JP3941537B2 - Heat transport equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique for reducing the thickness of a heat transport device using a microchannel and a micropump.
[0002]
[Prior art]
As heat dissipation and cooling devices, heat pipes, heat sinks, heat dissipation fins, etc. are widely used. Basically, heat exchange and cooling are performed by repeating the flow of steam and return of fluid after heat dissipation. .
[0003]
By the way, with the recent development of electronic device technology and micromachine technology, so-called MEMS (Micro Electro-Mechanical System) technology using a semiconductor silicon process has been developed aiming for a more compact device with better heat conduction characteristics than before. It is attracting attention. For example, a device called a “microchannel” is used for a cooling element corresponding to a local high-density heat source, and a micro-fin having a width of several tens of μm (microns) and a depth of about 100 μm is used as a silicon substrate. Cooling can be performed by forming a large number and allowing the refrigerant fluid to pass through each channel (passage). In addition, a closed microchannel using a fluid forced vibration plate has an apparent thermal conductivity far exceeding the thermal conductivity of copper.
[0004]
[Problems to be solved by the invention]
However, in the conventional apparatus, there is a certain limit regarding thinning and compacting of the heat dissipation device and the cooling device. As a result, when the device is attached to the heat source, it is a factor that hinders downsizing of the apparatus. There is a problem of becoming.
[0005]
For example, 1 cm for a heat pipe having a thickness of 1 mm, a width of 10 mm, and a length of 50 mm²The capacity limit of several watts per unit requires a large heat-dissipating area and heat-transfer area, and cannot be applied to ultra-small devices.
[0006]
In addition, in order to forcibly circulate the refrigerant in a device using a microchannel, an element (micropump) having some kind of pumping action is required. However, a microchannel and a micropump are provided independently to circulate the refrigerant. If each path is formed, it is difficult to reduce the arrangement space of the entire heat transport system, and it is difficult to increase the heat density related to heat transport.
[0007]
Therefore, an object of the present invention is to reduce the thickness and improve the heat transfer characteristics in a heat transport device using a microchannel and a micropump.
[0008]
[Means for Solving the Problems]
  In order to solve the above-described problems, the present invention allows a refrigerant to pass through.Plural formed in parallel toWith a small channelChannel layerWhen,Laminated on one surface of the channel layer;the aboveeachOf the minute channelA through-hole layer having a plurality of end-side via holes communicating with both end portions and a plurality of intermediate-side via holes communicating with the middle portion of each of the microchannels, and the through-hole layer laminated on the opposite side of the channel layer; A pump layer in which a plurality of micro pumps are formed that form a refrigerant flow path that communicates with the end-side via hole at both ends and communicates with the intermediate-side via hole at an intermediate portion.When,HaveA bubble-driven thermal pump is configured by communicating with each micropump through each of the microchannels through the end side via hole and the intermediate side via hole, and a narrowing portion is provided in the middle of each micropump. It is characterized by having .
[0009]
  Therefore, according to the present invention,The heat transport device has a laminated structure in which a channel layer, a through-hole layer, and a pump layer are laminated, and a microchannel formed in the channel layer and a micropump formed in the pump layer are interposed between the channel layer and the pump layer. A bubble-driven pump that facilitates the circulation of the refrigerant can be configured by communicating with and integrated with the via hole of the through hole layer that has been damped, and the heat transport device having the refrigerant effect can be made thin..
  And since the narrowing part which narrowed the width | variety by narrowing of a flow path is formed in the intermediate part of each micropump, a pump effect can be strengthened more with a simple structure.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
The present invention relates to a thin heat transport device that uses a micro channel (micro channel) for passing a refrigerant and a micro pump (micro pump) for transporting the refrigerant, and is used in a cooling element, a heat exchanger, and the like. Can be widely applied.
[0011]
And about the heat transport apparatus which concerns on this invention, when integrating a microchannel and a micropump, the following forms are mentioned.
[0012]
(1) A mode in which the channel layer and the pump layer are laminated or the laminated layer is made into a multilayer.
[0013]
(2) A form in which a channel and a pump are integrated into one unit structure, and a plurality of such structures are arranged side by side.
[0014]
First, an example of the form (1) is shown in FIG. This example has a structure in which a channel layer in which a microchannel is formed and a pump layer in which a micropump is formed, and is used as a heat transport device 1 (for example, a cooling or heat removal device) for the heat source HG. . FIG. 1A is a side view thereof.
[0015]
The heat transport device 1 has a laminated structure of a microchannel layer 2, a microvia / through-hole layer 3, and a micropump layer 4, and each layer is bonded by fusion or the like.
[0016]
FIG. 1B shows a top view of each layer. FIG. 1C is a side view of the heat transport device 1 as viewed from the direction of arrow D. Of the three layers, the microchannel layer 2 is in direct contact with the heat source HG, and a large number of microchannels 2a, 2a,... Heat from the heat source HG is transmitted through passage of refrigerant (for example, chlorofluorocarbons such as FC72 and FC75, but is not limited thereto, air, water, ethanol, etc.). The
[0017]
A micro via / through hole layer 3 is formed in the upper layer of the micro channel layer 2, and through holes 3a, 3a,... Indicated by black circles and via holes indicated by white circles are formed on a base material formed of a heat insulating material. 3b, 3b,... Are formed. Each through hole 3a is formed at a location near both ends in the longitudinal direction of the heat transport device 1 (the direction along the microchannel formation direction), and connects the microchannel and the flow path of the micropump. Each via hole 3b is used for supplying heat necessary for driving the micropump, and a material having good thermal conductivity such as copper is embedded in the hole.
[0018]
In the micropump layer 4, a plurality of micropumps 4a, 4a,... Are formed. In this example, a bubble-driven thermal pump (a micro pump that can be driven only by a thermal effect) is used for each micro pump.
[0019]
FIG. 2 is an explanatory diagram of the basic configuration, and the micropump 4a is formed by a configuration in which a part of the flow path is narrowed down.
[0020]
In FIG. 6A, a heater 5 is provided in front of the fluid outlet, and bubbles 6 are generated by the heating of the heater, as shown in FIG. By using the pumping action utilizing the vibration of the bubbles, the fluid can be sent out as shown in FIG.
[0021]
It is known that the maximum pressure generated by such a micropump is well explained by the Laplace formula determined from the surface tension and the maximum and minimum radii of the channels. Here, when a heater is used as a heating source, as shown in FIG. 2, there is a problem in that efficiency is lowered because an external power supply is required. Therefore, it is preferable to use the heat from the heat source HG instead of the heater as shown in FIG. In this example, heat is directly transferred from the microchannel 2a to the micropump 4a through the via hole 3b.
[0022]
Therefore, in this example, the refrigerant is circulated between the microchannel layer 2 and the micropump layer 4 or between the two layers via the through hole 3a, whereby the heat from the heat source HG passes through each microchannel. A cooling system transported by the refrigerant is formed.
[0023]
An example of a method for forming the microchannel layer and the micropump layer is shown in FIGS. A base material 7 such as plastic is prepared (FIG. (A)), and stop layers (or surface modification layers) 8 and 8 are formed on both surfaces by ion implantation (PBII treatment) as shown in FIG. Form. Then, mask patterning is performed as shown in FIG. For the mask MP, photoresist resin, metal, ceramic, or the like is used. Then (D) 0 as shown₂After the formation of the opening 9 by dry etching such as (oxygen) beam etching, as shown in FIG._TenH₁₆) Etc., the substrate is partially removed from the opening. That is, by immersing and dissolving in an etching solution tank, a channel, a pump flow path, or the like is formed as the passage 10 as shown in FIG.
[0024]
In addition, the base material constituting the channel layer and the pump layer is made of a highly flexible material (for example, a polymer film, a resin material used for a flexible substrate, etc.), so that the flexible microchannel or microchannel can be used. A pump can be formed. That is, each device can be formed on the film layer. Therefore, the heat transport apparatus can be bent and used, or can be used along a desired curved surface, and the application range can be expanded. In particular, it is effective in an apparatus or the like that does not have a sufficient arrangement space for downsizing and thinning.
[0026]
  Figure 4Bubble-driven microAn example of an outline of a method for forming a pump is shown.
[0027]
First, as shown in FIG. 5A, ion implantation layers 12 and 12 are formed on both surfaces of a base material 11, and thin films 13 and 13 are formed thereon. Then, after forming the opening 14 by ion beam etching as shown in FIG. (B), as shown in FIG. (C), a tapered circular hole 15 (to be exact, a truncated cone shape is formed by limonene etching. Bottomed hole). (C ') is the figure which looked at the circular hole 15 from the lower surface. Then, as shown in FIG. (D), the piezoelectric body 16 (or piezoelectric thin film) is fixed (or formed) in the circular hole 15, and the drive electrodes 17 and 17 are provided to form the piezoelectric drive pump 18a. To do. The piezoelectric drive pump 18a can pump the refrigerant by vibrating the thin film 13 by driving the piezoelectric body 16 by an external signal. That is, the refrigerant is sent out along the channel facing the pump.
[0028]
FIG. 5 shows a micropump array 18 in which a plurality of piezoelectric drive pumps 18a, 18a,. FIG. 5A shows a view from the direction of the arrangement hole of the piezoelectric body, and FIG. 5B shows a side view. Here, 19, 19,... Indicate refrigerant flow paths, respectively.
[0029]
FIG. 6 shows a configuration example 20 of a heat transport device using the micropump array 18.
[0030]
A micro channel layer 2 is attached to the heat source HG, and a micro via layer (a layer in which only the via holes 21a, 21a,... Are formed) 21 is provided on the channel layer. And fluid flat plate pipes 22 and 23 using a flexible base material etc. are arranged. In FIG. 6, for convenience of explanation, the layers are not shown stacked, but in an actual configuration, a layer made up of the microchannel layer 2 and the fluid flat plate pipe 23, and a layer made up of the micropump layer 24 and the fluid flat plate pipe 22. And a thin heat transport device 20 is configured. These fluid flat pipes are flow paths for the refrigerant (FC75 or the like) and also function as heat dissipation portions.
[0031]
The pump layer 24 including the micro pump array 18 has a function of drawing the refrigerant from the fluid flat pipe 22 and sending it out to the fluid flat pipe 23.
[0032]
In this configuration, the micropump layer 24 is provided on the refrigerant flow path using the microchannel layer 2 and the fluid plate pipes 22 and 23 to form a forced circulation system of the refrigerant, and the microchannel layer 2 is removed from the heat source HG. The heat is transferred to the fluid flat plate pipe and radiated, and the micro via layer 21 also radiates heat.
[0033]
In the above description, only the basic example in which each of the microchannel layer and the micropump layer is combined has been described. However, a multilayered device can be easily formed by stacking a plurality of layers. .
[0034]
Next, the configuration of the above-described form (2) will be described.
[0035]
In this embodiment, a unit structure in which microchannels and micropumps are integrated is provided, and so-called multi-scaling and expandability can be obtained by arranging the structures in parallel or regularly.
[0036]
FIG. 7 shows a heat transport device 25 having such a configuration, and a unit structure in which a micropump 27 is arranged on a microchannel 26 (shown simply as an elongated rectangular parallelepiped in the drawing). have. In this example, since a bubble-driven micropump is used, a via hole forming portion 28 is provided between the pump and the microchannel 26 for supplying heat to the micropump. Such a portion is not necessary when the piezoelectric drive type micro pump as described above is used. Instead, a wiring substrate (flexible substrate or the like) with a piezoelectric drive electrode is required.
[0037]
In FIG. 7, one of the heat transport units including the microchannel 26 and the micropump 27 is shifted upward for the sake of convenience, and the refrigerant flow relating to the unit is schematically indicated by arrows. By arranging the heat transport units having such a structure in parallel, the number of heat transport paths can be increased.
[0038]
Moreover, although the base material of a heat transport unit is abbreviate | omitted for convenience of illustration, each channel, a pump, etc. can be formed in the flexible base material using a flexible material.
[0039]
Although FIG. 7 shows a configuration in which the microchannel and the micropump are integrated in the stacking direction, the present invention is not limited to this, and one or a plurality of micropumps are provided in a part of the refrigerant flow path formed by the microchannel. The formed unit structure may be adopted. For example, a configuration in which a loop is formed in an annular shape on a thin flat base material (flexible base material), and a refrigerant flow path composed of a pump portion and a channel portion is arranged on the same plane. This will be described in detail later.
[0040]
The form (2) and the form (1) can be used independently, but the width of the embodiment can be expanded by using both in combination according to the application.
[0041]
FIG. 8 shows an example of use of the heat transport device according to the present invention. A heat transport device 29 in the form of a film sheet is disposed across a heating element 30 and a heat radiating plate 31. The heat transport device 29 in this case is a layer including the microchannel layer 2 and the micropump layer 4 or the pump layer and via / through hole layer as shown in an enlarged cross-sectional structure in the large circle frame of FIG. The layers are made of a multi-layer structure, and flexible materials (polymer materials, etc.) are used for the base material of each layer, making it easy to use in terms of flexibility, deformation due to bending stress, etc. Has the advantage of being able to withstand. At this time, since the thickness of each layer is about several tens of μm to 100 μm, the total film thickness does not increase so much even if the layers are made multilayer. For example, since the thickness can be suppressed to 1 mm or less as a whole, the thickness can be sufficiently reduced.
[0042]
FIG. 9 shows another example of use, in which a heating element 33 and a heat radiating plate 34 are respectively mounted on a film sheet-like heat transport device 32 including a microchannel layer and a micropump layer. Show. Also in this case, since a material having high flexibility is used for the base material of each layer, it is possible to flexibly cope with bending of the refrigerant flow path. For example, in a portable computer device or the like, when two casings have a hinge-coupled structure, a heat transport device 32 is provided for a heating element such as a CPU (Central Processing Unit), and the heating element The heat radiating plate 34 is arranged in another housing, and a heat radiating structure or a cooling structure in which the heat generating element and the heat radiating plate are thermally coupled can be realized by the heat transport device.
[0043]
The heat transport device is particularly effective for heat removal and cooling of a heat generating element having a high heat density. As described above, the heat transport device is based on a multilayer structure using the laminated structure of the form (1), or the form ▲ Examples of the multi-pump using the unit structure of 2 ▼ are shown in FIG. 10. For example, as shown in FIG. 10, a micropump layer (in the figure, an example using a piezoelectric pump type micropump array 18 is shown. Drive-type pumps may be used.) Since flexible pumps 35, 35,... Formed in a film shape are fixed to the heat radiating plate 34 to increase the heat radiation efficiency, various combinations of embodiments are conceivable. A wide range of applications can be expected. Although it is difficult to show the entire range of application, for example, in a heat-dissipating device attached to a high-temperature heat generating motor or a small hard disk drive device, a removable cartridge disk (high temperature during rotation) And various applications to devices for cooling.
[0044]
Moreover, about the microchannel which forms a refrigerant | coolant flow path, embodiment which makes this an open type structure and embodiment which makes a closed circuit type structure are mentioned.
[0045]
FIG. 11 is a conceptual diagram showing a case where a microchannel is formed in a closed loop shape (endless ring shape) to form a closed circuit configuration.
[0046]
A closed curve 36 shown in the figure indicates a circulation channel by a microchannel, and a portion indicated by a symbol “P” indicates a micropump in the middle.
[0047]
The micropump may be either a bubble driving type or a piezoelectric driving type, but the former is desirable from the viewpoint of not requiring driving power. In that case, a micropump is formed as a narrowed part by narrowing a part of the microchannel. In other words, a circulation channel is formed by forming a micro channel and a micro pump formed as a narrowed part by narrowing a part of the micro channel, and a plurality of such channels are arranged in the same plane. By using the structure, the efficiency of heat transport can be increased.
[0048]
The micropump P is provided in the vicinity of the heat source HG indicated by a dashed-dotted square frame in the figure, but the temperature distribution of the heat source HG is not uniform, and for example, it is assumed that the temperature is locally high at the point “Hs”. In the case of the bubble driving type, the flow of the refrigerant is determined in a direction (a direction indicated by an arrow Y in the figure) from the position of the pump toward the point Hs. Therefore, the refrigerant is circulated along a path in which the refrigerant moves in the flow path and is cooled by a heat removal means such as a heat radiating plate or a cooling means at a place away from the heat source HG and then returns to the micropump.
[0049]
In view of ease of handling, safety, and the like, the refrigerant filled in the flow path is preferably water, ethanol, or the like. For example, the refrigerant is evacuated by receiving heat near a pump formed as a narrow-diameter portion in the microchannel. A cycle in which a phase state is reached and then cooled to a liquid phase state and returns to the vicinity of the heat source is repeated.
[0050]
In the case of the bubble driven pump, as shown in FIG. 2, heat is applied to a position slightly deviated from the center position in the narrow diameter portion of the channel. It has been found that a similar pumping action can be obtained by heating the channel section. Therefore, not only the narrow diameter portion in the microchannel but also a configuration in which the channel portion having a constant diameter is heated may be used. At this time, the flow of the refrigerant is defined by the positional relationship between the narrow diameter portion and the heating portion, and is in a direction from the narrow diameter portion toward the heating portion.
[0051]
In FIG. 11, one micro pump is provided in the circulation flow path, but a configuration in which a plurality of pumps are formed may be used.
[0052]
FIG. 12 to FIG. 14 show the above-described closed-type configuration examples.
[0053]
In FIG. 12, a heating element 37 such as a CPU is disposed on a substrate, and a film sheet-like heat transport device 38 is attached to the heating element.
[0054]
In the heat transport device 38, a number of closed-loop microchannels that do not cross each other are formed by forming minute grooves in a base material using a flexible material such as a polymer material. And it has the structure by which the surface in which the groove | channel was formed among the said base materials was coat | covered with the cover member (film material). In FIGS. 12 and 13, a closed curve group 39 in a track-like arrangement represents a circulation flow path of the refrigerant (water or the like).
[0055]
In FIG. 12, a part of the heat transport device 38 is in contact with the high temperature portion 37a of the heating element 37, and micropumps are respectively formed in the individual circulation channels in the portions indicated by the dashed-dotted frame 40. Further, on the right side of the vertical line T shown in the figure, a heat sink, a heat removal plate, a heat transfer plate, etc. (not shown) are arranged, and a part (right side portion) of the heat transport device is in contact with these. ing.
[0056]
13 and 14 schematically show the cross-sectional structure of the heat transport device.
[0057]
Each circulation flow path shown by the closed curve group 39 is formed as a microchannel 41 formed as a groove having a predetermined width and a predetermined depth, and a narrow-diameter portion (a portion having a reduced width or depth) of the channel. The micro pump 42 is configured.
[0058]
FIG. 13 is an enlarged view of a part of a microchannel and a micropump, which are schematically shown as transparent members here. FIG. 14 shows only the main part of the micropump (the groove formed in the base material).
[0059]
For example, with respect to one closed loop, the pump part 42a is formed as a narrowed part by narrowing down a part of the channel forming the closed loop, and a channel having a constant width is formed in other parts.
[0060]
In addition, about the groove part formed in the base material except the pump part, the form which prescribes | regulates the width (w) and depth (d) uniformly is simple on creation, but depending on the case, depth etc. The cross-sectional area of the flow path may be locally different by changing continuously or stepwise according to the position on the flow path.
[0061]
Further, as described above, in the case of the bubble-driven pump, the refrigerant is moved in the direction approaching the heat source, and therefore, for example, a hot spot exists on the left side of the pump portion indicated by the round frame 40 in FIG. In this case, the refrigerant moves in the counterclockwise direction in the flow path indicated by the closed curve group 39. For example, a CPU or the like does not have a uniform temperature distribution on the surface, and there are locations where the temperature is locally high. Therefore, the position of the pump unit (the narrow diameter portion of the channel) can be changed from the high temperature location. An intentionally shifted arrangement may be adopted. This eliminates the need for an active heat source for the pumping action.
[0062]
Therefore, in this example, after the refrigerant transported by the micropump is heated by the heating element, it moves along the circulation flow path, is cooled by a heat radiating plate, etc., and then returns to the pump again. Thus, heat transfer from the heating element to the heat radiating plate or the like can be performed efficiently.
[0063]
Since the heat transport device 38 is formed in a very thin sheet shape, it is possible to transfer heat more effectively by stacking and using the heat transport device 38 and to reduce the arrangement space. I'll do it.
[0064]
Further, since the flow path including the microchannel and the micropump is formed in a closed loop shape, the circulation path of the refrigerant can be formed relatively freely, so that the degree of freedom in design is high. In the above example, a concentric semicircular portion is connected by two sets of straight roads, and the flow path is shaped like a “track of a stadium”. However, it is limited to such a shape. In addition, since it does not matter whether there is a branch or not, for example, a flow path shape over a plurality of heat sources is possible.
[0065]
FIG. 15 shows an example in which a heat transport device provided for each of a plurality of heat sources is connected to each other to form a flow path, and the heat transport apparatus is connected with a branched flow path.
[0066]
In this example, a plurality of ICs (integrated circuits) are mounted on the circuit boards 43 and 44, and among them, an IC that generates a large amount of heat is used as a heating element (heat source). For example, among ICs 43a, 43a,... Arranged on one substrate 43, a heat transport device (device) 45 is attached to IC 43a1, and a heat transport device 46 is attached to IC 43a2.
[0067]
In addition, among the ICs 44a, 44a,... Arranged on the other substrate 44, a heat transport device 47 is attached to the IC 44a1, and a heat radiating portion (or heat sink) 48 is provided on the substrate 44. .
[0068]
The heat transport devices 45 to 47 have a basic structure in which a channel including a channel formed in a plane on the surface of the base material and a flow path including a pump portion (bubble drive type) are formed in a loop shape. Accordingly, the plurality of flow paths are formed on the same plane, and are pump-driven using the heat of the IC as a heating element as power.
[0069]
For example, as shown in the drawing, with respect to the heat transport device 46, heat exchange is performed between the heat radiating unit 48 with two flow path portions 46A and 46A each including a plurality of microchannels. That is, a part of the heat transport device 46 is affixed to the surface of the IC 43a2 that is a heat generating portion, and the refrigerant (water or the like) heated here passes through the one flow passage portion 46A and then is Is released, and then returns to the portion pasted on the surface of the IC 43a2.
[0070]
Also, some of the flow path portions connected to the heat radiating section 48 are branched and connected to the heat transport devices 45 and 47, respectively. That is, of the two flow path portions 47A and 47B connecting the heat transport device 47 and the heat radiating portion 48, one of the flow passage portions 47A is branched in a T shape on the way and extends toward the substrate 43 side, and further It is connected to flow path portions 45A and 45A extending from the transport device 45 toward the substrate 44 side. Therefore, heat exchange is performed between each heat transport device and the heat radiating portion 48 through the microchannels formed in these flow path portions (that is, the refrigerant heated at the mounting position of the IC on the substrate is respectively After reaching the heat dissipating part through the flow path part and releasing the heat here, it returns to the mounting position of each IC again.)
[0071]
Thus, even when there are a plurality of heat generating portions, it is possible to freely design the flow path arrangement, shape, and the like. In addition, it is possible to make it flexible by using a flexible resin material as the base material of each heat transport device so that it has flexibility. Can be used by pasting to. Furthermore, it is also possible to use a configuration in which sheet-like devices in which a large number of flow paths are formed on the same plane are further laminated.
[0072]
【The invention's effect】
  As is clear from the above description, claim 1,Claim2According to the invention according toThe heat transport device has a laminated structure in which a channel layer, a through-hole layer, and a pump layer are laminated, and a microchannel formed in the channel layer and a micropump formed in the pump layer are interposed between the channel layer and the pump layer. The bubble-driven pump that promotes circulation of the refrigerant can be configured by communicating and integrating with the via hole of the squeezed through hole layer, and the heat transport device having the refrigerant effect can be made thin.
  And since the narrowing part which narrowed the width | variety by narrowing of a flow path is formed in the intermediate part of each micropump, a pump effect can be strengthened more with a simple structure.
  AlsoAs in the invention according to claim 2,A structure comprising a plurality of unit structures in which the microchannel of the channel layer and the micropump of the pump layer are integrated through the end side via hole and the intermediate side via hole of the through hole layerIndidin case of,By increasing the number of unit structures, the thermal conductivity can be easily increased.
[0074]
  Claim3According to the invention according to the present invention, heat can be transported by circulating the refrigerant in the closed-loop flow path by the micro-channel and the micro-pump. Therefore, the efficiency of heat removal and cooling can be improved by arranging many such closed loops in parallel. Can be increased.
[0075]
  Claim4According to the present invention, by forming the base material from a flexible material, it is possible to make a flexible device against bending stress and the like, and to easily cope with the formation of a flow path having a curvature. Therefore, the ease of use is greatly improved.
[Brief description of the drawings]
1A and 1B are diagrams showing a configuration example of a heat transport device according to the present invention, in which FIG. 1A is a view showing a laminated structure, FIG. 1B is a top view of each layer, and FIG. It is.
FIG. 2 is an explanatory diagram of a basic configuration of a bubble drive pump.
FIG. 3 is an explanatory diagram of a flow path forming method for microchannels and micropumps.
FIG. 4 is an explanatory diagram relating to a method of forming a piezoelectric drive type pump.
FIG. 5 schematically shows a micropump array.
FIG. 6 is a diagram schematically showing a configuration example of a heat transport device, and shows a configuration seen from the side, the shape of each part, and the like.
FIG. 7 is a diagram showing a configuration example of a heat transport device formed by a repeating arrangement of unit structures.
FIG. 8 is a diagram showing an example of use of a heat transport device according to the present invention.
FIG. 9 is a diagram showing another example of use of the heat transport device according to the present invention.
FIG. 10 is a diagram showing a usage example of a micropump array.
FIG. 11 is a conceptual diagram showing a configuration in which microchannels are formed in a closed loop shape.
FIG. 12 shows an example of a closed circuit configuration together with FIGS. 13 and 14, and this figure is a schematic view seen from a plane.
FIG. 13 is an enlarged view showing a part of a microchannel and a micropump in a heat transport device.
FIG. 14 is a diagram showing a main part of a micropump.
FIG. 15 is a perspective view showing an example of an embodiment in which a plurality of heat sources are connected with a heat transport device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Heat transport apparatus, 2 ... Channel layer, 2a ... Channel, 4 ... Pump layer, 4a ... Pump, 25 ... Heat transport apparatus, 26 ... Channel, 27 ... Pump, 38, 45, 46, 47 ... Heat transport apparatus

Claims (4)

A channel layer having a plurality of microchannels formed in parallel to allow refrigerant to pass through;
Laminated on one surface of the channel layer, and a through hole layer having a plurality of intermediate portions via-holes communicating with the intermediate portion of the plurality of end-side via holes and each fine channel communicating with the opposite ends of each fine channel ,
A plurality of micro pumps that are stacked on the opposite side of the through-hole layer from the channel layer and that communicate with the end-side via hole at both ends and that form a refrigerant flow path that communicates with the intermediate-side via hole at an intermediate portion. An individually formed pump layer ;
Have
A bubble-driven thermal pump is configured by communicating with each micro pump through the end side via hole and the intermediate side via hole to each micro channel,
A heat transporting device comprising a narrowing portion at an intermediate portion of each of the micro pumps . The heat transport device according to claim 1,
A heat characterized by comprising a plurality of unit structures in which the microchannel of the channel layer and the micropump of the pump layer are integrated through the end-side via hole and the intermediate-side via hole of the through-hole layer. Transport equipment. In the heat transport device according to claim 1 or 2,
The heat transport device, wherein the microchannel and the micropump are formed in a closed loop shape. In the heat transport device according to claim 1, 2, or 3,
The heat transport device, wherein the base material constituting the channel layer and the pump layer is formed of a flexible material.

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