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WO2003054869A1 - Substrate treatment device - Google Patents

Substrate treatment device Download PDF

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Publication number
WO2003054869A1
WO2003054869A1 PCT/EP2002/014387 EP0214387W WO03054869A1 WO 2003054869 A1 WO2003054869 A1 WO 2003054869A1 EP 0214387 W EP0214387 W EP 0214387W WO 03054869 A1 WO03054869 A1 WO 03054869A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrates
cooling
transport
carrier
transport device
Prior art date
Application number
PCT/EP2002/014387
Other languages
German (de)
French (fr)
Inventor
Timo Hartfelder
Frank Michels
Original Assignee
Steag Hamtech Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Hamtech Ag filed Critical Steag Hamtech Ag
Publication of WO2003054869A1 publication Critical patent/WO2003054869A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G15/00—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
    • B65G15/10—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration comprising two or more co-operating endless surfaces with parallel longitudinal axes, or a multiplicity of parallel elements, e.g. ropes defining an endless surface
    • B65G15/12—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration comprising two or more co-operating endless surfaces with parallel longitudinal axes, or a multiplicity of parallel elements, e.g. ropes defining an endless surface with two or more endless belts
    • B65G15/14—Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration comprising two or more co-operating endless surfaces with parallel longitudinal axes, or a multiplicity of parallel elements, e.g. ropes defining an endless surface with two or more endless belts the load being conveyed between the belts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0235—Containers
    • B65G2201/0258—Trays, totes or bins
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor

Definitions

  • the present invention relates to an apparatus and a method for treating, in particular for cooling and / or drying, substrates with a transport device in which the substrates are stacked one above the other and can be transported vertically.
  • the substrates used for this are subjected to various process steps.
  • the substrates for example a DVD, leave the injection molding machine in which they are manufactured at a relatively high temperature, which cannot be accepted for the subsequent further treatment processes.
  • high temperatures of the substrates are not permitted for subsequent treatment processes or process steps, for example for the optical measurement of the substrates. Therefore, cooling processes are required between the process steps or the individual treatment processes, which are carried out with appropriate cooling devices.
  • the substrates from which a DVD is made are glued to one another by UV radiation, the substrate, here the glued partial disks, heating up.
  • the substrate is measured optically, but may only have a temperature of at most 30 ° C. It may therefore be necessary to insert a cooling step between the two process steps. This is usually carried out using specially designed cooling devices.
  • Another example of a process step in the production of CDs and DVDs relates to the coating of the substrates.
  • the varnish applied to the substrates in a first process step must be effectively dried in a subsequent process step.
  • specially developed Drying devices are used, which let heated air sweep over the substrates.
  • Cooling and drying devices are often implemented as dynamic substrate stores, in which a large number of substrates can be exposed to a desired atmosphere for cooling or drying during a predetermined dwell time.
  • Conventional transport devices in cooling and drying devices transport the substrates according to the sketch shown in FIG. 1.
  • the transport device is received at its right end.
  • the substrates are tilted, transported, tilted again and removed at the left end.
  • the coolant or air flow used for cooling or drying is indicated in FIG. 1 from top to bottom by the vertically positioned substrates.
  • the air flow is uniformly distributed over the entire horizontal transport length of the transport device.
  • a first disadvantage is that the substrates which are still hot at the inlet of the cooler may experience a "temperature shock" when they are exposed to the cooling air for the first time. This leads to internal stresses in the substrates due to the high temperature differences, so that A further disadvantage is maximum utilization when the vertically positioned substrates are arranged very close to one another in the conveyor belt.
  • the air resistance between the substrates is then comparatively high, so that the cooling or drying air flow coming from above only intervenes to a limited extent the substrates can penetrate and develop its effect there, since the air heated between the substrates and rising by convection according to FIG an air jam occurs between or over the substrates, which worsens the cooling process. This in turn leads to longer dwell times in the cooling or drying device.
  • the one-sided supply of the coolant or desiccant stream to the substrates also leads to an uneven flow and temperature distribution on the substrates. This can impair the finished product, for example, asymmetries in the substrates and stresses in them.
  • the uneven flow and temperature distribution also increase the dwell times in the cooler or dryer. Also, all sections of a substrate have to be cooled or heated uniformly over its entire surface, which is only possible to a limited extent with the conventional devices, if at all.
  • cooling or drying devices are used for drying and cooling substrates.
  • the substrates are transported vertically by conveyor belts.
  • the conveyor belts have a suitable profile to accommodate the substrates.
  • the coolant or desiccant stream is passed through the concentrically arranged substrates.
  • a device and a method with a transport device are known in which the substrates are stacked and one above the other and can be transported.
  • the substrates lie directly on the teeth of a toothed belt for vertical transport during vertical transport, so that heat or cold bridges between see the transport device and the substrates occur at certain points that prevent uniform treatment, for example cooling of the substrate over the entire substrate surface.
  • US Pat. No. 4,274,535 describes a transport device for wafers in which the wafers are transported in the form of an arc and thereby rest on wire arches which are fastened to the conveyor belt. This arrangement also does not allow a uniform treatment of the substrates due to the thermal or cold bridges resulting from the wire arches.
  • the conveyor system for chocolate articles described in DE 703 373 also has the same disadvantages in connection with their cooling, since these articles also rest on the transport device in their entire area and uniform cooling of the substrates without heat or cold bridges is not possible.
  • the object of the present invention is to propose an apparatus and a method with which the cooling or drying of substrates is possible more uniformly and more quickly.
  • the object is achieved in that the transport device has a multiplicity of supports for the substrates which can be inserted therein, and in that a jacket is arranged around the transport device , which has the inlet or outlet openings for the treatment agent.
  • the jacket which is arranged around the transport device, likewise brings about a uniform treatment atmosphere in the transport device, the inlet and / or outlet openings in the form of a cooling or heating jacket for introducing or discharging the treatment agent, for example a cooling device, or desiccant. This measure also improves the uniformity of the substrate treatment both across the substrate surface.
  • the substrates to be treated are introduced into the transport device in one plane and removed from the transport device again in the same plane or in an offset manner.
  • This has the advantage that the substrate treatment device can be made very compact, for example if the receiving section of the transport device is arranged directly next to the delivery section.
  • the substrates are oriented uniformly in the transport device, no special handling device is required for tilting or rotating the substrates.
  • the transport of the substrates begins and ends on a common level. This makes it possible to feed and discharge the substrates, the carrier without substrates / or the carrier with substrates with handling devices which are arranged in this plane.
  • the object is achieved by means of a method according to the invention in that the substrates are each on a carrier and during transport be treated in a jacket surrounding the transport device with a treatment agent which is supplied or removed on the circumferential side through openings in the jacket.
  • the advantages resulting from this method correspond to the advantages described above with regard to the device according to the invention.
  • the supports each have a plate for the targeted guidance of a treatment stream.
  • Figure 1 is a schematic diagram of a substrate cooling device according to the prior art.
  • FIG. 2 shows a schematic representation of the flow conditions on a vertically arranged substrate in a device according to FIG.
  • FIG. 3 shows a schematic illustration of a substrate treatment device according to the invention
  • Fig. 4 is a perspective view of an embodiment of a
  • Carrier device as can be used in the device according to the invention.
  • Fig. 5 is a schematic diagram of the flow conditions in a vertical
  • Fig. 6 is a perspective view of a cooler according to the invention with a cooling jacket.
  • the transport device has a vertically arranged first conveyor pair and a second conveyor pair 2 arranged next to it.
  • the pairs of conveyors can be sledges, belts or other suitable devices.
  • Each conveyor device of these conveyor pairs 1, 2 has horizontally running slots or tooth profiles, not shown, into which substrates 3 or carriers 4 for substrates 3 can be inserted or inserted.
  • the first pair of conveyors 1 rotates in such a way that the carriers 4 located therein are transported downwards according to the arrows 5, 6.
  • the second pair of conveyors 2 rotates according to arrow 7 in such a way that the carriers 4 therein, including the substrates 3, are conveyed upward.
  • a device (not shown) which moves the carriers in the horizontal direction, as indicated by arrow 8.
  • the two pairs of conveyors 1, 2 should preferably carry out step-by-step movements synchronized with one another, so that the slots of both pairs of conveyors 1, 2 lie on the same plane during the horizontal movement of the substrates.
  • the carrier-plate stacks 9 and 10 move in opposite directions, the substrates 3 being placed on the empty carriers 4 at the top of the stack 9 and removed again at the top of the stack 10.
  • the loading and 'unloading of the transport device with substrates 3 thus takes place on the same plane.
  • the substrate treatment device can thus be integrated more easily into a production system since no complicated handling devices, such as for rotating or tilting the substrates 3, are required.
  • the height of the transport device can be adapted to the respective needs, for example depending on the desired residence time of the substrates in the substrate treatment device.
  • the treatment process for example the cooling process, can also be adjusted and adjusted by clocking the carrier-plate stack transport, but also by setting and controlling the treatment flow, for example the cooling flow, or the height of the transport device.
  • the transport of the carriers 4 or substrates 3 in the transport device can take place step by step or continuously. It can be advantageous to couple or adapt the transport movement of the conveyor belts mechanically or electronically to the transport movements of upstream or downstream treatment facilities.
  • the movement of the conveying devices for example of carriages of the conveying pairs 1, 2, and the transfer of the substrates or substrate carriers is adapted accordingly and can take place via separate or coupled drives.
  • a substrate 3 or a carrier 4 with a substrate 3 is brought into the stack 9 according to arrow 11 in FIG. 3.
  • the substrate 3 is transported within the substrate-carrier stack 9 according to the arrows 5, 6 with the conveyor pair 1 downwards.
  • the lowermost carrier 4 with the substrate 3 is transported under the stack 10 in the horizontal direction according to arrow 8.
  • the substrate 3 or the carrier 4 moves with it in accordance with the conveying movement of the rear conveying pair 2 (arrow 7).
  • the substrate 3 is removed according to arrow 12 and the empty carrier 4 is transferred from stack 10 to stack 9 according to arrow 13.
  • the loading of the. pels 9 and the removal of a substrate from stack 10 thus takes place on one level.
  • a carrier 4 shows a perspective view of a carrier 4 for the substrates 3.
  • Elements of the carrier 4 are a plate 14 for the horizontal guiding of a treatment stream, with a through hole 15, through which a treatment stream can flow, and mounting arms 16 for receiving into the conveyor device.
  • Such a carrier 4 has the advantage that no disadvantageous heat or Cold bridges between the conveyor and the substrate 3, which can occur at the edge of the substrates 3 as in conventional devices in which the substrates are directly connected to the conveyor.
  • FIG. 5 schematically shows the cooling or drying flow profile in the case of such a substrate stack.
  • the coolant or drying agent flows according to arrow 18 upwards.
  • the disks shown in the drawing alternately represent substrates 3 and plates 14 of carriers 4. Between the substrates 3 and carrier plates 14, part of the coolant or drying agent flows according to arrow 19 from the center to the outside or vice versa. Outside the stack, the coolant or drying agent, usually cooled or heated air, flows from top to bottom (see arrow 20) or from top to bottom.
  • FIG. 6 shows a further embodiment of the treatment device according to the invention, which essentially corresponds to that shown in FIG. 3.
  • Fig. 6 also shows cooling or heating jackets 21, 22 which surround the carrier plate stack 9 or 10 and into which cooling or drying agent is introduced or discharged through an inlet or outlet opening.
  • the substrates can be rotated in the treatment device during transport. This rotational movement of the substrates with respect to the cooling or drying flow can be simulated by a suitable arrangement of inlet and / or outlet openings on the circumference of the cooling or heating jacket.
  • the inlet and / or outlet openings are distributed, for example, in a spindle shape on the inner circumference of the cooling or heating jacket.
  • the coolant or drying agent is therefore repeatedly introduced and / or drawn off from different sides, which would correspond to a rotation of a substrate in a solid coolant flow. Movable parts are therefore advantageously not required for the rotation of the substrates or the coolant flow.
  • the cooling or drying flow indicated schematically in FIG. 5 can also run in a different way depending on the circumstances and requirements.
  • the cooling or drying stream can be introduced via the cooling jackets 21, 22 and discharged centrally. This would mean that, for example, the coolant is supplied to the stack from the outside, penetrates through the gaps between the supports and substrates and is drawn off via the holes in the middle of the substrates and supports. This would be particularly advantageous if large temperature differences at the entrance to the cooling device are to be avoided.
  • the cooling jacket has coolant openings at different heights, these can be acted upon by coolants or drying agents at different temperatures.
  • the cooling or drying agent at the entrance of the cooling device can be somewhat warmer than in the further course. With such a temperature control, the cooling process can be optimized and carried out continuously, so that an impairment of the substrate properties, such as internal stresses, is avoided.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Drying Of Solid Materials (AREA)

Abstract

In order to design substrate treatment devices so that they are more compact, substrates (3) are arranged essentially perpendicular to the direction of conveyance while forming a stack. The conveying device comprises a receiving section and a delivery section, whereby the orientation of the substrates in the direction of transport is maintained.

Description

Substratbehandlungsvorrichtung Substrate processing apparatus
Die vorliegende Erfindung betrifft eine Vorrichtung und ein Verfahren zum Behandeln, insbesondere zum Kühlen und/oder Trocknen, von Substraten mit einer Transporteinrichtung, in der die Substrate stapelförming übereinander angeordnet und senkrecht transportierbar sind.The present invention relates to an apparatus and a method for treating, in particular for cooling and / or drying, substrates with a transport device in which the substrates are stacked one above the other and can be transported vertically.
Bei der Fertigung von scheibenförmigen Datenträgern, wie CD's und DVD's, werden die hierfür verwendeten Substrate verschiedenen Prozess-Schritten unterzogen. Die Substrate, aus denen beispielsweise eine DVD besteht, verlassen die Spritzgußmaschine, in der sie hergestellt werden, mit relativ hoher Temperatur, die für die sich anschließenden weiteren Behandlungsvorgänge nicht akzeptiert werden kann. Auch beim Verkleben von wenigstens zwei Substraten zu einem Datenträger, etwa einer DVD werden die Substrate auf- grund der für den Aushärtvorgang vorgenommenen UV-Bestrahlung erwärmt. Für nachfolgende Behandlungsverfahren oder Prozess-Schritte, beispielsweise für die optische Vermessung der Substrate, sind jedoch hohe Temperaturen der Substrate nicht erlaubt. Daher sind zwischen den Prozess-Schritten ode^den einzelnen Behandlungsvorgängen Kühlvorgänge erforderlich, die mit entsprechenden Kühlvorrichtungen durchgeführt werden. Beispielsweise werden die Substrate, aus denen eine DVD besteht, in einem ersten Schritt durch UV-Bestrahlung miteinander verklebt, wobei sich das Substrat, hier die verklebten Teilscheiben, erwärmen. In einem anschließenden Prozessschritt wird das Substrat optisch vermessen, darf dabei aber nur eine Temperatur von höchstens 30°C besitzen. Somit ist es unter Umständen erforderlich, zwischen beide Prozessschritte einen Kühlschritt einzufügen. Dieser wird in der Regel durch speziell konstruierte Kühlvorrichtungen vollzogen.In the manufacture of disk-shaped data carriers, such as CDs and DVDs, the substrates used for this are subjected to various process steps. The substrates, for example a DVD, leave the injection molding machine in which they are manufactured at a relatively high temperature, which cannot be accepted for the subsequent further treatment processes. Even when at least two substrates are bonded to a data carrier, for example a DVD, the substrates are heated due to the UV radiation carried out for the curing process. However, high temperatures of the substrates are not permitted for subsequent treatment processes or process steps, for example for the optical measurement of the substrates. Therefore, cooling processes are required between the process steps or the individual treatment processes, which are carried out with appropriate cooling devices. For example, in a first step, the substrates from which a DVD is made are glued to one another by UV radiation, the substrate, here the glued partial disks, heating up. In a subsequent process step, the substrate is measured optically, but may only have a temperature of at most 30 ° C. It may therefore be necessary to insert a cooling step between the two process steps. This is usually carried out using specially designed cooling devices.
Ein anderes Beispiel eines Prozessschritts bei der Fertigung von CDs und DVDs betrifft das Belacken der Substrate. Der in einem ersten Prozessschritt auf die Substrate aufgebrachte Lack muss in einem anschließenden Prozessschritt wirkungsvoll getrocknet werden. Hierzu werden speziell entwickelte Trocknungsvorrichtungen eingesetzt, die erwärmte Luft über die Substrate streichen lassen.Another example of a process step in the production of CDs and DVDs relates to the coating of the substrates. The varnish applied to the substrates in a first process step must be effectively dried in a subsequent process step. For this purpose, specially developed Drying devices are used, which let heated air sweep over the substrates.
Sowohl das Kühlen als auch das Trocknen erfordern einen definierten Zeit- räum, der von der maximal zulässigen Temperaturdifferenz zwischen Substrat und Kühlluft oder der Flüchtigkeit des Lösungsmittels aus dem Lack abhängt. Daher werden die. Kühl- und Trocknungsvorrichtungen oftmals als dynamische Substratspeicher realisiert, in denen eine große Anzahl von Substraten während einer vorbestimmten Verweilzeit einer gewünschten Atmosphäre zum Kühlen oder Trocknen ausgesetzt werden kann.Both cooling and drying require a defined period of time, which depends on the maximum permissible temperature difference between the substrate and the cooling air or the volatility of the solvent from the paint. Therefore, the. Cooling and drying devices are often implemented as dynamic substrate stores, in which a large number of substrates can be exposed to a desired atmosphere for cooling or drying during a predetermined dwell time.
Herkömmliche Transporteinrichtungen in Kühl- und Trocknungsvorrichtungen transportieren die Substrate gemäß der in Fig. 1 dargestellten Skizze. Gemäß dem skizzierten Beispiel erfolgt die Aufnahme in die Transporteinrichtung an deren rechtem Ende. Die Substrate werden gekippt, transportiert, erneut gekippt und am linken Ende abtransportiert.Conventional transport devices in cooling and drying devices transport the substrates according to the sketch shown in FIG. 1. According to the sketched example, the transport device is received at its right end. The substrates are tilted, transported, tilted again and removed at the left end.
Der zum Kühlen oder Trocknen verwendete Kühlmittel- bzw. Luftstrom ist in Fig. jl von oben nach unten durch die vertikal aufgestellten Substrate ange- deutet. Darüber hinaus ist der Luftstrom über die gesamte horizontale Transportlänge der Transportvorrichtung gleichförmig verteilt. Daraus ergeben sich mehrere Nachteile. Ein erster Nachteil, besteht darin, dass die am Eingang des Kühlers noch heißen Substrate unter Umständen einen „Temperaturschock" erleiden, wenn sie der Kühlluft erstmals ausgesetzt werden. Dies führt dazu, dass aufgrund der hohen Temperaturunterschiede innere Spannungen in den Substraten auftreten, so dass sie sich verziehen. Ein weiterer Nachteil besteht bei maximaler Auslastung, wenn die vertikal aufgestellten Substrate in dem Transportband sehr eng aneinander angeordnet sind. Der Luftwiderstand ist dann zwischen den Substraten verhältnismäßig hoch, so dass der von oben kommende kühlende oder trocknende Luftstrom nur bedingt zwisc en die Substrate eindringen und dort seine Wirkung entfalten kann. Da ferner die zwischen den Substraten erwärmte, durch Konvektion gemäß Fig. 2 nach oben steigende Luft dem Kühlstrom entgegenströmt, kann es zwischen oder über den Substraten zu einem Luftstau kommen, wodurch der Kühlprozess verschlechtert wird. Dies wiederum führt zu längeren Verweilzeiten in der Kühl- oder Trocknungsvorrichtung.The coolant or air flow used for cooling or drying is indicated in FIG. 1 from top to bottom by the vertically positioned substrates. In addition, the air flow is uniformly distributed over the entire horizontal transport length of the transport device. This has several disadvantages. A first disadvantage is that the substrates which are still hot at the inlet of the cooler may experience a "temperature shock" when they are exposed to the cooling air for the first time. This leads to internal stresses in the substrates due to the high temperature differences, so that A further disadvantage is maximum utilization when the vertically positioned substrates are arranged very close to one another in the conveyor belt. The air resistance between the substrates is then comparatively high, so that the cooling or drying air flow coming from above only intervenes to a limited extent the substrates can penetrate and develop its effect there, since the air heated between the substrates and rising by convection according to FIG an air jam occurs between or over the substrates, which worsens the cooling process. This in turn leads to longer dwell times in the cooling or drying device.
Die einseitige Zufuhr des Kühl- oder Trocknungsmittelstroms auf die Substrate führt darüber hinaus zu einer ungleichmäßigen Strömungs- und Temperaturverteilung an den Substraten. Dies kann zu Beeinträchtigen des fertigen Produkts, beispielsweise zu Unsymmetrien der Substrate und Spannungen in ihnen führen. Femer erhöhen sich durch die ungleichmäßige Strömungs- und Temperaturverteilung die Verweilzeiten im Kühler bzw. Trockner. Auch müssen alle Abschnitte eines Substrats gleichmäßig über seine gesamte Fläche hinweg gekühlt oder erwärmt werden, was mit den herkömmlichen Vorrichtungen - wenn überhaupt - nur begrenzt durchführbar ist.The one-sided supply of the coolant or desiccant stream to the substrates also leads to an uneven flow and temperature distribution on the substrates. This can impair the finished product, for example, asymmetries in the substrates and stresses in them. The uneven flow and temperature distribution also increase the dwell times in the cooler or dryer. Also, all sections of a substrate have to be cooled or heated uniformly over its entire surface, which is only possible to a limited extent with the conventional devices, if at all.
Bekanntermaßen werden bei der Trocknung und Kühlung von Substraten vertikale Kühl- oder Trocknungsvorrichtungen eingesetzt. In diesen Kühl- oder Trocknungsvorrichtungen werden die Substrate durch Förderbänder vertikal transportiert. Die Förderbänder weisen ein geeignetes Profil auf, um die Substrate aufzunehmen. Der Kühl- oder Trocknungsmittelstrom wird durch die konzentrisch übereinander angeordneten Substrate geführt. Das Problem der Konvektion über die Oberfläche der Substrate ist zwar durch deren horizontale Anordnung umgangen, jedoch tritt die Konvektion zwischen den übereinander angeordneten Substraten auf, so dass die Unterseite der Substrate stets wärmer sein wird, als die Oberseite. Darüber hinaus wird der Kühl- oder Trocknungsstrom durch die Konvektion verwirbelt, so dass es auf den einzelnen Substraten örtlich zu unterschiedlichen Kühl- oder Trocknungswirkungen kommt.As is known, vertical cooling or drying devices are used for drying and cooling substrates. In these cooling or drying devices, the substrates are transported vertically by conveyor belts. The conveyor belts have a suitable profile to accommodate the substrates. The coolant or desiccant stream is passed through the concentrically arranged substrates. Although the problem of convection over the surface of the substrates is avoided by arranging them horizontally, convection occurs between the substrates arranged one above the other, so that the underside of the substrates will always be warmer than the top. In addition, the cooling or drying flow is swirled by the convection, so that there are locally different cooling or drying effects on the individual substrates.
Aus der DE 297 07 657 U1 ist eine Vorrichtung und ein Verfahren mit einer Transporteinrichtung bekannt, in der die Substrate stapeiförmig übereinander angeordnet und transportierbar sind. Die Substrate liegen bei dieser Vorrichtung während des vertikalen Transports direkt auf Zähnen eines Zahnriemens für den senkrechten Transport auf, so dass Wärme- bzw. Kältebrücken zwi- sehen der Transporteinrichtung und den Substraten an bestimmten Stellen auftreten, die eine gleichmäßige Behandlung, beispielsweise Kühlung des Substrats über die gesamte Substratfläche hinweg verhindern.From DE 297 07 657 U1 a device and a method with a transport device are known in which the substrates are stacked and one above the other and can be transported. In this device, the substrates lie directly on the teeth of a toothed belt for vertical transport during vertical transport, so that heat or cold bridges between see the transport device and the substrates occur at certain points that prevent uniform treatment, for example cooling of the substrate over the entire substrate surface.
In der US 4 274 535 ist eine Transporteinrichtung für Wafer beschrieben, bei der die Wafer bogenförmig transportiert werden und dabei auf Drahtbögen aufliegen, die an dem Transportband befestigt sind. Auch diese Anordnung läßt eine gleichmäßige Behandlung der Substrate aufgrund der durch die Drahtbögen ergebenen Wärme- oder Kältebrücken nicht zu. Dasselbe gilt für die aus der US 3 993 189 bekannte Transportvorrichtung im Zusammenhang mit der Fertigung von Nahrungsprodukten, da diese während der Behandlung ebenfalls mit der Transporteinrichtung in Verbindung stehen und Wärme- bzw. Kältebrücken die gleichmäßige Behandlung dieser Produkte nicht ermöglichen. Auch weist die aus der DE 703 373 beschriebene Förderanlage für Schokoladenartikel in Zusammenhang mit deren Kühlung dieselben Nachteile auf, da diese Artikei ebenfalls in ihrer ganzen Fläche auf der Transporteinrichtung aufliegen und eine gleichmäßige Kühlung der Substrate ohne Wärme- oder Kältebrücken nicht mögljch ist.US Pat. No. 4,274,535 describes a transport device for wafers in which the wafers are transported in the form of an arc and thereby rest on wire arches which are fastened to the conveyor belt. This arrangement also does not allow a uniform treatment of the substrates due to the thermal or cold bridges resulting from the wire arches. The same applies to the transport device known from US Pat. No. 3,993,189 in connection with the production of food products, since these are also connected to the transport device during the treatment and heat or cold bridges do not enable these products to be treated evenly. The conveyor system for chocolate articles described in DE 703 373 also has the same disadvantages in connection with their cooling, since these articles also rest on the transport device in their entire area and uniform cooling of the substrates without heat or cold bridges is not possible.
Angesichts der obigen Nachteile besteht die Aufgabe der vorliegenden Erfindung darin, eine Vorrichtung und ein Verfahren vorzuschlagen, mit denen das Kühlen bzw. Trocknen von Substraten gleichmäßiger und schneller möglich ist.In view of the above disadvantages, the object of the present invention is to propose an apparatus and a method with which the cooling or drying of substrates is possible more uniformly and more quickly.
Ausgehend von einer eingangs genannten Vorrichtung, wie sie aus der DE 297 07 657 U1 bekannt ist, wird die gestellte Aufgabe dadurch gelöst, dass die Transporteinrichtung eine Vielzahl von in sie einsetzbaren Trägern für die Substrate aufweist, und dass ein Mantel um die Transporteinrichtung angeordnet ist, der die Einlass- bzw. Auslassöffnungen für das Behandlungsmittel aufweist.Starting from a device mentioned at the outset, as is known from DE 297 07 657 U1, the object is achieved in that the transport device has a multiplicity of supports for the substrates which can be inserted therein, and in that a jacket is arranged around the transport device , which has the inlet or outlet openings for the treatment agent.
Da nicht das Substrat selbst, sondern der das Substrat tragende Träger mit der Transporteinrichtung in Verbindung steht, ergibt sich eine wesentlich gleichmäßigere Behandlung, beispielsweise eine wesentlich gleichmäßigere Erwärmung oder Kühlung über die gesamte Substratfläche hinweg, da Wärme- bzw. Kältebrücken nicht auftreten und sich der Träger selbst in der Behandlungsvorrichtung befindet. Der Mantel, der um die Transporteinrichtung angeordnet ist, bewirkt ebenfalls eine gleichmäßige Behandlungsatmosphäre in der Transporteinrichtung, wobei die am Umfang des als Kühl- bzw. Heizmantels ausgebildeten Einlass- und/oder Auslassöffnungen zum Ein- bzw. Ableiten des Behandlungsmittels, beispielsweise eines Kühl- oder Trocknungsmittels dienen. Auch diese Maßnahme verbessert die Gleichmä- ßigkeit der Substratbehandlung sowohl über die Substratfläche hinweg.Since it is not the substrate itself, but rather the carrier carrying the substrate, that is connected to the transport device, this results in an essential one more uniform treatment, for example a much more uniform heating or cooling over the entire substrate surface, since heat or cold bridges do not occur and the carrier itself is in the treatment device. The jacket, which is arranged around the transport device, likewise brings about a uniform treatment atmosphere in the transport device, the inlet and / or outlet openings in the form of a cooling or heating jacket for introducing or discharging the treatment agent, for example a cooling device, or desiccant. This measure also improves the uniformity of the substrate treatment both across the substrate surface.
Die zu behandelnden Substrate werden in die Transporteinrichtung in einer Ebene eingeführt und in der gleichen Ebene oder in einer dazu versetzten aus der Transporteinrichtung wieder entnommen. Dies hat den Vorteil, dass die Substratbehandlungsvorrichtung sehr kompakt gestaltet werden kann, beispielsweise wenn der Aufnahmeabschnitt der Transporteinrichtung unmittelbar neben dem Abgabeabschnitt angeordnet ist. Da ferner die Substrate in der Transporteinrichtung einheitlich orientiert sind, bedarf es keiner speziellen Handhabungsvorrichtung zum Kippen oder Drehen der Substrate.The substrates to be treated are introduced into the transport device in one plane and removed from the transport device again in the same plane or in an offset manner. This has the advantage that the substrate treatment device can be made very compact, for example if the receiving section of the transport device is arranged directly next to the delivery section. Furthermore, since the substrates are oriented uniformly in the transport device, no special handling device is required for tilting or rotating the substrates.
Gemäß einer besonders vorteilhaften Ausführungsform der Erfindung beginnt und endet das Transportieren der Substrate auf einer gemeinsamen Ebene. Dadurch ist es möglich, die Zuführung und Abführung der Substrate, der Träger ohne Substrate/oder der Träger mit Substraten mit Handhabungsvorrich- tungen vorzunehmen, die in dieser Ebene angeordnet sind. Gegebenenfalls ist es für bestimmte Ausführungsfälle jedoch auch vorteilhaft, das Transportieren der Substrate auf verschiedenen Ebenen beginnen bzw. enden zu lassen, beispielsweise dann, wenn dies aus Platzgründen für die Handhabungsvorrichtungen vorteilhafter ist.According to a particularly advantageous embodiment of the invention, the transport of the substrates begins and ends on a common level. This makes it possible to feed and discharge the substrates, the carrier without substrates / or the carrier with substrates with handling devices which are arranged in this plane. However, it may also be advantageous for certain embodiments to have the transport of the substrates begin or end at different levels, for example when this is more advantageous for the handling devices for reasons of space.
Ausgehend von der aus der DE 297 07 657 U1 bekannten Vorrichtung wird die gestellte Aufgabe mittels eines Verfahrens erfindungsgemäß dadurch gelöst, dass die Substrate auf jeweils einen Träger und während des Transports in einem die Transporteinrichtung umgebenden Mantel mit einem Behandlungsmittel behandelt werden, das durch Öffnungen im Mantel umfangsseitig zu- oder abgeführt wird. Die sich aus diesem Verfahren ergebenden Vorteile entsprechen den zuvor im Hinblick auf die erfindungsgemäße Vorrichtung be- schriebenen Vorteile.Starting from the device known from DE 297 07 657 U1, the object is achieved by means of a method according to the invention in that the substrates are each on a carrier and during transport be treated in a jacket surrounding the transport device with a treatment agent which is supplied or removed on the circumferential side through openings in the jacket. The advantages resulting from this method correspond to the advantages described above with regard to the device according to the invention.
Vorteilhafte Weiterentwicklungen ergeben sich aus den Unteransprüchen.Advantageous further developments result from the subclaims.
Als besonders vorteilhaft erweist sich, wenn die Substrate in der Transportein- richtung auf Trägern transportiert werden, die Träger jeweils eine Platte zum gezielten Führen eines Behandlungsstroms aufweisen.It proves to be particularly advantageous if the substrates are transported on supports in the transport device, the supports each have a plate for the targeted guidance of a treatment stream.
Die vorliegende Erfindung wird anhand von Ausführungsbeispielen unter Bezugnahme auf die Figuren näher erläutert. Es zeigen:The present invention is explained in more detail using exemplary embodiments with reference to the figures. Show it:
Fig. 1 eine Prinzipskizze einer Substratkühlvorrichtung nach dem Stand der Technik;Figure 1 is a schematic diagram of a substrate cooling device according to the prior art.
Fig. 2 eine schematische Darstellung der Strömungsverhältnisse an ei- nem vertikal angeordneten Substrat bei einer Vorrichtung gemäß2 shows a schematic representation of the flow conditions on a vertically arranged substrate in a device according to FIG
Fig. 1 ;Fig. 1;
Fig. 3 eine schematische Darstellung einer erfindungsgemäßen Substratbehandlungsvorrichtung;3 shows a schematic illustration of a substrate treatment device according to the invention;
Fig. 4 eine perspektivische Ansicht eines Ausführungsbeispiels für eineFig. 4 is a perspective view of an embodiment of a
Trägervorrichtung, wie sie bei der erfindungsgemäßeh Vorrichtung verwendbar ist;Carrier device, as can be used in the device according to the invention;
Fig. 5 eine Prinzipskizze der Strömungsverhältnisse in einem vertikalenFig. 5 is a schematic diagram of the flow conditions in a vertical
Substratstapel der erfindungsgemäßen Vorrichtung; und Fig. 6 eine perspektivische Ansicht eines erfindungsgemäßen Kühlers mit Kühlmantel.Stack of substrates of the device according to the invention; and Fig. 6 is a perspective view of a cooler according to the invention with a cooling jacket.
Fig. 3 zeigt eine Ausführungsform für eine erfindungsgemäße Substratbe- handlungsvorrichtung mit einer Transporteinrichtung. Die Transporteinrichtung weist ein vertikal angeordnetes, erstes Förderpaa und ein daneben angeordnetes zweites Förderpaar 2 auf. Die Förderpaare können Schlitten, Bänder oder sonstige geeignete Einrichtungen sein. Jede Fördereinrichtung dieser Förderpaare 1 , 2 weist horizontal verlaufende, nicht dargestellte Schlitze oder Zahnprofile auf, in die Substrate 3 direkt oder Träger 4 für die Substrate 3 einschieb- oder einsteckbar sind. Das erste Förderpaar 1 dreht sich derart, dass die darin befindlichen Träger 4 gemäß den Pfeilen 5,6 nach unten transportiert werden. Das zweite Förderpaar 2 dreht sich gemäß Pfeil 7 derart, dass die darin befindlichen Träger 4 einschließlich der Substrate 3 nach oben befördert werden.3 shows an embodiment for a substrate treatment device according to the invention with a transport device. The transport device has a vertically arranged first conveyor pair and a second conveyor pair 2 arranged next to it. The pairs of conveyors can be sledges, belts or other suitable devices. Each conveyor device of these conveyor pairs 1, 2 has horizontally running slots or tooth profiles, not shown, into which substrates 3 or carriers 4 for substrates 3 can be inserted or inserted. The first pair of conveyors 1 rotates in such a way that the carriers 4 located therein are transported downwards according to the arrows 5, 6. The second pair of conveyors 2 rotates according to arrow 7 in such a way that the carriers 4 therein, including the substrates 3, are conveyed upward.
Zum Wechsel der Träger an der unteren Stelle der beiden Förderpaare 1 , 2 vom ersten Förderpaar 1 zum zweiten Förderpaar 2 ist eine nicht dargestellte Einrjphtung vorgesehen, die die Träger in horizontaler Richtung bewegt, wie dies durch den Pfeil 8 angedeutet ist. Vorzugsweise sollten die beiden Förderpaare 1 ,2 zueinander synchronisierte schrittweise Bewegungen durchführen, so dass die Schlitze beider Förderpaare 1 , 2 während der horizontalen Bewegung der Substrate auf derselben Ebene liegen.To change the carrier at the lower point of the two pairs of conveyors 1, 2 from the first pair of conveyors 1 to the second pair of conveyors 2, a device (not shown) is provided which moves the carriers in the horizontal direction, as indicated by arrow 8. The two pairs of conveyors 1, 2 should preferably carry out step-by-step movements synchronized with one another, so that the slots of both pairs of conveyors 1, 2 lie on the same plane during the horizontal movement of the substrates.
In der Transporteinrichtung bewegen sich die Träger-Platten-Stapel 9 und 10 gegenläufig, wobei die Substrate 3 auf die leeren Träger 4 an der Oberseite des Stapels 9 aufgelegt und an der Oberseite des Stapels 10 wieder entnommen werden. Das Be- und'Entladen der Transporteinrichtung mit Substraten 3 erfolgt somit auf derselben Ebene. Damit lässt sich die Substratbehandlungs- einrichtung leichter in eine Produktionsanlage integrieren, da keine komplizierten Handhabungsvorrichtungen, wie beispielsweise zum Drehen oder Kippen der Substrate 3, erforderlich sind. Die Höhe der Transporteinrichtung lässt sich an die jeweiligen Bedürfnisse anpassen, beispielsweise in Abhängigkeit von der gewünschten Verweildauer der Substrate in der Substratbehandlungsvorrichtung. Der Behandlungsvorgang, beispielsweise der Kühlvorgang, ist dabei auch durch die Taktung des Träger-Platten-Stapeltransports, aber auch durch die Einstellung und Steuerung des Behandlungsstroms, etwa des Kühlstroms, oder, die Höhe der Transporteinrichtung einstell- und anpaßbar.In the transport device, the carrier-plate stacks 9 and 10 move in opposite directions, the substrates 3 being placed on the empty carriers 4 at the top of the stack 9 and removed again at the top of the stack 10. The loading and 'unloading of the transport device with substrates 3 thus takes place on the same plane. The substrate treatment device can thus be integrated more easily into a production system since no complicated handling devices, such as for rotating or tilting the substrates 3, are required. The height of the transport device can be adapted to the respective needs, for example depending on the desired residence time of the substrates in the substrate treatment device. The treatment process, for example the cooling process, can also be adjusted and adjusted by clocking the carrier-plate stack transport, but also by setting and controlling the treatment flow, for example the cooling flow, or the height of the transport device.
Wie bereits zuvor beschrieben wurde, kann der Transport der Träger 4 bzw. Substrate 3 in der Transporteinrichtung schrittweise oder stetig erfolgen. Dabei kann es vorteilhaft sein, die Transportbewegung der Förderbänder mechanisch oder elektronisch an die Transportbewegungen vorgeschalteter oder nachgeschalteter Behandlungseinrichtungen zu koppeln oder anzupassen.As has already been described above, the transport of the carriers 4 or substrates 3 in the transport device can take place step by step or continuously. It can be advantageous to couple or adapt the transport movement of the conveyor belts mechanically or electronically to the transport movements of upstream or downstream treatment facilities.
Die Bewegung der Fördereinrichtungen, beispielsweise von Schlitten der Förderpaare 1 , 2, und die Übergabe der Substrate oder Substratträger ist entsprechend angepaßt und kann über separate oder gekoppelte Antriebe erfolgen.The movement of the conveying devices, for example of carriages of the conveying pairs 1, 2, and the transfer of the substrates or substrate carriers is adapted accordingly and can take place via separate or coupled drives.
Der Transport der Substrate in der Transporteinrichtung erfolgt somit zusammenfassend folgendermaßen:The substrates are thus transported in the transport device in summary as follows:
Ein Substrat 3 bzw. ein Träger 4 mit einem Substrat 3 wird gemäß Pfeil 11 in Fig. 3 in den Stapel 9 gebracht. Das Substrat 3 wird innerhalb des Substrat- Träger-Stapels 9 gemäß den Pfeilen 5, 6 mit dem Förderpaar 1 nach unten transportiert. Am unteren Ende des Stapels 10 wird der unterste Träger 4 mit dem Substrat 3 iα horizontaler Richtung gemäß Pfeil 8 unter den Stapel 10 transportiert. Innerhalb des Stapels 10 wandert das Substrat 3 bzw. der Träger 4 mit ihm entsprechend der Förderbewegung .des rückwärtigen Förder- paars 2 (Pfeil 7) nach oben. An der obersten Stelle des Stapels 10 wird das Substrat 3 gemäß Pfeil 12 entnommen und der leere Träger 4 wird entsprechend Pfeil 13 von Stapel 10 zu Stapel 9 überführt. Das Beschicken des. Sta- pels 9 und das Entnehmen eines Substrats von Stapel 10 erfolgt somit auf einer Ebene.A substrate 3 or a carrier 4 with a substrate 3 is brought into the stack 9 according to arrow 11 in FIG. 3. The substrate 3 is transported within the substrate-carrier stack 9 according to the arrows 5, 6 with the conveyor pair 1 downwards. At the lower end of the stack 10, the lowermost carrier 4 with the substrate 3 is transported under the stack 10 in the horizontal direction according to arrow 8. Within the stack 10, the substrate 3 or the carrier 4 moves with it in accordance with the conveying movement of the rear conveying pair 2 (arrow 7). At the top of the stack 10, the substrate 3 is removed according to arrow 12 and the empty carrier 4 is transferred from stack 10 to stack 9 according to arrow 13. The loading of the. pels 9 and the removal of a substrate from stack 10 thus takes place on one level.
Fig. 4 zeigt eine perspektivische Ansicht eines Trägers 4 für die Substrate 3. Zur detaillierten Beschreibung von Ausführungsbeispielen für diesen Träger sei auf die Parallelanmeldung mit dem Titel „Trägervorrichtung für Substrate" mit dem gleichen Zeitrang wie die vorliegende Patentanmeldung mit der dazugehörigen Beschreibung verwiesen. Wesentliche Elemente des Trägers 4 sind eine Platte 14 zum horizontalen Führen eines Behandlungsstroms, mit einem Durchgangsloch 15, durch das ein Behandlungsstrom strömen kann, und Halterungsarme 16 zur Aufnahme in die Fördereinrichtung. Ein derartiger Träger 4 hat den Vorteil, dass keine nachteiligen Wärme- bzw. Kältebrücken zwischen Fördereinrichtung und Substrat 3 der am Rand der Substrate 3 wie bei herkömmlichen Einrichtungen entstehen können, bei denen die Substrate direkt mit der Fördereinrichtung in Verbindung stehen.4 shows a perspective view of a carrier 4 for the substrates 3. For a detailed description of exemplary embodiments for this carrier, reference is made to the parallel application entitled "Carrier Device for Substrates" with the same priority as the present patent application with the associated description Elements of the carrier 4 are a plate 14 for the horizontal guiding of a treatment stream, with a through hole 15, through which a treatment stream can flow, and mounting arms 16 for receiving into the conveyor device. Such a carrier 4 has the advantage that no disadvantageous heat or Cold bridges between the conveyor and the substrate 3, which can occur at the edge of the substrates 3 as in conventional devices in which the substrates are directly connected to the conveyor.
Fig. 5 zeigt schematisch den Kühl- bzw. Trocknungs-Stromverlauf bei einem derartigen Substratstapel. Durch die Durchgangslöcher 17 der Substrate 3 und ^Träger 4 strömt das Kühl- bzw. Trocknungsmittel entsprechend Pfeil 18 nach oben. Die in der Zeichnung dargestellten Scheiben stellen dabei abwechselnd Substrate 3 und Platten 14 von Trägern 4 dar. Zwischen den Substraten 3 und Trägerplatten 14 strömt jeweils ein Teil des Kühl- bzw. Trocknungsmittels entsprechend Pfeil 19 vom Zentrum nach außen oder umgekehrt. Außerhalb des Stapels strömt das Kühl- bzw. Trocknungsmittel, in der Regel gekühlte oder erwärmte Luft, von oben nach unten (vgl. Pfeil 20) bzw. von oben nach unten.FIG. 5 schematically shows the cooling or drying flow profile in the case of such a substrate stack. Through the through holes 17 of the substrates 3 and ^ carrier 4, the coolant or drying agent flows according to arrow 18 upwards. The disks shown in the drawing alternately represent substrates 3 and plates 14 of carriers 4. Between the substrates 3 and carrier plates 14, part of the coolant or drying agent flows according to arrow 19 from the center to the outside or vice versa. Outside the stack, the coolant or drying agent, usually cooled or heated air, flows from top to bottom (see arrow 20) or from top to bottom.
Fig. 6 stellt eine weitere Ausführungsform der erfindungsgemäßen Behandlungsvorrichtung dar, die im Wesentlichen mit der in Fig. 3 dargestellten. Be- handlungsvorrichtung übereinstimmt. Fig. 6 zeigt darüber hinaus Kühl- bzw. Heizmäntel 21, 22, die die Träger-Platten-Stapel 9 bzw. 10 umgeben, und in die durch eine Einlaß- bzw. Auslaßöffnung Kühl- bzw.Trocknungsmittel eingeleitet bzw. abgeleitet wird. Um die Substrate noch gleichmäßiger in dem Kühl- bzw. Trocknungsmittelstrom zu kühlen oder zu trocknen, können die Substrate während des Transports in der Behandlungsvorrichtung gedreht werden. Diese Drehbewegung der Substrate bezüglich des Kühl- bzw. Trocknungsstroms kann durch geeignete Anordnung von Einlaß- und/oder Auslaß-Öffnungen am Umfang des Kühl- bzw. Heizmantels simuliert werden. Die Einlaß und/oder Auslaß- Öffnungen sind beispielsweise spindelförmig am Innenumfang des Kühl- bzw. Heizmantels verteilt. Beim Transport der Substrate von unten nach oben oder umgekehrt wird das Kühl- bzw. Trocknungsmittel somit immer wieder von unterschiedlichen Seiten eingeleitet und/oder abgesogen, was einer Drehung eines Substrats in einem festen Kühlmittelstrom entsprechen würde. Bewegliche Teile sind daher für die Drehung der Substrate oder des Kühlmittelstroms vorteilhafterweise nicht erforderlich.FIG. 6 shows a further embodiment of the treatment device according to the invention, which essentially corresponds to that shown in FIG. 3. Treatment device matches. Fig. 6 also shows cooling or heating jackets 21, 22 which surround the carrier plate stack 9 or 10 and into which cooling or drying agent is introduced or discharged through an inlet or outlet opening. In order to cool or dry the substrates even more uniformly in the coolant or desiccant stream, the substrates can be rotated in the treatment device during transport. This rotational movement of the substrates with respect to the cooling or drying flow can be simulated by a suitable arrangement of inlet and / or outlet openings on the circumference of the cooling or heating jacket. The inlet and / or outlet openings are distributed, for example, in a spindle shape on the inner circumference of the cooling or heating jacket. When the substrates are transported from bottom to top or vice versa, the coolant or drying agent is therefore repeatedly introduced and / or drawn off from different sides, which would correspond to a rotation of a substrate in a solid coolant flow. Movable parts are therefore advantageously not required for the rotation of the substrates or the coolant flow.
Der in Fig. 5 schematisch angedeutete Kühl- bzw. Trocknungstrom kann je nach den Gegebenheiten und Erfordernissen auch in anderer Weise verlaufen. Beispielsweise kann der Kühl- bzw. Trocknungstrom statt im Zentrum eingeleitet und im Verlauf des Stapel ausgeleitet zu werden, über die Kühl- mäntel 21 , 22 eingeleitet und zentral abgeführt werden. Dies würde bedeuten, dass beispielsweise das Kühlmittel von außen dem Stapel zugeführt wird, durch die Spalte zwischen den Trägern und Substraten dringt und über die Löcher in der Mitte der Substrate und Träger abgesogen wird. Dies wäre insbesondere dann vorteilhaft, wenn starke Temperaturunterschiede am Eingang der Kühlvorrichtung vermieden werden sollen. Falls der Kühlmantel in unterschiedlichen Höhen Kühlmittelöffnungen aufweist, können diese mit Kühloder Trocknungsmitteln unterschiedlicher Temperatur beaufschlagt werden. Somit kann das Kühl oder Trockungsmittel am Eingang der, Kühlvorrichtung durchaus etwas wärmer sein als im weiteren Verlauf. Mit einer derartigen Temperatursteuerung lässt sich der Abkühlprozess optimieren und stetig durchführen, so dass eine Beeinträchtigung der Substrateigenschaften, wie beispielsweise innere Spannungen, vermieden wird. The cooling or drying flow indicated schematically in FIG. 5 can also run in a different way depending on the circumstances and requirements. For example, instead of being introduced in the center and discharged in the course of the stack, the cooling or drying stream can be introduced via the cooling jackets 21, 22 and discharged centrally. This would mean that, for example, the coolant is supplied to the stack from the outside, penetrates through the gaps between the supports and substrates and is drawn off via the holes in the middle of the substrates and supports. This would be particularly advantageous if large temperature differences at the entrance to the cooling device are to be avoided. If the cooling jacket has coolant openings at different heights, these can be acted upon by coolants or drying agents at different temperatures. Thus, the cooling or drying agent at the entrance of the cooling device can be somewhat warmer than in the further course. With such a temperature control, the cooling process can be optimized and carried out continuously, so that an impairment of the substrate properties, such as internal stresses, is avoided.

Claims

Patentansprüche claims
1. Vorrichtung zum Behandeln, insbesondere zum Kühlen und/oder Trocknen, von Substraten (3) für die Fertigung von optischen Datenträgern, mit einer Transporteinrichtung, in der die Substrate (3) stapeiförmig übereinander angeordnet und senkrecht transportierbar sind, dadurch gekennzeichnet, dass die Transporteinrichtung eine Vielzahl von in sie einsetzbarenTrä- gern (4) für die Substrate (3) aufweist und dass ein Mantel (21 , 22) um die Transporteinrichtung angeordnet ist, der Einlass- bzw. Auslassöffnungen für die Behandlugnsmittel aufweist.1. Device for treating, in particular for cooling and / or drying, of substrates (3) for the production of optical data carriers, with a transport device in which the substrates (3) are stacked one above the other and can be transported vertically, characterized in that the Transport device has a plurality of carriers (4) for the substrates (3) which can be inserted therein and that a jacket (21, 22) is arranged around the transport device, which has inlet and outlet openings for the treatment means.
2. Vorrichtung nach Anspruch 1 , dadurch gekennzeichnet, dass die Transporteinrichtung nebeneinander angeordnete Fördereinrichtungen (1 , 2) aufweist, die die Substrate (3) in vertikaler Richtung bewegen.2. Device according to claim 1, characterized in that the transport device has conveyors (1, 2) arranged next to one another, which move the substrates (3) in the vertical direction.
3. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die nebeneinander angeordneten Fördereinrichtungen (1 , 2) gegenläufig sind.3. Device according to claim 1 or 2, characterized in that the conveying devices (1, 2) arranged next to one another are in opposite directions.
4. Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass zwischen den Fördereinrichtungen (1 , 2) eine Übergabeeinrichtung zur Übergabe der Substrate (3) und/oder von Substratträgern (4) von einer Fördereinrichtung (1 bzw. 2) zur anderen (2 bzw. 1) aufweist.4. Device according to one of the preceding claims, characterized in that between the conveyor devices (1, 2) a transfer device for transferring the substrates (3) and / or substrate carriers (4) from one conveyor device (1 or 2) to the other ( 2 or 1).
5. Vorrichtung nach Anspruch 1 , dadurch gekennzeichnet, dass jeder Träger (4) eine Platte (14) und wenigstens eine. Fixiereinrichtung für die Substrate aufweist. 5. The device according to claim 1, characterized in that each carrier (4) has a plate (14) and at least one. Has fixing device for the substrates.
6. Vorrichtung nach Anspruch 1 , dadurch gekennzeichnet, dass die Platten und die Träger (4) jeweils ein zentrales Durchgangsloch (15) aufweisen.6. The device according to claim 1, characterized in that the plates and the carrier (4) each have a central through hole (15).
7. Vorrichtung nach Anspruch 1 , dadurch gekennzeichnet, dass die Ein- und/oder Auslaßöffnungen im Mantel (21 , 22) spindelförmig angeordnet sind.7. The device according to claim 1, characterized in that the inlet and / or outlet openings in the jacket (21, 22) are arranged spindle-shaped.
8. Verfahren zum Behandeln, insbesondere Kühlen und/oder Trocknen, von Substraten (3), wobei die Substrate (3) als Stapel (9, 10) senkrecht transportiert werden, dadurch gekennzeichnet, dass die Substrate (3) auf jeweils einem Träger (4) aufgelegt und während des Transports in einem die Transporteinrichtung umgebenden Mantel (21 , 22) mit einem Behandlungsmittel behandelt werden, das durch Öffnungen im Mantel umfangsseitig zu- oder abgeführt wird.8. A method for treating, in particular cooling and / or drying, substrates (3), the substrates (3) being transported vertically as a stack (9, 10), characterized in that the substrates (3) are each carried on a carrier ( 4) placed and treated during the transport in a jacket (21, 22) surrounding the transport device with a treatment agent which is supplied or removed on the circumferential side through openings in the jacket.
9. Verfahren nach Anspruch 11 , dadurch gekennzeichnet, däss das Transportieren der Substrate (3) auf einer gemeinsamen Ebene beginnt und endet.9. The method according to claim 11, characterized in that the transport of the substrates (3) begins and ends on a common level.
10. Verfahren nach Anspruch 11 oder 12, dadurch gekennzeichnet, dass dieSubstrate (3) in einer ersten vertikalen Richtung und danach in einer entgegengesetzten zweiten vertikalen Richtung transportiert werden. A method according to claim 11 or 12, characterized in that the substrates (3) are transported in a first vertical direction and then in an opposite second vertical direction.
PCT/EP2002/014387 2001-12-20 2002-12-17 Substrate treatment device WO2003054869A1 (en)

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DE2001162956 DE10162956B4 (en) 2001-12-20 2001-12-20 Substrate processing apparatus
DE10162956.7 2001-12-20

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WO2010057671A2 (en) * 2008-11-24 2010-05-27 Gebr. Schmid Gmbh & Co. Method and device for handling a cut wafer block
DE102013104780A1 (en) * 2013-05-08 2014-11-13 Weidmüller Interface GmbH & Co. KG Magazine device and method for stacking printed marker mats
CN106076893A (en) * 2016-07-29 2016-11-09 芜湖市振华戎科智能科技有限公司 A kind of printing delivery device of CD-enciphering production line

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WO2010057671A2 (en) * 2008-11-24 2010-05-27 Gebr. Schmid Gmbh & Co. Method and device for handling a cut wafer block
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CN106076893A (en) * 2016-07-29 2016-11-09 芜湖市振华戎科智能科技有限公司 A kind of printing delivery device of CD-enciphering production line

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DE10162956A1 (en) 2003-07-10

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