tube 24 A mechanism 240 for preventing the attachment of a tool is provided.
- the liquid recovery device 6 is provided with inflow nozzles 29a and 29b having a distal end and extending in the Y direction side of the distal end 4A via a recovery pipe 30 through a recovery pipe 29.
- the inflow nozzles 30a and 30b having a wide tip on the + Y direction side of the tip 4A are connected by force.
- the flowers 29a, 29b, 30a, and 30bi are arranged in a fan-like shape with respect to an axis passing through the center of the tip 4A and parallel to the Y axis.
- the collection pipe 29 is provided with a scale adhesion preventing mechanism 290 for preventing scale, which is an impurity dissolved in the liquid 7, from adhering to the collection pipe 29, the nozzles 29a, 29b, and the like.
- the collection pipe 30 is also provided with a scale adhesion preventing mechanism 300.
- the liquid recovery device 6 is provided with at least one of the inflow nozzles 23a, 23b, 24a and 24b, 29a and 29b, 30a and 30b, at least one of the inflow nozzles 23, 24, 29, and 30.
- the liquid 7 is collected from above the wafer W through one collection pipe.
- the liquid recovery device 6 of the exposure apparatus may not necessarily include a tank and a suction pump, and at least one of the tanks and the suction pump may be replaced by equipment such as a factory where the exposure apparatus is installed.
- the liquid supply device 5 is connected to the tip 4A of the optical element 4 via the supply pipe 21 and the discharge nozzle 21a.
- the liquid 7 is supplied between the wafer 7 and the wafer W.
- Liquid recovery unit 6, the recovery pipe 23 and the inflow nozzles 23a, via 23b Ueno by W upper force liquid supply device 5 for recovering the liquid 7 is supplied between the distal end portion 4A and the wafer W.
- the liquid 7 flows on the wafer W in the direction of the arrow 25B (X direction), and the space between the ueno, W and the optical element 4 is stably filled with the liquid 7.
- the liquid supply device 5 connects the supply pipe 22 and the discharge nozzle 22a.
- the liquid 7 is supplied between the front end portion 4A of the optical element 4 and the wafer W via the optical element 4.
- the liquid recovery device 6 recovers the liquid 7 supplied between the distal end portion 4A and the fin / W by the liquid supply device 5 via the recovery pipe 24 and the inflow nozzles 24a and 24b.
- the liquid 7 flows on the wafer W in the direction of the arrow 26B (+ X direction), and the space between the wafer W and the optical element 4 is stably filled with the liquid 7.
- the liquid 7 is supplied and recovered from the ⁇ direction. That is, in FIG. 3, when the wafer W is step-moved in the direction of the arrow 31A (- ⁇ direction) indicated by the solid line, the liquid supply device 5 supplies the liquid 7 through the supply pipe 27 and the discharge nozzle 27a. I do.
- the liquid recovery device 6 recovers the liquid 7 supplied between the tip 4A and the wafer W by the liquid supply device 5 via the recovery pipe 29 and the inflow nozzles 29a and 29b. In this case, the liquid 7 flows in the direction of the arrow 31B (-Y direction) on the exposure area immediately below the tip 4A of the optical element 4.
- the liquid supply device 5 supplies the liquid 7 via the supply pipe 28 and the discharge nozzle 28a.
- the liquid recovery device 6 recovers the liquid 7 supplied between the distal end portion 4A and the ueno, W by the liquid supply device 5 via the recovery pipe 30 and the inflow nozzles 30a, 30b. In this case, the liquid 7 flows in the + Y direction on the exposure area immediately below the tip 4A of the optical element 4.
- a nozzle for supplying and recovering the liquid 7 in the X-direction or Y-direction but also a nozzle for supplying and recovering the liquid 7 in an oblique direction may be provided.
- FIG. 4 is a diagram showing a state in which the liquid 7 is supplied and collected between the optical element 4 and the wafer W which constitute the projection optical system PL.
- the liquid 7 supplied from the discharge nozzle 21a flows in the direction of arrow 25B (direction X). It is collected by the inflow nozzles 23a and 23b.
- the supply amount Vi (m 3 Zs) and the recovery amount Vo (m) of the liquid 7 are maintained in order to keep the amount of the liquid 7 filled between the optical element 4 and the wafer W constant. 3 Zs).
- the supply amount Vi and the recovery amount Vo of the liquid 7 are adjusted based on the moving speed V of the XY stage 10 (wafer W). That is, the supply amount Vi and the recovery amount Vo of the liquid 7 are calculated based on the equation (1).
- D is the diameter (m) of the tip 4A of the optical element 4 as shown in Fig. 1
- V is the moving speed of the XY stage 10 (mZs)
- d is the working distance (working, distance) of the projection optical system PL. (m).
- Speed V when stepping the XY stage 10 is set by the main control system 14. Since D and d are input in advance, the supply amount Vi and the recovery amount Vo of the liquid 7 are calculated and adjusted based on Equation 1, so that the liquid 7 is placed between the optical element 4 and the wafer W. Always filled.
- the working distance d of the projection optical system PL is as small as possible in order to allow the liquid 7 to be stably present between the optical element 4 and the wafer W.
- the working distance d of the projection optical system PL is set to about 2 mm.
- the scale which is an impurity dissolved in the liquid 7 may adhere to the inner walls of the supply pipe and the recovery pipe, thereby deteriorating the performance of the projection exposure apparatus.
- Impurities such as calcium dissolved in liquids such as water are positively charged! And therefore easily charged negatively and tend to be adsorbed on the inner walls of the supply pipe and the recovery pipe. Therefore, the amount of adsorption of the scale to the inner wall of the supply pipe or the recovery pipe increases with time, and if the scale adheres, the performance of the projection exposure apparatus decreases.
- the scale may accumulate (adhere) on the inner wall of the supply pipe or the recovery pipe, causing a poor flow of the liquid, or the scale may accumulate (adhere) on the nozzle that supplies and discharges the liquid, resulting in nozzle clogging. There is.
- the scale may accumulate (adhere) on the tip of the projection optical system in contact with the liquid, which may cause deterioration of the optical performance.
- the dissolved impurity force is used to neutralize or negatively charge the surface potential at the time of S-scale crystallization, thereby suppressing the crystallization of the scale and preventing the deposition by the repulsive force of the electric charge.
- the scale component is ion-sequestered by the hydration energy of water molecules polarized by the electron excitation effect generated when a magnetic field is applied to the liquid from the outside, and the surface potential is made neutral or negative.
- the scale can be prevented from adhering to the supply pipe and the recovery pipe.
- an N-pole magnet is disposed at a position in contact with the outer wall surface of the supply pipe 21, and an S-pole is disposed at a position facing the N-pole magnet with the supply pipe 21 interposed therebetween.
- Lines of magnetic force act on the supply pipe 21 due to the magnetic field generated between the two poles. Therefore, when a fluid with electrical conductivity crosses the magnetic field between the two poles at a certain speed at a right angle, an electronic excitation action occurs and energy is generated.
- the generated energy can neutralize or negatively charge the surface potential when the scale is crystallized, thereby preventing the scale from adhering to the supply pipe 21 or the like.
- the scale adhesion prevention mechanisms 220, 270, and 280, and the collection pipes 23, 24, 29, and 30 are located on the supply pipes 22, 27, and 28, respectively.
- 230, 240, 290, and 300 also have the same configuration as the scale adhesion preventing mechanism 210, and the magnetic lines of force also act on the scale adhesion preventing mechanisms 220, 270, 280, 230, 240, 290, and 300 using magnets. By doing so, adhesion of scale is prevented.
- a scale adhesion preventing mechanism is provided in each of the supply pipes for supplying the liquid.
- the scale component dissolved in the water can be neutrally or negatively charged to prevent the scale from adhering to the inner wall of the supply pipe or the nozzle. Therefore, it is possible to prevent the scale from adhering to the inner walls of the supply pipe and the recovery pipe, thereby preventing the flow of the liquid from deteriorating, and preventing the nozzle for supplying or discharging the liquid from clogging the nozzle with the scale. Since the optical characteristics can be prevented from deteriorating due to the scale adhering to the tip of the projection optical system, the performance of the projection exposure apparatus can be stably maintained.
- the supply pipe for supplying the liquid between the tip of the projection optical system and the substrate and the recovery pipe for collecting the liquid are each provided with a mechanism for preventing scale adhesion, the liquid is dissolved in the liquid. Adhesion and deposition of the scale, which is an impurity, on the supply pipe, the tip of the projection optical system, each nozzle, and the collection pipe are prevented. Therefore, it is not necessary to stop the operation of the apparatus to replace a component that has become defective due to scale deposition, or the frequency of component replacement due to scale deposition can be reduced. The performance as an exposure apparatus can be stably maintained.
- the refractive index n of pure water with respect to exposure light having a wavelength of about 200 nm is about 1.44, and the ArF excimer laser light having a wavelength of 193 nm is reduced to lZn, ie, 134 nm, on the wafer W. Therefore, a high resolution can be obtained. Furthermore, since the depth of focus is expanded to about n times, that is, about 1.44 times as compared with that in the air, if it is sufficient to secure the same depth of focus as that used in the air, the projection optical system PL To increase the numerical aperture of the Therefore, the resolution can be further improved.
- the wafer is provided with two pairs of discharge nozzles and inflow nozzles that are inverted in the X direction and the Y direction. Even when moving in the X direction, the + Y direction or the Y direction, the space between the wafer and the optical element can be stably filled with the liquid.
- the liquid flows on the wafer, even if foreign matter is attached to the wafer, the foreign matter can be washed away by the liquid. Further, since the liquid is adjusted to a predetermined temperature by the liquid supply device, the temperature of the wafer surface is also constant, and it is possible to prevent a reduction in overlay accuracy due to thermal expansion of the wafer during exposure. Therefore, EG
- the liquid flows in the same direction as the direction in which the wafer is moved.
- the liquid can be collected by the liquid collecting device without staying on the exposure area immediately below the tip of the liquid.
- FIG. 5 is a front view showing a lower portion of a projection optical system PLA of a step-and-scan type projection exposure apparatus, a liquid supply device 5, a liquid recovery device 6, and the like, which are used in the second embodiment.
- the XYZ orthogonal coordinate system shown in FIG. 5 is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system.
- the XYZ orthogonal coordinate system is set so that the X axis and the Y axis are parallel to the wafer W, and the Z axis is set to a direction orthogonal to the wafer W.
- the XY plane is actually set as a plane parallel to the horizontal plane, and the Z axis is set vertically upward.
- FIG. 5 the same components as those of the projection exposure apparatus according to the first embodiment will be described with the same reference numerals used in the first embodiment.
- the lowermost optical element 32 of the lens barrel 3A of the projection optical system PLA has a distal end portion 32A in the Y direction (non-scanning direction) except for a portion necessary for scanning exposure. Fine It is cut into a long rectangle.
- a pattern image of a portion of the reticle is projected onto a rectangular exposure area immediately below the tip 32A, and the reticle (not shown) is moved in the ⁇ X direction (or + X direction) with respect to the projection optical system PLA.
- the wafer W moves in the + X direction (or X direction) at a speed ⁇ ⁇ ⁇ ( ⁇ is a projection magnification) via the XY stage 10. Then, after the exposure of one shot area is completed, the next shot area is moved to the scanning start position by the stepping of the wafer W, and the exposure of each shot area is sequentially performed by the step-and-scan method.
- the base material of the optical element 32 is fluorite, and magnesium fluoride (MgF) is formed on the tip 32 ⁇ of the optical element 32 as an anti-dissolution film formed by a vacuum deposition method.
- MgF magnesium fluoride
- the liquid 7 is placed between the optical element 32 and the surface of the wafer W during the scanning exposure. It is filled. As the liquid 7, pure water is used. The supply and recovery of the liquid 7 are performed by the liquid supply device 5 and the liquid recovery device 6, respectively.
- FIG. 6 is a diagram showing the positional relationship between the tip 32A of the optical element 32 of the projection optical system PLA and the discharge nozzle and the inflow nozzle for supplying and recovering the liquid 7 in the X direction.
- the liquid supply device 5 has three discharge nozzles 21a-21c on the + X direction side of a rectangular end portion 32A elongated in the Y direction through the supply tube 21. Three discharge nozzles 22a-22c are connected to the X direction side of the part 32A.
- the liquid recovery device 6 has two inflow nozzles 23a and 23b on the X-direction side of the distal end portion 32A through the recovery pipe 23, and the distal end portion 32A through the force recovery pipe 24. Two inflow nozzles 24a, 24b are connected to the + X direction side S force.
- the liquid supply device 5 When scanning exposure is performed by moving the wafer W in the scanning direction (1X direction) indicated by the solid arrow, the liquid supply device 5 is optically connected to the liquid supply device 21 through the supply pipe 21 and the discharge nozzles 21a-21c.
- the liquid 7 is supplied between the tip 32A of the element 32 and the wafer W.
- the liquid recovery device 6 recovers the liquid 7 supplied between the front end portion 32A and the wafer W by the liquid supply device 5 via the recovery pipe 23 and the inflow nozzles 23a and 23b. In this case, the liquid 7 flows on the wafer W in the X direction, and the space between the optical element 32 and the wafer W is filled with the liquid 7.
- scanning exposure is performed by moving the wafer W in the direction (+ X direction) indicated by the two-dot chain line arrow.
- the liquid supply device 5 supplies the liquid 7 between the front end 32A of the optical element 32 and the wafer W via the supply pipe 22 and the discharge nozzles 22a to 22c.
- the liquid recovery device 6 recovers the liquid 7 supplied between the distal end portion 32A and the heads W by the liquid supply device 5 via the recovery pipe 24 and the inflow nozzles 24a and 24b.
- the liquid 7 flows on the wafer W in the + X direction, and the space between the optical element 32 and the wafer W is filled with the liquid 7.
- DSY is the length (m) of the distal end portion 32A of the optical element 32 in the X direction. Since the DSY is input in advance, the supply amount Vi (m 3 Zs) and the recovery amount Vo (m 3 Zs) of the liquid 7 are calculated and adjusted based on Equation 2 so that the optical element can be adjusted even during scanning exposure. Liquid 7 is stably filled between 32 and wafer W.
- the same structure as that of the scale adhesion preventing mechanism provided in the supply pipe and the recovery pipe according to the first embodiment is used.
- the scale adhesion preventing mechanism having the configuration the adhesion of the scale to the inner walls of the supply pipe and the collection pipe and the nozzle for supplying and discharging the liquid is prevented by the same method as in the first embodiment. That is, as shown in FIG. 6, in the scale adhesion preventing mechanisms 210 and 220 provided in the supply pipes 21 and 22, magnetic lines of force act on the respective supply pipes to neutralize or negatively charge the scale component. The scale is prevented from adhering to the supply pipe. Similarly, in the scale adhesion preventing mechanisms 230 and 240 provided in the collection pipes 23 and 24, adhesion of scale to the respective collection pipes and the like is prevented.
- the supply and recovery of the liquid 7 in the Y direction is performed by the same method as in the first embodiment.
- FIG. 7 is a diagram showing a positional relationship between the distal end portion 32A of the optical element 32 of the projection optical system PLA and the discharge nozzle and the inflow nozzle for the Y direction.
- the wafer W In the non-scanning direction (one Y direction) that is perpendicular to the direction, the liquid 7 is supplied and recovered using the discharge nozzles 27a and the inflow nozzles 29a and 29b arranged in the Y direction.
- the supply and recovery of the liquid 7 are performed using the discharge nozzles 28a and the inflow nozzles 30a and 30b arranged in the Y direction.
- the supply amount Vi (m 3 Zs) and the recovery amount Vo (m 3 Zs) of the liquid 7 are calculated by the following Expression 3.
- DSX is the length (m) of the tip 32A of the optical element 32 in the Y direction.
- the liquid is supplied between the optical element 32 and the wafer W by adjusting the supply amount of the liquid 7 in accordance with the moving speed V of the wafer W when performing the step movement in the Y direction. Keeps 7 satisfied.
- the same structure as that of the scale adhesion preventing mechanism provided in the supply pipe and the recovery pipe according to the first embodiment is used.
- the scale adhesion preventing mechanism having the configuration the adhesion of the scale to the inner walls of the supply pipe and the collection pipe and the nozzle for supplying and discharging the liquid is prevented by the same method as in the first embodiment. That is, a scale adhesion preventing mechanism provided in the supply pipe through which the liquid 7 supplied through the nozzle 27a shown in FIG. 7 flows, and a scale adhesion mechanism provided in the supply pipe through which the liquid 7 supplied through the nozzle 28a flows.
- lines of magnetic force are applied to the supply tube by a magnetic field generated using a magnet, and the scale component is neutrally or negatively charged to prevent the scale from adhering to the supply tube.
- a scale adhesion preventing mechanism provided in the collection pipe through which the liquid 7 collected through the nozzles 29a and 29b flows, and a collection pipe provided with the liquid 7 through which the liquid 7 collected through the nozzles 30a and 30b flow
- magnetic lines of force are applied to the supply pipes by the magnetic field generated using magnets to prevent the scale from adhering to each collection pipe.
- the scale dissolving in the liquid is achieved by the scale adhesion preventing mechanisms provided in the supply pipe and the recovery pipe, respectively. Because the components are neutrally or negatively charged, the inner wall of the supply pipe and recovery pipe And adhesion of scale to the nozzle for supplying and discharging the liquid. Therefore, the flow of the liquid in the supply pipe or the recovery pipe is always kept constant by the adhesion of the scale, and the space between the optical element and the wafer can be stably filled with the liquid.
- the refractive index n of pure water with respect to exposure light having a wavelength of about 200 nm is about 1.44, and the ArF excimer laser light having a wavelength of 193 nm is reduced to lZn, ie, 134 nm, on the wafer W. Therefore, a high resolution can be obtained. Furthermore, since the depth of focus is expanded to about n times, that is, about 1.44 times as compared with that in the air, if it is sufficient to secure the same depth of focus as that used in the air, the projection optical system PL The numerical aperture of the lens can be further increased!], So that the resolution can be further improved.
- the wafer W Even when the wafer W moves in the X direction, the X direction, the + Y direction, or the Y direction, the space between the wafer W and the optical element 32 can be stably filled with the liquid 7. That is, by flowing the liquid in a direction corresponding to the moving direction of the wafer W, the space between the wafer W and the tip of the projection optical system PL can be continuously filled with the liquid 7.
- the liquid 7 flows on the wafer W, even if foreign matter adheres to the wafer W, the foreign matter can be washed away by the liquid 7.
- the liquid 7 is adjusted to a predetermined temperature by the liquid supply device 5, the temperature of the surface of the wafer W is also constant, and it is possible to prevent a decrease in overlay accuracy due to thermal expansion of the wafer W occurring during exposure. it can. Therefore, even when there is a time difference between the alignment and the exposure as in the EGA (enhanced 'global' alignment) type alignment, it is possible to prevent a decrease in overlay accuracy due to thermal expansion of the wafer.
- the liquid 7 since the liquid 7 flows in the same direction as the direction in which the wafer W is moved, the liquid Can be recovered by the liquid recovery device 6 without staying in the exposure area immediately below the tip 32A of the optical element 32.
- a magnetic field generated by using a magnet causes a magnetic field line to act on the supply pipe or the recovery pipe.
- Force preventing scale adhesion The magnetic field generated by applying a current to the coil wound around the supply pipe may cause magnetic lines of force to act on the supply pipe or the recovery pipe to prevent scale adhesion.
- a coil is wound around the outer wall of a supply pipe, and a weak current modulated by a change in magnetism is caused to flow through the coil wound around the supply pipe to generate a magnetic field, and the magnetic field causes lines of magnetic force to act on the supply pipe. .
- the liquid flows through the supply pipe where the lines of magnetic force are acting to generate energy based on the electronic excitation action, and the generated energy charges the scale component negatively. Therefore, based on the lines of magnetic force applied to the supply tube by the magnetic field generated by the current flowing through the coil, the scale component is dissolved in the liquid flowing through the supply tube and negatively charged. To prevent the scale from adhering to the supply pipe.
- a scale adhesion preventing mechanism is provided for each of the supply pipe and the recovery pipe.
- a scale adhesion prevention mechanism is provided only for the supply pipe. Is also good. That is, when the liquid is supplied, the scale component dissolved in the liquid is neutrally or negatively charged, so that the scale is formed on the inner walls of the supply pipe and the recovery pipe and the nozzle for supplying and discharging the liquid. You may try to prevent it from sticking.
- a scale adhesion preventing mechanism may be provided only in the collection tube. The scale adhesion preventing mechanism may be provided at a plurality of locations in each supply pipe or recovery pipe.
- a nozzle may be further provided near each nozzle to prevent nozzle clogging and to more effectively prevent scale from adhering to an optical element on the wafer side of the projection optical system.
- the scale adhesion preventing mechanism may be supported by another member in the vicinity of the supply pipe or the recovery pipe which does not need to be directly attached to the supply pipe or the recovery pipe.
- the scale is not changed.
- the adhesion preventing mechanism it is possible to suppress such impurities such as eluted substances and foreign substances from adhering to the discharge nozzle and the recovery nozzle.
- the action of the scale adhesion preventing mechanism causes the impurities such as elutes and foreign substances. Can be prevented from accumulating (adhering) on the inner wall of the recovery pipe.
- the space between the surface of the wafer and the optical element formed of fluorite on the wafer side of the projection optical system is filled with the liquid.
- Liquid may be interposed between the surface of the wafer and the optical element formed by the fluorite on the wafer side of the projection optical system.
- the optical path space on the exit side of the optical elements 4 and 32 of the projection optical system is configured to be filled with liquid (pure water).
- the optical path space on the entrance side of the optical elements 4 and 32 of the projection optical system may be filled with liquid (pure water).
- an anti-adhesion mechanism that prevents adhesion of impurities to members (such as a supply pipe and a recovery pipe) that form a liquid flow path for the optical path space on the incident side of the optical elements 4 and 32 of the projection optical system is also provided. Can be mounted.
- the force liquid using pure water as the liquid 7 is not limited to pure water. It is also possible to use a projection optical system that is higher than the height of the projection optical system or a photoresist that is applied to the wafer surface (eg, cedar oil).
- a projection optical system that is higher than the height of the projection optical system or a photoresist that is applied to the wafer surface (eg, cedar oil).
- the number and shape of the nozzles are not particularly limited.
- two pairs of nozzles may supply or recover the liquid 7 on the long side of the tip 32A.
- the discharge nozzle and the inflow nozzle are arranged vertically. Good.
- the liquid can transmit the F laser light.
- a fluorinated liquid such as fluorinated oil or perfluorinated polyether (PFPE) may be used.
- PFPE perfluorinated polyether
- an exposure apparatus that locally fills the space between the projection optical system PL and the wafer (substrate) W with a liquid is used.
- the present invention is also applicable to an immersion exposure apparatus in which a liquid bath having a predetermined depth is formed on a stage and a substrate is held therein.
- the above-described first and second embodiments it is possible to prevent impurities from adhering to the members forming the liquid flow path such as the supply pipe and the recovery pipe, so that the liquid Supply and recovery can be performed stably.
- the amount of impurities in the liquid through which the exposure light passes is reduced, and the adhesion of impurities to the optical elements 4 and 32 at the end of the projection optical system is prevented.
- FIG. 8 is a diagram illustrating a schematic configuration of a liquid immersion type projection exposure apparatus according to a third embodiment.
- the liquid immersion type projection exposure apparatus 100 includes an optical component 113, a projection optical system 114, a stage 115, an illumination optical system (not shown), a light source (not shown), and a liquid supply mechanism. 111, a liquid supply channel ll la, a liquid discharge mechanism 112, and a liquid discharge channel 112a.
- a bubble removal filter may be provided at the tip 11 lb of the liquid supply channel 11 la.
- an ArF (excimer) laser is used as a light source, and an optical component 113 made of a lens using synthetic quartz glass and a synthetic calcium fluoride single crystal as a member is used.
- an optical component 113 made of a lens using synthetic quartz glass and a synthetic calcium fluoride single crystal as a member is used. This is because the lens closest to the silicon wafer 116 has a high fluence of an ArF (excimer) laser, and synthetic silica glass has a refractive index increase called compaction. This phenomenon does not occur! Is used as a member.
- the light source is a KrF excimer laser or F laser.
- an explanation will be given using an aqueous solution in which salts are dissolved as a liquid.
- the outermost surface of the lens (optical component 113) in contact with the aqueous solution in which the salt is dissolved is coated with magnesium fluoride which has good durability against the aqueous solution in which the salt is dissolved. Note that pure water containing no salts or the like can be used as the liquid.
- the immersion type projection exposure apparatus 100 includes a supply flow grasping section 12 la and a discharge flow grasping section 12 lb for grasping a liquid supply flow rate and a liquid discharge flow rate per unit time, respectively, and a liquid per unit time.
- a flow rate variation control unit 122 for varying the supply flow rate and the liquid discharge flow rate per unit time is provided.
- Supply flow grasping section 12 la and discharge flow grasping section 1 Reference numerals 21b each include a liquid flow meter and are connected to a mass flow meter described later.
- the liquid supply mechanism 111 for supplying the liquid 117 and the liquid discharge mechanism 112 for discharging the partial force liquid 117 filled with the liquid 117 include a flow rate fluctuation control unit 122
- the gap between the optical component 113 and the silicon wafer 116 is controlled to be always filled with a fixed amount of the liquid 117.
- the gap between the optical component 113 and the silicon wafer 116 need not always be filled with a fixed amount of the liquid 117. The point is that the optical path force of the laser light (exposure light) with the light source power does not cause leakage, and if it is filled with the liquid 117, the amount of the liquid 117 in the gap between the optical component 113 and the silicon wafer 116 changes. Well! / ,.
- the laser beam emitted from the light source projects a mask pattern from the illumination optical system via a mask, and then passes through a projection optical system 114 including an optical component 113 to an exposure target, such as a silicon wafer 116, which is set on a stage 115.
- the exposure is reduced. Exposure is performed while the space between the optical component 113 and the silicon wafer 116 is filled with the liquid 117. Since the liquid 117 has a higher refractive index than the atmosphere, exposure with high resolution can be performed.
- exposure is repeatedly performed on one silicon wafer 116, and the reduced pattern of the same mask is exposed on the silicon wafer 116 a plurality of times. That is, when a certain exposure is completed, the stage 115 is driven, and is moved to a predetermined position on the silicon wafer 116 for the next exposure, and the exposure is performed.
- the cleaning of the liquid flow path is performed by changing the liquid supply flow rate with time. By performing such washing, substances that cause solids such as salts dissolved in the liquid are removed, and the solids are prevented from adhering to the wall surface in the flow channel.
- the flow rate fluctuation control unit 122 controls the value and timing of pressurization for changing the liquid supply flow rate. That is, the flow rate fluctuation control unit 122 transmits a pressurization signal corresponding to the liquid supply flow rate to be increased to the liquid supply mechanism 111 at a predetermined time. Pressurization signal from flow rate fluctuation control unit 122
- the liquid supply mechanism 111 that has received the pressure supplies the liquid by pressurization, and performs intermittent supply using an electromagnetic switching valve. Such a process makes it possible to increase the liquid supply flow rate by a desired amount.
- a mass flow meter and a mass flow controller are connected to the liquid supply mechanism 111 with high accuracy and good responsiveness.
- This mass flow meter detects a current that changes following a minute temperature change caused by a fluctuation of the liquid flow meter with high sensitivity, and grasps the liquid flow rate as an electric signal. The obtained electric signals are transmitted to the mass flow controller one by one.
- This mass flow controller has a piezo valve that can be adjusted at high speed.
- the flow rate fluctuation control unit 122 controls the value and timing of pressure reduction for changing the liquid discharge flow rate. That is, the flow rate fluctuation control unit 122 transmits a pressure reduction signal corresponding to the liquid discharge flow rate to be increased to the liquid discharge mechanism 112 at a predetermined time.
- the liquid discharge mechanism 112 that has received the pressure reduction signal from the flow rate fluctuation control unit 122 discharges the liquid by reducing the pressure, and performs intermittent discharge using an electromagnetic switching valve. By such a process, the liquid discharge flow rate can be increased by a desired amount.
- the liquid discharge mechanism 112 is connected to a mass flow meter and a mass flow controller with high accuracy and high responsiveness.
- This mass flow meter detects a current that changes following a minute temperature change caused by a fluctuation of the liquid flow meter with high sensitivity, and grasps the liquid flow rate as an electric signal. The obtained electric signals are transmitted to the mass flow controller one by one.
- This mass flow controller has a piezo valve that can be adjusted at high speed.
- V, ru V, ru.
- the operation of the flow rate variation control unit 122 when the liquid supply flow rate varies over time will be described in detail.
- the temporal fluctuations in the amount of liquid to be discharged are usually delayed or fluctuated with respect to the temporal fluctuations in the liquid supply flow rate. It involves a change in the pattern itself.
- the amount fluctuation control unit 122 controls the liquid discharge mechanism 112 in consideration of the time delay and the change of the fluctuation pattern itself with respect to the time fluctuation of the liquid supply flow rate. Maintain the balance between the supply flow rate and the discharge flow rate.
- the flow rate fluctuation control unit 122 controls the liquid supply mechanism and the liquid discharge mechanism so as to fluctuate the liquid supply flow rate per unit time and the liquid discharge flow rate per unit time in conjunction.
- the liquid surface shape of the liquid 117 in the gap between the optical component 113 and the silicon wafer 116 can be kept constant. That is, the fluctuation of the liquid amount in the gap between the optical component 113 and the silicon wafer 116 can be suppressed, and the leakage of the liquid can be prevented.
- the flow rate variation control unit 122 includes a CPU and a memory that store these variation patterns.
- FIG. 10 is an explanatory diagram of the fluctuation of the liquid supply flow rate according to the third embodiment.
- the liquid supply flow rate per unit time fluctuated with an amplitude of 0.1% or more with respect to the time average value of the liquid supply flow rate in the pattern shown in Fig. 10.
- the fluctuation period is assumed to be 0.2 hectares.
- the liquid supply flow rate is changed in a supply flow rate fluctuation pattern as shown by a solid line in FIG. 10, for example.
- the liquid supply flow rate per unit time was approximately constant as shown in FIG. 13.
- the liquid is supplied with a fluctuation of 0.1% or more.
- sufficient washing it is desirable that the fluctuation is 0.1% or more.
- the period of the fluctuation is not particularly limited, but it is difficult to perform precise flow control in a period of less than 0.1 second. Therefore, it is preferable to change the period in a period of 0.1 second or more.
- the fluctuation pattern of the discharge flow rate is taken into consideration as shown by the dashed line in Fig. 10 so that the supply flow rate and the discharge flow rate per cycle are equal, taking into account the time delay At and the fluctuation pattern of the supply flow rate. Discharge in the discharge flow fluctuation pattern.
- the cleaning may be performed using the supply flow rate and discharge flow rate variation patterns shown in Figs.
- the liquid supply amount was fluctuated by 0.1%, and the fluctuation period was set to 0.5 seconds.
- the liquid discharge flow rate is also varied, the liquid discharge channel 112a can be washed at the same time.
- the fluctuation pattern of the discharge flow rate is taken into consideration by taking into account the time delay At and the fluctuation pattern of the supply flow rate so that the supply flow rate per cycle and the discharge flow rate are equal, as indicated by the broken lines in FIGS. 11 and 12. The discharge is performed according to the discharge flow fluctuation pattern shown in the figure.
- the liquid supply mechanism 111 and the liquid discharge mechanism 112 are linked via the flow rate fluctuation control unit 122, the liquid surface shape of the liquid 117 can be maintained even if the amount of supplied liquid fluctuates over time. Is kept almost constant. Therefore, the liquid does not spill due to the fluctuation of the liquid flow rate. In addition, it becomes possible to perform the exposure process while performing cleaning.
- a cleaning schedule may be programmed in advance in the flow rate fluctuation control unit 122 including a CPU and a memory.
- the cleaning function may be performed at a predetermined time before the start of exposure on one silicon wafer 116 or at a predetermined time after the end of the entire exposure.
- FIG. 9 is a diagram showing a schematic configuration of an immersion projection exposure apparatus 101 according to the fourth embodiment.
- FIG. 9 shows a projection exposure apparatus according to the third embodiment.
- the same configurations as those described in the third embodiment are denoted by the same reference numerals as those used in the third embodiment.
- the fourth embodiment of the present invention provides a configuration in which bubbles are injected into a supply liquid and supplied. By doing so, the liquid flow path on the supply side is cleaned.
- the liquid supply mechanism 111 for supplying the liquid is provided with a bubble injection mechanism 120.
- the pressure of gas such as nitrogen, argon, air, etc. is adjusted to a gauge pressure lOkPa which is moderately higher than atmospheric pressure by a pressure valve.
- the gas is sealed by an electromagnetic opening / closing valve, and is injected into the liquid through this valve through a thin needle-like hollow tube.
- Other configurations and operations are the same as those of the projection exposure apparatus according to the third embodiment, and a description thereof will be omitted.
- one lmL nitrogen bubble was injected at the timing when the exposure of silicon wafer 116 was stopped. Perform 7 such injections for every 10,000 L of liquid supply.
- the solid matter since the substance that causes the solid matter is removed from the liquid supply channel 11la, the solid matter may be mixed into the liquid and damage the surface of the optical component 113 of the projection optical system. Is also prevented. Therefore, inconveniences such as a decrease in the amount of exposure light due to physical damage to the surface of the optical component 113 can be prevented. It is considered that the liquid flow rate of the liquid into which bubbles are injected fluctuates locally due to the density difference between the gas and the liquid. For this reason, an effect of removing a substance that prevents solid matter from adhering to the wall surface in the flow path is exhibited.
- the gas for generating bubbles may be an inert gas such as nitrogen or argon, or air.
- a bubble size of less than 1 mL is sufficient.
- the frequency of injection of such bubbles is about once in 10,000 L of liquid.
- the number of bubbles in one injection is better, but the effect is effective even with one.
- the substance that causes the solid matter is removed, and the solid matter is prevented from adhering to the wall surface in the flow path, so that physical damage to the lens surface can be prevented.
- bubbles may scatter the exposure light, so that injection of bubbles is avoided, and exposure is performed. It is advisable to inject bubbles at such occasions.
- the stage drive schedule during exposure The cleaning schedule may be programmed in advance in the flow rate fluctuation control unit 122 composed of a CPU and a memory.
- a cleaning may be performed by attaching a bubble removal filter to the tip 11 lb of the liquid supply channel 11 la.
- a bubble removal filter may be used.
- the flow rate fluctuation control unit 122 takes the effect into account. Needless to say, setting the fluctuation pattern of the discharge flow rate.
- a large number of fine air bubbles may be injected into the liquid, and the flow path of the liquid may be cleaned by publishing.
- the liquid supply flow path 11 la is cleaned. However, if bubbles injected from the liquid supply flow path 11 la flow into the liquid discharge flow path 112 a, the liquid supply flow path 11 la is cleaned.
- the body discharge channel 112a can be cleaned, and the force near the tip (liquid contact portion) of the liquid discharge channel 112a is injected into the liquid discharge channel 112a to clean the liquid discharge channel 112a. You may do so.
- the exposure operation is stopped at an appropriate maintenance time. Since the flow channel is cleaned, it is possible to maintain the cleanness of the liquid flow channel and to stably supply and discharge (collect) the liquid. Therefore comes in contact with liquid Since the frequency of replacement and maintenance of members (parts) can be reduced, the immersion type exposure apparatus can maintain a high operation rate.
- the adhering matter is removed from the flow path. It is also possible to prevent the surface of the optical component 113 of the projection optical system from being damaged by being mixed therein. Therefore, inconveniences such as a decrease in the amount of exposure light due to physical damage to the surface of the optical component 113 can be prevented.
- the synthetic calcium fluoride single crystal is used as the optical component.
- the synthetic calcium fluoride single crystal has high durability against laser light having a high energy density. Cleaning can be performed by a liquid immersion type projection exposure apparatus using a material suitable as an optical component located at the tip of the projection optical system.
- the flow path may be cleaned using a liquid different from the liquid used for exposure.
- the exposure apparatus that locally fills the space between the optical component 113 and the silicon wafer 116 with a liquid is adopted.
- An immersion-type projection exposure apparatus that moves a stage holding a substrate to be exposed as described in a liquid tank, and a predetermined depth on a stage as disclosed in Japanese Patent Application Laid-Open No. 10-303114.
- the present invention is also applicable to a liquid immersion type projection exposure apparatus in which a liquid tank is formed and a substrate is held therein.
- the optical path space on the exit side of the optical component 113 of the projection optical system is configured to be filled with liquid (pure water).
- the optical path space on the incident side of the optical component 113 of the projection optical system may also be filled with liquid (pure water) as disclosed in US Pat.
- the present invention also discloses a method of separately mounting substrates to be processed such as wafers as disclosed in JP-A-10-163099, JP-A-10-214783, and JP-T-2000-505958.
- the present invention can also be applied to a twin-stage type exposure device equipped with two stages that can move independently in the X and Y directions.
- the optical member (4, 113) at the end of the projection optical system may be a lens or a parallel flat plate having no refractive power.
- the base material of the optical member (4, 32, 113) at the end of the projection optical system is not limited to fluorite, but may be formed of other materials such as quartz.
- the projection optical system may be a refraction type optical system including no reflection optical element, or a reflection type optical system including no refraction optical element. Or a catadioptric optical system including a reflective optical element and a refractive optical element.
- a microdevice such as a semiconductor device has a step 201 for designing the function and performance of the microdevice, a step 202 for manufacturing a mask (reticle) based on the design step, and a substrate for the device.
- Step 203 of manufacturing a certain substrate (Ueno) an exposure process of exposing the substrate to a mask pattern by the exposure apparatus of the above-described embodiment. It is manufactured through a step 204, a device assembling step (including a dicing step, a bonding step, and a packaging step) 205, an inspection step 206, and the like.
- the projection exposure apparatus, the cleaning method for the projection exposure apparatus, the maintenance method for the projection exposure apparatus, and the device manufacturing method according to the present invention include a high-performance semiconductor device, an imaging device, a liquid crystal display device, a thin film magnetic head, Suitable for use in device manufacturing.
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Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
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JP2005514207A JP4438747B2 (ja) | 2003-09-26 | 2004-09-24 | 投影露光装置及び投影露光装置の洗浄方法、メンテナンス方法並びにデバイスの製造方法 |
KR1020127017911A KR101301804B1 (ko) | 2003-09-26 | 2004-09-24 | 투영노광장치 및 투영노광장치의 세정방법, 메인터넌스 방법 그리고 디바이스의 제조방법 |
KR1020117021426A KR101238134B1 (ko) | 2003-09-26 | 2004-09-24 | 투영노광장치 및 투영노광장치의 세정방법, 메인터넌스 방법 그리고 디바이스의 제조방법 |
EP04788065.3A EP1667211B1 (en) | 2003-09-26 | 2004-09-24 | Projection exposure apparatus, cleaning and maintenance methods for a projection exposure apparatus, and method of producing a device |
KR1020067005687A KR101248325B1 (ko) | 2003-09-26 | 2004-09-24 | 투영노광장치 및 투영노광장치의 세정방법, 메인터넌스방법 그리고 디바이스의 제조방법 |
US11/386,777 US8035797B2 (en) | 2003-09-26 | 2006-03-23 | Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method |
US13/064,362 US8724076B2 (en) | 2003-09-26 | 2011-03-21 | Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method |
Applications Claiming Priority (4)
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JP2003-335691 | 2003-06-26 | ||
JP2003335691 | 2003-09-26 | ||
JP2003-339625 | 2003-09-30 | ||
JP2003339625 | 2003-09-30 |
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US11/386,777 Continuation US8035797B2 (en) | 2003-09-26 | 2006-03-23 | Projection exposure apparatus, cleaning and maintenance methods of a projection exposure apparatus, and device manufacturing method |
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WO2005031820A1 true WO2005031820A1 (ja) | 2005-04-07 |
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PCT/JP2004/013906 WO2005031820A1 (ja) | 2003-09-26 | 2004-09-24 | 投影露光装置及び投影露光装置の洗浄方法、メンテナンス方法並びにデバイスの製造方法 |
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US (2) | US8035797B2 (ja) |
EP (2) | EP3007207B1 (ja) |
JP (1) | JP4438747B2 (ja) |
KR (3) | KR101301804B1 (ja) |
HK (1) | HK1219567A1 (ja) |
WO (1) | WO2005031820A1 (ja) |
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WO2006137410A1 (ja) * | 2005-06-21 | 2006-12-28 | Nikon Corporation | 露光装置及び露光方法、メンテナンス方法、並びにデバイス製造方法 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06124874A (ja) * | 1992-01-30 | 1994-05-06 | Sony Corp | パターン形成方法及びパターン形成用投影露光装置 |
JPH06168866A (ja) * | 1992-11-27 | 1994-06-14 | Canon Inc | 液浸式投影露光装置 |
WO1999049504A1 (fr) * | 1998-03-26 | 1999-09-30 | Nikon Corporation | Procede et systeme d'exposition par projection |
Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4346164A (en) * | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
US4509852A (en) * | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
JPS57153433A (en) * | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
JPS58202448A (ja) | 1982-05-21 | 1983-11-25 | Hitachi Ltd | 露光装置 |
JPS5919912A (ja) | 1982-07-26 | 1984-02-01 | Hitachi Ltd | 液浸距離保持装置 |
DD221563A1 (de) | 1983-09-14 | 1985-04-24 | Mikroelektronik Zt Forsch Tech | Immersionsobjektiv fuer die schrittweise projektionsabbildung einer maskenstruktur |
DD224448A1 (de) | 1984-03-01 | 1985-07-03 | Zeiss Jena Veb Carl | Einrichtung zur fotolithografischen strukturuebertragung |
JPS6265326A (ja) | 1985-09-18 | 1987-03-24 | Hitachi Ltd | 露光装置 |
JPS63157419A (ja) | 1986-12-22 | 1988-06-30 | Toshiba Corp | 微細パタ−ン転写装置 |
US5237865A (en) * | 1987-08-17 | 1993-08-24 | Kabushiki Kaisha Toshiba | Flow rate measuring apparatus |
JPH04305915A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
JPH04305917A (ja) | 1991-04-02 | 1992-10-28 | Nikon Corp | 密着型露光装置 |
JPH0562877A (ja) | 1991-09-02 | 1993-03-12 | Yasuko Shinohara | 光によるlsi製造縮小投影露光装置の光学系 |
JPH06124873A (ja) | 1992-10-09 | 1994-05-06 | Canon Inc | 液浸式投影露光装置 |
JPH07220990A (ja) | 1994-01-28 | 1995-08-18 | Hitachi Ltd | パターン形成方法及びその露光装置 |
JPH08316125A (ja) | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
JPH08316124A (ja) * | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
US5825043A (en) * | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
JP4029183B2 (ja) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
IL130137A (en) * | 1996-11-28 | 2003-07-06 | Nikon Corp | Exposure apparatus and an exposure method |
JP4029182B2 (ja) | 1996-11-28 | 2008-01-09 | 株式会社ニコン | 露光方法 |
KR100512450B1 (ko) * | 1996-12-24 | 2006-01-27 | 에이에스엠엘 네델란즈 비.브이. | 두개의물체홀더를가진이차원적으로안정화된위치설정장치와이런위치설정장치를구비한리소그래픽장치 |
JP3747566B2 (ja) | 1997-04-23 | 2006-02-22 | 株式会社ニコン | 液浸型露光装置 |
JP3817836B2 (ja) | 1997-06-10 | 2006-09-06 | 株式会社ニコン | 露光装置及びその製造方法並びに露光方法及びデバイス製造方法 |
JPH11176727A (ja) | 1997-12-11 | 1999-07-02 | Nikon Corp | 投影露光装置 |
US6063267A (en) * | 1998-07-16 | 2000-05-16 | Clearwater Systems, Llc | Apparatus for treating flowing liquid with electromagnetic flux |
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JP2000124179A (ja) * | 1998-10-16 | 2000-04-28 | Dainippon Screen Mfg Co Ltd | 基板処理方法 |
US6571057B2 (en) | 2000-03-27 | 2003-05-27 | Nikon Corporation | Optical instrument, gas replacement method and cleaning method of optical instrument, exposure apparatus, exposure method and manufacturing method for devices |
US7018481B2 (en) * | 2002-01-28 | 2006-03-28 | Kabushiki Kaisha Toshiba | Substrate treating method, substrate-processing apparatus, developing method, method of manufacturing a semiconductor device, and method of cleaning a developing solution nozzle |
AU2003256081A1 (en) | 2002-08-23 | 2004-03-11 | Nikon Corporation | Projection optical system and method for photolithography and exposure apparatus and method using same |
US6788477B2 (en) * | 2002-10-22 | 2004-09-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus for method for immersion lithography |
CN101382738B (zh) * | 2002-11-12 | 2011-01-12 | Asml荷兰有限公司 | 光刻投射装置 |
KR20110104084A (ko) * | 2003-04-09 | 2011-09-21 | 가부시키가이샤 니콘 | 액침 리소그래피 유체 제어 시스템 |
WO2004093130A2 (en) * | 2003-04-11 | 2004-10-28 | Nikon Corporation | Cleanup method for optics in immersion lithography |
TWI424470B (zh) * | 2003-05-23 | 2014-01-21 | 尼康股份有限公司 | A method of manufacturing an exposure apparatus and an element |
EP1486827B1 (en) * | 2003-06-11 | 2011-11-02 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
DE602004024782D1 (de) * | 2003-06-19 | 2010-02-04 | Nippon Kogaku Kk | Belichtungseinrichtung und bauelementeherstellungsverfahren |
WO2005031820A1 (ja) | 2003-09-26 | 2005-04-07 | Nikon Corporation | 投影露光装置及び投影露光装置の洗浄方法、メンテナンス方法並びにデバイスの製造方法 |
US7050146B2 (en) * | 2004-02-09 | 2006-05-23 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
-
2004
- 2004-09-24 WO PCT/JP2004/013906 patent/WO2005031820A1/ja active Application Filing
- 2004-09-24 JP JP2005514207A patent/JP4438747B2/ja not_active Expired - Fee Related
- 2004-09-24 EP EP15178029.3A patent/EP3007207B1/en not_active Expired - Lifetime
- 2004-09-24 EP EP04788065.3A patent/EP1667211B1/en not_active Expired - Lifetime
- 2004-09-24 KR KR1020127017911A patent/KR101301804B1/ko not_active Expired - Fee Related
- 2004-09-24 KR KR1020067005687A patent/KR101248325B1/ko not_active Expired - Fee Related
- 2004-09-24 KR KR1020117021426A patent/KR101238134B1/ko not_active Expired - Fee Related
-
2006
- 2006-03-23 US US11/386,777 patent/US8035797B2/en not_active Expired - Fee Related
-
2011
- 2011-03-21 US US13/064,362 patent/US8724076B2/en not_active Expired - Fee Related
-
2016
- 2016-06-28 HK HK16107480.4A patent/HK1219567A1/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06124874A (ja) * | 1992-01-30 | 1994-05-06 | Sony Corp | パターン形成方法及びパターン形成用投影露光装置 |
JPH06168866A (ja) * | 1992-11-27 | 1994-06-14 | Canon Inc | 液浸式投影露光装置 |
WO1999049504A1 (fr) * | 1998-03-26 | 1999-09-30 | Nikon Corporation | Procede et systeme d'exposition par projection |
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Also Published As
Publication number | Publication date |
---|---|
US8035797B2 (en) | 2011-10-11 |
JPWO2005031820A1 (ja) | 2007-11-15 |
KR101238134B1 (ko) | 2013-02-28 |
EP3007207B1 (en) | 2017-03-08 |
JP4438747B2 (ja) | 2010-03-24 |
EP1667211B1 (en) | 2015-09-09 |
KR101301804B1 (ko) | 2013-08-29 |
KR20110120942A (ko) | 2011-11-04 |
US8724076B2 (en) | 2014-05-13 |
KR20120087192A (ko) | 2012-08-06 |
KR101248325B1 (ko) | 2013-03-27 |
US20060232757A1 (en) | 2006-10-19 |
EP1667211A1 (en) | 2006-06-07 |
EP1667211A4 (en) | 2008-10-15 |
EP3007207A3 (en) | 2016-06-08 |
HK1219567A1 (zh) | 2017-04-07 |
KR20060088880A (ko) | 2006-08-07 |
US20110170080A1 (en) | 2011-07-14 |
EP3007207A2 (en) | 2016-04-13 |
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