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WO2005015315A3 - Mikrolithographische projektionsbelichtungsanlage sowie verfahren zum einbringen einer immersionsflüssigkeit in einem immersionsraum - Google Patents

Mikrolithographische projektionsbelichtungsanlage sowie verfahren zum einbringen einer immersionsflüssigkeit in einem immersionsraum Download PDF

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Publication number
WO2005015315A3
WO2005015315A3 PCT/EP2004/007456 EP2004007456W WO2005015315A3 WO 2005015315 A3 WO2005015315 A3 WO 2005015315A3 EP 2004007456 W EP2004007456 W EP 2004007456W WO 2005015315 A3 WO2005015315 A3 WO 2005015315A3
Authority
WO
WIPO (PCT)
Prior art keywords
immersion
introducing
projection objective
exposure system
light
Prior art date
Application number
PCT/EP2004/007456
Other languages
English (en)
French (fr)
Other versions
WO2005015315A2 (de
Inventor
Bernhard Gellrich
Gerd Reisinger
Dieter Schmerek
Jens Kugler
Original Assignee
Zeiss Carl Smt Ag
Bernhard Gellrich
Gerd Reisinger
Dieter Schmerek
Jens Kugler
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeiss Carl Smt Ag, Bernhard Gellrich, Gerd Reisinger, Dieter Schmerek, Jens Kugler filed Critical Zeiss Carl Smt Ag
Priority to US10/565,612 priority Critical patent/US20070132969A1/en
Priority to JP2006520714A priority patent/JP2006528835A/ja
Publication of WO2005015315A2 publication Critical patent/WO2005015315A2/de
Publication of WO2005015315A3 publication Critical patent/WO2005015315A3/de

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Microscoopes, Condenser (AREA)

Abstract

Eine Projektionsbelichtungsanlage für die Mikrolithographie umfaßt eine Beleuchtungseinrichtung zur Erzeugung von Projektionslicht und ein Projektionsobjektiv mit mehreren optischen Elementen wie z.B. Linsen (L5), mit dem ein in einer Objektebene des Projektionsobjektivs anordenbares Retikel auf eine in einer Bildebene des Projektionsobjektivs anordenbare und auf einem Träger (30) aufgebrachte lichtempfindliche Oberfläche (26) abbildbar ist. Ferner ist eine Immersionseinrichtung zum Einbringen einer Immersionsflüssigkeit (34) in einen Immersionsraum (50) zwischen einem bildseitig letzten optischen Element (L5) des Projektionsobjektivs und der lichtempfindlichen Oberfläche (26) vorgesehen. Die Immersionseinrichtung weist Mittel (44; 66) auf, durch die das Auftreten von die Abbildungsqualität beeinträchtigenden Gasblasen (48) in der Immersionsflüssigkeit (34) verhindert werden kann und/oder bereits aufgetretene Gasblasen (48) entfernt werden können. Bei diesen Mitteln kann es sich z.B. um eine Ultraschallquelle (66) oder einen Entgaser (44) handeln.
PCT/EP2004/007456 2003-07-24 2004-07-08 Mikrolithographische projektionsbelichtungsanlage sowie verfahren zum einbringen einer immersionsflüssigkeit in einem immersionsraum WO2005015315A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/565,612 US20070132969A1 (en) 2003-07-24 2004-07-08 Microlithographic projection exposure apparatus and method for introducing an immersion liquid into an immersion space
JP2006520714A JP2006528835A (ja) 2003-07-24 2004-07-08 マイクロリソグラフィ投影露光装置および浸漬液体を浸漬空間へ導入する方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10333644 2003-07-24
DE10333644.3 2003-07-24

Publications (2)

Publication Number Publication Date
WO2005015315A2 WO2005015315A2 (de) 2005-02-17
WO2005015315A3 true WO2005015315A3 (de) 2005-09-09

Family

ID=34129463

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/007456 WO2005015315A2 (de) 2003-07-24 2004-07-08 Mikrolithographische projektionsbelichtungsanlage sowie verfahren zum einbringen einer immersionsflüssigkeit in einem immersionsraum

Country Status (3)

Country Link
US (1) US20070132969A1 (de)
JP (1) JP2006528835A (de)
WO (1) WO2005015315A2 (de)

Cited By (9)

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USRE42741E1 (en) 2003-06-27 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8629971B2 (en) 2003-08-29 2014-01-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8860923B2 (en) 2003-10-28 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8934082B2 (en) 2004-10-18 2015-01-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8958051B2 (en) 2005-02-28 2015-02-17 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US9013672B2 (en) 2007-05-04 2015-04-21 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US9134623B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9507270B2 (en) 2004-06-16 2016-11-29 Asml Netherlands B.V. Vacuum system for immersion photolithography

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US6867844B2 (en) 2003-06-19 2005-03-15 Asml Holding N.V. Immersion photolithography system and method using microchannel nozzles
US6809794B1 (en) 2003-06-27 2004-10-26 Asml Holding N.V. Immersion photolithography system and method using inverted wafer-projection optics interface
JP2005136374A (ja) * 2003-10-06 2005-05-26 Matsushita Electric Ind Co Ltd 半導体製造装置及びそれを用いたパターン形成方法
EP2267536B1 (de) * 2003-10-28 2017-04-19 ASML Netherlands B.V. Lithographischer Apparat
EP1531362A3 (de) * 2003-11-13 2007-07-25 Matsushita Electric Industrial Co., Ltd. Vorrichtung zur Herstellung von Halbleitern und Methode zur Bildung von Mustern
EP2490248A3 (de) * 2004-04-19 2018-01-03 Nikon Corporation Belichtungsvorrichtung und Vorrichtungsherstellungsverfahren
US20090225286A1 (en) * 2004-06-21 2009-09-10 Nikon Corporation Exposure apparatus, method for cleaning member thereof , maintenance method for exposure apparatus, maintenance device, and method for producing device
US7414699B2 (en) * 2004-11-12 2008-08-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7378025B2 (en) * 2005-02-22 2008-05-27 Asml Netherlands B.V. Fluid filtration method, fluid filtered thereby, lithographic apparatus and device manufacturing method
US20060232753A1 (en) 2005-04-19 2006-10-19 Asml Holding N.V. Liquid immersion lithography system with tilted liquid flow
US7262422B2 (en) * 2005-07-01 2007-08-28 Spansion Llc Use of supercritical fluid to dry wafer and clean lens in immersion lithography
KR101449055B1 (ko) * 2005-08-23 2014-10-08 가부시키가이샤 니콘 노광 장치, 노광 방법, 및 디바이스 제조 방법
US20070058263A1 (en) * 2005-09-13 2007-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and methods for immersion lithography
NL1030447C2 (nl) * 2005-11-16 2007-05-21 Taiwan Semiconductor Mfg Inrichting en werkwijze voor megasonische immersielithografie belichting.
US7633073B2 (en) 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7773195B2 (en) 2005-11-29 2010-08-10 Asml Holding N.V. System and method to increase surface tension and contact angle in immersion lithography
JP6456238B2 (ja) 2015-05-14 2019-01-23 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN107991384B (zh) * 2017-12-21 2023-10-13 浙江启尔机电技术有限公司 一种微管内气液两相流流型的检测装置及方法
DE102020206695A1 (de) * 2020-05-28 2021-04-15 Carl Zeiss Smt Gmbh Vorrichtung und Verfahren zur Reduktion von Vibrationen bedingt durch Gasblasen im Temperierfluid in mikrolithographischen Projektionsbelichtungsanlagen
CN112684674B (zh) * 2020-12-29 2024-08-06 浙江启尔机电技术有限公司 浸液供给回收系统以及浸没流场初始建立方法

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EP1489461A1 (de) * 2003-06-11 2004-12-22 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung

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JPS63157419A (ja) * 1986-12-22 1988-06-30 Toshiba Corp 微細パタ−ン転写装置
EP0605103A1 (de) * 1992-11-27 1994-07-06 Canon Kabushiki Kaisha Projektionsvorrichtung zur Tauchbelichtung
US6191429B1 (en) * 1996-10-07 2001-02-20 Nikon Precision Inc. Projection exposure apparatus and method with workpiece area detection
EP1489461A1 (de) * 2003-06-11 2004-12-22 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE42741E1 (en) 2003-06-27 2011-09-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8629971B2 (en) 2003-08-29 2014-01-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9581914B2 (en) 2003-08-29 2017-02-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8953144B2 (en) 2003-08-29 2015-02-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9025127B2 (en) 2003-08-29 2015-05-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8860923B2 (en) 2003-10-28 2014-10-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482962B2 (en) 2003-10-28 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9134622B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9134623B2 (en) 2003-11-14 2015-09-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9507270B2 (en) 2004-06-16 2016-11-29 Asml Netherlands B.V. Vacuum system for immersion photolithography
US8934082B2 (en) 2004-10-18 2015-01-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9436097B2 (en) 2004-10-18 2016-09-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US8958051B2 (en) 2005-02-28 2015-02-17 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method and apparatus for de-gassing a liquid
US9013672B2 (en) 2007-05-04 2015-04-21 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method
US8947629B2 (en) 2007-05-04 2015-02-03 Asml Netherlands B.V. Cleaning device, a lithographic apparatus and a lithographic apparatus cleaning method

Also Published As

Publication number Publication date
WO2005015315A2 (de) 2005-02-17
JP2006528835A (ja) 2006-12-21
US20070132969A1 (en) 2007-06-14

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