WO2002068318A1

WO2002068318A1 - Heat transport device

Info

Publication number: WO2002068318A1
Application number: PCT/JP2002/001853
Authority: WO
Inventors: Minehiro Tonosaki; Koji Kitagawa; Hiroichi Ishikawa; Kazuhito Hori
Original assignee: Sony Corporation
Priority date: 2001-02-28
Filing date: 2002-02-28
Publication date: 2002-09-06
Also published as: JP3941537B2; US20030121644A1; JP2002349975A

Abstract

In a heat transport device using microchannels and micropumps, thinning is attained and heat transfer characteristics are improved. A heat transfer device (1) has a construction in which microchannels for a refrigerant to pass therethrough and micropumps for pumping the refrigerant are integrated. For example, a multiple layer construction is used in which a channel layer (2) formed with microchannels (2a) and a pump layer (4) formed with micropumps (4a) are laminated to each other, or another construction is used in which a number of unit structures are arranged, each unit structure including a microchannel and a micropump which are integrated. And, pliability is imparted in that the microchannels and micropumps are formed on a resin base material using a flexible material.

Description

Description Heat transport equipment Technical field

The present invention relates to a technique for reducing the thickness of a heat transport device using a microchannel and a micropump. Background art

Heat pipes and heat sinks are widely used as devices for heat dissipation and cooling.Basically, heat exchange and cooling are performed by repeating the flow of steam and the return of fluid after heat dissipation. .

By the way, in response to recent developments in electronic device technology and micromachine technology, we have been aiming for devices that are more compact and have better heat conduction characteristics, and have used semiconductor silicon processes, so-called MEMS (Micro Electro-Mechanical System). ) Technology is attracting attention. For example, a device called a “micro-channel” is used for a cooling element, etc., corresponding to a local high-density heat source, and has a width of several tens of meters (microns) and a depth of about 100 m. Cooling can be performed by forming a large number of fins on the silicon substrate and passing refrigerant fluid through each channel (passage). In addition, in a closed-type microchannel or the like using a fluid-forced diaphragm, the apparent thermal conductivity is much higher than that of copper.

However, conventional equipment has certain limitations with regard to thinning and compacting of heat dissipation devices and cooling devices.As a result, when the device is attached to a heat source, the equipment becomes smaller. There is a problem that it becomes a factor that hinders.

For example, the thickness lmm, a width 1 O mm, require a large heat dissipation area and the heat transfer area by the ability limit of 1 cm ² per number Wa Tsu DOO in heating Topai flop like length 5 O mm, the device of the super compact It cannot be applied.

In addition, a device having a pumping function (a microphone port pump) is required to perform forced circulation of the refrigerant in a device using a microchannel, but the microchannel and the microphone port pump are provided independently. If the circulation channels for the refrigerant are formed individually, it is difficult to reduce the space for disposing the entire heat transport system, and it is difficult to increase the heat density related to the heat transport.

Therefore, an object of the present invention is to reduce the thickness and improve the heat transfer characteristics of a heat transport device using a microchannel and a micropump. Disclosure of the invention

In order to solve the above-mentioned problems, the present invention has a structure in which a microchannel for passing a refrigerant and a micropump for transporting the refrigerant are integrated. For example, a microchannel is formed. The channel layer thus formed and the pump layer on which the minute pump is formed are laminated, or a unit structure is provided in which the minute channel and the minute pump are integrated.

Therefore, according to the present invention, the device can be made thin by integrating the microchannel and the micropump and arranging them in a laminated structure or an integrated structure. In the case of adopting a laminated structure, it is included in the microchannel group included in the channel layer and the pump layer. The thermal conductivity can be easily increased by increasing the number of micro-pump groups or the number of layers, or when employing an integrated structure, by increasing the number of unit structures including micro-channels and micro-pumps. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a diagram showing a configuration example of a heat transport device according to the present invention, wherein (A) is a diagram showing a laminated structure, (B) is a top view of each layer, and (C) is a side surface viewed from a direction D. FIG.

2A to 2C are explanatory diagrams of the basic configuration of the bubble-driven pump.

FIGS. 3A to 3F are explanatory diagrams of a method for forming a flow channel of a microchannel or a micropump.

4A to 4D are explanatory views related to a method of forming a piezoelectric drive pump.

5A to 5B are diagrams schematically showing a micropump array.

FIG. 6 is a diagram schematically showing a configuration example of a heat transport device, and also shows a configuration viewed from a side, shapes of respective parts, and the like.

FIG. 7 is a diagram showing a configuration example of a heat transport device formed by repeating arrangement of unit structures.

FIG. 8 is a diagram showing an example of use of the heat transport device according to the present invention. FIG. 9 is a diagram showing another example of use of the heat transport device according to the present invention.

FIG. 10 is a diagram showing an example of use of a micropump array. FIG. 11 is a conceptual diagram showing a configuration in which microchannels are formed in a closed loop. FIG. 12 shows an example of a closed-circuit type configuration together with FIGS. 13 and 14, and FIG. 12 is a schematic diagram viewed from a plane. FIG. 13 is an enlarged view showing a part of a microchannel and a microphone pump in the heat transport device.

FIG. 14 is a diagram showing a main part of the micropump.

FIG. 15 is a perspective view showing an example of an embodiment in which a heat transport device is provided for each of a plurality of heat sources and connected. BEST MODE FOR CARRYING OUT THE INVENTION

The present invention relates to a thin heat transport device using a micro channel (micro channel) for passing a refrigerant and a micro pump (micro pump) for transporting the refrigerant, such as a cooling element or a heat exchanger. Can be widely applied to.

In the heat transport device according to the present invention, the following forms can be given for integrating the microchannel and the micropump.

(1) A mode in which a channel layer and a pump layer are stacked, or a multilayer of the stacked layers.

(2) The channel and pump are integrated into a single unit structure, and multiple such structures are juxtaposed. · First, Fig. 1 shows an example of form II. This example has a structure in which a channel layer in which a microchannel is formed and a pump layer in which a micropump is formed are stacked, and a heat transport device 1 for a heat source HG (for example, a cooling or heat removal device) Used as Fig. 1 (A) is a side view.

Heat transport device 1 has microchannel layer 2, microvia It has a laminated structure of one hole layer 3 and micropump layer 4, and each layer is connected by fusion or the like.

Fig. 1 (B) shows a top view of each layer. FIG. 1 (C) is a side view of the heat transport device 1 as viewed from the direction of arrow D. Of the three layers, the microchannel layer 2 is in direct contact with the heat source HG, and a number of microchannels 2a, 2a, ... are formed in a parallel relationship with each other. Refrigerant (eg, FC72, FC75, etc., but not limited thereto, but may be air, water, ethanol, etc.) passes through each channel. Heat is transferred.

A microphone opening via hole layer 3 is formed on the upper layer of the micro channel layer 2, and the through holes 3a, 3a,. , Via holes 3 b, 3 b,... Shown by white circles are formed. Each through-hole 3a is formed at a position near both ends in the longitudinal direction of the heat transport device 1 (the direction along the direction in which the microchannel is formed), and connects the microchannel and the flow path of the micropump. . Each via hole 3b is used for supplying heat necessary for driving the micropump, and a material having good heat conductivity such as copper is buried in the hole.

A plurality of micropumps 4 a, 4 a,... Are formed in the micropump layer 4. In this example, a bubble-driven thermal pump (a micropump that can be driven only by thermal effects) is used for each micropump.

FIGS. 2A to 2C are explanatory views of the basic configuration, and a micropump 4a is formed by a configuration in which a part of a flow path is narrowed down. In FIG. 2A, a heater 5 is provided in front of the fluid outlet, and the heating of the heater generates bubbles 6 as shown in FIG. 2B. The fluid can be sent out as shown in Fig. 2C by utilizing the pumping action utilizing the vibration of the bubbles.

It is known that the maximum pressure generated by such a micropump is well explained by Laplace's equation determined by the surface tension and the maximum and minimum radii of the flow path. Here, if a heater is used as a heating source as shown in FIGS. 2A to 2C, there is a problem that power supply from outside is required and efficiency is reduced. Therefore, as shown in Fig. 1, it is preferable to use the heat itself from the heat source HG instead of the heat source. In this example, heat is directly transmitted from the microphone channel 2a to the micro pump 4a via the via hole 3b.

Therefore, in this example, the refrigerant is circulated between the microchannel layer 2 and the micropump layer 4 and between the two layers via the through holes 3a, whereby the heat from the heat source HG passes through each microchannel. Thus, a cooling system transported by the refrigerant is formed.

FIGS. 3A to 3F show an example of a method of forming the microchannel layer and the microphone port pump layer. A base material 7 such as plastic is prepared (Fig. 3A), and both surfaces are subjected to ion implantation treatment (PBII treatment) as shown in Fig. 3B. To form Then, mask patterning is performed as shown in FIG. 3C. For the mask MP, a photoresist resin, metal, ceramic or the like is used. Thereafter, as shown in FIG. 3D, through the formation of the opening 9 by dry etching such as O ₂ (oxygen) beam etching, etc., as shown in FIG. 3E, to limonene (d—C _{1 ()} H ₁₆ ) and the like. Yo The base material is partially removed from the opening by chemical etching. That is, by immersing and dissolving in an etching solution tank,

As shown in FIG. 3F, a channel, a pump flow path, and the like are formed as the passage 10.

In addition, the base material constituting the channel layer and the pump layer is made of a material having high flexibility (for example, a polymer film, a resin material used for a flexible substrate, or the like), so that a micro material having high flexibility is obtained. Channels and micropumps can be formed. That is, each device can be formed on the film layer. Therefore, it is possible to use the heat transport device by bending it, or to use the heat transport device along a desired curved surface, thereby expanding the applicable range. In particular, it is effective for a device where the arrangement space is not enough for miniaturization and thinning.

In the above example, a configuration using a bubble-driven micropump has been described, but the present invention is not limited to this, and a piezoelectric-driven (or piezo-driven) pump can also be used.

4A to 4D show an example of an outline of a method for forming such a pump.

First, as shown in FIG. 4A, ion-implanted layers 12 and 12 are formed on both surfaces of a base material 11, and thin films 13 and 13 are formed thereon. Then, as shown in FIG. 4B, after the opening 14 is formed by ion beam etching, as shown in FIG. 4C, a tapered circular hole 15 (to be precise, almost conical) is formed by limonene etching. A trapezoidal bottomed hole) is formed. FIG. 4C 'is a view of the circular hole 15 viewed from below. Then, as shown in Fig. 4D, a piezoelectric body 16 (or a piezoelectric thin film) is fixed (or formed) in the circular hole 15 and its driving electrode is formed. The piezoelectric drive pump 18a is formed by attaching 17 and 17 to the piezoelectric drive pump 18a.The piezoelectric drive pump 18a drives the piezoelectric body 16 by an external signal to vibrate the thin film 13 In addition, the refrigerant can be pumped. That is, the refrigerant is sent out along the flow path facing the pump.

5A to 5B show a micropump array 18 in which a plurality of piezoelectric drive pumps 18a, 18a,... Are formed on a base material. Figure 5B shows a side view, as viewed from the direction of the hole. Here, reference numerals 19, 19,... Denote refrigerant flow paths, respectively.

FIG. 6 shows a configuration example 20 of a heat transport device using the micropump array 18.

The heat source HG is provided with a microchannel layer 2, and a microvia layer (a layer formed with only via holes 21 a, 21 a,...) 21 is provided on the channel layer. Further, fluid flat pipes 22 and 23 using a flexible base material or the like are arranged. In FIG. 6, for convenience of explanation, each layer is not shown in a stacked manner. However, in an actual configuration, a layer composed of the microchannel layer 2 and the fluid flat pipe 23 and a micropump layer 24 and the fluid flat pipe are formed. A thin heat transport device 20 is formed by laminating the layers comprising 22 from each other. These fluid flat pipes are channels for a refrigerant (such as FC75) and also function as heat radiating parts.

The pump layer 24 including the micropump array 18 has a function of drawing refrigerant from the fluid flat pipe 22 and sending it to the fluid flat pipe 23.

In this configuration, the microchannel layer 2 and the flat fluid pipe 2 2, A forced circulation system for the refrigerant is formed by providing a micropump layer 24 on the refrigerant flow path using 23, and heat is transmitted from the heat source HG to the fluid flat pipe via the microchannel layer 2. The heat is dissipated and the heat is also dissipated from the micro via layer 21.

In the above description, only the basic example in which one microchannel layer and one micropump layer are combined is described.However, a multilayer device can be easily formed by laminating a plurality of layers. Can be.

Next, the configuration of the above-described embodiment I will be described.

In this embodiment, the unit has a unit (unit) structure in which the microchannel and the micropump are integrated, and by arranging the structure in parallel or regularly, so-called multi-unit and expandability can be obtained. I can go.

FIG. 7 shows a heat transport device 25 having such a configuration, in which a micropump 27 is placed on a microchannel 26 (simplified simply as an elongated rectangular parallelepiped in the figure). It has a unit structure with. Since a bubble-driven micropump is used in this example, a via hole forming portion 28 is provided between the pump and the microchannel 26 for supplying heat to the micropump. . In the case of using the piezoelectric-driven micropump as described above, such a portion is unnecessary. Instead, a wiring substrate (flexible substrate, etc.) for connecting the piezoelectric drive electrodes is required.

In FIG. 7, one of the heat transport units including the microchannel 26 and the micropump 27 is shifted upward for convenience, and the flow of the refrigerant in the unit is schematically indicated by an arrow. are doing. By arranging heat transport units having such a structure in parallel, it is possible to achieve multiple heat transport paths.

Although the base material of the heat transport unit is omitted for convenience of illustration, each channel, pump, and the like can be formed on a flexible base material using a flexible material.

FIG. 7 shows a configuration in which the microchannel and the micropump are integrated in the stacking direction. However, the present invention is not limited to this, and one or more microchannels may be provided in a part of the refrigerant channel formed by the microchannel. A unit structure in which a pump is formed may be used. For example, there is a configuration in which a loop is formed in an annular shape on a thin flat base material (flexible base material), and a refrigerant flow path including a pump portion and a channel portion is arranged on the same plane. This will be described in detail later.

Although the present embodiment I and the above embodiment I can be used independently, it is also possible to widen the scope of the embodiment by using both according to the application.

FIG. 8 shows an example of use of the heat transport device according to the present invention, in which a heat transport device '29 in the form of a film sheet is arranged over a heating element 30 and a heat radiating plate 31. ing. In this case, the heat transfer device 29 includes the microchannel layer 2 and the micropump layer 4 or the pump layer and the via-through-hole layer as shown in an enlarged cross-sectional structure in a large circle in FIG. It has a multi-layered structure in which the layers containing layers are alternately laminated. Since the base material of each layer is made of a flexible material (polymer material, etc.), it is easy to use in terms of flexibility, and also has bending stress. There is an advantage that it can withstand deformation due to the like. At this time, the thickness of each layer is several tens / X m to about 100 m Therefore, the total film thickness does not become so large even if the number of layers is increased. For example, the entire thickness can be suppressed to 1 mm or less, so that the thickness can be sufficiently reduced.

FIG. 9 shows another example of use, in which a heating element 33 and a heat sink 3 are placed on a film-sheet-shaped heat transport device 32 including a microchannel layer and a micropump layer. 4 shows an example in which each is attached. Also in this case, since a material having high flexibility is used for the base material of each layer, it is possible to flexibly cope with bending of the refrigerant flow path '. For example, in a portable computer device, etc., when two housings have a structure in which hinges are connected, a heat transport device 32 is provided for a heating element such as a CPU (central processing unit). By disposing the heat radiating plate 34 in a housing separate from the heat generating element, a heat radiating structure or a cooling structure in which the heat generating element and the heat radiating plate are thermally coupled by the heat transport device can be realized.

The heat transport device is particularly effective for heat removal and cooling of a heating element having a high heat density. As described above, a device using a multilayer structure using the laminated structure of the embodiment 1 or a unit of the embodiment 2 Multi-layering using a structure can be mentioned. For example, as shown in FIG. 10, a micro-pump layer (an example using a piezoelectric-driven micro-pump array 18 is shown in FIG. Drive pumps may be used.) Flexible pumps 35, 35, ... formed in a film shape are fixed to the heat sink 34 to increase the heat dissipation efficiency. Since the form can be considered, a very wide range of applications can be expected. It is difficult to show the full range of applications, but for example, it can be attached and detached in a heat-dissipating device that is attached to a motor that generates heat and can be used, or in a small hard disk drive. There are various applications to devices for cooling efficient cartridge type disks (which become hot when rotating).

Further, the microchannel forming the refrigerant flow path includes an embodiment in which this is an open type configuration and an embodiment in which this is a closed type configuration.

FIG. 11 is a conceptual diagram showing a case where a micro-channel is formed in a closed loop shape (endless annular shape) to obtain a closed circuit configuration.

The closed curve 36 shown in the figure indicates the circulation channel by the microchannel, and the part indicated by the symbol “P” indicates the micropump in the middle.

This micropump may be a bubble-driven type or a piezoelectric-driven type, but the former is preferable from the viewpoint that no driving power is required. Then, in that case, a micropump is formed as a narrowed part of the microchannel. In other words, a circulation channel is formed by forming a microchannel and a micropump formed as a narrowed portion by narrowing a part of the channel into a closed loop, and a plurality of such channels are arranged in the same plane. By using such a structure, the efficiency of heat transport can be increased.

The micropump P is provided in the vicinity of the heat source HG indicated by a dashed-dotted box in the figure.However, the temperature distribution of the heat source HG is not uniform.For example, it is assumed that the temperature becomes high locally at the point `` H s ''. Then, in the case of the bubble drive type, the flow of the refrigerant is determined in the direction from the pump position to the point H s (the direction indicated by arrow Y in the figure). Therefore, the refrigerant moves in the flow path, is cooled by a heat removal means such as a heat sink or a cooling means at a place away from the heat source HG, and then circulates along a path of returning to the micropump again. The refrigerant to be filled in the flow channel is preferably water or ethanol in consideration of ease of handling and safety. For example, the refrigerant receives heat near a pump formed as a narrow-diameter portion in a microchannel, and the refrigerant receives heat. The cycle of gas phase, then cooling to liquid phase, and returning to near the heat source is repeated.

In the case of the bubble-driven pump, as shown in FIGS. 2A to 2C, heat is applied to the narrow diameter portion of the channel at a position slightly deviated from the center position. It is known that a similar pumping action can be obtained even if the channel portion apart from the narrow diameter portion is heated. Therefore, a configuration in which the channel portion having a constant diameter is heated, not limited to the narrow portion in the microchannel, may be used. At this time, the flow of the refrigerant is defined by the positional relationship between the narrow-diameter portion and the heating portion, and is in a direction from the narrow-diameter portion to the heating portion.

In FIG. 11, one micropump is provided in the circulation channel, but a configuration in which a plurality of pumps are formed may be used.

FIG. 12 to FIG. 14 show examples of the closed-circuit type configuration.

In FIG. 12, a heating element 37 such as CPU is disposed on a substrate, and a heat transfer device 38 in the form of a film sheet is attached to the heating element.

In the heat transport device 38, a large number of closed-loop microchannels that do not intersect with each other are formed by forming minute grooves in a base material using a flexible material such as a polymer material. Then, a structure in which the grooved surface of the base material is covered with a cover member (film material) have. In FIGS. 12 and 13, a closed curve group 39 in a track-like arrangement represents a circulation flow path for a refrigerant (such as water).

In FIG. 12, a part of the heat transport device 38 is in contact with the high temperature portion 37 a of the heating element 37, and the micropumps are located at the portions indicated by the dashed-dotted line frame 40 in the individual circulation channels. Are formed respectively. On the right side of the vertical line T shown in the figure, a heat radiating plate, a heat removing plate, a heat transfer plate, and the like, which are not shown, are arranged. ing.

FIG. 13 and FIG. 14 schematically show the cross-sectional structure of the heat transport device.

Each circulation channel indicated by the closed curve group 39 includes a microchannel 41 formed as a groove having a constant width and a predetermined depth, and a narrow portion (a portion having a reduced width or depth) of the channel. It is constituted by a micropump 42 formed as:

FIG. 13 shows an enlarged view of a part of the microchannel and the micropump, and here, they are schematically shown as transparent members. FIG. 14 shows only the main part of the micropump (the groove formed in the base material).

For example, with respect to one closed loop, a pump section 42a is formed as a portion where a part of a channel forming the closed loop is narrowed down, and a channel having a constant width is formed in other portions.

The width (w) and depth (d) of the groove formed on the base material are simple except for the pump part, although it is easy to prepare. Is changed continuously or stepwise according to the position on the flow path, so that the cross-sectional area of the flow path varies locally. You may design so that.

Further, as described above, in the case of the bubble-driven pump, the refrigerant is moved in a direction approaching the heat source. For example, in FIG. 12, the left side of the pump portion indicated by the round frame 40 in FIG. When a hot spot exists in the flow path, the refrigerant moves counterclockwise in the flow path indicated by the closed curve group 39. For example, in a CPU or the like, the surface does not have a uniform temperature distribution, and there are locally high temperatures. Therefore, the position of the pump section (the narrow-diameter portion of the channel) is It is sufficient to adopt an arrangement deliberately shifted from the above. This eliminates the need to provide an active heat source for the bombing action.

However, in this example, a cycle in which the refrigerant transported by the micropump is heated by the heating element, moves along the circulation flow path, is cooled by the heat release plate, and returns to the pump again is repeated. By returning the heat, heat can be efficiently transferred from the heating element to the heat sink or the like.

Since the heat transport device 38 is formed in a very thin sheet shape, it is possible to conduct heat transfer more effectively by stacking and using this in multiple layers. Less space is required.

Further, by forming the flow path including the micro-channel and the micro-pump in a closed loop, the circulation flow path of the refrigerant can be formed relatively freely, so that the degree of design freedom is high. In the above example, the concentric semi-circular parts were connected by two sets of straight paths, and the flow path was shaped like a “track of the stadium”, but it is limited to such a shape. It does not mean that it does not matter whether or not there is a branch. The shape of the flow path over the heat source is possible.

FIG. 15 shows an example in which a heat transport device provided for each of a plurality of heat sources is connected to each other to form a flow path. The heat transport device is connected to a branched flow path.

In this example, a plurality of ICs (integrated circuits) are mounted on each of the circuit boards 43 and 44, and among them, the IC having the largest calorific value is defined as a heating element (heat source). For example, among the ICs 43 a, 43 a,... Disposed on one substrate 43, a heat transport device (device) 45 is provided for the IC 43 a, and the IC 43 A heat transport device 46 is attached to a 2.

Further, of the ICs 44a, 44a,... Arranged on the other substrate 44, the heat transport device 47 is attached to the IC 44a1, and the substrate is also provided. A heat radiator (or heat sink) 48 is provided on 44.

The heat transport devices 45 to 47 have a basic structure in which the channels including the channels formed in a plane on the surface of the base material and the flow path including the pump portion (bubble driven type) are formed in a loop shape. I have. Therefore, a plurality of flow paths are formed on the same plane, and the pump is driven by the heat of the heating element I C as power.

For example, as shown in the figure, the heat transport device 46 has two flow passage portions 46 A and 46 A each composed of a plurality of micro-channels, and heat is exchanged with the heat radiating portion 48. Will be In other words, a part of the heat transport device 46 is attached to the surface of the IC 43 a 2, which is a heat-generating portion, and the refrigerant (water, etc.) heated here passes through the negative flow path portion 46 A After the heat is released from the heat radiating section 48 after passing through, the heat returns to the portion attached to the surface of the IC 43a2 again. Some of the flow path portions connected to the heat radiating section 48 are branched and connected to the heat transport devices 45 and 47, respectively. In other words, of the two flow path portions 47 A and 47 B connecting the heat transport device 47 and the heat radiating portion 48, one of the flow portions 47 A is branched in a T shape on the way and is directed to the substrate 43 side. It extends to the flow path portions 45 A and 45 A extending from the heat transport device 45 to the substrate 44 side. Accordingly, heat is exchanged between each heat transport device and the heat radiating section 48 through the microchannels formed in these flow path portions (that is, the refrigerant heated at the mounting position of the IC on the substrate is not heated). After arriving at the heat radiating part via each flow path part and releasing heat here, it returns to the mounting position of each IC again.)

Thus, even when there are a plurality of heat generating parts, it is possible to freely design the flow path arrangement, the shape, and the like. In addition, it is possible to use flexible resin material as the base material of each heat transport device so that it can be easily bent to have flexibility. Can be attached to Furthermore, it is also possible to use a sheet-like device in which a number of flow paths are formed on the same plane, in a further stacked configuration.

As is clear from the above description, according to the inventions according to claims 1 to 3, the minute space and the pump are integrated to arrange the space and occupied surface of the entire heat transport system. Since the product and the like can be reduced, the device can be made thinner. In the case where a laminated structure is adopted as in the invention according to claim 2 of the claim, the number of channel groups and pump groups is increased, and an integrated structure as in the invention according to claim 3 is provided. If you take it, The thermal conductivity can be easily increased by increasing the number of unit structures including the pump.

According to the fourth aspect of the present invention, since the minute pump can be formed by narrowing a part of the passage for the minute channel, the configuration is simple.

According to the invention as set forth in claim 5, since the refrigerant can be circulated in the closed loop flow path by the minute channel and the minute pump to carry out heat transfer, a number of such closed loops are provided in parallel. Thus, the efficiency of heat removal and cooling can be increased.

According to the inventions set forth in claims 6 to 9, by forming the base material from a flexible material, a device that is flexible against bending stress and the like can be produced, and a flow having curvature can be obtained. The ease of use is greatly improved because it is easier to deal with the formation of roads.

Claims

The scope of the claims

1. It has a microchannel for passing the refrigerant and a micropump for transporting the refrigerant, the microchannel and the micropump are integrally formed, and the cold soot flows through the microchannel. A heat transport device that transports heat by circulating.

2. The heat transport device according to claim 1, comprising: a channel layer in which the microchannel is formed; and a pump layer in which the micropump is formed, wherein the channel layer and the pump layer are provided. A heat transport device comprising a structure in which and are stacked.

3. The heat transport device according to claim 1, further comprising a unit structure in which the microchannel and the micropump are integrated, and having a plurality of the unit structures. .

4. The heat transport device according to claim 1, wherein the micro pump is formed by narrowing a part of the micro channel narrowly.

5. The heat transport device according to claim 4, wherein the micro-channel and the micro-pump are formed in a closed loop.

6. The heat transport device according to claim 1, wherein the base material constituting the microchannel and the micropump is formed of a flexible material.

7. The heat transport device according to claim 2, wherein the base material constituting the channel layer and the pump layer is formed of a flexible material. .

8. The heat transport apparatus according to claim 3, wherein the base material constituting the micro-channel and the micro-pump is made of a flexible material. A heat transport device characterized by being formed by:

9. The heat transport device according to claim 4, wherein the base material constituting the micro-channel and the micro-pump is formed of a flexible material.